+

WO2004015368A1 - Appareil de controle - Google Patents

Appareil de controle Download PDF

Info

Publication number
WO2004015368A1
WO2004015368A1 PCT/IE2003/000109 IE0300109W WO2004015368A1 WO 2004015368 A1 WO2004015368 A1 WO 2004015368A1 IE 0300109 W IE0300109 W IE 0300109W WO 2004015368 A1 WO2004015368 A1 WO 2004015368A1
Authority
WO
WIPO (PCT)
Prior art keywords
sample
illumination
monitoring apparatus
controller
path
Prior art date
Application number
PCT/IE2003/000109
Other languages
English (en)
Inventor
Liam Kehoe
Patrick Vincent Kelly
Original Assignee
Optical Metrology Patents Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optical Metrology Patents Limited filed Critical Optical Metrology Patents Limited
Priority to JP2004527258A priority Critical patent/JP2005534934A/ja
Priority to EP03784445A priority patent/EP1540277A1/fr
Priority to AU2003256029A priority patent/AU2003256029A1/en
Publication of WO2004015368A1 publication Critical patent/WO2004015368A1/fr
Priority to US11/042,148 priority patent/US20050219553A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge

Definitions

  • the invention relates to an optical apparatus for the determination of deformation, strain, mechanical movement, thermal expansion, or dimensions, of a material or a material structure.
  • thermomechanical strain measurement A requirement exists for advanced analytical methods and apparatus for direct thermomechanical strain measurement in microelectronic, optoelectronic and micro-systems and their components. It is preferable that non-contact or non-destructive methods and apparatus are used for strain measurement.
  • strain measurement requirements generic to micro-engineered products.
  • Microelectronic devices Deformation maps of both out of plane and in-plane local deformation of advanced large-area single-chip packages, as well as in-plane deformation maps of cross-sectioned integrated circuit packages.
  • Microsystems Measurement of strain and deformation in sensors and microsystem components, as well as in the packages for these devices and in the components for and complete micro-electiO-mechanical-systems (MEMS) and micro-opto-electro- mechanical-sy stems (MOEMs).
  • MEMS micro-electiO-mechanical-systems
  • MOEMs micro-opto-electro- mechanical-sy stems
  • Strain is defined as the fractional deformation resulting from a stress, and so deformation measurement is required to measure strain directly.
  • Other indirect methods of strain measurement may be employed based on the measurement of a strain induced effect, for example, the use of electronic integrated circuits whose parameters or functionality are strain dependent, to measure strain in an integrated circuit package.
  • Excessive thermomechanical deformation strain in microsystems or microelectronic packages is known to lead to the development of failure mechanisms which reduce the mean time to failure, or the useful lifetime, of these products.
  • optical metrology techniques for the determination of relative motion between different parts of an object, which may indicate degradation of its integrity or of part thereof, or of coatings on such objects including protective and optical coatings and paints, surface treatments, vamishes or lacquers.
  • CTE coefficient of thermal expansion
  • Geometric Moire effect and Moire Interferometry both collectively referred to as "Moire” and Electronic Speckle Pattern Interferometry (ESPI) are known optical methods for the measurement of deformation and strain on structures over a wide range of dimensions.
  • a feature of these techniques is that they require a position reference on the sample surface from which any relative movements may be derived.
  • ESPI the inherent roughness of the surface provides a speckle pattern whose movement monitors changes in the strain state of the sample.
  • existing Moire based methods a grating structure is deposited on the sample to provide the reference structure.
  • Optical ball grid array inspection system describes a method for inspecting a 3D structure using collimated laser light. The technique relies on holographic or Moire analysis of light scattered from the surface onto an array of optical detectors.
  • Non-contact deformation measurement describes a method of analysing plane deflections in materials under load by projecting a reference grating onto the sample and recording information relating to the individual colour channels of a colour camera, providing an imaginary (software) reference grating. This allows Moire fringe analysis to be determined.
  • ESPI Electronic speckle pattern interferometry
  • variants on speckle interferometry and speckle photography have been reported since the early 1970s, for measuring in and out of plane object deformation by production of optical speckles when a coherent beam is scattered from a rough surface.
  • Deformation of the sample changes the phase values of the speckles.
  • the phase values of the speckles may be measured before and after the deformation, and can be related to the amount of deformation.
  • ESP Electronic speckle pattern photography
  • MDAC 2-dimensional micro-deformation analysis by correlation
  • the invention is directed towards providing a system and method for more versatile monitoring of deformation.
