WO1982003040A1 - Parallel stabilizer for plane lapping and polishing machines and rotary carrier system for duplex head plane grinding machine,double plane fine gliding machine,double lapping machine and polishing machine - Google Patents
Parallel stabilizer for plane lapping and polishing machines and rotary carrier system for duplex head plane grinding machine,double plane fine gliding machine,double lapping machine and polishing machine Download PDFInfo
- Publication number
- WO1982003040A1 WO1982003040A1 PCT/JP1981/000052 JP8100052W WO8203040A1 WO 1982003040 A1 WO1982003040 A1 WO 1982003040A1 JP 8100052 W JP8100052 W JP 8100052W WO 8203040 A1 WO8203040 A1 WO 8203040A1
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- WO
- WIPO (PCT)
- Prior art keywords
- machine
- double
- polishing
- lapping
- plane
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 19
- 239000003381 stabilizer Substances 0.000 title description 2
- 238000000034 method Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 2
- KKEBXNMGHUCPEZ-UHFFFAOYSA-N 4-phenyl-1-(2-sulfanylethyl)imidazolidin-2-one Chemical compound N1C(=O)N(CCS)CC1C1=CC=CC=C1 KKEBXNMGHUCPEZ-UHFFFAOYSA-N 0.000 claims 1
- 238000012993 chemical processing Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000036651 mood Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
Definitions
- the parallel stabilizer in the plane lapping machine and the polish ⁇ , the rain head surface grinder, the double-sided lapping machine, the double-sided lapping machine and the rotary carrier method in the polishing machine is the parallel stabilizer in the plane lapping machine and the polish ⁇ , the rain head surface grinder, the double-sided lapping machine, the double-sided lapping machine and the rotary carrier method in the polishing machine.
- the 3 ⁇ 4 of n3 ⁇ 4 has advanced remarkably, and from transistors to ICs, ICs to SIs, LSIs and LSIs, and miniaturization from precision to ultra-compact and ultra-precise, computers, microcomputers, and offices
- the necessity of making the first and last grades of the Jubilee unit, and the need for ultra-precision machines to make these ultra-small electronic parts have increased.
- ultra-precise lapping and polishing such as silicon for semiconductor LSI, sapphire of SOS, glass substrate for photomask, etc.
- ceramic, GGG, sendust Equipment for feeding workpieces to double-sided grinding, double-sided lap ⁇ , fining line cutting machine, double-sided polishing for electrical, chemical grinding, lapping and polishing of thin materials such as steel, ferrite, hard alloys, etc.
- the parallelism and the depth of the raft can be obtained, thereby enabling the dense lapping and polishing, and the double-sided lapping machine and the double-sided lapping machine for electrically and chemically treating the thin material Lf, lapping and polishing. Board, fining lined-Automatic supply of workpieces to polish
- ⁇ MPI It relates to a device for feeding.
- FIG. 1 shows an embodiment of the present invention.
- Fig. 1 is a front view of an embodiment of Fig. 1
- Fig. 2 is a front view of Fig. 1
- Fig. 3 is a front view of an apparatus according to the present invention
- Fig. 4 is FIG. 5 is a front view
- FIG. 6 is a front view
- FIG. 7 is a rotary carrier type inverted view
- FIG. 8 is a front view of the whole.
- Fig. 1 shows the support S2 for supporting the main body and the pneumatic or hydraulic cylinder 8 is a lapping plate or polisher. 3 A pressure head. Alternatively, it is a pulley for giving ⁇ force roll lj) to policing constant 2.
- a general polishing machine and a lap s are equipped with these devices, but they are close to a genuinely non-J ⁇ that controls the degree of parallelism to stabilize the lap and polishing accuracy.
- Silicon, sapphires, and wafers that are required for the cleavage of semiconductors (the high precision of the wafers is required, and the conventional wrapping and polishing S cannot easily obtain the required degree of hesitation. .
- the present invention introduces the ⁇ SS: VOL.
- Reference numeral 3 denotes a lap and polishing head body for holding 9 carriers (work holders) and applying an appropriate surface pressure to the work 10.
