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WO1999038207A1 - Procede et appareil de detection de tranche - Google Patents

Procede et appareil de detection de tranche Download PDF

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Publication number
WO1999038207A1
WO1999038207A1 PCT/JP1999/000322 JP9900322W WO9938207A1 WO 1999038207 A1 WO1999038207 A1 WO 1999038207A1 JP 9900322 W JP9900322 W JP 9900322W WO 9938207 A1 WO9938207 A1 WO 9938207A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
cassette
wafer
detecting
sensor
Prior art date
Application number
PCT/JP1999/000322
Other languages
English (en)
Japanese (ja)
Inventor
Kiyoaki Kumazaki
Souichi Ueta
Ken Hattori
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10014582A external-priority patent/JPH11214484A/ja
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to AU20756/99A priority Critical patent/AU2075699A/en
Publication of WO1999038207A1 publication Critical patent/WO1999038207A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

Definitions

  • the present invention relates to a substrate detecting apparatus, a substrate detecting method, and a cassette.
  • the present invention relates to a cassette for storing a substrate therein, a substrate detection device for detecting a substrate stored in the cassette, and a substrate detection method.
  • a substrate detection apparatus for detecting a substrate stored in the cassette
  • a substrate detection method for example, in a semiconductor device manufacturing apparatus process, a substrate exposed by an exposure device is used.
  • the present invention relates to a substrate detection apparatus and a substrate detection method suitable for use when a substrate to be stored and a substrate are carried out and carried in by a loader system with respect to the cassette.
  • a wafer is loaded and unloaded in order to efficiently expose a photomask or reticle pattern onto a single lot of wafers.
  • a wafer loader system is provided. Further, the exposure apparatus is provided with a reticle loader system for selecting a large number of reticles and setting them in the exposure apparatus.
  • This type of loader system takes out wafers one by one from a wafer cassette in which the wafers are stored by a robot arm or the like, transports the wafers onto a wafer stage, and carries them into the wafer cassette from the wafer stage.
  • FIG. 21 is a plan view showing a wafer opening system of a conventional exposure apparatus.
  • a wafer loader system is arranged on a side of a wafer holder 13 2 on which a subject to be exposed and a wafer 102 E are placed in a chamber 13 1, which is substantially isolated from the outside air and is air-conditioned.
  • the guide portion of the wafer loader system is composed of a horizontal slider main body 139 extending in the X direction and a vertical slider main body 148 extending in the Y direction.
  • the scalar robot hand 147 is placed on the horizontal slider body 139 so as to be slidable in the X direction.
  • SCARA Type 1 robot hand 1 4 7 moves in X direction along horizontal slider body 1 3 9 X-axis moving section 1 41, expands and contracts in the Z-axis direction perpendicular to the XY plane on this X-axis moving section 1 4 1 Z-axis moving section 1 4 2 (In the figure, it overlaps with X-axis moving section 1 4 1 ), Which rotates about the center of the Z-axis moving section 144 2.
  • ⁇ -axis rotating section 144 3 R-axis rotating section 144 provided rotatably at the tip of the ⁇ -axis rotating section 144
  • the R-axis rotating section 144 is constituted by a hand section 144 rotatably provided at the tip of the section.
  • cassettes 122A and 122B for storing wafers are fixed on the mounting tables 121A and 122IB, respectively, which are provided on the side surfaces of the horizontal slider body 133.
  • a wafer buffer 156 consisting of two upper and lower stages capable of temporarily mounting two wafers is installed. Openings for exchanging cassettes 122A and 122B from the outside are provided on the side of the chamber 131 near the bases 121A and 122B, respectively. 3 B is provided.
  • the wafer 102A By extruding the hand part 144 of the scalar robot hand 144 through the opening 133C on the left side of the chamber 131, external equipment (such as coating photoresist on the wafer or after exposure)
  • the wafer 102A can be delivered to a developer that develops the wafer.
  • the wafer buffer 156 is placed near the opening 133C to temporarily place the wafer.
  • two sliders 149A and 149B having a U-shaped contact portion with the wafer are slidably mounted in the longitudinal direction. These two sliders 149A and 149B move independently while holding the wafer by vacuum suction.
  • an adjustment base 15 1 for performing briar alignment is arranged in the vicinity of the intersection between the horizontal slider main body 13 9 and the vertical slider main body 14 8.
  • a turntable 152 that rotates around the Z axis and can move in the Z direction is provided above the adjustment table 151.
  • FIGS. 22 to 24 show an example of a conventional cassette 122.
  • FIG. As shown in the plan view of FIG. 22, the left and right sides of the cassette 1 2 2 are surrounded by side walls, The front and rear sides are open, and as can be seen from the front view of FIG. 23, the front can be seen through the wafer 102 from the front. For this reason, as shown in the left side view of Fig. 24, a light source (emitter: one that is insensitive to the photoresist on the wafer 102) is placed in front of the cassette 122, and the light-receiving sensor is placed first. The presence or absence of a wafer is detected by determining whether or not the transmitted light from the light source to the light receiving sensor is blocked by the wafer in each slot where the wafer 102 is placed.
  • a light source emitter: one that is insensitive to the photoresist on the wafer 102
  • a cassette 122A is loaded from the opening 133A and fixed to the mounting table 121A, and the control device (not shown) sets the force based on the configuration of FIG.
  • the presence / absence of wafer 102 in each slot in 1 22 A is detected.
  • the scalar type robot hand 147 takes out the desired wafer 102 from the cassette 122A at the position Q2, moves to the position Q3, and turns the wafer on the adjustment table 151.
  • the slider 1449B vacuum-adsorbs the wafer 102B and moves in the Y direction along the vertical slider main body 148.
  • the slider 144B is moved from the slider 144B by a wafer transfer mechanism (not shown). Transfer wafer 102E onto 32.
  • the slider 149A receives the wafer 102D from the wafer holder 132 by the wafer transfer mechanism, sucks it in a vacuum, and moves along the vertical slider 148. Move in the Y direction and pass to scalar robot hand 1 4 7 at position Q 3.
  • the SCARA type 1 robot hand 1447 sucks the wafer 102C into the vacuum, moves it to the position Q2, and returns it to the cassette 122A.
  • 122 B can be used in addition to 122 A.
  • the delivery of the wafer 102 may be performed not only to the cassettes 122A and 122B but also to an external device from the opening 133C.
  • a sealed cassette mini-environment that is isolated from the outside air, as shown in Figs. 25 to 27, has been proposed.
  • the cassette 101 is surrounded by side walls and the front is openable and closable by an openable door (front door) 103.