  • a monitoring apparatus comprising:-
  • a light sensor for sensing light reflected or scattered from a sample being monitored
  • a controller having image processing functions for performing:
  • controller operates with a mode selected from a plurality of modes, the modes differing in terms of sample illumination and/ or the image processing function used.
  • the apparatus comprises actuators for moving optical components and the controller comprises functions for directing movement of the components according to mode of operation.
  • the apparatus comprises a plurality of light sources and associated illumination paths, and the controller comprises functions for controlling activation of the paths.
  • the illumination paths comprise a common beam splitter for directing light from one or more paths through an objective onto a sample.
  • the apparatus comprises a beam splitter for directing illumination towards a sample for a plurality of illumination paths, and for directing reflected or scattered light from a sample.
  • a first illumination path comprises a light source, a collimating lens, a grating to impose structure, a focusing lens, and an objective lens.
  • the focusing lens is mounted to focus light onto a back focal plane of the objective lens.
  • a second illumination path comprises a light source, a collimating lens, a focusing lens, and an objective lens.
  • the second illumination path comprises the light source and optical components of the first illumination path and the controller comprises a function for moving away the grating to provide the second illumination path.
  • the apparatus comprises a sample mount comprising an actuator for moving a sample axially in an illumination path.
  • the controller comprises an image correlation function for causing stepped axial movement of the sample mount close to focus and for compositing sub-images to provide a composite image.
  • the controller directs use of the first illumination path for automatic focusing, and use of the first or the second illumination path for image correlation.
  • the first image path is used for image correlation and the controller directs stepped movement of the grating laterally across the illumination path, the steps sizes being a fraction of a grating period.
  • the apparatus further comprises a third illumination path, said path comprising a coherent light source and optical components for directing off-axis transmission of light through the objective lens.
  • the optical components focus the light onto the back focal plane of the objective lens.
  • the third illumination path comprises a laser light source.
  • the controller comprises a function for performing Moire image processing to determine deformation out of the plane of the sample using illumination from the first and third illumination paths .
  • the controller directs the third illumination path to provide structured illumination. In a further embodiment, the controller filters higher frequency projected fringes out of the captured images.
  • the apparatus comprises an imaging path comprising an imaging lens, a wavelength filter, and an ambient light shield adjacent the sensor.
  • the senor comprises a CCD camera.
  • the apparatus further comprises a sample mount for controlled movement of a sample.
  • the sample mount comprises means for applying mechanical, electrical, optical, or thermal stress conditions to a sample to cause deformation of the sample.
  • the controller has an image correlation programmed mode of operation, using illumination from the first or second illumination paths.
  • the controller has an in-plane Moire programmed mode using illumination from only the first illumination path.
  • Fig. 1 is a diagrammatic overview of an apparatus of the invention
  • Fig. 2 is a diagram of light impingement onto a sample
  • Fig. 3 is a diagram of another apparatus of the invention
  • Figs. 4 and 5 are flow diagrams illustrating control steps of the apparatus controller.
  • Fig. 6 is a diagram illustrating focusing using stacking of images.
  • a monitoring system 1 comprises the following.
  • a computer-based controller for initial inspection, selection of mode of operation for sample positioning, and for directing image capture and analysis.
  • the first light source 3 generates a light beam which is collinated through the objective lens 5 and is structured with a line pattern for in-plane (XT) Moire analysis. This structured illumination extends across the width of the sample for full impingement across the sample.
  • XT in-plane
  • the second light source 4 comprises a laser to produce coherent light. This beam passes off- centre through the lens 5 so that it is deflected towards the optical axis to impinge on the sample at an angle to the normal.
  • the second light beam is therefore suitable for out-of- plane Moire analysis.
  • Fig. 2 is an illustration of the beams and how they pass through the lens 5 and impinge onto the sample.
  • Bl is produced by an LED in the first light source 3 and is focussed onto the back focal plane of the objective 5 on-axis through the centre of the objective.
