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WO2003010575A1 - Optical device and its manufacturing method - Google Patents

Optical device and its manufacturing method Download PDF

Info

Publication number
WO2003010575A1
WO2003010575A1 PCT/JP2002/007673 JP0207673W WO03010575A1 WO 2003010575 A1 WO2003010575 A1 WO 2003010575A1 JP 0207673 W JP0207673 W JP 0207673W WO 03010575 A1 WO03010575 A1 WO 03010575A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer body
substrate
cut
optical waveguide
optical device
Prior art date
Application number
PCT/JP2002/007673
Other languages
French (fr)
Japanese (ja)
Inventor
Tooru Takahashi
Hiroaki Kikuchi
Sigeyuki Yagi
Nobuo Miyadera
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to JP2003515890A priority Critical patent/JP4151073B2/en
Publication of WO2003010575A1 publication Critical patent/WO2003010575A1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

An optical device with a high-precision oblique cut in a device. This device has a substrate (1) and a multilayer body (10) disposed on the substrate (1) and comprising an optical waveguide (4). At least the optical waveguide (4) of the multilayer body (10) is made of a resin. The multilayer body (10) has such a cut (27) as to cross the optical waveguide (4). The cut (27), oblique relative to the normal direction of the substrate (1), is formed by cutting the multilayer body (10) with a discoidal cutting tool with the deposit of abrasive grains.
PCT/JP2002/007673 2001-07-27 2002-07-29 Optical device and its manufacturing method WO2003010575A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003515890A JP4151073B2 (en) 2001-07-27 2002-07-29 Optical element and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-227539 2001-07-27
JP2001227539 2001-07-27

Publications (1)

Publication Number Publication Date
WO2003010575A1 true WO2003010575A1 (en) 2003-02-06

Family

ID=19060185

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007673 WO2003010575A1 (en) 2001-07-27 2002-07-29 Optical device and its manufacturing method

Country Status (2)

Country Link
JP (1) JP4151073B2 (en)
WO (1) WO2003010575A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10300961A (en) * 1996-07-31 1998-11-13 Nippon Telegr & Teleph Corp <Ntt> Optical path changing element, manufacture thereof and blade for manufacturing the optical path changing element
JPH11149019A (en) * 1997-06-25 1999-06-02 Matsushita Electric Ind Co Ltd Optical transmitting and receiving device and its manufacturing method, and optical semiconductor module
JP2000241642A (en) * 1999-02-17 2000-09-08 Sumitomo Electric Ind Ltd Optical transceiver module
JP2001013339A (en) * 1999-06-28 2001-01-19 Nec Corp Optical power monitor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE513849C2 (en) * 1998-03-06 2000-11-13 Ericsson Telefon Ab L M Method of connecting a light emitting or receiving electro-optic or optoelectric device to an optical waveguide
JPH11337758A (en) * 1998-05-29 1999-12-10 Nippon Telegr & Teleph Corp <Ntt> Optical waveguide components
JP2000347050A (en) * 1999-06-03 2000-12-15 Nhk Spring Co Ltd Optical transceiver module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10300961A (en) * 1996-07-31 1998-11-13 Nippon Telegr & Teleph Corp <Ntt> Optical path changing element, manufacture thereof and blade for manufacturing the optical path changing element
JPH11149019A (en) * 1997-06-25 1999-06-02 Matsushita Electric Ind Co Ltd Optical transmitting and receiving device and its manufacturing method, and optical semiconductor module
JP2000241642A (en) * 1999-02-17 2000-09-08 Sumitomo Electric Ind Ltd Optical transceiver module
JP2001013339A (en) * 1999-06-28 2001-01-19 Nec Corp Optical power monitor

Also Published As

Publication number Publication date
JPWO2003010575A1 (en) 2004-11-18
JP4151073B2 (en) 2008-09-17

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