+

WO1996005572A1 - Multi-layered chip card coils for contactless chip cards - Google Patents

Multi-layered chip card coils for contactless chip cards Download PDF

Info

Publication number
WO1996005572A1
WO1996005572A1 PCT/DE1995/001052 DE9501052W WO9605572A1 WO 1996005572 A1 WO1996005572 A1 WO 1996005572A1 DE 9501052 W DE9501052 W DE 9501052W WO 9605572 A1 WO9605572 A1 WO 9605572A1
Authority
WO
WIPO (PCT)
Prior art keywords
coils
cards
chip
chip cards
contactless
Prior art date
Application number
PCT/DE1995/001052
Other languages
German (de)
French (fr)
Inventor
Hans-Diedrich Kreft
Original Assignee
Angewandte Digital Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Angewandte Digital Elektronik Gmbh filed Critical Angewandte Digital Elektronik Gmbh
Priority to AU32191/95A priority Critical patent/AU3219195A/en
Priority to DE19580862T priority patent/DE19580862D2/en
Publication of WO1996005572A1 publication Critical patent/WO1996005572A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another

Definitions

  • the invention relates to a method for arranging coils for contactless smart cards (smart cards), which contain coils 9, 10 for electromagnetic coupling of the cards with their environment.
  • Coil arrangements are described which multiply the coil effect of a coil on a carrier element by superimposing carrier elements.
  • the thickness of the card is used to increase the coil effect. In this way, cards can receive more power from a transmitter in a small space. Data can be transmitted over a greater distance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

The invention concerns a folding process for combining coils on a flexible substrate, the inductance of the coils being amplified by their superimposition.