  • B2 is produced by the laser of the second light source 4 and is focused onto the back focal plane of the objective at a distance from the centre. This allows the coherent laser beam to exit the objective at an angle to the normal. Referring to Fig.
  • a monitoring apparatus 20 comprises two orthogonal mounts 6 supporting samples S, and a computer controller 8.
  • the light source LSI and its following optics for its illumination path are equivalent to the source 3 of the apparatus 1, and the source LS3 and its illumination path are equivalent to the source 4 of the apparatus 1.
  • the illumination path from the source LSI comprises:
  • a lens LI for collimating the light
  • a Ronchi Grating RGl for collimating the light
  • a beam splitter C5 for collimating the light
  • a lens L3 for focusing
  • abeam splitter Cl for focusing
  • the objective lens' 27 or 28 depending on control of the splitter Cl .
  • Light from the source LS2 passes through a collimating lens L2 and a beam splitter C2 followed by C5-L3-C 1-27/28.
  • Light from the source LS3 passes through a Ronchi Grating RG2 and a mirror C3 followed by C2-C5-L3-C1-27/28.
  • Reflected light from a sample S is directed to the camera CCD1 (charge-coupled device) via the objective lens 27/28, the beam splitter Cl, an imaging lens L4, a beamsteering mirror C4, a coloured glass wavelength filter Fl, and a tube Tl for blocking ambient light.
  • the light shield Tl includes a baffle device consisting of a series of opaque panels to trap stray light entering the enclosure through an aperture.
  • the light sources LSI and LS3 generate uniform light from which fringes are generated by the gratings RGl and RG2.
  • the second light source LS2 provides a non structured illumination source for uniform sample illumination.
  • the apparatus can, by suitable control of the three sources, optics, and the detector, perform: in-plane Moire analysis, out-of-plane Moire analysis, image correlation (MDAC).
  • in-plane Moire analysis out-of-plane Moire analysis
  • MDAC image correlation
  • in-plane means the X-Y plane of a sample
  • out-of-plane means the Z-direction normal to the X-Y plane
  • the computer controller 8 controls the devices by way of electro-mechanical drives to move some in and out of the relevant optical path and to change source intensities/wavelengths to produce the desired bright/dark patterns.
  • the controller 8 can select the sample position from the two shown in Fig. 3.
  • the controller directs the first light source to produce a periodically varying intensity profile Bl laterally across the sample.
  • This light source is used in modes of operation in which image recording is performed using periodically varying illumination, and in modes in which Moire effect measurements or imaging are performed.
  • the second light source (only in the apparatus 20) produces an approximately uniform intensity profile laterally across the beam at the sample. It is used in a mode in which image recording is performed using approximately uniform intensity illumination which is not periodically varying in intensity across the target material or component. This source is used for image correlation measurements.
  • the third light source LS3 (and its equivalent source 4 in the apparatus 1) is used in the case of the Moire effect out-of-plane mode to project a second periodically varying illumination pattern onto the target material or component. This is the off-centre laser B2 shown in Fig. 2.
  • the sources LSI and LS3 there is a phase shifting operated by the controller for translating the pattern of the structured illumination laterally (i.e. orthogonally to the beam propagation direction) and for varying fractions of its periodic repeating pattern where the structure has such a pattern.
  • This operates by moving the grating laterally by a fraction of a single period of the grating.
  • the grating period is 1/600 mm, and the translation is typically in the range of 20% to 60% of the period.
  • the microscopic objectives 27 or 28 are infinity-corrected objectives which are aligned relative to the optical axes such that the alignment is telecentric and the workpiece surface placed near the focus of the objective is illuminated in the manner of Kohler illumination to a high degree of uniformity of intensity over the illumination region.
  • the optical components of the apparatus are mounted on an optical mounting plate, housed in a single compact housing.
  • the optical mounting plate comprises a series of parallel slots for the mounting of optical component mounts by means of bolts of different sizes.
  • the resulting compactness is not only important for ease of use but improves system stability and hence measurement precision.
  • the optical mounting plate may be equipped with handles for ease of insertion in an instrument housing, in preferred embodiments of the invention.
  • the sample position may be altered with respect to the optical part of the apparatus and in one or more dimensions by means of the electro-mechanical mount 6 which is computer controlled.
  • the sample mount 6 may include a thermal device for increasing the temperature of the sample and/or a cryostatic means for decreasing the temperature of the sample. Also, it may comprise a circuit for delivering electrical power to the sample, which may change the temperature of different regions of the sample, or may cause parts of the sample to move.
