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WO1996041359A1 - Procede et appareil perfectionnes pour un dispositif fusible monte en surface - Google Patents

Procede et appareil perfectionnes pour un dispositif fusible monte en surface Download PDF

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Publication number
WO1996041359A1
WO1996041359A1 PCT/US1996/009147 US9609147W WO9641359A1 WO 1996041359 A1 WO1996041359 A1 WO 1996041359A1 US 9609147 W US9609147 W US 9609147W WO 9641359 A1 WO9641359 A1 WO 9641359A1
Authority
WO
WIPO (PCT)
Prior art keywords
fusible link
fuse
terminal pad
substrate
conductive
Prior art date
Application number
PCT/US1996/009147
Other languages
English (en)
Other versions
WO1996041359B1 (fr
Inventor
Vladimir Blecha
Katherine M. Mcguire
Andrew J. Neuhalfen
Daniel B. Onken
Original Assignee
Littelfuse, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/482,829 external-priority patent/US5943764A/en
Application filed by Littelfuse, Inc. filed Critical Littelfuse, Inc.
Priority to DK96919129T priority Critical patent/DK0830704T3/da
Priority to EP96919129A priority patent/EP0830704B1/fr
Priority to DE69600974T priority patent/DE69600974T2/de
Priority to JP9501537A priority patent/JPH10512094A/ja
Priority to AU61547/96A priority patent/AU6154796A/en
Publication of WO1996041359A1 publication Critical patent/WO1996041359A1/fr
Publication of WO1996041359B1 publication Critical patent/WO1996041359B1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices

