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WO2004066197A1 - Produit en plastique avec puce a faible cout integree - Google Patents

Produit en plastique avec puce a faible cout integree Download PDF

Info

Publication number
WO2004066197A1
WO2004066197A1 PCT/EP2004/000215 EP2004000215W WO2004066197A1 WO 2004066197 A1 WO2004066197 A1 WO 2004066197A1 EP 2004000215 W EP2004000215 W EP 2004000215W WO 2004066197 A1 WO2004066197 A1 WO 2004066197A1
Authority
WO
WIPO (PCT)
Prior art keywords
plastic product
electronic component
plastic
product according
housing
Prior art date
Application number
PCT/EP2004/000215
Other languages
German (de)
English (en)
Inventor
Wolfgang Clemens
Werner Eberlein
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to DE112004000012T priority Critical patent/DE112004000012B4/de
Publication of WO2004066197A1 publication Critical patent/WO2004066197A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources

Definitions

  • the invention relates to a plastic product or the housing of a plastic product with a low-cost chip, for example visible or invisible, integrated in the housing, preferably an organic-based one.
  • An RFID tag based on organic electronics which is constructed on a flexible plastic substrate, can be, for example, a chip or electronic component.
  • Plastic products are known in which labels or “labels” are applied by means of so-called in-mold labeling, which are not fused to the plastic product or can only be fused with difficulty. This results in beautiful plastic products, the labels of which are stably fixed and which are disposed of without elaborate separation With the in-mold-labeling technique as well as with the in-mold-decoration technique, labels are presented (eg for decorative purposes) and the plastic product is then melted onto it.
  • the object of the present invention is to create a plastic product which contains an electronic component, such as a chip, which is inexpensive and suitable for mass production.
  • the invention relates to a plastic product with an electronic component, the electronic component being molded labeling is not connected to the plastic product or is difficult to remove.
  • the electronics can be integrated completely or partially within the plastic, or can be firmly connected to the surface.
  • An organic-based chip is advantageously used as the electronic component. It is particularly advantageous if an electronic component is used on a flexible substrate.
  • an electronic component can be a combination of electronics with other elements such as input elements (e.g. buttons) and / or output elements (e.g. display elements, loudspeakers) and / or with a device for energy supply (e.g. solar cell, battery, contact, coil, antenna) ) and / or with a sensor element (eg for temperature, pressure, humidity).
  • input elements e.g. buttons
  • output elements e.g. display elements, loudspeakers
  • a device for energy supply e.g. solar cell, battery, contact, coil, antenna
  • a sensor element eg for temperature, pressure, humidity
  • An organic circuit can be built on flexible plastic films. These can also be printed for decorative purposes at the same time.
  • This film can now be used like an in-mold label film in a corresponding system.
  • RFID radio frequency ident
  • the invention is described in more detail below with reference to two figures which make the process of in-mold labeling clear.
  • FIG. 1 shows the process of in-mold labeling: the two parts of an outer housing 1 and 2 are pressed against one another, so that a closed cavity, 3, in the form of the later component is created in between.
  • the label 4 to be introduced is attached to the wall to the housing 1.
  • the liquefied base material for the housing is pressed into the cavity 3 through a hole 5 in the housing 1 in the direction of arrow 6. This now fills up, then the material cools and solidifies.
  • the label 4 is integrated in the newly created housing of the plastic product.
  • the housing part 2 is moved apart in the direction of arrow 7 and the new plastic product is released.
  • FIG. 2 shows the finished new plastic product 8 with the integrated Label4.
  • plastic parts come into consideration as plastic products. From containers for food to housings of household machines, from medical devices and small devices such as syringes and bottles to X-ray housings, cans of cassettes, all kinds of furniture, sports equipment and many more.
  • Electronics such as an RFID tag are integrated directly in the housing, without additional space requirement, externally or internally, visible or invisible.
  • This RFID tag can pass on information to a corresponding reader without contact, even without visual contact.
  • This can be used for automation in production, for identification, right up to information about the correct recycling route. Nature- Any other information can be transferred.
  • Other electronics that perform logical functions are also conceivable. Only the power supply and signal transmission need to be guaranteed here, for example via appropriate electrical contacts.
  • an electronic label e.g. for marketing purposes in the consumer goods and food sector.
  • a label can also be used to display (e.g. based on electrochromic materials, liquid-crystalline displays (LCD), organic or inorganic light-emitting diodes), and to supply energy (e.g. organic or inorganic solar cells, batteries, antennas, contacts) and sensors and / or input elements (eg for light, temperature, pressure, humidity, chemical elements, pressure) and buttons for an input.
  • display e.g. based on electrochromic materials, liquid-crystalline displays (LCD), organic or inorganic light-emitting diodes
  • energy e.g. organic or inorganic solar cells, batteries, antennas, contacts
  • sensors and / or input elements eg for light, temperature, pressure, humidity, chemical elements, pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Produit en plastique ou boîtier d'un produit en plastique pourvu d'une puce, de préférence à base organique, à faible coût intégrée de manière visible ou invisible, par exemple dans le boîtier. Selon la technique de décoration dans le moule, des films-étiquettes (par ex. à des fins de décoration) sont préalablement déposés et le plastique est ensuite coulé sur lesdits films.
PCT/EP2004/000215 2003-01-21 2004-01-14 Produit en plastique avec puce a faible cout integree WO2004066197A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112004000012T DE112004000012B4 (de) 2003-01-21 2004-01-14 Kunststoffprodukt mit integriertem organischen elektronischen Bauteil, Verfahren zur Herstellung dazu

