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WO2019041365A1 - Embout semi intra-auriculaire, écouteur et leur procédé de fabrication - Google Patents

Embout semi intra-auriculaire, écouteur et leur procédé de fabrication Download PDF

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Publication number
WO2019041365A1
WO2019041365A1 PCT/CN2017/100507 CN2017100507W WO2019041365A1 WO 2019041365 A1 WO2019041365 A1 WO 2019041365A1 CN 2017100507 W CN2017100507 W CN 2017100507W WO 2019041365 A1 WO2019041365 A1 WO 2019041365A1
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WO
WIPO (PCT)
Prior art keywords
ear
semi
ventilation
hole
ear tip
Prior art date
Application number
PCT/CN2017/100507
Other languages
English (en)
Inventor
Skovgaard FREDERIK
Original Assignee
Goertek. Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek. Inc filed Critical Goertek. Inc
Publication of WO2019041365A1 publication Critical patent/WO2019041365A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/65—Housing parts, e.g. shells, tips or moulds, or their manufacture
    • H04R25/652—Ear tips; Ear moulds
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/003—Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/11—Aspects relating to vents, e.g. shape, orientation, acoustic properties in ear tips of hearing devices to prevent occlusion

Definitions

  • the present invention relates to the technical field of earphones, and more specifically, to a semi in-ear tip for an earphone, an earphone and a method for manufacturing a semi in-ear tip.
  • Semi in-ear earphone or in-ear earphone generally has a semi in-ear tip.
  • the semi in-ear tip consists, for example, of a part touching ear canal and concha and another one interfacing only with external air domain.
  • the two function areas can be housed in either one or multiple bodies/mechanical parts.
  • the one part includes a front end and a stem of the tip and the another part includes a rear end of the tip.
  • a semi in-ear earphone relies on the coupling between exterior surfaces of the tip and the ear canal as well as the concha to both stay in place and deliver the sound effectively.
  • the exterior surface of the tip is in a close contact with the soft tissue (skin) in the concha and/or the ear canal, and a buildup of heat and moisture will occur, which will make a user uncomfortable.
  • One object of this invention is to provide a new technical solution for a semi in-ear tip.
  • a semi in-ear tip for an earphone including: a first part to be placed in at least one of a concha and an ear canal; and a second part to be placed towards outside of an ear, wherein an exterior surface of the first part is perforated to have at least one first ventilation hole and an exterior surface of the second part is perforated to have at least one second ventilation hole, and wherein the first ventilation hole is connected to the outside of the ear via the second ventilation hole.
  • the first ventilation hole is formed on an exterior surface of the first part, which is to be placed in contact with a surface of the at least one of the concha and the ear canal.
  • the first part further includes at least one sound hole which is connected to a transducer of the semi in-ear tip, and the sound hole is not in communication with the first ventilation hole.
  • a ventilation path between the first and second ventilation holes is sealed from a front volume of the transducer.
  • a ventilation path between the first and second ventilation holes is sealed from a rear volume of the transducer.
  • At least one of the first and second ventilation holes is covered with a mesh.
  • a shape of at least one of the first and second ventilation holes includes at least one of regular hexagon, round hole, slit and triangle.
  • the exterior surfaces of the first and second parts are made of soft or hard material.
  • a portion of the first part which is in contact with the ear canal is solid to seal a sound path from a transducer to the ear canal.
  • an earphone including at least one semi in-ear tip according to the above embodiments.
  • a method for manufacturing a semi in-ear tip comprising: forming a first part to be placed in at least one of a concha and an ear canal; forming a second part to be placed towards outside of an ear, perforating an exterior surface of the first part to have at least one first ventilation hole; and perforating an exterior surface of the second part to have at least one second ventilation hole; wherein the first ventilation hole is connected to the outside of the ear via the second ventilation hole.
  • the first ventilation hole is formed on an exterior surface of the first part, which is to be placed in contact with a surface of the at least one of the concha and the ear canal.
  • the method further comprises: forming at least one sound hole in the first part; and placing a transducer inside the semi in-ear tip, wherein the sound hole is connected to the transducer and is not in communication with the first ventilation hole.