Description

Mehrlagige Chipkartenspulen für kontaktfreie Chipkarten.Multi-layer chip card coils for contactless chip cards.
Beschreibungdescription
Die Erfindung bezieht sich auf ein Verfahren zur Anordnung von Spulen zum Zwecke der Erhöhung ihrer Induktivität in Chipkarten.The invention relates to a method for arranging coils for the purpose of increasing their inductance in chip cards.
Es sind Plastikkarten als Chipkarten bekannt, welche kontaktfrei mit Schreib/Lesegeräten Energie und Daten austauschen. Diese Karten wer- den für vielfache Anwendungen wie beispielsweise Identifikationszwecke, Zutrittskontrollkarten eingesetzt. Ein Überblick über solche Karten und de¬ ren Anwendungen ist in drei Ausgaben der Elektronik Jahrgang 13 zusam¬ mengestellt.Plastic cards are known as chip cards, which exchange energy and data without contact with read / write devices. These cards are used for a wide range of applications such as identification purposes and access control cards. An overview of such cards and their applications is compiled in three editions of electronics year 13.
Der Erfindung liegt die Aufgabe zugrunde, in einfacher Weise Spulenanor- dungen zu schaffen, die in Chipkarten durch elektrische Verbindung in ih¬ rer Wirkung zu kombinieren sind und den begrenzten Raum in einer Karte optimal nutzen.The invention is based on the object of providing in a simple manner coil arrangements which are to be combined in their effect in chip cards by electrical connection and which make optimal use of the limited space in a card.
Diese Aufgabe wird durch die in dem Anspruch angegebenen Merkmale gelöst und wird nachfolgend in einer Ausführungsform beschrieben:This object is achieved by the features specified in the claim and is described below in one embodiment:
Figur 1 zeigt schematisch die Spulen 9,10 auf derselben Seite der Folie (wobei die Spulen in üblicher und bekannter Weise durch eine Isolier- schicht geschützt sind). Es können auch Spulen auf der gegenüberliegen¬ den Seite der Folie angeordnet werden. Die Spulen sind auf der Folie so angeordnet, daß ihre beiden Enden bei Faltung (an den Kontaktflächen 1 ,2 und 3,4) in der gewünschten Weise zueinander passen. Werden beispiels¬ weise die Spulen 9, 10 übereinandergelegt, setzt sich der Drehsinn der ei- nen Spule in der anderen Spule fort. Die Kontaktenden der Spulen können an vorgegebenen Löchern in der Folie zusammentreffen, und bei Verbin¬ dung mit einem leitfähigen und fließfähigen Material sind die Spulen elek¬ trisch verbindbar, womit sich eine Verdoppelung der induktiven Wirkung weise auch über eine Schaltung in dem elektronischen Chip einer Chipkar¬ te erfolgen, an den die Spulenenden angeschlossen werden.FIG. 1 shows schematically the coils 9, 10 on the same side of the film (the coils being protected in the usual and known manner by an insulating layer). Coils can also be arranged on the opposite side of the film. The coils are arranged on the film so that their two ends when folded (on the contact surfaces 1, 2 and 3,4) fit together in the desired manner. If, for example, the coils 9, 10 are placed one on top of the other, the direction of rotation of one coil continues in the other coil. The contact ends of the coils can meet at predetermined holes in the film, and when connected to a conductive and flowable material, the coils can be electrically connected, which doubles the inductive effect also take place via a circuit in the electronic chip of a chip card to which the coil ends are connected.
Die Erfindung betrifft gemäß dem Anspruch ein Verfahren zur Anordnung von Spulen für kontaktfreie Chipkarten (Smartcard), welche Spulen 9,10 zur elektromagnetischen Kopplung der Karten mit ihrer Umwelt enthalten. Es werden Spulenanordnungen beschrieben, welche die Spulenwirkung einer Spule auf einem Trägerelement durch Übereinanderlegen von Trä¬ gerelementen vervielfacht. Durch das Übereinanderlegen der Trägerele- mente wird die Dicke der Karte zur Erhöhung der Spulenwirkung ausge¬ nutzt. Karten können derart auf kleinem Raum mehr Leistung von einem Sender empfangen. Es können Daten über größere Entfernung übertragen werden.According to the claim, the invention relates to a method for arranging coils for contactless smart cards (smart cards), which contain coils 9, 10 for electromagnetic coupling of the cards with their environment. Coil arrangements are described which multiply the coil effect of a coil on a carrier element by superimposing carrier elements. By superimposing the carrier elements, the thickness of the card is used to increase the coil effect. In this way, cards can receive more power from a transmitter in a small space. Data can be transmitted over a greater distance.
Das Trägermaterial kann beispielsweise auf einer Rolle 16 aufgewickelt werden und kann an bestimmten vorgegebenen Stellen 17 zum Zwecke der Übereinanderlegung gefaltet werden. Die konzentrisch angeordneten Lei¬ terbahnen können so angeordnet werden, daß bei Faltung des Bandes, die richtigen Punkte der Spulen an markierten Stellen übereinanderliegen. Die Erfindung beschreibt ferner ein Verfahren zur elektrischen Verbindung der einzelnen Spulen an vorgegebenen Stellen durch eingebrachte Löcher in dem flexiblen Trägermaterial.The carrier material can, for example, be wound up on a roll 16 and can be folded at certain predetermined locations 17 for the purpose of being superimposed. The concentrically arranged conductor tracks can be arranged such that when the tape is folded, the correct points of the coils lie one above the other at marked points. The invention further describes a method for the electrical connection of the individual coils at predetermined points through holes made in the flexible carrier material.
In den Figuren 2 bis 4 sind durch die Bezugszeichen 13,14 jeweils ein Trägerelement,In FIGS. 2 to 4, reference symbols 13, 14 each indicate a carrier element,
15 ein Loch,15 a hole,
16 eine Rolle, und16 a role, and
17 eine Stelle bezeichnet. 17 denotes a place.

