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WO2004066010A1 - Procede de fabrication d'un miroir a facettes - Google Patents

Procede de fabrication d'un miroir a facettes Download PDF

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Publication number
WO2004066010A1
WO2004066010A1 PCT/EP2004/000331 EP2004000331W WO2004066010A1 WO 2004066010 A1 WO2004066010 A1 WO 2004066010A1 EP 2004000331 W EP2004000331 W EP 2004000331W WO 2004066010 A1 WO2004066010 A1 WO 2004066010A1
Authority
WO
WIPO (PCT)
Prior art keywords
mirror
facet
facets
mirror facets
receiving bores
Prior art date
Application number
PCT/EP2004/000331
Other languages
German (de)
English (en)
Inventor
Markus Weiss
Andreas Seifert
Andreas Heisler
Stefan Dornheim
Original Assignee
Carl Zeiss Smt Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Ag filed Critical Carl Zeiss Smt Ag
Publication of WO2004066010A1 publication Critical patent/WO2004066010A1/fr
Priority to US10/936,317 priority Critical patent/US7246909B2/en
Priority to US11/695,626 priority patent/US20070206301A1/en
Priority to US12/338,049 priority patent/US7802891B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • G02B7/1822—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors comprising means for aligning the optical axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • G02B7/1822—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors comprising means for aligning the optical axis
    • G02B7/1824—Manual alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G03F7/70166—Capillary or channel elements, e.g. nested extreme ultraviolet [EUV] mirrors or shells, optical fibers or light guides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports

