+

WO2018139048A1 - Interposeur et machine électronique - Google Patents

Interposeur et machine électronique Download PDF

Info

Publication number
WO2018139048A1
WO2018139048A1 PCT/JP2017/043085 JP2017043085W WO2018139048A1 WO 2018139048 A1 WO2018139048 A1 WO 2018139048A1 JP 2017043085 W JP2017043085 W JP 2017043085W WO 2018139048 A1 WO2018139048 A1 WO 2018139048A1
Authority
WO
WIPO (PCT)
Prior art keywords
interposer
element body
circuit board
terminal electrode
connection terminal
Prior art date
Application number
PCT/JP2017/043085
Other languages
English (en)
Japanese (ja)
Inventor
浩和 矢▲崎▼
啓人 米森
貴紀 土屋
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018139048A1 publication Critical patent/WO2018139048A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to an interposer provided with an insulating element body, and more specifically, a wiring member such as a flat cable, a substrate, an electronic component, and the like can be obliquely connected to the bottom surface of the element body.
  • a wiring member such as a flat cable, a substrate, an electronic component, and the like can be obliquely connected to the bottom surface of the element body.
  • the present invention also relates to an electronic device using the interposer of the present invention, and more specifically, a wiring member such as a flat cable connected to the interposer is not bent in the middle or is bent even if it is bent.
  • the present invention relates to an electronic device having a small size (bending amount).
  • a flat cable may be used to connect a circuit board and a circuit board that are arranged apart from each other.
  • FIG. 17A is a side cross-sectional view of the electronic device 1500.
  • FIG. 17B is a cross-sectional plan view of the electronic device 1500.
  • circuit boards 102 and 103 and a battery pack 104 are accommodated in a housing (equipment housing) 101.
  • Electronic components (IC chip, mounting component) 105 are mounted on the circuit boards 102 and 103, respectively.
  • the circuit board 102 and the circuit board 103 are connected by a flat and long flat cable 106.
  • the flat cable 106 has a certain degree of flexibility.
  • the flat cable 106 is formed in multiple layers, and has a structure in which a signal conductor and a ground conductor wider than the signal conductor are vertically stacked with an insulating layer interposed therebetween.
  • the signal conductor and the ground conductor are each made of, for example, copper (copper foil).
  • a coaxial connector 107 is connected to each end of the flat cable 106.
  • One coaxial connector 107 is connected to a coaxial connector 108 provided on the circuit board 102, and the other coaxial connector 107 is connected to a coaxial connector 108 provided on the circuit board 103.
  • the flat cable 106 is largely bent at four positions (P1 to P4) shown in FIG. 17A, and the circuit board 102 and the circuit board 103 are connected to each other through a gap between the battery pack 104 and the housing 101. Connected. Note that reference symbols P1 to P4 in FIG. 17A are supplemented by the applicant for the purpose of explanation.
  • the impedance of the signal conductor is deviated from the original design value, which may increase the insertion loss. That is, the impedance of the signal conductor is affected by the size of the capacitance formed between the signal conductor and the ground conductor, but is formed between the signal conductor and the ground conductor by bending the flat cable 106 greatly. The magnitude of the capacitance to be changed may change, and the impedance of the signal conductor may deviate from the original design value. And there was a possibility that insertion loss might become large because the impedance of a signal conductor shifted.
  • the flat cable 106 and the circuit boards 102 and 103 are connected by the coaxial connectors 107 and 108.
  • the coaxial connectors 107 and 108 are made of a metal plate such as phosphor bronze mechanically, for example. This was a mechanical structure manufactured by processing, and had a large dimension in the height direction and a dimension in the plane direction. For this reason, the electronic device 1500 requires a space for arranging the coaxial connectors 107 and 108 on the circuit boards 102 and 103, and there is a problem that the electronic device 1500 is increased in size.
  • the interposer of the present invention is provided on an insulator body and a bottom surface of the element body, with a conductive bonding material interposed therebetween.