Claims

Anspruch 1 :Claim 1:
Verfahren zur Einbringung von Spulenanordnungen in Chipkarten, wobei die Spulenanordungen zum Zweck der Übertragung von elektromagneti- sehen Signalen und Leistung zwischen Chipkarten und externen Geräten in das Plastik der IC-Karte einzubetten sind, dadurch gekennzeichnet, daß einzelne Spulen (9,10) in Form von Leiterbahnwindungen auf mechanisch biegbaren, flexiblen Trägerelementen (13,14) galvanisch aufgetragen und die Trägerelemente in einem flächigen, zusammenhängenden Band ange- ordnet sind, und daß bei Zusammenfalten des Bandes an markierten Stel¬ len (17) sich eine Verstärkung der Induktivität der übereinandergelegten Spulen ergibt, wobei Löcher, welche in der Folie an definierten, wiederkeh¬ renden Stellen angebracht sind, zur elektrischen Verbindung der Spulen verwendet werden können. Method for introducing coil arrangements in chip cards, the coil arrangements for the purpose of transmitting electromagnetic signals and power between chip cards and external devices to be embedded in the plastic of the IC card, characterized in that individual coils (9, 10) are in the form of conductor track turns on mechanically bendable, flexible carrier elements (13, 14), and the carrier elements are arranged in a flat, coherent band, and that when the band is folded up at marked points (17), the inductance of the superimposed ones increases Coils results, wherein holes which are made in the film at defined, recurring locations can be used for the electrical connection of the coils.
PCT/DE1995/001052 1994-08-15 1995-08-04 Multi-layered chip card coils for contactless chip cards WO1996005572A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU32191/95A AU3219195A (en) 1994-08-15 1995-08-04 Multi-layered chip card coils for contactless chip cards
DE19580862T DE19580862D2 (en) 1994-08-15 1995-08-04 Multi-layer chip card coils for contactless chip cards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4428732.1 1994-08-15
DE19944428732 DE4428732C1 (en) 1994-08-15 1994-08-15 Multilayer chip card coil for contactless chip cards

Publications (1)

Publication Number Publication Date
WO1996005572A1 true WO1996005572A1 (en) 1996-02-22

Family

ID=6525623

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1995/001052 WO1996005572A1 (en) 1994-08-15 1995-08-04 Multi-layered chip card coils for contactless chip cards

Country Status (3)

Country Link
AU (1) AU3219195A (en)
DE (2) DE4428732C1 (en)
WO (1) WO1996005572A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0756244B1 (en) * 1995-07-26 2003-03-12 Giesecke & Devrient GmbH Electronic unit and method of producing that unit
DE102011003754A1 (en) * 2011-02-08 2012-08-09 Bolzenschweißtechnik Heinz Soyer GmbH Winding element, useful for forming a winding packet for a transformer, comprises connecting elements, and an insulating element arranged between two windings

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19641406C2 (en) * 1996-10-08 2001-03-08 Pav Card Gmbh Smart card
KR100629923B1 (en) * 1998-09-30 2006-09-29 돗빤호무즈가부시기가이샤 Conductive paste, curing method therof, method for fabricating antenna for contactless data transmitter-receiver, and contactless data transmitter-receiver
DE19962194A1 (en) * 1999-12-22 2001-06-28 Flexchip Ag Production of conductor loops for transponders comprises forming conductor loop on one side of deformable substrate, lengthening loop and folding substrate between lengthened outer end and outer end of loop
DE10233927A1 (en) * 2002-07-25 2004-02-12 Giesecke & Devrient Gmbh Data carrier with transponder coil
US7446663B2 (en) * 2004-04-20 2008-11-04 Alcoa Closure Systems International, Inc. Method of forming an RF circuit assembly having multiple antenna portions
JP2006304184A (en) 2005-04-25 2006-11-02 Lintec Corp Antenna circuit, ic inlet, ic tag, ic card, manufacturing method of ic tag and ic card
WO2020033533A1 (en) * 2018-08-07 2020-02-13 Avery Dennison Retail Information Services, Llc Overlapping coil structures formed by folding for compact rfid tags
WO2020092683A1 (en) 2018-10-31 2020-05-07 Avery Dennison Retail Information Services, Llc Wafer-scale integration with wafers that can be folded into three-dimensional packages

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156311A (en) * 1979-05-24 1980-12-05 Kokusai Electric Co Ltd Inductance element
EP0547563A1 (en) * 1991-12-16 1993-06-23 Siemens Aktiengesellschaft Printed circuit board antenna
US5276421A (en) * 1991-07-17 1994-01-04 Alcatel Converters Transformer coil consisting of an insulating ribbon comprising electrically conducting patterns making it possible to produce paralleling of the patterns when this ribbon is accordion folded