  • Fig. 1 shows a schematic front view of a semi in-ear tip according to an embodiment of this disclosure.
  • Fig. 2 shows a schematic cross-section view of the semi in-ear tip along line A-A’ in Fig. 1.
  • Fig. 3 shows a schematic perspective view of the semi in-ear tip according to an embodiment of this disclosure.
  • Fig. 4 shows a schematic 3D view of a semi in-ear tip according to an embodiment of this disclosure.
  • Fig. 5 schematically shows a semi in-ear tip in an ear.
  • Fig. 6 shows a flow chart of a method for manufacturing a semi in-ear tip according to another embodiment of this disclosure.
  • FIG. 1 shows a schematic front view of a semi in-ear tip according to an embodiment of this disclosure.
  • Fig. 2 shows a schematic cross-section view of the semi in-ear tip along line A-A’ in Fig. 1.
  • the semi in-ear tip 100 includes a first part 110 to be placed in at least one of a concha and an ear canal; and a second part 120 to be placed towards outside of an ear.
  • the first part 110 is a part to be inside an ear and the second part 120 is a part to be outside the ear.
  • the first part 110 can be placed just in the concha.
  • the first part 110 can be placed in both the concha and the ear canal.
  • An exterior surface of the first part 110 is perforated to have at least one first ventilation hole 101.
  • Fig. 1 shows a plurality of first ventilation holes 101.
  • An exterior surface of the second part 120 is perforated to have at least one second ventilation hole 102.
  • Fig. 1 shows a plurality of second ventilation holes 102.
  • the first ventilation hole 101 is connected to the outside of the ear via the second ventilation hole 102.
  • Fig. 2 shows a ventilation path 105 from a first ventilation hole 101 to a second ventilation hole 102.
  • there are gaps between the exterior surface and the interior components such as a front volume 106 of a transducer shown in Fig. 2. These gaps are communicated and are connected to the first and second ventilation holes 101, 102. These gaps can form the ventilation path 105.
  • a semi in-ear tip will block the concha with its exterior surfaces. Since the surfaces of the semi in-ear tip match that of the concha and/or the ear canal, there is no room for air transport. A buildup of heat and moisture will occur, which makes a user feel uncomfortable.
  • Fig. 3 shows a schematic perspective view of the semi in-ear tip according to an embodiment of this disclosure.
  • the semi in-ear tip 100 is placed in an ear 200.
  • Fig. 4 shows a schematic 3D view of a semi in-ear tip according to an embodiment of this disclosure.
  • Fig. 5 schematically shows a semi in-ear tip in an ear.
  • the semi in-ear tip 100 includes the first part 110 and the second part 120.
  • the first part 110 has a plurality of first ventilation holes 101 and the second part 120 has a plurality of second ventilation holes 102.
  • the first and second ventilation holes 101, 102 can be perforated in a same manufacturing process. They can be discriminated from each other just based on their positions. For example, the holes placed on an exterior surface to be in contact with tissue of an ear is deemed as the first ventilation holes. As shown in Fig. 5 the first ventilation hole 101 is formed on an exterior surface of the first part 110, which is to be placed in contact with a surface of the at least one of the concha and the ear canal.
  • the holes placed on an exterior surface to point to free air outside of the ear is deemed as the second ventilation holes.
  • the second ventilation can be an opening of the rear end of the tip.
  • the second ventilation holes 102 are not blocked and point into free air.
  • the first part 110 further includes at least one sound hole 103. In the figures, only one sound hole 103 is shown.
  • the sound hole 103 is different from the ventilation holes.
  • the first and second ventilation holes 101, 102 are not connected to a transducer.
  • the first and second ventilation holes 101, 102 function to provide a ventilation path between the surface of the ear and the outside air. This path is blocked in conventional tip designs.
  • the sound hole 103 is connected to a transducer (not shown) of the semi in-ear tip. It is used for the sound path from the transducer to the ear canal. As shown in Fig. 2, the sound hole 103 is not in communication with the first ventilation hole 101. That is, the sound hole 103 is sealed from the ventilation hole 101 or the ventilation path 105.
  • Fig. 2 shows a front volume 106 of a transducer. As shown in Fig. 2, the ventilation path 105 between the first and second ventilation holes 101, 102 is sealed from the front volume 106.
  • the ventilation path 105 between the first and second ventilation holes 101, 102 can also be sealed from a rear volume (not shown) of the transducer.
