WO2019036304A1

WO2019036304A1 - Spray coated sense lines, security and/or identification tags and devices including the same, and methods of manufacturing

Info

Publication number: WO2019036304A1
Application number: PCT/US2018/046302
Authority: WO
Inventors: Peter Fischer
Original assignee: Thin Film Electronics Asa
Priority date: 2017-08-18
Filing date: 2018-08-10
Publication date: 2019-02-21

Abstract

A security device, and methods of manufacturing the same, are disclosed. The security device comprises a first substrate having an integrated circuit thereon, the integrated circuit including (i) a continuity sensor configured to determine a continuity state of a container or package to which the first substrate is affixed, attached or adhered, and (ii) a first set of connection pads electrically connected to the continuity sensor, and one or more spray- coated sensing lines on the container, the package, or a second substrate to be affixed, attached or adhered to the container or package, the one or more spray-coated sensing lines being electrically connected to the first set of connection pads.

Description

SPRAY COATED SENSE LINES, SECURITY AND/OR IDENTIFICATION TAGS AND DEVICES INCLUDING THE SAME, AND METHODS OF MANUFACTURING

CROSS REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of U.S. Provisional Pat. Appl. No.

62/547,656, filed on August 18, 2017, incorporated herein by reference as if fully set forth herein.

FIELD OF THE INVENTION

[0002] The present invention generally relates to the field(s) of product security and authentication. More specifically, the present invention relates to a container, a product, or product packaging having circuitry for detecting a continuity state of the container, product or product packaging with spray-coated sense lines connected thereto. The present invention also relates to methods of manufacturing and using such devices (e.g., spray-coating the sense lines on the container, product, or product packaging, and attaching the circuitry to the sense lines).

DISCUSSION OF THE BACKGROUND

[0003] Wireless communication tags, such as the OpenSense™ security tags commercially available from Thin Film Electronics ASA, include labels with electronics printed or otherwise formed thereon that detect whether a bottle or package has been opened and communicate the continuity state using NFC (near field communication) or RF (radio frequency) protocols. This product is being evaluated and accepted in the packaging industry, for instance.

[0004] In the packaging industry, there are thousands of different package types.

However, on a commercial scale, it is difficult or impossible to tailor a different wireless communication tag for each different type, shape and size of package. For example, some packages may have complicated shapes (e.g., a bottle or jar with a rounded or curved surface). Furthermore, current solutions generally protect only one interface (e.g., one side of a package such as a carton), which is insufficient for many applications, such as packaging types with more than one interface between separable parts (e.g., a box with separable flaps on the top and bottom, such as a regular slotted container).

[0005] A challenge facing the packaging industry is finding a shape for a sense line or other security feature that protects each possible opening of the package. For example, a package such as a box or carton typically has at least 2-3 openings at the interfaces between separable parts. The challenge to provide such a security feature in a high-speed manufacturing process is even greater.

[0006] In some prior approaches, the sense line(s) are formed by blanket-depositing a metal such as aluminum, and subsequently patteming and etching the blanket-deposited metal. In some cases, 2/3 of the area of the blanket-deposited metal is used to form the sense line(s), and 1/3 of the area of the blanket-deposited metal is used to form the antenna. When etching a blanket deposited metal to form a sense line, a significant amount of the metal is wasted, which increases production costs (especially when manufacturing millions of wireless communication tags). Thus, it may be advantageous to form the sense line(s) using less metal or with a material that is cheaper than metal, and/or by a process that is faster than blanket-deposition and subsequent patteming and etching.

[0007] This "Discussion of the Background" section is provided for background information only. The statements in this "Discussion of the Background" are not an admission that the subject matter disclosed in this "Discussion of the Background" section constitutes prior art to the present disclosure, and no part of this "Discussion of the Background" section may be used as an admission that any part of this application, including this "Discussion of the Background" section, constitutes prior art to the present disclosure.

SUMMARY OF THE INVENTION

[0008] The present invention generally relates to the field(s) of product security and authentication. More specifically, the present invention relates to a container, a product, or product packaging having circuitry for detecting a continuity state of the container, product or product packaging with spray-coated sense lines connected thereto. The circuitry may comprise a standard communication device (e.g., a wireless or battery-operated security tag) with two open circuit endpoints (e.g., connection pads) for connection to the sense lines. The present invention also relates to methods of manufacturing and using such devices (e.g., spray-coating the sense lines on the container, product, or product packaging, and attaching the circuit endpoints to the sense lines).

[0009] In one aspect, the present invention relates to a security device, comprising a first substrate having an integrated circuit thereon and one or more spray-coated sensing lines on the container, the package, or a second substrate to be affixed, attached or adhered to the container or package. The integrated circuit includes (i) a continuity sensor configured to determine a continuity state of a container or package to which the first substrate is affixed, attached or adhered, and (ii) a first set of connection pads electrically connected to the continuity sensor. The spray-coated sensing line(s) are electrically connected to the first set of connection pads.

[0010] In various embodiments of the present invention, the sensing line(s) are on the container or the package. The container or the package may have an interface, and at least one sensing line may cross the interface of the package or container. In other embodiments, the sensing line(s) are on a second substrate.

[0011] In further embodiments of the present invention, the sensing line(s) comprise a conductive polymer. The conductive polymer may comprise a polyaniline, a polypyrrole, a polycarbazole, a polyindole, a polyazepine, a polyfluorene, a polyphenylene, a polypyrene, a polyazulene, a polynaphthalene, a polyacetylene, a poly(p-phenylene vinylene), a polythiophene, or a poly(3,4-ethylenedioxythiophene):polystyrene sulfonate. Alternatively, the sensing line(s) may comprise a metal. The metal may comprise aluminum, copper or silver. In even further embodiments, the sensing line(s) may be transparent.

[0012] In various embodiments of the present invention, the sensing line(s) may have a length of from 1 to 100 cm, a width of from 0.10 mm to 1 cm, and a thickness of from 0.05 mm to 2 mm. In further embodiments, the sensing line(s) may include one or more capacitive sensing lines that comprise at least one first capacitor electrode having a first segment that is aligned with and parallel to an interface of the package or container and a second segment that electrically connects the continuity sensor and the first segment. In some embodiments, the capacitive sensing line(s) comprise at least one second capacitor electrode that is aligned with and parallel to the interface and is on an opposite side of the interface from the first capacitor electrode, in which the at least one first capacitor electrode and the at least one second capacitor electrode form a capacitor when the package or container is closed.

[0013] In further embodiments of the present invention, the sensing line(s) may include a plurality of inductive sense lines. The inductive sensing lines may comprise at least one first inductor connected to the integrated circuit and near an interface of the package or container, and at least one second inductor on an opposite side of the interface of the package or container. Each of the first and second inductors may include a plurality of concentric circles or loops. [0014] In one or more embodiments of the present invention, the integrated circuit may include a memory storing a unique identification number and/or a value representing the continuity state of the container or package. For example, the memory may include one or more bits configured to store a value corresponding to the continuity state of the container or package. At least one layer of the memory may be printed.

[0015] In various embodiments of the present invention, the security device may further comprise a first component selected from an antenna and a battery on the first substrate or on a third substrate. The antenna may be configured to receive a first wireless signal and optionally transmit or broadcast a second wireless signal. When the battery is absent, the antenna may be configured to enable the integrated circuit to extract power from the first wireless signal. The battery may provide power to the integrated circuit. The first component may include the antenna, in which case the antenna is on the first substrate. Altematively, the antenna may be on the third substrate. In other embodiments of the present invention, the first component may include the battery.

[0016] In further embodiments of the present invention, the security device comprises a display on the first substrate, the third substrate, or a fourth substrate. The display may be electrically connected to the battery (when present) and/or the integrated circuit, and the integrated circuit may be configured to provide data and/or one or more instructions to the display. In some embodiments, the battery and the display may be on a common (i.e., the same) substrate.

[0017] In one or more embodiments, the security device may include an adhesive on the second substrate. The security device may also include a conductive adhesive on the first set of connection pads. The conductive adhesive may be pressure-sensitive or heat-activated.

[0018] In even further embodiments of the present invention, the security device may comprise a second component selected from a switch and a sensor other than a continuity sensor. The second component may be on the first substrate, the second substrate, the third substrate, or a fifth substrate. The second component is generally electrically connected to the integrated circuit. When the second component is on a substrate other than the first substrate, the integrated circuit comprises a second set of connection pads electrically connected to the second component.

[0019] In various embodiments, the security device comprises a near field communication (NFC), radio frequency (RF), and/or radio frequency identification (RFID) device. The integrated circuit may comprise one or more printed layers and/or one or more thin films. In some embodiments, the integrated circuit comprises a plurality of printed layers. In other embodiments, the integrated circuit comprises at least one printed layer and at least one thin film.

[0020] In some embodiments, the first substrate comprises a plastic sheet or film or a metal foil. In various embodiments, the first substrate may be flexible and/or may be configured to withstand a processing temperature of at least 200 °C.

[0021] In another aspect, the present invention relates to a method of manufacturing a security device, comprising spray-coating one or more sensing lines on a container, a package or a (first) substrate, and electrically connecting a first set of connection pads in an integrated circuit (IC) on another substrate to the sensing line(s). The IC further includes a continuity sensor electrically connected to the first set of connection pads, and the continuity sensor is configured to determine a continuity state of a container or package to which the other substrate is affixed, attached or adhered.

[0022] In various embodiments, electrically connecting the first set of connection pads to the sensing line(s) comprises affixing, attaching or adhering the (first) substrate to the container, the package or the other substrate such that the first set of connection pads contact ends of the sensing line(s).

