WO1996041359B1 - Procede et appareil perfectionnes pour un dispositif fusible monte en surface - Google Patents
Procede et appareil perfectionnes pour un dispositif fusible monte en surfaceInfo
- Publication number
- WO1996041359B1 WO1996041359B1 PCT/US1996/009147 US9609147W WO9641359B1 WO 1996041359 B1 WO1996041359 B1 WO 1996041359B1 US 9609147 W US9609147 W US 9609147W WO 9641359 B1 WO9641359 B1 WO 9641359B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- fusible link
- conductive
- layer
- mount fuse
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims 15
- 239000000758 substrate Substances 0.000 claims abstract 33
- 239000011241 protective layer Substances 0.000 claims abstract 9
- 239000010409 thin film Substances 0.000 claims abstract 7
- 239000000463 material Substances 0.000 claims abstract 6
- 239000004593 Epoxy Substances 0.000 claims abstract 2
- 239000004642 Polyimide Substances 0.000 claims abstract 2
- 230000003647 oxidation Effects 0.000 claims abstract 2
- 238000007254 oxidation reaction Methods 0.000 claims abstract 2
- 229920001721 polyimide Polymers 0.000 claims abstract 2
- 239000004814 polyurethane Substances 0.000 claims abstract 2
- 229920002635 polyurethane Polymers 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims 40
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 8
- 238000000151 deposition Methods 0.000 claims 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 4
- 239000011253 protective coating Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010408 film Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
Abstract
L'invention concerne un fusible monté en surface (58) à couche mince comportant deux sous-ensembles matière. Le premier sous-ensemble comprend une liaison fusible (42), son substrat de support (13) et ses plots terminaux (34, 36). Le deuxième sous-ensemble comprend une couche protectrice (56) qui recouvre la liaison fusible (42) de manière à assurer une protection contre les chocs et l'oxydation. Cette couche protectrice (56) est de préférence constituée d'un materiau polymère. Le matériau polymère idéal est un gel ou une pâte de polyuréthane. En outre, le substrat de support idéal est une époxy FR-4 ou un polyimide.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9501537A JPH10512094A (ja) | 1995-06-07 | 1996-06-06 | 薄膜表面実装ヒューズおよびその製造方法 |
| DK96919129T DK0830704T3 (da) | 1995-06-07 | 1996-06-06 | Forbedret fremgangsmåde og apparatur til en overflademonteret sikringsindretning |
| AU61547/96A AU6154796A (en) | 1995-06-07 | 1996-06-06 | Improved method and apparatus for a surface-mounted fuse dev ice |
| DE69600974T DE69600974T2 (de) | 1995-06-07 | 1996-06-06 | Verbessertes verfahren und gerät für oberflächenmontierte sicherungsvorrichtung |
| EP96919129A EP0830704B1 (fr) | 1995-06-07 | 1996-06-06 | Procede et appareil perfectionnes pour un dispositif fusible monte en surface |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47256395A | 1995-06-07 | 1995-06-07 | |
| US08/482,829 | 1995-06-07 | ||
| US08/482,829 US5943764A (en) | 1994-05-27 | 1995-06-07 | Method of manufacturing a surface-mounted fuse device |
| US08/472,563 | 1995-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1996041359A1 WO1996041359A1 (fr) | 1996-12-19 |
| WO1996041359B1 true WO1996041359B1 (fr) | 1997-02-06 |
Family
ID=27043825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1996/009147 WO1996041359A1 (fr) | 1995-06-07 | 1996-06-06 | Procede et appareil perfectionnes pour un dispositif fusible monte en surface |
Country Status (10)
| Country | Link |
|---|---|
| EP (1) | EP0830704B1 (fr) |
| JP (1) | JPH10512094A (fr) |