  • the mount may also comprise a mechanical system for applying a mechanical deformation to the sample; a thermal device to cause solder or other metal alloys forming part of a sample to become liquid and flow; a liquid or gas container; a colour- changing means which changes colour in response to some property or condition of a sample or its environment.
  • the controller 8 is programmed to automatically capture the sample condition status data and time stamps.
  • the mount 6 comprises a thermo-electric element and a chuck bonded to it.
  • the chuck comprises a resistive thermometer.
  • the sample is mounted in good thermal contact with the chuck. Heat is transferred or extracted through the chuck by applying suitable currents and voltages to the thermoelectric device.
  • the heating/ cooling is controlled by a controller function which specifies the starting and finishing temperature of each step and the time at which the chuck must remain at a steady state temperature before images are recorded.
  • a typical program involves: (a) heating or cooling to an initial reference temperature, performing autofocus and image stacking as described below with reference to Fig. 6 to acquire an image (single or composite), and
  • step (b) repeating again for a desired number of steps.
  • the controller has a frame grabber for acquiring the images. Temperature is captured via an A/D interface to the chuck resistive thermometer.
  • the apparatus is portable and capable of alignment to the sample in situ if it is inconvenient to move the sample.
  • light from the semiconductor light emitting diode LSI is collimated by the lens LI, such that the beam subsequently illuminates the Ronchi Grating RGl at the focus of L4, and then passes through the objective 27.
  • the function of the objective 27 is to create the spectrum of the Ronchi Grating RGl and to remove undesirable orders from the beam, creating a periodically varying (which may be sinusoidally varying) intensity profile laterally across the beam at the sample.
  • the beamsplitter C5 allows combinations of the three possible illumination paths.
  • the beamsplitter Cl allows a single path through the objective 27 or 28 to be used for both illumination and imaging.
  • LS2 provides uniform, non-structured illumination across the sample, suitable for image correlation processing by the controller 8.
  • the third source LS3 comprises a laser source which has been expanded to its desired beam width. It passes through the Ronchi Grating (RG2) which has been placed at the focus of the lens L3. This beam is directed along the path of RG2, C3, C2, C5, Cl, and the objective 27/28 onto the sample.
  • Each objective 27 and 28 is an infinity corrected microscopic objective, aligned relative to the optical axes the lenses and such that the alignment with LI and L4 is telecentric and the workpiece surface, placed near the focus of the microscopic objective is illuminated in the manner of Kohler illumination to a high degree of uniformity of intensity over the illuminated region.
  • the controller 8 of the apparatus of Figs. 1 and 3 Operation of the controller 8 of the apparatus of Figs. 1 and 3 is illustrated at a high level in Fig. 4.
  • the major functions are inspection/decision making functions, actuation of optical components, sample movement, and automatic focusing.
  • the apparatus has the advantage of enabling flexibility of operation and is capable of operation in any of four modes, for the purposes of deformation and strain measurement or for the extraction of other information during processing of the image or images after their recording. These modes are:
  • Image recording under conditions of structured or unstructured illumination including the recording of a set of multiple images under different sample conditions, and including performance of image correlation (MDAC, micro-deformation analysis by correlation of images) using periodic illumination.
  • MDAC image correlation
  • Mode 2 Recording of a set or stack of images using approximately uniform illumination and as a function of moving the position of the sample surface relative to the microscopic objective through the focal plane of the objective or otherwise.
  • Step 1 The sample is inspected. A preliminary inspection is performed to determine the sample properties.
  • the target material or component may have a periodic or other structure which has a different optical appearance at different parts of its surface, or may have one or more of its surfaces polished or round or roughened.
  • the controller 8 has image processing functions to determine whether or not sufficient texture exists for the implementation of a digital image correlation method on a material workpiece inspected by it. These functions process captured images to determine the extent of texture by analysing the variations of grey scale levels within a number of sub-images. Where there is very little texture, such as a highly polished sample, a structured illumination source will be used.
  • Samples with inherent texture or optical contrast in the image field of view are suitable for inspection in the Modes 1 and 2.