Definitions

  • the invention relates to a method for producing a facet mirror with a plurality of mirror facets, in particular for an illumination device in a projection exposure system for microlithography, and here in particular for use with illumination in the area of extreme ultraviolet.
  • the invention also relates to a method for machining receiving bores and a facet mirror with a plurality of mirror facets.
  • Faceted mirrors comprise several mirror facets and are already known from the prior art.
  • the mirror facets have a spherical body, a mirror surface being arranged in a recess in the spherical body and the side of the spherical body facing away from the mirror surface being mounted in a bearing device.
  • a lever element is arranged on each of the mirror facets on the side of the spherical body facing away from the mirror surface. Adjustment means act on the lever element in a region facing away from the spherical body, by means of which movement of the spherical body around its center can be achieved.
  • mirror facets are known from the older DE 102 04 249.7, the mirror surfaces of which are arranged on a carrier element.
  • the carrier element has adjusting means with which the angular position of the mirror surface in a plane can be adjusted at least approximately perpendicular to the optical axis of the mirror surface in at least one spatial direction.
  • Faceted mirrors have to withstand high thermal loads due to the absorbed radiation, which is to be arranged in the extreme ultraviolet range, this arrangement probably only meeting the high requirements with regard to the thermal loads to a small extent.
  • the object is achieved according to the invention in that a) the mirror facets are manufactured in a first method step, after which b) in a second method step the angular deviation of the optical axis of the mirror surface of each of the mirror surfaces facets compared to the normal of the mirror facet is determined, according to which c) in a third method step, with knowledge of the measured values determined in the second method step, a receiving bore is made in a carrier plate for each of the mirror facets, and the receiving bore is already about the second position with regard to the angular position to be achieved
  • the measured value measured in the method step is corrected, after which d) the mirror facets are inserted into the mounting hole provided for the respective mirror facet, after which e) the alignment of the mirror surface is measured again for each of the mirror surfaces, and f) finally, the mirror surface of the mirror facet is reworked Achieve the final required angular accuracy.
  • the object is achieved with respect to the method for machining the receiving bores by the characterizing features of claim 6.
  • the manufacturing process is carried out step by step.
  • the individual facets are manufactured to the best possible angular error of approx. 200 ".
  • This deviation is then determined with an angle measuring device, preferably with an autocollimation telescope with a positioning table.
  • the mounting holes for the mirror facets are now made with the best possible manufacturing accuracy, which in this case is, for example, 50 ", has been introduced into the carrier plate. It has already been determined which of the mirror facets with which of the previously measured angle errors is to be inserted into which of the mounting holes.
  • the mounting holes can therefore already be corrected in accordance with the measured angle errors of the mirror facets.
  • the residual error after inserting the mirror facets into the respective mounting holes is again determined using an angle measuring device, which is due to the manufacturing accuracy to be achieved in a range that allows the residual error to be corrected using a surface precision processing method.
  • the mirror facets are then firmly connected to the carrier plate, so that stable alignment is ensured even over a long period of time.
  • the direct contact of the mirror facet with the carrier plate achieves a structure which ideally dissipates the heat absorbed by the mirror facets. This enables a simple, inexpensive, very stable, shock-resistant, material-reducing, adhesive-free and thermally unproblematic construction of a facet mirror in the ultra-high vacuum range, in particular for use in EUV lithography.
  • the method for producing facet mirrors not only has advantages in terms of less assembly and adjustment effort and more cost-effective production, but this method also makes it possible to produce much smaller facet mirrors and in multiple versions in a facet mirror to be arranged, with a diameter range of the mirror facets of 3 mm to 50 mm being realizable without difficulty.
  • the processing of the mirror facet takes place via ion bea figuring (IBF).
  • IBF ion bea figuring
  • the processing of the mirror facet takes place via the vapor deposition of preferably wedge-shaped metal intermediate layers.
  • This processing step represents an alternative to IBF processing.
  • the receiving bores are manufactured with a manufacturing accuracy of 30 ", after which in a second process step the receiving bores are machined on defined guide surfaces and support surfaces in order to achieve the required accuracy via IBF.
  • machining the locating holes via IBF is much more precise than other fine machining methods.
