WO2019113955A1

WO2019113955A1 - Sub-film defect detection method and sub-film defect detection device

Info

Publication number: WO2019113955A1
Application number: PCT/CN2017/116532
Authority: WO
Inventors: 洪日; 周振华; 赵云飞; 刘瑶
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2017-12-15
Filing date: 2017-12-15
Publication date: 2019-06-20
Also published as: CN110741246A

Abstract

A sub-film defect detection method and a sub-film defect detection device (100). The sub-film defect detection method comprises the steps of: detecting, by means of an optical microscope (10), an object to be detected (Y), and determining first coordinate information of a defect of the detected object (Y) (S10); according to the positional relationship between the optical microscope (10) and a scanning apparatus (20) and the positional relationship between the optical microscope and a cutting apparatus (30), and the first coordinate information, determining second coordinate information of the defect of the detected object (Y) and the scanning apparatus (20), and determining third coordinate information of the defect of the detected object (Y) and the cutting apparatus (30) (S20); and according to the third coordinate information, controlling the cutting apparatus (30) so that same cuts the detected object (Y), and according to the second coordinate information, controlling the scanning apparatus (20) so that same scans a defect of the cut detected object (Y) (S30).

Description

Sub-film defect detecting method and sub-film defect detecting device

Technical field

The invention relates to the technical field of focused ion devices, in particular to a method for detecting defects under the film and a device for detecting defects under the film.

Background technique

In the related art, when there is a defect in a product having a multilayer film, the existing focused ion beam apparatus is difficult to accurately locate a product defect position, and the efficiency of defect analysis is low.

Summary of the invention

Embodiments of the present invention provide a sub-film defect detecting method and a sub-film defect detecting device.

The invention provides a method for detecting defects under the film, comprising the steps of:

Detecting the detected object by an optical microscope to determine first coordinate information of the defect of the detected object;

Determining a defect of the detected object and second coordinate information of the scanning device according to a positional relationship between the optical microscope and the scanning device and the cutting device, and the first coordinate information, and determining a defect of the detected object Third coordinate information with the cutting device; and

Controlling, by the cutting device, the cutting device to cut the detected object according to the third coordinate information, and controlling the scanning device to scan the defect of the detected object after cutting according to the second coordinate information.

In the film defect detecting method of the above embodiment, the coordinate position of the defect can be quickly located by the optical microscope, and the specific film layer position of the defect of the detected object can be accurately located by the cutting device and the scanning device, so that the product defect can be quickly and accurately obtained. Location and analysis of defects, high efficiency.

The invention provides a sub-film defect detecting device comprising an optical microscope, a scanning device and a cutting device; the sub-film defect detecting device further comprises:

a memory storing at least one program;

a processor, configured to execute the at least one program to implement the following steps:

Detecting the detected object by the optical microscope to determine first coordinate information of the defect of the detected object;

Determining a defect of the detected object and second coordinate information of the scanning device according to a positional relationship between the optical microscope and the scanning device and the cutting device, and the first coordinate information, and determining the a defect of the detecting object and third coordinate information of the cutting device; and

The under-film defect detecting device of the above embodiment can quickly locate the coordinate position of the defect by the optical microscope, and can accurately locate the specific film layer of the defect of the detected object by the cutting device and the scanning device, so that the product defect can be quickly and accurately obtained. Location and analysis of defects, high efficiency.

The additional aspects and advantages of the embodiments of the present invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic structural view of a film under defect detecting apparatus according to an embodiment of the present invention.

2 is a flow chart of a method of detecting a defect under the film according to an embodiment of the present invention.

3 is a schematic block diagram of a film under defect detecting apparatus according to an embodiment of the present invention.

4 is another flow chart of a method of detecting a defect under the film according to an embodiment of the present invention.

FIG. 5 is a schematic diagram showing conversion of first coordinate information and second coordinate information of the film defect detection method according to the embodiment of the present invention.

Fig. 6 is still another flow chart of the method for detecting defects under the film according to the embodiment of the present invention.

FIG. 7 is a schematic diagram showing conversion of first coordinate information and third coordinate information of the film defect detection method according to the embodiment of the present invention.

Fig. 8 is still another flow chart of the method for detecting defects under the film according to the embodiment of the present invention.

Fig. 9 is a view showing the positional relationship of a scanning device, a cutting device, and an object to be detected according to an embodiment of the present invention.