  • Samples which lack inherent texture, but which may possess a grating structure, or to which a grating structure may be applied if desired are preferably measured using Moire effect Modes 3 or 4.
  • Steps 2 & 3 Optimum mode of operation of the apparatus is selected. It is possible to manually or programmably select the optimum mode of operation of the apparatus.
  • the control of the motion of the sample and of optical components confers flexibility allowing the mode of operation to be programmed into the system according to the surface quality preparation and texture. This also allows a series of multiple images to be made of the sample at different distances from the microscopic objective, as the sample is moved through the optimum focus position relative to the microscopic objective. It also allows a series of multiple images to be made of the sample under the same sample conditions and with the sample either always at the focus of the microscopic objective or at a constant distance from it, in order to build up an image of the sample which is larger than the field of view of the microscopic objective. Step 4. Determination of optimum sample position and movement of the sample relative to the optics as required.
  • An autofocus routine based on FFT of the image and analysis of the frequency distribution present in the image in order to determine the best focused image is implemented. Also, a multiple stacked imaging method can be implemented where a through focus series of images is acquired of a sample at different distances from the microscope objective and in which the central image in the series is well focused.
  • Step 5 Images are made of the sample. These images are recorded using the same optical illumination and recording imaging mode of the apparatus, but under different sample conditions.
  • the apparatus may be used to acquire images of a sample at different temperatures or under different mechanically or otherwise induced local deformations such that deformations may be determined by any or all of the following methods described in subsequent steps.
  • the apparatus may be used to acquire images of a sample at different distances from the focus of the microscopic objective.
  • Step 6 Images are rendered in digital electronic format. Images recorded from different areas of the sample may be combined to render a larger image. Parts of images recorded at different distances of the sample from the microscopic objective may be selectively combined to render a single image of all points of which are in focus with the microscopic objective.
  • Step 7 The determination of deformation, strain, thermal expansion, is by the comparison of two or more of the images recorded, or subsequently rendered at step 6, by any of the following methods:
  • the Moire effect is geometric rather than interferometric.
  • some modes use an interferometric Moire effect because of its greater sensitivity.
  • Moire fringes are produced at the sample plane after stress induced in-plane deformation at the sample plane. In-plane deformation may be determined from calculation of the displacement of the Moire fringes in subsequent images from those in a first reference image.
  • the controller 8 implements an autofocus method based on a Fourier transform of the image and analysis of the frequency distribution present in the image in order to determine the nearest focus image.
  • a software function performs a Fast Fourier Transform of the real-time image of the workpiece yielding an analysis of the frequencies present in the digital image.
  • the workpiece is in best focus when the image is sharpest, which in mathematical terms is when the highest proportion of high frequencies are present in the digital image.
  • the controller 8 also controls a heat filtering glass plate, or an opaque shutter, interposed between the workpiece and the objective or between the objective and other elements of the optical path, to prevent excessive heat from a thermal stressing device or from a thermally stressed workpiece from reaching the optical components.
  • a heat filtering glass plate or an opaque shutter, interposed between the workpiece and the objective or between the objective and other elements of the optical path, to prevent excessive heat from a thermal stressing device or from a thermally stressed workpiece from reaching the optical components.
  • the controller 8 controls a glass filter plate mounted on an actuation device. Where the sample is viewed from the side, most of the heat will be convected upwards rather than radiating sideways to the optical assembly.
  • the apparatus When operated in Mode 1, the apparatus makes use of the inherent texture or image contrast present on the surface of most engineering and micro-engineering materials and structure by imaging the texture as a function of the applied stress. Digital/Image correlation of blocks of pixels in these images is performed to determine the motion of local regions by means of tracking motion of the local image details associated with its texture. After image acquisition, controller functions calculate the deformation due to stress by finding the position of maximum cross correlation between undeformed and deformed regions of the image, known as subimages. A deformation map is then built up across the entire field of view. In one option for this mode LSI is used for auto focusing, followed by LS2 for the image correlation.
