WO1999038207A1

WO1999038207A1 - Method and apparatus for detecting wafer

Info

Publication number: WO1999038207A1
Application number: PCT/JP1999/000322
Authority: WO
Inventors: Kiyoaki Kumazaki; Souichi Ueta; Ken Hattori
Original assignee: Nikon Corporation
Priority date: 1998-01-27
Filing date: 1999-01-27
Publication date: 1999-07-29
Also published as: AU2075699A

Abstract

An apparatus (50) for detecting wafers in a cassette (43) comprises a detector (49) that detects, at the cassette opening, whether there are wafers (22) in the cassette (43) having a room (46) for accommodating wafers (22). This allows the circuit board (22) to be detected even if the cassette (43) is of a sealed type.

Description

Specification

TECHNICAL FIELD The present invention relates to a substrate detecting apparatus, a substrate detecting method, and a cassette.

The present invention relates to a cassette for storing a substrate therein, a substrate detection device for detecting a substrate stored in the cassette, and a substrate detection method.For example, in a semiconductor device manufacturing apparatus process, a substrate exposed by an exposure device is used. The present invention relates to a substrate detection apparatus and a substrate detection method suitable for use when a substrate to be stored and a substrate are carried out and carried in by a loader system with respect to the cassette.

This application is based on a patent application filed in Japan (Japanese Patent Application No. 10-0-145 and Japanese Patent Application No. Hei 10-166-0586). The contents shall be incorporated as a part of this specification. Background art

In general, in an exposure apparatus used in a photolithography process for manufacturing semiconductor elements, a wafer is loaded and unloaded in order to efficiently expose a photomask or reticle pattern onto a single lot of wafers. A wafer loader system is provided. Further, the exposure apparatus is provided with a reticle loader system for selecting a large number of reticles and setting them in the exposure apparatus. This type of loader system takes out wafers one by one from a wafer cassette in which the wafers are stored by a robot arm or the like, transports the wafers onto a wafer stage, and carries them into the wafer cassette from the wafer stage.

FIG. 21 is a plan view showing a wafer opening system of a conventional exposure apparatus. In FIG. 21, a wafer loader system is arranged on a side of a wafer holder 13 2 on which a subject to be exposed and a wafer 102 E are placed in a chamber 13 1, which is substantially isolated from the outside air and is air-conditioned. I have. The guide portion of the wafer loader system is composed of a horizontal slider main body 139 extending in the X direction and a vertical slider main body 148 extending in the Y direction. The scalar robot hand 147 is placed on the horizontal slider body 139 so as to be slidable in the X direction. SCARA Type 1 robot hand 1 4 7 moves in X direction along horizontal slider body 1 3 9 X-axis moving section 1 41, expands and contracts in the Z-axis direction perpendicular to the XY plane on this X-axis moving section 1 4 1 Z-axis moving section 1 4 2 (In the figure, it overlaps with X-axis moving section 1 4 1 ), Which rotates about the center of the Z-axis moving section 144 2. Θ-axis rotating section 144 3, R-axis rotating section 144 provided rotatably at the tip of the Θ-axis rotating section 144 The R-axis rotating section 144 is constituted by a hand section 144 rotatably provided at the tip of the section. Attach the vacuum suction part 144 to the tip of the hand part 144. By rotating the Θ-axis rotating section 144 around the center of the Z-axis moving section 144, the hand section 144 rotates in the 0 direction. By combining the rotation angles of the R-axis rotating section 144 and the hand section 144, the position of the hand section 144 in the radial direction (R direction) from the center of the Z-axis moving section 144 can be adjusted.

In addition, cassettes 122A and 122B for storing wafers are fixed on the mounting tables 121A and 122IB, respectively, which are provided on the side surfaces of the horizontal slider body 133. Furthermore, a wafer buffer 156 consisting of two upper and lower stages capable of temporarily mounting two wafers is installed. Openings for exchanging cassettes 122A and 122B from the outside are provided on the side of the chamber 131 near the bases 121A and 122B, respectively. 3 B is provided. By extruding the hand part 144 of the scalar robot hand 144 through the opening 133C on the left side of the chamber 131, external equipment (such as coating photoresist on the wafer or after exposure) The wafer 102A can be delivered to a developer that develops the wafer. At this time, in order to carry out the delivery efficiently, the wafer buffer 156 is placed near the opening 133C to temporarily place the wafer.

On the side surface of the vertical slider body 148, two sliders 149A and 149B having a U-shaped contact portion with the wafer are slidably mounted in the longitudinal direction. These two sliders 149A and 149B move independently while holding the wafer by vacuum suction.

In the vicinity of the intersection between the horizontal slider main body 13 9 and the vertical slider main body 14 8, an adjustment base 15 1 for performing briar alignment is arranged. A turntable 152 that rotates around the Z axis and can move in the Z direction is provided above the adjustment table 151.

FIGS. 22 to 24 show an example of a conventional cassette 122. FIG. As shown in the plan view of FIG. 22, the left and right sides of the cassette 1 2 2 are surrounded by side walls, The front and rear sides are open, and as can be seen from the front view of FIG. 23, the front can be seen through the wafer 102 from the front. For this reason, as shown in the left side view of Fig. 24, a light source (emitter: one that is insensitive to the photoresist on the wafer 102) is placed in front of the cassette 122, and the light-receiving sensor is placed first. The presence or absence of a wafer is detected by determining whether or not the transmitted light from the light source to the light receiving sensor is blocked by the wafer in each slot where the wafer 102 is placed.

In the above configuration, for example, a cassette 122A is loaded from the opening 133A and fixed to the mounting table 121A, and the control device (not shown) sets the force based on the configuration of FIG. The presence / absence of wafer 102 in each slot in 1 22 A is detected. Then, the scalar type robot hand 147 takes out the desired wafer 102 from the cassette 122A at the position Q2, moves to the position Q3, and turns the wafer on the adjustment table 151. After being placed on one bull 152 and optically or mechanically aligned, it is transferred to a slider 1449B. The slider 1449B vacuum-adsorbs the wafer 102B and moves in the Y direction along the vertical slider main body 148. The slider 144B is moved from the slider 144B by a wafer transfer mechanism (not shown). Transfer wafer 102E onto 32. When the exposure of the wafer 102E is completed, the slider 149A receives the wafer 102D from the wafer holder 132 by the wafer transfer mechanism, sucks it in a vacuum, and moves along the vertical slider 148. Move in the Y direction and pass to scalar robot hand 1 4 7 at position Q 3. The SCARA type 1 robot hand 1447 sucks the wafer 102C into the vacuum, moves it to the position Q2, and returns it to the cassette 122A. As for the cassette, 122 B can be used in addition to 122 A. The delivery of the wafer 102 may be performed not only to the cassettes 122A and 122B but also to an external device from the opening 133C.

However, since the cassettes 122A and 122B are open type and are transported in a clean room, the cleanness of the clean room cannot be reduced. Therefore, a sealed cassette (mini-environment) that is isolated from the outside air, as shown in Figs. 25 to 27, has been proposed. As shown in the plan view of Fig. 25, the cassette 101 is surrounded by side walls and the front is openable and closable by an openable door (front door) 103. As shown, open and close With the door 103 opened, the wafer 102 can be seen from the front, but the back of the cassette 101 cannot be seen through. As shown in the left side view of FIG. 27, the door 103 can be opened, for example, by being lowered.