[0023] In further embodiments, spray-coating the sensing line(s) comprises spraying a powder comprising a conductive polymer (e.g., as described herein) onto the container, the package, or the (first) substrate. Alternatively, spray-coating the sensing line(s) comprises spraying a powder including a metal (e.g., as described herein) onto the container, the package, or the (first) substrate. In even further embodiments, spraying the powder may comprise forcing a pressurized gas and the powder out of a nozzle onto the package, the container or the (first) substrate. In further embodiments, a stencil may be placed between the nozzle and the package, the container or the (first) substrate, and the powder is spray- coated through the stencil.

[0024] Some embodiments of the present method may further comprise connecting a first component selected from an antenna and a battery to the IC. The antenna may be configured to receive a first wireless signal and optionally transmit or broadcast a second wireless signal. When the battery is absent, the antenna may be configured to enable the integrated circuit to extract power from the first wireless signal. The battery may provide power to the integrated circuit. Alternatively, a display may be electrically connected to the battery (when present) and/or the integrated circuit. The integrated circuit may be configured to provide data and/or one or more instructions to the display. The battery and the display may be formed on a common (i.e., the same) substrate, and an adhesive may be deposited on the other substrate (when present). In addition, a conductive adhesive may be deposited on the first set of connection pads. The conductive adhesive may be pressure-sensitive or heat- activated.

[0025] One or more embodiments of the present method may further comprise electrically connecting a second component (e.g., a switch or a sensor other than a continuity sensor) to the integrated circuit. The second component may be on a substrate other than the other substrate, and the integrated circuit may comprise a second set of connection pads electrically connected to the second component.

[0026] In further embodiments, the method further comprises sensing the continuity state of the package or container with the continuity sensor, and communicating the continuity state with an antenna or display.

[0027] The present invention advantageously forms the sense line(s) with less metal or with a material that is cheaper than metal, and/or by a process that is faster than blanket- deposition and subsequent patterning and etching. These and other advantages of the present invention will become readily apparent from the detailed description of various embodiments below.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG. 1 shows an exemplary spray-coating apparatus.

[0029] FIGS. 2A-C show a container or package with an exemplary spray-coated sense line thereon, connected to a wireless security tag in accordance with one or more embodiments of the present invention.

[0030] FIGS. 3A-C show a container or package with exemplary spray-coated capacitive sense lines thereon, connected to a wireless security tag in accordance with one or more embodiments of the present invention.

[0031] FIGS. 4A-C show a container or package with exemplary spray-coated inductive sense lines thereon, connected to wireless a security tag in accordance with one or more embodiments of the present invention. [0032] FIGS. 5A-B show an alternative exemplary wireless security tag in accordance with one or more embodiments of the present invention.

[0033] FIGS. 6A-B show an exemplary connection between the connection pads of an exemplary wireless security tag and the connection pads of a spray-coated sense line in accordance with one or more embodiments of the present invention.

[0034] FIGS. 7A-B show an exemplary wireless security tag with a display in accordance with one or more embodiments of the present invention.

[0035] FIG. 8 shows a block diagram of an exemplary integrated circuit for use in the present wireless security tag. [0036] FIG. 9 is a flow chart for an exemplary method of spray-coated sensing lines on a package, container or substrate and attaching a security device thereto in accordance with one or more embodiments of the present invention.

DETAILED DESCRIPTION

[0037] Reference will now be made in detail to various embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the following embodiments, it will be understood that the descriptions are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents that may be included within the spirit and scope of the invention. Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be readily apparent to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to unnecessarily obscure aspects of the present invention. Furthermore, it should be understood that the possible permutations and combinations described herein are not meant to limit the invention. Specifically, variations that are not inconsistent may be mixed and matched as desired.

[0038] For convenience and simplicity, the terms "part," "portion" and "region" may be used interchangeably, but these terms are also generally given their art-recognized meanings. In addition, the terms "connection pad" and "terminal" may be used interchangeably, and the use of such one term herein includes the other term, unless the context of its use indicates otherwise. Additionally, the terms "spray-coat" and "cold spray" may be used interchangeably, and the terms "sense line," "sensing lines," "sense loop" and "sensing loop" may be used interchangeably, and the use of one such term herein includes the other terms.

[0039] The technical proposal(s) of embodiments of the present invention will be fully and clearly described in conjunction with the drawings in the following embodiments. It will be understood that the descriptions are not intended to limit the invention to these embodiments. Based on the described embodiments of the present invention, other embodiments can be obtained by one skilled in the art without creative contribution and are in the scope of legal protection given to the present invention.

[0040] In the various drawings, use of like reference numerals indicates like features, but the use of dissimilar reference numerals does not necessarily indicate dissimilar features. Furthermore, all characteristics, measures or processes disclosed in this document, except characteristics and/or processes that are mutually exclusive, can be combined in any manner and in any combination possible. Any characteristic disclosed in the present specification, claims, Abstract and Figures can be replaced by other equivalent characteristics or characteristics with similar objectives, purposes and/or functions, unless specified otherwise.

[0041] FIG. 1 shows a spray-coating apparatus 100 comprising a spray nozzle 101 , a gas supply tube 102, a carrier gas 106, a gas source 107, and a powder source 108. The spray-coating apparatus 100 may use cold spraying (CS), also known as gas dynamic cold spraying (GDCS), kinetic energy metallization, kinetic metallization, kinetic spraying, or high-velocity powder deposition. FIG. 1 additionally shows a spray plume 103, a thin film or coating 104, and a substrate 105.

[0042] In cold spraying, solid powders comprising fine particles (1 to 50 micrometers in diameter) are introduced into the spray nozzle 101 from the powder source (and/or powder source inlet) 108. The particles are accelerated to velocities up to 500 - 2000 m/s (e.g., supersonic speeds) out of the spray nozzle 101 in a carrier gas 106 supplied from the gas source 107 by the gas supply tube 102, forming the spray plume 103. The carrier gas 106 is expanded and achieves a high velocity, with an accompanying decrease in pressure and temperature. The powder particles may be initially carried by a separate gas stream, and are injected into the spray nozzle 101 either at an entrance 110 of the spray nozzle 101, or at a lower pressure point downstream of the entrance 110 (as shown). Unlike thermal spraying techniques, e.g., plasma spraying, arc spraying, flame spraying, or high velocity oxygen fuel (HVOF) spraying, the powders are not melted during the spraying process. During impact with the substrate 105, particles in the spray plume 103 undergo plastic deformation and adhere to the substrate 105, forming the thin film or coating 104.

[0043] The spray nozzle 101 may be a de Laval nozzle (e.g., with a converging section and a diverging section) or a cylindrical nozzle. Metals, polymers, ceramics, composite materials and nanocrystalline powders may be deposited out of the spray nozzle 101. The present spray-coating apparatus 100 advantageously utilizes metal or polymer powders, such as aluminum or polyaniline powders. To achieve a uniform thickness in the thin film or coating 104, the spray nozzle 101 may be scanned (e.g., moved or translated) along the substrate 105 in one direction when in operation. In order to form a specific partem in the thin film 104, a stencil or template may be placed between the substrate 105 and the spray nozzle 101. Subsequent passes or scans by the spray nozzle 101 can increase the thickness of the thin film 104. The adhesion of the metal and/or polymer powder to the substrate 105, as well as the cohesion of the thin film 104, is accomplished in the solid state. Since polymers are generally softer than metals, they can be applied at a lower velocity to achieve plastic deformation. To decrease the velocity of the spray plume 103, a diffuser may be placed at the end of the spray nozzle 101 , or, alternatively, the spray nozzle 101 may be cylindrical (e.g., as opposed to the de Laval nozzle).

[0044] In alternative embodiments, the spray-coating apparatus 100 may utilize shockwave-induced spraying, whereby the fast opening/closing of a control valve downstream from the carrier gas source 107 generates a pulsed (e.g., 10 - 30 Hz) supersonic gas jet, which may be optionally heated. The pulsed gas jet is used to accelerate and/or heat the powder, which is introduced into a cylindrical nozzle. The intermittent gas flow lowers gas consumption and increases energy efficiency. In contrast with cold spray, a DeLaval nozzle is not required, and powders may gain additional energy during acceleration. This effectively facilitates bonding for a wide range of engineering materials, including steels, titanium, and cermets.

[0045] The gas supply tube 102 may be connected to the gas source 107. The gas source 107 may contain nitrogen, helium, air or deoxygenated air at room temperature. The gas source 107 may comprise a tank or canister, and may include a pressure gauge and a valve. When the gas source 107 is opened, the carrier gas 106 is transferred from the gas source 107 to the spray nozzle 101 by the gas supply tube 102. While more expensive, helium gas produces much higher particle velocities in the spray plume 103.

[0046] A cost-saving approach (e.g., compared to using pure helium) is using a mixture of helium and nitrogen. A percentage of helium of from 1 -99% can be selected to optimize both cost and quality. In this way, higher particle velocities in the spray plume 103 may be achieved compared to using nitrogen alone, but at a lower cost than pure helium. Air may also be used in place of helium or nitrogen. However, the oxygen in air may have a detrimental effect for some materials (e.g., materials prone to oxidation, such as aluminum). Nevertheless, air may be suitable due to the significant cost savings. There may be a gas heater between the gas source 107 and the gas supply tube 102 that heats the carrier gas 106 to a temperature of from 100 - 500°C. A temperature higher than 500°C may result in the spray-coating apparatus 200 being characterized as a thermal spray, rather than a cold spray. The velocity of the spray plume 103 may also be controlled by the pressure of the carrier gas 106. Increasing the pressure of the carrier gas 106 increases the velocity of the spray plume 103, and, conversely, decreasing the pressure of the carrier gas 106 decreases the velocity of the spray plume 103.

[0047] The thin film or coating 104 may conduct electricity (e.g., when comprising a metal or a conductive polymer), and thus may be a component of a thin film electronic circuit. For example, the electronic circuit may be part of a wireless near field communication (NFC) or radio frequency (RF) identification and/or security device. In various embodiments, the thin film or coating 104 may comprise one or more sense lines used to determine whether a package or container has been opened (e.g., in combination with a sensor in the electronic circuit).