  • LSI structured illumination
  • structured illumination from LSI is used for both auto-focus and image correlation.
  • LSI is used for image correlation particularly where the sample does not have much surface texture.
  • RGl is stepped laterally across the beam by a fraction of a period, and an image is acquired at each step for phase-step Moire.
  • Phase-step Moire increases the displacement sensitivity per Moire fringe.
  • a series of images is recorded when the sample is at different distances from the microscopic objective, which are near the focus position.
  • the entire part of the sample within the field of view need not be in focus in any image.
  • Different in-focus subimages of the images at different sample positions are combined to give a composite image which is made up of a series of in-focus subimages.
  • Fig. 6 shows the manner in which a stack of images is made through the region of focus of the optical system, and the way in which the image in focus is selected or composited.
  • the focus function is important for the compositing process, and can be evaluated for every part of an image.
  • the 3D stack of images is acquired and processed by a Fast Fourier Transform function to auto-select the best focus regions of different stack images and render them as composite image in focus.
  • the sample has a colour intensity grating (as opposed to a phase grating) deposited on its surface.
  • the combination of fringes which have been projected onto the sample through the objective and those deposited grating lines produce Moire fringes when the sample deforms.
  • Images of the sample are captured before and after application of an applied stress.
  • In-plane deformation is determined from calculation of the displacement of the Moire fringes in subsequent images from those in a first reference image after digital filtering of the image to remove the higher frequency orders of the projection fringes and grating lines.
  • the sample and illumination optics are adjusted such that no Moire fringes are visible in the image prior to stressing of the sample.
  • This mode does not require the use of a grating structure or periodic structure on the sample surface.
  • a second periodically varying illumination pattern of the same frequency as that produced by LSI is projected onto the sample as shown in Fig. 2.
  • the apparatus allows out-of-plane strain determination by the Moire effect method using a combination of normal fringe projection onto the sample combined with off-normal axis projection through a microscopic objective.
  • the combination of the on axis and off axis fringes produce Moire fringes which are related to the amount of deformation.
  • the higher frequency projected fringes are filtered out of the image.
  • Modes 1 or 2 may be performed at multiple successively overlapping sample areas. This is achieved by control of the sample mount 6.
  • the images may be composited into a larger high-resolution image for image correlation to determine deformation.
  • the controller 8 may also be used to measure the co-efficient of thermal expansion of a material, because thermal expansion is a deformation of the material.
  • the apparatus may be used to examine a localised microscopic field of view on a microscopic scale or on a larger area scale by an appropriate choice of illumination and imaging optics and their control. If the area scale becomes so large that the resolution is too large to determine micro-deformation, the MDAC technique is implemented as deformation analysis by correlation (D AC) .
  • the apparatus allows deformation due to many different types of stress to be measured. It allows the sample to be inspected during transient thermal processes such as during solder reflow processes or metal alloying or creep.
  • the apparatus also allows a strain image to be recorded on applying electrical power or signals to an electrical or electronic or micro- electro-mechanical system to induce the stresses and deformations inherent to the normal functioning of such a device.
  • the apparatus may be used to the strain or deformation measurements sufficiently fast for real time output. This may be during the performance of a process on the material or component. Examples are measuring the changing deformation or strain in a microelectronic, optoelectronic or microsystem component or device, whether or not packaged, during a process to attach or bond said component or device to another material, component, device or system.
  • the apparatus may be used to determine strain or deformation of objects which are of a fragile nature. Examples are objects such as historical artefacts, archaeological structures, murals, and historical structures. The determination of damaged regions of physically co ⁇
  • the light sources LSI and LS2 may comprise instead emitters directing light into a fibre bundle, the outputs of which are directed on the relevant light paths. Also, there may be only one light path corresponding to both LSI and LS2, in which the grating is movable in and out of the path for conversion.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)