  • FIG. 1 shows a structure of an EUV lighting system with a light source, a lighting system and a projection lens
  • Figure 2 shows a longitudinal section of a cylindrical mirror facet, the mirror facet being mounted in a carrier plate;
  • Figure 3 shows a longitudinal section of a conical mirror facet, the mirror facet being mounted in a carrier plate
  • FIG. 4 shows a plan view of a facet mirror, which contains both embodiments of the mirror facets shown in FIG. 2 and FIG. 3.
  • FIG. 1 shows an overview of an EUV projection exposure system with a complete EUV illumination system with a light source 1 and a projection lens 2 that is only shown in principle. Furthermore, in the lighting system there is a plane mirror 3, a first optical element 4 with a large number of facet mirrors, a subsequently arranged second optical element 5 with a plurality of raster elements in the form of facet mirrors and two imaging mirrors 6a and ⁇ b.
  • the imaging mirrors 6a and 6b serve to image the facet mirrors of the second optical element 5 in an entrance pupil of the projection objective 2.
  • a reticle 7 can be moved in the y direction as a scanning system.
  • a reticle level 8 also simultaneously represents the object level.
  • a wafer 11 is located on a carrier unit 9 as the object to be exposed.
  • FIG. 2 shows a mirror facet 12, which is formed from a cylindrical head 13 and a cylindrical base 14.
  • the cylindrical head 13 has, for example, a diameter of 20 mm and the cylindrical base 14 has a diameter of approximately 8 mm.
  • the mirror facet 12 has a length of 60 mm, for example. Silicon is selected as the material of the mirror facet 12, for reasons of processing and thermal stress.
  • the mirror facet 12 can also be made of a stainless steel alloy or other materials that meet the requirements for polishability, mechanical, thermal and temporal stability and ultra-high vacuum compatibility (UHV compatibility).
  • the front side of the mirror facet head 13 has a spherical, concave mirror surface 15 with a radius of approximately 2,000 mm.
  • the mirror surfaces 15 can also be flat, spherical, aspherical, convex and concave.
  • a marking 23 (see FIG. 4) for correct azimuthal orientation of the mirror facet 12 is attached to the mirror surface 15. The marking 23 must be aligned with a corresponding marking on the flat carrier plate 16.
  • the carrier plate 16 can also be aspherical, so that, if desired, the mirror facets 12, 12 'are not arranged in one plane.
  • the carrier plate 16 is made of steel with a thickness of approximately 50 mm.
  • the carrier plate 16 can also be made of silicon, since thermal conductivity again has advantages here. Other materials are also possible.
  • the cylindrical base 14 is provided with a thread 17 in order to hold the mirror facet 12 in position with a defined force, for example realized by a threaded nut 18 and a spring 19.
  • the spring 19 can be formed as a cylindrical spring or as a disc spring made of stainless steel. This is particularly important if materials with different coefficients of thermal expansion are used for the carrier plate 16 and for the mirror facet 12, as in the present exemplary embodiment.
  • the mirror facets 12 must be arranged at different tilt angles on the carrier plate 16 so that the incident rays are reflected in a predetermined direction.
  • the normal 20 of the mirror facet 12 must therefore lie in a certain desired direction. For this reason the mirror surface 15 are well oriented so that the precisely manufactured mirror surface 15 can be aligned precisely on the body axis or on the desired direction.
  • the relationship between the mirror surface 15 and the rear mirror surface 15 ' is measured.
  • the relationship between the lateral surface 21 and the mirror surface 15 can also advantageously be measured so that an error to be corrected can be determined immediately. This means that a target angular direction and an actual angular direction are determined, the difference is formed therefrom and this difference must be eliminated.
  • the first step is aimed at the receiving bore 22. Since the mirror surface 15 can only be manufactured with an accuracy of approximately 200 ′′ relative to the support plate 16, the receiving bore 22 is machined accordingly at the position of the position-defining lateral surfaces 21 of the mirror facet 12 until the reference surfaces 21 are tilted by the previously measured angle correction (in most cases 200 "). Thereafter, the finely machined lateral surface 21 with a measured error can additionally achieve the required accuracy of approximately 10 "by vapor deposition of a wedge-shaped intermediate metal layer.
  • the mirror surface can be reworked with ion beam figuring
  • the necessary accuracy can also be achieved only with ion beam figuring, in which the surface to be treated is removed by ions in the final processing.
  • the removal of typically 1 to 2 ⁇ m required for IBF processing can be carried out in this processing step without Deterioration of surface roughness ability to be carried out.
  • a final accuracy of approx. 1 can thus be achieved.
  • the mirror rear surface 15 ′ (angle-defining guide surface) of the mirror facet 12 corresponding to the receiving bore 22 can also be machined with IBF, or a wedge-shaped metal intermediate layer can be applied in the region of the mirror surface 15, or the mirror rear surface 15 ′ of the mirror facet 12 corresponding to the receiving bore 22 wedge-shaped metal intermediate layer.