If the cassette 101 is transported in a clean room with the opening / closing door 103 closed, there is no problem even if the degree of cleanliness in the clean room is somewhat reduced because the wafer 102 is covered by the cassette 101.

However, when the cassette 101 is used, the presence or absence of the wafer 102 in the cassette 101 cannot be detected by the transmitted light as described above because the wafer 102 is surrounded by the side wall. Therefore, there has been a demand for a detection device capable of detecting whether or not a wafer is stored in a mini-inventory type cassette.

The present invention has been made in view of the above points, and provides a substrate detection device, a substrate detection method, and a cassette capable of detecting a substrate without being limited to a mode of a cassette for storing the substrate. The purpose is to: Disclosure of the invention

In order to achieve the above object, the invention of claim 1 is directed to a cassette (43, 101) having a storage portion (46) for a substrate (22, 102), The board detection device (49, 100) is equipped with a detection section (50, 107, 117, 120) that detects the presence or absence of the board (22, 102) on the side where the board (22, 102) is taken in and out. Thus, in the substrate detection device (49, 100) of the present invention, the detection unit (50, 107, 117, 120) allows the substrate (22, 102) to enter and exit the cassette (43, 101). Since the presence / absence is detected, the substrate (22, 101) can be detected without any problem even if the periphery of the substrate (22, 102) is surrounded by the side wall of the cassette (43, 101).

The invention according to claim 2 is characterized in that the detection unit includes a proximity sensor (50) capable of detecting the substrate (22) when approaching the substrate (22) in the storage unit (46). A substrate detection device according to claim 1, wherein said substrate detection device is (49). This allows the proximity sensor (50) to move the cassette (43) in and out of the cassette (43) in the substrate detection device (49) of the present invention. When the storage side (46) approaches the storage section (46), the substrate (22) stored in the storage section (46) can be detected.

The invention according to claim 3 is the substrate detection device (49) according to claim 2, wherein the detection section (50) is supported so as to be able to approach and separate from the storage section (46). Thus, in the board detection device (49) of the present invention, when the detection section (50) approaches the storage section (46), the board (22) in the storage section (46) is detected. Can be. In addition, in the board detecting device (49), when the detecting section (49) is separated from the storing section (46), the storing section (46) of the cassette (46) unloads the substrate (22). Can be brought in.

The invention according to claim 4 is characterized in that the detection unit is a single substrate stored in the storage unit (46).

In contrast to (22), the substrate detecting device (49) according to claim 2, comprising a pair of sensors (50, 50) capable of detecting two separated points on the peripheral edge of the substrate. Thus, in the board detection device (49) of the present invention, when the pair of sensors (50, 50) approach the storage section (46), the board detection device (49) detects the board (22) in the storage section (46). Can be. At this time, if a part of the peripheral portion of one board (22) is not stored in a predetermined position, one of the pair of sensors (50, 50) is connected to the board.

(22) is detected, and the other does not detect the substrate (22).

The invention according to claim 5 is characterized in that the cassette (43) is provided with a substrate with respect to the storage portion (46).

3. The substrate according to claim 2, further comprising: a cassette body (44) having an opening (48) through which the (22) is inserted / removed, and a lid (47) capable of opening and closing the opening (48). Detector (49). Thus, in the substrate detecting device (49) of the present invention, when the lid (47) opens the opening (48) of the cassette body (44), the detecting section (50) moves the storage section (46). Board in the storage part (46)

(22) can be detected.

The invention according to claim 6 is characterized in that the cassette (43) is provided with a holding section (45) for holding a plurality of substrates (22) in a parallel state at intervals, and the detecting section comprises a holding section (45). 3. The substrate detecting device according to claim 2, comprising a plurality of sensors corresponding to respective peripheral portions of the plurality of substrates held in the substrate detecting device. As a result, in the substrate detecting device (49) of the present invention, the plurality of sensors (50) are When approaching (45), the periphery of the substrate (22) held by the holding section (45) corresponding to each sensor (50) can be detected.

The invention according to claim 7 is characterized in that the cassette (43) is provided with a holding portion (45) for holding a plurality of substrates (22) in a parallel state at intervals, and the cassette (43) or the sensor (50) is provided. ), The sensor (50) is placed in close proximity to the storage section (46) so that the sensor (50) corresponds to each of the plurality of substrates (22) held in the holding section (45). The substrate detection device (49) according to claim 2, further comprising a drive mechanism (55, 56) for sequentially moving the substrate detection device relative to the substrate detection device. As a result, in the substrate detecting device (49) of the present invention, at least one of the cassette (43) and the sensor (50) is moved relative to the other by the drive mechanism (55, 56). Therefore, the sensor (50) corresponds to each of the plurality of boards (22) held in the holding section (45) in a state of approaching the storage section (46). Detection can be performed sequentially.

The invention of claim 8 includes an irradiation mechanism (104, 116, 118) for irradiating the inside of the cassette (101) with a light, and a light receiving mechanism for receiving reflection from the inside of the cassette (101). 107, 117, 120) and a discriminating mechanism (113) for discriminating the presence or absence of the substrate (102) based on the output from the light receiving mechanism (107, 117, 120). The substrate detection device (100) according to claim 1, wherein (120) is the detection unit. As a result, in the substrate detecting device (100) of the present invention, the light receiving mechanism (107, 117, 120) is connected to the cassette.

At the loading / unloading side of (101), the reflection from the inside of the cassette (101) is received, and the discrimination mechanism (113) determines the presence or absence of the board (102) based on the output from the light receiving mechanism (107, 117, 120). By discriminating, the board stored in the storage unit (146)

(102) can be detected.

The invention according to claim 9 is the substrate detecting device (100) according to claim 8, wherein the light receiving mechanism (107, 117, 120) is a line sensor. As a result, in the substrate detecting apparatus (100) of the present invention, the substrate can be stably provided without any movable parts.

(102) can be detected.

The invention according to claim 10 is characterized in that the light receiving mechanism (107, 1 17, 120) has an area. The substrate detecting device (100) according to claim 8, which is a sensor. Thus, the substrate detecting device (100) of the present invention can determine the position of the substrate (102) in the cassette (101) in addition to detecting the presence or absence of the substrate (102).

The invention according to claim 11 is characterized in that the irradiating mechanism (104, 1 16, 118) irradiates in a point-like manner, or the light receiving mechanism (107, 117, 120) is a point sensor. A substrate detection apparatus (100) according to claim 8. Thus, the substrate detection device (100) of the present invention can detect the presence or absence of the substrate (102) with a simple configuration.

The invention according to claim 12 is characterized in that the irradiation mechanism (104) is located at a plurality of different positions on the periphery of the substrate (102) with respect to one substrate (102) stored in the storage section (146). 9. The substrate detecting apparatus (100) according to claim 8, which is capable of irradiating light. Thus, in the substrate detection apparatus (100) of the present invention, even if the reflected light of the light irradiated assuming a certain position of the substrate (102) is not received for some reason, the substrate detection device (100) may be able to detect the position of the substrate (102). The presence or absence of the substrate (102) can be detected by receiving the reflected light of the light applied to the position.

The invention according to claim 13 is the invention according to claim 12, wherein the irradiation mechanism (104) is relatively movable with respect to one substrate (102) stored in the storage section (146). It is a substrate detection device (100). Thus, the substrate detecting device of the present invention

In (100), even if the irradiation mechanism irradiates light from one position and the reflected light is not received for some reason, the irradiation mechanism (104) moves relative to the substrate (102). Thus, light can be applied to the peripheral portion at another position of the substrate (102). Then, the presence or absence of the substrate (102) can be detected by receiving reflected light from another peripheral portion.