- Reference numeral 4 denotes a parallelism adjusting device formed by cutting a long hole 7 as shown in the figure
- reference numeral 5 denotes a screw integrated with the parallelism adjusting device 6.
- Reference numeral 6 denotes a set screw (nut) for turning the parallelism adjusting device when it is displaced in the horizontal direction.
- FIG. 5 in view of FIG. 6 is where you Dzura parallelism 11 integer unit 4 the way to the right, there is a deviation of ⁇ degree of a to the ⁇ workpiece; in »case 3 ⁇ 4> [rho 0 Work The higher the momentum becomes, the more it is wrapped and polished, and if the work is in a row as shown in Fig. 3 and Fig. 4, parallelism and dimensional accuracy can be obtained.
- 1 1 is a stone or lap or polish machine, which is provided to finish the i-side of the work piece.
- 1 2 is the work piece between o2 pieces and the stone or wrap, the disc of the polish machine 1 1 It is a carrier that allows the workpiece to be turned while rotating, and the work piece to be finished on both sides at the discs of two schools.
- 13 is a corner or a round or rectangular hole provided for inserting a workpiece into the carrier of 12.
- 1 4 is the carrier 1 2 or the 'tension' screw 17 which is provided to apply tension in the outer tail direction because it is thin, and a stopper for connecting the tension fittings 16, the tension flange 15, and the carrier 1 2 It is a screw.
- Reference numeral 18 denotes a belt pulley provided to impart a different rotation to the carrier 12 through the belt 19 by the fg moving portion of the carrier 12.
- Reference numeral 20 denotes a belt pulley for the carrier IS, which is provided so that power is finally supplied to the carrier 12 by the belt 19. .
- the present invention is constructed as described above, and is different from the ⁇ -tally carrier method described above in that the tension bracket is fixed to the outer periphery of the carrier 12 and taken out from the center of the carrier of the carrier 12. Since the tension is given to the carrier 12 by the tension fitting 6, the extremely thin carrier 12 can be output, that is, both sides of an extremely thin work piece can be processed simultaneously.
- the conventional carrier has no support at the outer periphery.When using F Carrier 12, it is very fragile and cannot be machined.However, the laborer can support the carrier 12 at an external station. For this reason, it has a feature that it has a very long life and that the carrier 12 does not exist because it has a good tension.
- the need for advanced machine tools capable of producing ultra-fine plastic parts with a high degree of cleanliness is increasing due to the advancement of electronics and other technologies.
- the invention described above makes it possible to use ultra-tight wrapping and polishing such as silicon for semiconductor super LSIs, sapphires for SOS, and glass substrates such as photomasks, etc., and the equipment of the present invention supports the carrier in an external office. can, strong and its Kotobukigo long, and has a feature that not I have Kiyarya order to have given the Nao and tension c
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Conventional lapping and polishing operations in which parallelism and dimensional accuracy are almost impossible to control are improved. The parallelism and dimensional accuracy are obtained by providing a parallelism adjusting unit (4) which incorporates a long hole (7) opened in a surface plate (3) and which is displaced in response to a work (10). A rotating workpiece (12) is passed between two grindstones or between lapping and polishing machines (11). It incorporates a tension screw (17), a tension fitment (16) and a tension flange (15). Since tension is applied to a carrier (12) in a complete profile in an outer peripheral direction by the tension screw (17), and the carrier (12) is rectilinearly spanned, and extremely thin carrier (12) can be used, and can accordingly both side surfaces of an extremely thin workpiece can be machined simultaneously.
Description
明 細 書 Specification
発明の名称 Title of invention
平面ラップ盤及びポリッシュ^におけるパラレルスタビライザー及び、 雨頭平面研削盤 、 両面苹面ファイングライディング盤、 両面ラップ盤、 ポリッシュ盤におけるロータリ一 キヤリャ方式。 The parallel stabilizer in the plane lapping machine and the polish ^, the rain head surface grinder, the double-sided lapping machine, the double-sided lapping machine and the rotary carrier method in the polishing machine.