Definitions

  • the invention relates generally to a surface-mountable fuse for placement into and protection of the electrical circuit of a printed circuit board.
  • PC Printed circuit
  • the passivation layer is either chemically vapor-deposited silica or a thick layer of printed glass. See '656 patent, column 3, lines 39-41.
  • the insulating cover may be a glass cover. See '656 patent, column
  • the fuse from the '656 patent has three layers protecting its fusible link. In addition, the fuse from the '656 patent has relatively thick glass covering. There are several other features in the '656 patent fuse
  • the present invention is designed to solve these and other problems.
  • the invention is a thin film, surface-mounted fuse which comprises two material subassemblies.
  • the first subassembly comprises a fusible link, its supporting substrate and terminal pads.
  • the second subassembly comprises a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation.
  • the protective layer is preferably made of a polymeric material .
  • the most preferred polymeric material is a polyurethane gel or paste when the stencil printing step is used to apply the cover coat.
  • polycarbonates will also work well when an injection molding step is used to apply the cover coat.
  • the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
  • a second aspect of the invention is a thin film, surface-mounted fuse.
  • This fuse comprises a fusible link made of a conductive metal.
  • the first conductive metal is preferably, but not exclusively, selected from the group including copper, silver, nickel, titanium, aluminum or alloys of these conductive metals.
  • a second conductive metal, different from the first conductive metal, is deposited on the surface of this fusible link.
  • One preferred metal for the surface-mounted fuse of this invention is copper.
  • One preferred second conductive metal is tin-lead. 5 Another preferred second conductive metal is tin.
  • the second conductive metal may be deposited onto the fusible link in the form of a rectangle, circle or in the form of any of
  • the second conductive metal is preferably deposited along the central portion of the fusible link.
  • PVD physical vapor deposition
  • the top of the substrate of the present fuse enables one to use laser processing methods as a high precision secondary operation, in that way trimming the final resistance value of the fuse element .
  • FIG. 1 is a perspective view of a copper-plated, FR-4 epoxy sheet used to make a subminiature surface-mounted fuse in accordance with the invention.
  • FIG. 2 is a view of a portion of the sheet of FIG. 1, and taken along lines 2-2 of FIG. 1.
  • FIG. 3 is a perspective view of the FR-4 epoxy sheet of FIG. 1, but stripped of
  • FIG. 4 is an enlarged, perspective view of a cut-away portion of the bored sheet of FIG. 3, but with a copper plating layer having been reapplied.
  • FIG. 5 is a cut-away perspective
  • FIG. 6 is a perspective view of the
  • FIG. 7 is a perspective view of the top-side of FIG. 6, rotated about one of the 5 fuse rows 27, and showing linear regions 40 defined by dotted lines.
  • FIG. 8 is a perspective view of a single fuse row 27 from the sheet, cut away from the other fuse rows, and cut away at one
  • FIG. 9 is a perspective view of the strip of FIG. 8, but prior to UV light curing, and showing a fuse-blowing portion 50 at the center of fusible link 42 that is masked with
  • FIG. 10 shows the strip of FIG. 9, but after immersion into a tin-lead plating bath to create another layer over the copper and nickel layers, and after deposition of a
  • FIG. 11 shows the strip of FIG. 10, but with an added polymeric gel or paste layer onto the top of the fuse row 27.
  • FIG. 12 shows the individual fuse in accordance with the invention as it is finally made, and after a so-called dicing operation in which a diamond saw is used to cut the strips along parallel and perpindicular planes to form these individual surface-mountable fuses .
  • the thin film, surface-mounted fuse is a subminiature fuse used in a surface mount configuration on a PC board or on a thick film hybrid circuit .
  • One of these fuses is typically known in the art as an "A" case fuse.
  • the "A" case fuse standard industry size for these fuses is 125 mils, long by 60 mils. wide.
  • the "A" case fuse is also designated as a 1206 f se.
  • the present invention includes even smaller sized fuses which are compatible with standard sized surface mountable devices.
  • the present invention can be used within all other standard sizes of such surface mountable device sizes, such as 1210, 0805, 0603 and 5 0402 fuses, as well as non-standard sizes.
  • the invention generally comprises two material subassemblies. As will be seen, the first subassembly includes the fuse element or fusible link 42, its supporting
  • the second subassembly is a protective layer 56 which overlies the fusible link 42 and a substantial portion of the top portion of the
  • the first subassembly contains and
  • the 20 supports two metal electrodes or pads 34, 36, and the fusible element or link 42, both of which are bonded to the substrate as a single continuous film, as shown in FIGs. 5 and 6.
  • the pads 34, 36 are located on the top, the 25 bottom, and a the sides of the substrate or core 13, while the fusible link 42 is located at the top of the substrate 13. More specifically, the pads 34, 36 extend into the two grooves 16 (each groove 16 is one half of
  • each bore 14 in each fuse created by the bores 14 and dicing operation during the process of manufacture, as will be further described below.
  • pads are made up of several 5 layers, including a base copper layer, a supplemental copper layer, a nickel layer and a tin-lead layer.
  • the base copper layer of the pads and the thin film fusible link are simultaneously deposited by (1)
  • This fuse may be made by the following process. Shown in FIGS. 1 and 2 is a solid sheet 10 of an FR-4 epoxy with copper plating 12. The copper plating 12 and the FR-