The invention according to claim 14 is the substrate detection device according to claim 12, wherein a plurality of irradiation mechanisms (104) and a plurality of light receiving mechanisms (107) are provided corresponding to a plurality of positions, respectively. ). Thus, in the substrate detecting apparatus (100) of the present invention, even if one of the irradiation mechanisms (104) irradiates light and the reflected light is not received for some reason, the other irradiation mechanisms (104) To receive the light Thus, the presence or absence of the substrate (102) can be detected.

The invention according to claim 15 is characterized in that the substrate (22, 102) of the cassette (43, 101) is inserted into and out of the cassette (43, 101) for storing the substrate (22, 102). This is a board detection method that detects the presence or absence of (22, 102). Thus, in the substrate detection method of the present invention, the presence or absence of a substrate is detected on the side where the substrate (22, 102) is inserted into or taken out of the cassette (43, 101). The substrate (22, 101) can be detected without any problem even if it is surrounded by the side wall of (43, 101).

The invention according to claim 16 is the substrate detection method according to claim 15, wherein the presence or absence of the substrate (22) is detected by approaching the storage part (46) of the substrate (22). Thus, in the substrate detection method of the present invention, the presence or absence of the substrate (22) is detected by approaching the storage portion (46) of the substrate (22) from the cassette (43) with respect to the substrate (22). can do.

The invention according to claim 17 is characterized in that the inside of the cassette (101) is irradiated with light, the reflection from the inside is received, and the presence or absence of the substrate (102) is detected. It is a substrate detection method described in the paragraph. As a result, in the substrate detection method of the present invention, the inside of the cassette (101) is irradiated with light from the side where the substrate (102) is put in and taken out, and the reflection from the inside is received. Presence or absence can be detected.

The invention according to claim 18 is the cassette (101) including a reference mark (109) indicating a reference position of the cassette (101). As a result, the cassette (101) of the present invention detects the fiducial mark (109), and

The reference position of (101) can be detected.

The invention according to claim 19 is the cassette (101) according to claim 18, wherein the reference mark (109) has an area having a different reflectance. As a result, in the cassette (101) of the present invention, the reference position of the cassette (101) can be detected by detecting a difference in reflectance. BRIEF DESCRIPTION OF THE FIGURES FIG. 1 is a diagram showing the first embodiment of the present invention, and is a cross-sectional view in which proximity sensors corresponding to a plurality of wafers stored in a wafer cassette are provided.

FIG. 2 is a diagram showing the first embodiment of the present invention, and is a cross-sectional plan view in which a pair of sensors are arranged in the vicinity of a peripheral portion of a wafer with a distance therebetween.

FIG. 3 is a view showing the first embodiment of the present invention, and is a plan sectional view of an exposure apparatus provided with a wafer detection apparatus.

FIG. 4 is a sectional view taken along line AA in FIG.

FIG. 5 is a view showing a second embodiment of the present invention, and is a cross-sectional view provided with a drive mechanism for vertically moving a proximity sensor with respect to a wafer cassette.

FIG. 6 is a view showing the third embodiment of the present invention, and is a cross-sectional view provided with a drive mechanism for vertically moving the wafer cassette relative to the proximity sensor.

FIG. 5 is a plan view showing a configuration of a main part of a fourth embodiment of the present invention. FIG. 8 is a left sectional view of FIG.

FIG. 9 is a front view of a fiducial mark constituting the cassette of the present invention.

FIG. 10 is a block diagram of a control device according to the fourth embodiment of the present invention. FIG. 11 is a diagram illustrating signals according to the fourth embodiment of the present invention.

FIG. 12 is a flowchart illustrating the operation of the fourth exemplary embodiment of the present invention.

FIG. 13 is a plan view showing the configuration of the main part of the fifth embodiment of the present invention. FIG. 14 is a plan view showing a configuration of a main part of the sixth embodiment of the present invention. FIG. 15 is a diagram for explaining signals according to the sixth embodiment of the present invention.

FIG. 16 is a plan view showing a configuration of a main part of the seventh embodiment of the present invention. FIG. 17 is a left sectional view of FIG.

FIG. 18 is a flowchart illustrating the operation of the seventh embodiment of the present invention.

FIG. 19 is a plan view showing a configuration of a main part of the eighth embodiment of the present invention. FIG. 20 is a left sectional view of FIG. FIG. 21 is a diagram showing a Jehachi loader system of a conventional exposure apparatus.

FIG. 22 is a plan view showing a conventional cassette.

FIG. 23 is a front view of FIG.

FIG. 24 is a left side view of FIG.

FIG. 25 is a plan view showing a cassette to which the present invention is applied.

FIG. 26 is a front view of FIG.

FIG. 27 is a left side view of FIG. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to FIG. 1 to FIG.

Here, for example, an example in which a cassette is provided in an exposure apparatus and wafers are stored in the cassette will be described.

[First Embodiment]

FIG. 3 is a plan sectional view of the exposure apparatus, and FIG. 4 is a sectional view taken along line AA in FIG. 3. In these figures, reference numeral 1 denotes an exposure apparatus.

The exposure apparatus 1 has a configuration in which independent chambers 6, 7, and 8, which are independent from each other, are sequentially arranged. As shown in FIG. 4, the independent chamber 8 is separated by a partition plate 9 into a lower chamber 8A and an upper chamber 8B. An air conditioner 10 is installed in the independent chamber 6.

Inside the air conditioner 10, an air conditioning unit (not shown) for adjusting the temperature of the air is provided. In addition, the air conditioner 10 allows the air whose temperature has been adjusted by the air conditioning unit to flow down into the independent chamber 7 via a dust removal filter 11 installed on the ceiling of the independent chamber 7 and to be independently cooled. It has the function of returning to the air conditioning unit from the return 12 installed on the floor of the chamber 7. In addition, the air conditioner 10 is also lowered into the lower chamber 8A and upper chamber 8B via the filters 13 and 14 installed on the respective ceilings. It has a function to flow and return to the air conditioning unit from returns 15 and 16 installed on the floor of each chamber 8A and 8B.

On the other hand, an exposure apparatus main body 17 is installed in the independent chamber 7. Exposure equipment The main body 17 is roughly composed of an anti-vibration table 20, a wafer stage 21, a column 23, a projection optical system 24, a reticle holder (not shown), and an illumination system (not shown). The anti-vibration table 20 is installed on the floor of the independent chamber 7 via anti-vibration pads 18 and 19. The wafer stage 21 loads a wafer (substrate) 22 placed on a vibration isolator 20 and coated with a photoresist at the time of exposure. Column 23 is set up on the vibration isolator 20. The projection optical system 24 is fixed to the middle of the column 23. The reticle holder is provided at the upper end of the column 23, on which the reticle 25 is placed.

As shown in FIG. 3, the wafer stage 21 includes a base 26, a Y stage 27, an X stage 28, a wafer holder 29, and the like. On the wafer holder 29, the wafer 22 to be exposed is held by vacuum suction. A notch called a notch is formed on the outer periphery of the wafer 22. The wafer loader 3 is placed on the wafer holder 29 so that the notch faces in a predetermined direction and the center of the wafer 22 has a predetermined positional relationship with respect to the wafer holder 29. It is set to be spoken by 0.