| CN (1) | CN1191624A (fr) |
| AT (1) | ATE173355T1 (fr) |
| AU (1) | AU6154796A (fr) |
| CA (1) | CA2224070A1 (fr) |
| DE (1) | DE69600974T2 (fr) |
| DK (1) | DK0830704T3 (fr) |
| ES (1) | ES2124634T3 (fr) |
| WO (1) | WO1996041359A1 (fr) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5923239A (en) * | 1997-12-02 | 1999-07-13 | Littelfuse, Inc. | Printed circuit board assembly having an integrated fusible link |
| WO1999056297A1 (fr) * | 1998-04-24 | 1999-11-04 | Wickmann-Werke Gmbh | Fusible electrique |
| US6002322A (en) * | 1998-05-05 | 1999-12-14 | Littelfuse, Inc. | Chip protector surface-mounted fuse device |
| GB0001573D0 (en) * | 2000-01-24 | 2000-03-15 | Welwyn Components Ltd | Printed circuit board with fuse |
| WO2002103735A1 (fr) * | 2001-06-11 | 2002-12-27 | Wickmann-Werke Gmbh | Composant de fusible |
| US7551048B2 (en) | 2002-08-08 | 2009-06-23 | Fujitsu Component Limited | Micro-relay and method of fabricating the same |
| CN101197351B (zh) * | 2006-12-05 | 2010-09-01 | 邱鸿智 | 芯片慢熔型保险丝结构与制造方法 |
| CN101894717B (zh) * | 2009-05-21 | 2012-10-24 | 邱鸿智 | 具钻孔电极与压模包覆保险丝结构及制造方法 |
| US9117615B2 (en) | 2010-05-17 | 2015-08-25 | Littlefuse, Inc. | Double wound fusible element and associated fuse |
| JP5505142B2 (ja) * | 2010-07-06 | 2014-05-28 | 富士通株式会社 | ヒューズおよびその製造方法 |
| CN101964287B (zh) * | 2010-10-22 | 2013-01-23 | 广东风华高新科技股份有限公司 | 薄膜片式保险丝及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4164725A (en) * | 1977-08-01 | 1979-08-14 | Wiebe Gerald L | Three-piece solderless plug-in electrically conducting component |
| GB1604820A (en) * | 1978-05-30 | 1981-12-16 | Laur Knudson Nordisk Elektrici | Electrical safety fuses |
| DE3044711A1 (de) * | 1980-11-27 | 1982-07-01 | Wickmann-Werke GmbH, 5810 Witten | Schmelzsicherung |
| DE3530354A1 (de) * | 1985-08-24 | 1987-03-05 | Opel Adam Ag | Elektrische sicherungsanordnung |
| JPH0831303B2 (ja) * | 1986-12-01 | 1996-03-27 | オムロン株式会社 | チツプ型ヒユ−ズ |
| WO1991014279A1 (fr) * | 1990-03-13 | 1991-09-19 | Morrill Glasstek, Inc. | Element electrique (fusible) et methode de fabrication de celui-ci |
| JPH0433230A (ja) * | 1990-05-29 | 1992-02-04 | Mitsubishi Materials Corp | チップ型ヒューズ |
| JPH04248221A (ja) * | 1991-01-23 | 1992-09-03 | Hitachi Chem Co Ltd | チップ型ヒューズの製造法 |
| JPH04245132A (ja) * | 1991-01-30 | 1992-09-01 | Hitachi Chem Co Ltd | チップヒューズ用基板及びそれを用いたチップヒューズ |
| JPH04245129A (ja) * | 1991-01-30 | 1992-09-01 | Hitachi Chem Co Ltd | チップ型ヒューズ |
| JPH04255627A (ja) * | 1991-02-08 | 1992-09-10 | Hitachi Chem Co Ltd | チップ型ヒューズの製造法 |
| JPH05166454A (ja) * | 1991-12-11 | 1993-07-02 | Hitachi Chem Co Ltd | チップ型ヒューズ |
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
| JPH0636672A (ja) * | 1992-07-16 | 1994-02-10 | Sumitomo Wiring Syst Ltd | カード型ヒューズおよびその製造方法 |
| US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
-
1996
- 1996-06-06 EP EP96919129A patent/EP0830704B1/fr not_active Expired - Lifetime
- 1996-06-06 AT AT96919129T patent/ATE173355T1/de not_active IP Right Cessation
- 1996-06-06 DK DK96919129T patent/DK0830704T3/da active
- 1996-06-06 JP JP9501537A patent/JPH10512094A/ja active Pending
- 1996-06-06 WO PCT/US1996/009147 patent/WO1996041359A1/fr not_active Application Discontinuation
- 1996-06-06 CN CN96195755A patent/CN1191624A/zh active Pending
- 1996-06-06 AU AU61547/96A patent/AU6154796A/en not_active Abandoned
- 1996-06-06 DE DE69600974T patent/DE69600974T2/de not_active Expired - Lifetime
- 1996-06-06 CA CA002224070A patent/CA2224070A1/fr not_active Abandoned
- 1996-06-06 ES ES96919129T patent/ES2124634T3/es not_active Expired - Lifetime
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