技術分野 Technical field
エレクトロ二クスの進歩にともない^ ¾ の n堯はいちじるしく進み、 トランジスタか ら I C 、 I C からし S I 、 L S I 超 L S I と小型、 精密から超小型、 超精密化すること により、 コンピュータ一、 マイコン、 オフィスコンビユタ一等段々の/ J、型に作る必要性が 出来、 それに供ってこれ等の超小型鼋子部品を作る超精密機械が必要となって来たわけで ある。 With the advancement of electronics, the ¾ of n¾ has advanced remarkably, and from transistors to ICs, ICs to SIs, LSIs and LSIs, and miniaturization from precision to ultra-compact and ultra-precise, computers, microcomputers, and offices The necessity of making the first and last grades of the Jubilee unit, and the need for ultra-precision machines to make these ultra-small electronic parts have increased.
本発明の装置を使用することにより半導 の超 L S I 用のシリコン、 S O S 甩のサファ ィャ、 フォトマスク用のガラス基扳等の超精密ラップ及びポリッシングが ¾能となり又セ ラミック、 G G G 、 センダスト、 フェライト、 硬合金等の薄 ¾Γ材料を電気的、 化学的研 削、 ラッピング、 ポリツシングすべく、 両頭研削 、 両面ラップ^、 ファイングラインデ イング盤、 両面ポリッシュ ¾にワークピースをき動供給する装置を提供するにある。 By using the apparatus of the present invention, ultra-precise lapping and polishing such as silicon for semiconductor LSI, sapphire of SOS, glass substrate for photomask, etc. can be performed, and ceramic, GGG, sendust Equipment for feeding workpieces to double-sided grinding, double-sided lap ^, fining line cutting machine, double-sided polishing for electrical, chemical grinding, lapping and polishing of thin materials such as steel, ferrite, hard alloys, etc. To provide.
背景技術 Background art
昔はもっぱら手作業で行な れ、 人の 滂度にたよつていたこれ等の加工が、 / ヲ / ヲ年にアメリカで平面ラップ が発明されてからば、 続いて各葛の研削盤、 ラップ盤及び ポリッシング愨が出現し、 溟在ではどんどん镲？ 5化が進んでいる。 In the past, these processes, which were performed exclusively by hand and depended on the degree of human singularity, began to be invented in the U.S.A. in ヲ / ヲ / ヲ. A lapping machine and a polishing gak appeared, and more and more in the mood. 5 is progressing.
発明の開示 ^ Disclosure of Invention ^
本発明のものは平行度及び寸筏猜度が得られ¾锓密ラップ及びポリッシングを可能とす ると共に、 薄物材料を電気的、 化学的 S旨 Lf、 ラッピング、 ポリツシングする両頭硏削盤、 両面ラップ盤、 ファイングラインデイング -、 ポリ ッシュ逞にワークピースを自動供 According to the present invention, the parallelism and the depth of the raft can be obtained, thereby enabling the dense lapping and polishing, and the double-sided lapping machine and the double-sided lapping machine for electrically and chemically treating the thin material Lf, lapping and polishing. Board, fining lined-Automatic supply of workpieces to polish
〇MPI
給する装置に関するものである。 〇MPI It relates to a device for feeding.
図面の簡単な説明 BRIEF DESCRIPTION OF THE FIGURES
図は本発明の実施例を示すものであって、 箅 1図ば よりあるものの正面図、 第 2図 はその军面図、 第 3図は本発明の方式によるものの正面図、 箅 4図はその早面図、 同じく 第 5図は正面図、 第 6図はその军 図、 第 7 はロータリーキヤリャ方式の倒面図、 第 8 図はその全体正面の^面図である。 Fig. 1 shows an embodiment of the present invention. Fig. 1 is a front view of an embodiment of Fig. 1, Fig. 2 is a front view of Fig. 1, Fig. 3 is a front view of an apparatus according to the present invention, Fig. 4 is FIG. 5 is a front view, FIG. 6 is a front view, FIG. 7 is a rotary carrier type inverted view, and FIG. 8 is a front view of the whole.
