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WO2003038894A2 - Chip module - Google Patents

Chip module Download PDF

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Publication number
WO2003038894A2
WO2003038894A2 PCT/DE2002/003425 DE0203425W WO03038894A2 WO 2003038894 A2 WO2003038894 A2 WO 2003038894A2 DE 0203425 W DE0203425 W DE 0203425W WO 03038894 A2 WO03038894 A2 WO 03038894A2
Authority
WO
WIPO (PCT)
Prior art keywords
chip
chip module
module according
holding frame
fastening
Prior art date
Application number
PCT/DE2002/003425
Other languages
German (de)
French (fr)
Other versions
WO2003038894A3 (en
Inventor
Andreas Karl
Norbert Koczwara
Boris Mayerhofer
Hans-Georg Mensch
Thomas Spoettl
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2003038894A2 publication Critical patent/WO2003038894A2/en
Publication of WO2003038894A3 publication Critical patent/WO2003038894A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a chip module according to claim 1.
  • the invention is therefore based on the object of providing a chip module which, for very large “chips”, ensures simple holding with simple means, which transfers as little mechanical load as possible onto the chip.
  • the chip module according to the invention holds the chip only on one side and can move with respect to the holding frame when bending loads occur, so that the holding frame and not the chip is loaded.
  • the chip can be easily contacted by leading lines to the fastenings.
  • soldered connection or adhesive connection in particular as an anisotropically conductive adhesive connection, such an attachment can be produced in a slightly conductive manner.
  • the chip By covering the chip with a film, the chip is held securely on the holding frame, in particular if a gap between the chip and the holding frame on the one hand and the film on the other hand by means of a gel-like mass or an adhesive which does not harden or does not harden completely and transmits only low shear forces, is filled out.
  • a holding frame 2 is shown, which as
  • Epoxy frame can be formed. If necessary, a surface is metallized.
  • the frame which is only shown in cross section in the figure, has a rectangular shape in plan view.
  • the dimensions of the chip 1 relative to the holding frame 2 are such that it covers the opening which the frame forms.
  • the chip 1 lies on the side opposite the metallization.
  • the chip 1 is fastened to a fastening 8 on one side of the holding frame 2.
  • This attachment can be designed as a soldered connection, conductive adhesive connection, in particular as an anisotropically conductive adhesive connection.
  • the chip 1 is thus fastened in the vicinity of the inner edge 6 of the holding frame 2, whereas it is unattached on the shark in the vicinity of the inner edge 5 frame 2 rests.
  • Chip 1 rests on the holding frame 2, a conductor track guide 7 which enables an electrical connection of the chips to the outside world.
  • the film 3 is provided to mechanically relieve the fastening 8 or to protect the rear side of the semiconductor chip 1. This presses the chip 1 against the holding frame 2, however, leaves room for maneuver when bends occur.
  • an intermediate space is formed between the film 3 on the one hand and the chip 1 or the holding frame 2 on the other hand, which is filled with a gel-like material.
  • the chip module 11 described above can be used particularly advantageously if the surface has a fingerprint sensor or something similar, which must be accessible from the outside.
  • a chip module with a fingerprint sensor as a chip for example used in a chip card, makes it possible for bending loads or shear forces, which often occur during shipping and which are repeated with a particularly high frequency during the life of such a chip card, from the holding frame 2 of the Chip module 11 are added while the chip as such is kept more or less "floating”.

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electrotherapy Devices (AREA)

Abstract

The invention relates to a chip module, comprising a rectangular support frame and a chip, which lies at least on two opposite inner edges of said frame. According to said invention, said chip is firmly secured to the frame, by means of a fixing device, at only one of said two opposite inner edges.

Description

Beschreibungdescription

Chipmodulchip module

Die Erfindung betrifft ein Chipmodul gemäß Patentanspruch 1.The invention relates to a chip module according to claim 1.

Insbesondere bei sehr großen integrierten Schaltungen, wie sie in der Mikroelektronik verwendet werden und üblicherweise als "Chips" benannt sind, droht die Zerstörung durch Kraft- einwirkung. Diese tritt insbesondere bei diesem großen "Chips" auf, wenn Biegebelastungen auftreten.Particularly in the case of very large integrated circuits, such as are used in microelectronics and are usually referred to as "chips", there is a risk of destruction due to the action of force. This occurs particularly with this large "chip" when bending loads occur.

