WO1997013130A2 - Composant electronique de detection de pression statique et dynamique - Google Patents
Composant electronique de detection de pression statique et dynamique Download PDFInfo
- Publication number
- WO1997013130A2 WO1997013130A2 PCT/DE1996/001718 DE9601718W WO9713130A2 WO 1997013130 A2 WO1997013130 A2 WO 1997013130A2 DE 9601718 W DE9601718 W DE 9601718W WO 9713130 A2 WO9713130 A2 WO 9713130A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- electrodes
- individual
- carrier layer
- component according
- Prior art date
Links
- 230000003068 static effect Effects 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000004020 conductor Substances 0.000 claims description 32
- 229920001971 elastomer Polymers 0.000 claims description 31
- 239000000806 elastomer Substances 0.000 claims description 30
- 238000001514 detection method Methods 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 2
- 239000013013 elastic material Substances 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
- 230000005489 elastic deformation Effects 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 238000003491 array Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229920004482 WACKER® Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
- G01L5/226—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping
- G01L5/228—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping using tactile array force sensors
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B34/00—Computer-aided surgery; Manipulators or robots specially adapted for use in surgery
- A61B34/70—Manipulators specially adapted for use in surgery
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/50—Prostheses not implantable in the body
- A61F2002/5058—Prostheses not implantable in the body having means for restoring the perception of senses
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/50—Prostheses not implantable in the body
- A61F2002/5058—Prostheses not implantable in the body having means for restoring the perception of senses
- A61F2002/5059—Prostheses not implantable in the body having means for restoring the perception of senses the feeling of position
Definitions
- the invention relates to an electronic component for static and dynamic pressure detection with a non-conductive base substrate, on which at least two electrodes are applied, which are arranged on the substrate surface such that the electrodes are spaced apart, and with one, above the base substrate and the Flexible, non-conductive carrier layer arranged on the electrode pairs, on the underside of which, depending on the number of the electrode pairs, elastic, electrically conductive deforming elements which are oriented essentially centrally to the individual electrode pairs and have a cross-sectional area whose diameter is in Near the base substrate is smaller than the electrode spacing and which increases continuously in the direction of the carrier layer and corresponds approximately to the substrate area covered by the electrodes, which can be pressed against the conductor track pairs.
- pressure sensor arrays are used, which are preferably designed as matrix sensors and for Robotics and telemanipulation, but also for medical applications such as prosthetics. Components of this type are aids for detecting surface topologies or positions of touched or gripped objects and, with suitable tactile feedback, make telemanipulation considerably easier.
- piezoresistive sensors change their electrical resistance under the action of pressure and also permit the detection of static pressures.
- Conductive elastomers have been used in connection with piezoresistive sensors, which makes the sensors inexpensive, mechanically robust and flexible.
- the measurement result is subject to a high degree of hysteresis if the pressure-dependent change in the specific resistance of the elastomer material is used as the sensor principle.
- pressure sensor arrays are known which have been produced with the aid of micromechanical silicon technology, which capacitively or piezoresistively determine the pressure-induced deflection of a membrane and thus quantitatively the applied pressure.
- Such silicon pressure sensor arrays can be produced with a high resolution, but are inflexible and fragile due to the silicon carrier material, and are very complex and therefore very expensive to produce.
- Sugiyama S. et al. "Tactile Image Detection Using an IK-element Silicon Pressure Sensor Array", in Sensors and Actuators, A21-A23 (1990), pp. 397-400; Wolffenfuttel M.R., Regtien P.P.L. "Polysilicon Bridges for the Realization of Tactile Sensors", in Sensors and Actuators A, 25-27 (1991), pp. 257-264.
- JP 2-275603 which is considered to be the closest prior art, shows a pressure sensor which consists of an electrically insulating base plate 4, on which two elongate electrodes 10, 11 are formed, which are at a distance from one another are upset. There is an electrically conductive rubber over the electrode gap manufactured contact wedge 13 attached, which can be pressed under pressure on the electrode gap. If the contact wedge is pressed completely onto the electrode gap, the latter short-circuits the opposite electrodes, as a result of which a current flows between the electrodes.
- This pressure sensor can only differentiate between two states, namely the state without exerting pressure, in which there is no current flow between the electrodes and the state in which the contact wedge shorts the two electrodes, so that a current flow is generated between the two electrodes, a statement over which the force or pressure holding down the contact wedge is not possible.