1は装置 2は支柱 3は定愨 4は孚行度請整装置 5 モーター 5 回定ビス 6 は定盤に動力を与えるためのプーリー 6は回定ナヅト 7は長穴 8 シリンダー 9はキヤリャ 1 0はワーク 1 1はと石又ほラップ、 ポリヅシュ箜 1 2はキヤリャ 1 3は穴 1 4は止めネジ 1 5はテンションフランジ 1 6はテンション会具 1 7は テンション 'スクリュー 1 8はべル卜プ一リー 1 9はベル卜 2 0 ベル卜プーリー c 発明を実施するための最良の形態 1 is a device 2 is a column 3 is a fixed bag 4 is a grading device 5 is a motor 5 is a fixed screw 6 is a pulley for powering the platen 6 is a fixed nut 7 is a long hole 8 cylinder 9 is a carrier 1 0 is a work 1 1 is a wrapping stone, polish Ishomato 1 2 is a carrier 1 3 is a carrier 1 3 is a hole 1 4 is a set screw 1 5 is a tension flange 1 6 is a tension fixture 1 7 is a tension 'screw 1 8 is a belt The belt 19 is a belt 20 The belt pulley c Best mode for carrying out the invention
従来のラップ' 及びポリッシング罄 ワークに重りを使用する方法及び第 1図に示すよ うに、 ニューマチックあるいは泡圧により加圧する方 とがある。 A conventional method of using a weight for a wrap and a polishing work, and as shown in FIG. 1, there is a method of applying pressure by pneumatic or bubble pressure.
第 1図は本体及びニューマチックあるい 油圧シリンダー 8を支持する為の支 S 2は、 ラ ヅプ定盤あるいはポリツシング定 3 加圧ヘッドで、 5 モータ一、 6はモーター 5よ りラップ定盤あるいはポリツシング定 2に ε力 転違 lj) を与えるためのプーリーで ある。 Fig. 1 shows the support S2 for supporting the main body and the pneumatic or hydraulic cylinder 8 is a lapping plate or polisher. 3 A pressure head. Alternatively, it is a pulley for giving ε force roll lj) to policing constant 2.
—般のポリッシングマシン及びラップ sはこれ等の装置を えているが、 ラップ及びポリ ッシュ精度が安定せす平行度寸¾»度をコン卜ロールする辜^全く不^ J §に近い。 A general polishing machine and a lap s are equipped with these devices, but they are close to a genuinely non-J § that controls the degree of parallelism to stabilize the lap and polishing accuracy.
半導体の開癸に^いシリコン、 サフアイャ、 その^のウェファ一 （基 の高精度が要求 され従来のラップ 、 ポリッシング Sではこれ等の要求猜度を要易に得る事ができなくな つてきている。 Silicon, sapphires, and wafers that are required for the cleavage of semiconductors (the high precision of the wafers is required, and the conventional wrapping and polishing S cannot easily obtain the required degree of hesitation. .
本発明はこれらの要求に答えるべくラップ SS:びボリッシング Sの £Π圧機導を ¾ 3図、 第 In order to respond to these demands, the present invention introduces the Π SS: VOL.
CMPI CMPI
», '、' ι?ο
5図に示す様に改造したものである。 第 3図、 芎 5図の図面の説明は下記の遠りであ る。 », ',' Ι? Ο It was modified as shown in Fig. 5. The description of the drawings in FIGS. 3 and 5 is far below.
3は 9キヤリャ （ワーク保持具） をホールドし、 ワーク 1 0に適当な面圧を与える為のラ ップ及びポリッシングへッド本体である。 Reference numeral 3 denotes a lap and polishing head body for holding 9 carriers (work holders) and applying an appropriate surface pressure to the work 10.
