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WO2019005530A2 - Appareil de traitement laser, procédés d'utilisation et agencements associés - Google Patents

Appareil de traitement laser, procédés d'utilisation et agencements associés Download PDF

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Publication number
WO2019005530A2
WO2019005530A2 PCT/US2018/038190 US2018038190W WO2019005530A2 WO 2019005530 A2 WO2019005530 A2 WO 2019005530A2 US 2018038190 W US2018038190 W US 2018038190W WO 2019005530 A2 WO2019005530 A2 WO 2019005530A2
Authority
WO
WIPO (PCT)
Prior art keywords
mirror
laser
workpiece
laser processing
processing system
Prior art date
Application number
PCT/US2018/038190
Other languages
English (en)
Other versions
WO2019005530A3 (fr
Inventor
Fumiyo Yoshino
Brady Nilsen
Robert Ferguson
David Lord
Wayne BUTTERFIELD
Original Assignee
Electro Scientific Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries, Inc. filed Critical Electro Scientific Industries, Inc.
Publication of WO2019005530A2 publication Critical patent/WO2019005530A2/fr
Publication of WO2019005530A3 publication Critical patent/WO2019005530A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece

Definitions

  • a lens to focus the laser beam to a small spot at the work surface of a workpiece to be processed (e.g., a semiconductor wafer, a printed circuit board, etc.).
  • the focal length of a focusing lens e.g., a microscope objective
  • the lens focal length might be many tens or hundreds of millimeters.
  • FIG. 1 schematically illustrates an apparatus for processing a workpiece, according to one embodiment.
  • FIG. 1 schematically illustrates laser processing system, in accordance with one embodiment of the present invention, which is configured to process a workpiece.
  • the processing is accomplished, either in whole or in part, by irradiating the workpiece with laser radiation, to heat, melt, evaporate, ablate, crack, discolor, polish, roughen, carbonize, foam, or otherwise modify one or more properties or characteristics (e.g., chemical composition, crystal structure, electronic structure, microstructure, nanostructure, density, viscosity, index of refraction, magnetic permeability, relative permittivity, etc.) of one or more materials from which the workpiece is formed.
  • properties or characteristics e.g., chemical composition, crystal structure, electronic structure, microstructure, nanostructure, density, viscosity, index of refraction, magnetic permeability, relative permittivity, etc.
  • Laser pulses are typically delivered so as to be incident upon a region of the workpiece surface 101a that is to be processed.
  • the region that is irradiated by a delivered laser pulse is herein referred to as a "process spot,” “spot location” or, more simply, a “spot”, and encompasses a region where the beam axis traverses the workpiece 101.
  • the system 100 includes one or more turn mirrors arranged in the beam path 116 (e.g., between the laser source 102 and the beam positioner 104).
  • Any turn mirror can be provided as a fixed turn mirror or an adjustable turn mirror.
  • the orientation of a fixed turn mirror generally remains fixed (or at least substantially fixed) once mounted within the system 100.
  • the orientation of an adjustable turn mirror can be adjusted (e.g., so as to tip or tilt the mirror about one or more axes) by means of manually- adjustable screws, piezoelectric actuators, or the like or any combination thereof.
  • a turn mirror includes, as components thereof, a mirror for reflecting the laser pulses (i.e., redirecting the beam path 116), and a mirror mount for coupling the mirror to the system 100.
  • the controller 112 includes one or more processors configured to generate the control signals upon executing instructions.
  • a processor can be provided as a programmable processor (e.g., including one or more general purpose computer processors, microprocessors, digital signal processors, or the like or any combination thereof) configured to execute the instructions. Instructions executable by the processor(s) may be implemented software, firmware, etc., or in any suitable form of circuitry including programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), field-programmable object arrays (FPOAs), application-specific integrated circuits (ASICs) - including digital, analog and mixed PLDs, programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), field-programmable object arrays (FPOAs), application-specific integrated circuits (ASICs) - including digital, analog and mixed PLDs, programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), field-programmable object arrays (FPOAs), application-
  • one or more additional controllers may, optionally, be communicatively coupled to an input of a driver communicatively coupled to a components (and thus associated with the component) such as the laser source 102, the beam positioner 104, the workpiece positioner 108, the lens actuator, etc.
  • each component- specific controller can be communicatively coupled and the controller 112 and be operative to generate, in response to one or more control signals received from the controller 112, one or more control signals (e.g., trigger signals, etc.), which can then be transmitted to the input(s) of the driver(s) to which it is communicatively coupled.
  • a component-specific controller may be configured as similarly described with respect to the controller 112.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)

Abstract

Un système de traitement laser selon l'invention peut comprendre une source laser configurée pour générer un faisceau d'impulsions laser à une puissance moyenne supérieure à 10 W et un miroir rotatif disposé dans un trajet du faisceau. Le miroir rotatif peut comprendre un miroir conçu pour réfléchir une première partie de la lumière à l'intérieur des impulsions laser et pour transmettre une seconde partie de la lumière à l'intérieur des impulsions laser, et un support de miroir accouplé au miroir. Le support de miroir est conçu de façon à ne pas être présent derrière le miroir à un emplacement où le miroir est exposé aux impulsions laser.
PCT/US2018/038190 2017-06-26 2018-06-19 Appareil de traitement laser, procédés d'utilisation et agencements associés WO2019005530A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762524863P 2017-06-26 2017-06-26
US62/524,863 2017-06-26

Publications (2)

Publication Number Publication Date
WO2019005530A2 true WO2019005530A2 (fr) 2019-01-03
WO2019005530A3 WO2019005530A3 (fr) 2019-02-21

Family

ID=64741817

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2018/038190 WO2019005530A2 (fr) 2017-06-26 2018-06-19 Appareil de traitement laser, procédés d'utilisation et agencements associés

Country Status (2)

Country Link
TW (1) TW201904700A (fr)
WO (1) WO2019005530A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110434471A (zh) * 2019-08-21 2019-11-12 南京魔迪多维数码科技有限公司 集成三种激光加工工艺的实验装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6951995B2 (en) * 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
JP2004228456A (ja) * 2003-01-27 2004-08-12 Canon Inc 露光装置
JP5093267B2 (ja) * 2010-03-11 2012-12-12 ウシオ電機株式会社 集光鏡アッセンブリおよびこの集光鏡アッセンブリを用いた極端紫外光光源装置
WO2015112775A1 (fr) * 2014-01-22 2015-07-30 Swift Control Systems, Inc. Dispositif monture de miroir intelligent
JP6307322B2 (ja) * 2014-03-27 2018-04-04 株式会社荏原製作所 反射鏡の姿勢調整構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110434471A (zh) * 2019-08-21 2019-11-12 南京魔迪多维数码科技有限公司 集成三种激光加工工艺的实验装置

Also Published As

Publication number Publication date
WO2019005530A3 (fr) 2019-02-21
TW201904700A (zh) 2019-02-01

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