  • the first and second ventilation holes are not connected to the front or rear volume, it cannot be considered as a front leak or rear vent. So, the performance of the earphone will not be influenced by the perforated holes.
  • At least one of the first and second ventilation holes 101, 102 is covered with a mesh. This will give a certain aesthetic to the earphone and make the earphone more attractive to a user.
  • the mesh can provide a dust-proof function to the semi in-ear tip.
  • the mesh can be made of a moisture absorbing material. In this regard, it may further improve the experience of using a earphone with such a semi in-ear tip.
  • the shape of the first and second ventilation holes is regular hexagon, which can form a honeycomb. It is appreciated by a person skilled in the art, that the honeycomb is just an example and will not limit this invention.
  • the layout of the first and second ventilation holes is not limited to the honeycomb.
  • the first and second ventilation holes can also be round hole, slit or triangle.
  • the number, the design and/or the size of the first and second ventilation holes are arbitrary. Holes could be covered with a mesh to get a certain aesthetic, be it either hard or soft.
  • the first and second ventilation holes 101, 102 can be formed in a single process and can be formed through the same processing.
  • the holes will be in contact with the tissues of the concha or the ear canal when it is worn by a user and will be the first ventilation holes 101, and the others of the holes will be exposed to the outside free air when it is worn by a user will be the second ventilation holes 102.
  • the invention As long as there is at east one hole in contact with the tissue of a ear and at least one hole exposed to the outside free air when the tip is worn by a user, they will be covered by the invention as claimed here.
  • the exterior surfaces of the first and second parts can be made of soft or hard material.
  • a topology-optimized design could enable a more locally compliant ear tip that will conform better to various concha and ear canal geometries.
  • a portion 104 of the first part 110 which is in contact with the ear canal is solid to seal a sound path from a transducer to the ear canal.
  • the portion 104 is around the sound hole 103.
  • solid means that there is no perforated holes therein. Seal can still be established as that of the prior art because the portion 104 of the semi in-ear tip 100 in contact with the ear canal is solid.
  • a semi in-ear tip 100 according to the embodiment is described with reference to Figs 1-5 above.
  • the tip 100 can be a part of an earphone.
  • an earphone is provided, which include at least one semi in-ear tip as described above.
  • Fig. 6 shows a flow chart of a method for manufacturing a semi in-ear tip according to another embodiment of this disclosure.
  • a first part is formed to be placed in at least one of a concha and an ear canal.
  • a second part is formed to be placed towards outside of an ear.
  • an exterior surface of the first part is perforated to have at least one first ventilation hole.
  • an exterior surface of the second part is perforated to have at least one second ventilation hole.
  • steps S1100 and S1200 can be performed in a single step, and the steps S1300 and S14200 can be performed in a single step.
  • the finished semi in-ear tip can be that shown in Figs. 1-5.
  • the first ventilation hole is connected to the outside of the ear via the second ventilation hole.
  • the first ventilation hole is formed on an exterior surface of the first part, which is to be placed in contact with a surface of the at least one of the concha and the ear canal.
  • the manufacturing method may further comprise: forming at least one sound hole in the first part; and placing a transducer inside the semi in-ear tip.
  • the sound hole will be connected to the transducer and is not in communication with the first ventilation hole.
  • the technician can set the sequence of manufacture step as demanded and the sequence is not what the embodiments concern. So, the sequence will not be a limitation to this application.
  • a ventilation path between the first and second ventilation holes is sealed from a front volume of the transducer.
  • a ventilation path between the first and second ventilation holes is sealed from a rear volume of the transducer.
  • the method may further comprise covering at least one of the first and second ventilation holes with a mesh.
  • a shape of at least one of the first and second ventilation holes includes at least one of regular hexagon, round hole, slit and triangle.
  • the exterior surfaces of the first and second parts are made of soft or hard material.
  • a portion of the first part which is in contact with the ear canal can be made to be solid to seal a sound path from a transducer to the ear canal.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Headphones And Earphones (AREA)

