WO2003012836A1

WO2003012836A1 - Semiconductor manufacturing system, semiconductor manufacturing apparatus, semiconductor manufacturing method, and semiconductor device

Info

Publication number: WO2003012836A1
Application number: PCT/JP2002/007761
Authority: WO
Inventors: Yasushi Kato; Toshikazu Suzuki; Hirohisa Kooriyama
Original assignee: Sony Corporation
Priority date: 2001-07-31
Filing date: 2002-07-30
Publication date: 2003-02-13
Also published as: JP2003042498A

Abstract

A semiconductor manufacturing system comprises, as shown in Fig. 1, a clean room (1) for manufacturing a semiconductor device and a semiconductor manufacturing apparatus (20) using a chemical contaminantion non-releasing material. The semiconductor manufacturing apparatus (20) is installed in the clean room (1). Thus no chemical contaminants are not released from the semiconductor manufacturing apparatus (20) into the clean room (1) and consequently the inside of the clean room (1) can be kept in a clean, purified environment state. Compared to manufacture of a semiconductor device by using a semiconductor manufacturing apparatus (20) using a chemical contamination releasing material, defectives attributable to contamination by chemical contaminants, quality degradation, reliability degradation, degradation of the working ratio of the production line are low.

Description

Description: Semiconductor manufacturing system, semiconductor manufacturing apparatus, semiconductor manufacturing method, and semiconductor device

The present invention relates to a semiconductor manufacturing system, a semiconductor manufacturing apparatus, a semiconductor manufacturing method, and a semiconductor device suitable for application to manufacture and manufacture of a semiconductor integrated circuit device and a liquid crystal display device in a clean room. More specifically, a semiconductor manufacturing device using a material that does not emit chemical contamination is installed in the clean room so that semiconductor devices can be manufactured in a clean room maintained in a clean and pure atmosphere. is there. Background art

Conventionally, devices that manufacture semiconductor integrated circuit devices and liquid crystal display devices (hereinafter referred to as semiconductor manufacturing devices) have been installed in a tallin room that eliminates submicron particulate dust, and strict dust management has been performed. Have been. However, in recent years, as semiconductor processing has become finer, not only particulate dust but also gaseous air pollutants and so-called chemical contamination (Chemical Contamination) have been attracting attention.

Chemical contaminants, ionic components such as NH ₄ ^+, Futanore acid Jiokuchiru (DOP) of any organic matter, are classified into inorganic substances such as boron (B). For example, N ⁺ causes clouding of the optical system of the exposure equipment, and organic and inorganic substances are known to cause changes in the characteristics of oxide films and deterioration of film deposition in chemical vapor deposition (CVD) equipment. . This leads to a decrease in productivity of semiconductor integrated circuit devices or liquid crystal display devices (hereinafter simply referred to as semiconductor devices), a decrease in manufacturing yield, and a decrease in quality and reliability. For this reason, chemical pollutants in clean room air are recognized as a major problem.

By the way, in manufacturing plants for semiconductor devices, etc., air washers are installed in external controllers to prevent ionic components from entering the clean room from outside air, and silicon with low volatilization of low-molecular siloxane is used to prevent the generation of organic matter from building components. Use sealing material To prevent the generation of boron (B) from high-performance air conditioning filters (Ultra Low Penetration Filter: ULPA). We are working to reduce chemical pollutants in clean rooms from the perspective of building facilities such as air conditioning and electricity.

However, according to the conventional clean room and semiconductor manufacturing equipment, there are the following problems.

(1) Even if a clean room is made of materials that are designed to reduce chemical pollutants, if semiconductor manufacturing equipment is installed there, the concentration of airborne chemical pollutants will increase. This is because chemical contaminants emanate from the constituent materials of semiconductor manufacturing equipment, and the constituent materials of semiconductor manufacturing equipment have not been selected from the viewpoint of not increasing aerial chemical pollution in clean rooms. is there. For example, it is known that phthalate esters emanate from vinyl chloride-coated wires used in semiconductor manufacturing equipment, siloxanes emanate from silicone sealants, and DOP and boron (B) emanate from ULPA filters.

(2) In addition, since no measures have been taken to prevent chemical air pollution in the clean room from increasing, organic substances may emanate from the coated wires and sealing materials inside the semiconductor manufacturing equipment that come into direct contact with the air in the clean room. Boron (B) emitted from the air-conditioning filter for sending clean air inside may leak into the air in the tarin room through the gap between the equipment, and increase the chemical contamination in the air in the clean room.

(3) Since the air inside the semiconductor manufacturing equipment that comes into contact with the wafers sent into the clean room is generally the same as the air in the clean room, the contamination of chemical contaminants in the clean room air is unavoidable. By the way, a mechanism that sends air through a chemical filter to the place where the semiconductor wafer is exposed in the semiconductor manufacturing equipment to avoid contamination by chemical contaminants in the clean room air can be considered, but all semiconductors in the semiconductor manufacturing line Unless manufacturing equipment has the same response, multiple semiconductor processing steps

In the meantime, the Tallen Room was contaminated with airborne chemical pollutants, It is difficult to avoid this.

化学 Chemical contaminants emitted from components of semiconductor manufacturing equipment may contaminate air in areas other than the clean room into which air with reduced chemical contaminants has been sent. Therefore, the wafer surface fed into the semiconductor manufacturing apparatus comes into contact with the air, thereby contaminating the wafer surface.