  • the door 103 can be opened, for example, by being lowered.
  • the present invention has been made in view of the above points, and provides a substrate detection device, a substrate detection method, and a cassette capable of detecting a substrate without being limited to a mode of a cassette for storing the substrate.
  • the purpose is to: Disclosure of the invention
  • the invention of claim 1 is directed to a cassette (43, 101) having a storage portion (46) for a substrate (22, 102),
  • the board detection device (49, 100) is equipped with a detection section (50, 107, 117, 120) that detects the presence or absence of the board (22, 102) on the side where the board (22, 102) is taken in and out.
  • the detection unit (50, 107, 117, 120) allows the substrate (22, 102) to enter and exit the cassette (43, 101). Since the presence / absence is detected, the substrate (22, 101) can be detected without any problem even if the periphery of the substrate (22, 102) is surrounded by the side wall of the cassette (43, 101).
  • the invention according to claim 2 is characterized in that the detection unit includes a proximity sensor (50) capable of detecting the substrate (22) when approaching the substrate (22) in the storage unit (46).
  • the substrate (22) stored in the storage section (46) can be detected.
  • the invention according to claim 3 is the substrate detection device (49) according to claim 2, wherein the detection section (50) is supported so as to be able to approach and separate from the storage section (46).
  • the board detection device (49) of the present invention when the detection section (50) approaches the storage section (46), the board (22) in the storage section (46) is detected. Can be.
  • the board detecting device (49) when the detecting section (49) is separated from the storing section (46), the storing section (46) of the cassette (46) unloads the substrate (22). Can be brought in.
  • the invention according to claim 4 is characterized in that the detection unit is a single substrate stored in the storage unit (46).
  • the substrate detecting device (49) comprising a pair of sensors (50, 50) capable of detecting two separated points on the peripheral edge of the substrate.
  • the board detection device (49) of the present invention when the pair of sensors (50, 50) approach the storage section (46), the board detection device (49) detects the board (22) in the storage section (46). Can be. At this time, if a part of the peripheral portion of one board (22) is not stored in a predetermined position, one of the pair of sensors (50, 50) is connected to the board.
  • the invention according to claim 5 is characterized in that the cassette (43) is provided with a substrate with respect to the storage portion (46).
  • the invention according to claim 6 is characterized in that the cassette (43) is provided with a holding section (45) for holding a plurality of substrates (22) in a parallel state at intervals, and the detecting section comprises a holding section (45). 3.
  • the substrate detecting device according to claim 2, comprising a plurality of sensors corresponding to respective peripheral portions of the plurality of substrates held in the substrate detecting device.
  • the plurality of sensors (50) are When approaching (45), the periphery of the substrate (22) held by the holding section (45) corresponding to each sensor (50) can be detected.
  • the invention according to claim 7 is characterized in that the cassette (43) is provided with a holding portion (45) for holding a plurality of substrates (22) in a parallel state at intervals, and the cassette (43) or the sensor (50) is provided. ), The sensor (50) is placed in close proximity to the storage section (46) so that the sensor (50) corresponds to each of the plurality of substrates (22) held in the holding section (45).
  • the substrate detection device (49) according to claim 2, further comprising a drive mechanism (55, 56) for sequentially moving the substrate detection device relative to the substrate detection device.
  • the invention of claim 8 includes an irradiation mechanism (104, 116, 118) for irradiating the inside of the cassette (101) with a light, and a light receiving mechanism for receiving reflection from the inside of the cassette (101). 107, 117, 120) and a discriminating mechanism (113) for discriminating the presence or absence of the substrate (102) based on the output from the light receiving mechanism (107, 117, 120).
  • the substrate detection device (100) according to claim 1, wherein (120) is the detection unit.
  • the light receiving mechanism (107, 117, 120) is connected to the cassette.
  • the discrimination mechanism (113) determines the presence or absence of the board (102) based on the output from the light receiving mechanism (107, 117, 120). By discriminating, the board stored in the storage unit (146)
  • the invention according to claim 9 is the substrate detecting device (100) according to claim 8, wherein the light receiving mechanism (107, 117, 120) is a line sensor.
  • the substrate detecting apparatus (100) of the present invention the substrate can be stably provided without any movable parts.
  • the invention according to claim 10 is characterized in that the light receiving mechanism (107, 1 17, 120) has an area.
  • the substrate detecting device (100) of the present invention can determine the position of the substrate (102) in the cassette (101) in addition to detecting the presence or absence of the substrate (102).
  • the invention according to claim 11 is characterized in that the irradiating mechanism (104, 1 16, 118) irradiates in a point-like manner, or the light receiving mechanism (107, 117, 120) is a point sensor.
  • the substrate detection device (100) of the present invention can detect the presence or absence of the substrate (102) with a simple configuration.
  • the invention according to claim 12 is characterized in that the irradiation mechanism (104) is located at a plurality of different positions on the periphery of the substrate (102) with respect to one substrate (102) stored in the storage section (146).
  • the substrate detection device (100) may be able to detect the position of the substrate (102). The presence or absence of the substrate (102) can be detected by receiving the reflected light of the light applied to the position.
  • the invention according to claim 13 is the invention according to claim 12, wherein the irradiation mechanism (104) is relatively movable with respect to one substrate (102) stored in the storage section (146). It is a substrate detection device (100).
  • the substrate detecting device of the present invention is the substrate detecting device of the present invention.
  • the irradiation mechanism (104) moves relative to the substrate (102).
  • light can be applied to the peripheral portion at another position of the substrate (102).
  • the presence or absence of the substrate (102) can be detected by receiving reflected light from another peripheral portion.
  • the invention according to claim 14 is the substrate detection device according to claim 12, wherein a plurality of irradiation mechanisms (104) and a plurality of light receiving mechanisms (107) are provided corresponding to a plurality of positions, respectively. ).
  • a plurality of irradiation mechanisms (104) and a plurality of light receiving mechanisms (107) are provided corresponding to a plurality of positions, respectively.
  • the invention according to claim 15 is characterized in that the substrate (22, 102) of the cassette (43, 101) is inserted into and out of the cassette (43, 101) for storing the substrate (22, 102).
  • This is a board detection method that detects the presence or absence of (22, 102).
  • the presence or absence of a substrate is detected on the side where the substrate (22, 102) is inserted into or taken out of the cassette (43, 101).
  • the substrate (22, 101) can be detected without any problem even if it is surrounded by the side wall of (43, 101).
  • the invention according to claim 16 is the substrate detection method according to claim 15, wherein the presence or absence of the substrate (22) is detected by approaching the storage part (46) of the substrate (22).