Fig. 10 is still another flow chart of the method for detecting defects under the film according to the embodiment of the present invention.

Detailed ways

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or connected in one piece; Therefore, they may be mechanically connected, or may be electrically connected or may communicate with each other; they may be directly connected or indirectly connected through an intermediate medium, and may be internal communication of two elements or an interaction relationship of two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

Referring to FIG. 1-3, the method for detecting a defect under the film according to an embodiment of the present invention includes the following steps:

S10, detecting the detected object Y by an optical microscope, and determining first coordinate information of the defect of the detected object Y;

S20, determining the defect of the detected object Y and the second coordinate information of the scanning device according to the positional relationship between the optical microscope and the scanning device and the cutting device and the first coordinate information, and determining the defect of the detected object Y and the third of the cutting device Coordinate information; and

S30, controlling the cutting device to cut the detected object Y according to the third coordinate information, and controlling the scanning device to scan the defect of the detected object Y after the cutting according to the second coordinate information.

The sub-film defect detecting apparatus 100 of the embodiment of the present invention includes an optical microscope 10, a scanning device 20, a cutting device 30, a memory 40, and a processor 50. The memory 40 stores at least one program for the processor 50 to execute the at least one program. As an example, the under-film defect detecting method of the embodiment of the present invention can be realized by the under-film defect detecting apparatus 100 of the embodiment of the present invention.

The steps S10 to S30 of the under-film defect detecting method of the embodiment of the present invention can be realized by the under-film defect detecting apparatus 100 of the embodiment of the present invention. That is, the processor 50 is configured to execute at least one program to implement detection of the detected object Y by the optical microscope 10, and determine first coordinate information of the defect of the detected object Y; according to the optical microscope 10 and the scanning device 20 and cutting Determining the positional relationship of the device 30 and the first coordinate information, determining the defect of the detected object Y and the second coordinate information of the scanning device 20, and determining the defect of the detected object Y and the third coordinate information of the cutting device 30; according to the third coordinate The information is controlled to cut the object Y by the cutting device 30, and the scanning device 20 is controlled to scan the defect of the object Y after the cutting according to the second coordinate information.

In the sub-film defect detecting method and the sub-film defect detecting device 100 of the above embodiment, the coordinate position of the defect can be quickly located by the optical microscope 10, and the specific film layer of the defect of the detected object Y can be accurately positioned by the scanning device 20 and the cutting device 30. Position, as such, can quickly and accurately obtain the location of product defects and analyze the defects with high efficiency.

Specifically, in the present embodiment, the first coordinate system O1X1Y1 is established centering on the position where the optical microscope 10 is located, and the second coordinate system O2X2Y2 is established centering on the position where the scanning device 20 is located, centering on the position where the cutting device 30 is located. Establish a third coordinate system O3X3Y3. The first coordinate system O1X1Y1, the second coordinate system O2X2Y2, and the third coordinate system O3X3Y3 may determine corresponding coordinate relationships according to mutual positional relationships. These coordinate relationships are pre-settable.

Referring again to FIG. 1, optical microscope 10 includes an objective system 12, an LED light source 14, and an image sensor 16. The image sensor 16 can be a CCD (Charge Coupled Device). The scanning device 20 is an electronic device that can emit a focused electron beam. The cutting device 30 is an electronic device that can emit a focused ion beam. The sub-film defect detecting apparatus 100 includes a vacuum chamber 200 and a computer main body 300, and the scanning device 20 includes a scanning probe 22. The cutting device 30 includes a cutting probe 32. The objective system 12, the scanning probe 22, and the cutting probe 32 are all located inside the vacuum chamber 200. The LED light source 14 and the image sensor 16 can be located outside of the vacuum chamber 200, so that when the LED light source 14 and the image sensor 16 fail, it is convenient to repair and replace the LED light source 14 and the image sensor 16. In addition, the first coordinate information of the image sensor 16 for acquiring the defect is transmitted to the computer host 300. The processor 50 and the memory 40 may be disposed at the computer host 300.

It should be noted that the processor 50 may be a stand-alone processor or a part dynamically allocated by the processor of the computer host 300, a part of the dynamic allocation of the processor of the sub-film defect detecting apparatus 100, and a dynamic allocation of the processor of the optical microscope 10. A part of the dynamic allocation of the processor of the scanning device 20 and a part of the dynamic allocation of the processor of the cutting device 30 are combined to form an organic whole.

