+

WO1998005000A1 - Carte a puce pourvue d'une zone de contact, et procede de production d'une telle zone de contact - Google Patents

Carte a puce pourvue d'une zone de contact, et procede de production d'une telle zone de contact Download PDF

Info

Publication number
WO1998005000A1
WO1998005000A1 PCT/DE1997/001541 DE9701541W WO9805000A1 WO 1998005000 A1 WO1998005000 A1 WO 1998005000A1 DE 9701541 W DE9701541 W DE 9701541W WO 9805000 A1 WO9805000 A1 WO 9805000A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
conductive layer
contact zone
contact
chip card
Prior art date
Application number
PCT/DE1997/001541
Other languages
German (de)
English (en)
Inventor
Michael Huber
Peter Stampka
Josef Heitzer
Detlef Houdeau
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1998005000A1 publication Critical patent/WO1998005000A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00—Processes for producing special ornamental bodies

Definitions

  • Chip card with a contact zone and method for producing such a contact zone
  • the invention relates to a chip card with a card carrier containing an integrated circuit, on the at least one main surface of which a contact zone with a plurality of mutually spaced metallic contacts, which are electrically connected to the integrated circuit, is arranged, and to a method for producing such a contact zone.
  • Chip cards have been known for a long time and are e.g. used in public telephone systems, as an identification card or the like on a large scale. In the meantime there are standards that define the dimensions and technical details of such chip cards. These standards are, for example, ISO 7810 and ISO 7816.
  • the chip cards with an integrated circuit which is integrated in a card carrier, have a contact zone which provides a total of eight contacts in accordance with the standards mentioned.
  • the arrangement of these contact areas on the chip card is clearly defined by the standards mentioned.
  • the contact zones of the card modules currently consist of suitable metallic functional surfaces, which are made of AU, NiPdAg or the like, for example.
  • the individual contact areas of the contacts are realized by separation channels, which are formed, for example, by corresponding etching structures.
  • the outer design of the contact zone is determined by the geometry of the etching contours taking into account the ISO standards mentioned.
  • chip card module manufacturers generally deliver the same modules, ie the same contact zones with connected integrated circuits, to customers.
  • a distinction between the individual chip card modules according to their manufacturer is only possible if their contact zones are designed differently. If the contact zones of different manufacturers are of identical design, it will no longer be possible to determine from which chip card module manufacturer the chip card modules originate on the basis of a chip card that will be manufactured later with an inserted chip card module, ie contact zone and integrated circuit.
  • the invention is based on the object of specifying a chip card with a contact zone which serves not only as a functional area but also as an information carrier.
  • the metallic contacts are at least partially provided with an electrically conductive layer, the electrically conductive layer being arranged on the contact zone in a short-circuit-free manner with respect to the contacts and having a difference from the contacts Coloration.
  • the method for producing a contact zone for a chip card according to the invention has the following method steps:
  • this further layer serves as a protective layer and is also electrically conductive.
  • This protective layer is advantageously designed to be transparent or at least largely transparent so that the underlying, arbitrarily colored, electrically conductive layer remains recognizable for the user of the chip card.
  • the electrically conductive layer is colored so that there is a clear contrast to the underlying metallic layer of the contact surfaces. This makes it possible, for example, to apply a company logo or the like to the contact zone of the chip card with the aid of the electrically conductive layer.
  • the contact zone of the chip card can thus serve as an information carrier which, for example, indicates from which chip manufacturer the chip card module comes.
  • the layer applied to the contact areas of the contact zone and any protective layer applied thereover are designed to be electrically conductive, so that when the chip card is used, i. when the chip card is inserted into a chip card reader, perfect contact at the contact surfaces is still guaranteed. It is therefore important to ensure that the electrically conductive layer and any electrically conductive protective layer applied over it have the lowest possible electrical surface resistance.
  • the electrically conductive layer and electrically conductive protective layer which have an electrical surface resistance of 40 ⁇ / 2.
  • the layer thickness of such a layer can be, for example, approximately 10 ⁇ m.
  • the electrically conductive layer and the possibly overlying electrically conductive protective layer can be applied, for example, by means of a tampon printing process, spraying on, rolling on, stamping on, a screen printing process or the like.
  • electrically conductive layer or electrically conductive protective layer are essentially as follows:
  • the protective layer should have a high hardness or a high wear resistance
  • the electrically conductive layer and the electrically conductive protective layer have the lowest possible surface resistance and thus a high conductivity.
  • the electrically conductive layer or the electrically conductive protective layer consists of a plurality of separate layer elements, each layer element being arranged within a contact area of the respective contact.
  • the contact surfaces of the contacts are arranged electrically separated from one another by separating channels and that the electrically conductive layer and the possibly overlying electrically conductive protective layer above the separating channels is interrupted.
  • the electrically conductive layer and the electrically conductive protective layer can e.g. a carbon paint or the like.
  • Figure 1 A perspective view of a chip card with a contact zone according to the invention.
  • Figure 2 An embodiment of a conventional contact zone for a chip card.
