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WO2005054345A1 - Ruban pour processus de production de carte de cablage en forme de film - Google Patents

Ruban pour processus de production de carte de cablage en forme de film Download PDF

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Publication number
WO2005054345A1
WO2005054345A1 PCT/JP2004/017046 JP2004017046W WO2005054345A1 WO 2005054345 A1 WO2005054345 A1 WO 2005054345A1 JP 2004017046 W JP2004017046 W JP 2004017046W WO 2005054345 A1 WO2005054345 A1 WO 2005054345A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
film
tape
production process
sheet
Prior art date
Application number
PCT/JP2004/017046
Other languages
English (en)
Japanese (ja)
Inventor
Arihiro Kanada
Original Assignee
Sumitomo Bakelite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to JP2005515897A priority Critical patent/JPWO2005054345A1/ja
Priority to KR1020067013497A priority patent/KR101146967B1/ko
Publication of WO2005054345A1 publication Critical patent/WO2005054345A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Definitions

  • the present invention relates to a tape for a production process of a film-like wiring board that requires excellent heat resistance and mechanical strength.
  • polyether aromatic resins have been widely and widely known as engineering plastics having excellent heat resistance, mechanical properties, and the like. Further, in order to expand the use of these resins, attempts have been made to improve the properties of super engineering plastics such as polyether aromatic ketone resin, thermoplastic polyimide resin and the like by adding fillers. For example, it has been proposed to add various inorganic fiber fillers to improve the mechanical strength and heat resistance (JP-A-63-22854).
  • Examples of film-like wiring boards (hereinafter simply referred to as boards) required for electronic components include FPC (flexible wiring board), TAB (tape-automated bonding), and COF (chip-on). There is something called 'film).
  • Production process tapes such as lead tapes and space tapes are used in the production and shipping processes of these film substrates.
  • various metallic resins are employed in consideration of the heat resistance temperature, mechanical properties, cost, and the like in the process.
  • TAB which is one of the film-like substrates
  • TAB products themselves can be used as lead tapes in predetermined processes during processing and production on reels "1", or TAB semi-finished products. May be used. In this case, expensive TAB products will be defective and productivity will be reduced.
  • thermosetting polyimide resin sheets are sometimes used in the TAB production process.
  • a thermosetting polyimide sheet it is necessary to use a relatively thick sheet to satisfy mechanical strength, which is not preferable in terms of production cost. Since thermosetting polyimide resin sheets are produced by a solvent casting method, the productivity of relatively thick sheets is low and the production cost is high.
  • As another process tape used in the production process of a film-like substrate there is a space tape for preventing products from sticking to each other. Examples of the space tape requiring heat resistance include metal such as SUS and a relatively thick thermosetting polyimide resin sheet.
  • metal space tape requiring heat resistance include metal such as SUS and a relatively thick thermosetting polyimide resin sheet.
  • all of these sheets are expensive and the production cost increases.
  • metal space tapes are heavy and reduce productivity. If exceptional heat resistance is not required, a polyethylene terephthalate sheet or the like may be used.
  • Patent Document 1 JP-A-63-22854
  • the present invention solves the above problems, and provides a low-cost resin composition for a film or sheet that is excellent in heat resistance and mechanical properties, has high sheet productivity and high productivity, and is low in cost. is there. Further, the present invention provides a film-like tape for a substrate production process, which is produced using the film or sheet.
  • the “sheet” includes a film.
  • the present invention is a sheet comprising at least one thermoplastic resin selected from polysulfone resin, thermoplastic polyimide resin and polyether aromatic ketone resin, and a plate-shaped filler.
  • Its folding endurance [IS P 8155: tension 250g, bending speed; 175 times per minute, bending surface 0.38R) is 10 times or more, and the linear expansion coefficient is 50ppmZ ° C or less.
  • An object of the present invention is to provide a tape for a wiring board production process.
  • the average particle diameter of the plate-like filler is preferably 0.1 to 20 ⁇ m, and the aspect ratio is preferably 5 or more.
  • the amount of the plate-shaped filler is preferably 5 to 60 parts by weight based on 100 parts by weight of the thermoplastic resin.
  • the plate-like filler is preferably at least one filler selected from metal oxides such as silicon, aluminum, and magnesium.
  • the process tape of the present invention can be produced by a melt extrusion method with high production efficiency.
  • it is suitable as an industrial film-like substrate production tape. It is.
  • the polysulfone resin used in the present invention is not particularly limited, but a polysulfone resin having a repeating unit represented by (!) In formula (1)-(8) is particularly preferred.
  • thermoplastic polyimide resin used in the present invention is not particularly limited, but those having a repeating unit represented by the formula (9)-(11) are particularly preferable.
  • An example of such a structure is ULTEM (trade name) manufactured by US GE.
  • SILTEM trade name manufactured by GE, which has flexibility by silicone modification to improve bending strength.
  • thermoplastic polyether aromatic ketone resin used in the present invention is not particularly limited, but preferably has a repeating unit represented by the formulas (12) to (13).
  • VICTREX's PEEK (trade name registered) has such a structure.
  • the addition amount of the plate-like filler in the present invention is 5 to 60 parts by weight, preferably 10 to 40 parts by weight, based on 100 parts by weight of the thermoplastic resin. If the amount is less than the above range, the heat resistance and dimensional stability of the obtained resin composition are not sufficient. If the amount is more than the above range, the moldability of the resin composition will be reduced.
  • the plate-shaped filler used in the present invention preferably has an average particle diameter of 0.1 to 20 m. More preferably, the average particle size is 0.5-10 m, most preferably 2-8 m.
  • the process tape has insufficient properties such as heat resistance and dimensional stability. In addition, the fluidity during resin processing is poor and processing becomes difficult, which is not preferable.
  • the average particle diameter of the plate-shaped filler is larger than the above range, the appearance of the molded product is not preferable, and it is difficult to obtain smoothness of the surface. Absent.
  • the mechanical strength and dimensional stability of the resin composition are dramatically improved by the plate-like filler.