The wafer porter system 30 is installed in the lower chamber 8 A of the independent chamber 8. In the wafer loader system 30, a guide portion is configured by a horizontal slider main body 31 extending in the X direction and a vertical slider main body 32 extending in the Y direction. A robot hand 33 slidable in the X direction is arranged on the horizontal slider body 31. The robot hand 33 is schematically composed of an X-axis moving unit 34, a Z-axis moving unit 35, a 0-axis rotating unit 36, an R-axis rotating unit 37, and a hand unit 38. The X-axis moving section 34 is movable in the X direction along the horizontal slider body 31. The Z-axis moving unit 35 is configured to be able to expand and contract on the X-axis moving unit 34 in the Z direction perpendicular to the XY plane.

The shaft rotating unit 36 is rotatable about the center of the Z-axis moving unit 35 as an axis. The R-axis rotating unit 37 is rotatably provided at the tip of the 0-axis rotating unit 36. The hand section 38 is rotatably provided at the tip of the R-axis rotating section 37. Further, a vacuum suction part 39 is attached to the tip of the hand part 38.

Further, the hand unit 38 is rotatable in the 0 direction when the 0-axis rotating unit 36 rotates, and the rotation angles of the R-axis rotating unit 37 and the hand unit 38 are combined. Thus, the position in the radial direction (R direction) from the center of the hand portion 38 can be adjusted.

In addition, on the side of the horizontal slider body 31, there are provided the mounting tables 40 and 41 positioned with respect to the robot hand 33. A wafer cassette (cassette) 43 positioned at a predetermined position on the mounting tables 40 and 41 is placed on the mounting tables 40 and 41.

As shown in FIG. 1, the wafer cassette 43 includes a cassette body 44 whose inside is a closed space, and an opening / closing door (lid) 47. On both sides of the cassette body 44, holding shelves (holding portions) 45 are provided side by side at regular intervals in the vertical direction so as to form a pair. The holding shelf 45 forms a slot (storage portion) 46 for storing the wafer 22 by holding the peripheral portion of the wafer 22 from below. The cassette body 44 has an opening 48 through which the wafer 22 is put in and taken out of the slot 46. The opening / closing door 47 opens and closes the opening 48 independently.

On the other hand, a wafer detecting device (substrate detecting device) 49 is provided near the wafer cassette 43. The wafer detection device 49 detects the wafer 22 stored in the slot 46 of the wafer cassette 43, and has a configuration including a sensor (detection unit) 50 and a moving unit 51. Have been. As the sensor 50, a capacitive proximity sensor capable of detecting the wafer 22 when approaching the wafer 22 in the slot 46 is used.

The moving unit 51 moves the sensor 50 so that it can approach and separate from the slot 46, that is, moves the sensor 50 between the position where the wafer can be detected and the retreat position when the wafer hand is closed by the robot hand 33. Things. As shown in FIG. 2, the moving part 51 includes a rotating shaft 52 that is rotatable around an axis extending in a vertical direction, a support member 53 that is integrally attached to the rotating shaft 52, and a switching member. Section 54.

As shown in FIG. 1, a sensor 50 is supported by the support member 53 at a position corresponding to each peripheral portion of the wafer 22 held by the plurality of holding shelves 45. As shown in FIG. 2, this moving unit 51 can detect a pair of sensors 50 at two separated points on the wafer periphery with respect to one wafer 22 stored in the slot 46. Like two It is located.

Returning to FIG. 3 again, temporary placing tables 64 and 65 for temporarily placing the wafers 22 are provided beside the horizontal slider body 31. A plurality of wafer mounting pins are planted on these temporary mounting tables 64 and 65. In addition, on the side of the independent chamber 8 near the installation tables 40 and 41 and the temporary storage tables 64 and 65, openings 66, 67, and 72 for exchanging the wafer cassette 43 and the like from the outside, respectively. 68 are provided.

On the other hand, the vertical slider body 32 projects into the independent chamber 7 through an opening 69 on the side surface of the independent chamber 7 and an opening 70 on the side surface of the lower chamber 8A of the independent chamber 8. On the side surface of the vertical slider main body 32, sliders 71 and 72 each having a U-shape in plan view are slidably provided in the longitudinal direction. The sliders 71 and 72 can hold the wafer 22 by vacuum suction, respectively, and can move independently between the inside of the independent chamber 7 and the inside of the lower chamber 8A. A vertically movable movable table 73 is provided below the sliders 71 and 72 and beside the horizontal slider body 31.

On the other hand, a reticle loader system 74 is provided in the upper chamber 8 B of the independent chamber 8. In the reticle loader system 74, a guide portion is formed by the vertical slider body 77. The vertical slider body 77 protrudes into the independent chamber 7 through the opening 75 of the independent chamber 7 and the opening 76 of the upper chamber 8B. Further, sliders 78 and 79 slidable along the vertical slider main body 77 are attached to the vertical slider main body 77. A robot hand 80 is installed near the vertical slider body 77.

The robot hand 80 includes a base 81, a Z-axis moving unit 82, a Θ-axis rotating unit 83, an R-axis rotating unit 84, and a hand unit 85. The Z-axis moving unit 82 expands and contracts on the base 81 in the Z direction perpendicular to the XY plane. The Θ-axis rotating unit 83 rotates around the center of the Z-axis moving unit 82 as an axis. The R-axis rotating section 84 is rotatably provided at the tip of the 0-axis rotating section 83. The hand portion 85 is rotatably provided at the tip of the R-axis rotating portion 84. A storage shelf 86 for storing the reticle is installed near the robot hand 80. First, the operation of the wafer detecting device and the cassette of the above-described exposure device and wafer detecting device will be described below.

When the robot hand 33 carries out a predetermined wafer 22 from the wafer cassette 43 mounted on the mounting table 40, first, the wafer detecting device 49 operates to detect the wafer 22.

That is, first, the switching unit 54 shown in FIG. 2 is separated from the wafer cassette 43 (in the figure, the right switching unit 54 is counterclockwise, and the left switching unit 54 is clockwise). Moving. Accordingly, the rotating shaft 52 and the support member 53 rotate integrally around the axis of the rotating shaft 52. As a result, the sensor 50 supported by the support member 53 reaches a wafer detectable position close to the slot 46 of the wafer cassette 43. At this time, since the opening / closing door 47 is opened in advance in preparation for the unloading operation of the robot hand 33, the sensor 50 moves from the opening 48 of the cassette body 44 to the vicinity of the slot 46 of the closed space 42. Can be reached without hindrance.

Then, among the plurality of sensors 50, the sensor 50 corresponding to the slot 46 of the wafer 22 to be carried out detects the wafer 22. That is, since the sensor 50 is a proximity sensor, the wafer 22 can be detected if the wafer 22 is stored in the predetermined slot 46 while being held by the holding shelf 45. If the wafer 22 is not stored in the scot 46, the sensor 50 detects an abnormal state, issues an alarm, and stops the unloading operation by the robot hand 33.

When the sensor 50 detects that the wafer 22 is stored in the slot 46 as specified, the switching unit 54 approaches the wafer cassette 43 (the right switching unit 5 in the drawing). 4 moves clockwise, and the left switching section 54 moves counterclockwise). Along with this, the rotating shaft 52 and the support member 53 rotate integrally around the axis of the rotating shaft 52. As a result, the sensor 50 supported by the support member 53 is separated from the slot 46 of the wafer force set 43 and reaches the retreat position when loading the wafer. Thereafter, the robot hand 33 unloads the wafer 22 stored in the slot 46 from the opening 48.