In one example, the number of layers of the object Y to be detected is 20, and when the object Y is manufactured, foreign matter Y is peeled off during the third film manufacturing process, and after the 20 layers of film are packaged, it is found that The detection object Y has a dark spot defect. At this time, the specific position of the dark spot defect can be accurately found by the optical microscope 10 of the embodiment of the present invention, and the dark spot can be analyzed. In the embodiment of the present invention, referring to FIG. 5 and FIG. 7 , the detected object Y may be first moved to the optical microscope 10 through the moving platform 110 for detection, and the first coordinate information of the defect is located by the optical microscope 10, for example, two. Dimension coordinate information (X1', Y1'). Then, the detected object Y is moved to the lower side of the scanning device 20 via the moving platform, and the two-dimensional defect of the detected object Y is known by the coordinate conversion relationship between the first coordinate system O1X1YI, the second coordinate system O2X2Y2, and the third coordinate system O3X3Y3. The second coordinate information corresponding to the coordinates in the second coordinate system O2X2Y2 is (X2', Y2'), and the third coordinate information corresponding to the two-dimensional coordinates of the defect of the detected object Y in the third coordinate system O3X3Y3 is (X3', Y3 '), it should be noted that the coordinates (X2', Y2') and the coordinates (X3', Y3') can be the same coordinates or different coordinates, for example, when O2X2Y2 and O3X3Y3 are the same coordinate system, the coordinates (X2', Y2') is the same coordinate as coordinates (X3', Y3'); when O2X2Y2 and O3X3Y3 are different coordinate systems, coordinates (X2', Y2') and coordinates (X3', Y3') For different coordinates.

In the present embodiment, the processor 50 can control the cutting device 30 against the detected object Y according to the coordinates (X3', Y3'). Performing a section cutting to obtain a profile of the defect, and controlling the scanning device 20 to scan the profile of the defect of the detected object Y according to the coordinates (X2', Y2'), according to the scanning result, the defect of the object Y is known On the third layer of film.

Referring to FIG. 4, in some embodiments, the scanning device 20 includes a scanning probe 22, and step S20 includes:

S22, calculating the focus of the optical microscope 10 and the relative position of the focus of the scanning probe 22;

S24. Convert the first coordinate information according to the relative position to obtain the second coordinate information.

Steps S22 and S24 of the sub-film defect detecting method of the embodiment of the present invention may be implemented by the processor 50 of the embodiment of the present invention. That is, the processor 50 is configured to execute at least one program to calculate the relative position of the focus of the optical microscope 10 and the focus of the scanning probe 22; and convert the first coordinate information according to the relative position to obtain the second coordinate information.

In this way, the first coordinate information can be quickly converted by the focus of the optical microscope 10 and the relative position of the focus of the scanning probe 22 to obtain the second coordinate information, which is high in efficiency and high in accuracy.

Specifically, in one example, the focus coordinate of the optical microscope 10 is (X0, Y0), the focal coordinate of the scanning probe 22 is (X0', Y0'), and the position of the first coordinate system O1X1Y1 and the second coordinate system O2X2Y2. The relationship is determined to determine the relative position of the focus coordinate of the optical microscope 10 (X0, Y0) and the focus coordinate of the scanning probe 22 to (X0', Y0'), and the second coordinate information is determined based on the relative position and the first coordinate information. When the optical microscope 10 detects the detected object Y, it is mainly necessary to adjust the focus of the optical microscope 10 to acquire a clear image of the detected object Y, and when scanning the detected object Y by the scanning probe 22, focus on the focus of the scanning probe 22 The electron beam is so determined based on the relative position of the focus of the optical microscope 10 and the focus of the scanning probe 22, so that the scanning probe 22 is more accurate when scanning.

Referring to FIG. 6, in some embodiments, the cutting device 30 includes a cutting probe 32, and step S20 includes:

S26, calculating the focus of the optical microscope 10 and the relative position of the focus of the cutting probe 32;

S28. Convert the first coordinate information according to the relative position to obtain the third coordinate information.

Steps S26 and S28 of the sub-film defect detecting method of the embodiment of the present invention may be implemented by the processor 50 of the embodiment of the present invention. That is, the processor 50 is configured to execute at least one program to calculate the relative position of the focus of the optical microscope 10 and the focus of the cutting probe 32; and convert the first coordinate information according to the relative position to obtain the third coordinate information.

