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WO1982003040A1 - Stabilisateur parallele pour machines de rectification et de polissage de plan et systeme porteur rotatif pour machine de meulage de plan a tete duplex, machine de planage fin a double plan, machine de rectification double et machine de polissage - Google Patents

Stabilisateur parallele pour machines de rectification et de polissage de plan et systeme porteur rotatif pour machine de meulage de plan a tete duplex, machine de planage fin a double plan, machine de rectification double et machine de polissage Download PDF

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Publication number
WO1982003040A1
WO1982003040A1 PCT/JP1981/000052 JP8100052W WO8203040A1 WO 1982003040 A1 WO1982003040 A1 WO 1982003040A1 JP 8100052 W JP8100052 W JP 8100052W WO 8203040 A1 WO8203040 A1 WO 8203040A1
Authority
WO
WIPO (PCT)
Prior art keywords
machine
double
polishing
lapping
plane
Prior art date
Application number
PCT/JP1981/000052
Other languages
English (en)
Japanese (ja)
Inventor
Kikai Co Ltd Shibayama
Yoshio Ishimura
Original Assignee
Hatano Kouichi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hatano Kouichi filed Critical Hatano Kouichi
Priority to PCT/JP1981/000052 priority Critical patent/WO1982003040A1/fr
Publication of WO1982003040A1 publication Critical patent/WO1982003040A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders

Definitions

  • the parallel stabilizer in the plane lapping machine and the polish ⁇ , the rain head surface grinder, the double-sided lapping machine, the double-sided lapping machine and the rotary carrier method in the polishing machine is the parallel stabilizer in the plane lapping machine and the polish ⁇ , the rain head surface grinder, the double-sided lapping machine, the double-sided lapping machine and the rotary carrier method in the polishing machine.
  • the 3 ⁇ 4 of n3 ⁇ 4 has advanced remarkably, and from transistors to ICs, ICs to SIs, LSIs and LSIs, and miniaturization from precision to ultra-compact and ultra-precise, computers, microcomputers, and offices
  • the necessity of making the first and last grades of the Jubilee unit, and the need for ultra-precision machines to make these ultra-small electronic parts have increased.
  • ultra-precise lapping and polishing such as silicon for semiconductor LSI, sapphire of SOS, glass substrate for photomask, etc.
  • ceramic, GGG, sendust Equipment for feeding workpieces to double-sided grinding, double-sided lap ⁇ , fining line cutting machine, double-sided polishing for electrical, chemical grinding, lapping and polishing of thin materials such as steel, ferrite, hard alloys, etc.
  • the parallelism and the depth of the raft can be obtained, thereby enabling the dense lapping and polishing, and the double-sided lapping machine and the double-sided lapping machine for electrically and chemically treating the thin material Lf, lapping and polishing. Board, fining lined-Automatic supply of workpieces to polish
  • ⁇ MPI It relates to a device for feeding.
  • FIG. 1 shows an embodiment of the present invention.
  • Fig. 1 is a front view of an embodiment of Fig. 1
  • Fig. 2 is a front view of Fig. 1
  • Fig. 3 is a front view of an apparatus according to the present invention
  • Fig. 4 is FIG. 5 is a front view
  • FIG. 6 is a front view
  • FIG. 7 is a rotary carrier type inverted view
  • FIG. 8 is a front view of the whole.
  • Fig. 1 shows the support S2 for supporting the main body and the pneumatic or hydraulic cylinder 8 is a lapping plate or polisher. 3 A pressure head. Alternatively, it is a pulley for giving ⁇ force roll lj) to policing constant 2.
  • a general polishing machine and a lap s are equipped with these devices, but they are close to a genuinely non-J ⁇ that controls the degree of parallelism to stabilize the lap and polishing accuracy.
  • Silicon, sapphires, and wafers that are required for the cleavage of semiconductors (the high precision of the wafers is required, and the conventional wrapping and polishing S cannot easily obtain the required degree of hesitation. .
  • the present invention introduces the ⁇ SS: VOL.
  • Reference numeral 3 denotes a lap and polishing head body for holding 9 carriers (work holders) and applying an appropriate surface pressure to the work 10.
  • Reference numeral 4 denotes a parallelism adjusting device formed by cutting a long hole 7 as shown in the figure
  • reference numeral 5 denotes a screw integrated with the parallelism adjusting device 6.
  • Reference numeral 6 denotes a set screw (nut) for turning the parallelism adjusting device when it is displaced in the horizontal direction.
  • FIG. 5 in view of FIG. 6 is where you Dzura parallelism 11 integer unit 4 the way to the right, there is a deviation of ⁇ degree of a to the ⁇ workpiece; in »case 3 ⁇ 4> [rho 0 Work The higher the momentum becomes, the more it is wrapped and polished, and if the work is in a row as shown in Fig. 3 and Fig. 4, parallelism and dimensional accuracy can be obtained.
  • 1 1 is a stone or lap or polish machine, which is provided to finish the i-side of the work piece.
  • 1 2 is the work piece between o2 pieces and the stone or wrap, the disc of the polish machine 1 1 It is a carrier that allows the workpiece to be turned while rotating, and the work piece to be finished on both sides at the discs of two schools.
  • 13 is a corner or a round or rectangular hole provided for inserting a workpiece into the carrier of 12.
  • 1 4 is the carrier 1 2 or the 'tension' screw 17 which is provided to apply tension in the outer tail direction because it is thin, and a stopper for connecting the tension fittings 16, the tension flange 15, and the carrier 1 2 It is a screw.
  • Reference numeral 18 denotes a belt pulley provided to impart a different rotation to the carrier 12 through the belt 19 by the fg moving portion of the carrier 12.
  • Reference numeral 20 denotes a belt pulley for the carrier IS, which is provided so that power is finally supplied to the carrier 12 by the belt 19. .
  • the present invention is constructed as described above, and is different from the ⁇ -tally carrier method described above in that the tension bracket is fixed to the outer periphery of the carrier 12 and taken out from the center of the carrier of the carrier 12. Since the tension is given to the carrier 12 by the tension fitting 6, the extremely thin carrier 12 can be output, that is, both sides of an extremely thin work piece can be processed simultaneously.
  • the conventional carrier has no support at the outer periphery.When using F Carrier 12, it is very fragile and cannot be machined.However, the laborer can support the carrier 12 at an external station. For this reason, it has a feature that it has a very long life and that the carrier 12 does not exist because it has a good tension.
  • the need for advanced machine tools capable of producing ultra-fine plastic parts with a high degree of cleanliness is increasing due to the advancement of electronics and other technologies.
  • the invention described above makes it possible to use ultra-tight wrapping and polishing such as silicon for semiconductor super LSIs, sapphires for SOS, and glass substrates such as photomasks, etc., and the equipment of the present invention supports the carrier in an external office. can, strong and its Kotobukigo long, and has a feature that not I have Kiyarya order to have given the Nao and tension c