  • the presence or absence of the substrate (22) is detected by approaching the storage portion (46) of the substrate (22) from the cassette (43) with respect to the substrate (22). can do.
  • the invention according to claim 17 is characterized in that the inside of the cassette (101) is irradiated with light, the reflection from the inside is received, and the presence or absence of the substrate (102) is detected. It is a substrate detection method described in the paragraph. As a result, in the substrate detection method of the present invention, the inside of the cassette (101) is irradiated with light from the side where the substrate (102) is put in and taken out, and the reflection from the inside is received. Presence or absence can be detected.
  • the invention according to claim 18 is the cassette (101) including a reference mark (109) indicating a reference position of the cassette (101).
  • the cassette (101) of the present invention detects the fiducial mark (109), and
  • the reference position of (101) can be detected.
  • FIG. 1 is a diagram showing the first embodiment of the present invention, and is a cross-sectional view in which proximity sensors corresponding to a plurality of wafers stored in a wafer cassette are provided.
  • FIG. 2 is a diagram showing the first embodiment of the present invention, and is a cross-sectional plan view in which a pair of sensors are arranged in the vicinity of a peripheral portion of a wafer with a distance therebetween.
  • FIG. 3 is a view showing the first embodiment of the present invention, and is a plan sectional view of an exposure apparatus provided with a wafer detection apparatus.
  • FIG. 4 is a sectional view taken along line AA in FIG.
  • FIG. 5 is a view showing a second embodiment of the present invention, and is a cross-sectional view provided with a drive mechanism for vertically moving a proximity sensor with respect to a wafer cassette.
  • FIG. 6 is a view showing the third embodiment of the present invention, and is a cross-sectional view provided with a drive mechanism for vertically moving the wafer cassette relative to the proximity sensor.
  • FIG. 5 is a plan view showing a configuration of a main part of a fourth embodiment of the present invention.
  • FIG. 8 is a left sectional view of FIG.
  • FIG. 9 is a front view of a fiducial mark constituting the cassette of the present invention.
  • FIG. 10 is a block diagram of a control device according to the fourth embodiment of the present invention.
  • FIG. 11 is a diagram illustrating signals according to the fourth embodiment of the present invention.
  • FIG. 12 is a flowchart illustrating the operation of the fourth exemplary embodiment of the present invention.
  • FIG. 13 is a plan view showing the configuration of the main part of the fifth embodiment of the present invention.
  • FIG. 14 is a plan view showing a configuration of a main part of the sixth embodiment of the present invention.
  • FIG. 15 is a diagram for explaining signals according to the sixth embodiment of the present invention.
  • FIG. 16 is a plan view showing a configuration of a main part of the seventh embodiment of the present invention.
  • FIG. 17 is a left sectional view of FIG.
  • FIG. 18 is a flowchart illustrating the operation of the seventh embodiment of the present invention.
  • FIG. 19 is a plan view showing a configuration of a main part of the eighth embodiment of the present invention.
  • FIG. 20 is a left sectional view of FIG.
  • FIG. 21 is a diagram showing a Jehachi loader system of a conventional exposure apparatus.
  • FIG. 22 is a plan view showing a conventional cassette.
  • FIG. 23 is a front view of FIG.
  • FIG. 24 is a left side view of FIG.
  • FIG. 25 is a plan view showing a cassette to which the present invention is applied.
  • FIG. 26 is a front view of FIG.
  • FIG. 27 is a left side view of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 3 is a plan sectional view of the exposure apparatus
  • FIG. 4 is a sectional view taken along line AA in FIG. 3.
  • reference numeral 1 denotes an exposure apparatus.
  • the exposure apparatus 1 has a configuration in which independent chambers 6, 7, and 8, which are independent from each other, are sequentially arranged. As shown in FIG. 4, the independent chamber 8 is separated by a partition plate 9 into a lower chamber 8A and an upper chamber 8B. An air conditioner 10 is installed in the independent chamber 6.
  • an air conditioning unit (not shown) for adjusting the temperature of the air is provided inside the air conditioner 10.
  • the air conditioner 10 allows the air whose temperature has been adjusted by the air conditioning unit to flow down into the independent chamber 7 via a dust removal filter 11 installed on the ceiling of the independent chamber 7 and to be independently cooled. It has the function of returning to the air conditioning unit from the return 12 installed on the floor of the chamber 7.
  • the air conditioner 10 is also lowered into the lower chamber 8A and upper chamber 8B via the filters 13 and 14 installed on the respective ceilings. It has a function to flow and return to the air conditioning unit from returns 15 and 16 installed on the floor of each chamber 8A and 8B.
  • an exposure apparatus main body 17 is installed in the independent chamber 7.
  • Exposure equipment The main body 17 is roughly composed of an anti-vibration table 20, a wafer stage 21, a column 23, a projection optical system 24, a reticle holder (not shown), and an illumination system (not shown).
  • the anti-vibration table 20 is installed on the floor of the independent chamber 7 via anti-vibration pads 18 and 19.
  • the wafer stage 21 loads a wafer (substrate) 22 placed on a vibration isolator 20 and coated with a photoresist at the time of exposure.
  • Column 23 is set up on the vibration isolator 20.
  • the projection optical system 24 is fixed to the middle of the column 23.
  • the reticle holder is provided at the upper end of the column 23, on which the reticle 25 is placed.
  • the wafer stage 21 includes a base 26, a Y stage 27, an X stage 28, a wafer holder 29, and the like.
  • the wafer 22 to be exposed is held by vacuum suction.
  • a notch called a notch is formed on the outer periphery of the wafer 22.
  • the wafer loader 3 is placed on the wafer holder 29 so that the notch faces in a predetermined direction and the center of the wafer 22 has a predetermined positional relationship with respect to the wafer holder 29. It is set to be spoken by 0.
  • the wafer porter system 30 is installed in the lower chamber 8 A of the independent chamber 8.
  • a guide portion is configured by a horizontal slider main body 31 extending in the X direction and a vertical slider main body 32 extending in the Y direction.
  • a robot hand 33 slidable in the X direction is arranged on the horizontal slider body 31.
  • the robot hand 33 is schematically composed of an X-axis moving unit 34, a Z-axis moving unit 35, a 0-axis rotating unit 36, an R-axis rotating unit 37, and a hand unit 38.
  • the X-axis moving section 34 is movable in the X direction along the horizontal slider body 31.
  • the Z-axis moving unit 35 is configured to be able to expand and contract on the X-axis moving unit 34 in the Z direction perpendicular to the XY plane.