  • This copper-plated FR-4 epoxy sheet 10 is available from Allied Signal Laminate Systems, Hoosick Falls, New York, as Part No. 0200BED130C1/C1GFN0200 C1/C1A2C.
  • FR-4 epoxy is a preferred 5 material
  • other suitable materials include any material that is compatible with, i.e., of a chemically, physically and structurally similar nature to, the materials from which PC boards are made.
  • another suitable material include any material that is compatible with, i.e., of a chemically, physically and structurally similar nature to, the materials from which PC boards are made.
  • another suitable materials include any material that is compatible with, i.e., of a chemically, physically and structurally similar nature to, the materials from which PC boards are made.
  • another suitable materials include any material that is compatible with, i.e., of a chemically, physically and structurally similar nature to, the materials from which PC boards are made.
  • another suitable materials include any material that is compatible with, i.e., of
  • polyimide for this solid sheet 10 is polyimide.
  • FR-4 epoxy and polyimide are among the class of materials having physical properties that are nearly identical with the standard substrate material used in the PC board
  • the fuse of the invention and the PC board to which that fuse is secured have extremely well-matched thermal and mechanical properties.
  • the substrate of the fuse of the present invention also has very well-matched thermal and mechanical properties.
  • the copper plating 12 is etched away from the solid sheet 10 by a conventional etching process.
  • this conventional etching In this conventional etching
  • the copper is etched away from the substrate by a ferric chloride solution. 12
  • the FR-4 epoxy sheet 10 having this treated, copper-free surface is then drilled or punched to create holes or bores 14 along four quadrants 10a, 10b, 10c, lOd of the sheet
  • the length L between the center of the bores 14 is approximately 70 mils, and the width W between the center of the bores 14 is approximately 38 mils.
  • the length L between the center of the bores 14 is approximately 50 mils, and the width W between the center of the bores 14 is approximately 30 mils.
  • the diameter D (FIG. 4) for each bore 14 for the "603" sizing is approximately 18 mils.
  • This copper plating step results in the placement of a copper layer having a uniform thickness along each of the exposed 25 surfaces of the sheet 10.
  • the copper plating 18 resulting from this step covers both (1) the flat, upper surfaces 22 of the sheet 10; and (2) the vertical regions of the groves 16
  • the copper plating 18 has a thickness
  • the copper plating 18 has a thickness of approximately 75,000 Angstroms for a particular width of the fusable link.
  • Square panels are a part of, and are evenly spaced across, this clear mask according to the sizing of the fuse being 25 manufactured. These square panels are made of an UV light-opaque substance, and are generally shown as the rectangle 30 shown in FIG. 5. Essentially, by placing this mask having these panels onto the replated copper
  • these square panels will essentially define the shapes and sizes of the so-called fusible link 42 and the upper terminal areas 60 of the terminal pads 34, 36 on the upper portion 22 of the fuse.
  • the fusible link 42 is in electrical communication with the upper terminal areas 60. It will be appreciated that the width, length and shape of both the fusible link 42 and these upper terminal areas 60 may be altered by changing the size and shape of these UV light-opaque panels.
  • the backside of the sheet is covered with a photoresist material and an otherwise clear mask is placed over the replated copper sheet 20 after it has been covered with the photoresist.
  • a rectangular panel is a part of this clear mask.
  • the rectangular panels are made of a UV light- opaque substance, and are of a size corresponding to the size of the panel 28 shown in FIG. 6. Essentially, by placing this mask having these panels onto the replated copper sheet 20, several strips of the flat, downward-facing surfaces 28 of the replated copper sheet 20 are effectively shielded from the effects of the UV light.
  • the rectangular panels will essentially define the shapes and 16
  • the copper plating from a portion of 5 the underside of a sheet 20 is defined by a photoresist mask. Particularly, the copper plating from the lower, middle portions 28 of the underside of the sheet 20 is removed. The lower, middle portions 28 of the underside of
  • the sheet 20 is that part of the strip along a line immediately beneath the areas 30 of clear epoxy, and the fuse links 42.
  • a perspective view of this section of this replated sheet 20 is shown in FIG. 6.
  • the replated sheet 20 is subjected to the UV light for a time sufficient to ensure
  • the cured photoresist prevents the removal of copper beneath those areas of cured photoresist.
  • the regions formerly below the square panels have no cured 5 photoresist and no such protection.
  • the copper from those regions can be removed by etching. This etching is performed with a ferric chloride solution through well known etching concepts.
  • the replated sheet 20 is then placed in a chemical bath to remove all of the remaining cured photoresist from the previously cured areas of that sheet 20.
  • this sheet 20 will ultimately be cut into a plurality of pieces, and each of these pieces becomes a fuse in accordance with the 25 invention, as will be further described below.
  • this sheet 20 will ultimately be cut into a plurality of pieces, and each of these pieces becomes a fuse in accordance with the 25 invention, as will be further described below.
  • FIGS. 5 through 7 only a cut-away portion of the overall sheet including three rows 27 and four columns 29 is shown in FIGS. 5 through 7. As may also be
  • the bores 14 and grooves of the sheet 20 still include copper 18
  • FIG. 7 is a perspective view of the opposite side of the sheet 20 from FIG. 6. Directly opposite and coinciding with the lower, middle portions 28 of the sheet 20 are