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Les operations conventionnelles de rectification et de polissage dans lesquelles la precision du parallelisme et des dimensions est presque impossible a controler, sont ameliorees. La precision du parallelisme et de dimensions est obtenue a l'aide d'une unite de reglage du parallelisme (4) qui comporte un trou allonge (9) ouvert dans une plaque de surface (3) et qui se deplace en reponse a un travail (10). Une piece a usiner en rotation (12) passe entre deux pierres a affuter ou entre des machines de rectification et de polissage (11). Elle comporte une vis de tension (17), un organe de tension (16) et une bride de tension (15). Etant donne qu'une tension est appliquee sur un organe porteur (12) dans un profil complet dans une direction peripherique exterieure par la vis de tension (17), et que l'organe porteur (12) est bride de maniere rectiligne, un organe porteur extremement fin (12) peut etre utilise, et les surfaces des deux cotes d'une piece a usiner extremement fine peuvent etre usinees simultanement.
PCT/JP1981/000052 1981-03-10 1981-03-10 Stabilisateur parallele pour machines de rectification et de polissage de plan et systeme porteur rotatif pour machine de meulage de plan a tete duplex, machine de planage fin a double plan, machine de rectification double et machine de polissage WO1982003040A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP1981/000052 WO1982003040A1 (fr) 1981-03-10 1981-03-10 Stabilisateur parallele pour machines de rectification et de polissage de plan et systeme porteur rotatif pour machine de meulage de plan a tete duplex, machine de planage fin a double plan, machine de rectification double et machine de polissage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP1981/000052 WO1982003040A1 (fr) 1981-03-10 1981-03-10 Stabilisateur parallele pour machines de rectification et de polissage de plan et systeme porteur rotatif pour machine de meulage de plan a tete duplex, machine de planage fin a double plan, machine de rectification double et machine de polissage
WOJP81/00052810310 1981-03-10

Publications (1)

Publication Number Publication Date
WO1982003040A1 true WO1982003040A1 (fr) 1982-09-16

Family

ID=13734199

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1981/000052 WO1982003040A1 (fr) 1981-03-10 1981-03-10 Stabilisateur parallele pour machines de rectification et de polissage de plan et systeme porteur rotatif pour machine de meulage de plan a tete duplex, machine de planage fin a double plan, machine de rectification double et machine de polissage

Country Status (1)

Country Link
WO (1) WO1982003040A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7252099B2 (en) * 2003-09-05 2007-08-07 Nan Ya Technology Corporation Wafer cleaning apparatus with multiple wash-heads
CN103317403A (zh) * 2013-06-21 2013-09-25 来安县浦创轨道装备有限公司 一种双面自动打磨装置
CN105690241A (zh) * 2016-03-17 2016-06-22 中国电子科技集团公司第四十五研究所 抛光头调平装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839034Y1 (fr) * 1970-05-06 1973-11-17
US3791079A (en) * 1972-05-23 1974-02-12 Itek Corp Pressure applicator for surface generating apparatus
SU637241A2 (ru) * 1977-08-08 1978-12-15 Предприятие П/Я В-8851 Устройство дл доводки плоских и плоскопараллельных поверхностей пластин
JPS5558964A (en) * 1978-10-26 1980-05-02 Minoru Ueda Double-faced grinder
JPS5565069A (en) * 1978-10-30 1980-05-16 Shibayama Kikai Kk Carrier system in both surfaces lapping machine and fine grinding machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839034Y1 (fr) * 1970-05-06 1973-11-17
US3791079A (en) * 1972-05-23 1974-02-12 Itek Corp Pressure applicator for surface generating apparatus
SU637241A2 (ru) * 1977-08-08 1978-12-15 Предприятие П/Я В-8851 Устройство дл доводки плоских и плоскопараллельных поверхностей пластин
JPS5558964A (en) * 1978-10-26 1980-05-02 Minoru Ueda Double-faced grinder
JPS5565069A (en) * 1978-10-30 1980-05-16 Shibayama Kikai Kk Carrier system in both surfaces lapping machine and fine grinding machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7252099B2 (en) * 2003-09-05 2007-08-07 Nan Ya Technology Corporation Wafer cleaning apparatus with multiple wash-heads
CN103317403A (zh) * 2013-06-21 2013-09-25 来安县浦创轨道装备有限公司 一种双面自动打磨装置
CN105690241A (zh) * 2016-03-17 2016-06-22 中国电子科技集团公司第四十五研究所 抛光头调平装置及方法
CN105690241B (zh) * 2016-03-17 2018-05-18 中国电子科技集团公司第四十五研究所 抛光头调平装置及方法

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