- the invention is based on the object of developing an electronic component for static and dynamic pressure detection of the type described above in such a way that, with the aid of known micromechanical production methods and the use of conductive elastomers, a pressure sensor array can be produced which can be both a has high sensitivity as well as a large dynamic range and a high resolution.
- the poor overcoupling properties should be eliminated when using elastomers, so that mechanical overcoupling is reduced to a minimum.
- the manufacturing process should be less complex and therefore less expensive.
- the solution to the problem underlying the invention is specified in claim 1.
- Advantageous embodiments can be found in claims 2 ff.
- the electronic component consists essentially of two parts, the base substrate, which can be rigid or flexible, on the upper side of which thin-film technology, conductor track structures and spacer structures are applied, and a carrier layer is arranged exactly over the top of the base substrate and has a three-dimensional structured elastomer matrix with conductive and non-conductive elastomer areas.
- the conductor track structures applied to the upper side of the base substrate form individual array elements which have the shape of two interdigital electrodes, each with at least two fingers.
- the simplest form of interdigital electrodes each consist of two electrodes, the electrode structure of which corresponds to the shape of an "F" and are arranged with respect to one another such that the transverse electrode sections of the "F" arrangement come to lie parallel next to one another in an alternating order.
- the manufacture of such interdigital electrodes is accomplished in thin-film technology with the aid of standard photolytographic methods from a non-corrosive metal, for example gold or platinum.
- the substrate areas between the metal electrodes are also coated with a non-conductive spacer material with the aid of microsystem technology production methods so that the spacer structures protrude slightly beyond the conductor track structures. The typical peaks are in the micrometer range.
- the carrier layer opposite the conductor track structures, on the underside of which electrically conductive deforming elements are attached consists of a non-conductive elastomer layer and a conductive elastomer matrix applied thereon, which has a large number of adjoining elastomer pyramids.
- the pyramid shapes are produced by molding a silicon wafer structured with the aid of anisotropic standard etching technology. To produce such structures, uncrosslinked conductive elastomer is first knife-coated into the pyramid-shaped etching pits, then a layer of insulating elastomer that is as thin as possible is applied to the entire wafer surface. In principle, both types of elastomer must have the highest possible resistance to tearing and tear.
- the softness of the conductive elastomer in the crosslinked state determines the dynamic range of the sensor. Furthermore, the extensibility and thickness of the non-conductive elastomer influence the mechanical coupling between the sensor elements, so that the greatest possible extensibility with the smallest possible thickness should be sought.
- the structured elastomer matrix can be removed from the silicon mold.
- the carrier layer consisting of a non-conductive elastomer and the elastomer pyramid matrix structure applied thereon are now positioned on the surface of the base substrate in such a way that the individual pyramid tips each rest on the space between two conductor tracks, so that no current flow between the conductor track Electrodes are made over the conductive elastomer pyramid tip. If pressure is now exerted on the back of the support structure, which is also the sensor surface, the pyramid tips are pressed against the substrate and flattened accordingly. As a result of the flattening, individual electrode contact fingers of the interdigital electrodes are contacted with one another via the conductive elastomer, so that the resistance between the two electrodes decreases.
- the flattening surface increases as a result of the pyramidal shape of the conductive elastomer, as a result of which, on the one hand, an increasing number of interdigital fingers and, on the other hand, two fingers contact each other over a greater length become.
- the resistance between the electrons consequently decreases with increasing contact pressure.
- the insulating spacer structures between the electrodes only serve to rule out electrode contact in a completely unloaded state.
- FIG. 3 embodiment of a sensor array according to the invention under the action of pressure.
- FIG. 1 shows a pair of interdigital electrodes, each consisting of two electrode arrangements E1 and E2.
- the individual electrodes have the shape of an "F".
- the transverse electrode sections of both electrode tracks project into one another in such a way that they are spaced apart from one another by an insulation layer I.
- Figure 2 shows an embodiment of a pressure sensor array according to the invention, which is shown in cross section. The example shown consists of 4 x 4 pressure sensor array elements, four of which can be seen in the cross-sectional representation.
- a sensor array element consists of the base substrate 1, on which the interdigital electrode pair 2 shown in FIG. 1 is applied. Electrically isolating spacer structures I are incorporated between the electrode conductor structures, which are shown as black areas in FIG.
- the carrier layer 3 made of a non-conductive elastomer is arranged above this electrode arrangement, and elastomer pyramids 4 made of conductive elastomer are attached to the underside thereof.