⑤ In addition, if a part of the air sent into the clean room is passed through a chemical filter, a large initial investment will be required, and the maintenance and management of the chemical filter will be troublesome and costly. Disclosure of the invention

A semiconductor manufacturing system according to the present invention includes: a clean room for manufacturing a semiconductor device; and a semiconductor manufacturing device using a material that does not emit chemical pollution. The semiconductor manufacturing device is installed in the clean room. It is assumed that. According to this semiconductor manufacturing system, the emission of chemical contaminants from the semiconductor manufacturing equipment to the clean room can be eliminated, so that the clean room can be maintained in a clean and pure atmosphere. Therefore, compared to the case of manufacturing semiconductor devices using semiconductor manufacturing equipment that uses materials that emit chemical pollution, the occurrence of defects due to contamination by chemical contaminants, lower quality, lower reliability, and The reduction in the operating rate can be reduced. '

A first semiconductor manufacturing apparatus according to the present invention is an apparatus for manufacturing a semiconductor device, comprising: a device main body; and a device component attached to the device main body or connected to Z and the device main body. The equipment itself or Z and equipment parts are characterized by using materials that do not emit chemical pollution. According to the first semiconductor manufacturing apparatus, since the emission of chemical contaminants from the apparatus to the clean room can be eliminated, the clean room can be maintained in a clean and pure atmosphere. Therefore, as compared with the case where a semiconductor device is manufactured using a semiconductor manufacturing device using a material that emits chemical pollution, defects caused by contamination of chemical contaminants, quality deterioration, reliability deterioration, It is possible to reduce a decrease in the operation rate of the production line. A second semiconductor manufacturing apparatus according to the present invention is an apparatus for manufacturing a semiconductor device, comprising: a device main body; a device component attached to and / or connected to the device main body; Or an enclosure that covers a part or the whole of the device components, and an exhaust unit that exhausts the enclosure. According to the second semiconductor manufacturing apparatus, even when a part or all of the main unit and / or the parts of the main unit are unavoidably used, the chemical contaminants are exhausted by the exhaust means to the outside of the clean room. The clean room can be maintained in a clean and pure atmosphere.

The first semiconductor manufacturing method according to the present invention manufactures a semiconductor manufacturing apparatus using a material which does not emit chemical contamination in advance, installs the semiconductor manufacturing apparatus in a clean room, and uses the semiconductor manufacturing apparatus in a clean room. And manufacturing the semiconductor device. According to the first semiconductor manufacturing method, a semiconductor device can be manufactured in a clean room maintained in a clean and pure atmosphere. Therefore, compared to the case where semiconductor devices are manufactured in a clean room using semiconductor manufacturing devices that use materials that emit chemical contamination, high-quality and highly reliable semiconductor devices that are not dependent on chemical contaminants. Can be manufactured. Semiconductor device manufacturing costs can be reduced.

A second semiconductor manufacturing method according to the present invention is a method for manufacturing a semiconductor device using a semiconductor manufacturing apparatus in a clean room, comprising the steps of: covering a part or all of the semiconductor manufacturing apparatus with an enclosure; Exhausting the chemical pollutants out of the clean room. According to the second semiconductor manufacturing method, even when a material that emits chemical contamination is used for a part or the whole of the semiconductor manufacturing equipment, the chemical contaminants in the enclosure can be exhausted to the outside of the clean room. The inside can be maintained in a clean and pure atmosphere.

A semiconductor device according to the present invention includes a semiconductor substrate and an electronic circuit element formed on the semiconductor substrate, and the semiconductor substrate and / or the semiconductor device is manufactured by using a semiconductor manufacturing device manufactured using a material that does not emit chemical contamination. The electronic circuit element is manufactured. According to this semiconductor device, a semiconductor device using a material that emits chemical pollution is manufactured. It is possible to provide a high-quality and high-reliability semiconductor device that is not dependent on chemical contaminants as compared with a case where a semiconductor device is manufactured using a manufacturing apparatus. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a schematic diagram showing a configuration example of a semiconductor manufacturing system 100 as a first embodiment according to the present invention.

FIG. 2 is a schematic diagram of a clean room showing a configuration example of a semiconductor manufacturing system 200 as a second embodiment according to the present invention.

FIG. 3 is a schematic diagram showing a configuration example of a semiconductor manufacturing apparatus 201 as a first embodiment of the present invention.

FIG. 4 is a schematic diagram showing a configuration example of a semiconductor manufacturing apparatus 202 as a second embodiment according to the present invention.

FIG. 5 is a schematic diagram showing a configuration example of a semiconductor manufacturing apparatus 203 as a third embodiment according to the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

An object of the present invention is to provide a semiconductor manufacturing system, a semiconductor manufacturing apparatus, a semiconductor manufacturing method, and a semiconductor device that can maintain a clean room in a clean and pure atmosphere.

Hereinafter, an embodiment of a semiconductor manufacturing system, a semiconductor manufacturing apparatus, a semiconductor manufacturing method, and a semiconductor device according to the present invention will be described with reference to the drawings.

(1) First embodiment

In this embodiment, a semiconductor manufacturing apparatus using a material that does not emit chemical contamination is installed in the clean room, so that the semiconductor device can be manufactured in a clean room maintained in a clean and pure atmosphere. Things. In other words, the semiconductor manufacturing system 100 previously manufactures a semiconductor manufacturing device 20 using a material that does not emit chemical contamination, and installs the semiconductor manufacturing device 20 in the clean room 1 to clean the semiconductor room. To be used to manufacture semiconductor devices using semiconductor manufacturing equipment 20 (First semiconductor manufacturing method).