In this way, the first coordinate information can be quickly converted by the focus of the optical microscope 10 and the relative position of the focus of the cutting probe 32 to obtain the third coordinate information, which is high in efficiency and high in accuracy.

Specifically, in one example, the focus coordinate of the optical microscope 10 is (X0, Y0), and the focal coordinate of the optical microscope 10 is determined by the positional relationship between the first coordinate system O1X1Y1 and the third coordinate system O3X3Y3 (X0, Y0). The focal coordinate of the cutting probe 32 is the relative position of (X0", Y0"), and the third coordinate information is determined based on the relative position and the first coordinate information. Since the optical microscope 10 observes the object Y, the main focus is to adjust the focus of the optical microscope 10. When a clear image of the detected object Y is acquired, and a cross section of the defect of the detected object Y is cut by the cutting probe 32, the ion beam is focused according to the focus of the cutting probe 32, so the focus of the optical microscope 10 and the focus of the cutting probe 32 are obtained. The relative position of the third coordinate information is determined so that the cutting probe 32 cuts the profile of the defect of the detected object Y more accurately.

Referring to FIG. 8, in some embodiments, step S30 includes:

S32, moving the detected object Y to the focus of the scanning probe 22 according to the second coordinate information;

S34, rotating the detected object Y to the vertical direction of the ion beam of the cutting probe 32 according to the third coordinate information, and controlling the cutting probe 32 to cut the defect of the detected object Y; and

S36, the scanning probe 22 is controlled to scan the defect of the detected object Y after the cross-section cutting according to the second coordinate information.

Steps S26 and S28 of the sub-film defect detecting method of the embodiment of the present invention may be implemented by the processor 50 of the embodiment of the present invention. That is, the processor 50 is configured to execute at least one program to move the detected object Y to the focus of the scanning probe 22 according to the second coordinate information; rotate the detected object Y to the cutting probe 32 according to the third coordinate information. The ion beam is vertically oriented, and the cutting probe 32 is controlled to perform section cutting of the defect of the object Y; and the scanning probe 22 is controlled to scan the defect of the object Y after the section cutting according to the second coordinate information.

In this way, the cutting probe 32 can be quickly controlled according to the third coordinate information to accurately cut the defect of the detected object Y, and the scanning probe 22 can be quickly controlled according to the second coordinate information to scan the defect of the detected object Y after the section cutting. The efficiency of cutting and analyzing defects is high.

Specifically, referring again to FIG. 1 , the sub-film defect detecting apparatus 100 includes a moving platform 110 including a translating mechanism 60 and a rotating mechanism 70 . The embodiment of the present invention can send the detected object Y to the lower side of the optical microscope 10 and the focus of the scanning probe 22 through the translation mechanism 60, and rotate the detected object Y to the vertical direction of the ion beam of the cutting probe 32 by the rotating mechanism 70. In order to cause the ion beam to cut vertically in the cross section of the defect.

It can be understood that the cutting probe 32 can focus the ion beam and form a focused ion beam, and the focused ion beam peels off the surface atoms of the detected object Y by the strong current ion beam to complete the cross-sectional cutting of the detected object Y. The ion beam of the cutting probe 32 according to the embodiment of the present invention performs a progressive section cutting on the cross section of the object Y to be detected. The scanning probe 22 can emit a focused electron beam to scan a defect of the detected object Y after the section cutting.

In some embodiments, step S34 further includes the steps of:

When the cutting probe 32 is configured to cut the detected object Y according to the third coordinate information, the intensity of the ion beam is moved in the vertical direction of the ion beam perpendicular to the cutting probe 32, and the intensity of the ion beam of the cutting probe 32 is adjusted. The surface of the probe 32 that is perpendicular to the ion beam is cut, and the surface is defective, and the surface faces the scanning probe 22.

The step S342 of the sub-film defect detecting method of the embodiment of the present invention can be realized by the processor 50 of the embodiment of the present invention. That is, the processor 50 is configured to execute at least one program to control the cutting probe 32 to perform the cross-sectional cutting of the detected object Y according to the third coordinate information, and move the detected object in the vertical direction of the ion beam perpendicular to the cutting probe 32. Y and adjusting the ion beam intensity of the cutting probe 32 are formed with a surface parallel to the direction perpendicular to the ion beam of the cutting probe 32, with a defect on the surface, the surface facing the scanning probe 22.