4は図で示す様に 7の長穴を切った平行度請整窆置であり、 5は 6平行度請整装置と一体 になっているネジである。 Reference numeral 4 denotes a parallelism adjusting device formed by cutting a long hole 7 as shown in the figure, and reference numeral 5 denotes a screw integrated with the parallelism adjusting device 6.
6は平行度調整装置を横方向にづらした時に回定する為の止めネジ （ナット） である。 第 3図、 第 4図の状態はポリ ッシングヘッド 3と孚行度篛螯装置 4との軸が一体となるの で図の様にワーク 1 0に ®く運動量 P t = P t で、 この: ϋ合は前加工の平行度がそのまま 持続されるのである。 Reference numeral 6 denotes a set screw (nut) for turning the parallelism adjusting device when it is displaced in the horizontal direction. In Figure 3, the fourth state poly Tsu Thing head 3 and MakotoKo degree篛螯momentum rather ® in the work 1 0 as in FIG axis at become integral with the device 4 of Figure P t = P t, this: In this case, the parallelism of pre-processing is maintained as it is.
第 5図、 第 6図は平行度 11整装置 4を右いっぱいにづらした所の図で、 この焉合ワークに aの苹行度のくるいがある； »合 ¾〉 ρ0 でワークの高い方の運動量が大きくなり、 それだ けよけいにラップ及びポリッシュされ、 ワークば^ 3図、 第 4図のように军行になるので 平行度及び寸法精度が得られるわけである。 FIG. 5, in view of FIG. 6 is where you Dzura parallelism 11 integer unit 4 the way to the right, there is a deviation of苹行degree of a to the焉合workpiece; in »case ¾> [rho 0 Work The higher the momentum becomes, the more it is wrapped and polished, and if the work is in a row as shown in Fig. 3 and Fig. 4, parallelism and dimensional accuracy can be obtained.
次いで口一タリ一キヤリャ方式について t¾明する。 1 1はと石あるいはラヅプ、 ポリッシュ盤で、 ワークピースの i¾面を仕上する為に設けてあり、 1 2はワークピースを o2枚と石、 又はラップ、 ポリッシュ盤 1 1のディスク ¾の間を回転させながら通適させ、 ワークピースを„2校のディスク授にて両面サイドを仕上げ加工せしめる為のキヤリャであ る。 ' Next, a description of the oral carrier system will be given. 1 1 is a stone or lap or polish machine, which is provided to finish the i-side of the work piece. 1 2 is the work piece between o2 pieces and the stone or wrap, the disc of the polish machine 1 1 It is a carrier that allows the workpiece to be turned while rotating, and the work piece to be finished on both sides at the discs of two schools.
1 3は 1 2のキヤリャにワークピースを入れる為に設けられた角又は、 丸 、 く型の穴で ある。 13 is a corner or a round or rectangular hole provided for inserting a workpiece into the carrier of 12.
1 4はキヤリャ 1 2か '薄い為に外尾方向にテンションをかける為に設けられた、 テンショ ン ' スクリユー 1 7及びテンション会具 1 6、 テンションフランジ 1 5、 キヤリャ 1 2を 継ぐ為の止めネジである。 1 4 is the carrier 1 2 or the 'tension' screw 17 which is provided to apply tension in the outer tail direction because it is thin, and a stopper for connecting the tension fittings 16, the tension flange 15, and the carrier 1 2 It is a screw.
O PI O PI
Y,rIFO"
このキヤリャ 1 2はテンション ·スクリユー 1 7により、 キヤリャ 1 2の外周方向に完全 な形でテンションをかけられているので、 ピンと真すぐに張られるわけで極めて薄くつく れる。 Y, r IFO " Since the carrier 12 is completely tensioned by the tension screw 17 in the outer circumferential direction of the carrier 12, the carrier 12 is made extremely thin because it is stretched straight with the pin.
よって極薄なワークピースをディスク内に俟 出栾るものである。 Therefore, an extremely thin workpiece is brought into the disk.
1 8はキヤリャ 1 2の fg動部によって、 ベルト 1 9を通してキヤリャ 1 2に回転違 を与 える為に設けられたベルトプーリ一である。 Reference numeral 18 denotes a belt pulley provided to impart a different rotation to the carrier 12 through the belt 19 by the fg moving portion of the carrier 12.