[0048] The substrate 105 may comprise a package or container, or a label or other substrate (such as tape) separate from the package or container, and may comprise a metal (e.g., aluminum, stainless steel, or tin), a ceramic (e.g., glass), a polymer (e.g., polyethylene, polypropylene, poly [ethylene naphthalate] or PEN, polyvinyl alcohol, copolymers and blends thereof, etc.) or a composite material. The package or container may be or comprise a box, a bottle, a jar, a tray, or other containment device. If the substrate 105 is or comprises a label, the substrate 105 may comprise a high temperature polymer (such as PEN), a metal layer or foil, or a laminate thereof.

[0049] It may be advantageous to spray-coat a conductive and optionally transparent polymer, such as polyaniline or poly[3,4-ethylenedioxythiophene] :polystyrene sulfonate [PEDOT:PSS], to form the sense line(s). The conductive polymer may be selected for its physical and/or electrical properties and its cost. Thus, spray-coating may save approximately 2/3 of the material costs, since only the antenna of the wireless device is formed from a blanket-deposited metal. For example, spray-coating may reduce the cost of the aluminum used in NFC tag manufacturing from 3 cents to 1 cent. Other conductive polymers that may be used include polypyrroles, polycarbazoles, polyindoles, polyazepines, polyfluorenes, polyphenylenes, polypyrenes, polyazulenes, polynaphthalenes, polyacetylenes, poly(p-phenylene vinylene)s, polythiophenes, and conductive mixtures, blends and co-polymers thereof.

[0050] Spray-coating also simplifies the application of the sense line(s) to more complex package or container shapes and/or patterns (e.g., to which a label, tape or other sense line substrate may not be easily applied, such as rounded or curved containers). By using a conductive polymer, the sense line(s) may be invisible or nearly invisible, and the appearance and/or aesthetics of the package may be improved (e.g., by avoiding use of a relatively large and/or shape-limited substrate onto which a metal sense line is formed).

Dimensions of the sense line(s) may vary, depending on the size and/or shape of the container or package.

Exemplary Spray-Coated Sense Lines and a Security Tag on a Sealed

Container

[0051] FIG. 2A shows an exemplary container 250 with a sense line 240 thereon, for use with a smart security tag 200 (FIG. 2B) on a separate substrate 205 in accordance with one or more embodiments of the present invention. As shown in FIG. 2A, the container or package 250 includes a box with separable flaps 255a-b at one end or surface of the box. Another set or pair of separable flaps may be at an opposite end of the box (not shown). Generally, the flaps 255a-b have an interface 252 therebetween. The sense line 240 is connected to pads 242 and 244 for subsequent attachment to the smart security tag.

[0052] Generally, the sense line pads 242 and 244 are on one of the separable parts of the container 250 (e.g., the flap 255b) or a part of the container connected thereto or integrated therewith (e.g., a front or side panel 258 of the container 250), and the sensing line 240 is on both the first and second separable parts 255a-b of the container 250 and in, on or over the interface 252. In some embodiments, a second sense line is also on third and fourth separable flaps on the side of the container 250 opposite from the flaps 255a-b and in, on or over the interface between the third and fourth separable flaps.

[0053] In some embodiments, the sense line 240 is spray-coated on the outside of the container 250 after sealing the container 250. For example, a spray coating station for applying a conductive polymer to the package or container 250 may spray a conductive polymer sense line 240 (e.g., through a mask or stencil) onto the flaps 255a-b of the package or container 250 in a manner that connects the two parts of the sense line 240 to the pads 242 and 244 and crosses or covers the interface(s) 252 to enable a subsequent user or purchaser to determine whether the package or container 250 has been opened or not. Alternatively, the sense line 240 may be spray-coated on an adhesive tape or label, and applied to the container 250 after it has been sealed.

[0054] In other embodiments, the sense line 240 may be spray-coated on an inside surface of the container 250 and across the ends of the flaps 255a-b at the interface 252 before it is sealed, and electrical connections may be made between the ends of the sense line 240 at the interface 252 (e.g., by inserting a conductive tab into the interface 252) at the time of sealing. However, bridging the unconnected ends of the sense line 240 across the interface 252 is not limited to the techniques disclosed herein, and may be done in any of a variety of ways. For example, in sealed, plastic-lined paper bag containers (e.g., for pet food), unconnected sections of the sense line 240 may be connected through pads in the crimped end(s) of the bag (and in some instances, repeatedly across the width of the bag to ensure a change in state of the continuity sensor regardless of where the bag is opened).

[0055] FIG. 2B shows the container 250 and the sense line 240 of FIG. 2A with the exemplary smart security tag 200 thereon. The exemplary security tag 200 comprises a substrate 205 with an antenna 220, an integrated circuit 210, and a plurality of connection pads 230 and 232 thereon. The antenna 220 may be electrically connected to the integrated circuit 210 as discussed below. The sensing line 240 is electrically connected to the integrated circuit 210 through connection pads 230 and 232 (which are bonded to underlying sense line pads 242 and 244; see also FIGS. 6A-B). The inner end of the antenna 220 is connected to the IC pad 225b by an electrical strap or trace on the opposite (inner) surface of the substrate 205 that is in contact with both of the pads 225a-b.

[0056] As shown in part in FIG. 2B, the sensing line 240 extends over the interface

252 between the separable or openable flaps 255a-b of the container 250. The sensing line 240 is connected to the integrated circuit 210 (and, in particular, to a continuity sensor in the integrated circuit 210) through the connection pads 230 and 232. Opening the container 250 along the interface 252 as shown in FIG. 2C tears the sensing line 240 and changes the state of the continuity sensor in the integrated circuit 210. This results in a change in the continuity state of the container 250 (e.g., from "closed" or "sealed" to "open").

[0057] Of course, the container 250 is not limited to a box with sealable, mated flaps

(at one end or each of two opposite ends). For example, if the flaps 255a-b are replaced with an extended, hinged flap that functions as a lid for the container 250, and/or if the end of the container 250 opposite from the flaps 255a-b is formed in a manner discouraging opening the container at that end, then the sense line 240 may be printed in a manner crossing at least one of the three separable interfaces between the hinged flap and the side panels of the container 250, and the security tag 200 may be placed on the hinged flap. Such an arrangement may be relatively easy to form at least in part on the inside surface of the container 250 (e.g., by printing the sense line 240 on the outer surface of the hinged flap, on the outer surface of any insertable extension [e.g., "lip"] of the hinged flap, and on the inner surface of the side panel of the container 250 in a location contacting the sense line[s] on the insertable extension^]), as well as on the outside surface of the container 250.

[0058] To sense the continuity of the sense line 240, a pulse or other electrical signal may be placed on one pad or end of the pad trace (e.g., by the IC 210), and the effect of the pulse or other electrical signal may be detected on the other pad or end of the pad trace (e.g., using conventional voltage or current detection circuitry). When a positive voltage is applied at one end of the sense line 240, and that positive voltage (or a positive voltage similar thereto or at least above a first predetermined threshold) is detected at the other end, the sense line 240 is intact, and the sensor detects that the container or package 250 is closed or sealed. When the positive voltage is applied at one end, but is not detected (or is less than or equal to a second predetermined threshold) at the other end, the sense line 240 is considered broken, and the sensor detects that the container or package 250 is opened. In general, the second predetermined threshold is less than the first predetermined threshold.

[0059] In general, tearing a paper carton or other paper container is easier than tearing multiple layers of plastic. Thus, relative to a security tag in or on a laminated plastic label, the present security tag may be placed in any convenient location on or in a paper container as long as the substrate for the IC (and optionally for the antenna) does not completely overlap the sense line 240. As a result, the present invention provides more freedom to place the tag 200 in a logistically or topologically facile location (e.g., on a planar surface somewhere other than the location of the sense line 240).

Exemplary Spray-Coated Capacitive Sense Lines and a Security Tag on a Sealed Container

[0060] FIGS. 3A-C show the exemplary container 250 with the exemplary security tag 200 (FIGS. 3B-C) thereon, but instead of a conductive sensing line crossing the interface between the flaps 255a-b, capacitive sensing lines in the form of capacitor electrodes 260a-b are on opposite sides of the interface 252. The capacitor electrodes 260a-b may be formed in a substantially similar manner to the sense line 240, and are capacitively coupled to form a capacitor that is electrically connected to the continuity sensor when the container 250 is closed or sealed. The capacitor electrode 260a may be larger (e.g., have one or more of a greater width, length, surface area, thickness, etc.) than the capacitor electrode 260b. The capacitor electrode 260b may be formed on the security tag 200 and then subsequently affixed to the container 250, as shown in FIGS 3B-C. Alternatively, the capacitor electrode 260b may be spray-coated onto the container 250 at the same time as the capacitor electrode 260a, and subsequently electrically connected to the IC 210 (e.g., in the same manner as sense line 240).

[0061] To detect a continuity state of the package or container 250, the continuity sensor in the IC 210 may detect a first capacitance on the capacitor electrode 260b when the container is closed, and a second capacitance of the capacitor electrode 260b when the container 250 is open. The continuity sensor may generate a first digital value representing the continuity state of the package or container 250 when it detects the first capacitance and/or a second digital value representing the continuity state of the package or container 250 when it detects the second capacitance. The first capacitance may be greater than or equal to a first predetermined threshold (e.g., a "closed state" threshold), and the second capacitance may be less than a second predetermined threshold (e.g., an "open state" threshold). The second predetermined threshold is less than (e.g., significantly less than) the first predetermined threshold. In some examples, the first capacitance has a non-zero value, and the second capacitance is zero or substantially zero.