  • Figure 3 The top view of the contact zone of Figure 2 with additionally applied, electrically conductive layer to represent a company logo.
  • Figure 4 A section through the contact zone of Figure 3 along the section line IV-IV.
  • FIG. 5 An insulating mask for applying the electrically conductive protective layer to the contact zone according to FIGS. 3 and 4.
  • Figure 6 An exemplary mask for applying the company logo according to Figure 3 on the contact zone.
  • Figure 7 A possible insulating mask for applying a protective layer on the contact zone of Figure 3.
  • FIG. 1 a known smart card is shown in perspective.
  • the chip card has a card carrier 3, for example made of plastic, which has a credit card format.
  • the chip card is identified by reference number 1.
  • An approximately square-shaped contact zone 5, which has eight contacts, is arranged on the main surface of the card carrier 3 facing the viewer.
  • An electrically conductive layer 11 is partially applied to the contact zone 5, which serves as a display area in order to convey a certain meaning to the viewer of the contact zone, depending on the type and design of the electrically conductive layer.
  • FIG. 2 shows a conventional contact zone for a chip card in an enlarged representation and a top view.
  • the contact zone 5 has a total of eight contacts which are electrically separated from one another by separation channels 9.
  • the generally square contact zone 5 has at its lower edge four adjacent, also square contact surfaces 7, which are separated from one another by separation channels 9.
  • Four contact surfaces of four contacts 7, which are separated from one another by separating channels 9, are likewise arranged at the upper edge of the contact zone 5, the contact 7 on the far left extending in an I-shape into the center of the contact zone 5.
  • an electrically conductive layer 11 is applied to this contact zone 5, which is designed with a different color compared to the contact zone 5. If the contact zone 5 according to FIG. 2 consists of brass or copper or is gold-plated, the electrically conductive layer can be chosen to be blue, green or similar, so that a good contrast between the electrically conductive layer 11 and the contact zone 5 underneath is ensured.
  • colors such as white or red are also possible, a carbon lacquer advantageously being doped with color pigments.
  • Ti0 2 can be chosen for white and purple for red and thus a particularly inexpensive coloring can be obtained.
  • the contact zone of Figure 2 is shown again.
  • the electrically conductive layer 11 according to the invention has now been applied.
  • the outer boundary of the electrically conductive layer 11 is in the form of an “S”, this “S” extending at least partially into all contact surfaces of the contacts 7.
  • the electrically conductive layer 11 is exactly at the points below Broken, on which the separation channels 9 of the contact zone 5 are also located. This ensures that the electrically conductive layer 11 does not cause a short circuit between the individual contacts 7.
  • the interruptions in the electrically conductive layer 11 mentioned ensure that a total of nine layer elements 13 form the entire electrically conductive layer 11.
  • FIG. 4 shows a sectional view of the contact zone from FIG. 3.
  • the contact zone is delimited on the left and right by two separation channels 9.
  • a metal layer, which forms the contact 7, is located between these two separation channels 9.
  • the electrically conductive layer 11 is arranged above this contact 7, this electrically conductive layer 11 not reaching as far as the two separating channels 9 in accordance with the boundary of the "S" in FIG.
  • An electrically conductive protective layer 15 is applied over the electrically conductive layer 11 and preferably has a high hardness or a high level of wear resistance.
  • This electrically conductive protective layer 15 is optionally and expediently designed to be transparent so that the underlying electrically conductive layer 11, which is intended to convey a certain meaning as information carrier, remains recognizable.
  • FIG. 5 shows an insulating mask 21 with which the separation channels 9 of the contact zone 5 from FIG. 2 can be covered in order to subsequently apply the electrically conductive layer 11 using a suitable method.
  • the insulating mask 21 is designed in such a way that the separating channels 9 which can be seen in FIG. 2 are reliably covered.
  • the insulating mask 21 is designed in such a way that the individual separation channels 9 of the contact zone 5 are slightly overlapped on the left and right.
  • This insulating mask 21 is placed on the contact zone 5 of FIG. 2 and then the electrically conductive layer, for example a carbon varnish, is applied. This can be done by pad printing, screen printing, spraying, rolling, stamping or the like.
  • An information mask 23 is shown by way of example in FIG. 6 in order to apply the “S” shown in FIG. Instead of such an information mask 23, any mask can be provided.
  • an electrically conductive protective layer 15 can, as already mentioned in connection with FIG. 4, be applied to the electrically conductive layer 11.
  • This protective layer 15 is designed to be transparent.
  • FIG. 7 shows a suitable insulating mask 25 with which the protective layer 15 can be applied to the contact zone 5 together with the electrically conductive layer 11 applied.
  • the design of the insulating mask 25 in FIG. 7 corresponds to the insulating mask 21 from FIG. 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Les surfaces de contact métallique (7) d'une carte à puce sont, au moins partiellement, pourvues d'une couche conductrice (11) qui est disposée sur la zone de contact (5) de sorte qu'il n'y ait aucun court-circuit par rapport aux contacts. Les surfaces de contact servent ainsi non seulement de surfaces fonctionnelle de mise en contact mais également de supports d'informations correspondant au contour extérieur de la couche conductrice (11).
PCT/DE1997/001541 1996-07-25 1997-07-22 Carte a puce pourvue d'une zone de contact, et procede de production d'une telle zone de contact WO1998005000A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19630049.5 1996-07-25
DE1996130049 DE19630049A1 (de) 1996-07-25 1996-07-25 Chipkarte mit einer Kontaktzone und Verfahren zum Herstellen einer solchen Kontaktzone

