WO1996017971B1 - Appareil de pulverisation avec module de service embarque - Google Patents
Appareil de pulverisation avec module de service embarqueInfo
- Publication number
- WO1996017971B1 WO1996017971B1 PCT/US1995/014436 US9514436W WO9617971B1 WO 1996017971 B1 WO1996017971 B1 WO 1996017971B1 US 9514436 W US9514436 W US 9514436W WO 9617971 B1 WO9617971 B1 WO 9617971B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module
- service module
- service
- process module
- vacuum
- Prior art date
Links
Abstract
Cette invention se rapporte à un système (50) pour l'application d'une couche de revêtement sur un substrat (42) par pulvérisation. Ce système comprend un logement central (12) comportant au moins un module de traitement (20, 22, 24) servant à former la couche de revêtement, ce module de traitement se trouvant en communication fluide avec le logement central (12) et comprenant un premier dispositif utilisé de façon conjointe avec l'opération de formation de la couche de revêtement sur le substrat (42). Ce système (50) comprend en outre au moins un module de service (52) en communication fluide avec le logement central (12), ce module de service (52) comprenant au moins un dispositif de remplacement servant à remplacer le premier dispositif. Le logement central (12) contient un élément robotique (40) servant à transporter le premier dispositif du module de traitement (20, 22, 24) au module de service (52) et servant à transporter le dispositif de remplacement du module de service (52) au module de traitement (20, 22, 24), afin de remplacer le premier dispositif. Le module de service (52) comprend en outre une pompe spécialisée (60) qui sert à faire le vide dans le module de service (52) à un niveau de vide élevé, afin de réduire le dégazage de surface du dispositif de remplacement jusqu'à un niveau désiré avant l'utilisation.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69525372T DE69525372T2 (de) | 1994-12-08 | 1995-11-09 | Sputter anlage mit eingebautem wartungsmodul |
EP95941368A EP0796354B1 (fr) | 1994-12-08 | 1995-11-09 | Appareil de pulverisation avec module de service embarque |
AU42814/96A AU4281496A (en) | 1994-12-08 | 1995-11-09 | Sputtering apparatus having an on board service module |
JP8517586A JPH11504386A (ja) | 1994-12-08 | 1995-11-09 | オンボードサービスモジュールを有するスパッタリング装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35200094A | 1994-12-08 | 1994-12-08 | |
US08/352,000 | 1994-12-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1996017971A1 WO1996017971A1 (fr) | 1996-06-13 |
WO1996017971B1 true WO1996017971B1 (fr) | 1996-08-08 |
Family
ID=23383365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1995/014436 WO1996017971A1 (fr) | 1994-12-08 | 1995-11-09 | Appareil de pulverisation avec module de service embarque |
Country Status (9)
Country | Link |
---|---|
US (1) | US5620578A (fr) |
EP (1) | EP0796354B1 (fr) |
JP (1) | JPH11504386A (fr) |
KR (1) | KR100372500B1 (fr) |
AU (1) | AU4281496A (fr) |
CA (1) | CA2206109A1 (fr) |
DE (1) | DE69525372T2 (fr) |
TW (1) | TW359849B (fr) |
WO (1) | WO1996017971A1 (fr) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6254747B1 (en) * | 1996-12-25 | 2001-07-03 | Nihon Shinku Gijutsu Kabushiki Kaisha | Magnetron sputtering source enclosed by a mirror-finished metallic cover |
US5944857A (en) * | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
US6312525B1 (en) | 1997-07-11 | 2001-11-06 | Applied Materials, Inc. | Modular architecture for semiconductor wafer fabrication equipment |
