+

WO2002060810A3 - Interconnexion de substrats a micro-elements - Google Patents

Interconnexion de substrats a micro-elements Download PDF

Info

Publication number
WO2002060810A3
WO2002060810A3 PCT/GB2002/000399 GB0200399W WO02060810A3 WO 2002060810 A3 WO2002060810 A3 WO 2002060810A3 GB 0200399 W GB0200399 W GB 0200399W WO 02060810 A3 WO02060810 A3 WO 02060810A3
Authority
WO
WIPO (PCT)
Prior art keywords
micro
substrates
element substrate
pillars
substrate interconnection
Prior art date
Application number
PCT/GB2002/000399
Other languages
English (en)
Other versions
WO2002060810A2 (fr
Inventor
Peter A Ivey
Nicholas L Seed
Gavin L Williams
David Barrow
Kostas Bouris
Original Assignee
Univ Sheffield
Univ Cardiff
Peter A Ivey
Nicholas L Seed
Gavin L Williams
David Barrow
Kostas Bouris
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Sheffield, Univ Cardiff, Peter A Ivey, Nicholas L Seed, Gavin L Williams, David Barrow, Kostas Bouris filed Critical Univ Sheffield
Priority to AU2002228179A priority Critical patent/AU2002228179A1/en
Publication of WO2002060810A2 publication Critical patent/WO2002060810A2/fr
Publication of WO2002060810A3 publication Critical patent/WO2002060810A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention concerne un boîtier de micro-éléments présentant un substrat inférieur dans lequel une puce à micro-éléments peut être incorporée, par exemple un micro-capteur fluidique ou un composant micro-électronique, un substrat supérieur et un joint entre ces substrats. Ce boîtier est caractérisé en ce qu'un desdits substrats comprend au moins deux colonnettes saillantes et que l'autre substrat présente un certain nombre d'évidements correspondant au nombre de colonnettes, substrat dans lequel lesdites colonnettes peuvent être positionnées de manière à maintenir ensemble les deux substrats de manière libérable. DRAWING: 0 YES 0 NO 1 NOTHING TO TRANSLATE
PCT/GB2002/000399 2001-01-30 2002-01-30 Interconnexion de substrats a micro-elements WO2002060810A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002228179A AU2002228179A1 (en) 2001-01-30 2002-01-30 Micro-element substrate interconnection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0102326A GB2371674A (en) 2001-01-30 2001-01-30 Micro-element package
GB0102326.6 2001-01-30

Publications (2)

Publication Number Publication Date
WO2002060810A2 WO2002060810A2 (fr) 2002-08-08
WO2002060810A3 true WO2002060810A3 (fr) 2003-09-04

Family

ID=9907770

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/000399 WO2002060810A2 (fr) 2001-01-30 2002-01-30 Interconnexion de substrats a micro-elements

Country Status (3)

Country Link
AU (1) AU2002228179A1 (fr)
GB (1) GB2371674A (fr)
WO (1) WO2002060810A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2395196B (en) 2002-11-14 2006-12-27 Univ Cardiff Microfluidic device and methods for construction and application
WO2005001933A2 (fr) * 2003-06-28 2005-01-06 Infineon Technologies Ag Composant a semi-conducteur a puces multiples et procede de realisation
NL1024486C2 (nl) * 2003-10-08 2005-04-11 Lionix B V Werkwijze en koppelingselement voor het koppelen van onderdelen alsmede inrichting omvattende zo een koppelingselement.
JP4148201B2 (ja) * 2004-08-11 2008-09-10 ソニー株式会社 電子回路装置
WO2007072379A2 (fr) 2005-12-22 2007-06-28 Koninklijke Philips Electronics N.V. Dispositif electronique, piece de boitier et procede de fabrication d'une piece de boitier
US10197465B2 (en) 2017-01-12 2019-02-05 Honeywell International Inc. O-ring internal seal for pressure sensor
US20250085182A1 (en) * 2023-09-11 2025-03-13 Nxp Usa, Inc. Low stress packaging for environmental sensors