Publications (1)

Publication Number Publication Date
WO1998005000A1 true WO1998005000A1 (fr) 1998-02-05

Family

ID=7800823

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/001541 WO1998005000A1 (fr) 1996-07-25 1997-07-22 Carte a puce pourvue d'une zone de contact, et procede de production d'une telle zone de contact

Country Status (2)

Country Link
DE (1) DE19630049A1 (fr)
WO (1) WO1998005000A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7694888B2 (en) 2005-11-15 2010-04-13 Infineon Technologies Ag Method for producing a chip card contact zone

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2777506B1 (fr) * 1998-04-17 2000-06-30 Gemplus Card Int Procede de realisation d'une entite decorative sur une carte du type a circuit integre
DE10325564B4 (de) 2003-06-05 2008-12-18 Infineon Technologies Ag Chipkartenmodul
DE10345257B4 (de) 2003-09-29 2008-10-02 Infineon Technologies Ag Chipkarte mit Kontaktfelder und Verfahren zum Herstellen solcher Kontaktfelder
DE10356153B4 (de) 2003-12-02 2010-01-14 Infineon Technologies Ag Modul für kontaktlose Chipkarten oder Identifizierungssysteme
FR3110768A1 (fr) * 2020-05-21 2021-11-26 Linxens Holding Procédé de fabrication d’un circuit électrique pour module électronique de carte à puce avec des contacts ayant une couleur noire ou proche du noir et circuit électrique réalisé par ce procédé