US6688375B1 (en) * | 1997-10-14 | 2004-02-10 | Applied Materials, Inc. | Vacuum processing system having improved substrate heating and cooling |
US6042623A (en) * | 1998-01-12 | 2000-03-28 | Tokyo Electron Limited | Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
US6558509B2 (en) * | 1999-11-30 | 2003-05-06 | Applied Materials, Inc. | Dual wafer load lock |
US6953392B2 (en) * | 2001-01-05 | 2005-10-11 | Asm Nutool, Inc. | Integrated system for processing semiconductor wafers |
US7172497B2 (en) * | 2001-01-05 | 2007-02-06 | Asm Nutool, Inc. | Fabrication of semiconductor interconnect structures |
TWI222154B (en) * | 2001-02-27 | 2004-10-11 | Asm Nutool Inc | Integrated system for processing semiconductor wafers |
US20040259348A1 (en) * | 2001-02-27 | 2004-12-23 | Basol Bulent M. | Method of reducing post-CMP defectivity |
US20040089421A1 (en) * | 2002-02-15 | 2004-05-13 | Komandur Srinivasan M. | Distributed control system for semiconductor manufacturing equipment |
US20050205209A1 (en) * | 2004-03-18 | 2005-09-22 | Aelan Mosden | Replacing chamber components in a vacuum environment |
US7867904B2 (en) * | 2006-07-19 | 2011-01-11 | Intermolecular, Inc. | Method and system for isolated and discretized process sequence integration |
WO2008141106A1 (fr) * | 2007-05-09 | 2008-11-20 | Applied Materials, Inc. | Chambre de transfert dotée d'une extension sous vide pour des disques d'obturateur |
US20080276867A1 (en) * | 2007-05-09 | 2008-11-13 | Jason Schaller | Transfer chamber with vacuum extension for shutter disks |
CN102284307A (zh) * | 2011-06-08 | 2011-12-21 | 大连海事大学 | 模块化集成式可分区操作的大型真空装置 |
US9746678B2 (en) * | 2014-04-11 | 2017-08-29 | Applied Materials | Light wave separation lattices and methods of forming light wave separation lattices |
US9666461B1 (en) * | 2016-02-05 | 2017-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor process and semiconductor processing device using the same |
TWI742201B (zh) * | 2016-12-02 | 2021-10-11 | 美商應用材料股份有限公司 | 整合式原子層沉積工具 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3314395A (en) * | 1964-10-23 | 1967-04-18 | Melpar Inc | Thin film circuit vacuum processing facility |
US3516386A (en) * | 1965-07-16 | 1970-06-23 | Boeing Co | Thin film deposition fixture |
US4909695A (en) * | 1986-04-04 | 1990-03-20 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
JP2859632B2 (ja) * | 1988-04-14 | 1999-02-17 | キヤノン株式会社 | 成膜装置及び成膜方法 |
US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
JPH0733576B2 (ja) * | 1989-11-29 | 1995-04-12 | 株式会社日立製作所 | スパツタ装置、及びターゲツト交換装置、並びにその交換方法 |
JPH0449523A (ja) * | 1990-06-18 | 1992-02-18 | Denki Kagaku Kogyo Kk | 磁気記録媒体の製造法及びその装置 |
US5223112A (en) * | 1991-04-30 | 1993-06-29 | Applied Materials, Inc. | Removable shutter apparatus for a semiconductor process chamber |
JPH081923B2 (ja) * | 1991-06-24 | 1996-01-10 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
-
1995
- 1995-11-08 TW TW084111832A patent/TW359849B/zh not_active IP Right Cessation
- 1995-11-09 EP EP95941368A patent/EP0796354B1/fr not_active Expired - Lifetime
- 1995-11-09 JP JP8517586A patent/JPH11504386A/ja active Pending
- 1995-11-09 DE DE69525372T patent/DE69525372T2/de not_active Expired - Lifetime
- 1995-11-09 CA CA002206109A patent/CA2206109A1/fr not_active Abandoned
- 1995-11-09 WO PCT/US1995/014436 patent/WO1996017971A1/fr active IP Right Grant
- 1995-11-09 KR KR1019970703813A patent/KR100372500B1/ko not_active Expired - Fee Related
- 1995-11-09 AU AU42814/96A patent/AU4281496A/en not_active Abandoned
-
1996
- 1996-01-04 US US08/583,200 patent/US5620578A/en not_active Expired - Lifetime
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