[0062] The capacitor electrode 260b on the security tag 200 may comprise a first segment that is aligned with and parallel to the interface and a second segment that electrically connects the continuity sensor and the first segment. In alternative embodiments, the capacitor electrode 260a may further comprise a second electrode (e.g., a third segment that is aligned with and parallel to the interface 252 and/or the edge of the substrate 205, and a fourth segment that electrically connects the continuity sensor and the third segment). In in other or further alternative embodiments, the security device may comprise a plurality of capacitor electrodes 260a, configured to capacitively couple to a plurality of complementary capacitor electrodes 260b (at least one of which is on the second part of the package or container 250, or each of which is on a different separable part of the package or container

250). In such alternative embodiments, the capacitor electrodes 260a are advantageously spray-coated on the package or container 250 near (e.g., as close as possible) to an interface

(e.g., the interface 252) of the package or container 250.

Exemplary Spray-Coated Inductive Sense Lines and a Security Tag on a Sealed Container

[0063] FIGS. 4A-C show the exemplary container 250 with an exemplary security tag 200' thereon. Instead of a sensing line crossing the interface between the flaps 255a-b, inductive sense lines comprising inductors 270a-b are formed on opposite sides of the interface 252. The inductors 270a-b may be formed in a substantially similar manner to the sense line 240, and each may comprise a coil, concentric rings or a plurality of loops or "rings" in a spiral. For example, the number of loop or "rings" may be from 2 to about 50, or any number or range of numbers therein. The shape of the inductors 270a-b may be square, rectangular, oval, circular or serpentine, and may have dimensions that match any of multiple form factors. When the inductors 270a-b have a serpentine pattern, the need to route an inner end of the inductor coil or spiral to an external location is avoided (along with the strap 275a). The inductors 270a-b are inductively coupled to each other such that a current in the inductor 270b produces a current in the inductor 270a, and vice versa. The inductor 270b is electrically connected to the continuity sensor in the IC 210 through pads 242 and 244.

[0064] In some embodiments, the inductor 270b may be formed on the security tag

200' and then subsequently affixed to the container 250. Alternatively, the inductor 270b may be spray-coated onto the container 250 at the same time as the inductor 270a as shown in FIGS 4B-C, and subsequently electrically connected to the IC 210. The inductor 270b may function as an antenna for wireless communications with the IC 210, or a separate antenna (e.g., antenna 220 in FIGS. 2B-C and 3B-C) may be connected to the IC 210 for wireless communication with external devices.

[0065] To detect a continuity state of the package or container 250, the continuity sensor in the IC 210 may detect a first current in the inductor 270b when the package or container 250 is closed, and a second current in the inductor 270b when the package or container 250 is open. Similar to the capacitive sense lines 260a-b shown in FIGS. 3A-C, the continuity sensor may generate one of a plurality of digital values representing the continuity state of the package or container 250 when it detects the first current and/or the second current. The first current may be greater than or equal to a first predetermined (e.g., the closed state) threshold, the second current may be less than a second predetermined (e.g., the open state) threshold, and the second predetermined threshold may be less than (e.g., significantly less than) or equal to the first predetermined threshold. For example, the second current may be a baseline or minimum current (or be approximately equal to a baseline or minimum current), and the first current may have a value greater than (e.g., significantly greater than) the baseline or minimum current.

[0066] The inductor 270b may comprise a first segment or trace that electrically connects the outer end of the coil or spiral to the IC 210 or continuity sensor through the pad 244, and a second segment or trace on an insulative substrate or layer 275b that electrically connects the inner end of the coil or spiral to the IC 210 or continuity sensor through the pad 242. In some embodiments, a second IC 280 having pads 282 and 284 may be similarly connected to the inductor 270a through pads 272 and 274. The pads 272 and 274 may be respectively connected to the pads 282 and 284 on the IC 280. The IC 280 may comprise a capacitor, and optionally, other circuit elements configured to generate or create a relatively large differential between the first and second currents in the inductor 270b. In alternative embodiments, the security device may comprise a plurality of inductors 270a, configured to inductively couple to a plurality of complementary inductors 270b, each of which is on a different separable part of the package or container 250.

[0067] When a capacitive or inductive sense line is on the same substrate as the IC, wireless contact or communication (i.e., capacitive and/or inductive coupling) with the complementary sense line advantageously avoids any need to include a material having the primary function of making ohmic contact between the sense line and the pads 230 and 232. Capacitive and/or inductive coupling between the sense line and the IC 210 also avoids processing issues such as alignment between the pads 230 and 232 and the pads of the sense line, and may provide the highest-speed processing for placement of the IC 210 and antenna

220, without temperature and/or other restrictions. Thus, a smart security tag 200 with a short between the pads 230 and 232 may function as a small antenna that inductively couples with the sense line, which may function as a larger antenna.

Exemplary Connectable Security Tags with a (Wireless) Communication

Device and a Continuity Sensor thereon

[0068] As shown in FIGS. 2B-C, 3B-C and 4B-C, the wireless security tag/device

200 includes an integrated circuit (IC) 210, an optional antenna 220 and antenna connection pads 225a-b, and IC connection pads 230 and 232 on a substrate 205. Traces 234 and 236 electrically connect the IC connection pads 230 and 232 to the IC 210 (e.g., to bond pads on the IC 210). The antenna connection pads 225a-b are for a strap to electrically connect the inner end of the antenna 220 to a location outside the antenna 220.

[0069] The substrate 205 for the wireless security tag/device 200 is rectangular or substantially rectangular, although the substrate 205 may have another shape suitable for a particular application (e.g., such as t-shaped, oval, elongated, rectangular or other quadrilateral [with or without rounded corners], tapered, irregular or as otherwise described herein). In exemplary embodiments, the substrate 205 may comprise paper, a polymer (e.g., a high temperature polymer such as polyethylene naphthalate [PEN] or polyethylene terephthalate [PET], nylon, polyvinyl alcohol and copolymers thereof [e.g., ethylene-vinyl alcohol (EVOH) copolymers], polyvinyl chloride [PVC], polypropylene [PP], polychlorotrifluoroethylene [PCFE; e.g., ACLAR^® pharmaceutical packaging film, available commercially from Honeywell], polyethylene [PE; e.g., high density PE (HDPE)]), a metal layer or foil (e.g., comprising aluminum, stainless steel or copper), a laminate or other combination thereof, etc.

[0070] In exemplary embodiments, the integrated circuit 210 includes a continuity sensor (not shown) electrically connected to the traces 234 and 236. The integrated circuit 210 may further include a memory (not shown) including one or more bits configured to store a value corresponding to a continuity state of a container or package on which the substrate 205 is attached or secured. The memory may also include a plurality of bits that store identification information (e.g., a device identification number), product information, information from at least one other sensor, software instructions, etc.

[0071] In some embodiments, the integrated circuit 210 includes one or more printed layers. For example, memory bits storing information that does not change (e.g., device identification information, instructions) may be formed by printing one or more layers of the memory, similar to a read-only memory (ROM). In one example, the integrated circuit is an "all-printed" integrated circuit (i.e., all or substantially all layers are printed layers). In further embodiments, the integrated circuit 210 includes one or more thin films, as an alternative to or in combination with one or more printed layer(s). In any of these embodiments, the IC 210 may be formed directly on the substrate 205. In embodiments in which the integrated circuit 210 is configured to process wireless signals to or from a reader (e.g., an RF- or NFC-enabled smart phone or tablet computer), the manufacturer and/or reseller may send a message or other information to the consumer depending on the continuity state of the container 350. For example, when the continuity state of the container 350 is sealed (or its equivalent), the manufacturer and/or reseller may send product price information and/or information about other products with which the product in the container 350 may be advantageously used. On the other hand, when the continuity state of the container 350 is opened, the manufacturer and/or reseller may send use information for the product, such as instructions for assembly or use, recipes (for food or beverage products), etc.

[0072] In various embodiments, the antenna 220 may comprise a coil, concentric rings or a plurality of loops or "rings" in a spiral. For example, the number of loop or "rings" may be from 2 to about 50, or any natural number or range of natural numbers therein. Alternatively, the shape of the antenna 220 may be a square, rectangular, oval or serpentine, and may have dimensions that match any of multiple form factors, while preserving compatibility with reader hardware (e.g., the NFC 13.56 MHz target frequency). The antenna 220 may be printed (e.g., using a printed conductor such as, but not limited to, silver from a silver paste or ink) or formed using conventional methods such as blanket deposition and etching (e.g., by sputtering or evaporating aluminum on the substrate 205 and patterning by low-resolution [e.g., 10-1,000 μιτι line width] photolithography and wet or dry etching).

[0073] In one embodiment, the IC 210 is formed on ends of the traces 234 and 236, the outer end of the antenna 220, and the trace to which the antenna pad 225b is connected. Alternatively, the IC 210 is built up layer by layer on the substrate 205, and the ends of the traces 234 and 236, the outer end of the antenna 220, and the trace to which the antenna pad 225b is connected are formed in contact with conductive pads on the IC 210 that are, in turn, connected to circuitry in the IC 210. [0074] The inner end of the antenna 220 may be electrically connected to a first pad

225a, which is conventionally connected to a second pad 225b that is electrically connected to a terminal on the integrated circuit 230. In one example, a strap is formed on the underside of the substrate 205 and bonded to the pads 225a-b through vias in the substrate. Alternatively, the strap may be formed on an interposer (i.e., an insulating substrate) and bonded to the pads 225a-b through vias in the interposer or in a dielectric layer formed over the strap.

[0075] An alternative is shown in FIGS. 5A-B, in which the integrated circuit 210' may function as such a strap when formed on an electrically insulating substrate or interposer (a so-called "integrated interposer"). In such embodiments, the integrated circuit 210' includes first and second pads 212a-b (that connect to antenna pads 225a-b) and third and fourth pads 214a-b (that connect to pads 231 and 233 at the ends of traces 234 and 236 on the substrate 205'). With the exception of antenna pad 225a being on the inside of the antenna 220' and antenna pad 225b being on the outside of the antenna 220, the various pads may be in any location as long as the first and second pads 212a-b overlap with the antenna pads

225a-b, and the third and fourth pads 214a-b overlap with the trace pads 231 and 233. FIG.