  • FIG. 7 is to be referred to in connection with the next step in the
  • fusible links 42 are made of a conductive metal, here copper.
  • the photoresist polymer is then treated with UV
  • the middle portion 28 of the underside of the 5 sheet 20 will also not be subject to plating when the sheet 20 is dipped into the electrolytic plating bath. Copper metal previously covering this metal portion had been removed, revealing the bare epoxy that
  • the entire sheet 20 is dipped into an electrolytic copper plating bath and then
  • a tin-lead layer 52 (FIG. 10) is
  • a tin-lead spot 54 is also deposited onto the surface of the fusible link 42, i.e., essentially placed by an electrolytic plating process onto the central portion 50 of the
  • This electrolytic plating process is essentially a thin film deposition process. It will be understood, however, that this tin-lead may also be added to the surface of the fusible link 42 by a photolithographic
  • This spot 54 is comprised of a second conductive metal, i.e., tin-lead or 5 tin, that is dissimilar to the copper metal of the fusible link 42.
  • This second conductive metal in the form of the tin-lead spot 54 is deposited onto the fusible link 42 in the form of a rectangle.
  • the tin-lead spot 54 on the fusible link 42 provides that link 42 with certain advantages. First, the tin-lead spot 54 melts upon current overload conditions, creating a fusible link 42 that becomes a tin-lead-copper
  • This tin-lead-copper alloy results in a fusible link 42 having a lower melting temperature than the copper alone.
  • the lower melting temperature reduces the operating temperature of the fuse device of the
  • the tin-lead alloy or other metal deposited on the fusible link 42 need not be 22
  • the second conductive metal may be placed in a notched section of the link, or in 5 holes or voids in that link.
  • Parallel fuse links are also possible. As a result of this flexibility, specific electrical characteristics can be engineered into the fuse to meet varying needs of the ultimate
  • one of the possible fusible link configurations is a serpentine configuration.
  • the next step in the manufacture of the device of the invention is the placement, across a significant portion of the top of the sheet 20 between the terminal pads 34, 36, of
  • This protective layer 56 is the second subassembly of the present fuse, and forms a relatively tight seal over the portion of the top of the sheet where the fusible links 42 exist.
  • the protective layer 56 inhibits corrosion of the fusible links 42 during their 23
  • the protective layer 56 also provides protection from oxidation and impacts during attachment to the PC board. This protective layer also serves as a means of 5 providing for a surface for pick and place operations which use a vacuum pick-up tool. This protective layer 56 helps to control the melting, ionization and arcing which occur in the fusible link 42 during
  • the protective layer 56 or cover coat material provides desired arc-quenching characteristics, especially important upon interruption of the fusible link 42.
  • the protective layer 56 may be comprised of a polymer, preferably a polyurethane gel or paste when a stencil print operation is used to apply the cover coat .
  • a preferred polyurethane is made by Dymax
  • the protective layer 56 may also be comprised of plastics, conformal coatings and epoxies.
  • This protective layer 56 is applied to the strips 26 using a stencil printing process which includes the use of a common stencil printing machine.
  • a stencil printing process which includes the use of a common stencil printing machine.
  • the material is applied to the sheet 20 in strips simultaneously, instead of two strips at a time in the die mold/injection filling process.
  • the material is cured much faster than the injection fill process because in the stencil printing process, the cover coat material is completely exposed to the UV radiation from the lamps as opposed to the injection filling
  • the stencil printing machine comprises a slidable plate 70, a base 72. a 5 squeegee arm 74, a squeegee 76, and an overlay 78.
  • the overlay 78 is mounted on the base 72 and the squeegee 76 is movably mounted on the squeegee arm 74 above the base 72 and overlay 78.
  • the plate 70 is slidable underneath the
  • the overlay 78 has parallel openings 80 which correspond to the width of the cover coat 56.
  • the stencil printing process begins by attaching an adhesive tape under the fuse
  • the cover coat now covers the fuse link area 40 (FIGS. 8 & 9) .
  • the squeegee 76 is 26
  • the sheet 20 is unlodged from the overlay 78, and the sheet 20 is placed in a UV light chamber so that the material can solidify and form the protective layer 56 5 (FIGS. 11 & 12) .
  • the openings 80 in the overlay 78 are wide enough so that the protective layer partially overlaps the pads 34, 36, as shown in FIGS. 11 & 12.
  • the material used for the cover coat is used for the cover coat
  • cover coat 15 Although a colorless, clear cover coat is aesthetically pleasing, alternative types of cover coats may be used. For example, colored, clear materials may be used. These colored materials may be simply
  • this protective layer 56 has significant advantages over the prior art, including the prior art, so-called, "capping" method. Due to the placement of the 5 protective layer 56 over the entire top of a fuse body, the location of the protective layer relative to the location of the fusible link 42 is not critical.
  • the sheet 20 is then ready for a so-
  • dicing operation which separates the rows and columns 27, 29 from one another, and into individual fuses.
  • a diamond saw or the like is used to cut the sheet 20 along parallel planes 57
  • This cutting operation completes the 25 manufacture of the thin film surface-mounted fuse 58 (FIG. 12) of the present invention.
  • Fuses in accordance with this invention are rated at voltages and amperages greater than the ratings of prior art devices.
  • the fuse of the present invention exhibits improved control of fusing characteristics by regulating voltage drops