  • the shaft rotating unit 36 is rotatable about the center of the Z-axis moving unit 35 as an axis.
  • the R-axis rotating unit 37 is rotatably provided at the tip of the 0-axis rotating unit 36.
  • the hand section 38 is rotatably provided at the tip of the R-axis rotating section 37. Further, a vacuum suction part 39 is attached to the tip of the hand part 38.
  • the hand unit 38 is rotatable in the 0 direction when the 0-axis rotating unit 36 rotates, and the rotation angles of the R-axis rotating unit 37 and the hand unit 38 are combined.
  • the position in the radial direction (R direction) from the center of the hand portion 38 can be adjusted.
  • the mounting tables 40 and 41 positioned with respect to the robot hand 33.
  • a wafer cassette (cassette) 43 positioned at a predetermined position on the mounting tables 40 and 41 is placed on the mounting tables 40 and 41.
  • the wafer cassette 43 includes a cassette body 44 whose inside is a closed space, and an opening / closing door (lid) 47.
  • holding shelves (holding portions) 45 are provided side by side at regular intervals in the vertical direction so as to form a pair.
  • the holding shelf 45 forms a slot (storage portion) 46 for storing the wafer 22 by holding the peripheral portion of the wafer 22 from below.
  • the cassette body 44 has an opening 48 through which the wafer 22 is put in and taken out of the slot 46.
  • the opening / closing door 47 opens and closes the opening 48 independently.
  • a wafer detecting device (substrate detecting device) 49 is provided near the wafer cassette 43.
  • the wafer detection device 49 detects the wafer 22 stored in the slot 46 of the wafer cassette 43, and has a configuration including a sensor (detection unit) 50 and a moving unit 51. Have been.
  • a sensor 50 a capacitive proximity sensor capable of detecting the wafer 22 when approaching the wafer 22 in the slot 46 is used.
  • the moving unit 51 moves the sensor 50 so that it can approach and separate from the slot 46, that is, moves the sensor 50 between the position where the wafer can be detected and the retreat position when the wafer hand is closed by the robot hand 33. Things.
  • the moving part 51 includes a rotating shaft 52 that is rotatable around an axis extending in a vertical direction, a support member 53 that is integrally attached to the rotating shaft 52, and a switching member. Section 54.
  • a sensor 50 is supported by the support member 53 at a position corresponding to each peripheral portion of the wafer 22 held by the plurality of holding shelves 45. As shown in FIG. 2, this moving unit 51 can detect a pair of sensors 50 at two separated points on the wafer periphery with respect to one wafer 22 stored in the slot 46. Like two It is located.
  • temporary placing tables 64 and 65 for temporarily placing the wafers 22 are provided beside the horizontal slider body 31.
  • a plurality of wafer mounting pins are planted on these temporary mounting tables 64 and 65.
  • openings 66, 67, and 72 for exchanging the wafer cassette 43 and the like from the outside, respectively. 68 are provided.
  • the vertical slider body 32 projects into the independent chamber 7 through an opening 69 on the side surface of the independent chamber 7 and an opening 70 on the side surface of the lower chamber 8A of the independent chamber 8.
  • sliders 71 and 72 each having a U-shape in plan view are slidably provided in the longitudinal direction.
  • the sliders 71 and 72 can hold the wafer 22 by vacuum suction, respectively, and can move independently between the inside of the independent chamber 7 and the inside of the lower chamber 8A.
  • a vertically movable movable table 73 is provided below the sliders 71 and 72 and beside the horizontal slider body 31.
  • a reticle loader system 74 is provided in the upper chamber 8 B of the independent chamber 8.
  • a guide portion is formed by the vertical slider body 77.
  • the vertical slider body 77 protrudes into the independent chamber 7 through the opening 75 of the independent chamber 7 and the opening 76 of the upper chamber 8B. Further, sliders 78 and 79 slidable along the vertical slider main body 77 are attached to the vertical slider main body 77.
  • a robot hand 80 is installed near the vertical slider body 77.
  • the robot hand 80 includes a base 81, a Z-axis moving unit 82, a ⁇ -axis rotating unit 83, an R-axis rotating unit 84, and a hand unit 85.
  • the Z-axis moving unit 82 expands and contracts on the base 81 in the Z direction perpendicular to the XY plane.
  • the ⁇ -axis rotating unit 83 rotates around the center of the Z-axis moving unit 82 as an axis.
  • the R-axis rotating section 84 is rotatably provided at the tip of the 0-axis rotating section 83.
  • the hand portion 85 is rotatably provided at the tip of the R-axis rotating portion 84.
  • a storage shelf 86 for storing the reticle is installed near the robot hand 80.
  • the wafer detecting device 49 operates to detect the wafer 22.
  • the switching unit 54 shown in FIG. 2 is separated from the wafer cassette 43 (in the figure, the right switching unit 54 is counterclockwise, and the left switching unit 54 is clockwise).
  • the rotating shaft 52 and the support member 53 rotate integrally around the axis of the rotating shaft 52.
  • the sensor 50 supported by the support member 53 reaches a wafer detectable position close to the slot 46 of the wafer cassette 43.
  • the opening / closing door 47 is opened in advance in preparation for the unloading operation of the robot hand 33, the sensor 50 moves from the opening 48 of the cassette body 44 to the vicinity of the slot 46 of the closed space 42. Can be reached without hindrance.
  • the sensor 50 corresponding to the slot 46 of the wafer 22 to be carried out detects the wafer 22. That is, since the sensor 50 is a proximity sensor, the wafer 22 can be detected if the wafer 22 is stored in the predetermined slot 46 while being held by the holding shelf 45. If the wafer 22 is not stored in the scot 46, the sensor 50 detects an abnormal state, issues an alarm, and stops the unloading operation by the robot hand 33.
  • the switching unit 54 approaches the wafer cassette 43 (the right switching unit 5 in the drawing). 4 moves clockwise, and the left switching section 54 moves counterclockwise).
  • the rotating shaft 52 and the support member 53 rotate integrally around the axis of the rotating shaft 52.
  • the sensor 50 supported by the support member 53 is separated from the slot 46 of the wafer force set 43 and reaches the retreat position when loading the wafer. Thereafter, the robot hand 33 unloads the wafer 22 stored in the slot 46 from the opening 48.
  • the wafer detection device 49 is operated to set the predetermined slot to be loaded. Detects that wafers are not stored in lot 46.
  • the sensor 50 issues an alarm and stops the loading operation by the robot hand 33 as described above.