Abstract

L'invention concerne un embout semi intra-auriculaire (100) pour un écouteur, un écouteur et un procédé de fabrication d'un embout semi intra-auriculaire (100). L'embout semi intra-auriculaire (100) comprend : une première partie destinée à être placée dans au moins l'une d'une conque et d'un conduit auditif; et une seconde partie destinée à être placée vers l'extérieur d'une oreille, une surface extérieure de la première partie (110) étant perforée pour avoir au moins un premier trou de ventilation (101) et une surface extérieure de la seconde partie (120) étant perforée pour avoir au moins un second trou de ventilation (102), et le premier trou de ventilation (101) étant relié à l'extérieur de l'oreille par l'intermédiaire du second trou de ventilation (102).
PCT/CN2017/100507 2017-08-28 2017-09-05 Embout semi intra-auriculaire, écouteur et leur procédé de fabrication WO2019041365A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710751685.7 2017-08-28
CN201710751685.7A CN107484100B (zh) 2017-08-28 2017-08-28 半入耳式耳塞、耳机及其制造方法

Publications (1)

Publication Number Publication Date
WO2019041365A1 true WO2019041365A1 (fr) 2019-03-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/100507 WO2019041365A1 (fr) 2017-08-28 2017-09-05 Embout semi intra-auriculaire, écouteur et leur procédé de fabrication

Country Status (2)

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CN (1) CN107484100B (fr)
WO (1) WO2019041365A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113709620B (zh) * 2021-08-31 2024-04-12 维沃移动通信有限公司 耳机控制方法及耳机

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101106831A (zh) * 2006-07-14 2008-01-16 三星电子株式会社 放在耳内的耳机
CN201315663Y (zh) * 2008-11-28 2009-09-23 陈奚平 耳塞机
US20120097475A1 (en) * 2011-12-29 2012-04-26 Schumaier Daniel R Hearing aid tip having multiple sound ports
CN206077646U (zh) * 2016-10-09 2017-04-05 珠海声浪科技有限公司 入耳式耳机
CN207200925U (zh) * 2017-08-28 2018-04-06 歌尔股份有限公司 半入耳式耳塞及耳机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102917292A (zh) * 2012-10-14 2013-02-06 南通芯迎设计服务有限公司 无尾部入耳式耳机
DE102013203334B3 (de) * 2013-02-28 2014-05-22 Siemens Medical Instruments Pte. Ltd. Ventilvorrichtung, Hörgerät und Verfahren
CN203181176U (zh) * 2013-03-27 2013-09-04 陈菊香 一种压力平衡耳机
KR20150018340A (ko) * 2013-12-10 2015-02-23 윤영은 외부 음향의 유입이 가능한 이어팁
US9301040B2 (en) * 2014-03-14 2016-03-29 Bose Corporation Pressure equalization in earphones
CN206364987U (zh) * 2017-01-04 2017-07-28 江西天键电声有限公司 改善佩戴舒适度的耳机

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101106831A (zh) * 2006-07-14 2008-01-16 三星电子株式会社 放在耳内的耳机
CN201315663Y (zh) * 2008-11-28 2009-09-23 陈奚平 耳塞机
US20120097475A1 (en) * 2011-12-29 2012-04-26 Schumaier Daniel R Hearing aid tip having multiple sound ports
CN206077646U (zh) * 2016-10-09 2017-04-05 珠海声浪科技有限公司 入耳式耳机
CN207200925U (zh) * 2017-08-28 2018-04-06 歌尔股份有限公司 半入耳式耳塞及耳机

Also Published As

Publication number Publication date
CN107484100A (zh) 2017-12-15
CN107484100B (zh) 2023-11-28

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