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WO2003010575A1 - Dispositif optique et procede de fabrication - Google Patents

Dispositif optique et procede de fabrication Download PDF

Info

Publication number
WO2003010575A1
WO2003010575A1 PCT/JP2002/007673 JP0207673W WO03010575A1 WO 2003010575 A1 WO2003010575 A1 WO 2003010575A1 JP 0207673 W JP0207673 W JP 0207673W WO 03010575 A1 WO03010575 A1 WO 03010575A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer body
substrate
cut
optical waveguide
optical device
Prior art date
Application number
PCT/JP2002/007673
Other languages
English (en)
Japanese (ja)
Inventor
Tooru Takahashi
Hiroaki Kikuchi
Sigeyuki Yagi
Nobuo Miyadera
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to JP2003515890A priority Critical patent/JP4151073B2/ja
Publication of WO2003010575A1 publication Critical patent/WO2003010575A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un dispositif optique à entaille oblique de haute précision réalisée dans sa structure. Le dispositif comporte un substrat (1) et un corps multicouches (10) sur ce substrat (1), ainsi qu'un guide d'ondes optique (4). Au moins le guide d'ondes (4) est en résine. Le corps multicouches (10) présente une entaille (27) traversant le guide d'ondes (4), qui est oblique par rapport à la direction normale du substrat (1). On entaille le corps (10) au moyen d'un outil tranchant discoïde qui dépose des grains abrasifs.
PCT/JP2002/007673 2001-07-27 2002-07-29 Dispositif optique et procede de fabrication WO2003010575A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003515890A JP4151073B2 (ja) 2001-07-27 2002-07-29 光学素子およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001227539 2001-07-27
JP2001-227539 2001-07-27

Publications (1)

Publication Number Publication Date
WO2003010575A1 true WO2003010575A1 (fr) 2003-02-06

Family

ID=19060185

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007673 WO2003010575A1 (fr) 2001-07-27 2002-07-29 Dispositif optique et procede de fabrication

Country Status (2)

Country Link
JP (1) JP4151073B2 (fr)
WO (1) WO2003010575A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10300961A (ja) * 1996-07-31 1998-11-13 Nippon Telegr & Teleph Corp <Ntt> 光路変換素子と、その作製方法、および光路変換素子作製用のブレード
JPH11149019A (ja) * 1997-06-25 1999-06-02 Matsushita Electric Ind Co Ltd 光送受信装置及びその製造方法並びに光半導体モジュール
JP2000241642A (ja) * 1999-02-17 2000-09-08 Sumitomo Electric Ind Ltd 光送受信モジュール
JP2001013339A (ja) * 1999-06-28 2001-01-19 Nec Corp 光パワー監視器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE513849C2 (sv) * 1998-03-06 2000-11-13 Ericsson Telefon Ab L M Förfarande för att förbinda en ljusalstrande eller - mottagande elektrooptisk eller optoelektrisk anordning med en optisk vågledare
JPH11337758A (ja) * 1998-05-29 1999-12-10 Nippon Telegr & Teleph Corp <Ntt> 光導波路部品
JP2000347050A (ja) * 1999-06-03 2000-12-15 Nhk Spring Co Ltd 光送受信モジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10300961A (ja) * 1996-07-31 1998-11-13 Nippon Telegr & Teleph Corp <Ntt> 光路変換素子と、その作製方法、および光路変換素子作製用のブレード
JPH11149019A (ja) * 1997-06-25 1999-06-02 Matsushita Electric Ind Co Ltd 光送受信装置及びその製造方法並びに光半導体モジュール
JP2000241642A (ja) * 1999-02-17 2000-09-08 Sumitomo Electric Ind Ltd 光送受信モジュール
JP2001013339A (ja) * 1999-06-28 2001-01-19 Nec Corp 光パワー監視器

Also Published As

Publication number Publication date
JP4151073B2 (ja) 2008-09-17
JPWO2003010575A1 (ja) 2004-11-18

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