  • the wafer 50 detects that the wafer 22 is not stored in the slot 46 as specified, the wafer 50 is moved to the evacuation position when loading the wafer, and then the wafer 22 is moved to the slot. 4 Stored in 6.
  • the robot hand 33 After the robot hand 33 takes out the wafer 22 from the wafer cassette 43 positioned on the mounting table 40, the robot hand 33 moves to the position Q and moves to the slider 71 or 72 via the evening table 73. Pass wafer 2 2.
  • the sliders 71 and 72 are loaded onto the wafer holder 29 of the wafer stage 21 so as to be at predetermined positions while holding the wafer 22 by vacuum suction.
  • the wafer 22 held by the vacuum suction of the wafer holder 29 exposes the image of the pattern of the reticle 25 to the wafer 22 via the projection optical system 24 by light rays from the illumination system.
  • the exposed wafer 22 is loaded again by the slider 71 or 72 and transferred to the robot hand 33 via the vertical movement of the turntable 73. Then, the robot hand 33 returns the wafer 22 to, for example, the wafer cassette 43.
  • the hand unit 85 of the robot hand 80 takes out the reticle 25 from the storage shelf 86 by vacuum suction and attaches the taken reticle 25 to the vertical slider body 77. Pass to slider 78 or 79. Thereafter, the slider 78 or 79 moves into the independent chamber 7 along the vertical slider main body 77 while holding the reticle 25 by vacuum suction, and moves through the reticle transfer means (not shown) to the exposure apparatus main body. Place the reticle 25 on the reticle holder on column 23 of 17.
  • the reticle 25 When the reticle 25 is replaced, the reticle 25 is taken out of the reticle holder and returned to the storage shelf 86 via the slider 78 or 79 and the robot hand 80. The replacement is completed by installing a new reticle on the reticle holder by the same operation as described above.
  • the wafer detection sensor 50 since the proximity sensor for detecting the wafer 22 when approaching the wafer 22 is used as the wafer detection sensor 50, the sensor is affected by disturbance. Thus, the wafer 22 can be detected without fail.
  • the detection of the wafer 22 is performed by moving the sensor 50 closer to the slot 46 from the opening 48 on the side of the wafer 22 in the cassette main body 44. It can also handle wafer cassettes with no open facing surface.
  • the wafer can be moved by the robot hand 33. There is no hindrance to the transport of 22.
  • the sensors 50 are provided corresponding to the wafers 22 held on the plurality of holding shelves 45, each of the slots 46 can be easily rotated around the axis of the rotating shaft 52. Wafers 22 can be detected, and all wafers can be detected at once.
  • the sensor 50 can detect two separated points on the periphery of one wafer 22 stored in the slot 46. For example, one side of one wafer 22 is held by a predetermined holding shelf 45, and the other side is held by a holding shelf 45 shifted one step from a predetermined position.
  • One of the pair of sensors 50 can detect an abnormal state of the wafer 22 even when the wafer 22 is stored in the inclined state.
  • the wafer 22 can be reliably loaded and unloaded from the wafer cassette 43 by the robot hand 33. Therefore, the wafer cassette 43 and the robot hand 33 Can be prevented from being damaged during transportation.
  • FIG. 5 is a diagram showing a second embodiment of the present invention.
  • the difference between the second embodiment and the first embodiment is that This is the configuration of 49.
  • the wafer detection device 49 is configured to include the sensor 50 and the moving unit 51.
  • the moving unit 51 includes a rotating shaft 52, a support member 57, a switching unit 54, and a driving mechanism 55.
  • the support member 57 supports one sensor 50.
  • the drive mechanism 55 drives the sensor 50 via a support member 57 so that the sensor 50 approaches each of the plurality of wafers 22 held on the holding shelf 45 while approaching the slot 46. This is to sequentially move the wafer cassette 43 relative to the wafer cassette 43 in the vertical direction.
  • Other configurations are the same as those in the first embodiment.
  • the operation of the drive mechanism 55 causes the plurality of wafers 22 held on the holding shelf 45 while the sensor 50 approaches the slot 46 via the support member 57.
  • the wafer 22 can be sequentially detected by moving up and down so as to correspond to.
  • the substrate detecting device and the substrate detecting method according to the present embodiment in addition to obtaining the same effects as those of the first embodiment, it is not necessary to use many expensive sensors, so that the cost can be reduced. Can be. Further, unlike the case where a plurality of sensors 50 are used, it is not necessary to position the pitch between the sensors 50 and the pitch between the holding shelves 45 with high accuracy, so that the working efficiency is improved.
  • FIG. 6 is a diagram showing a third embodiment of the present invention.
  • the same elements as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof will be omitted.
  • the difference between the third embodiment and the first embodiment is the configuration of the wafer detecting device 49.
  • the wafer detection device 49 is configured to include the sensor 50, the moving unit 51, and the driving mechanism 56.
  • the drive mechanism 56 moves the wafer cassette 43 up and down with respect to the sensor 50 so that the sensor 50 approaches each of the plurality of wafers 22 held on the holding shelf 45 with the sensor 50 approaching the slot 46. It is to make relative movement sequentially in the direction.
  • Other configurations are the same as those in the first embodiment.
  • the drive mechanism 56 operates the sensor 50 to support the plurality of wafers 22 held on the holding shelf 45 while approaching the slot 46. By moving the wafer cassette 43 vertically in such a manner, the sensor 50 can sequentially detect the wafers 22.
  • the cost can be reduced since it is not necessary to use many expensive sensors. be able to. Further, unlike the case where a plurality of sensors 50 are used, it is not necessary to position the pitch between the sensors 50 and the pitch between the holding shelves 45 with high accuracy, so that the working efficiency is improved.
  • FIG. 7 to FIG. 9 are schematic views of a main part of a fourth embodiment of the present invention.
  • the cassette (mini-environment) 101 the one shown in FIGS. 25 to 27 is used.
  • reference numeral 100 denotes a wafer detection device (substrate detection device).
  • the wafer detection device 100 is roughly equivalent to the light source (irradiation mechanism) 104, mirror 105, lens 106, and CCD (light receiving mechanism) 107, which is the detection unit for the wafer (substrate) 102. It is configured.
  • the front door (lid) 103 shown in Fig. 27) is open.
  • a light source that is insensitive to the photo resist on the wafer 102 for example, a single wavelength light source such as an infrared laser is desirable.
  • the mirror 105 secures an optical working distance, and guides the reflected light from the wafer 102 in each slot to the CCD 107 via the lens 106. .
  • the left cross-sectional view of FIG. 8 shows a drawing in which the mirror 105 is omitted and optically expanded.