Abstract

La présente invention concerne un appareil de contrôle comportant un 1er chemin d'éclairage (LS1, L1, RG1, C5, L3, C1, 27) apportant un éclairage structuré, un 2ème chemin d'éclairage (LS2, L2, C2, C5, L3, C1, 27) apportant un éclairage uniforme, et un 3ème chemin d'éclairage (LS3, RG2, C3, C2, C5, L3, C1, 27) apportant un éclairage laser désaxé. L'éclairage est focalisé dans son entier sur le plan focal arrière de l'objectif, celui du 3ème chemin étant désaxé pour permettre une analyse du moiré hors-plan. Le contrôleur dispose d'une gamme de modes de fonctionnement programmés correspondant à une analyse par moiré plan-focal, par moiré hors plan focal et de corrélation d'images.
PCT/IE2003/000109 2002-07-31 2003-07-31 Appareil de controle WO2004015368A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004527258A JP2005534934A (ja) 2002-07-31 2003-07-31 モニタ装置
EP03784445A EP1540277A1 (fr) 2002-07-31 2003-07-31 Appareil de controle
AU2003256029A AU2003256029A1 (en) 2002-07-31 2003-07-31 A monitoring apparatus
US11/042,148 US20050219553A1 (en) 2003-07-31 2005-01-26 Monitoring apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39941302P 2002-07-31 2002-07-31
US60/399,413 2002-07-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/042,148 Continuation US20050219553A1 (en) 2003-07-31 2005-01-26 Monitoring apparatus

Publications (1)

Publication Number Publication Date
WO2004015368A1 true WO2004015368A1 (fr) 2004-02-19

Family

ID=31715682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IE2003/000109 WO2004015368A1 (fr) 2002-07-31 2003-07-31 Appareil de controle

Country Status (4)

Country Link
EP (1) EP1540277A1 (fr)
JP (1) JP2005534934A (fr)
AU (1) AU2003256029A1 (fr)
WO (1) WO2004015368A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2870935A1 (fr) * 2004-05-25 2005-12-02 Insidix Sarl Dispositif de mesure de deformations de surface
RU2445572C1 (ru) * 2010-11-09 2012-03-20 Государственное образовательное учреждение высшего профессионального образования "Санкт-Петербургский государственный университет информационных технологий, механики и оптики" Устройство для контроля деформаций протяженного объекта
CN103149087A (zh) * 2013-02-07 2013-06-12 湘潭大学 一种基于随动视窗与数字图像的非接触式实时应变测量方法
ITBA20120040A1 (it) * 2012-06-25 2013-12-26 Cenms Srl Dispositivo ottico per la misura contemporanea di deformazioni nel piano e fuori dal piano
WO2018107584A1 (fr) * 2016-12-15 2018-06-21 东南大学 Procédé de correction d'erreur pour système de mesure tridimensionnel par projection de réseau
CN110207606A (zh) * 2019-06-27 2019-09-06 航天神舟飞行器有限公司 基于数字图像关联性的面外应变测量方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109029279B (zh) * 2018-07-23 2020-01-10 清华大学 变形测量方法及装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19614896A1 (de) * 1996-04-16 1997-10-23 Chemnitzer Werkstoffmechanik G Verfahren zur feldmäßigen Bestimmung von Deformationszuständen in mikroskopisch dimensionierten Prüflingsbereichen
US5898486A (en) * 1994-03-25 1999-04-27 International Business Machines Corporation Portable moire interferometer and corresponding moire interferometric method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5898486A (en) * 1994-03-25 1999-04-27 International Business Machines Corporation Portable moire interferometer and corresponding moire interferometric method
DE19614896A1 (de) * 1996-04-16 1997-10-23 Chemnitzer Werkstoffmechanik G Verfahren zur feldmäßigen Bestimmung von Deformationszuständen in mikroskopisch dimensionierten Prüflingsbereichen