2 0はキヤリャ IS 用のベルトプーリーであり、 ベルト 1 9により動力を最終的にキヤリ ャ 1 2に する為に設けられている。 . Reference numeral 20 denotes a belt pulley for the carrier IS, which is provided so that power is finally supplied to the carrier 12 by the belt 19. .
本発明のものは以上のごとく構成されたものであって、 の α—タリーキャリャ方式と 違って、 キヤリャ 1 2の キヤリャのセンター部より取らす、 キヤリャ 1 2の外周部に 固定してあるテンション金具 1 6より取り、 キヤリャ 1 2にテンション金具 6によりテン シヨンを与えている為極めて薄いキヤリャ 1 2を庋甩出枭、 すなはち極薄ワークピースの 両面同時加工が可能となる。 The present invention is constructed as described above, and is different from the α-tally carrier method described above in that the tension bracket is fixed to the outer periphery of the carrier 12 and taken out from the center of the carrier of the carrier 12. Since the tension is given to the carrier 12 by the tension fitting 6, the extremely thin carrier 12 can be output, that is, both sides of an extremely thin work piece can be processed simultaneously.
従来のキヤリャは外周部に支持がなく薄 ¾Fキヤリャ 1 2を使用した場合、 非常にこわれや すくその加工が不可能であったが、 勞明の装置は外局にてキヤリャ 1 2を支 出来る為 、 じょうぶでその寿命が非常に長く、 なをかつテンションを与えている為キヤリャ 1 2が おれないという特長を有するものである。 The conventional carrier has no support at the outer periphery.When using F Carrier 12, it is very fragile and cannot be machined.However, the laborer can support the carrier 12 at an external station. For this reason, it has a feature that it has a very long life and that the carrier 12 does not exist because it has a good tension.
産業上の莉甩可能性 Industrial potential
本発明のものは電子工学等の進 にともない、 ますます g高清度の極超小塑 子部品の 作れる高度の工作機械の必要倥が増すもので、 その ϋ癸 目下の急務であり、 本装置の発 明により半導体の超 L S I 甩のシリコン、 S O S 用サフアイャ、 フォトマスクほのガラス 基板等の超猜密ラップ及びポリッシング ^[能となり、 又本癸 ¾の装置は外局にてキヤリ ャを支持出来、 じょうぶでその寿合 長く、 なをかつテンションを与えている為キヤリャ がおれないという特長を有するものである c In the present invention, the need for advanced machine tools capable of producing ultra-fine plastic parts with a high degree of cleanliness is increasing due to the advancement of electronics and other technologies. The invention described above makes it possible to use ultra-tight wrapping and polishing such as silicon for semiconductor super LSIs, sapphires for SOS, and glass substrates such as photomasks, etc., and the equipment of the present invention supports the carrier in an external office. can, strong and its Kotobukigo long, and has a feature that not I have Kiyarya order to have given the Nao and tension c
O PIO PI
- ν ιρ <
-ν ιρ <
Claims
請求の範囲 The scope of the claims
/ ) 化学的、 電気的を含む平面ラッピング及びポリッシング¾のワーク 圧及び保持具 における、 ワークの平行度を修正しゥ一クの寸法精度及び平行度を高殪度にラップ及びポ リ ッシングせしめる平行度 持装置。 /) Plane lapping and polishing including chemical and electrical work Parallelism that corrects work parallelism in work pressure and holding fixtures and wraps and polishes workpieces with high dimensional accuracy and parallelism. Holding device.