  • the CCD 107 is a line sensor that detects reflected light from a linear area covering the cassette 101 from the top to the bottom and a mounting table 108 for fixing the cassette 101. It is.
  • the mounting table 1108 has a reference mark 109 in the form of sandwiching the low reflectance area 109b between the high reflectance areas 109a and 109c.
  • the reference position information for each slot position is given by the reflected light from the reference mark 109. It is desirable that the reference mark 109 be partially colored on the aluminum coating so as not to reduce the cleanliness of the clean room. What is necessary is just to have a different area and to indicate the reference position of the cassette 101, and it is not limited to the above.
  • FIG. 10 is a block diagram of a control device that processes a signal output from the CCD 107.
  • the output of the CCD 107 is reduced in noise by a correlated double sampling (CDS) circuit 110, converted from an analog signal to a digital signal by an AZD converter 111, and stored in a memory 112.
  • the CPU (determination mechanism) 113 determines the presence or absence of the wafer 102 in each slot based on the data stored in the memory 112.
  • the operation timing of these CCD 107, correlated double sampling (CDS) circuit 110, AZD converter 111, memory 112 and CPU 113 is controlled by a timing signal from timing circuit 114.
  • FIG. 11 shows an example of the output signal of the CCD 107.
  • the horizontal axis indicates the number of pixels (time) of the CCD 107
  • the vertical axis indicates the magnitude of the output signal of the CCD 107.
  • the presence or absence of the wafer 102 in each slot can be determined.
  • the distance between the slots is defined by the standard, and the offset distance is derived from the distance between the slots.
  • FIG. 12 is a flowchart for explaining the operation of searching for the wafer 102 in the cassette 101.
  • the cassette 101 is placed on the mounting table 108 and fixed.
  • the front door 103 is opened (step S2), the light source 104 for wafer detection is turned on (step S3), and the output of the CCD 107 as a line sensor is output. Is stored in the memory 111 (step S4).
  • step S5 the reference mark 109 is detected by detecting a pattern of large and small dogs having a signal amplitude corresponding to the pattern of large and small dogs with the reflectance of the reference mark 109 from the stored output of the CCD 107. Then, using that position as a reference position, the presence or absence of the wafer 102 is detected (step S6). It is determined whether or not the slot is the last slot (step S7). If N ⁇ is not the last slot, the process returns to step S6. If YES, the process proceeds to step S8 if the slot is final. To end the wafer search process and end this flow.
  • the mirror 105 and the lens 106 are not necessarily required. .
  • FIG. 13 is a diagram showing a fifth embodiment of the present invention.
  • the difference between the fifth embodiment and the fourth embodiment is the configuration of the wafer detection apparatus 100.
  • the wafer detection device 100 rotates between the reference position K 1 shown by the two-dot chain line and the position K 2 shown by the solid line in the figure with the center of the wafer 102 as the rotation axis. It has a possible configuration.
  • the position K2 is set according to the size of the notch (or orientation flat) of the wafer 102. Specifically, even when the light interferes with the notch (or orientation flat) when the light is irradiated at the reference position K1, the position K2 is set at a place where the light does not interfere with the notch.
  • the wafer detecting device 100 located at the reference position K1 irradiates light into the cassette 101 and receives reflected light.
  • the wafer detection device 100 Rotate from reference position K1 to position K2.
  • the wafer detection device 100 detects that the wafer 102 is stored, and the amount of reflected light increases the threshold value during movement. If not, wafer 1 0 2 Is not stored.
  • the same operation and effect as those of the fourth embodiment can be obtained, and the notch (or the orientation flat) formed on the wafer 102 can be obtained. ) Can reliably detect the presence or absence of the wafer 102 even if the reflected light interferes with the light emitted from the light source 104 and a sufficient amount of reflected light cannot be obtained.
  • FIG. 14 and FIG. 15 are diagrams showing a sixth embodiment of the present invention.
  • the difference between the sixth embodiment and the fourth embodiment is the configuration of the wafer detection apparatus 100.
  • the wafer detection device 100 irradiates the inside of the cassette 101 with light at two places, and separates the position P 1 from each other so that each reflected light can be received.
  • P 2 are located at the place of good.
  • Other configurations are the same as those of the fourth embodiment.
  • the wafer detection device 100 at the position P1 irradiates the notch of the wafer 102 with light, and Even if the reflected light cannot be received, the wafer detector 100 at the position P2 receives a sufficient amount of reflected light from the wafer 102, so it is necessary to reliably detect the presence of the wafer 102. Can be. Further, as shown in FIG. 15, when the signals m 1 and m 1 are detected at different positions between the slots 144 at the wafer detection device 100 force positions P 1 and P 2, the wafer 10 2 Can be detected as being stored at an angle.
  • the wafer detection device 100 detects signals m 2 and m 2 having a larger number of pixels than the predetermined value at both the positions P l and P 2, the wafers 100 have the same slot. It can be detected that they are stored in a state where they overlap with 1 4 6.
  • the same operation and effect as those of the fourth embodiment are obtained, and in addition, the light radiated from the light source 104 is applied to the wafer 100.
  • the wafer 102 can be reliably detected even if it interferes with the notch 2 (or orientation flat).
  • the abnormalities stored in the state of being held can also be reliably detected.
  • each wafer detection mechanism 10 of each wafer detection mechanism 100 located at the position P1 and the position P2 is shared, and the light emitted from one light source 104 is divided into two. Irradiation may be performed at two different points on the periphery of the wafer 102. In this case, each wafer detection mechanism 10 is associated with the expected optical path of the reflected light from the wafer 102.
  • FIG. 16 to FIG. 18 are diagrams showing a seventh embodiment of the present invention.
  • the seventh embodiment and the fourth embodiment described above are point illumination (irradiation mechanism) 116 in which a light source substantially illuminates a point region, and a sensor is also substantially in a point region.
  • These point illumination 1 16 and point sensor 1 17 can be configured using fibers.
  • FIG. 16 when wafer 102 is present in slot 146, light from point illumination 1 16 is reflected at the edge of wafer 102 and detected by point sensor 1 17
  • the point illumination 1 16 and the point sensor 1 17 are arranged at positions where they can be made. Then, as shown in FIG. 17, the point illumination 1 16 and the point sensor 1 17 move up and down integrally with each other to detect the presence or absence of the wafer 102 in each slot.
  • FIG. 18 is a flowchart for explaining the operation of searching for the wafer 102 in the cassette 101 by the wafer detection device 100.
  • the cassette 101 is placed on the installation table 108 and fixed.
