WO1996017971B1 - Sputtering apparatus having an on board service module - Google Patents
Sputtering apparatus having an on board service moduleInfo
- Publication number
- WO1996017971B1 WO1996017971B1 PCT/US1995/014436 US9514436W WO9617971B1 WO 1996017971 B1 WO1996017971 B1 WO 1996017971B1 US 9514436 W US9514436 W US 9514436W WO 9617971 B1 WO9617971 B1 WO 9617971B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module
- service module
- service
- process module
- vacuum
- Prior art date
Links
Abstract
A system (50) for sputtering a substrate (42) is disclosed. The system includes a central housing (12) having at least one process module (20, 22, 24) for forming the layer, wherein the process module is in fluid communication with the central housing (12) and includes a first device used in conjunction with forming the layer on the substrate (42). In addition, the system (50) includes at least one service module (52) in fluid communication with the central housing (12), wherein the service module (52) includes at least one replacement device suitable for replacing the first device. The central housing (12) includes a robotic element (40) for transporting the first device from the process module (20, 22, 24) to the service module (52) and for transporting the replacement device from the service module (52) to the process module (20, 22, 24) in order to replace the first device. In addition, the service module (52) includes a dedicated pump (60) for evacuating the service module (52) to a high vacuum in order to reduce surface outgassing of the replacement device to a desired level before use.
Claims
1. A system for forming a layer on a substrate, comprising: at least one process module for forming said layer, said process module including a first device used in conjunction with forming said layer on said substrate; at least one service module removably affixed to said process module, said service module having at least one replacement device suitable for replacing said first device; a valve for isolating said service module from said process module; evacuation means for providing evacuation of said process and service modules to a desired vacuum, wherein when said valve is opened said evacuation of said process and service modules is sufficient for maintaining said vacuum thereby minimizing time needed for evacuation; and a robotic element for transporting said first device from said process module to said service module and for transporting said replacement device from said service module to said process module for replacing said first device.
2. The system according to claim 1 , wherein said service module is maintained under a vacuum suitable for reducing outgassing of said replacement device to a desired level.
3. The system according to claim 1 further including a rack having at least one shelf for storing said replacement device and for receiving said first device.
4. The system according to claim 3 further including a drive mechanism for moving said shelf to enable alignment with said robotic element.
5. The system according to claim 1 wherein said service module is removably affixed to said process module.
6. The system according to claim 1 wherein said service module is unistructurally formed with said process module.
7. The system according to claim 1 further including a valve for isolating said service module from said process module.
8. The system according to claim 1 wherein said service module includes a pump for evacuating said service module to a vacuum level suitable for outgassing.
-27-
9. A system for forming a layer on a substrate, comprising: at least one process module for forming said layer, said process module including a first device used in conjunction with forming said layer on said substrate; at least one service module having at least one replacement device suitable for replacing said first device wherein said service module is maintained at a vacuum suitable for reducing outgassing of said replacement device to a desired level; a central housing removably affixed between said process module and said service module; a valve for isolating said service module from said central housing and said process module; evacuation means for providing evacuation of said process and service modules and said central housing to said vacuum, wherein when said valve is opened said evacuation of said process and service modules and said central housing is sufficient for maintaining said vacuum thereby minimizing time needed for evacuation; and at least one robotic element located in said central housing, wherein said robotic element is adapted for transporting said first device from said process module to said service module and for transporting said replacement device from said service module to said process module for replacing said first device under said vacuum.
10. The system according to claim 9 further including a rack having at least one shelf for storing said replacement device and for receiving said first device.
1 1 . The system according to claim 10 further including a drive mechanism for moving said shelf to enable alignment with said robotic element. -28-
12. The system according to claim 9 wherein said service module is removeably affixed to said central housing.
13. The system according to claim 9 wherein said service module is removeably affixed to said process module.
14. The system according to claim 9 further including a valve for isolating said service module from said process module.
15. The system according to claim 9 wherein said service module includes a pump for evacuating said service module to a vacuum level suitable for outgassing.
