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WO2002003420A3 - Integrated circuit radio architectures - Google Patents

Integrated circuit radio architectures Download PDF

Info

Publication number
WO2002003420A3
WO2002003420A3 PCT/US2001/016730 US0116730W WO0203420A3 WO 2002003420 A3 WO2002003420 A3 WO 2002003420A3 US 0116730 W US0116730 W US 0116730W WO 0203420 A3 WO0203420 A3 WO 0203420A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
circuits
fabricated
silicon substrate
circuit radio
Prior art date
Application number
PCT/US2001/016730
Other languages
French (fr)
Other versions
WO2002003420A2 (en
Inventor
Thomas A Freeburg
Gary W Grube
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to AU2001263398A priority Critical patent/AU2001263398A1/en
Publication of WO2002003420A2 publication Critical patent/WO2002003420A2/en
Publication of WO2002003420A3 publication Critical patent/WO2002003420A3/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/08Manufacture or treatment characterised by using material-based technologies using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Recrystallisation Techniques (AREA)
  • Semiconductor Memories (AREA)

Abstract

Two-way radio semiconductor structures and methods for making such structures are provided. The integrated structure includes a single monolithic integrated circuit (401) on which processing circuitry, such as a CPU (420) and a DSP (418), is fabricated within a silicon substrate structure. Through appropriate use of an intervening layer, compound semiconductor material, such as GaAs, can be layered atop the silicon substrate. That compound material can then be utilized for the RF circuits in the radio. Thus, the RF circuits and the processing circuits may be fabricated on a single IC, thereby reducing power and size requirements of the assembled device.
PCT/US2001/016730 2000-06-30 2001-05-21 Integrated circuit radio architectures WO2002003420A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001263398A AU2001263398A1 (en) 2000-06-30 2001-05-21 Integrated circuit radio architectures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60723900A 2000-06-30 2000-06-30
US09/607,239 2000-06-30

Publications (2)

Publication Number Publication Date
WO2002003420A2 WO2002003420A2 (en) 2002-01-10
WO2002003420A3 true WO2002003420A3 (en) 2002-06-06

Family

ID=24431410

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/016730 WO2002003420A2 (en) 2000-06-30 2001-05-21 Integrated circuit radio architectures

Country Status (2)

Country Link
AU (1) AU2001263398A1 (en)
WO (1) WO2002003420A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11158575B2 (en) * 2018-06-05 2021-10-26 Macom Technology Solutions Holdings, Inc. Parasitic capacitance reduction in GaN-on-silicon devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5596205A (en) * 1993-07-12 1997-01-21 Peregrine Semiconductor Corporation High-frequency wireless communication system on a single ultrathin silicon on sapphire chip

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5596205A (en) * 1993-07-12 1997-01-21 Peregrine Semiconductor Corporation High-frequency wireless communication system on a single ultrathin silicon on sapphire chip

Also Published As

Publication number Publication date
WO2002003420A2 (en) 2002-01-10
AU2001263398A1 (en) 2002-01-14

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