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Lock And Its Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un fusible monté en surface (58) à couche mince comportant deux sous-ensembles matière. Le premier sous-ensemble comprend une liaison fusible (42), son substrat de support (13) et ses plots terminaux (34, 36). Le deuxième sous-ensemble comprend une couche protectrice (56) qui recouvre la liaison fusible (42) de manière à assurer une protection contre les chocs et l'oxydation. Cette couche protectrice (56) est de préférence constituée d'un materiau polymère. Le matériau polymère idéal est un gel ou une pâte de polyuréthane. En outre, le substrat de support idéal est une époxy FR-4 ou un polyimide.
PCT/US1996/009147 1995-06-07 1996-06-06 Procede et appareil perfectionnes pour un dispositif fusible monte en surface WO1996041359A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DK96919129T DK0830704T3 (da) 1995-06-07 1996-06-06 Forbedret fremgangsmåde og apparatur til en overflademonteret sikringsindretning
EP96919129A EP0830704B1 (fr) 1995-06-07 1996-06-06 Procede et appareil perfectionnes pour un dispositif fusible monte en surface
DE69600974T DE69600974T2 (de) 1995-06-07 1996-06-06 Verbessertes verfahren und gerät für oberflächenmontierte sicherungsvorrichtung
JP9501537A JPH10512094A (ja) 1995-06-07 1996-06-06 薄膜表面実装ヒューズおよびその製造方法
AU61547/96A AU6154796A (en) 1995-06-07 1996-06-06 Improved method and apparatus for a surface-mounted fuse dev ice