Thus, by moving the detected object Y in the vertical direction of the ion beam perpendicular to the cutting probe 32 and adjusting the ion beam intensity of the cutting probe 32, the profile of the defect in the detected object Y is exposed, so that the scanning probe 22 is defective. The profile is scanned for analysis.

Specifically, referring to FIG. 9, the intensity of the ion beam is moved perpendicular to the direction perpendicular to the ion beam along the cutting probe 32 and the ion beam intensity of the cutting probe 32 is adjusted, so that the defect profile P1 parallel to the ion velocity is formed and The ion velocity vertically forms an oblique section P2 of a certain angle, wherein the depth of the defect profile P1 and the depth of the oblique section P2 can be changed by adjusting the intensity of the ion beam.

Referring to FIG. 10, in some embodiments, scanning device 20 includes scanning probe 22 and detector 24. Step S36 further includes the steps of:

S362, an electron beam is emitted by the scanning probe 22 to scan a cross section formed when the cutting probe 32 is cut;

S364, receiving, by the detector 24, a secondary electronic signal generated by the cross section to obtain image information of the cross section, and determining a film position of the defect according to the image information; and

S366, the X-ray generated by the defect is acquired by the detector 24, and the composition of the defect is analyzed according to the X-ray. Step S362, step S364, and step S366 of the under-film defect detecting method of the embodiment of the present invention may be implemented by the processor 50 of the embodiment of the present invention. That is, the processor 50 is configured to execute at least one program to enable the electron beam to be emitted by the scanning probe 22 to scan the profile formed when the cutting probe 32 is cut; the secondary electron signal generated by the cross section is received by the detector 24 to obtain a profile The image information determines the position of the defect film layer based on the image information; and the X-ray generated by the defect is acquired by the detector 24, and the composition of the defect is analyzed according to the X-ray.

Specifically, the scanning probe 22 emits a cross-section P1 formed by the scanning of the electron beam scanning cutting probe 32, and the cross-section P1 of the detected object Y generates a secondary electronic signal, and the detector 24 collects the secondary electronic signal generated by the cross-section, and is processed. After processing 50, the image information of the cross section is formed, and the processor 50 can determine the position of the film layer based on the image information or the defect. For example, in one example, the detected object Y is a 20-layer film structure, and in the image information of the cross section of the detected object Y, it is found that a dark spot appears in the third layer film, whereby the defect of the detected object Y can be determined. On the third layer of film. Since the corresponding X-rays are generated when the electron beam is scanned for defects, the processor 50 analyzes the constituents of the defects based on the X-rays generated by the defects acquired by the detector 24. The detector 24 can transmit the analyzed data to the computer host 300.

In some embodiments, the detected object Y is a display screen, and step S10 further includes the steps of:

The object to be detected Y is turned on and turned on, and the object Y is detected by using the optical microscope 10.

The above steps of the under-film defect detecting method of the embodiment of the present invention can be realized by the processor 50 of the embodiment of the present invention. That is, the processor 50 is configured to execute at least one program to turn on the power of the object Y to be detected and to illuminate, and then observe the object Y by using the optical microscope 10.

In this way, the first coordinate information of the defect of the detected object Y can be quickly and accurately obtained by the optical microscope after the detected object Y is lit.

Specifically, the display screen may be an AMOLED (Active Matrix Organic Light Emitting Diode) or an LCD (Liquid Crystal Display). It can be understood that when the detected object Y itself is transparent, when the object Y is observed, the object Y is not illuminated. Of course, in such an example, when the object Y is observed by the optical microscope 10, the LED lamp or other light source that turns on the optical microscope fills the object to be detected Y so that the optical microscope 10 can acquire the object Y to be detected. Clear image.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

Any process or method description in the flowcharts or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for performing the steps of a particular logical function or process. And the scope of the preferred embodiments of the invention includes additional implementations, which may be performed in a substantially simultaneous manner or in an reverse order, depending on the functions involved, in the order shown or discussed, which should It will be understood by those skilled in the art to which the embodiments of the present invention pertain.