On the other hand, when the wafer 22 is loaded into the slot 46 of the wafer cassette 43, similarly to the above-described unloading, first, the wafer detection device 49 is operated to set the predetermined slot to be loaded. Detects that wafers are not stored in lot 46. When another wafer is stored in the slot 46, the sensor 50 issues an alarm and stops the loading operation by the robot hand 33 as described above. When the sensor 50 detects that the wafer 22 is not stored in the slot 46 as specified, the wafer 50 is moved to the evacuation position when loading the wafer, and then the wafer 22 is moved to the slot. 4 Stored in 6.

Next, the operation of the exposure apparatus 1 will be described.

After the robot hand 33 takes out the wafer 22 from the wafer cassette 43 positioned on the mounting table 40, the robot hand 33 moves to the position Q and moves to the slider 71 or 72 via the evening table 73. Pass wafer 2 2. The sliders 71 and 72 are loaded onto the wafer holder 29 of the wafer stage 21 so as to be at predetermined positions while holding the wafer 22 by vacuum suction.

The wafer 22 held by the vacuum suction of the wafer holder 29 exposes the image of the pattern of the reticle 25 to the wafer 22 via the projection optical system 24 by light rays from the illumination system. The exposed wafer 22 is loaded again by the slider 71 or 72 and transferred to the robot hand 33 via the vertical movement of the turntable 73. Then, the robot hand 33 returns the wafer 22 to, for example, the wafer cassette 43.

On the other hand, when the reticle 25 is set, the hand unit 85 of the robot hand 80 takes out the reticle 25 from the storage shelf 86 by vacuum suction and attaches the taken reticle 25 to the vertical slider body 77. Pass to slider 78 or 79. Thereafter, the slider 78 or 79 moves into the independent chamber 7 along the vertical slider main body 77 while holding the reticle 25 by vacuum suction, and moves through the reticle transfer means (not shown) to the exposure apparatus main body. Place the reticle 25 on the reticle holder on column 23 of 17.

When the reticle 25 is replaced, the reticle 25 is taken out of the reticle holder and returned to the storage shelf 86 via the slider 78 or 79 and the robot hand 80. The replacement is completed by installing a new reticle on the reticle holder by the same operation as described above. In the substrate detecting apparatus and the substrate detecting method of the present embodiment, since the proximity sensor for detecting the wafer 22 when approaching the wafer 22 is used as the wafer detection sensor 50, the sensor is affected by disturbance. Thus, the wafer 22 can be detected without fail. The detection of the wafer 22 is performed by moving the sensor 50 closer to the slot 46 from the opening 48 on the side of the wafer 22 in the cassette main body 44. It can also handle wafer cassettes with no open facing surface.

In the substrate detecting device and the substrate detecting method according to the present embodiment, since the sensor 50 can be moved between the position where the wafer can be detected by the moving portion 51 and the retracted position when loading the wafer, the wafer can be moved by the robot hand 33. There is no hindrance to the transport of 22. In addition, since the sensors 50 are provided corresponding to the wafers 22 held on the plurality of holding shelves 45, each of the slots 46 can be easily rotated around the axis of the rotating shaft 52. Wafers 22 can be detected, and all wafers can be detected at once.

Further, in the substrate detecting apparatus and the substrate detecting method of the present embodiment, the sensor 50 can detect two separated points on the periphery of one wafer 22 stored in the slot 46. For example, one side of one wafer 22 is held by a predetermined holding shelf 45, and the other side is held by a holding shelf 45 shifted one step from a predetermined position. One of the pair of sensors 50 can detect an abnormal state of the wafer 22 even when the wafer 22 is stored in the inclined state.

In the exposure apparatus 1 having the wafer detection device 49, the wafer 22 can be reliably loaded and unloaded from the wafer cassette 43 by the robot hand 33. Therefore, the wafer cassette 43 and the robot hand 33 Can be prevented from being damaged during transportation.

[Second embodiment]

FIG. 5 is a diagram showing a second embodiment of the present invention.

In this figure, the same elements as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof will be omitted.

The difference between the second embodiment and the first embodiment is that This is the configuration of 49.

That is, the wafer detection device 49 is configured to include the sensor 50 and the moving unit 51. The moving unit 51 includes a rotating shaft 52, a support member 57, a switching unit 54, and a driving mechanism 55. The support member 57 supports one sensor 50. The drive mechanism 55 drives the sensor 50 via a support member 57 so that the sensor 50 approaches each of the plurality of wafers 22 held on the holding shelf 45 while approaching the slot 46. This is to sequentially move the wafer cassette 43 relative to the wafer cassette 43 in the vertical direction. Other configurations are the same as those in the first embodiment.

In the wafer detection apparatus having the above-described configuration, the operation of the drive mechanism 55 causes the plurality of wafers 22 held on the holding shelf 45 while the sensor 50 approaches the slot 46 via the support member 57. The wafer 22 can be sequentially detected by moving up and down so as to correspond to.

In the substrate detecting device and the substrate detecting method according to the present embodiment, in addition to obtaining the same effects as those of the first embodiment, it is not necessary to use many expensive sensors, so that the cost can be reduced. Can be. Further, unlike the case where a plurality of sensors 50 are used, it is not necessary to position the pitch between the sensors 50 and the pitch between the holding shelves 45 with high accuracy, so that the working efficiency is improved.

[Third Embodiment]

FIG. 6 is a diagram showing a third embodiment of the present invention.

In this figure, the same elements as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof will be omitted. The difference between the third embodiment and the first embodiment is the configuration of the wafer detecting device 49.

That is, the wafer detection device 49 is configured to include the sensor 50, the moving unit 51, and the driving mechanism 56. The drive mechanism 56 moves the wafer cassette 43 up and down with respect to the sensor 50 so that the sensor 50 approaches each of the plurality of wafers 22 held on the holding shelf 45 with the sensor 50 approaching the slot 46. It is to make relative movement sequentially in the direction. Other configurations are the same as those in the first embodiment.

In the wafer detection device having the above-described configuration, the drive mechanism 56 operates the sensor 50 to support the plurality of wafers 22 held on the holding shelf 45 while approaching the slot 46. By moving the wafer cassette 43 vertically in such a manner, the sensor 50 can sequentially detect the wafers 22.

In the substrate detecting device and the substrate detecting method according to the present embodiment, in addition to obtaining the same effects as those of the first embodiment, the cost can be reduced since it is not necessary to use many expensive sensors. be able to. Further, unlike the case where a plurality of sensors 50 are used, it is not necessary to position the pitch between the sensors 50 and the pitch between the holding shelves 45 with high accuracy, so that the working efficiency is improved.