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1443028A (en) * 1972-11-02 1976-07-21 Philips Electronic Associated Microminiaturized electrical compoennts
GB2167228A (en) * 1984-10-11 1986-05-21 Sinclair Res Ltd Integrated circuit package
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5668408A (en) * 1996-04-12 1997-09-16 Hewlett-Packard Company Pin grid array solution for microwave multi-chip modules
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US6028351A (en) * 1996-10-09 2000-02-22 Texas Instruments Incorporated Gasket sealed integrated circuit package
US6065864A (en) * 1997-01-24 2000-05-23 The Regents Of The University Of California Apparatus and method for planar laminar mixing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2094005B (en) * 1981-02-03 1985-05-30 Coal Industry Patents Ltd Electrochemical gas sensor
DE19964218C2 (de) * 1999-10-08 2003-04-10 Hahn Schickard Ges Elektromechanisches Bauelement mit einem Polymerkörper und Verfahren zur Herstellung desselben

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1443028A (en) * 1972-11-02 1976-07-21 Philips Electronic Associated Microminiaturized electrical compoennts
GB2167228A (en) * 1984-10-11 1986-05-21 Sinclair Res Ltd Integrated circuit package
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5668408A (en) * 1996-04-12 1997-09-16 Hewlett-Packard Company Pin grid array solution for microwave multi-chip modules
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US6028351A (en) * 1996-10-09 2000-02-22 Texas Instruments Incorporated Gasket sealed integrated circuit package
US6065864A (en) * 1997-01-24 2000-05-23 The Regents Of The University Of California Apparatus and method for planar laminar mixing

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
COLLINS S D ET AL: "MicroJoinery: Concept, definition, and application to microsystem development", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 66, no. 1-3, 1 April 1998 (1998-04-01), pages 315 - 332, XP004144009, ISSN: 0924-4247 *
TZE-JUNG YAO ET AL: "Micromachined rubber O-ring micro-fluidic couplers", PROCEEDINGS IEEE XIII CONFERENCE ON MEMS, 23 January 2000 (2000-01-23) - 27 January 2000 (2000-01-27), Miyazaki,Japan, pages 624 - 627, XP010377200 *

Also Published As

Publication number Publication date
WO2002060810A2 (fr) 2002-08-08
GB0102326D0 (en) 2001-03-14
GB2371674A (en) 2002-07-31
AU2002228179A1 (en) 2002-08-12

Similar Documents

Publication Publication Date Title
WO2002041398A3 (fr) Boitiers micro-electronique et procedes d'encapsulation dans lesquels des seconds substrats micro-electroniques sont orientes par rapport a des premiers substrats micro-electroniques pour former un angle aigu
WO2007050287A3 (fr) Structure a semi-conducteurs et procede de montage
TW516141B (en) Semiconductor device
TW200613123A (en) Transparent member, optical device using transparent member and method of manufacturing optical device
WO2007109492A3 (fr) Empilement pop de semi-conducteurs de faible epaisseur
TW571144B (en) Substrate assembling apparatus
TW200608540A (en) Stacked packaging methods and structures
TW200735291A (en) Semiconductor package featuring metal lid member
WO2009142391A3 (fr) Boîtier de composant luminescent et son procédé de fabrication
EP1515364A3 (fr) Boîtier de dispositif et leurs procédés de fabrication et de test
WO2004012862A3 (fr) Modele de micropuce integree
WO2008019277A3 (fr) Procédé de collage de substrat avec aérations intégrées
TW200614900A (en) A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
EP1783498A3 (fr) Bloc de capteurs
TW200735293A (en) Semiconductor device, substrate and manufacturing method thereof
WO2006023894A3 (fr) Composants pour le traitement de semi-conducteurs et traitement de semi-conducteurs dans lequel sont utilises ces composants
DE602004026112D1 (de) Prozess zum Kapseln von Komponenten und gekapselte Komponenten
TW200717738A (en) MEMS package and method of forming the same
WO2002060810A3 (fr) Interconnexion de substrats a micro-elements
WO2003019643A1 (fr) Dispositif semi-conducteur comportant un film isolant presentant une permittivite elevee et son procede de production
WO2005097506A3 (fr) Details dans des substrats et leurs procedes de formation
TW200513452A (en) Junction substrate and method of joining substrates together
TW200721514A (en) Flip chip package and manufacturing method of the same
WO2004075294A3 (fr) Procede de conditionnement de composant retourne et composant retourne
TW532567U (en) Flip chip package substrate and flip chip

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载