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3111516A1 (en) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Identity card with IC chip
JPH01157896A (en) * 1987-09-28 1989-06-21 Mitsubishi Electric Corp Noncontact type ic card and noncontact type card reader writer
JP2713529B2 (en) * 1992-08-21 1998-02-16 三菱電機株式会社 Signal receiving coil and non-contact IC card using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156311A (en) * 1979-05-24 1980-12-05 Kokusai Electric Co Ltd Inductance element
US5276421A (en) * 1991-07-17 1994-01-04 Alcatel Converters Transformer coil consisting of an insulating ribbon comprising electrically conducting patterns making it possible to produce paralleling of the patterns when this ribbon is accordion folded
EP0547563A1 (en) * 1991-12-16 1993-06-23 Siemens Aktiengesellschaft Printed circuit board antenna

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0756244B1 (en) * 1995-07-26 2003-03-12 Giesecke & Devrient GmbH Electronic unit and method of producing that unit
DE102011003754A1 (en) * 2011-02-08 2012-08-09 Bolzenschweißtechnik Heinz Soyer GmbH Winding element, useful for forming a winding packet for a transformer, comprises connecting elements, and an insulating element arranged between two windings

Also Published As

Publication number Publication date
AU3219195A (en) 1996-03-07
DE4428732C1 (en) 1996-01-04
DE19580862D2 (en) 1999-04-15

Similar Documents

Publication Publication Date Title
DE69706280T2 (en) CONTACTLESS ELECTRONIC MODULE FOR CARD OR LABEL
EP1271399B1 (en) Data carrier with integrated circuit
DE3824870A1 (en) SYSTEM FOR CONTACT-FREE INFORMATION TRANSFER BETWEEN AN IC CARD AND A CARD READING / WRITING DEVICE AND IC CARD
DE60019080T2 (en) IC CARD
EP0092555B1 (en) Tag-shaped identification device attachable to an object
DE19632115C1 (en) Combination chip module for smart cards allowing both contacting- and contactless communication with external data station
DE10201112A1 (en) A method of forming a dual interface IC card and a card formed by such a method
EP2820768B1 (en) Contactless data-transmitting device, security and/or value document containing said data-transmitting device, and method for producing the contactless data-transmitting device
EP0710919A2 (en) Contactless module
EP1267303B1 (en) Transponder
DE10012967A1 (en) Transponder used in radio frequency identification system, includes coupling elements connected to chip surface, and structurally designed to act as dipole antenna and disk capacitor
DE4431604A1 (en) Circuit arrangement with a chip card module and an associated coil
DE4428732C1 (en) Multilayer chip card coil for contactless chip cards
EP1435067B1 (en) Device for shielding a transponder, method for producing a corresponding shielding and transponder provided with said shielding
WO2018223171A2 (en) Device in particular printed item for data communication
EP0810547B1 (en) Method for manufacturing a card shaped data carrier
WO2004012138A1 (en) Data support with transponder coil
EP1133796B2 (en) A method for producing a two-dimensional support for semiconductor chips
EP1862953B1 (en) Method for contactless data and/or energy transmission between a terminal and at least one transponder
DE19962194A1 (en) Production of conductor loops for transponders comprises forming conductor loop on one side of deformable substrate, lengthening loop and folding substrate between lengthened outer end and outer end of loop
EP2158566B1 (en) Transponder system
DE19626702C1 (en) Chip card with contacts
DE20009865U1 (en) Antenna arrangement for contactless transponders
DE69226348T2 (en) Method of making a flexible RF antenna
DE10109030C2 (en) Contactless transponder

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AM AT AU BB BG BR BY CA CH CN CZ DE DK EE ES FI GB GE HU JP KE KG KP KR KZ LK LR LT LU LV MD MG MN MW MX NO NZ PL PT RO RU SD SE SI SK TJ TT UA US UZ VN

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): KE MW SD SZ UG AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: CA

122 Ep: pct application non-entry in european phase
REF Corresponds to

Ref document number: 19580862

Country of ref document: DE

Date of ref document: 19990415

WWE Wipo information: entry into national phase

Ref document number: 19580862

Country of ref document: DE

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载