The logic and/or steps represented in the flowchart or otherwise described herein, for example, may be considered as an ordered list of executable instructions for performing logical functions, and may be embodied in any computer readable medium, Used in conjunction with, or in conjunction with, an instruction execution system, apparatus, or device (eg, a computer-based system, a system including a processor, or other system that can fetch instructions and execute instructions from an instruction execution system, apparatus, or device) Or use with equipment. For the purposes of this specification, a "computer-readable medium" can be any apparatus that can contain, store, communicate, propagate, or transport a program for use in an instruction execution system, apparatus, or device, or in conjunction with the instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer readable media include the following: electrical connections (electronic devices) having one or more wires, portable computer disk cartridges (magnetic devices), random access memory (RAM), Read only memory (ROM), erasable editable read only memory (EPROM or flash memory), fiber optic devices, and portable compact disk read only memory (CDROM). In addition, the computer readable medium may even be a paper or other suitable medium on which the program can be printed, as it may be optically scanned, for example by paper or other medium, followed by editing, interpretation or, if appropriate, other suitable The method is processed to obtain the program electronically and then stored in computer memory.

It should be understood that portions of the invention may be implemented in hardware, software, firmware or a combination thereof. In the above-described embodiments, multiple steps or methods may be performed by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if performed in hardware, as in another embodiment, it can be used in the art. Any one of the column technologies or a combination thereof: discrete logic circuits with logic gates for performing logic functions on data signals, application specific integrated circuits with suitable combinational logic gates, programmable gate arrays (PGA) ), field programmable gate array (FPGA), etc.

Those skilled in the art can understand that all or part of the steps carried in carrying out the above implementation method can be completed by a program to instruct related hardware, and the program can be stored in a computer readable storage medium, and the program is executed. Including one or a combination of the steps of the method embodiments.

In addition, each functional unit in each embodiment of the present invention may be integrated into one processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above integrated modules can be executed in the form of hardware or in the form of software functional modules. The integrated modules, if executed in the form of software functional modules and sold or used as separate products, may also be stored in a computer readable storage medium.

The above mentioned storage medium may be a read only memory, a magnetic disk or an optical disk or the like. Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The embodiments are subject to variations, modifications, substitutions and variations.

Claims

A method for detecting a defect under the film, comprising the steps of:

Detecting the detected object by an optical microscope to determine first coordinate information of the defect of the detected object;

Determining a defect of the detected object and second coordinate information of the scanning device according to a positional relationship between the optical microscope and the scanning device and the cutting device, and the first coordinate information, and determining a defect of the detected object Third coordinate information with the cutting device; and

Controlling, by the cutting device, the cutting device to cut the detected object according to the third coordinate information, and controlling the scanning device to scan the defect of the detected object after cutting according to the second coordinate information.
The method of detecting a defect under the film according to claim 1, wherein the scanning device comprises a scanning probe, and the determining is based on a positional relationship between the optical microscope and the scanning device and the cutting device, and the first coordinate information. The step of the defect of the detected object and the second coordinate information of the scanning device includes:

Calculating a focus of the optical microscope and a relative position of a focus of the scanning probe; and

Converting the first coordinate information according to the relative position to obtain the second coordinate information.
The method of detecting a defect under the film according to claim 1 or 2, wherein the cutting device comprises a cutting probe, the positional relationship between the optical microscope and the scanning device and the cutting device, and the first coordinate information The step of determining the defect of the detected object and the third coordinate information of the cutting device comprises:

Calculating a focus of the optical microscope and a relative position of a focus of the cutting probe; and

Converting the first coordinate information according to the relative position to obtain the third coordinate information.
The method of detecting a defect under the film according to claim 1, wherein said scanning device comprises a scanning probe, said cutting device comprising a cutting probe, said controlling said cutting device according to said third coordinate information The step of cutting the detected object and controlling the scanning device to scan the defect of the detected object after cutting according to the second coordinate information includes:

Moving the detected object to a focus of the scanning probe according to the second coordinate information;

Rotating the detected object to a vertical direction of the ion beam of the cutting probe according to the third coordinate information, and controlling the cutting probe to perform section cutting on the defect of the detected object; and

The scanning probe is controlled to scan a defect of the detected object after the section cutting according to the second coordinate information.
The method of detecting a defect under the film according to claim 4, wherein the object to be detected is rotated to a vertical direction of the ion beam of the cutting probe according to the third coordinate information, and the pair of cutting probes is controlled The step of performing the section cutting of the defect of the detected object includes:

And controlling the ion beam in the vertical direction of the ion beam perpendicular to the cutting probe to move the object and adjust the ion beam of the cutting probe according to the third coordinate information when controlling the cutting probe to perform cross-sectional cutting on the object to be detected Intensity, the profile is formed with a surface parallel to the perpendicular direction of the ion beam of the cutting probe, the surface having the defect, the surface facing the scanning probe.
The method of detecting a defect under the film according to claim 1, wherein said scanning means comprises a scanning probe and a detector, said controlling said scanning means for said cut after said cutting according to said second coordinate information The steps of scanning for defects of the detection object include:

Transmitting an electron beam through the scanning probe to scan a profile formed when the cutting probe is cut;

Receiving, by the detector, a secondary electronic signal generated by the cross section to acquire image information of the cross section, and determining a film position of the defect according to the image information; and

X-rays generated by the defect are acquired by the detector, and constituents of the defect are analyzed according to the X-ray.
The method of detecting a defect under the film according to claim 1, wherein the object to be detected is a display screen, and the step of detecting the object to be detected by an optical microscope comprises the steps of:

The object to be detected is turned on and turned on, and the object to be detected is detected by the optical microscope.
A sub-film defect detecting device, comprising: an optical microscope, a scanning device and a cutting device; the sub-film defect detecting device further comprises:

a memory storing at least one program;

a processor, configured to execute the at least one program to implement the following steps:

Detecting the detected object by the optical microscope to determine first coordinate information of the defect of the detected object;

Determining a defect of the detected object and second coordinate information of the scanning device according to a positional relationship between the optical microscope and the scanning device and the cutting device, and the first coordinate information, and determining the a defect of the detecting object and third coordinate information of the cutting device; and

Controlling, by the cutting device, the cutting device to cut the detected object according to the third coordinate information, and controlling the scanning device to scan the defect of the detected object after cutting according to the second coordinate information.
The sub-film defect detecting apparatus according to claim 8, wherein said scanning means comprises a scanning probe, said processor being operative to execute at least one program to implement the following steps:

Calculating a focus of the optical microscope and a relative position of a focus of the scanning probe; and

Converting the first coordinate information according to the relative position to obtain the second coordinate information.
The sub-film defect detecting apparatus according to claim 8 or 9, wherein the cutting device comprises a cutting probe, and the processor is configured to execute at least one program to implement the following steps:

Calculating a focus of the optical microscope and a relative position of a focus of the cutting probe; and

Converting the first coordinate information according to the relative position to obtain the third coordinate information.
The sub-film defect detecting apparatus according to claim 8, wherein said scanning means comprises a scanning probe, said cutting means comprising a cutting probe, said processor for executing at least one program to implement the following steps:

Moving the detected object to a focus of the scanning probe according to the second coordinate information;

Rotating the detected object to a vertical direction of the ion beam of the cutting probe according to the third coordinate information, and controlling the cutting probe to perform section cutting on the defect of the detected object; and

The scanning probe is controlled to scan a defect of the detected object after the section cutting according to the second coordinate information.
The sub-film defect detecting apparatus according to claim 11, wherein said processor is operative to execute at least one program to implement the following steps:

And controlling the ion beam in the vertical direction of the ion beam perpendicular to the cutting probe to move the object and adjust the ion beam of the cutting probe according to the third coordinate information when controlling the cutting probe to perform cross-sectional cutting on the object to be detected Intensity, the profile is formed with a surface parallel to the perpendicular direction of the ion beam of the cutting probe, the surface having the defect, the surface facing the scanning probe.
The sub-film defect detecting apparatus according to claim 8, wherein said scanning means comprises a scanning probe and a detector, said processor being operative to execute at least one program to implement the following steps:

Transmitting an electron beam through the scanning probe to scan a profile formed when the cutting probe is cut;

Receiving, by the detector, a secondary electronic signal generated by the cross section to acquire image information of the cross section, and determining a film position of the defect according to the image information; and

X-rays generated by the defect are acquired by the detector, and constituents of the defect are analyzed according to the X-ray.
The sub-film defect detecting apparatus according to claim 8, wherein said object to be detected is a display screen, and said processor is operative to execute at least one program to implement the following steps:

The object to be detected is turned on and turned on, and the object to be detected is detected by the optical microscope.