5B shows the IC 210' electrically connected to the antenna 220' and the traces 234 and 236 through the first and second pads 212a-b and the third and fourth pads 214a-b, respectively

(e.g., by soldering, a conductive paste or adhesive, etc.).

Exemplary Connections between the Spray-Coated Sense Line(s) and the

Communication Device

[0076] The wireless security tag or device 200 is produced without sense lines, as shown in FIGS. 2B-C, 3B-C and 4B-C. The wireless security device 200 is then coupled to one or more spray-coated sense lines 240, 260b or 270b on the container or package 250, which means that the tag or device 200 may be used for almost any type of package without modification. However, there is a need to create an ohmic contact to electrically connect the spray-coated sense line(s) and the integrated circuit 200. This may be accomplished in several ways.

[0077] One objective of the present invention is to connect a wireless security tag or device to a spray-coated sense loop. Some commercially-available wireless security devices include aluminum-based traces electrically connected to the IC. One challenge is that aluminum oxidizes rapidly, which can make it difficult to form an ohmic contact between the connection points of the traces and the spray-coated sense loop. One solution is to use a conductive ink or adhesive to attach the trace(s) from the integrated circuit of the wireless security device to the spray-coated sense line(s), and optionally sinter it with a laser or heat it (e.g., in a furnace or an oven). Another solution is to use a material for the traces that does not oxidize easily (e.g., copper, silver, etc.). A third solution is to protect the aluminum trace or connection point (terminal) using a protective coating or similar oxygen barrier.

[0078] One way to implement the present wireless security device in packages and containers is to attach the antenna and/or integrated circuit to the spray-coated sense line(s) in a packaging process / manufacturing line using a conductive glue, laser welding or similar attachment technique. The spray-coated sense line(s) that detect the continuity state of the package (e.g., whether the package is opened or sealed) may typically be spray-coated using a conductive powder (e.g., silver, aluminum, copper or other metal, a conductive polymer, etc.), a metal ink (e.g., containing a suspension of a metal powder or metal nanoparticles, a solution of one or more metal salts or metal complexes, etc., in one or more solvents), an ink or paste of another conductor (e.g., a conductive polymer, a doped Group IV element, etc.), etc. Another objective is to use capacitive and/or inductive sense lines in or in proximity to the sense line(s) connected to the IC, thus using a sensed capacitance or inductance to indicate an opened package or container, instead of a physical tear action (e.g., a broken sense line).

[0079] The sense line(s) may be effectively made with an open circuit. The circuit endpoints may be spray-coated as a relatively wide pad (for ease of placement tolerance), and when formed on a separate substrate (rather than directly on the container, product or package), an optional a via hole may be formed in the pad. In some cases, an isotropic or anisotropic conductive adhesive may be placed on the underside of the substrate (e.g., in contact with a corresponding pad, and/or through the via). The via may function as a conduit connecting pads to the integrated circuit with pads of the spray-coated sense line(s). A similar type of via or through-hole construction is common in the printing/die cutting industry.

[0080] In another example, attachment of the connection pads 232 and 234 may be made with an anisotropic pressure-sensitive adhesive (PSA) and/or a heat-activated conductive adhesive (e.g., that electrically connects the sense line(s) to the connection pads 232 and 234 when heating a shrink-wrap film applied to the package or container). Alternatively, the sense line(s) may be coupled to the IC using a capacitive coupling approach (e.g., an inductor printed over an interface of the container that is also capacitively coupled to the antenna of the present security tag/device).

[0081] Referring now to FIG. 6A, the exemplary wireless security device 200 includes an antenna 220, an integrated circuit 210, and a set of connection pads 230 and 232 for connection to a sensing line 240. The connection pads 230 and 232 may be connected to pads 242 and 244 at opposite ends of the sensing line 240, for example, using a via 248 (FIG. 6B). In one embodiment, a via or hole 248 is punched through each of the connection pads 230 and 232, and a conductive adhesive 246 is placed in the via or hole 248 (e.g., by spraying, printing, etc.). In a further embodiment, the via or hole 248 is also punched through the substrate 205 under or over the connection pads 230 and 232, or a window or other opening is formed in the substrate 205 over the connection pads 230 and 232. The wireless security device 200 with the vias or holes 248 punched in the connection pads 230 and 232 is then placed directly on the carton or other container with the traces 240a-b printed thereon. ("240a" and "240b" refer to opposite ends of a single wire on the container.) Connector pads 242 and 244 may also be spray-coated on the container to allow for wide placement tolerance of the wireless security device 200 on the container (e.g., so that the pads 230 and 232 overlap with the pads 242 and 244).

[0082] The exact size, shape and alignment of the vias in the pads 230 and 232 may be anything as long as the conductive adhesive 246 makes contact with both of the pads 230 and 242 (to connect the IC 210 to sensing line end 240a), and separately, both of the pads 232 and 244 (to connect the IC 210 to sensing line end 240b). Preferably, the vias are completely within the area of the pads 230 and 232. In general, the vias have width and length (area) dimensions that are no more than 80-90% of the corresponding dimensions of the pads 230 and 232. Alternatively, the vias have a maximum area dimension (e.g., width, length or diameter) that is less than the corresponding dimension of the pads 230 and 232, minus at least two alignment tolerances of the equipment forming the vias.

[0083] In one embodiment, the antenna 220, the pads 230 and 232, and the traces thereto are formed in a single process using a metal such as aluminum. One issue that may arise when the pads 230 and 232 comprise aluminum is securing good ohmic contacts to the pads 230 and 232. Thus, in a further embodiment, a layer comprising or consisting essentially of tin or a tin alloy (e.g., tin with one or more alloying metals or elements selected from bismuth, silver, copper, zinc, and indium) may be deposited on the aluminum pads 230 and 232, and optionally, on the traces thereto (e.g., by immersion plating or printing). When the pads 230 and 232 comprise tin-coated aluminum, silver or copper (or another solder- compatible metal or alloy), the sensing line 240 may be attached to the pads 230 and 232 by bumping or welding. Alternatively, the pads 230 and 232 may be coated with a thin layer of palladium or a photosensitive conductive material that is cured by irradiation with light (e.g., ultraviolet light). When the coating comprises palladium, the coating may be formed from an ink comprising an aqueous or organic solution of a palladium salt or complex. The ink may be used to print a seed layer on which a bulk metal conductor (e.g., aluminum or copper) is plated, electrochemically or electrolessly. Thus, the traces from the IC 210 to the pads 232 and 234 may have a uniform width and thickness, and the pads 232 and 234 may be formed thereon with dimensions different from those of the traces. For example, the pads 232 and 234 may have a greater width, and, optionally, a greater thickness than the width and thickness of the traces, respectively.

[0084] In another example, an ink or paste of a conductive metal such as silver or copper or other curable conductive ink may be placed in the vias and irradiated with a relatively high dose of radiation (e.g., from a laser) to sinter the metal or other conductor in the ink. Alternatively, curing may involve a so-called flash cure (e.g., using a 300 ms dose of visible light), for example using a flash-curable material available commercially from Nanocentrix. In a further alternative, an anisotropic pressure sensitive material (available commercially from 3M) may be used to join the pads 230 and 232 to the sense line ends 242 and 244. A variety of conductive adhesives may be compatible with processes and/or materials for forming the sense line 240 on the packaging or container. Thus, other materials and/or methods suitable to connect the wireless security device to a printed sense line are contemplated, and the invention is not limited to the specific materials and methods described herein.

[0085] In a further alternative to the vias in FIGS. 6A-B, the antenna 220, the pads

230 and 232, and the traces thereto are formed in a single process using a conductive material such as carbon black, graphite, carbon nanotubes, etc. Carbon loops have sufficiently good electrical properties for formation of antennas, in which case the antenna 220 may be printed using a carbon ink. Another advantage to carbon as an antenna material is that the antenna 220 may be printed on a side of the substrate 205 opposite to that of the IC 210. [0086] An advantage of the present approach is that the substrate 205 and IC 210 provide a relatively large amount of area or space to form the antenna 220, the traces, the vias, and the conductive adhesive 246, and allow ample room for alignment of overlapping structures with each other.

[0087] In any case, the IC 210 and antenna 220 may comprise materials that may tolerate a relatively high temperature (e.g., routinely up to about 400 °C, and in limited excursions, up to about 600 °C), and may be generic, without many different variations to design, track, and maintain. On the other hand, the sense line 240 tends to be somewhat product- or package-specific, since it is formed on the product or package. In fact, placement and formation of the sense line 240 may be performed by an entity different from the entity or entities that manufacture the IC 210 and/or antenna 220 and/or that connect the IC 210 to the sense line 240. In general, the sense (or continuity) line 240 is relatively simple and does not require fine tolerances or tuning (e.g., such as in an RF circuit or the antenna 220). Thus, when the sense line 240 is a separate material, it may be designed and manufactured to tear easily when the package or container is opened. Consequently, it may be an advantage when the sense line 240 is not strong, and especially so when it is printed on a tearable material such as paper or a thin polypropylene film. Furthermore, separating the manufacturing processes for the sense line 240 and the antenna 220 allows different, and more specifically tailored, materials to be used for the sense line 240 and the antenna 220.