- the tips of the pyramids are positioned in such a way that they lie exactly on the insulating layer I. If pressure is now exerted on the sensor surface 5, as can be seen in FIG. 3, the contact surface of the elastomer pyramids on the conductor track structures expands, so that the individual interdigital electrodes are contacted with one another, as a result of which the resistance between the two electrodes decreases . In the case shown in FIG.
- Functional samples consist of 4 x 4 pressure sensor array elements, each with a grid dimension of 0.76 mm x 0.51 mm. The circumference of the whole The pressure sensor is approximately 2 mm x 3 mm.
- a glass substrate with gold electrodes of 50 ⁇ m conductor width and a gold layer thickness of 400 nm as well as an insulating polyimide spacer structure of approx. 1 ⁇ m have been used as materials for the pressure sensor.
- Each individual interdigital electrode consists of two fingers with a conductor width of 50 ⁇ m and an interdigital distance of 50 ⁇ m. For each individual pressure sensor element, one of the two electrodes is individually contacted to the outside, while the respective counter electrode of all sensor elements are connected to one another and are at a common potential.
- Elastosil LR 3162 from Wacker was used for the conductive elastomer material and likewise from Wacker for the non-conductive component Elastosil LR 3003.
- the size of the conductive pyramids at the base is 0.56 mm x 0.41 mm, the height is 0.29 mra.
- the thickness of the non-conductive silicone rubber layer is approximately 0.2 mm.
- the two layers of the sensor are positioned exactly one above the other under a microscope and bonded to one another at the sensor edge without tension.
- a further increase in the number of array elements could be simplified with the aid of so-called row-column coding, since this would allow a reduction in the number of conductor tracks.
- a measuring sensitivity of at least 14 mN / mm 2 can be achieved. Furthermore, there is a high tolerance to large forces of at least 10 N / mm 2 reachable. Shock loads, large dynamic ranges and high resolving power with the element size described above can be achieved with the component according to the invention. With the aid of somewhat more complex standard masking techniques, the production method allows the spatial and / or dynamic resolution achieved to be increased by at least a factor of 5.
- An additional advantage of the sensor principle is that when using a polyimide film substrate, a 2- Dimensionally bendable sensor can be produced, which can be provided, for example, on an artificial finger with a corresponding sense of touch.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Adjustable Resistors (AREA)
- Pressure Sensors (AREA)
Abstract
Ce composant électronique de détection de pression statique et dynamique comprend un substrat de base non conducteur sur lequel sont montées au moins deux électrodes mutuellement espacées sur la surface du substrat, ainsi qu'une couche non conductrice souple de support située au-dessus du substrat de base et des paires d'électrodes. Une pluralité d'éléments électroconducteurs élastiques de déformation susceptibles d'être pressés contre les paires de pistes conductrices et dont le nombre correspond au nombre de paires d'électrodes se situent sur la face inférieure de la couche de support, sensiblement au milieu des paires individuelles d'électrodes. Ces éléments élastiques de déformation ont une superficie transversale dont le diamètre à proximité du substrat de base est inférieur à l'écart entre les électrodes et qui augmente en continu dans la direction de la couche de support jusqu'à correspondre, au niveau de la couche de support, à peu près à la surface du substrat recouverte par les électrodes. L'invention se caractérise en ce que les électrodes individuelles sont constituées de pistes conductrices mutuellement isolées qui se subdivisent en éventail en au moins deux pistes conductrices individuelles montées sur la surface du substrat de sorte que les pistes conductrices de chaque électrode alternent en paires avec les pistes conductrices de l'autre électrode.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19533756.5 | 1995-09-12 | ||