Insbesondere wenn ein derartiger "Chip" z.B. einen großflächigen sogenannten Fingerabdrucksensor aufweist, müssen Vor- kehrungen zur Stabilisierung des Chips getroffen werden. Auch ist leicht einsehbar, daß bei derartigen Anwendungen der Chip einem besonderen Biegestreß ausgesetzt ist. Insbesondere für derartige Fingerabdrucksensoren, liefern die Hersteller derartiger "Chips" diese in einem sogenannten „Chipmodul" als Zwischenprodukt aus.Especially when such a "chip" e.g. has a large so-called fingerprint sensor, precautions must be taken to stabilize the chip. It is also easy to see that the chip is subjected to a special bending stress in such applications. For such fingerprint sensors in particular, the manufacturers of such "chips" deliver them as an intermediate product in a so-called "chip module".

Der Erfindung liegt somit die Aufgabe zu Grunde, ein Chipmodul vorzusehen, das für sehr große "Chips" mit einfachen Mitteln eine leichte Halterung gewährleistet, die möglichst we- nig mechanische Belastung auf den Chip überträgt.The invention is therefore based on the object of providing a chip module which, for very large “chips”, ensures simple holding with simple means, which transfers as little mechanical load as possible onto the chip.

Diese Aufgabe wird erfindungsgemäß mit den in Patentanspruch 1 angegebenen Maßnahmen gelöst.This object is achieved with the measures specified in claim 1.

Durch das erfindungsgemäße Chipmodul wird der Chip nur einseitig gehalten und kann beim Auftreten von Biegebelastungen sich gegenüber dem Halterahmen bewegen, so daß der Halterahmen und nicht der Chip belastet wird.The chip module according to the invention holds the chip only on one side and can move with respect to the holding frame when bending loads occur, so that the holding frame and not the chip is loaded.

Weitere vorteilhafte Ausgestaltung der Erfindung sind in den Unteransprüchen angegeben. Durch das Heranführen von Leitungen zu den Befestigungen ist der Chip leicht kontaktierbar .Further advantageous embodiments of the invention are specified in the subclaims. The chip can be easily contacted by leading lines to the fastenings.

Insbesondere durch das Vorsehen einer Lötverbindung bzw. Kle- beverbindung, insbesondere als anisotropisch leitende Klebeverbindung, ist eine derartige Befestigung leicht leitend herstellbar.In particular, by providing a soldered connection or adhesive connection, in particular as an anisotropically conductive adhesive connection, such an attachment can be produced in a slightly conductive manner.

Durch das Abdecken des Chips mittels einer Folie ist dieser sicher am Halterahmen gehalten, insbesondere wenn ein Zwischenraum zwischen dem Chip und dem Halterahmen einerseits und der Folie andererseits mittels einer gelartigen Masse oder einem klebstoff , der nicht oder nicht vollständig aushärtet und nur geringe Scherkräfte überträgt, ausgefüllt ist.By covering the chip with a film, the chip is held securely on the holding frame, in particular if a gap between the chip and the holding frame on the one hand and the film on the other hand by means of a gel-like mass or an adhesive which does not harden or does not harden completely and transmits only low shear forces, is filled out.

Nachfolgend wird die Erfindung an Hand eines Ausführungsbei- spiels erläutert, wobei die Figur ein erfindungsgemäßes Chipmodul im Querschnitt darstellt.The invention is explained below on the basis of an exemplary embodiment, the figure showing a chip module according to the invention in cross section.

In der Figur ist ein Halterahmen 2, dargestellt, der alsIn the figure, a holding frame 2 is shown, which as

Epoxidrahmen ausbildbar ist. Gegebenenfalls ist eine Oberfläche metallisiert.Epoxy frame can be formed. If necessary, a surface is metallized.

Der Rahmen, der in der Figur nur im Querschnitt dargestellt ist, weist in der Draufsicht eine Rechteckform auf.The frame, which is only shown in cross section in the figure, has a rectangular shape in plan view.

Bezugnehmend auf die Figur ist der Chip 1 von seinen Abmessungen her gegenüber dem Halterahmen 2 so ausgebildet, daß er die Öffnung, die der Rahmen bildet, abdeckt. Dabei liegt der Chip 1 auf der der Metallisierung gegenüberliegenden Seite auf. An einer Befestigung 8 ist der Chip 1 an einer Seite des Halterahmens 2 befestigt. Diese Befestigung kann als Lötverbindung, leitende Klebeverbindung, insbesondere als anisotrop leitende KlebeVerbindung ausgebildet sein. Wie der Figur zu entnehmen ist, ist der Chip 1 somit in der Nähe der Innenkante 6 des Halterahmens 2 mit diesem befestigt, wogegen er gegenüber in der Nähe der Innenkante 5 unbefestigt auf dem Hai- terahmen 2 aufliegt. Genauso besteht keine Befestigung an den nicht dargestellten Querseiten, die die Kanten 5 und 6 miteinander zu einer rechteckförmigen Öffnung verbinden.Referring to the figure, the dimensions of the chip 1 relative to the holding frame 2 are such that it covers the opening which the frame forms. The chip 1 lies on the side opposite the metallization. The chip 1 is fastened to a fastening 8 on one side of the holding frame 2. This attachment can be designed as a soldered connection, conductive adhesive connection, in particular as an anisotropically conductive adhesive connection. As can be seen from the figure, the chip 1 is thus fastened in the vicinity of the inner edge 6 of the holding frame 2, whereas it is unattached on the shark in the vicinity of the inner edge 5 frame 2 rests. Likewise, there is no attachment to the transverse sides, not shown, which connect the edges 5 and 6 to one another to form a rectangular opening.