An Exemplary Tag Including a Display

[0088] FIGS. 7A-B show an exemplary tag 300 including a display 310, the integrated circuit 210 and a battery 320 on a substrate 305. The tag 300 may be electrically connected to a sense line on a container (e.g., box), such as the container 250 shown in FIGS. 2A-C, 3A-C, and 4A-C. The integrated circuit 210 may be the same or substantially the same as the integrated circuit 210 in FIGS. 2B-C, 3B-C, 4B-C and 6A, but may include circuitry configured to cause the display to display a message or indication, rather than to wirelessly communicate with an external device (e.g., using a transmitter and/or receiver). The IC 210 is electrically connected to connection pads 230 and 232 through traces on the substrate 305. The sense line (not shown) may be the same or substantially the same as the sense line 240 in FIGS. 2A-C and 6A-B, the capacitive sense lines 260a-b in FIGS. 3A-C, or the inductive sense lines in FIGS. 4A-C, and may have ends connected to the connection pads 230 and 232.

[0089] The display 310 may show the continuity state of the container 350 by displaying a text message or other visual indication, such as "Authentic Product" when the container remains sealed from the time of factory production or packaging. The display 310 may also show other information about the product or the conditions under which the product was shipped and/or stored, a message from the manufacturer or reseller, etc. The display 310 is, in some embodiments, relatively simple, and may comprise an electrochromic display (ECD), an electroluminescent display (ELD), a liquid crystal display (LCD), or a dot-matrix display. For example, the integrated circuit 210 may send a simple "on/off instruction (e.g., in the form of a binary logic signal) to the display 310. Alternatively, the display 310 may be relatively complex, and may comprise a thin film transistor liquid crystal display (TFT LCD), an organic light-emitting diode (OLED) display, electronic paper, a light-emitting diode (LED)-backlit LCD display, etc. Thus, a photoactive layer in the display 310 may comprise an electrochromic layer, an electroluminescent layer, a liquid crystal layer, or organic or inorganic LED layers, alone or in combination with a plurality of thin film transistors and/or LED backlighting, etc. In a further embodiment, the display 310 may further comprise a touch screen to enable the user to input information or data to send to manufacturer or reseller.

[0090] The battery 320 may be a conventional thin-film or printed battery, comprising a first current collector layer, a cathode, an electrolyte layer, an anode, and a second current collector layer. In general, the cathode is in electrical contact (and generally is in physical contact) with one of the first and second current collector layers, and the anode is in electrical contact (and generally is in physical contact) with the other of the first and second current collector layers. The electrolyte layer is between the cathode and the anode, and is generally in electrical and physical contact with each of the cathode and the anode.

[0091] In some embodiments, the battery 320 is formed on a separate substrate and advantageously connected to one or more other components (e.g., the IC 210, the display 310, etc.) and/or activated at the latest possible time. For example, when the sense lines are spray-coated on the package or container, one or more shunt lines (structurally similar or identical to the sense lines) that electrically connect the battery to the IC are also printed on the package or container. The battery may be formed on the same substrate as the IC (e.g., for convenience), but the battery circuit is not connected to the IC on the substrate. When the tag is attached to the sense lines, the substrate is placed on the package or container in a manner that connects the battery 320 to the IC 210 by the shunt lines. Thus, the shelf life of the battery 320 may be extended (in some cases, significantly) because the battery is only connected when the IC 210 and the battery 320 are placed on the package or container. This is especially significant when the battery 320 has appreciable leakage or stand-by current (as is sometimes the case in printed electronics).

An Exemplary Integrated Circuit

[0092] FIG. 8 shows an exemplary integrated circuit 400 for use in the present wireless security device. Some or all of the circuit and/or functional blocks in the exemplary integrated circuit 400 may be present in the integrated circuit 210 in FIGS. 2B-C, 3B-C, 4B- C, 6A and 7A-B, and the integrated circuit 210' in FIGS. 5A-B. Additional circuit blocks, such as one or more display drivers, may also be included in certain embodiments.

[0093] The exemplary integrated circuit (IC) 400 for use with the present security tag includes one or more sensors 410, a threshold comparator 420 receiving information (e.g., a signal) from the sensor(s) 410, a pulse driver 440 receiving an output of the threshold comparator 420, a memory 460 storing sensor data from the pulse driver 440, one or more bit lines (BL) 472 for reading data from the memory 460, one or more sense amplifiers (SA) 474 for converting the signal(s) on the bit line(s) to digital signals, one or more latches 476 for temporarily storing data from the sense amplifier(s), and a transmitter (e.g., modulator) 490 configured to output data (including an identification code) from the device. The exemplary IC 400 also contains a clock 450 configured to provide a timing signal (e.g., CLK) that controls the timing of certain operations in the IC 400 and a memory timing control block or circuit 470 that controls the timing of memory read operations. The modulator 490 also receives the timing signal (CLK) from the clock circuit or a slowed-down or sped-up variation thereof. The exemplary IC 400 also includes a power supply block or circuit 480 that provides a direct current (e.g., VCC) to various circuits and/or circuit blocks in the IC. The memory 460 may also contain identification code. The portion of the memory 460 containing identification code may be printed. The IC 400 may further contain a receiver (e.g., a demodulator), one or more rectifiers (e.g., a rectifying diode, one or more half-bridge or full-bridge rectifiers, etc.), one or more tuning or storage capacitors, etc. Connection pads in the modulator 490 and the power supply 480 may be connected to ends of an antenna (e.g., at Coill and Coil2). Alternatively, the modulator may be omitted or replaced with one or more display drivers, for example, and the power supply 480 may be connected to one or more leads electrically connected to a battery and optionally a ground plane or other ground potential.

[0094] The memory in an NFC or RF identification device may contain a fixed number of bits. In some implementations, NFC tags may contain 128 or 256 bits. Some bits are allocated to overhead (non-payload) data for format identification and data integrity (CRC) checking. The pay load of the device (e.g., the NFC or RF tag) consumes the remainder of the bits. For example, the payload may be up to 96 bits in the case of the 128- bit NFC tag and up to 224 bits in the case of the 256-bit NFC tag.

[0095] The payload of the NFC tag may be allocated to variable amounts of fixed

ROM bits (which are generally - but not always - used as a unique identification number). When print methods are used in manufacturing the NFC tag, the ROM bits are permanently encoded and cannot be electrically modified. Any payload bits that are not allocated as fixed ROM bits may be allocated as dynamic sensor bits (e.g., for the continuity sensor to which the sensing lines are connected). These sensor bits may change values, based on a sensed input. Different splits or allocations between ROM and sensor bits are indicated by data format bits that are part of the non-payload or Overhead' bits, generally in the first 16 bits of the NFC tag memory.

[0096] One example of how continuity sensing may be implemented in the present invention involves a sensor 410 that detects when one or more sensing lines (e.g., sensing line 240 in FIGS. 2A-C and 6A, sensing lines 260a-b in FIGS. 3A-C, or sensing lines 270a-b in FIGS. 4A-B) are broken or decoupled. Upon such an event, one or more sensor bits in the memory 460 change state to reflect the broken or cut sensing line. This indicates to the reader (e.g., an NFC smartphone, etc.) that the protected container has been opened. The ROM ID bits do not change, but any data integrity bits (e.g., for CRC) may be updated to reflect the state of the sensor bits.

[0097] Continuity sensing generally refers to a capability and/or function that senses or determines whether a container has been tampered with or opened on the one hand, or remains in a closed state (e.g., its factory-sealed condition) on the other hand. In one embodiment, continuity sensing is implemented using at least one sensing line (e.g., sensing line 240 in FIGS. 2A-C and 6A, sensing lines 260a-b in FIGS. 3A-C, or sensing lines 270a-b in FIGS. 4A-B). The present security device may be thought of as having two parts: a first part that includes the IC and the antenna (or display), and a second part that includes the sensing line(s). The part of the wireless security device that includes the IC and antenna or display is on a first part of the protected container. The part of the security device that includes the sensing line(s) is generally on the same part of the container as the integrated circuit and the antenna or display, and may be at least in part on a second, separable part of the protected container and/or a sealing device or mechanism such as a cap or lid that may move relative to the container (e.g., a bottle, jar or tray) upon opening. The sensing line may cross an interface between the two separable parts of the container, where opening the container or packaging along or across the interface generally breaks or decouples the sensing line(s), or determines the continuity state of the package or container by capacitive or inductive coupling across the interface.

[0098] In addition to a primary sensing line, the present wireless security device may include one or more redundant sensing lines. The redundant sensing line(s) may be used in an "AND"-type function with the primary sensing line(s) (e.g., the IC and sensor sense that the container or packaging is opened only when all of the primary and redundant sensing lines are broken), or in an "OR"-type function with the sensing line(s) (e.g., the IC and sensor sense that the container or packaging is opened or has been tampered with when any of the primary and redundant sensing lines are broken). Alternatively, the sensing line and redundant sensing lines may provide one or more "partially-opened" continuity states when one or more of the primary and redundant sensing lines are broken and one or more of the primary and redundant sensing lines are not broken. One skilled in the art may easily derive logic and applications for such functionality and/or capability.

[0099] Of course, the IC 400 in the present device may include one or more other sensors in addition to the continuity sensor(s). For example, the IC 400 may further include one or more temperature sensors, humidity sensors, electromagnetic field sensors, current / voltage / power sensors, light sensors, and/or chemical sensors (e.g., for oxygen, carbon monoxide, carbon dioxide, nitrogen oxides, sulfur dioxide and/or trioxide, ozone, one or more toxins, etc.). The present IC may also include one or more time sensors (e.g., configured to count or determine elapsed time), which may include the clock circuit (which may be a basis for a real-time clock) and one or more counters, dividers, etc., as is known in the art. The leads from any external sensing mechanism should be connected to the IC at connection pads separate from those for the antenna and the continuity sensor. Such sensors may be on the same substrate as the antenna and the IC, or on a different substrate that is electrically connectable to the antenna and/or the IC. [0100] The electronic security tag and/or device includes a sensor configured to detect an opened or tampered state of a package or container to which the tag and/or device is attached. In one embodiment, the security tag or device communicates wirelessly (e.g., with an NFC or RF reader). In other embodiments, the security tag or device includes a display and a battery. The security device generally includes an integrated circuit on or over a substrate, an antenna or display on the same or a different substrate, and a first set of connection pads electrically connected to the integrated circuit (and, optionally, the antenna or display). The first set of connection pads is configured to be electrically connected to a spray-coated sense line or loop on the package or container. The antenna is configured to receive a first wireless signal (e.g., from the reader) and/or transmit or broadcast a second wireless signal (e.g., from the integrated circuit). The display is configured to display an indicator indicating a continuity state of the package or container on which the security device is placed or to which the security device is fixed or adhered. The integrated circuit is configured to determine a continuity state of the package or container and either (i) process the first wireless signal and/or information therefrom and generate the second wireless signal and/or information therefor, or (ii) indicate the continuity state of the package or container using the display. A receiver and/or transmitter may be included in the integrated circuit (e.g., when the security device includes an antenna).