  • a mirror facet 12 is used on a trial basis and the reflectivity is measured.
  • the metal to be evaporated can be gold because it is soft and also adapts to the shapes.
  • any form of metal can be used, for example precious metals, gallium, platinum, silver or indium. However, it is important to use a metal that is easy to separate and therefore also makes good thermal contact.
  • Another alternative besides the vapor deposition of metal intermediate layers for IBF processing is to rotate the tilted mirror facets 12 and 12 'about their axes. By turning, it can be achieved that the correction is only carried out in one direction, thus simplifying the further process steps. If high accuracy can only be achieved in one direction, but not in the other direction, rotating the mirror facets 12 and 12 'means that the accuracy is the same in all directions. After that, either by IBF or vapor deposition of metal intermediate layers the required accuracy can be achieved.
  • the receiving bore 22 should be made very precisely in the area of the rear mirror surface 15 ', since the exact position of the mirror is defined here.
  • the other areas of the holes are space-creating holes and do not have to meet high accuracy.
  • the receiving bore 22 has a cylindrical shape in this embodiment.
  • the small surface corresponding to the facet mirror rear surface 15 'thus defines the angle and the lateral surfaces 21' define the position. The exact position determination is particularly important if there are curved surfaces.
  • FIG. 3 shows a mirror facet 12 'with a conical mirror facet head 13' and a cylindrical mirror facet base 14. Accordingly, the receiving bore 22 'is also conical. The machining steps of the receiving bore 22 'are carried out in the same steps as when there is a cylindrical mirror facet head. However, it should be noted that the lateral surfaces 21 'must have a very high level of accuracy, since the mirror facet head 13' lies directly on the lateral surfaces 21 '. The evaporation of the wedge-shaped intermediate metal layer can take place in the region of the mirror surface 15 and in the conical receiving bore 22 ', as can the IBF processing.
  • the conical guide has a major advantage. It is not self-locking but self-centering. Very steep angles of the receiving bore 22 as well as of the conical see mirror facet head 13 'preferred to obtain a very good position definition.
  • the conical mirror facet head 13 ' has a radius of approximately 2,000 mm and a diameter of approximately 20 mm, measured in each case on the mirror surface 15.
  • FIG. 4 shows a plan view of a facet mirror 24.
  • the facet mirror 24 is each provided with a cylindrical mirror facet 12 and a conical mirror facet 12 '.
  • the marking 23 for azimuthal alignment can be seen in the lower region of the mirror facets 12 and 12 '.
  • a setting hole 25 or reference surfaces 26 on the facet mirror 24 define the reference to a measuring system. There may also be a plurality of pegging holes 25.
  • a facet mirror 24 contains approximately 200 mirror facets, e.g. only with cylindrical mirror facets 12 or only with conical mirror facets 12 '. However, it would also be possible to mix cylindrical and conical mirror facets 12 and 12 '.
  • V-shaped grooves can possibly be introduced in the area of the receiving bores 22 in order to vent the surfaces 21.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un miroir à facettes (24) présentant plusieurs facettes de miroir (12, 12'), lequel miroir est en particulier destiné à un dispositif d'éclairage dans un système d'éclairage par projection en microlithographie et prévu pour être utilisé avec un éclairage dans l'ultraviolet extrême. Dans une première étape dudit procédé, la facette de miroir (12, 12') est fabriquée. Dans une deuxième étape de ce procédé, l'écart angulaire de l'axe optique de la surface de miroir de chaque facette de miroir par rapport à la normale (20) de la facette de miroir (12, 12') est déterminé. Dans une troisième étape, en connaissance des valeurs de mesure déterminées à l'étape précédente pour la facette de miroir correspondante (12, 12'), un alésage (22) est formé dans une plaque de support (16). Cet alésage (22) est déjà corrigé avec la valeur mesurée en deuxième étape du point de vue de la position angulaire à atteindre. Les facettes de miroir (12, 12') sont ensuite introduites dans l'alésage (22) prévu pour la facette de miroir correspondante (12, 12') puis l'orientation de la surface de miroir (15) de chaque facette (12, 12') est à nouveau mesurée. Enfin, la surface de miroir (15) de la facette de miroir (12, 12') est usinée jusqu'à l'obtention de la précision angulaire définitive requise.
PCT/EP2004/000331 2003-01-24 2004-01-17 Procede de fabrication d'un miroir a facettes WO2004066010A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/936,317 US7246909B2 (en) 2003-01-24 2004-09-08 Method for the production of a facetted mirror
US11/695,626 US20070206301A1 (en) 2003-01-24 2007-04-03 Faceted mirror apparatus
US12/338,049 US7802891B2 (en) 2003-01-24 2008-12-18 Faceted mirror apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2003102664 DE10302664A1 (de) 2003-01-24 2003-01-24 Verfahren zur Herstellung eines Facettenspiegels
DE10302664.9 2003-01-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/936,317 Continuation US7246909B2 (en) 2003-01-24 2004-09-08 Method for the production of a facetted mirror