  • This plate-shaped filler suppresses the linear expansion inherent to the resin particularly when the process tape is used in a high-temperature region, and reduces the dimensional change due to the softening of the resin, thereby improving the mechanical strength and the dimensional stability.
  • the plate-shaped filler used in the present invention has excellent dispersibility in the base resin and can be uniformly dispersed in the resin, so that the entire resin composition imparts uniformly good dimensional stability. it can.
  • the resin composition of the present invention desirably has a uniform mixture of the resin and the plate-like filler. Yes.
  • the plate-like filler used in the present invention preferably has an aspect ratio of 5 or more.
  • the aspect ratio of the plate-shaped filler is represented by the average particle diameter Z and the average thickness of the plate-shaped filler. If the particles have a spherical shape and an aspect ratio of less than 5, linear expansion is not sufficiently reduced, which is not preferable. In addition, if the particles have an aspect ratio of 100 or more and are close to fibrous, the melt fluidity of the resin will decrease, and the resin will be oriented in the flow direction. A sheet having characteristics cannot be obtained.
  • the material of the plate-shaped filler used in the present invention is not particularly limited, but a material mainly composed of a metal oxide such as silicon, aluminum, or magnesium can be used. . These may be used alone or in combination.
  • the resin sheet for a process tape of the present invention may include a fiber reinforcing material (glass fiber, carbon fiber, potassium titanate fiber, ceramic fiber, aramide fiber, Boron fiber, etc.), granular or irregular reinforcing materials (calcium carbonate, clay, turquoise, my strength, graphite carbon, molybdenum disulfide, etc.), conductivity improving materials (carbon, zinc oxide, titanium oxide, etc.) ), Thermal conductivity improvers (such as powdered metal oxides), antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, lubricants, mold release agents, dyes, pigments, and other thermoplastic resins ( Polyamide type, polycarbonate type, polyacetanol type, PET type, PBT type, polyphenylene sulfide type, polyarylate type, fluorine type, polyether-tolyl type, liquid crystal polymer type, etc.), thermosetting resin (phenol type, Epoxy-based, silicon-based, polyamide-imide, etc.) may be used
  • the method of adding and mixing the resin component and the plate-shaped filler is not particularly limited, and various mixing and mixing means are used.
  • a filler when a filler is added to a thermoplastic resin, each may be separately supplied to a melt extruder and mixed.
  • only the powder raw material may be dry-preliminarily mixed using a mixer such as a Henschel mixer, a ball mixer, a blender, or a tumbler, and then melt-mixed using a melt mixer.
  • a forming method suitable for the resin used as the base material can be used.
  • a seed molding method may be used.
  • secondary processing such as slitting to a predetermined width, forming of a concave and convex mold, application of a surface conductive layer, and an antistatic layer may be performed.
  • the raw resin is melt-extruded and formed into a sheet.
  • the method of extrusion and the method of taking over are not particularly limited.
  • the sheet may have either a single-layer structure or a multilayer structure, and is not particularly limited.
  • thermoplastic resin layer is produced by melt extrusion, and then a thermosetting polyimide resin layer is formed.
  • a thermosetting polyimide resin sheet may be laminated and laminated by a lamination method during melt extrusion of a thermoplastic resin.
  • the number of laminations and the lamination method are not particularly limited, but a heat-sealing lamination or a lamination method using an adhesive can be used.
  • the thermoplastic resin layer of the present invention may be combined to form a multilayer structure.
  • the tape for the production process of the present invention needs to have heat resistance.
  • a heating step such as drying or baking
  • the difference in dimensional change during heating between the film-shaped substrate and the spacer tape be as small as possible. If the values of the respective coefficients of linear expansion are significantly different, the film-like substrate and the spacer tape for producing the film-like substrate come into contact during the heating process, and the function of the spacer cannot be obtained.
  • the film-shaped substrate is made of thermosetting polyimide / copper foil, and their linear expansion coefficient is 20-30 ppmZ ° C. Therefore, the tape for process of the present invention is desired to have a linear expansion coefficient of 50 ppmZ ° C or less.
  • the appropriate range of such physical properties depends on the relative value between the tape for the production process and the film-like substrate used, so generally 50 ppm / ° C or less is practically used in most cases. Often there is no problem.
  • the linear expansion coefficient of the sheet in the present invention is larger than 50 ppm / ° C, the difference in dimensional change between the sheet and the film-like substrate during the heating step becomes too large to cause a problem during the step.
  • the process-step tape of the present invention has a bending strength of 10 times or more.
  • Film substrate When processing in the form of S-reel, it is necessary that these process lead tapes and space tapes are also reel-shaped. If the bending strength is less than 10 times, it is easy to break during roll-to-roll line transfer for calorie in a reel shape, and there is a problem in use.
  • the value of the bending strength (times) is preferably as large as possible, and more preferably 10 times or more. It is particularly preferably at least 15 times, more preferably at least 20 times.
  • UDEL P—1700NT (trade name) manufactured by Solvay Advanced Polymers
  • N-Talc L-1 aspect ratio 25 Average particle size: 5 / ⁇ ⁇
  • each material was supplied to a twin-screw extruder with the composition shown in Table 1 and Table 2, and melt-blended to produce a bellet.
  • Table 1 and Table 2 the composition shown in Table 1 and Table 2, and melt-blended to produce a bellet.
  • the numerical values of the blending amounts in the respective Examples and Comparative Examples are parts by weight.
  • the pellets thus produced were melt-extruded using a single screw extruder and a ⁇ die to obtain a sheet-like sample.
  • a sheet-like sample was obtained by hot pressing.
  • Various evaluations were performed based on the following.
  • Folding strength is measured using a 0.2 mm thick sheet sample
  • Alumina particles (* 5) 0 0 0 10 20 Plate-like filler (* 6) 0 0 0 0 0 0 0 Plate-like filler (* 7) 0 0 0 0 0 0 Folding strength [times] 28 120 2 9 7 lines expansion coefficient [P pmZ ° C] 55 55 48 54 48 properties heat resistance X ⁇ O ⁇ moldability OO ⁇ XX
  • a tape for a production process of a low-cost film-shaped substrate excellent in heat resistance, mechanical properties, moldability, dimensional stability, and workability can be obtained.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