[0101] The present security tags may be made and/or manufactured as described herein, except with a relatively short antenna (e.g., about 2/3 the length of an antenna configured to resonate at a standard RF, HF, UHF, VHF, etc. frequency) electrically connected to pads that may then be connected to the sense line 240 (which effectively contributes the remainder of the antenna). Alternatively, the integrated circuit may include first and second sets of connection pads to which the sensing line and the antenna or display are separately connected.

[0102] In some embodiments, the tag and/or device is a generic wireless security tag with a generic antenna connected thereto and a mechanism for connecting the generic wireless security tag to a continuity sensor on a separate substrate (e.g., the package or container). However, the invention is not so limited. The continuity sensor is one of several possible components that may be made more easily or efficiently on a separate substrate, and to which the tag/device or IC may be connected. Displays, additional sensors, batteries, and switches (e.g., to connect/disconnect the tag and/or device to another component) may be formed on a different substrate or directly on the container or package and connected to the IC in the same way (e.g., using a separate set of connection pads electrically connected to the integrated circuit).

[0103] In fact, the antenna may also be separately connectable to the integrated circuit (generally through a second set of connection pads different from the first set of connection pads). However, in some embodiments, at least one of the separately connectable components is on the same substrate as the integrated circuit (e.g., the antenna, in typical embodiments). The separately connectable component may be electrically connected to the integrated circuit and/or antenna using any of a variety of different mechanisms (e.g., capacitively, inductively, or using any of several different kinds of ohmic connections).

[0104] Thus, in one aspect, the spray-coated sense line(s) are connected to a generic, standard or universal security tag including an integrated circuit (IC) and a second component (generally either [1] an antenna or [2] a battery and an optional display) on one substrate, and a third component on a different substrate is electrically connected to the IC using a different set of connection pads. The generic, standard or universal security tag on the first substrate may include a plurality of sets of connection pads, each connected to a functionally different component on a plurality of different substrates. In this aspect, at least one of the different components is an antenna or battery, and another is a sensor, display, or switch.

[0105] In any case, the present invention provides a fully secure wireless or display- based security solution for any shape of package, container or carton. The solution does not require line of sight, so it does not interfere with any graphics on the package, container or carton. The present security tag/device may assist with use cases such as return fraud, in- store tampering of cartons, and consumer protection. The present security tag/device may also help with consumer engagement (e.g., to ensure that the consumer opens the package, container or carton correctly). Some commercially available devices offering a 2-state solution do not always work if the container or package is not opened as intended by the manufacturer or packager.

[0106] The present invention is also applicable to flexible packaging. Thus, in various embodiments, the antenna and/or the integrated circuit may be on a substrate that comprises paper, a glass/polymer laminate, a paper/polymer laminate, a high temperature polymer, a metal foil or layer, or a combination thereof. When the substrate comprises the high temperature polymer, the high temperature polymer may comprise a polyimide, a polyethersulfone, a polyethylene naphthalate (PEN), or a polyether ether ketone (PEEK).

Alternatively, when the substrate comprises a metal foil, the metal foil may comprise aluminum, stainless steel or copper.

Exemplary Methods of Spray-Coating Sense Line(s). Applying a Security Tag to a Package or Container and Sensing a Continuity State of the Package or Container

[0107] The present invention also concerns one or more methods of spray-coating sensing line(s) to a package or container and applying a security tag or device having a continuity sensor therein to the package or container. The sensing line(s) may cross, or be placed across, one or more interfaces between separable parts of the package or container, and may therefore be configured to sense or determine a continuity state of a package or container on which the security tag or device is placed or to which the security tag or device is fixed or adhered.

[0108] FIG. 9 shows a flow chart for an exemplary method 500 of spray-coating sensing line(s) to a package or container and applying a security tag or device (e.g., an NFC and/or RFID tag) having a continuity sensor therein to a package or container in accordance with one or more embodiments of the present invention. The present method advantageously enables manufacture of a universal or standard integrated circuit with a continuity sensor therein that may be electrically connected to an antenna or other communication mechanism (which may be made in a standardized way) and one or more spray-coated sense lines that may be customized for a package or container in accordance with the dimensions, design and/or materials of the package or container. The method may first comprise spray-coating sensing lines at a spray-coating station onto the package or container, and then subsequently applying a label or other substrate (e.g., including the integrated circuit, the continuity sensor, and optionally, the antenna and/or the display and the battery, on the same or different respective substrates) to the package or container later at a label application station or on a label application line. Alternatively, the label, the IC, the antenna, the display, and/or the battery substrate may be applied first, and then the sensing lines may be subsequently applied later.

[0109] Referring to FIG. 9, at 510, one or more sensing line(s) may be spray-coated on a package or container, or onto a first substrate. The sensing line(s) may cross one or more (and preferably all) of the interfaces between separable or openable parts of the package or container, or be formed across such interfaces from each other (see, e.g., the capacitive sense lines 260a-b shown in FIGS. 3A-C, or the inductive sense lines 270a-b shown in FIGS. 4A-C embodiments). In various embodiments, the separable or openable parts of the package or container include sealable flaps in or on a box, a lid (hinged or unhinged) on a box or tray, a cap on a bottle or jar, a cork in a bottle, a flap on an envelope, a plastic or paper seal over a well in a plastic container or tray, etc. The sensing line(s) may be formed as described herein, and may include extra material deposited or printed on or at the interface, or a connection tab inserted into the interface where the sections of the sensing line meet.

[0110] At 520, if the sensing line(s) are spray-coated on the first substrate, then the method continues at step 530. If the sensing line(s) are spray-coated on the package or container, then the method continues at step 540.

[0111] At 530, the first substrate is attached to the container or package such that the sensing lines cross an interface of the container or package. Alternatively, there may be two or more substrates, each having a sensing line spray-coated thereon, and more than one interface across which the substrates are respectively attached. The method subsequently continues at 540.

[0112] At 540, an integrated circuit on a second substrate that includes a set of connection pads and a continuity sensor electrically connected to the set of connection pads may be affixed, attached, or adhered to the container or package. The sensing line(s) are electrically connected to the integrated circuit via the connection pads on the integrated circuit substrate, as described herein. For example, a conductive adhesive may be applied (e.g., by printing, coating, spraying, etc.) to the connection pads and/or the ends of the sensing line prior to placing the integrated circuit and antenna (or display and battery) on the package or container. The continuity sensor connected to the set of connection pads is configured to determine a continuity state of a container or package to which the second substrate is affixed, attached or adhered.

[0113] At 540, the integrated circuit and an antenna (or a display and a battery) are placed on the package or container, typically in positions that enable formation of an electrical connection between the integrated circuit connection pads and the ends of the sensing line(s). A conductive adhesive may be applied (e.g., by printing, coating, spraying, etc.) to the connection pads and/or to the ends of the sensing line prior to placing the integrated circuit and antenna (or display and battery) on the package or container. Placing the substrate on the package or container may include adhering or wiping the substrate onto the package or container manually, semi-automatically, and/or automatically. Additionally, pressure and/or heat may be applied to the substrate to assist with adhering the substrate to the package or container. Subsequently, the substrate may be further secured to the package or container with shrink wrap or plastic wrap, or if the container is a bottle, a spinner and/or a capsule.

[0114] In various embodiments, the antenna, display and/or battery may be on the same second substrate as the integrated circuit, or on a separate third substrate, and attached to the IC (e.g., by pick-and-place [surface mount] technology and/or processing). If the antenna, the display and/or the battery are on a separate substrate from the IC, they may be connected to the IC using a separate set of pads on the IC (e.g., different from those used to connect the sense line[s] to the IC). In a further option, a set of spray-coated traces on the container or package may connect the connection pads of the antenna, the display and/or the battery to the IC.

[0115] The present invention may also concern a method of determining a continuity state of a package or container. The method includes the method of spray-coating one or more sensing line(s) on first and second separable parts of the package or container and over or across an interface between the first and second separable parts of the package or container, applying an integrated circuit to a package or container, connected the integrated circuit to the sensing line(s), and using the integrated circuit, sensing a continuity state of the package or container. The integrated circuit may be electrically connected to an antenna or to a display and battery. The sensing line(s) are configured to sense or determine a continuity state of a package or container on which the security device is placed or to which the security device is fixed or adhered.

[0116] In further embodiments, a memory in the IC may store a digital value representing a continuity state, and the digital value may be transmitted by the IC using the antenna. In some embodiments, the security device is a wireless security device (e.g., a near field and/or radio frequency security device). In such embodiments, the continuity state of the package or container is sensed by reading the wireless security device with an enabled reader (e.g., an NFC- or RF-enabled smart phone or tablet computer), and the continuity state can be and displayed on the display of the reader. Alternatively, the security device includes a display, and the continuity state of the package or container is sensed by the continuity sensor in the integrated circuit, then displayed on the display.