[Fourth embodiment]

FIG. 7 to FIG. 9 are schematic views of a main part of a fourth embodiment of the present invention. As the cassette (mini-environment) 101, the one shown in FIGS. 25 to 27 is used. In these figures, reference numeral 100 denotes a wafer detection device (substrate detection device). The wafer detection device 100 is roughly equivalent to the light source (irradiation mechanism) 104, mirror 105, lens 106, and CCD (light receiving mechanism) 107, which is the detection unit for the wafer (substrate) 102. It is configured. As shown in the plan view of Fig. 7, the front door (lid) 103 (shown in Fig. 27) is open. The light source 104 and the mirror 1 Place 0 5 As the light source 104, a light source that is insensitive to the photo resist on the wafer 102, for example, a single wavelength light source such as an infrared laser is desirable. The mirror 105 secures an optical working distance, and guides the reflected light from the wafer 102 in each slot to the CCD 107 via the lens 106. . Although not shown, it is desirable to provide a shielding plate so that light from the light source 104 does not directly enter the CCD 107. The left cross-sectional view of FIG. 8 shows a drawing in which the mirror 105 is omitted and optically expanded. In this embodiment, the CCD 107 is a line sensor that detects reflected light from a linear area covering the cassette 101 from the top to the bottom and a mounting table 108 for fixing the cassette 101. It is. As shown in FIG. 9, the mounting table 1108 has a reference mark 109 in the form of sandwiching the low reflectance area 109b between the high reflectance areas 109a and 109c. The reference position information for each slot position is given by the reflected light from the reference mark 109. It is desirable that the reference mark 109 be partially colored on the aluminum coating so as not to reduce the cleanliness of the clean room. What is necessary is just to have a different area and to indicate the reference position of the cassette 101, and it is not limited to the above.

FIG. 10 is a block diagram of a control device that processes a signal output from the CCD 107. The output of the CCD 107 is reduced in noise by a correlated double sampling (CDS) circuit 110, converted from an analog signal to a digital signal by an AZD converter 111, and stored in a memory 112. The CPU (determination mechanism) 113 determines the presence or absence of the wafer 102 in each slot based on the data stored in the memory 112. The operation timing of these CCD 107, correlated double sampling (CDS) circuit 110, AZD converter 111, memory 112 and CPU 113 is controlled by a timing signal from timing circuit 114.

FIG. 11 shows an example of the output signal of the CCD 107. The horizontal axis indicates the number of pixels (time) of the CCD 107, and the vertical axis indicates the magnitude of the output signal of the CCD 107. Assuming that the CCD 107 is arranged to scan from the bottom to the top, first, a signal corresponding to the reference mark 109 is received, and a portion a having a large reflectivity and a portion b having a small reflectivity appear. With the position corresponding to the number of pixels (time) as the reference position, the signal c is received at the position after the number of pixels (time) t1 corresponding to the offset distance to the bottom slot, and that slot is received. The presence of the wafer 102 can be detected. Thereafter, by determining the presence or absence of the signal c at the position of the number of pixels (time) t2 corresponding to the distance between the slots, the presence or absence of the wafer 102 in each slot can be determined. The distance between the slots is defined by the standard, and the offset distance is derived from the distance between the slots.

FIG. 12 is a flowchart for explaining the operation of searching for the wafer 102 in the cassette 101. First, in step S1, the cassette 101 is placed on the mounting table 108 and fixed. At this time, set the dip switch on the circuit board (both not shown) or set the distance between slots and the number of slots by software parameter setting. , 10 mm, 14 inches, 316 inches, etc., and examples of the number of slot stages include 26 stages, 25 stages, 13 stages, etc.). Next, the front door 103 is opened (step S2), the light source 104 for wafer detection is turned on (step S3), and the output of the CCD 107 as a line sensor is output. Is stored in the memory 111 (step S4). In step S5, the reference mark 109 is detected by detecting a pattern of large and small dogs having a signal amplitude corresponding to the pattern of large and small dogs with the reflectance of the reference mark 109 from the stored output of the CCD 107. Then, using that position as a reference position, the presence or absence of the wafer 102 is detected (step S6). It is determined whether or not the slot is the last slot (step S7). If N〇 is not the last slot, the process returns to step S6. If YES, the process proceeds to step S8 if the slot is final. To end the wafer search process and end this flow.

In this embodiment, if a CCD 107 having a length equal to or longer than the cassette 101 is used in proximity to the cassette 101, the mirror 105 and the lens 106 are not necessarily required. .

[Fifth Embodiment]

FIG. 13 is a diagram showing a fifth embodiment of the present invention.

In this figure, the same components as those of the fourth embodiment shown in FIGS. 7 to 12 are denoted by the same reference numerals, and description thereof will be omitted.

The difference between the fifth embodiment and the fourth embodiment is the configuration of the wafer detection apparatus 100. As shown in FIG. 13, the wafer detection device 100 rotates between the reference position K 1 shown by the two-dot chain line and the position K 2 shown by the solid line in the figure with the center of the wafer 102 as the rotation axis. It has a possible configuration. The position K2 is set according to the size of the notch (or orientation flat) of the wafer 102. Specifically, even when the light interferes with the notch (or orientation flat) when the light is irradiated at the reference position K1, the position K2 is set at a place where the light does not interfere with the notch.

Other configurations are the same as those of the fourth embodiment.

In the substrate detecting device and the cassette having the above configuration, first, the wafer detecting device 100 located at the reference position K1 irradiates light into the cassette 101 and receives reflected light. Here, as shown in FIG. 13, when the amount of reflected light received is equal to or less than a threshold value, for example, because the irradiated light interferes with the notch of the wafer 102, the wafer detection device 100 Rotate from reference position K1 to position K2. During this time, if the amount of reflected light exceeds the threshold value, the wafer detection device 100 detects that the wafer 102 is stored, and the amount of reflected light increases the threshold value during movement. If not, wafer 1 0 2 Is not stored.

In the substrate detecting apparatus, the substrate detecting method, and the cassette according to the present embodiment, the same operation and effect as those of the fourth embodiment can be obtained, and the notch (or the orientation flat) formed on the wafer 102 can be obtained. ) Can reliably detect the presence or absence of the wafer 102 even if the reflected light interferes with the light emitted from the light source 104 and a sufficient amount of reflected light cannot be obtained.

[Sixth embodiment]

FIG. 14 and FIG. 15 are diagrams showing a sixth embodiment of the present invention.

In these drawings, the same elements as those of the fourth embodiment shown in FIGS. 7 to 12 are denoted by the same reference numerals, and description thereof will be omitted.

The difference between the sixth embodiment and the fourth embodiment is the configuration of the wafer detection apparatus 100. As shown in FIG. 14, the wafer detection device 100 irradiates the inside of the cassette 101 with light at two places, and separates the position P 1 from each other so that each reflected light can be received. And P 2 are located at the place of good. Other configurations are the same as those of the fourth embodiment.

In the substrate detection device and the cassette having the above configuration, for example, as shown in FIG. 14, the wafer detection device 100 at the position P1 irradiates the notch of the wafer 102 with light, and Even if the reflected light cannot be received, the wafer detector 100 at the position P2 receives a sufficient amount of reflected light from the wafer 102, so it is necessary to reliably detect the presence of the wafer 102. Can be. Further, as shown in FIG. 15, when the signals m 1 and m 1 are detected at different positions between the slots 144 at the wafer detection device 100 force positions P 1 and P 2, the wafer 10 2 Can be detected as being stored at an angle. Similarly, when the wafer detection device 100 detects signals m 2 and m 2 having a larger number of pixels than the predetermined value at both the positions P l and P 2, the wafers 100 have the same slot. It can be detected that they are stored in a state where they overlap with 1 4 6.

In the substrate detecting apparatus, the substrate detecting method, and the cassette according to the present embodiment, the same operation and effect as those of the fourth embodiment are obtained, and in addition, the light radiated from the light source 104 is applied to the wafer 100. The wafer 102 can be reliably detected even if it interferes with the notch 2 (or orientation flat). The abnormalities stored in the state of being held can also be reliably detected.