  • the circuit board terminal electrode connected to the circuit board, the connection terminal electrode provided on the upper surface side of the element body and connected to the outside via the conductive bonding material, and the circuit board terminal electrode
  • a wiring electrode that connects the terminal electrode for the substrate and the connecting terminal electrode, and an upper surface of the element body is provided with an inclined surface that is a plane disposed obliquely with respect to the bottom surface. Is provided on the inclined surface.
  • a wiring member such as a flat cable, a substrate, an electronic component, or the like can be connected to the connection terminal electrode.
  • a wiring member it is not restricted to a flat cable, A general lead wire etc. may be sufficient.
  • the element body is preferably a laminated element body in which insulator layers are laminated.
  • a via conductor is formed by passing between both main surfaces of the insulator layer, a line conductor is formed between the layers of the insulator layer, and a wiring electrode is laminated using the via conductor and the line conductor. It can be easily formed inside the element body.
  • the element body is preferably a ceramic. In this case, an interposer with excellent heat resistance can be produced.
  • a metal shield be formed on the outer surface of the element body.
  • the metal shield can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside.
  • the element body has one or more side surfaces in addition to the bottom surface and the inclined surface, and the metal shield is formed on the entire side surface or a part of the side surface.
  • the element body preferably includes a top surface and one or more side surfaces, and the metal shield is preferably formed on the entire surface or a part of the top surface and the side surfaces.
  • the metal shield is formed so as to go around the outer periphery of the side surface of the element body. In these cases, noise emission and penetration can be effectively suppressed.
  • the case where there is one side corresponds to, for example, the case where the element body is cylindrical.
  • the element body is made of a magnetic material.
  • the interposer can have a function of a so-called magnetic bead inductor (a ferrite bead inductor when the magnetic material is ferrite) that suppresses the passage of noise.
  • the element body may be made of a laminated element body in which a plurality of insulator layers are laminated, and a part of the insulator layer may be made of a magnetic substance. That is, even if the entire element body is not a magnetic body, the element body is a laminated element body in which a plurality of insulator layers are stacked, and even if a part of the insulator layer is a magnetic body, a magnetic bead inductor ( When the magnetic material is ferrite, the function of a ferrite bead inductor) can be provided.
  • the electronic device can be manufactured by mounting the interposer of the present invention on a circuit board and connecting a wiring member such as a flat cable to the connection terminal electrode of the interposer. More specifically, for example, a first interposer, a second interposer, a first circuit board on which the first interposer is mounted, and a second circuit board on which the second interposer is mounted are provided.
  • a wiring member such as a flat cable
  • the connection terminal electrode of the first interposer and the connection terminal electrode of the second interposer can be connected to manufacture an electronic device. In this case, it is possible to eliminate bending in the middle of the flat cable or the like, or to reduce the amount of bending (bending amount) in the middle of the flat cable or the like.
  • the height at which the first interposer is arranged may be equal to the height at which the second interposer is arranged.
  • the height at which the first interposer is arranged may be different from the height at which the second interposer is arranged.
  • each of a first circuit board and a second circuit board includes an upper main surface and a lower main surface, the first interposer is mounted on the upper main surface of the first circuit board, and the second A second interposer may be mounted on the lower main surface of the circuit board.
  • the wiring member is preferably a flat cable. In this case, the connection of the wiring member to the connection terminal is facilitated.
  • the interposer has at least one side surface, a metal shield is formed on the side surface, an electronic component is mounted on the circuit board adjacent to the side surface on which the metal shield of the interposer is formed, and the metal shield is formed on the bottom surface It is also preferable that the side surface is covered up to a position higher than the height of the electronic component. In this case, it is possible to effectively suppress the noise radiated by the interposer from entering and affecting adjacent electronic components and the noise radiated by the adjacent electronic components from entering and affecting the interposer. can do.
  • the interposer includes at least one side surface, a metal shield is formed on the side surface, and the metal shield is formed so as to go around the outer periphery of the side surface of the element body. Also in this case, it is possible to effectively suppress noise emission from the interposer and noise intrusion into the interposer.
