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WO2002060810A3 - Micro-element substrate interconnection - Google Patents

Micro-element substrate interconnection Download PDF

Info

Publication number
WO2002060810A3
WO2002060810A3 PCT/GB2002/000399 GB0200399W WO02060810A3 WO 2002060810 A3 WO2002060810 A3 WO 2002060810A3 GB 0200399 W GB0200399 W GB 0200399W WO 02060810 A3 WO02060810 A3 WO 02060810A3
Authority
WO
WIPO (PCT)
Prior art keywords
micro
substrates
element substrate
pillars
substrate interconnection
Prior art date
Application number
PCT/GB2002/000399
Other languages
French (fr)
Other versions
WO2002060810A2 (en
Inventor
Peter A Ivey
Nicholas L Seed
Gavin L Williams
David Barrow
Kostas Bouris
Original Assignee
Univ Sheffield
Univ Cardiff
Peter A Ivey
Nicholas L Seed
Gavin L Williams
David Barrow
Kostas Bouris
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Sheffield, Univ Cardiff, Peter A Ivey, Nicholas L Seed, Gavin L Williams, David Barrow, Kostas Bouris filed Critical Univ Sheffield
Priority to AU2002228179A priority Critical patent/AU2002228179A1/en
Publication of WO2002060810A2 publication Critical patent/WO2002060810A2/en
Publication of WO2002060810A3 publication Critical patent/WO2002060810A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)

Abstract

Micro-element package comprising a lower substrate in which can be embedded a micro-element chip, for example a fluidic micro-sensor or a micro-electronic component, an upper substrate and a gasket intermediate the substrates characterised in that one of said substrates includes two or more protruding pillars and the other of said substrates includes a number of recesses corresponding to the number of pillars and into which said pillars can locate so as to releasably hold said substrates together.
PCT/GB2002/000399 2001-01-30 2002-01-30 Micro-element substrate interconnection WO2002060810A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002228179A AU2002228179A1 (en) 2001-01-30 2002-01-30 Micro-element substrate interconnection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0102326A GB2371674A (en) 2001-01-30 2001-01-30 Micro-element package
GB0102326.6 2001-01-30

Publications (2)

Publication Number Publication Date
WO2002060810A2 WO2002060810A2 (en) 2002-08-08
WO2002060810A3 true WO2002060810A3 (en) 2003-09-04

Family

ID=9907770

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/000399 WO2002060810A2 (en) 2001-01-30 2002-01-30 Micro-element substrate interconnection

Country Status (3)

Country Link
AU (1) AU2002228179A1 (en)
GB (1) GB2371674A (en)
WO (1) WO2002060810A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2395196B (en) 2002-11-14 2006-12-27 Univ Cardiff Microfluidic device and methods for construction and application
WO2005001933A2 (en) * 2003-06-28 2005-01-06 Infineon Technologies Ag Multichip semi-conductor component and method for the production thereof
NL1024486C2 (en) * 2003-10-08 2005-04-11 Lionix B V Coupling a component of a module to a component of a motherboard comprises using rigid coupling elements with passages for the exchange of signals between the two components
JP4148201B2 (en) * 2004-08-11 2008-09-10 ソニー株式会社 Electronic circuit equipment
WO2007072379A2 (en) 2005-12-22 2007-06-28 Koninklijke Philips Electronics N.V. An electronic device, a housing part, and a method of manufacturing a housing part
US10197465B2 (en) 2017-01-12 2019-02-05 Honeywell International Inc. O-ring internal seal for pressure sensor
US20250085182A1 (en) * 2023-09-11 2025-03-13 Nxp Usa, Inc. Low stress packaging for environmental sensors

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1443028A (en) * 1972-11-02 1976-07-21 Philips Electronic Associated Microminiaturized electrical compoennts
GB2167228A (en) * 1984-10-11 1986-05-21 Sinclair Res Ltd Integrated circuit package
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5668408A (en) * 1996-04-12 1997-09-16 Hewlett-Packard Company Pin grid array solution for microwave multi-chip modules
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US6028351A (en) * 1996-10-09 2000-02-22 Texas Instruments Incorporated Gasket sealed integrated circuit package
US6065864A (en) * 1997-01-24 2000-05-23 The Regents Of The University Of California Apparatus and method for planar laminar mixing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2094005B (en) * 1981-02-03 1985-05-30 Coal Industry Patents Ltd Electrochemical gas sensor
DE19964218C2 (en) * 1999-10-08 2003-04-10 Hahn Schickard Ges Electromechanical component with a polymer body and method for producing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1443028A (en) * 1972-11-02 1976-07-21 Philips Electronic Associated Microminiaturized electrical compoennts
GB2167228A (en) * 1984-10-11 1986-05-21 Sinclair Res Ltd Integrated circuit package
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5668408A (en) * 1996-04-12 1997-09-16 Hewlett-Packard Company Pin grid array solution for microwave multi-chip modules
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US6028351A (en) * 1996-10-09 2000-02-22 Texas Instruments Incorporated Gasket sealed integrated circuit package
US6065864A (en) * 1997-01-24 2000-05-23 The Regents Of The University Of California Apparatus and method for planar laminar mixing

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
COLLINS S D ET AL: "MicroJoinery: Concept, definition, and application to microsystem development", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 66, no. 1-3, 1 April 1998 (1998-04-01), pages 315 - 332, XP004144009, ISSN: 0924-4247 *
TZE-JUNG YAO ET AL: "Micromachined rubber O-ring micro-fluidic couplers", PROCEEDINGS IEEE XIII CONFERENCE ON MEMS, 23 January 2000 (2000-01-23) - 27 January 2000 (2000-01-27), Miyazaki,Japan, pages 624 - 627, XP010377200 *

Also Published As

Publication number Publication date
WO2002060810A2 (en) 2002-08-08
GB0102326D0 (en) 2001-03-14
GB2371674A (en) 2002-07-31
AU2002228179A1 (en) 2002-08-12

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