The light source (irradiation mechanism) 104 of each wafer detection mechanism 100 located at the position P1 and the position P2 is shared, and the light emitted from one light source 104 is divided into two. Irradiation may be performed at two different points on the periphery of the wafer 102. In this case, each wafer detection mechanism 10 is associated with the expected optical path of the reflected light from the wafer 102.

It is only necessary to determine the arrangement of the 0 mirror 105, the lens 106 and the CCD (light receiving mechanism) 107.

[Seventh Embodiment]

FIG. 16 to FIG. 18 are diagrams showing a seventh embodiment of the present invention.

The seventh embodiment and the fourth embodiment described above are point illumination (irradiation mechanism) 116 in which a light source substantially illuminates a point region, and a sensor is also substantially in a point region. A point sensor (light receiving mechanism) 1 17 as a detection unit that detects the reflected light of These point illumination 1 16 and point sensor 1 17 can be configured using fibers. As shown in Fig. 16, when wafer 102 is present in slot 146, light from point illumination 1 16 is reflected at the edge of wafer 102 and detected by point sensor 1 17 The point illumination 1 16 and the point sensor 1 17 are arranged at positions where they can be made. Then, as shown in FIG. 17, the point illumination 1 16 and the point sensor 1 17 move up and down integrally with each other to detect the presence or absence of the wafer 102 in each slot.

FIG. 18 is a flowchart for explaining the operation of searching for the wafer 102 in the cassette 101 by the wafer detection device 100. First, in step S11, the cassette 101 is placed on the installation table 108 and fixed. At this time, set the dip switch on the circuit board, or set the distance between slots and the number of slot stages by setting parameters by software. Next, open the front door 103 (step S12), turn on the point illumination 1 16 for wafer detection (step S13), and move the point sensor 1 17 together with the point illumination 1 16 Then, the output of the point sensor 1 17 is stored in the memory 1 12 (step S 14). In step S15, from the stored output of the point sensor 117, the signal amplitude of the signal corresponding to the pattern of the reflectance of the reference mark 109 is determined. The reference mark 109 is detected by detecting a large or small pattern, and the presence or absence of the wafer 102 is detected using that position as a reference position (step S16). Point sensor 1

It is determined whether or not 17 has moved to the final slot (step S17). If N〇 has not been reached, the process returns to step S16. If YES has been reached, the process proceeds to step S18. To end the wafer search process and end this flow. In the seventh embodiment, instead of moving the point illumination 1 16 and the point sensor 1 17 up and down, the pointing direction may be rotated.

108 may be moved up and down.

[Eighth Embodiment]

FIG. 19 and FIG. 20 are views showing an eighth embodiment of the present invention.

The seventh embodiment is different from the fourth embodiment in that the sensor is a detection unit that captures an image of the front surface of the cassette 101 including the installation table 108 via the lens 119. The difference is that the rear sensor (light receiving mechanism) 120 is used, and the light source is a light source (irradiation mechanism) 118 that illuminates the area imaged by the area sensor 120. In this embodiment, there are few restrictions on the arrangement of the light source 118 and the area sensor 120, and the wafer 102 of each slot 146 can be imaged by the area sensor 120. If possible, it can be anywhere in the center of the cassette 101 in the upper, lower, left and right directions. Further, when imaging from above or below, the outer periphery of the wafer 102 can be imaged. Therefore, by calculating the center position of the wafer 102 from the video signal of the outer periphery of the wafer 102, it is possible to simply calculate Not only can the presence or absence of the wafer 102 be detected, but also the mounting position of the existing wafer 102 can be detected. Therefore, even if the position of the wafer 102 moves when the cassette 101 is transported, the position of the wafer 102 is detected after the cassette 101 is fixed to the installation table 108, and then the cassette is detected. When taking out the wafer 102 from 101, the scalar robot hand 147 can be more appropriately controlled.

The substrate detecting device, the substrate detecting method, and the cassette according to the present invention are not limited to the above embodiment, but include those with the following changes. (1) An ultrasonic or optical proximity sensor instead of a capacitance type.

(2) Applied to cassettes that store reticles or glass substrates used in liquid crystal displays.

(3) A cassette provided outside the exposure apparatus, for example, near the opening 68 in FIG.

(4) Used not for the exposure equipment but for the coating of photoresist on the wafer, the development equipment (developer) that develops the wafer exposed by the exposure equipment, and the equipment that transfers substrates between cassettes. Applied to cassettes.

(5) The sensor does not detect the board every time the board is transported by the robot hand, but detects all the storage units in the cassette when the cassette is installed, and based on the detection result, the robot hand detects the board. That transports

(6) In the second embodiment, when the robot hand conveys a substrate, the sensor is retracted not by the rotating operation of the moving unit but by the vertical movement of the sensor by the driving mechanism.

(7) A drive mechanism that moves both the wafer cassette and the sensor relatively up and down.

(8) In addition to the sealed cassette 101, the cassette may be an open type. Even in this case, since the irradiation mechanism and the light receiving mechanism are arranged in one direction with respect to the cassette, the degree of freedom in design is increased.

(9) The wafer 102, which is a substrate, may or may not be coated with a resist. When judging the presence or absence of a wafer 102 not coated with a resist, the reticle does not require a light source that is not photosensitive.

(10) The fiducial mark 109 may be placed on the upper or lower part of the cassette other than the mounting table 108. Even if the reference mark 109 is not used, the position of each slot can be identified by increasing the accuracy of the position where the light receiving mechanism is placed. In addition, the position of each slot can be identified by calibrating the positional relationship between the light receiving mechanism and each slot.

Substrates include not only semiconductor wafers for semiconductor devices, but also glass substrates for liquid crystal display devices and ceramic wafers for thin-film magnetic heads. Alternatively, an original mask or reticle used in an exposure apparatus (synthetic quartz, silicon wafer) or the like is applied.

An exposure apparatus that exposes a reticle pattern while the reticle (mask) and wafer are at rest and sequentially moves the wafer in steps is a step-and-repeat type exposure apparatus (stepper). The present invention can also be applied to a step-and-scan type scanning projection exposure apparatus (scanning stepper) that synchronously moves a substrate and exposes a reticle pattern.

The types of exposure equipment include not only the above-mentioned semiconductor manufacturing equipment, but also exposure equipment for manufacturing liquid crystal display devices, exposure equipment for manufacturing thin-film magnetic heads, imaging devices (CCD), masks, reticles, etc. Is also widely applicable.

In addition, KrF excimer laser (248 nm), ArF excimer laser (193 nm), ?? _Two lasers (1571111), X-rays and the like can be used. Alternatively, a high frequency such as a YAG laser or a semiconductor laser may be used.

The magnification of the projection optical system may be any of a reduction system, an equal magnification, and an enlargement system. As the projecting projection optical system, using a material which transmits far ultraviolet rays such as quartz Ya fluorite as the glass material when using far ultraviolet rays such as excimer one The, in the case of using the F ₂ laser reflection refraction system or Use a refractive optical system.

When a linear motor is used for the wafer stage and the reticle stage, either an air levitation type using an air bearing or a magnetic levitation type using Lorentz force or reactance force may be used. Further, each stage may be a type that moves along a guide, or may be a guideless type in which a guide is not provided.

The reaction force generated by the movement of the wafer stage may be mechanically released to the floor (ground) using a frame member. The reaction force generated by the movement of the reticle stage may be mechanically released to the floor (ground) using a frame member.