The semiconductor manufacturing system 100 shown in FIG. 1 is a system for manufacturing a semiconductor integrated circuit device or a liquid crystal display device (hereinafter, simply referred to as a semiconductor device). This system

100 is provided with a clean air circulation type clean room 1. The clean room 1 has a ceiling 16, a floor 14, and walls 10 A and 10 B, and although not shown, of course, has an entrance through which a worker 9 enters and exits. In the ceiling 16 of the clean room 1, a fan filter unit (FFU) 13 is disposed, and the back side of the ceiling 16 is a ceiling plenum chamber 11.

The floor 14 of the clean room 1 is provided with a plurality of openings 14 A for ventilation, the floor 14 is provided with floor structural members 15 behind the floor 14, and the floor 14 is provided with a return floor below the floor 14. It has become. The above-mentioned ceiling plenum chanamba 11 and the underfloor return area 12 are connected through an air conditioner 17 and ducts 8A and 8B. An air conditioner 18 is installed in the middle of the ducts 8A and 8B. The air conditioner 18 has a built-in air washer 19, which purifies the air to take in outside air and replenish it to the clean room 1. It is made to make a dagger. The air purified by the air conditioner 18 is sent to the ceiling plenum chamber 11 by the air conditioner 17 and blown out to the clean room 1 by the fan filter unit 13 to ventilate the floor 14. It is sucked into the underfloor return area 12 through the opening 14A.

The air in the clean room 1 is circulated by the air conditioner 17 through the ceiling plenum champ 1 1 → fanfi / reunit 13 → inside the clean room 1 → opening 14 A → underfloor return area 1 2 → ducts 8 A, 8 B It is done as follows. The clean air is supplied to the clean room 1 from outside. The building structure up to this point can adopt the same configuration as the conventional clean room.

In this semiconductor manufacturing system 100, a semiconductor manufacturing apparatus 20 using a material that does not emit chemical pollution is installed in the clean room 1, and the manufacturing apparatus 200 is used for manufacturing a semiconductor device. It is composed of equipment or Z and equipment parts. The semiconductor manufacturing apparatus 20 includes, for example, an apparatus main body and Z and / or device parts attached to the apparatus main body or connected to the apparatus main body. The product is made of a material that does not emit chemical contamination. As the material which does not emit chemical contamination, a material composed of a polyolefin, Teflon (trademark), polyethylene terephthalate, or phenol or polycarbonate material is used (first semiconductor manufacturing equipment).

The semiconductor manufacturing apparatus 20 includes, for example, a casing (not shown), a covered wire, a sealing material, a resin panel, a resin sheet, a pan heater, a paint, an air-conditioning filter, a heat insulating material, an adhesive, a printed circuit board, and a printed circuit board. At least one of resist, adhesive tape, and piping, or a combination of these, has a main device and / or device component. In this example, the housing, covered electric wire, sealing material, resin panel, resin sheet, band heater, paint, air-conditioning filter, heat insulating material, adhesive At least one or all of printed circuit boards, printed circuit board resist, adhesive tape, and piping are made of materials that do not emit chemical contamination. This is to prevent emission of chemical pollutants into the clean room 1 concerned.

Semiconductor manufacturing equipment 20 includes exposure equipment, coating equipment, developing equipment, cleaning equipment, measuring equipment, chemical vapor deposition equipment, plasma film-forming equipment, diffusion furnace equipment, etching equipment, plating equipment, wrapping equipment, asshing equipment, and ions. It constitutes at least one of an injection device, a chemical mechanical polishing device, a transport device, and a storage device. For example, when a coated electric wire is used in the semiconductor manufacturing apparatus 20 described above in the system 100, an electric wire coated with a polyolefin-based material and / or a Teflon (trademark) -based material is used as the coated electric wire. Have been. In this semiconductor manufacturing apparatus 20, instead of a conventional vinyl chloride-coated wire, a wire coated with a polyolefin-based material or a Teflon (trademark) -based material containing no plasticizer or the like is used, so that the clean room 1 It is designed to eliminate the emission of chemical contaminants into the interior.

In the case where a filter is used in the semiconductor manufacturing apparatus 20, a low-boron filter material and a low-organic-emission material are used to seal the filter material. . Further, in the case where a transparent resin panel is used in the semiconductor manufacturing apparatus 20, a polyethylene sheet is used instead of a transparent vinyl chloride sheet which emits a lot of organic matter. Terephthalate (PET) plates or polycarbonate (PC) plates are used. In this case, instead of a general sealant, a sealant with low siloxane volatilization, which reduces the volatilization of siloxane, is used for sealing the plate material.

In either case, the emission of chemical pollutants into the clean room 1 is eliminated. These are just examples.In addition, reducing the emission of chemical contamination from the semiconductor manufacturing equipment 20 by replacing the material that emits chemical contamination with a material that emits little or no emission at all. Can be. Furthermore, a case where a drive unit for driving a fan, a stage, or the like is used in the semiconductor manufacturing apparatus 20 is used, and a sealed motor is used for this drive unit, and the motor is sufficiently aged. Used later. This is to eliminate the emission of chemical pollutants into the clean room 1.