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US47256395A 1995-06-07 1995-06-07
US08/482,829 1995-06-07
US08/482,829 US5943764A (en) 1994-05-27 1995-06-07 Method of manufacturing a surface-mounted fuse device
US08/472,563 1995-06-07

Publications (2)

Publication Number Publication Date
WO1996041359A1 true WO1996041359A1 (fr) 1996-12-19
WO1996041359B1 WO1996041359B1 (fr) 1997-02-06

Family

ID=27043825

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/009147 WO1996041359A1 (fr) 1995-06-07 1996-06-06 Procede et appareil perfectionnes pour un dispositif fusible monte en surface

Country Status (10)

Country Link
EP (1) EP0830704B1 (fr)
JP (1) JPH10512094A (fr)
CN (1) CN1191624A (fr)
AT (1) ATE173355T1 (fr)
AU (1) AU6154796A (fr)
CA (1) CA2224070A1 (fr)
DE (1) DE69600974T2 (fr)
DK (1) DK0830704T3 (fr)
ES (1) ES2124634T3 (fr)
WO (1) WO1996041359A1 (fr)

Cited By (7)

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WO1999029147A1 (fr) * 1997-12-02 1999-06-10 Littelfuse, Inc. Ensemble plaquette de circuits imprimes a connexion fusible integree
WO1999056297A1 (fr) * 1998-04-24 1999-11-04 Wickmann-Werke Gmbh Fusible electrique
GB2340317A (en) * 1998-05-05 2000-02-16 Littelfuse Inc Surface-mounted fuse
EP1120807A1 (fr) * 2000-01-24 2001-08-01 Welwyn Components Limited Circuit à film mince ou épais avec fusible
WO2002103735A1 (fr) * 2001-06-11 2002-12-27 Wickmann-Werke Gmbh Composant de fusible
EP1388875A3 (fr) * 2002-08-08 2006-04-12 Fujitsu Component Limited MEMS eletrostatique et étanche
US9117615B2 (en) 2010-05-17 2015-08-25 Littlefuse, Inc. Double wound fusible element and associated fuse

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
CN101197351B (zh) * 2006-12-05 2010-09-01 邱鸿智 芯片慢熔型保险丝结构与制造方法
CN101894717B (zh) * 2009-05-21 2012-10-24 邱鸿智 具钻孔电极与压模包覆保险丝结构及制造方法
JP5505142B2 (ja) * 2010-07-06 2014-05-28 富士通株式会社 ヒューズおよびその製造方法
CN101964287B (zh) * 2010-10-22 2013-01-23 广东风华高新科技股份有限公司 薄膜片式保险丝及其制备方法

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US4164725A (en) * 1977-08-01 1979-08-14 Wiebe Gerald L Three-piece solderless plug-in electrically conducting component
GB1604820A (en) * 1978-05-30 1981-12-16 Laur Knudson Nordisk Elektrici Electrical safety fuses
GB2089148A (en) * 1980-11-27 1982-06-16 Wickmann Werke Gmbh Electrical fuse
DE3530354A1 (de) * 1985-08-24 1987-03-05 Opel Adam Ag Elektrische sicherungsanordnung
EP0270954A1 (fr) * 1986-12-01 1988-06-15 Omron Tateisi Electronics Co. Fusible du type chip
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Cited By (13)

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Publication number Priority date Publication date Assignee Title
WO1999029147A1 (fr) * 1997-12-02 1999-06-10 Littelfuse, Inc. Ensemble plaquette de circuits imprimes a connexion fusible integree
WO1999056297A1 (fr) * 1998-04-24 1999-11-04 Wickmann-Werke Gmbh Fusible electrique
US6650223B1 (en) 1998-04-24 2003-11-18 Wickmann-Werke Gmbh Electrical fuse element
GB2340317A (en) * 1998-05-05 2000-02-16 Littelfuse Inc Surface-mounted fuse
DE19920475B4 (de) * 1998-05-05 2006-03-23 Littelfuse, Inc., Des Plaines Oberflächenbefestigte Dünnfilm-Schmelzsicherung
GB2340317B (en) * 1998-05-05 2002-09-11 Littelfuse Inc Chip protector surface-mounted fuse device
US6614341B2 (en) 2000-01-24 2003-09-02 International Resistive Company, Inc. Thick film circuit with fuse
EP1120807A1 (fr) * 2000-01-24 2001-08-01 Welwyn Components Limited Circuit à film mince ou épais avec fusible
WO2002103735A1 (fr) * 2001-06-11 2002-12-27 Wickmann-Werke Gmbh Composant de fusible
US7489229B2 (en) 2001-06-11 2009-02-10 Wickmann-Werke Gmbh Fuse component
EP1388875A3 (fr) * 2002-08-08 2006-04-12 Fujitsu Component Limited MEMS eletrostatique et étanche
US7551048B2 (en) 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
US9117615B2 (en) 2010-05-17 2015-08-25 Littlefuse, Inc. Double wound fusible element and associated fuse

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ES2124634T3 (es) 1999-02-01
MX9709974A (es) 1998-06-28
EP0830704A1 (fr) 1998-03-25
CN1191624A (zh) 1998-08-26
DE69600974T2 (de) 1999-06-10
EP0830704B1 (fr) 1998-11-11
AU6154796A (en) 1996-12-30
DK0830704T3 (da) 1999-07-26
JPH10512094A (ja) 1998-11-17
DE69600974D1 (de) 1998-12-17
CA2224070A1 (fr) 1996-12-19
ATE173355T1 (de) 1998-11-15

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