  • open the front door 103 step S12
  • turn on the point illumination 1 16 for wafer detection step S13
  • the output of the point sensor 1 17 is stored in the memory 1 12 (step S 14).
  • step S15 from the stored output of the point sensor 117, the signal amplitude of the signal corresponding to the pattern of the reflectance of the reference mark 109 is determined.
  • the reference mark 109 is detected by detecting a large or small pattern, and the presence or absence of the wafer 102 is detected using that position as a reference position (step S16).
  • Point sensor 1
  • step S17 It is determined whether or not 17 has moved to the final slot (step S17). If N ⁇ has not been reached, the process returns to step S16. If YES has been reached, the process proceeds to step S18. To end the wafer search process and end this flow.
  • the pointing direction instead of moving the point illumination 1 16 and the point sensor 1 17 up and down, the pointing direction may be rotated.
  • FIG. 19 and FIG. 20 are views showing an eighth embodiment of the present invention.
  • the seventh embodiment is different from the fourth embodiment in that the sensor is a detection unit that captures an image of the front surface of the cassette 101 including the installation table 108 via the lens 119.
  • the rear sensor (light receiving mechanism) 120 is used, and the light source is a light source (irradiation mechanism) 118 that illuminates the area imaged by the area sensor 120.
  • the wafer 102 of each slot 146 can be imaged by the area sensor 120. If possible, it can be anywhere in the center of the cassette 101 in the upper, lower, left and right directions. Further, when imaging from above or below, the outer periphery of the wafer 102 can be imaged.
  • the center position of the wafer 102 from the video signal of the outer periphery of the wafer 102, it is possible to simply calculate Not only can the presence or absence of the wafer 102 be detected, but also the mounting position of the existing wafer 102 can be detected. Therefore, even if the position of the wafer 102 moves when the cassette 101 is transported, the position of the wafer 102 is detected after the cassette 101 is fixed to the installation table 108, and then the cassette is detected.
  • the scalar robot hand 147 can be more appropriately controlled.
  • the substrate detecting device, the substrate detecting method, and the cassette according to the present invention are not limited to the above embodiment, but include those with the following changes.
  • the sensor does not detect the board every time the board is transported by the robot hand, but detects all the storage units in the cassette when the cassette is installed, and based on the detection result, the robot hand detects the board. That transports
  • the sensor when the robot hand conveys a substrate, the sensor is retracted not by the rotating operation of the moving unit but by the vertical movement of the sensor by the driving mechanism.
  • the cassette may be an open type. Even in this case, since the irradiation mechanism and the light receiving mechanism are arranged in one direction with respect to the cassette, the degree of freedom in design is increased.
  • the wafer 102 which is a substrate, may or may not be coated with a resist.
  • the reticle does not require a light source that is not photosensitive.
  • the fiducial mark 109 may be placed on the upper or lower part of the cassette other than the mounting table 108. Even if the reference mark 109 is not used, the position of each slot can be identified by increasing the accuracy of the position where the light receiving mechanism is placed. In addition, the position of each slot can be identified by calibrating the positional relationship between the light receiving mechanism and each slot.
  • Substrates include not only semiconductor wafers for semiconductor devices, but also glass substrates for liquid crystal display devices and ceramic wafers for thin-film magnetic heads. Alternatively, an original mask or reticle used in an exposure apparatus (synthetic quartz, silicon wafer) or the like is applied.
  • An exposure apparatus that exposes a reticle pattern while the reticle (mask) and wafer are at rest and sequentially moves the wafer in steps is a step-and-repeat type exposure apparatus (stepper).
  • the present invention can also be applied to a step-and-scan type scanning projection exposure apparatus (scanning stepper) that synchronously moves a substrate and exposes a reticle pattern.
  • the types of exposure equipment include not only the above-mentioned semiconductor manufacturing equipment, but also exposure equipment for manufacturing liquid crystal display devices, exposure equipment for manufacturing thin-film magnetic heads, imaging devices (CCD), masks, reticles, etc. Is also widely applicable.
  • KrF excimer laser (248 nm), ArF excimer laser (193 nm), ?? Two lasers (1571111), X-rays and the like can be used.
  • a high frequency such as a YAG laser or a semiconductor laser may be used.
  • the magnification of the projection optical system may be any of a reduction system, an equal magnification, and an enlargement system.
  • As the projecting projection optical system using a material which transmits far ultraviolet rays such as quartz Ya fluorite as the glass material when using far ultraviolet rays such as excimer one The, in the case of using the F 2 laser reflection refraction system or Use a refractive optical system.
  • each stage may be a type that moves along a guide, or may be a guideless type in which a guide is not provided.
  • the reaction force generated by the movement of the wafer stage may be mechanically released to the floor (ground) using a frame member.
  • the reaction force generated by the movement of the reticle stage may be mechanically released to the floor (ground) using a frame member.
  • the illumination optical system and the projection optical system composed of a plurality of optical elements are incorporated into the exposure apparatus main body, respectively, and optical adjustment is performed.
  • a reticle stage and a wafer stage, which are composed of many mechanical parts, are attached to the exposure apparatus main body.
  • the exposure equipment of this embodiment can be used.
  • Device can be manufactured. It is desirable to manufacture the exposure apparatus in a clean room where the temperature, cleanliness, etc. are controlled.
  • the steps of designing the function and performance of each device For devices such as semiconductor devices and liquid crystal display elements, the steps of designing the function and performance of each device, the steps of manufacturing a reticle based on this design step, the steps of manufacturing wafers, glass substrates, etc. It is manufactured through the steps of exposing a reticle pattern to a wafer and a glass substrate using a lithographic exposure apparatus, assembling each device, and inspecting.
  • the present invention relates to a cassette for storing a substrate such as a wafer therein, a substrate detection device for detecting a substrate stored in the cassette, and a substrate detection method.
  • the detection unit can detect the presence or absence of the substrate in the cassette without contacting the substrate on the substrate insertion / removal side with respect to the cassette. When the body is opened, the presence or absence of the substrate can be detected.
  • the sensor when a proximity sensor is used for the detection unit, the sensor is supported so as to be able to approach and separate from the storage unit, so that the sensor does not hinder the transfer of the substrate when taking the substrate in and out of the cassette. Can be prevented.
  • the sensor since the sensor consists of a pair of sensors that detect two separate points with respect to one board stored in the storage unit, one board may be incomplete with respect to the storage unit. Even if it is stored, this abnormal state can be detected.
  • the above-mentioned cassette includes a cassette body having an opening and a lid that allows the opening to be opened and closed, when the lid is opened even when the cassette is closed tightly, the opening is formed.