La présente invention concerne un ruban pour processus de production de carte de câblage en forme de film se distinguant par sa résistance élevée à la chaleur, ses propriétés mécaniques, son aptitude au moulage, et la stabilité de ses dimensions, tout en offrant une excellente productivité et aptitude à l'usinage, avec de faibles coûts de fabrication. L'invention concerne plus particulièrement un ruban pour processus de production de carte de câblage en forme de film, qui est constitué d'une feuille comprenant au moins une résine thermoplastique choisie dans le groupe des résines de polysulfone, résines de polyimide thermoplastiques, et des résines cétoniques aromatiques de polyéther, ainsi que d'une plaque de comblement. Cette feuille présente une résistance au fléchissement (JIS P8155: tension = 250 g, cadence = 175 fois/mn, et surface de fléchissement = 0,38R) de 10 fois au moins, et un coefficient d'expansion linéaire de 50 ppm/ °C au maximum.
PCT/JP2004/017046 2003-12-05 2004-11-17 Ruban pour processus de production de carte de cablage en forme de film WO2005054345A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005515897A JPWO2005054345A1 (ja) 2003-12-05 2004-11-17 フィルム状配線基板の生産工程用テープ
KR1020067013497A KR101146967B1 (ko) 2003-12-05 2004-11-17 필름 모양의 배선 기판을 위한 제조 공정 테잎

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-407330 2003-12-05
JP2003407330 2003-12-05

Publications (1)

Publication Number Publication Date
WO2005054345A1 true WO2005054345A1 (fr) 2005-06-16

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ID=34650306

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/017046 WO2005054345A1 (fr) 2003-12-05 2004-11-17 Ruban pour processus de production de carte de cablage en forme de film

Country Status (5)