  • the interposer of the present invention is provided with an inclined surface, which is a plane arranged obliquely with respect to the bottom surface, on the upper side surface of the element body, and the connection terminal electrode is provided on the inclined surface. Wiring members, substrates, electronic components, and the like can be connected obliquely to the bottom surface. Therefore, if the interposer of the present invention is used, for example, it is possible to eliminate bending in the middle of a flat cable or the like, or to reduce the amount of bending (bending amount) in the middle of a flat cable or the like.
  • the electronic device of the present invention uses the interposer of the present invention, there is no bending in the middle of a wiring member such as a flat cable, or the size of folding in the middle of a wiring member such as a flat cable (bending) The amount is small.
  • FIG. 1 is a perspective view showing an interposer 100 according to Embodiment 1.
  • FIG. 1 is a cross-sectional view showing an interposer 100.
  • FIG. 1 is a cross-sectional view illustrating an electronic device 200 according to a first embodiment.
  • 2 is a cross-sectional view of a main part showing an electronic device 200.
  • FIG. It is sectional drawing which shows the interposer 300 concerning Embodiment 2.
  • FIG. FIG. 9 is a cross-sectional view showing an electronic apparatus 600 according to a fifth embodiment.
  • FIG. 10 is a cross-sectional view illustrating an electronic apparatus 700 according to a sixth embodiment.
  • FIG. 10A is a perspective view of an interposer 800 according to the seventh embodiment.
  • FIG. 10B is a plan view of the interposer 800.
  • FIG. 11A is a perspective view of an interposer 900 according to the eighth embodiment.
  • FIG. 11B is a plan view of the interposer 900.
  • 10 is a perspective view of an interposer 1000 according to Embodiment 9.
  • FIG. It is a front view of the electronic device 1100 concerning Embodiment 10.
  • FIG. It is sectional drawing of the interposer 1200 concerning Embodiment 11.
  • FIG. It is sectional drawing of the interposer 1300 concerning Embodiment 12.
  • FIG. FIG. 16A is a perspective view of an interposer 1400 according to the thirteenth embodiment.
  • FIG. 16B is an exploded perspective view of the interposer 1400.
  • FIG. 17A is a side cross-sectional view of the electronic device 1500 disclosed in Patent Document 1.
  • FIG. 17B is a cross-sectional
  • each embodiment shows an embodiment of the present invention by way of example, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping understanding of the embodiment, and may not be drawn strictly. For example, a drawn component or a dimensional ratio between the components may not match the dimensional ratio described in the specification. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.
  • FIG. 1 and 2 show an interposer 100 according to the first embodiment.
  • 3 and 4 show an electronic apparatus 200 according to the first embodiment manufactured using the interposer 100.
  • FIG. 1 is a perspective view of the interposer 100
  • FIG. 2 is a cross-sectional view of the interposer 100
  • 3 is a cross-sectional view of the electronic device 200
  • FIG. 1 is a perspective view of the interposer 100
  • FIG. 2 is a cross-sectional view of the interposer 100
  • 3 is a cross-sectional view of the electronic device 200
  • the interposer 100 includes the multilayer body 1.
  • the multilayer body 1 has a structure in which three insulator layers 1a to 1c are laminated.
  • the multilayer body 1 (insulator layers 1a to 1c) is made of a ceramic such as LTCC (Low Temperature Co-fired Ceramics).
  • the multilayer body 1 includes a top surface TS (Top surface), a bottom surface BS (Bottom surface), and four side surfaces SS (Side surface). Furthermore, the multilayer body 1 includes an inclined surface IS (Inclined Surface) which is a plane disposed obliquely with respect to the bottom surface BS. The inclined surface IS intersects the top surface TS and the three side surfaces SS, respectively.
  • Via conductors 2 are formed through the insulator layers 1a to 1c.
  • a line conductor 3 is formed between the insulator layers 1a to 1c.