The clean room itself may be constructed using materials that do not emit chemical pollution. For example, a material that does not emit chemical pollution is used as a material or a coating material of the flooring material 14, the floor structural member 15, the ceiling 16 and the walls 1OA and 10B. In addition to paint materials, this non-contaminating material is not only paint materials, but also lighting wiring to the clean room 1, resin panels for partitions, sealing materials between panels, resin sheets, air-conditioning filters, heat insulating materials, adhesives, Adhesive tapes and pipes are also made of materials that do not emit chemical contamination. For example, a filter using a low boron-containing filter medium is used for the ULPA filter built into the fan filter unit 13 and a filter that uses a material that emits little organic matter is used for the seal material. . By adopting such a configuration, it is possible to significantly reduce the amount of airborne chemical pollutants in newly constructed clean rooms compared to clean rooms made of materials that do not consider chemical pollutants.

As described above, according to the semiconductor manufacturing system 100 as the first embodiment of the present invention, the constituent materials of the semiconductor manufacturing apparatus 20 are replaced from materials that emit chemical contamination to materials that do not emit chemical contamination. Thus, emission of chemical pollutants from the semiconductor manufacturing apparatus 20 to the clean room 1 can be eliminated. Therefore, the clean room 1 can be maintained in a clean and pure atmosphere. Compared to manufacturing semiconductor devices using semiconductor manufacturing equipment 20 that uses materials that emit chemical pollution, It is possible to reduce the occurrence of defects, deterioration in quality, deterioration in reliability, and reduction in the operation rate of the production line due to contamination of dyes.

According to the semiconductor device manufactured by the semiconductor manufacturing system 100, for example, a semiconductor substrate is provided, and an electronic circuit element formed on the semiconductor substrate is provided. A semiconductor substrate and / or an electronic circuit element are manufactured by the manufactured semiconductor manufacturing apparatus 20. When a liquid crystal display device is manufactured by the semiconductor manufacturing apparatus 20, the above-mentioned electronic circuit element is a liquid crystal display element. According to the semiconductor device manufactured using such a system 100, the semiconductor device is more dependent on chemical contaminants than when the semiconductor device is manufactured using a semiconductor manufacturing device 20 using a material that emits chemical pollution. It is possible to provide a high-quality and high-reliability semiconductor device which is not performed with high yield.

Also, when constructing a new clean room 1, the initial investment for an air purifying mechanism that purifies air using, for example, a chemical filter can be reduced, and the running cost of the conventional air purifying mechanism can be reduced. In comparison, in the present invention, a slight increase in investment such as changing a part of the constituent members of the semiconductor manufacturing apparatus 20, preferably changing the building members of the tallen room 1, etc., is sufficient.

In this embodiment, a polyolefin-based material, a Teflon (trademark) -based, a polyethylene terephthalate-based or a polycarbonate-based material has been described with respect to the material that does not emit chemical contamination. However, the present invention is not limited to this. † For raw materials, new materials can be found by analysis such as gas chromatography.

(2) Second embodiment

In this embodiment, a semiconductor manufacturing apparatus 20 using a chemical-contamination non-dispersing material is disposed in a bay-type clean room 2 shown in FIG. Note that components having the same reference numerals and the same names as those in the first embodiment have the same functions, and a description thereof will be omitted.

The clean room 2 shown in FIG. 2 is provided with partitions 24 that separate the work area. At the ceiling of this work area, a work area ceiling chamber 21 is provided. 1ϋ

A duct 8 G is arranged in the well plenum chamber 11. The work area divided by the partition 24 is a work passage 1OA and a maintenance area 23. Unlike the first embodiment, the duct 8B attached to the air conditioner 17 and the air conditioner 18 in this system 200 is divided into a duct 8C and a ceiling plenum champer 11. One of the ducts 8B is connected to a duct 8C through a chemical filter 22, and the other is connected to a ceiling plenum champer 11. The air cleaned by the air conditioner 18 is sent to the ceiling plenum champ 11 by the air conditioner 17, blown out to the maintenance area 23 by the fan filter unit 13, and the ventilation opening of the floor 14 is provided. It is sucked into the underfloor return area 1 2 through 14 A. Air in maintenance area 2 3 is ducted by air conditioner 17 7 B 8 → ceiling plenum champ 1 1 → fan fin unit 1 3 → inside maintenance area → opening 14 A → return area under floor 1 2 → duct 8 A , 8B.

The semiconductor manufacturing apparatus 20 is arranged in the maintenance area 23, and an operation unit is provided in front of the semiconductor manufacturing apparatus 20. In the area where this operation unit is visible, that is, in the passage section 10C through which the operator 9 mainly passes, the air in the taleen room 2 is supplied by the air conditioner 17 to the duct 8B → the chemical filter 22 → the duct. 8 C → Work area ceiling chamber 2 1 — Inside work passage → Opening 14 A → Underfloor return area 1 2 → Ducts 8 A and 8 B are circulated. The clean air is replenished from the outside to the maintenance area 23, the work channel 10C, and the like. The building structure up to this point can adopt the same configuration as the conventional bay-type clean room.

In the semiconductor manufacturing system 200, a semiconductor manufacturing apparatus 20 using a material that does not emit chemical contamination is installed in a clean room 2 that includes a maintenance area 23 and a work passageway 10C. This manufacturing apparatus 20 is also composed of a main body device and / or other device parts for manufacturing a semiconductor device in the same manner as in the first embodiment. Non-contaminating, non-contaminating materials are used for the main body or Z and the parts of the semiconductor manufacturing apparatus 20. In the same manner as in the first embodiment, polyolefin-based, Teflon-based, polyethylene terephthalate Those made of mono- or Z- and polycarbonate-based materials are used.