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10302148.5 2003-01-21
DE10302148 2003-01-21

Publications (1)

Publication Number Publication Date
WO2004066197A1 true WO2004066197A1 (fr) 2004-08-05

Family

ID=32747469

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/000215 WO2004066197A1 (fr) 2003-01-21 2004-01-14 Produit en plastique avec puce a faible cout integree

Country Status (2)

Country Link
DE (1) DE112004000012B4 (fr)
WO (1) WO2004066197A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1748402A1 (fr) * 2005-07-26 2007-01-31 Supreme Technic Package Co., Ltd. Étiquette à attacher sur un produit en plastique formé dans un moule et identifiable par un dispositif de détection
DE102005047638A1 (de) * 2005-10-05 2007-04-12 Schaeffler Kg Verwendung eines RFID-Transponders
WO2015035970A1 (fr) 2013-09-11 2015-03-19 Kiefel Gmbh Procédé de fabrication d'un produit au moyen d'une unité de thermoformage ou d'assemblage, et unité de thermoformage ou d'assemblage

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0350179A1 (fr) * 1988-06-21 1990-01-10 Gec Avery Limited Fabrication des cartes électroniques portables
US5569879A (en) * 1991-02-19 1996-10-29 Gemplus Card International Integrated circuit micromodule obtained by the continuous assembly of patterned strips
EP1052594A1 (fr) * 1999-05-14 2000-11-15 Sokymat S.A. Transpondeur et moule ainsi que leur procédé de fabrication
EP1134694A1 (fr) * 2000-03-16 2001-09-19 Infineon Technologies AG Document avec circuit électronique intégré
WO2002015264A2 (fr) * 2000-08-18 2002-02-21 Siemens Aktiengesellschaft Composant electronique organique encapsule, son procede de production et son utilisation
WO2003069552A1 (fr) * 2002-02-14 2003-08-21 Upm Rafsec Oy Etiquette intelligente

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19619462C1 (de) * 1996-05-14 1997-07-10 Hans Auer Verfahren zum Herstellen von mit bedruckten Etiketten versehenen Formkörpern nach dem sogenannten In-Mould-Labelling (IML) -Verfahren sowie Etikett für ein In-Mould-Labelling (IML) -Verfahren
FR2760998B1 (fr) * 1997-03-21 1999-05-21 Equisecurite Sa Procede d'inclusion d'une etiquette electronique dans un objet realise en plastique, au moment de la fabrication de l'objet
EP1035503B2 (fr) * 1999-01-23 2010-03-03 X-ident technology GmbH RFID-Transpondeur avec une surface imprimable
DE10045192A1 (de) * 2000-09-13 2002-04-04 Siemens Ag Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers
DE10151440C1 (de) * 2001-10-18 2003-02-06 Siemens Ag Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0350179A1 (fr) * 1988-06-21 1990-01-10 Gec Avery Limited Fabrication des cartes électroniques portables
US5569879A (en) * 1991-02-19 1996-10-29 Gemplus Card International Integrated circuit micromodule obtained by the continuous assembly of patterned strips
EP1052594A1 (fr) * 1999-05-14 2000-11-15 Sokymat S.A. Transpondeur et moule ainsi que leur procédé de fabrication
EP1134694A1 (fr) * 2000-03-16 2001-09-19 Infineon Technologies AG Document avec circuit électronique intégré
WO2002015264A2 (fr) * 2000-08-18 2002-02-21 Siemens Aktiengesellschaft Composant electronique organique encapsule, son procede de production et son utilisation
WO2003069552A1 (fr) * 2002-02-14 2003-08-21 Upm Rafsec Oy Etiquette intelligente

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1748402A1 (fr) * 2005-07-26 2007-01-31 Supreme Technic Package Co., Ltd. Étiquette à attacher sur un produit en plastique formé dans un moule et identifiable par un dispositif de détection
DE102005047638A1 (de) * 2005-10-05 2007-04-12 Schaeffler Kg Verwendung eines RFID-Transponders
WO2015035970A1 (fr) 2013-09-11 2015-03-19 Kiefel Gmbh Procédé de fabrication d'un produit au moyen d'une unité de thermoformage ou d'assemblage, et unité de thermoformage ou d'assemblage

Also Published As

Publication number Publication date
DE112004000012B4 (de) 2012-06-14
DE112004000012D2 (de) 2006-02-02

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