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AU2001267034A1 - Buried inverted gate field-effect transistor (bigfet) - Google Patents

Buried inverted gate field-effect transistor (bigfet)

Info

Publication number
AU2001267034A1
AU2001267034A1 AU2001267034A AU6703401A AU2001267034A1 AU 2001267034 A1 AU2001267034 A1 AU 2001267034A1 AU 2001267034 A AU2001267034 A AU 2001267034A AU 6703401 A AU6703401 A AU 6703401A AU 2001267034 A1 AU2001267034 A1 AU 2001267034A1
Authority
AU
Australia
Prior art keywords
bigfet
effect transistor
gate field
inverted gate
buried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001267034A
Inventor
John A. Iacoponi
Thomas E. Spikes Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001267034A1 publication Critical patent/AU2001267034A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/023Manufacture or treatment of FETs having insulated gates [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/611Insulated-gate field-effect transistors [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
    • H10D30/615Insulated-gate field-effect transistors [IGFET] having multiple independently-addressable gate electrodes influencing the same channel comprising a MOS gate electrode and at least one non-MOS gate electrode
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • H10D64/018Spacers formed inside holes at the prospective gate locations, e.g. holes left by removing dummy gates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0217Manufacture or treatment of FETs having insulated gates [IGFET] forming self-aligned punch-through stoppers or threshold implants under gate regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0225Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate using an initial gate mask complementary to the prospective gate location, e.g. using dummy source and drain electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/721Insulated-gate field-effect transistors [IGFET] having a gate-to-body connection, i.e. bulk dynamic threshold voltage IGFET 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/351Substrate regions of field-effect devices
    • H10D62/357Substrate regions of field-effect devices of FETs
    • H10D62/364Substrate regions of field-effect devices of FETs of IGFETs
    • H10D62/371Inactive supplementary semiconductor regions, e.g. for preventing punch-through, improving capacity effect or leakage current
AU2001267034A 2000-06-16 2001-06-06 Buried inverted gate field-effect transistor (bigfet) Abandoned AU2001267034A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59597700A 2000-06-16 2000-06-16
US09/595,977 2000-06-16
PCT/US2001/040862 WO2001097290A2 (en) 2000-06-16 2001-06-06 Buried inverted gate field-effect transistor (bigfet)

Publications (1)

Publication Number Publication Date
AU2001267034A1 true AU2001267034A1 (en) 2001-12-24

Family

ID=24385491

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001267034A Abandoned AU2001267034A1 (en) 2000-06-16 2001-06-06 Buried inverted gate field-effect transistor (bigfet)

Country Status (2)

Country Link
AU (1) AU2001267034A1 (en)
WO (1) WO2001097290A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4604444B2 (en) * 2002-12-24 2011-01-05 トヨタ自動車株式会社 Embedded gate type semiconductor device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132072A (en) * 1979-03-31 1980-10-14 Toshiba Corp Mos semiconductor device
JPS5783059A (en) * 1980-11-11 1982-05-24 Toshiba Corp Manufacture of mos type semiconductor device
JPS63308385A (en) * 1987-06-10 1988-12-15 Fuji Electric Co Ltd Manufacturing method of buried gate field effect transistor
JPH0294477A (en) * 1988-09-30 1990-04-05 Toshiba Corp Semiconductor device and manufacture thereof
US5602403A (en) * 1991-03-01 1997-02-11 The United States Of America As Represented By The Secretary Of The Navy Ion Implantation buried gate insulator field effect transistor
US5661051A (en) * 1996-10-09 1997-08-26 National Science Council Method for fabricating a polysilicon transistor having a buried-gate structure
US5912497A (en) * 1997-08-06 1999-06-15 North Carolina State University Semiconductor switching devices having buried gate electrodes and methods of forming same
EP0905761A3 (en) * 1997-08-29 2005-01-26 Texas Instruments Inc. Method of manufacturing a field effect transistor
US6043535A (en) * 1997-08-29 2000-03-28 Texas Instruments Incorporated Self-aligned implant under transistor gate

Also Published As

Publication number Publication date
WO2001097290A2 (en) 2001-12-20
WO2001097290A3 (en) 2002-08-15

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