-29-
16. A system for forming a layer on a substrate, comprising: at least one process module for forming said layer, said process module including a first device used in conjunction with forming said layer on said substrate; at least one service module having at least one replacement device suitable for replacing said first device wherein said service module is maintained at a vacuum suitable for reducing outgassing of said replacement device to a desired level; a central housing removably affixed in fluid communication between said process module and said service module; a valve for isolating said service module from said central housing and said process module; evacuation means for providing evacuation of said process and service modules and said central housing to said vacuum, wherein when said valve is opened said evacuation of said process and service modules and said central housing is sufficient for maintaining said vacuum thereby minimizing time needed for evacuation; at least one robotic element located in said central housing, wherein said robotic element is adapted for transporting said first device from said process module to said service module and for transporting said replacement device from said service module to said process module for replacing said first device under said high vacuum; a storage element for storing said replacement device in said service module; and a drive mechanism for moving said storage element within said service module to enable said robotic arm to place said first fixture in said storage element and to transport said replacement device from said storage element to said process module under said vacuum.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE69525372T DE69525372T2 (en) | 1994-12-08 | 1995-11-09 | SPUTTER SYSTEM WITH BUILT-IN MAINTENANCE MODULE |
| EP95941368A EP0796354B1 (en) | 1994-12-08 | 1995-11-09 | Sputtering apparatus having an on board service module |
| AU42814/96A AU4281496A (en) | 1994-12-08 | 1995-11-09 | Sputtering apparatus having an on board service module |
| JP8517586A JPH11504386A (en) | 1994-12-08 | 1995-11-09 | Sputtering apparatus having on-board service module |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35200094A | 1994-12-08 | 1994-12-08 | |
| US08/352,000 | 1994-12-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1996017971A1 WO1996017971A1 (en) | 1996-06-13 |
| WO1996017971B1 true WO1996017971B1 (en) | 1996-08-08 |
Family
ID=23383365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1995/014436 WO1996017971A1 (en) | 1994-12-08 | 1995-11-09 | Sputtering apparatus having an on board service module |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5620578A (en) |
| EP (1) | EP0796354B1 (en) |
| JP (1) | JPH11504386A (en) |
| KR (1) | KR100372500B1 (en) |
| AU (1) | AU4281496A (en) |
| CA (1) | CA2206109A1 (en) |
| DE (1) | DE69525372T2 (en) |
| TW (1) | TW359849B (en) |
| WO (1) | WO1996017971A1 (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6254747B1 (en) * | 1996-12-25 | 2001-07-03 | Nihon Shinku Gijutsu Kabushiki Kaisha | Magnetron sputtering source enclosed by a mirror-finished metallic cover |
| US5944857A (en) * | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
| US6312525B1 (en) | 1997-07-11 | 2001-11-06 | Applied Materials, Inc. | Modular architecture for semiconductor wafer fabrication equipment |
| US6688375B1 (en) * | 1997-10-14 | 2004-02-10 | Applied Materials, Inc. | Vacuum processing system having improved substrate heating and cooling |
| US6042623A (en) * | 1998-01-12 | 2000-03-28 | Tokyo Electron Limited | Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
| US6558509B2 (en) * | 1999-11-30 | 2003-05-06 | Applied Materials, Inc. | Dual wafer load lock |
| US6953392B2 (en) * | 2001-01-05 | 2005-10-11 | Asm Nutool, Inc. | Integrated system for processing semiconductor wafers |
| US7172497B2 (en) * | 2001-01-05 | 2007-02-06 | Asm Nutool, Inc. | Fabrication of semiconductor interconnect structures |
| TWI222154B (en) * | 2001-02-27 | 2004-10-11 | Asm Nutool Inc | Integrated system for processing semiconductor wafers |
| US20040259348A1 (en) * | 2001-02-27 | 2004-12-23 | Basol Bulent M. | Method of reducing post-CMP defectivity |
| US20040089421A1 (en) * | 2002-02-15 | 2004-05-13 | Komandur Srinivasan M. | Distributed control system for semiconductor manufacturing equipment |
| US20050205209A1 (en) * | 2004-03-18 | 2005-09-22 | Aelan Mosden | Replacing chamber components in a vacuum environment |
| US7867904B2 (en) * | 2006-07-19 | 2011-01-11 | Intermolecular, Inc. | Method and system for isolated and discretized process sequence integration |
| WO2008141106A1 (en) * | 2007-05-09 | 2008-11-20 | Applied Materials, Inc. | Transfer chamber with vacuum extension for shutter disks |
| US20080276867A1 (en) * | 2007-05-09 | 2008-11-13 | Jason Schaller | Transfer chamber with vacuum extension for shutter disks |
| CN102284307A (en) * | 2011-06-08 | 2011-12-21 | 大连海事大学 | Modularized integrated large-scale vacuum device available for partitioning operation |
| US9746678B2 (en) * | 2014-04-11 | 2017-08-29 | Applied Materials | Light wave separation lattices and methods of forming light wave separation lattices |
| US9666461B1 (en) * | 2016-02-05 | 2017-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor process and semiconductor processing device using the same |
| TWI742201B (en) * | 2016-12-02 | 2021-10-11 | 美商應用材料股份有限公司 | Integrated atomic layer deposition tool |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3314395A (en) * | 1964-10-23 | 1967-04-18 | Melpar Inc | Thin film circuit vacuum processing facility |
| US3516386A (en) * | 1965-07-16 | 1970-06-23 | Boeing Co | Thin film deposition fixture |
| US4909695A (en) * | 1986-04-04 | 1990-03-20 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
| JP2859632B2 (en) * | 1988-04-14 | 1999-02-17 | キヤノン株式会社 | Film forming apparatus and film forming method |
| US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
| JPH0733576B2 (en) * | 1989-11-29 | 1995-04-12 | 株式会社日立製作所 | Sputter device, target exchanging device, and exchanging method thereof |
| JPH0449523A (en) * | 1990-06-18 | 1992-02-18 | Denki Kagaku Kogyo Kk | Method and device for production of magnetic recording medium |
| US5223112A (en) * | 1991-04-30 | 1993-06-29 | Applied Materials, Inc. | Removable shutter apparatus for a semiconductor process chamber |
| JPH081923B2 (en) * | 1991-06-24 | 1996-01-10 | ティーディーケイ株式会社 | Clean transfer method and device |
-
1995
- 1995-11-08 TW TW084111832A patent/TW359849B/en not_active IP Right Cessation
- 1995-11-09 EP EP95941368A patent/EP0796354B1/en not_active Expired - Lifetime
- 1995-11-09 JP JP8517586A patent/JPH11504386A/en active Pending
- 1995-11-09 DE DE69525372T patent/DE69525372T2/en not_active Expired - Lifetime
- 1995-11-09 CA CA002206109A patent/CA2206109A1/en not_active Abandoned
- 1995-11-09 WO PCT/US1995/014436 patent/WO1996017971A1/en active IP Right Grant
- 1995-11-09 KR KR1019970703813A patent/KR100372500B1/en not_active Expired - Fee Related
- 1995-11-09 AU AU42814/96A patent/AU4281496A/en not_active Abandoned
-
1996
- 1996-01-04 US US08/583,200 patent/US5620578A/en not_active Expired - Lifetime
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