DE19533756A DE19533756A1 (de) | 1995-09-12 | 1995-09-12 | Elektronisches Bauelement zur statischen und dynamischen Druckerfassung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1997013130A2 true WO1997013130A2 (fr) | 1997-04-10 |
WO1997013130A3 WO1997013130A3 (fr) | 1997-05-29 |
Family
ID=7771951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1996/001718 WO1997013130A2 (fr) | 1995-09-12 | 1996-09-12 | Composant electronique de detection de pression statique et dynamique |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19533756A1 (fr) |
WO (1) | WO1997013130A2 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2401584A1 (fr) * | 2009-02-27 | 2012-01-04 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Peau protectrice pour robots |
CN108735889A (zh) * | 2017-04-14 | 2018-11-02 | 中国科学院苏州纳米技术与纳米仿生研究所 | 压力传感器及其制备方法 |
JPWO2020195460A1 (fr) * | 2019-03-25 | 2020-10-01 | ||
CN113023662A (zh) * | 2021-02-09 | 2021-06-25 | 南京高华科技股份有限公司 | 一种mems电容式触觉压力传感器及其制备方法 |
WO2021254249A1 (fr) * | 2020-06-18 | 2021-12-23 | Basf Se | Capteur de pression piézorésistif à structure en mousse |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2853057B1 (fr) * | 2003-03-26 | 2005-09-23 | Cera | Dispositif de detection d'enfoncement a amplificateur de detection |
GB0313794D0 (en) * | 2003-06-14 | 2003-07-23 | Univ Dundee | Tactile sensor assembly |
DE102006007664A1 (de) * | 2006-02-18 | 2007-08-23 | Bayerische Motoren Werke Ag | Fahrpedalsystem |
DE102010034712A1 (de) * | 2010-08-18 | 2012-02-23 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Minimalinvasives Instrument |
AT511330B1 (de) * | 2011-06-03 | 2012-11-15 | Piezocryst Advanced Sensorics | Sensor für die messung von druck und/oder kraft |
CN103091005B (zh) * | 2011-11-07 | 2015-02-18 | 中国医药大学 | 压力感测构件 |
CN104706335B (zh) * | 2013-12-17 | 2018-03-20 | 中国科学院苏州纳米技术与纳米仿生研究所 | 电子皮肤在脉搏检测上的应用、脉搏检测系统和方法 |
KR101877108B1 (ko) * | 2013-01-29 | 2018-07-10 | 중국 과학원, 쑤저우 나노기술 및 나노바이오닉스 연구소 | 전자 피부 및 그 제조 방법과 용도 |
DE102017218229A1 (de) * | 2017-10-12 | 2019-04-18 | Dr. Doll Engineering Gmbh | Schutzvorrichtung für einen Industrieroboter sowie Schutzelement für eine solche Schutzvorrichtung |
EP3726191A1 (fr) | 2019-04-17 | 2020-10-21 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Capteur de pression |
DE102019114185B4 (de) * | 2019-05-27 | 2022-08-11 | Tacterion Gmbh | Taktiles Sensorelement |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4479392A (en) * | 1983-01-03 | 1984-10-30 | Illinois Tool Works Inc. | Force transducer |
SE8400484D0 (sv) * | 1984-01-31 | 1984-01-31 | Slim Borgudd | Anordning for metning av dynamisk och statisk lastpakenning vid en draganordning for t ex drivorgan |
US4694231A (en) * | 1986-04-18 | 1987-09-15 | Mecanotron Corporation | Robotic skin |
DE3903094A1 (de) * | 1988-07-14 | 1990-01-18 | Blomberg Gmbh Robotertechnik | Taktiler sensor |
JPH02275603A (ja) * | 1988-12-29 | 1990-11-09 | Yokohama Rubber Co Ltd:The | 可変抵抗器及びこれを用いたセンサ |
US5237879A (en) * | 1991-10-11 | 1993-08-24 | At&T Bell Laboratories | Apparatus for dynamically varying the resolution of a tactile sensor array |
US5287089A (en) * | 1992-05-13 | 1994-02-15 | Micro-Integration Corporation | Hand manipulatable computer input device |
-
1995
- 1995-09-12 DE DE19533756A patent/DE19533756A1/de not_active Withdrawn
-
1996
- 1996-09-12 WO PCT/DE1996/001718 patent/WO1997013130A2/fr active Application Filing
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2401584A1 (fr) * | 2009-02-27 | 2012-01-04 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Peau protectrice pour robots |
CN108735889A (zh) * | 2017-04-14 | 2018-11-02 | 中国科学院苏州纳米技术与纳米仿生研究所 | 压力传感器及其制备方法 |
CN108735889B (zh) * | 2017-04-14 | 2021-08-17 | 中国科学院苏州纳米技术与纳米仿生研究所 | 压力传感器及其制备方法 |
JPWO2020195460A1 (fr) * | 2019-03-25 | 2020-10-01 | ||
WO2021254249A1 (fr) * | 2020-06-18 | 2021-12-23 | Basf Se | Capteur de pression piézorésistif à structure en mousse |
EP4168764A4 (fr) * | 2020-06-18 | 2024-08-21 | Basf Se | Capteur de pression piézorésistif à structure en mousse |
CN113023662A (zh) * | 2021-02-09 | 2021-06-25 | 南京高华科技股份有限公司 | 一种mems电容式触觉压力传感器及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
DE19533756A1 (de) | 1997-03-13 |
WO1997013130A3 (fr) | 1997-05-29 |
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