The semiconductor manufacturing apparatus 20 includes, for example, a casing (not shown), a covered wire, a sealing material, a resin panel, a resin sheet, a pan heater, a paint, an air-conditioning filter, a heat insulating material, an adhesive, a printed circuit board, and a printed circuit board. At least one of the resist, the adhesive tape, and the piping or a main unit or a device component obtained by combining them is provided. In this example, too, the chassis that constitutes the main unit or the components of the main unit, covered wires, sealing materials, resin panels, resin sheets, band heaters, paint, air-conditioning filters, heat insulating materials, adhesives, printed circuit boards, At least one or all of the printed circuit board resist, adhesive tape, and piping are made of materials that do not emit chemical contamination. This is to prevent the emission of chemical pollutants into the maintenance area 23 and the work passage 10C.

As in the first embodiment, the semiconductor manufacturing apparatus 20 includes an exposure apparatus, a coating apparatus, an imaging apparatus, a cleaning apparatus, a measuring apparatus, a chemical vapor deposition apparatus, a plasma film forming apparatus, a diffusion furnace apparatus, and an etching apparatus. It constitutes at least one of a plating device, a lapping device, an asshing device, an ion pouring device, a chemical mechanical polishing device, a transport device, and a storage device. For example, in the case where a coated electric wire is used in the semiconductor manufacturing apparatus 200 described above in this system 200, an electric wire coated with a polyolefin-based material and / or a Teflon (trademark) -based material is used as the coated electric wire. Have been.

In the case where a filter is used in the semiconductor manufacturing apparatus 20, a filter medium using a low amount of boron and a sealant having low organic substance emission are used for sealing the filter medium. Further, when a transparent resin panel is used in the semiconductor manufacturing apparatus 20, a polyethylene terephthalate (PET) plate or a polycarbonate (PC) plate is used instead of a transparent vinyl chloride plate that emits a large amount of organic substances. In this case, instead of a general sealant, a sealant with low siloxane volatilization, which reduces the volatilization of siloxane, is used for sealing the plate material.

In either case, the emission of chemical pollutants into the clean room 2 is eliminated. These are just examples, and other alternatives can be achieved by replacing materials that emit chemical contaminants with non-emissive materials that emit little or no emissions. The emission of chemical contamination from the body manufacturing apparatus 20 can be reduced. Furthermore, a case where a drive unit for driving a fan, a stage, and the like is used in the semiconductor manufacturing apparatus 20 is used, and a sealed motor is used for this drive unit, and the motor is sufficiently aged. Used later. This is to eliminate the emission of chemical pollutants into the clean room 2.

The clean room itself may be constructed using materials that do not emit chemical pollution. For example, a material that does not emit chemical pollution is used as a material for the surface of the flooring material 14, the floor structural member 15, the ceiling 16 and the walls 10A and 10B or a coating material. In addition to the floor material 14, floor structural members 15, ceiling 16 and walls 10A and 10B, the duct 8C, the partition 24, and the like also use materials that do not emit chemical contamination. Of course, lighting wiring to the maintenance area 23 and the work passage 10C, resin panels for partitioning, material for panels between panels, resin sheets, finoleta for air conditioning, heat insulating materials, adhesives, bonding Materials that do not emit chemical pollution are also used for tapes and piping. By adopting such a configuration, it is possible to significantly reduce airborne chemical pollutants in newly constructed clean rooms compared to clean rooms made of materials that do not consider chemical pollutants.

As described above, according to the semiconductor manufacturing system 200 as the second embodiment of the present invention, in the pay-type clean room 2 in which air with reduced chemical contaminants is sent through a chemical filter 22 or the like, By replacing the constituent materials of semiconductor manufacturing equipment 20 from materials that emit chemical pollution to materials that do not emit chemical pollution, chemicals from semiconductor manufacturing equipment 20 to maintenance area 23 and work passages 10 C etc. Emission of contaminants can be eliminated. Therefore, the maintenance area 23 and the work passage 10C can be maintained in a clean and pure atmosphere. Compared to manufacturing semiconductor devices using semiconductor manufacturing equipment 20 that uses materials that emit chemical pollution, the occurrence of defects due to contamination by chemical contaminants, lower quality, lower reliability, and lower manufacturing This can reduce the decrease in the operating rate of the application.

In addition, when a new clean room 2 is constructed, the initial investment for an air purifying mechanism for purifying air by using a chemical filter 22 or the like can be reduced, and the conventional air purifying mechanism can be reduced. Compared to running costs, in the second embodiment Thus, a small increase in investment such as changing a part of the constituent members of the semiconductor manufacturing apparatus 20, preferably changing the building members of the clean room 2, etc. can be achieved.

In this embodiment, a polyolefin-based material, a Teflon (trademark) -based material, a polyethylene terephthalate-based material, or a Z- and polycarbonate-based material has been described as a material that does not emit chemical contamination. However, the present invention is not limited thereto. For divergent materials, this includes all new materials found by analysis such as gas chromatography.

[First embodiment]

In this embodiment, an S MIF (Standard Mechanical) which is an example of the semiconductor manufacturing apparatus 20 installed in the above-described clean room 1 or clean room 2 or the like.

This is a semiconductor manufacturing device 201 of the (Interface) type, which uses a material that does not emit chemical pollution.