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231384A1 (fr) * 1985-07-17 1987-08-12 Ibiden Co, Ltd. Procédé de fabrication d'une plaquette à câblage imprimé pour cartes à circuits intégrés
EP0347321A1 (fr) * 1988-06-17 1989-12-20 STMicroelectronics S.A. Carte à puce avec écran de protection
WO1994002912A1 (fr) * 1992-07-23 1994-02-03 Deutsche Thomson-Brandt Gmbh Contact, produit muni dudit contact et appareil recepteur pour ce produit
WO1997001823A2 (fr) * 1995-06-27 1997-01-16 Orga Kartensysteme Gmbh Carte a puce

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2695234B1 (fr) * 1992-08-26 1994-11-04 Gemplus Card Int Procédé de marquage d'une carte à puce.
DE19523242A1 (de) * 1995-06-27 1997-01-02 Orga Kartensysteme Gmbh Chipkarte
DE19532223C1 (de) * 1995-09-01 1996-11-21 Orga Kartensysteme Gmbh Chipkarte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231384A1 (fr) * 1985-07-17 1987-08-12 Ibiden Co, Ltd. Procédé de fabrication d'une plaquette à câblage imprimé pour cartes à circuits intégrés
EP0347321A1 (fr) * 1988-06-17 1989-12-20 STMicroelectronics S.A. Carte à puce avec écran de protection
WO1994002912A1 (fr) * 1992-07-23 1994-02-03 Deutsche Thomson-Brandt Gmbh Contact, produit muni dudit contact et appareil recepteur pour ce produit
WO1997001823A2 (fr) * 1995-06-27 1997-01-16 Orga Kartensysteme Gmbh Carte a puce

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7694888B2 (en) 2005-11-15 2010-04-13 Infineon Technologies Ag Method for producing a chip card contact zone

Also Published As

Publication number Publication date
DE19630049A1 (de) 1998-01-29

Similar Documents

Publication Publication Date Title
DE19534480C2 (de) IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul
DE19606782C1 (de) Verfahren zur Herstellung einer Chipkarte und damit hergestellte Chipkarte
DE4443980A1 (de) Folienausführung für die Montage von Chipkarten mit Spulen
EP2836966B1 (fr) Couche transpondeur et procédé de fabrication de ladite couche
DE3535791A1 (de) Karte mit eingebautem chip
EP0835497A2 (fr) Carte a puce
EP0912962A1 (fr) Support de donnees presentant un module et un hologramme
DE69905288T2 (de) Verfahren zur herstellung einer kontaktlosen chipkarte
DE3927711A1 (de) Lamellierter induktor
DE19645084A1 (de) Identifikationskarte mit zusätzlichen Sicherheitsmerkmalen und Verfahren zu deren Herstellung
WO1998005000A1 (fr) Carte a puce pourvue d'une zone de contact, et procede de production d'une telle zone de contact
DE602004004647T2 (de) Verfahren zum zusammenbauen eines elektronischen komponent auf einem substrat
DE19625466C1 (de) Kontaktbehaftete Chipkarte
WO1998016900A1 (fr) Carte a puce munie d'une zone de contact et procede permettant de la produire
DE10345257B4 (de) Chipkarte mit Kontaktfelder und Verfahren zum Herstellen solcher Kontaktfelder
DE3336130A1 (de) Elektrischer schalter
WO2004018260A1 (fr) Plaque
DE69219488T2 (de) Verfahren zur Herstellung einer Speicherkarte und Speicherkarte so hergestellt
EP1410320B1 (fr) Procede pour la production d'un croisement de piste conductrice sur une carte support de donnees
DE19600388C2 (de) Chipkarte
DE3341115A1 (de) Ausweiskarte aus einem laminat miteinander verbundener, insbesondere thermoplastischer folien
DE10232007A1 (de) Transponder für flachstückartig ausgebildete Artikel
DE69701219T2 (de) Elektronische baugruppe mit einer an einer spule verbundenen elektronischen einheit
DE602004001871T2 (de) Kontaktbuchse mit Lötmasse und Herstellungsverfahren
DE19533427C1 (de) Elektrische Schalteinrichtung

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): BR CN JP KR MX RU UA US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

Ref document number: 98508378

Format of ref document f/p: F

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载