2 ) 薄物キヤリャの外局にテンション金具をつけ、 このテンション会具にベルトを取付 け、 これに |g動プーリ一よりのペルトにより ¾力を与え、 テンション会具に回 ¾を与える 方式を用いた電気的、 化学的加工方法を含む両頭平靣 削^、 両面軍 Ξファイングライン デイング盤、 両面ラップ s、 ポリッシュ罄におけるロータリーキヤリャ方式。 2) Attach a tension fitting to the outside of the thin carrier, attach a belt to this tension fitting, apply a force to the belt with a | g moving pulley, and apply a rotation to the tension fitting. Rotary carrier method for double-headed grinding, including electrical and chemical processing methods, double-sided arming (fining line laying machine, double-sided wrapping, polishing).
OMPI OMPI
、今 WIPO
, Now WIPO
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1981/000052 WO1982003040A1 (en) | 1981-03-10 | 1981-03-10 | Parallel stabilizer for plane lapping and polishing machines and rotary carrier system for duplex head plane grinding machine,double plane fine gliding machine,double lapping machine and polishing machine |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1981/000052 WO1982003040A1 (en) | 1981-03-10 | 1981-03-10 | Parallel stabilizer for plane lapping and polishing machines and rotary carrier system for duplex head plane grinding machine,double plane fine gliding machine,double lapping machine and polishing machine |
| WOJP81/00052810310 | 1981-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1982003040A1 true WO1982003040A1 (en) | 1982-09-16 |
Family
ID=13734199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1981/000052 WO1982003040A1 (en) | 1981-03-10 | 1981-03-10 | Parallel stabilizer for plane lapping and polishing machines and rotary carrier system for duplex head plane grinding machine,double plane fine gliding machine,double lapping machine and polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO1982003040A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7252099B2 (en) * | 2003-09-05 | 2007-08-07 | Nan Ya Technology Corporation | Wafer cleaning apparatus with multiple wash-heads |
| CN103317403A (en) * | 2013-06-21 | 2013-09-25 | 来安县浦创轨道装备有限公司 | Double-faced automatic grinding device |
| CN105690241A (en) * | 2016-03-17 | 2016-06-22 | 中国电子科技集团公司第四十五研究所 | polishing head leveling device and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4839034Y1 (en) * | 1970-05-06 | 1973-11-17 | ||
| US3791079A (en) * | 1972-05-23 | 1974-02-12 | Itek Corp | Pressure applicator for surface generating apparatus |
| SU637241A2 (en) * | 1977-08-08 | 1978-12-15 | Предприятие П/Я В-8851 | Apparatus for finishing flat and flat-parallel surfaces of plates |
| JPS5558964A (en) * | 1978-10-26 | 1980-05-02 | Minoru Ueda | Double-faced grinder |
| JPS5565069A (en) * | 1978-10-30 | 1980-05-16 | Shibayama Kikai Kk | Carrier system in both surfaces lapping machine and fine grinding machine |
-
1981
- 1981-03-10 WO PCT/JP1981/000052 patent/WO1982003040A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4839034Y1 (en) * | 1970-05-06 | 1973-11-17 | ||
| US3791079A (en) * | 1972-05-23 | 1974-02-12 | Itek Corp | Pressure applicator for surface generating apparatus |
| SU637241A2 (en) * | 1977-08-08 | 1978-12-15 | Предприятие П/Я В-8851 | Apparatus for finishing flat and flat-parallel surfaces of plates |
| JPS5558964A (en) * | 1978-10-26 | 1980-05-02 | Minoru Ueda | Double-faced grinder |
| JPS5565069A (en) * | 1978-10-30 | 1980-05-16 | Shibayama Kikai Kk | Carrier system in both surfaces lapping machine and fine grinding machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7252099B2 (en) * | 2003-09-05 | 2007-08-07 | Nan Ya Technology Corporation | Wafer cleaning apparatus with multiple wash-heads |
| CN103317403A (en) * | 2013-06-21 | 2013-09-25 | 来安县浦创轨道装备有限公司 | Double-faced automatic grinding device |
| CN105690241A (en) * | 2016-03-17 | 2016-06-22 | 中国电子科技集团公司第四十五研究所 | polishing head leveling device and method |
| CN105690241B (en) * | 2016-03-17 | 2018-05-18 | 中国电子科技集团公司第四十五研究所 | polishing head leveling device and method |
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