The semiconductor manufacturing apparatus 201 shown in FIG. 3 constitutes, for example, a chemical vapor deposition apparatus, and has a casing 300 having a predetermined shape serving as an apparatus main body. A processing area 33 extends from the center of the housing 300 to the right side. Below the machining area 33, control units 37A and 37B, which are equipment components, are provided. An insulated wire 38 is connected to the control unit 37A, and an insulated wire 38 is also connected between the control units 37A and 37B to supply power and the like. . For the covered electric wire 38, an electric wire coated with a polyolefin-based material and / or a Teflon (trademark) -based material is used. A transparent resin panel 39 is attached to the front surface of the housing 300 so that the inside can be observed. For the transparent resin panel 39, a polyethylene terephthalate (PET) plate or a polycarbonate (PC) plate is used. At this time, a low siloxane-evaporating sealant with reduced siloxane volatilization is used to seal the plate material.

The SMIF interface 30 is provided on the left side of the housing 300 so that the wafer cassette 31 can be inserted and removed. A plurality of semiconductor wafers 3OA are set in the wafer cassette 31. A wafer transfer path 301 is provided between the interface 30 and the processing area 33, and the wafer cassette 31 is transferred. An example For example, it moves in the apparatus as indicated by an arrow 32 and is guided to a processing area 33. The wafer force set 31 uses a material that does not emit chemical contamination.

This semiconductor wafer sealed container maintains a certain degree of airtightness during transportation between devices and during storage. Through SMIF's dedicated mounting port, cassettes and semiconductor wafers are sealed in the SMIF. In the container (FOUP; Front Opening Unified Pod), only the semiconductor wafer 30A is taken in. When the semiconductor wafer 3OA is fed into the processing area 33 or taken out from the semiconductor manufacturing apparatus 201, the semiconductor hermetic container and the dedicated mounting port are made to maintain a certain airtightness.

A chemical filter 35 and a fan 34 are attached to the ceiling of the wafer transfer path 301, and in the process of transferring the wafer cassette 31 or the semiconductor wafer 3OA taken out of the wafer cassette 31, The air sent from the fan 34 is supplied to the exposed portion of the semiconductor wafer 3OA through the chemical filter 35. This is because the exposed semiconductor wafer 3OA was not affected by chemical contaminants. For the chemical filter 35, a filter material with a low amount of boron used and a low-organic material-dispersing screen material are used to seal the filter material. As described above, according to the semiconductor manufacturing apparatus 201 as the first embodiment of the present invention, a chemical vapor deposition apparatus or the like using a material that does not emit chemical contamination is disposed. Emission of chemical contaminants within the temperature range can be eliminated. Therefore, it is possible to maintain a clean and pure atmosphere in the clean room 1 純粋 clean room 2 etc., compared to the case where semiconductor devices are manufactured using a chemical vapor deposition apparatus using materials that emit chemical pollution. As a result, it is possible to reduce the occurrence of defects, quality deterioration, reliability deterioration, and reduction in the operation rate of the production line due to the contamination of the chemical contaminants.

[Second embodiment]

In this embodiment, an exposure apparatus 202 as an example of the semiconductor manufacturing apparatus 20 installed in the above-described clean room 1 ゃ clean room 2 uses a material that does not emit chemical contamination.

The exposure apparatus 202 shown in FIG. 4 has a casing 60 having a predetermined shape. Inside housing 60 The central area is an exposure area 40, and an optical unit 45 is provided in the exposure area 40 so as to expose a semiconductor wafer 3OA with a transistor circuit, a wiring pattern, and the like. Below the optical unit 45, a wafer mounting table 53 is provided. An air conditioner 48 is provided on the right side of the housing 60, and a fan 41 is mounted inside the air conditioner 48.

An exposure area ceiling chamber 49 is provided at the ceiling of the exposure area 40, and a ULPA filter 43 is attached to the exposure area ceiling chamber 49. A chemical filter 42 is provided between the upper part of the air conditioner 48 and the exposure area ceiling chamber 49 to clean the circulating air. For the chemical filter 42 and the ULPA filter 43, a filter material having a low boron content and a low-organic-emission sealing material are used to seal the filter material. Materials that do not emit chemical contamination are used. A gallery 54 is provided below the air conditioner 48 so that air is taken in from the exposure area 40 into the air conditioner 48. The gallery 54 is made of louver-shaped material that does not emit chemical pollution. A control unit 46 is provided on the back of the air conditioner 48 described above. The control unit 46 is connected to a covered electric wire 47 to supply power and the like. As the coated electric wire 47, an electric wire coated with a polyolefin or Z and Teflon (trademark) material is used.

In this exposure apparatus 202, in the process of exposing the semiconductor wafer 3 OA by the optical unit 45, air sent from the fan 41 of the air conditioner 48 is passed through the chemical filter 42 and the ULPA filter 43 to expose the exposure area 4. Feed to 0 and circulate. This is to prevent contamination of the optical unit 45 with chemical contaminants.

As described above, according to the exposure apparatus 202 as the second embodiment of the present invention, the housing 60, the gallery 54, and the like are configured by using a material that does not emit chemical contamination. When air is circulated by the air conditioner 48, emission of chemical contaminants in the housing 60 can be eliminated. Therefore, the interior of the clean room 1 or the clean room 2 can be maintained in a clean and pure atmosphere, and the chemical contamination can be reduced as compared with the case where the semiconductor wafer 3 OA is exposed by an exposure apparatus using a material which emits chemical contamination. Less occurrence of defects due to material contamination, lower quality, lower reliability, and less reduction in production line availability can do.

