AU2001267034A1 - Buried inverted gate field-effect transistor (bigfet) - Google Patents
Buried inverted gate field-effect transistor (bigfet)Info
- Publication number
- AU2001267034A1 AU2001267034A1 AU2001267034A AU6703401A AU2001267034A1 AU 2001267034 A1 AU2001267034 A1 AU 2001267034A1 AU 2001267034 A AU2001267034 A AU 2001267034A AU 6703401 A AU6703401 A AU 6703401A AU 2001267034 A1 AU2001267034 A1 AU 2001267034A1
- Authority
- AU
- Australia
- Prior art keywords
- bigfet
- effect transistor
- gate field
- inverted gate
- buried
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000005669 field effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/023—Manufacture or treatment of FETs having insulated gates [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/611—Insulated-gate field-effect transistors [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
- H10D30/615—Insulated-gate field-effect transistors [IGFET] having multiple independently-addressable gate electrodes influencing the same channel comprising a MOS gate electrode and at least one non-MOS gate electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/018—Spacers formed inside holes at the prospective gate locations, e.g. holes left by removing dummy gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0217—Manufacture or treatment of FETs having insulated gates [IGFET] forming self-aligned punch-through stoppers or threshold implants under gate regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0225—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate using an initial gate mask complementary to the prospective gate location, e.g. using dummy source and drain electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/721—Insulated-gate field-effect transistors [IGFET] having a gate-to-body connection, i.e. bulk dynamic threshold voltage IGFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/351—Substrate regions of field-effect devices
- H10D62/357—Substrate regions of field-effect devices of FETs
- H10D62/364—Substrate regions of field-effect devices of FETs of IGFETs
- H10D62/371—Inactive supplementary semiconductor regions, e.g. for preventing punch-through, improving capacity effect or leakage current
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59597700A | 2000-06-16 | 2000-06-16 | |
US09/595,977 | 2000-06-16 | ||
PCT/US2001/040862 WO2001097290A2 (en) | 2000-06-16 | 2001-06-06 | Buried inverted gate field-effect transistor (bigfet) |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001267034A1 true AU2001267034A1 (en) | 2001-12-24 |
Family
ID=24385491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001267034A Abandoned AU2001267034A1 (en) | 2000-06-16 | 2001-06-06 | Buried inverted gate field-effect transistor (bigfet) |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2001267034A1 (en) |
WO (1) | WO2001097290A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4604444B2 (en) * | 2002-12-24 | 2011-01-05 | トヨタ自動車株式会社 | Embedded gate type semiconductor device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55132072A (en) * | 1979-03-31 | 1980-10-14 | Toshiba Corp | Mos semiconductor device |
JPS5783059A (en) * | 1980-11-11 | 1982-05-24 | Toshiba Corp | Manufacture of mos type semiconductor device |
JPS63308385A (en) * | 1987-06-10 | 1988-12-15 | Fuji Electric Co Ltd | Manufacturing method of buried gate field effect transistor |
JPH0294477A (en) * | 1988-09-30 | 1990-04-05 | Toshiba Corp | Semiconductor device and manufacture thereof |
US5602403A (en) * | 1991-03-01 | 1997-02-11 | The United States Of America As Represented By The Secretary Of The Navy | Ion Implantation buried gate insulator field effect transistor |
US5661051A (en) * | 1996-10-09 | 1997-08-26 | National Science Council | Method for fabricating a polysilicon transistor having a buried-gate structure |
US5912497A (en) * | 1997-08-06 | 1999-06-15 | North Carolina State University | Semiconductor switching devices having buried gate electrodes and methods of forming same |
EP0905761A3 (en) * | 1997-08-29 | 2005-01-26 | Texas Instruments Inc. | Method of manufacturing a field effect transistor |
US6043535A (en) * | 1997-08-29 | 2000-03-28 | Texas Instruments Incorporated | Self-aligned implant under transistor gate |
-
2001
- 2001-06-06 WO PCT/US2001/040862 patent/WO2001097290A2/en active Application Filing
- 2001-06-06 AU AU2001267034A patent/AU2001267034A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001097290A2 (en) | 2001-12-20 |
WO2001097290A3 (en) | 2002-08-15 |
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