Von den Befestigungen 8 besteht auf der Seite, an der derOf the fasteners 8 is on the side where the

Chip 1 auf dem Halterahmen 2 aufliegt eine Leiterbahnführung 7 die eine elektrische Verbindung der Chips zur Außenwelt ermöglicht .Chip 1 rests on the holding frame 2, a conductor track guide 7 which enables an electrical connection of the chips to the outside world.

Zur mechanischen Entlastung der Befestigung 8 bzw. zum Rückseitenschutz des Halbleiterchips 1 ist die Folie 3 vorgesehen. Diese drückt den Chip 1 gegen den Halterahmen 2 läßt jedoch Bewegungsspielraum beim Auftreten von Verbiegungen. Im in der Figur dargestellten Ausführungsbeispiel ist zwischen der Folie 3 einerseits und dem Chip 1 bzw. dem Halterahmen 2 andererseits ein Zwischenraum ausgebildet, der mit einem gelartigen Material ausgefüllt ist.The film 3 is provided to mechanically relieve the fastening 8 or to protect the rear side of the semiconductor chip 1. This presses the chip 1 against the holding frame 2, however, leaves room for maneuver when bends occur. In the embodiment shown in the figure, an intermediate space is formed between the film 3 on the one hand and the chip 1 or the holding frame 2 on the other hand, which is filled with a gel-like material.

Dadurch wird von der Rückseite ein gleichmäßiger Druck auf den Chip ausgeübt, der ihn gegen den Halterahmen 2 drückt, so daß kein Spalt an den Innenkanten des Halterahmens 2 entstehen. Dadurch, daß hier ein gelartiges Material 4 als Füllmaterial verwendet ist, entsteht beim Auftreten von Verbiegungen oder einem Rückbiegen keine, Hohlräume, da das Gel dem Zurückweichen des Chips folgt.As a result, a uniform pressure is exerted on the chip from the back, which presses it against the holding frame 2, so that there is no gap on the inner edges of the holding frame 2. Due to the fact that a gel-like material 4 is used here as the filling material, there are no cavities when bends or rebending occur, since the gel follows the chip's retraction.

Das zuvor beschriebene Chipmodul 11 ist besonders vorteilhaft dann einsetzbar, wenn die Oberfläche ein Fingerabdrucksensor oder etwas ähnliches aufweist, was von außen zugänglich sein muß. Ein derartiges Chipmodul mit einem Fingerabdrucksensor als Chip, beispielsweise in einer Chipkarte eingesetzt, ermöglicht es, daß Biegebelastungen bzw. Scherkräfte, die bereits beim Versand oftmals auftreten und während der Lebensdauer einer derartigen Chipkarte mit besonders großer Häufig- keit sich wiederholen, vom Halterahmen 2 des Chipmoduls 11 aufgenommen werden, während der Chip als solcher mehr oder weniger "schwimmend" gehalten wird. BezugszeichenlisteThe chip module 11 described above can be used particularly advantageously if the surface has a fingerprint sensor or something similar, which must be accessible from the outside. Such a chip module with a fingerprint sensor as a chip, for example used in a chip card, makes it possible for bending loads or shear forces, which often occur during shipping and which are repeated with a particularly high frequency during the life of such a chip card, from the holding frame 2 of the Chip module 11 are added while the chip as such is kept more or less "floating". LIST OF REFERENCE NUMBERS