The illumination optical system and the projection optical system composed of a plurality of optical elements are incorporated into the exposure apparatus main body, respectively, and optical adjustment is performed.A reticle stage and a wafer stage, which are composed of many mechanical parts, are attached to the exposure apparatus main body. By connecting wires and pipes and making comprehensive adjustments (electrical adjustment, operation confirmation, etc.), the exposure equipment of this embodiment can be used. Device can be manufactured. It is desirable to manufacture the exposure apparatus in a clean room where the temperature, cleanliness, etc. are controlled.

For devices such as semiconductor devices and liquid crystal display elements, the steps of designing the function and performance of each device, the steps of manufacturing a reticle based on this design step, the steps of manufacturing wafers, glass substrates, etc. It is manufactured through the steps of exposing a reticle pattern to a wafer and a glass substrate using a lithographic exposure apparatus, assembling each device, and inspecting. Industrial applicability

The present invention relates to a cassette for storing a substrate such as a wafer therein, a substrate detection device for detecting a substrate stored in the cassette, and a substrate detection method.

According to the substrate detection device of the present invention, the detection unit can detect the presence or absence of the substrate in the cassette without contacting the substrate on the substrate insertion / removal side with respect to the cassette. When the body is opened, the presence or absence of the substrate can be detected. In addition, when a proximity sensor is used for the detection unit, the sensor is supported so as to be able to approach and separate from the storage unit, so that the sensor does not hinder the transfer of the substrate when taking the substrate in and out of the cassette. Can be prevented. Furthermore, since the sensor consists of a pair of sensors that detect two separate points with respect to one board stored in the storage unit, one board may be incomplete with respect to the storage unit. Even if it is stored, this abnormal state can be detected. Since the above-mentioned cassette includes a cassette body having an opening and a lid that allows the opening to be opened and closed, when the lid is opened even when the cassette is closed tightly, the opening is formed. The sensor can be moved closer to the substrate in the storage unit to detect the substrate, and when the lid is closed, the inside of the cassette body is sealed and dust can be prevented from entering. Further, the cassette is provided with a holding unit for holding the substrates in a parallel state, and the sensors are configured by a plurality of sensors corresponding to the held substrates. Can be detected every time. Further, a holding portion for holding the substrates in a cassette in a parallel state is provided, and at least one of the cassette and the sensor is provided with a drive mechanism for sequentially moving the sensor relative to the other, so that an expensive sensor can be used. Many Since it is not necessary to use several sensors, it is possible to reduce the cost, and it is not necessary to determine the pitch between the sensors and the pitch between the holding parts with high accuracy as in the case of using a plurality of sensors. , Work efficiency can be improved.

On the other hand, in the substrate detection device of the present invention, by using the detection unit as an area sensor, it can be arranged anywhere in the front, bottom, left, right, and center of the cassette. In addition, when imaging from above or below, the outer periphery of the substrate can be imaged, so that not only the presence or absence of the substrate can be detected, but also the mounting position of the existing substrate can be detected. . Therefore, even if the position of the substrate moves when the cassette is transported, the position of the substrate is detected after fixing the cassette to the installation table, and the scalar robot hand is more often used when removing the substrate from the cassette. Can be properly controlled.

In addition, the irradiation mechanism is configured to be able to irradiate light to multiple positions on the substrate, such as by making the irradiation mechanism relatively movable with respect to the substrate and providing multiple irradiation mechanisms corresponding to multiple positions on the substrate. In this way, even if notch (or orientation flat) formed on the substrate does not provide a sufficient amount of reflected light, the irradiation mechanism moves relative to the substrate to irradiate light or perform other irradiation. By receiving the reflection of the light emitted by the mechanism, it is possible to reliably detect the presence or absence of the substrate and that the substrate is stored in an inclined state or a plurality of overlapping states.

Further, in the substrate detection method of the present invention, the presence or absence of the substrate in the cassette can be detected without contacting the substrate on the side where the substrate is taken in and out of the cassette, so that even if a sealed force set is used, the lid can be used. When the body is opened, the presence or absence of the substrate can be detected. In the cassette of the present invention, the position of the substrate with respect to the force set can be recognized by detecting the reference mark of the cassette.

Claims

The scope of the claims

1. A substrate detecting device, comprising: a detecting unit for detecting the presence or absence of a substrate on a cassette loading / unloading side of the cassette having a substrate storing unit.

2. The substrate detection device according to claim 1, wherein a proximity sensor capable of detecting the substrate when approaching the substrate in the storage unit is used as the detection unit.

3. The substrate detection device according to claim 2, wherein the detection unit is supported so as to be able to approach and separate from the storage unit.

4. The detection unit comprises a pair of sensors capable of detecting two spaced apart peripheral portions of the substrate with respect to one substrate stored in the storage unit. The substrate detection device according to any one of the preceding claims.

5. The cassette according to claim 2, wherein the cassette includes a cassette body having an opening through which a substrate is inserted into and taken out of the storage unit, and a lid that allows the opening to be opened and closed. The substrate detection device according to any one of the preceding claims.

6. The cassette is provided with a holding unit for holding a plurality of substrates in parallel at intervals.

3. The substrate detection device according to claim 2, wherein the detection unit includes a plurality of sensors corresponding to respective peripheral portions of the plurality of substrates held by the holding unit.

7. The cassette is provided with a holding unit for holding a plurality of substrates in parallel at intervals.

At least one of the cassette and the sensor is provided so that the sensor corresponds to each of a plurality of substrates held by the holding unit in a state of approaching the storage unit. 3. The substrate detecting device according to claim 2, wherein a driving mechanism for sequentially moving the one relative to the other is provided.

8. An irradiation mechanism for irradiating the inside of the cassette with light,

A light receiving mechanism for receiving reflection from the inside of the cassette,

A determining mechanism for determining the presence or absence of the substrate based on an output from the light receiving mechanism,

2. The substrate detection device according to claim 1, wherein the light receiving mechanism is the detection unit.

9. The substrate detecting device according to claim 8, wherein the light receiving mechanism is a line sensor.

10. The substrate detecting apparatus according to claim 8, wherein the light receiving mechanism is an area sensor.

11. The substrate detecting apparatus according to claim 8, wherein the irradiation mechanism irradiates in a point-like manner, or the light receiving mechanism is a point sensor.

12. The irradiation mechanism is capable of irradiating a plurality of different positions on a peripheral portion of the substrate with respect to one substrate stored in the storage section, the light being radiated. Item 8. The substrate detection device according to item 8.

13. The substrate detecting apparatus according to claim 12, wherein the irradiation mechanism is capable of relatively moving with respect to one substrate stored in the storage unit.

14. The substrate detecting apparatus according to claim 12, wherein a plurality of the irradiation mechanisms and the plurality of light receiving mechanisms are provided corresponding to the plurality of positions, respectively.

15. A substrate detection method, comprising: detecting the presence or absence of a substrate in a cassette for storing the substrate on a side of the cassette in and out of the cassette.

16. The substrate detecting method according to claim 15, wherein the presence or absence of the substrate is detected by approaching a storage part of the substrate.

17. The substrate detecting method according to claim 15, wherein light is applied to the inside of the cassette, and the presence or absence of the substrate is detected by receiving reflection from the inside.

18. In the cassette that stores the substrates,

A cassette comprising a reference mark indicating a reference position of the cassette.

19. The cassette according to claim 18, wherein the reference mark has an area having a different reflectance.