Country Link
JP (1) JPWO2005054345A1 (fr)
KR (1) KR101146967B1 (fr)
CN (2) CN1886448A (fr)
TW (1) TW200518932A (fr)
WO (1) WO2005054345A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009144058A (ja) * 2007-12-14 2009-07-02 Toyobo Co Ltd 自動車外板部材。
JP2016079335A (ja) * 2014-10-21 2016-05-16 三菱樹脂株式会社 フィルム

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101501957B1 (ko) * 2008-09-08 2015-03-12 신닛테츠 수미킨 가가쿠 가부시키가이샤 고열전도성 폴리이미드 필름, 고열전도성 금속장 적층체 및 그 제조방법

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6348835A (ja) * 1986-08-19 1988-03-01 Sumitomo Bakelite Co Ltd フイルムキヤリアテ−プ
JPS6454792A (en) * 1987-08-26 1989-03-02 Sumitomo Bakelite Co Film carrier tape
WO2002018495A1 (fr) * 2000-08-29 2002-03-07 Otsuka Chemical Co., Ltd. Composition de resine, objet moule fabrique a partir d'une telle composition et utilisation correspondante
JP2002338823A (ja) * 2001-05-21 2002-11-27 Mitsubishi Plastics Ind Ltd 基板用耐熱フィルムおよびこれを用いたプリント配線基板
JP2003128931A (ja) * 2001-10-23 2003-05-08 Otsuka Chem Co Ltd 樹脂組成物及び成形品
WO2003066740A1 (fr) * 2002-02-06 2003-08-14 Sekisui Chemical Co., Ltd. Composition de resine
JP2003292803A (ja) * 2002-02-01 2003-10-15 Sekisui Chem Co Ltd 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ
JP2004168962A (ja) * 2002-11-22 2004-06-17 Sumitomo Bakelite Co Ltd Ｔａｂ生産工程用スペーステープ
JP2004182832A (ja) * 2002-12-02 2004-07-02 Sumitomo Bakelite Co Ltd 芳香族系樹脂組成物、耐熱性シート及びフレキシブル回路基板補強用シート
JP2004253723A (ja) * 2003-02-21 2004-09-09 Dainichi Kasei Kogyo Kk チップ搬送体のスペーサのベース用フィルム
JP2004349366A (ja) * 2003-05-21 2004-12-09 Mitsubishi Plastics Ind Ltd 多層配線基板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2839704B2 (ja) * 1990-11-27 1998-12-16 住友ベークライト株式会社 Ｔａｂ用スペーステープ
JP2003282648A (ja) * 2002-03-26 2003-10-03 Sumitomo Bakelite Co Ltd 構成体シート及びｔａｂ用スペーステープ

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6348835A (ja) * 1986-08-19 1988-03-01 Sumitomo Bakelite Co Ltd フイルムキヤリアテ−プ
JPS6454792A (en) * 1987-08-26 1989-03-02 Sumitomo Bakelite Co Film carrier tape
WO2002018495A1 (fr) * 2000-08-29 2002-03-07 Otsuka Chemical Co., Ltd. Composition de resine, objet moule fabrique a partir d'une telle composition et utilisation correspondante
JP2002338823A (ja) * 2001-05-21 2002-11-27 Mitsubishi Plastics Ind Ltd 基板用耐熱フィルムおよびこれを用いたプリント配線基板
JP2003128931A (ja) * 2001-10-23 2003-05-08 Otsuka Chem Co Ltd 樹脂組成物及び成形品
JP2003292803A (ja) * 2002-02-01 2003-10-15 Sekisui Chem Co Ltd 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ
WO2003066740A1 (fr) * 2002-02-06 2003-08-14 Sekisui Chemical Co., Ltd. Composition de resine
JP2004168962A (ja) * 2002-11-22 2004-06-17 Sumitomo Bakelite Co Ltd Ｔａｂ生産工程用スペーステープ
JP2004182832A (ja) * 2002-12-02 2004-07-02 Sumitomo Bakelite Co Ltd 芳香族系樹脂組成物、耐熱性シート及びフレキシブル回路基板補強用シート
JP2004253723A (ja) * 2003-02-21 2004-09-09 Dainichi Kasei Kogyo Kk チップ搬送体のスペーサのベース用フィルム
JP2004349366A (ja) * 2003-05-21 2004-12-09 Mitsubishi Plastics Ind Ltd 多層配線基板及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009144058A (ja) * 2007-12-14 2009-07-02 Toyobo Co Ltd 自動車外板部材。
JP2016079335A (ja) * 2014-10-21 2016-05-16 三菱樹脂株式会社 フィルム

Also Published As

Publication number Publication date
KR101146967B1 (ko) 2012-05-22
CN101358035A (zh) 2009-02-04
TW200518932A (en) 2005-06-16
KR20060126683A (ko) 2006-12-08
CN1886448A (zh) 2006-12-27
JPWO2005054345A1 (ja) 2007-06-28

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