1 Chip1 chip

2 Halterahmen 3 Befestigungsfolie2 holding frames 3 mounting foil

4 Füllmaterial4 filling material

5 gegenüberliegende Innenkante5 opposite inner edges

6 Innenkante6 inner edge

7 Leitung 8 Befestigung 11 Chipmodul 7 line 8 mounting 11 chip module

Claims

Patentansprüche claims 1. Chipmodul bestehend aus einem rechteckförmigen Halterahmen (2) und einem Chip (1) , der zumindest an zwei sich gegenüber- liegenden Innenkanten (5, 6) des Rahmens aufliegt, wobei der Chip (1) mit dem Rahmen an nur einer dieser zwei sich gegenüberliegenden Innenkanten (6) mittels einer Befestigung (8) fest verbunden ist .1. Chip module consisting of a rectangular holding frame (2) and a chip (1), which rests at least on two opposite inner edges (5, 6) of the frame, the chip (1) with the frame on only one of these two opposite inner edges (6) is firmly connected by means of a fastening (8). 2. Chipmodul nach Anspruch 1, bei den Leiterbahnen (7) auf dem Halterahmen (2) zur Befestigung (8) hingeführt und über die Befestigung (8) mit Kontaktstellen des Chips (1) elektrisch leitend verbunden sind.2. Chip module according to claim 1, in which the conductor tracks (7) are guided on the holding frame (2) for fastening (8) and are electrically conductively connected to contact points of the chip (1) via the fastening (8). 3. Chipmodul nach Anspruch 2, bei dem die Befestigung (8) mittels einer Lötverbindung hergestellt ist.3. Chip module according to claim 2, wherein the fastening (8) is made by means of a solder connection. 4. Chipmodul nach Anspruch 2, bei der die Befestigung (8) als leitende Klebeverbindung hergestellt ist.4. Chip module according to claim 2, wherein the fastening (8) is made as a conductive adhesive connection. 5. Chipmodul nach Anspruch 4, bei der die leitende Klebeverbindung als anisotrop leitende Klebeverbindung ausgebildet ist .5. Chip module according to claim 4, wherein the conductive adhesive connection is designed as an anisotropically conductive adhesive connection. 6. Chipmodul nach Anspruch 2, bei dem der Chip (1) mittels einer Abdeckfolie (3) abgedeckt ist, die am Halterahmen (2) haftend befestigt ist.6. Chip module according to claim 2, wherein the chip (1) is covered by means of a cover film (3) which is adhesively attached to the holding frame (2). 7. Chipmodul nach Anspruch 6, bei dem zwischen der Abdeckfo- lie (3) einerseits und dem Chip (1), und dem Halterahmen (2) andererseits ein Zwischenraum ausgebildet ist, der mittels eines Füllmaterials (4) ausgefüllt ist.7. Chip module according to claim 6, in which an intermediate space is formed between the cover film (3) on the one hand and the chip (1) and the holding frame (2) on the other hand, which is filled by means of a filling material (4). 8. Chipmodul nach Anspruch 7, bei dem das Filmmaterial (4) aus einem gelartigen Material oder Klebstoff, der nicht oder nicht vollständig aushärtet und nur gering Scherkräfte überträgt, besteht. 8. Chip module according to claim 7, wherein the film material (4) consists of a gel-like material or adhesive that does not harden or does not fully harden and transmits only low shear forces.
PCT/DE2002/003425 2001-10-19 2002-09-13 Chip module WO2003038894A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10151151.5 2001-10-19
DE10151151A DE10151151A1 (en) 2001-10-19 2001-10-19 Chip module has chip in contact with at least two opposing inner edges of frame, whereby chip is fixed to frame at only one of opposing inner edges by attachment arrangement

Publications (2)

Publication Number Publication Date
WO2003038894A2 true WO2003038894A2 (en) 2003-05-08
WO2003038894A3 WO2003038894A3 (en) 2003-09-25

Family

ID=7702737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003425 WO2003038894A2 (en) 2001-10-19 2002-09-13 Chip module

Country Status (3)

Country Link
DE (1) DE10151151A1 (en)
TW (1) TW584947B (en)
WO (1) WO2003038894A2 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930010072B1 (en) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 CCD package and manufacturing method
CA2092165C (en) * 1992-03-23 2001-05-15 Tuyosi Nagano Chip carrier for optical device
ES2167791T3 (en) * 1996-08-22 2002-05-16 Pav Card Gmbh PROCEDURE FOR MANUFACTURING AN ELECTRICAL AND MECHANICAL CONNECTION OF A CHIP CARD MODULE INSERTED IN A HOLE OF A CARD BODY.
EP0941696A1 (en) * 1998-03-03 1999-09-15 Siemens Aktiengesellschaft Fingertipsensor with integrated bushbutton switch
FR2798226B1 (en) * 1999-09-02 2002-04-05 St Microelectronics Sa METHOD FOR PACKAGING A SEMICONDUCTOR CHIP CONTAINING SENSORS AND PACKAGE OBTAINED

Also Published As

Publication number Publication date
DE10151151A1 (en) 2002-06-13
WO2003038894A3 (en) 2003-09-25
TW584947B (en) 2004-04-21

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