  • the sensor can be moved closer to the substrate in the storage unit to detect the substrate, and when the lid is closed, the inside of the cassette body is sealed and dust can be prevented from entering.
  • the cassette is provided with a holding unit for holding the substrates in a parallel state, and the sensors are configured by a plurality of sensors corresponding to the held substrates. Can be detected every time.
  • a holding portion for holding the substrates in a cassette in a parallel state is provided, and at least one of the cassette and the sensor is provided with a drive mechanism for sequentially moving the sensor relative to the other, so that an expensive sensor can be used.
  • a drive mechanism for sequentially moving the sensor relative to the other so that an expensive sensor can be used.
  • the detection unit as an area sensor, it can be arranged anywhere in the front, bottom, left, right, and center of the cassette.
  • the outer periphery of the substrate can be imaged, so that not only the presence or absence of the substrate can be detected, but also the mounting position of the existing substrate can be detected. . Therefore, even if the position of the substrate moves when the cassette is transported, the position of the substrate is detected after fixing the cassette to the installation table, and the scalar robot hand is more often used when removing the substrate from the cassette. Can be properly controlled.
  • the irradiation mechanism is configured to be able to irradiate light to multiple positions on the substrate, such as by making the irradiation mechanism relatively movable with respect to the substrate and providing multiple irradiation mechanisms corresponding to multiple positions on the substrate. In this way, even if notch (or orientation flat) formed on the substrate does not provide a sufficient amount of reflected light, the irradiation mechanism moves relative to the substrate to irradiate light or perform other irradiation. By receiving the reflection of the light emitted by the mechanism, it is possible to reliably detect the presence or absence of the substrate and that the substrate is stored in an inclined state or a plurality of overlapping states.
  • the presence or absence of the substrate in the cassette can be detected without contacting the substrate on the side where the substrate is taken in and out of the cassette, so that even if a sealed force set is used, the lid can be used.
  • the presence or absence of the substrate can be detected.
  • the position of the substrate with respect to the force set can be recognized by detecting the reference mark of the cassette.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention se rapporte à un appareil (50) conçu pour détecter des tranches de semi-conducteur dans une cassette (43) et comportant un détecteur (49) qui détecte, lorsque la cassette est ouverte, s'il y a des tranches (22) dans la cassette (43) qui est munie d'une enceinte (46) conçue pour loger des tranches (22). Cet appareil rend possible la détection d'une plaquette (22) même lorsque la cassette est d'un type hermétique.
PCT/JP1999/000322 1998-01-27 1999-01-27 Procede et appareil de detection de tranche WO1999038207A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU20756/99A AU2075699A (en) 1998-01-27 1999-01-27 Method and apparatus for detecting wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10/14582 1998-01-27
JP10014582A JPH11214484A (ja) 1998-01-27 1998-01-27 基板検出装置
JP10/160586 1998-06-09
JP16058698 1998-06-09

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WO1999038207A1 true WO1999038207A1 (fr) 1999-07-29

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WO (1) WO1999038207A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045173A (ja) * 2008-08-12 2010-02-25 Contact Co Ltd フープ洗浄装置
WO2011062138A1 (fr) * 2009-11-17 2011-05-26 シンフォニアテクノロジー株式会社 Appareil de détection de tranche
JP2012231117A (ja) * 2011-04-11 2012-11-22 Hitachi Kokusai Electric Inc 基板処理装置、基板処理装置制御プログラム、及び半導体装置の製造方法
JP2020021795A (ja) * 2018-07-31 2020-02-06 日本電産サンキョー株式会社 搬送システム
JP2021158227A (ja) * 2020-03-27 2021-10-07 株式会社日立ハイテク ウェーハ搬送装置
CN113921414A (zh) * 2021-10-08 2022-01-11 江苏华恒新能源有限公司 一种晶硅电池刻蚀后反射率检测设备
TWI807764B (zh) * 2021-04-12 2023-07-01 南韓商尤金科技有限公司 基板轉移裝置以及具有基板轉移裝置的基板處理設備
TWI855547B (zh) * 2022-12-07 2024-09-11 大陸商西安奕斯偉材料科技股份有限公司 一種監測晶圓位置的裝置以及最終拋光設備

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JPH08279546A (ja) * 1995-03-28 1996-10-22 Jenoptik Ag 半導体加工装置のためのローディング及びアンローディング用ステーション
JPH0997826A (ja) * 1995-09-27 1997-04-08 Jenoptik Ag マガジン内のマガジン棚と、同マガジン棚内に格納されたウェハ状物体とに使用するインデックス装置

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Publication number Priority date Publication date Assignee Title
JPH04345049A (ja) * 1991-05-22 1992-12-01 Mitsubishi Electric Corp ウェハ配列パターン検出装置およびその検出方法
JPH08279546A (ja) * 1995-03-28 1996-10-22 Jenoptik Ag 半導体加工装置のためのローディング及びアンローディング用ステーション
JPH0997826A (ja) * 1995-09-27 1997-04-08 Jenoptik Ag マガジン内のマガジン棚と、同マガジン棚内に格納されたウェハ状物体とに使用するインデックス装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045173A (ja) * 2008-08-12 2010-02-25 Contact Co Ltd フープ洗浄装置
WO2011062138A1 (fr) * 2009-11-17 2011-05-26 シンフォニアテクノロジー株式会社 Appareil de détection de tranche
CN102576687A (zh) * 2009-11-17 2012-07-11 昕芙旎雅有限公司 晶圆检测装置
US8837777B2 (en) 2009-11-17 2014-09-16 Sinfonia Technology Co., Ltd. Wafer detecting apparatus
JP2012231117A (ja) * 2011-04-11 2012-11-22 Hitachi Kokusai Electric Inc 基板処理装置、基板処理装置制御プログラム、及び半導体装置の製造方法
JP2020021795A (ja) * 2018-07-31 2020-02-06 日本電産サンキョー株式会社 搬送システム
JP2021158227A (ja) * 2020-03-27 2021-10-07 株式会社日立ハイテク ウェーハ搬送装置
TWI807764B (zh) * 2021-04-12 2023-07-01 南韓商尤金科技有限公司 基板轉移裝置以及具有基板轉移裝置的基板處理設備
CN113921414A (zh) * 2021-10-08 2022-01-11 江苏华恒新能源有限公司 一种晶硅电池刻蚀后反射率检测设备
TWI855547B (zh) * 2022-12-07 2024-09-11 大陸商西安奕斯偉材料科技股份有限公司 一種監測晶圓位置的裝置以及最終拋光設備

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