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2870935A1 (fr) * 2004-05-25 2005-12-02 Insidix Sarl Dispositif de mesure de deformations de surface
WO2005119171A1 (fr) * 2004-05-25 2005-12-15 Insidix Dispositif de mesure de deformations de surface
JP2008500524A (ja) * 2004-05-25 2008-01-10 アンシディス 表面歪み測定装置
US7460216B2 (en) 2004-05-25 2008-12-02 Insidix Surface strain measuring device
JP4739330B2 (ja) * 2004-05-25 2011-08-03 アンシディス 表面歪み測定装置
RU2445572C1 (ru) * 2010-11-09 2012-03-20 Государственное образовательное учреждение высшего профессионального образования "Санкт-Петербургский государственный университет информационных технологий, механики и оптики" Устройство для контроля деформаций протяженного объекта
ITBA20120040A1 (it) * 2012-06-25 2013-12-26 Cenms Srl Dispositivo ottico per la misura contemporanea di deformazioni nel piano e fuori dal piano
CN103149087A (zh) * 2013-02-07 2013-06-12 湘潭大学 一种基于随动视窗与数字图像的非接触式实时应变测量方法
WO2018107584A1 (fr) * 2016-12-15 2018-06-21 东南大学 Procédé de correction d'erreur pour système de mesure tridimensionnel par projection de réseau
US10415957B1 (en) 2016-12-15 2019-09-17 Southeast University Error correction method for fringe projection profilometry system
CN110207606A (zh) * 2019-06-27 2019-09-06 航天神舟飞行器有限公司 基于数字图像关联性的面外应变测量方法
CN110207606B (zh) * 2019-06-27 2021-04-20 航天神舟飞行器有限公司 基于数字图像关联性的面外应变测量方法

Also Published As

Publication number Publication date
JP2005534934A (ja) 2005-11-17
AU2003256029A1 (en) 2004-02-25
EP1540277A1 (fr) 2005-06-15

Similar Documents

Publication Publication Date Title
KR102781740B1 (ko) 반도체 웨이퍼 상의 높이를 측정하기 위한 방법 및 장치
US11143598B2 (en) Defect inspection apparatus and defect inspection method
US5889593A (en) Optical system and method for angle-dependent reflection or transmission measurement
JP7166375B2 (ja) 物体の表面の光学的三次元トポグラフィ計測システム
NL1032881C2 (nl) Optisch monsterkarakteriseringssysteem.
US10088762B2 (en) Inspection apparatus and method
TWI402498B (zh) 影像形成方法及影像形成裝置
JP4939843B2 (ja) 欠陥検査方法及びその装置
CN101435698B (zh) 透明封装介质下微器件的表面形貌测量系统与方法
US20050219553A1 (en) Monitoring apparatus
Ishihara et al. High-speed surface measurement using a non-scanning multiple-beam confocal microscope
CN114502912A (zh) 混合式3d检验系统
WO2004072629A1 (fr) Systeme et procede destines a l'inspection de tranches de silicium
KR101652356B1 (ko) 광학적 웨이퍼 검사 장치
EP1540277A1 (fr) Appareil de controle
KR101826127B1 (ko) 광학적 웨이퍼 검사 장치
IE20030568A1 (en) A monitoring apparatus
IE83595B1 (en) A monitoring apparatus
Yen et al. Full-field 3-D flip-chip solder bumps measurement using DLP-based phase shifting technique
US20170082424A1 (en) Increasing Dynamic Range of a Height Sensor for Inspection and Metrology
Houghton et al. Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction
Fourspring et al. Scattered light in a DMD based multi-object spectrometer
Houghton et al. 2D Grating Pitch Mapping of a through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction: IEEE Electronic Components and Technology Conference, 2016
Yuanhao Development of digital image correlation method for displacement and shape measurement
Riesz et al. Realisation of quantitative Makyoh topography using a Digital Micromirror Device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003784445

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 11042148

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2004527258

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 2003784445

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2003784445

Country of ref document: EP

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载