[0117] In embodiments in which the integrated circuit is configured to process wireless signals to or from a reader (e.g., an RF- or NFC-enabled smart phone or tablet computer), the manufacturer and/or reseller may send a message or other information to the consumer depending on the continuity state of the container. For example, when the continuity state of the container is sealed (or its equivalent), the manufacturer and/or reseller may send product price information and/or information about other products with which the product in the container may be advantageously used. On the other hand, when the continuity state of the container is opened, the manufacturer and/or reseller may send use information for the product, such as instructions for assembly or use, recipes (for food or beverage products), etc.

CONCLUSION

[0118] The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the invention to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the Claims appended hereto and their equivalents.

Claims

CLAIMS What is claimed is:

1. A security device, comprising:

a first substrate having an integrated circuit thereon, the integrated circuit including (i) a continuity sensor configured to determine a continuity state of a container or package to which the first substrate is affixed, attached or adhered, and (ii) a first set of connection pads electrically connected to the continuity sensor; and one or more spray-coated sensing lines on the container, the package, or a second substrate to be affixed, attached or adhered to the container or package, the one or more spray-coated sensing lines being electrically connected to the first set of connection pads.

2. The security device of claim 1 , wherein the sensing line(s) are on the container or the package.

3. The security device of claim 2, wherein the container or the package has an interface, and at least one sensing line crosses the interface of the package or container.

4. The security device of claim 1, wherein the one or more sensing lines comprise a conductive polymer.

5. The security device of claim 4, wherein the conductive polymer comprises a polyaniline, a polypyrrole, a polycarbazole, a polyindole, a polyazepine, a polyfluorene, a polyphenylene, a polypyrene, a polyazulene, a polynaphthalene, a polyacetylene, a poly(p-phenylene vinylene), a polythiophene, or a poly(3,4- ethylenedioxythiophene): polystyrene sulfonate.

6. The security device of claim 1, wherein the one or more sensing lines comprise a metal.

7. The security device of claim 6, wherein the metal comprises aluminum, copper or silver.

8. The security device of claim 1, wherein the one or more sensing lines have a length of from 1 to 100 cm.

9. The security device of claim 8, wherein the one or more sensing lines have a width of from 0.10 mm to 1 cm.

10. The security device of claim 8, wherein the one or more sensing lines have a thickness of from 0.05 mm to 2 mm.

11. The security device of claim 8, wherein the one or more sensing lines comprise one or more capacitive sensing lines.

12. The security device of claim 11, wherein the one or more capacitive sensing lines comprise at least one first capacitor electrode having a first segment that is aligned with and parallel to an interface of the package or container and a second segment that electrically connects the continuity sensor and the first segment.

13. The security device of claim 12, wherein the one or more capacitive sensing lines comprise at least one second capacitor electrode that is aligned with and parallel to the interface and is on an opposite side of the interface from the first capacitor electrode.

14. The security device of claim 13, wherein the at least one first capacitor electrode and the at least one second capacitor electrode form a capacitor when the package or container is closed.

15. The security device of claim 8, wherein the one or more sensing lines comprise a plurality of inductive sense lines.

16. The security device of claim 8, wherein the plurality of inductive sensing lines comprise at least one first inductor connected to the integrated circuit and near an interface of the package or container, and at least one second inductor on an opposite side of the interface of the package or container.

17. The security device of claim 16, wherein each of the at least one first inductor and the at least one second inductor comprise a plurality of concentric circles or loops.

18. The security device of claim 4, wherein the one or more sensing lines are transparent.

19. The security device of claim 1, wherein the integrated circuit includes a memory storing a value representing the continuity state and/or a unique identification number.

20. The security device of claim 19, wherein the memory includes one or more bits configured to store a value corresponding to the continuity state of the container or package.

21. The security device of claim 1, further comprising a first component selected from an antenna and a battery on the first substrate or a third substrate, the antenna being configured to (i) receive a first wireless signal and optionally transmit or broadcast a second wireless signal and (ii) when the battery is absent, enable the integrated circuit to extract power from the first wireless signal, and the battery providing power to the integrated circuit.

22. The security device of claim 21, wherein the first component comprises the antenna.

23. The security device of claim 22, wherein the antenna is on the first substrate.

24. The security device of claim 22, wherein the antenna is on the third substrate.

25. The security device of claim 21, wherein the first component comprises the battery.

26. The security device of claim 25, further comprising a display on the first substrate, the third substrate, or a fourth substrate wherein the display is electrically connected to the battery and the integrated circuit, and the integrated circuit is configured to provide data and/or one or more instructions to the display.

27. The security device of claim 26, wherein the battery and the display are on a common substrate.

28. The security device of claim 1 , wherein the one or more sensing lines are on a second substrate.

29. The security device of claim 28, further comprising an adhesive on the second substrate.

30. The security device of claim 1, further comprising a conductive adhesive on the first set of connection pads.

31. The security device of claim 30, wherein the conductive adhesive is pressure-sensitive or heat-activated.

32. The security device of claim 21, further comprising a second component selected from a switch and a sensor other than a continuity sensor on the first substrate, the second substrate, the third substrate, or a fifth substrate wherein the second component is electrically connected to the integrated circuit.

33. The security device of claim 32, wherein the second component is on a substrate other than the first substrate, and the integrated circuit comprises a second set of connection pads electrically connected to the second component.

34. The security device of claim 1 , comprising a near field communication (NFC), radio frequency (RF), and/or radio frequency identification (RFID) device.

35. The security device of claim 1, wherein the integrated circuit comprises one or more printed layers.

36. The security device of claim 35, wherein the integrated circuit further comprises one or more thin films.

37. The security device of claim 35, wherein the integrated circuit comprises a plurality of printed layers.

38. The security device of claim 1 , wherein the first substrate comprises a plastic or a metal foil.

39. The security device of claim 38, wherein the first substrate is flexible and configured to withstand a processing temperature of at least 200 °C.

40. A method of manufacturing a security device, comprising:

spray-coating one or more sensing lines on a container, a package or a substrate; and

electrically connecting a first set of connection pads in an integrated circuit (IC) on another substrate to the sensing line(s), the IC further including a continuity sensor electrically connected to the first set of connection pads, and the continuity sensor being configured to determine a continuity state of a container or package to which the other substrate is affixed, attached or adhered.

41. The method of claim 40, wherein electrically connecting the first set of connection pads to the sensing line(s) comprises affixing, attaching or adhering the first substrate to the container, the package or the second substrate such that the first set of connection pads contact ends of the sensing line(s).

42. The method of claim 41 , wherein the container or the package has an interface, and at least one of the sensing line(s) intersects the interface of the package or container.

43. The method of claim 40, wherein the one or more sensing lines comprise a conductive polymer.

44. The method of claim 43, wherein the conductive polymer comprises a polyaniline, a polypyrrole, a polycarbazole, a polyindole, a polyazepine, a polyfluorene, a polyphenylene, a polypyrene, a polyazulene, a polynapthalene, a polyacetylene, a poly(p-phenylene vinylene), a polythiophene, or a poly(3,4- ethylenedioxythiophene): polystyrene sulfonate.

45. The method of claim 44, wherein spray-coating comprises spraying a powder comprising the conductive polymer onto the container, the package, or the substrate.

46. The method of claim 40, wherein the one or more sensing lines comprise a metal.

47. The method of claim 46, wherein the metal comprises aluminum, copper or silver.

48. The method of claim 47, wherein spray-coating comprises spraying a powder comprising the metal onto the container, the package, or the substrate.

49. The method of claim 48, wherein spraying the powder comprises forcing a pressurized gas and the powder out of a nozzle onto the package, the container or the substrate.

50. The method of claim 49, further comprising placing a stencil between the nozzle and the package, the container or the substrate, and the powder is spray-coated through the stencil.

51. The method of claim 40, wherein the integrated circuit includes a memory storing a value representing the continuity state.

52. The method of claim 51, wherein the memory includes a plurality of bits configured to store a unique identification number.

53. The method of claim 42, wherein at least one layer of the memory is printed.

54. The method of claim 40, further comprising connecting a first component selected from an antenna and a battery to the IC, the antenna being configured to (i) receive a first wireless signal and optionally transmit or broadcast a second wireless signal and (ii) when the battery is absent, enable the integrated circuit to extract power from the first wireless signal, the battery providing power to the integrated circuit.

55. The method of claim 54, wherein the first component comprises the antenna.

56. The method of claim 55, wherein the antenna on the other substrate.

57. The method of claim 54, wherein the first component comprises the battery.

58. The method of claim 57, further comprising electrically connecting a display to the battery and the integrated circuit, wherein the integrated circuit is configured to provide data and/or one or more instructions to the display.

59. The method of claim 58, comprising forming the battery and the display on a common substrate.

60. The method of claim 39, further comprising depositing an adhesive on the other substrate.

61. The method of claim 40, further comprising depositing a conductive adhesive on the first set of connection pads.

62. The method of claim 61, wherein the conductive adhesive is pressure-sensitive or heat-activated.

63. The method of claim 54, further comprising electrically connecting a second component selected from a switch and a sensor other than a continuity sensor to the integrated circuit.

64. The method of claim 63, wherein the second component is on a substrate other than the other substrate, and the integrated circuit comprises a second set of connection pads electrically connected to the second component.

65. The method of claim 40, wherein the device is a near field communication (NFC), radio frequency (RF), and/or radio frequency identification (RFID) device.

66. The method of claim 40, wherein the integrated circuit comprises one or more thin films.

67. The method of claim 40, wherein the integrated circuit comprises a plurality of printed layers.

68. The method of claim 40, wherein the other substrate comprises a plastic or a metal foil.

69. The method of claim 68, wherein the other substrate is flexible and configured to withstand a processing temperature of at least 200 °C.

70. The method of claim 40, further comprising sensing the continuity state of the package or container with the continuity sensor, and communicating the continuity state with an antenna or display.