[Third embodiment]

In this embodiment, when configuring the third semiconductor manufacturing system, components that may emit chemical contaminants are surrounded by an enclosure, the enclosure is provided with an exhaust port, and an appropriate exhaust means is provided in the exhaust port. It is connected so that the air inside the enclosure can be discharged out of the manufacturing equipment. In other words, in the third semiconductor manufacturing system, a semiconductor device is manufactured using the semiconductor manufacturing device 203 in the clean room 1 or the tallen room 2 or the like, and a part of the semiconductor manufacturing device 203 is used. Alternatively, the method includes a step of covering the entire structure with an enclosure, and a step of exhausting chemical contaminants in the enclosure to the outside of the clean room 1 or the tallinn room 2 (second semiconductor manufacturing method).

The semiconductor manufacturing apparatus 203 shown in FIG. 5 is a chemical vapor growth apparatus as described in the first embodiment, and control units 37A and 37B are attached to the main body of the apparatus. The control units 37A and 37B are provided so as to cover the whole with a sealed panel case 50 as an example of an enclosure. The sealed panel case 50 has a duct 51 and its duct 51 The exhaust means 52 is attached at the end of. A duct 51 leading to the outside of the clean room 1 例えば clean room 2, for example, is connected to the sealed panel case 50, and an exhaust means 52 such as a fan is attached to the middle or end of the duct 51 for control. Units 37 A and 37 B are exposed to chemical contaminants outside Clean Room 1 and Clean Nome 2.

In this example, the chemical contaminants include at least one of the ionic component, organic matter, and inorganic matter. The ion component F- groups, C group, N 0 ₃ - group, SO - group, P 0 ₄ ³ - group, wherein at least one of NH ₄ + group, organic matter Jipuchiru phthalate (DBP), phthalate It contains at least one of dioctyl acid (DOP), getyl phthalate (DEP), siloxane, dibutylhydroxytoluene (BHT), adipic acid ester, ester phosphate, and organic amine, and inorganic substances are phosphorus (P), It contains at least one of boron (B).

The sealed panel case (a point of interest) 50 does not need to be a part of the semiconductor manufacturing apparatus 203 as in the control units 37 A and 37 B, but the entire semiconductor manufacturing apparatus. Alternatively, the entire interior may be exhausted by surrounding the space. Exhaust is intended to prevent chemical pollutants emitted from the equipment components from being emitted into the clean room air. As a result, the exhaust destination does not necessarily need to be outside the clean room 1 or clean room 2, etc., so that the exhaust gas is passed through a suitable chemical filter to remove chemical pollutants and returned to the clean room. It does not matter.

As described above, according to the semiconductor manufacturing apparatus 203 as the third embodiment of the present invention, a material capable of emitting chemical contamination is used for a part of the main unit or the entire control units 37A and 37B. Even if it is unavoidable to use, the closed panel case 50 is attached to the part of the main unit to cover the entire control units 37A and 37B, so that the chemical contaminants in the closed panel case 50 can be removed. By means of the exhaust means 52, the air can be exhausted to the place where the filter is installed outside the clean room or in the tallen room.

Therefore, the interior of the tallen room 1 and the tallen room 2 can be maintained in a pure and pure atmosphere. As a result, chemical contaminants that emanate from the semiconductor manufacturing equipment 203 into the clean room air are reduced, and the occurrence of defects due to chemical contaminants, lower quality, lower reliability, and lower production line operation rates are reduced. be able to. Moreover, the manufacturing cost of the semiconductor device can be reduced. Industrial applicability

INDUSTRIAL APPLICABILITY The present invention is very suitable when applied to the manufacture of a liquid crystal display device in a clean room, a semiconductor integrated circuit device, and the like.

Claims

The scope of the claims

1. A clean room for manufacturing semiconductor devices;

A semiconductor manufacturing apparatus using a material that does not emit chemical contamination,

A semiconductor manufacturing system, wherein the semiconductor manufacturing apparatus is installed in the clean room.

2. The semiconductor manufacturing system according to claim 1, wherein the tallen room is constructed using a material that does not emit chemical pollution.

3. The semiconductor manufacturing equipment consists of housing, covered electric wire, sealing material, resin panel, resin sheet, band heater, paint, air conditioning filter, heat insulating material, adhesive, printed circuit board, printed circuit board resist, adhesive 2. The semiconductor manufacturing system according to claim 1, wherein the semiconductor manufacturing system has at least one of a tape and a pipe, or a main unit or a combination of a Z and a device, in which these are combined.

4. an enclosure covering a part or all of the semiconductor manufacturing apparatus;

The semiconductor manufacturing system according to claim 1, further comprising: an exhaust unit configured to exhaust the inside of the enclosure.

5. The semiconductor manufacturing apparatus includes:

Exposure equipment, coating equipment, developing equipment, cleaning equipment, measuring equipment, chemical vapor deposition equipment, plasma film forming equipment, diffusion equipment, etching equipment, plating equipment, wrapping equipment, assing equipment, ion implantation equipment, CMP equipment, 2. The semiconductor manufacturing system according to claim 1, wherein at least one of the transfer device and the storage device is configured.

6. An apparatus for manufacturing a semiconductor device,

The device body, And Z and an apparatus component connected to the apparatus main body.

A semiconductor manufacturing apparatus, wherein a material that does not emit chemical contamination is used for the apparatus main body or Z and the equipment parts.

7. The device body or / and device parts are

Cases, covered electric wires, sealing materials, resin panels, resin sheets, band heaters, paints, air-conditioning filters, heat insulating materials, adhesives, printed circuit boards, resists for printed circuit boards using the above-mentioned materials that do not emit chemical contamination 7. The semiconductor manufacturing apparatus according to claim 6, wherein the apparatus includes at least one of: an adhesive tape; and a pipe.