Publications (1)

Publication Number Publication Date
WO2004066010A1 true WO2004066010A1 (fr) 2004-08-05

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ID=32602907

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/000331 WO2004066010A1 (fr) 2003-01-24 2004-01-17 Procede de fabrication d'un miroir a facettes

Country Status (2)

Country Link
DE (1) DE10302664A1 (fr)
WO (1) WO2004066010A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008101656A3 (fr) * 2007-02-19 2009-03-12 Zeiss Carl Smt Ag Procédé de production de miroirs à facettes et appareil d'exposition par projection
CN114527566A (zh) * 2022-01-19 2022-05-24 洛伦兹(宁波)科技有限公司 转镜装置的制作方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008007060B3 (de) * 2008-01-31 2009-08-06 Astrium Gmbh Spiegelmodul zur Befestigung an einem Strukturelement
CN102257421B (zh) 2008-10-20 2014-07-02 卡尔蔡司Smt有限责任公司 用于引导辐射束的光学模块
DE102013220473A1 (de) * 2013-10-10 2015-05-07 Carl Zeiss Smt Gmbh Facettenelement mit justagemarkierungen
DE102014219770A1 (de) 2014-09-30 2016-03-31 Carl Zeiss Smt Gmbh Spiegelanordnung, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage, sowie Verfahren zur Ableitung eines Wärmestromes aus dem Bereich einer Spiegelanordnung
DE102015215214A1 (de) 2015-08-10 2016-09-08 Carl Zeiss Smt Gmbh Verfahren zur Bewerkstelligung einer metallischen Bauteilverbindung, sowie unter Anwendung desselben gefertigte Spiegelfassung für eine mikrolithografische Projektionsbelichtungsanlage
DE102015223793A1 (de) * 2015-11-30 2016-10-27 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithographie mit reduzierter thermischer Deformation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0145243A2 (fr) * 1983-11-03 1985-06-19 Unisys Corporation Procédé et appareil pour fabriquer des dispositifs avec des parcours de rayons réfléchis
DE10030495A1 (de) * 2000-06-21 2002-01-03 Zeiss Carl Verfahren zum Verbinden einer Vielzahl von optischen Elementen mit einem Grundkörper
DE10205425A1 (de) * 2001-11-09 2003-05-22 Zeiss Carl Smt Ag Facettenspiegel mit mehreren Spiegelfacetten
WO2003050586A2 (fr) * 2001-12-12 2003-06-19 Carl Zeiss Smt Ag Facette de miroir et miroir a facettes
WO2003067304A1 (fr) * 2002-02-09 2003-08-14 Carl Zeiss Smt Ag Miroir a plusieurs facettes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0145243A2 (fr) * 1983-11-03 1985-06-19 Unisys Corporation Procédé et appareil pour fabriquer des dispositifs avec des parcours de rayons réfléchis
DE10030495A1 (de) * 2000-06-21 2002-01-03 Zeiss Carl Verfahren zum Verbinden einer Vielzahl von optischen Elementen mit einem Grundkörper
DE10205425A1 (de) * 2001-11-09 2003-05-22 Zeiss Carl Smt Ag Facettenspiegel mit mehreren Spiegelfacetten
WO2003050586A2 (fr) * 2001-12-12 2003-06-19 Carl Zeiss Smt Ag Facette de miroir et miroir a facettes
WO2003067304A1 (fr) * 2002-02-09 2003-08-14 Carl Zeiss Smt Ag Miroir a plusieurs facettes

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SCHINDLER ET AL.: "Ion Beam and Plasma Jet Etching for Optical Component Fabrication", PROCEEDINGS OF THE SPIE, vol. 4440, November 2001 (2001-11-01), Bellingham, US, pages 217 - 227, XP002281181 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008101656A3 (fr) * 2007-02-19 2009-03-12 Zeiss Carl Smt Ag Procédé de production de miroirs à facettes et appareil d'exposition par projection
JP2010519725A (ja) * 2007-02-19 2010-06-03 カール・ツァイス・エスエムティー・アーゲー ファセットミラー及び投影露光装置の製造方法
CN114527566A (zh) * 2022-01-19 2022-05-24 洛伦兹(宁波)科技有限公司 转镜装置的制作方法

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