8. The semiconductor manufacturing apparatus according to claim 6, wherein a material such as polyolefin, Teflon (trademark), polyethylene terephthalate, or z and polycarbonate is used as the material that does not emit chemical contamination. .

9. A covered electric wire is used for the main unit and / or device parts,

7. The semiconductor manufacturing apparatus according to claim 6, wherein the covered electric wire is an electric wire covered with a polyolefin-based material or a material based on Z and Teflon (trademark).

10. A filter is used for the main unit or / and the parts of the main unit,

7. The semiconductor device according to claim 6, wherein a low-boron filter material and a low-organic-emission sealing material for sealing the filter material are used for the filter.

1 1. A transparent resin panel is used for the main unit and / or device parts,

7. The semiconductor manufacturing apparatus according to claim 6, wherein a plate material of polyethylene terephthalate or polycarbonate is used for the transparent resin panel.

12. The semiconductor manufacturing apparatus according to claim 11, wherein a sealant having low siloxane volatility is used for sealing the plate material.

1 3. A drive unit is used for the main unit and / or device parts,

7. The semiconductor manufacturing apparatus according to claim 6, wherein a hermetic motor is used for the driving section, and the motor is used after being sufficiently aged.

14. The semiconductor manufacturing apparatus according to claim 6, further comprising: an enclosure covering part or all of the main body device and / or the device components; and an exhaust unit configured to exhaust the enclosure.

1 5. An apparatus for manufacturing a semiconductor device,

The device body,

The apparatus includes: Z attached to the apparatus main body or an apparatus component connected to the apparatus main body; an enclosure covering part or all of the main apparatus, the Z, and the apparatus component; and an exhaust unit that exhausts the enclosure. A semiconductor manufacturing apparatus characterized by the above-mentioned.

16. The main unit and / or device parts are:

Exposure equipment, coating equipment, developing equipment, cleaning equipment, measuring equipment, chemical vapor deposition equipment, physical vapor deposition equipment, diffusion furnace equipment, etching equipment, plating equipment, wrapping equipment, asshing equipment, ion implantation equipment, chemical machinery 16. The semiconductor manufacturing device according to claim 15, wherein at least one of a mechanical polishing device, a transport device, and a storage device is configured.

7. A step of manufacturing a semiconductor manufacturing apparatus using a material that does not emit contamination in advance, and a step of installing the semiconductor manufacturing apparatus in a clean room.

Manufacturing a semiconductor device using the semiconductor manufacturing apparatus in the clean room A semiconductor manufacturing method characterized by the above-mentioned.

18. The semiconductor manufacturing method according to claim 17, wherein the clean room is constructed using a material that does not emit chemical pollution.

19. The semiconductor according to claim 17, wherein the material that does not emit chemical contamination is a polyolefin-based, Teflon (trademark) -based, polyethylene terephthalate-based or polycarbonate-based material. Production method.

20. a step of covering part or all of the semiconductor manufacturing apparatus with an enclosure;

18. The method according to claim 17, further comprising the step of exhausting the inside of the enclosure.

2 1. The semiconductor manufacturing equipment

Exposure equipment, coating equipment, developing equipment, cleaning equipment, measuring equipment, chemical vapor deposition equipment, physical vapor deposition equipment, diffusion furnace equipment, etching equipment, plating equipment, wrapping equipment, asshing equipment, ion implantation equipment, chemical machinery 18. The semiconductor manufacturing method according to claim 17, wherein at least one of a mechanical polishing device, a transport device, and a storage device is configured.

2 2. A method of manufacturing a semiconductor device using a semiconductor manufacturing device in a taleen room,

A step of covering a part or all of the semiconductor manufacturing apparatus with an enclosure;

Exhausting the chemical contaminants in the enclosure out of the clean room. ,

2 3. The chemical contaminants are:

Characterized by containing at least one of ionic components, organic substances and inorganic substances The method for manufacturing a semiconductor according to claim 22.

24. The ionic component is

Including at least one of F, C 1—, N O, S O—, P O, and NH;

The organic matter is

Containing at least one of dibutyl phthalate, dioctyl phthalate, getyl phthalate, siloxane, dibutylhydroxytoluene, adipic acid ester, phosphate ester, and organic amine;

The inorganic substance is

23. The semiconductor manufacturing method according to claim 23, comprising at least one of phosphorus and boron.

25. The semiconductor manufacturing equipment

Exposure equipment, coating equipment, developing equipment, cleaning equipment, measuring equipment, chemical vapor deposition equipment, physical vapor deposition equipment, diffusion furnace equipment, etching equipment, plating equipment, wrapping equipment, asshing equipment, ion implantation equipment, chemical machinery 23. The semiconductor manufacturing method according to claim 22, wherein at least one of a mechanical polishing device, a transport device, and a storage device is configured.

2 6. The semiconductor substrate,

Comprising an electronic circuit element formed on the semiconductor substrate,

A semiconductor device, wherein the semiconductor substrate and the Z or electronic circuit element are manufactured by a semiconductor manufacturing apparatus manufactured using a material that does not emit chemical contamination.

27. The semiconductor manufacturing equipment is installed in a clean room,

27. The semiconductor according to claim 26, wherein the semiconductor substrate and Z or an electronic circuit element are manufactured using the semiconductor manufacturing apparatus in the clean room.

2 8. The semiconductor manufacturing apparatus is an apparatus for manufacturing a liquid crystal display device,

27. The semiconductor device according to claim 26, wherein said electronic circuit element is a liquid crystal display element.