  • a wiring electrode is formed inside the multilayer body 1 using the via conductor 2 and the line conductor 3.
  • the via conductor 2 and the line conductor 3 are each formed of, for example, copper, silver, an alloy containing these, or the like.
  • a circuit board terminal electrode 4 connected to the circuit board is formed on the bottom surface BS of the multilayer body 1.
  • the circuit board terminal electrode 4 is formed of, for example, copper, silver, an alloy containing these, or the like.
  • a plating layer 4 a is formed on the surface of the circuit board terminal electrode 4.
  • the plating layer 4a is formed in a multilayer structure, for example, with a metal selected from nickel for the first layer and gold, copper, tin, etc. for the second layer.
  • connection terminal electrode 5 connected to a flat cable or the like is formed on the inclined surface IS of the multilayer body 1.
  • the via conductor 2 exposed from the inclined surface IS of the multilayer body 1 is used as the connection terminal electrode 5 as it is.
  • a plating layer 5 a is formed on the surface of the connection terminal electrode 5.
  • the plated layer 5a is formed in a multilayer structure, for example, with a metal selected from nickel as the first layer and gold, copper, tin, and the like as the second layer.
  • the target connected to the connection terminal electrode 5 is arbitrary. It may be a wiring member such as a flat cable, a substrate, or an electronic component. Further, the wiring member is not limited to the flat cable, and a general lead wire or the like may be connected.
  • the circuit board terminal electrode 4 and the connection terminal electrode 5 are connected inside the multilayer body 1 by the wiring electrodes formed using the via conductor 2 and the line conductor 3 described above.
  • the interposer 100 connects the circuit board terminal electrode 4 to the mounting electrode formed on the circuit board with a conductive bonding material, and the connection terminal electrode 5 is electrically connected to the connection terminal formed at the end of the flat cable. Connect with a bonding material.
  • a bonding material for example, solder or a conductive adhesive can be used.
  • the connection terminal electrode 5 is provided on the inclined surface IS arranged obliquely with respect to the bottom surface BS, the connected flat cable can be drawn obliquely with respect to the bottom surface BS. is there. Therefore, if the interposer 100 is used, it is possible to eliminate bending in the middle of the flat cable, or to reduce the amount of bending (bending amount) in the middle of the flat cable.
  • the interposer 100 can be manufactured to an extremely small size by using a multilayer ceramic technology used for manufacturing a multilayer ceramic electronic component (such as a multilayer ceramic capacitor).
  • the interposer 100 can be manufactured by the following manufacturing method, for example.
  • Ceramic green sheets for preparing the insulator layers 1a to 1c are prepared.
  • the green sheet is prepared as a mother green sheet in which a large number of interposers 100 are arranged in a matrix so as to manufacture a large number of interposers 100 at a time.
  • a hole for forming the via conductor 2 is formed in each mother green sheet.
  • the hole is formed by, for example, laser light irradiation.
  • a conductive paste pattern for forming the line conductor 3 and the circuit board terminal electrode 4 is formed by printing a conductive paste on one main surface or both main surfaces of each mother green sheet.
  • a mother green sheet for producing the insulator layer 1a, a mother green sheet for producing the insulator layer 1b, and a mother green sheet for producing the insulator layer 1c are sequentially laminated and pressed.
  • the green mother laminated body is made by integrating.
  • the unfired mother laminate body is divided into individual unfired laminate bodies.
  • the division is performed by, for example, cutting the division line with a dicer.
  • Each of the divided unfired laminated bodies has a rectangular parallelepiped shape including a top surface TS, a bottom surface BS, and four side surfaces SS.
  • the unfired multilayer body is fixed, and the unfired multilayer body is irradiated with laser light to form the inclined surface IS on the unfired multilayer body.
  • the unfired laminated body may be barrel-polished.
  • the unfired multilayer body is fired with a predetermined profile to produce the multilayer body 1.
  • a circuit board terminal electrode 4 is formed on the bottom surface BS of the multilayer body 1. Further, on the inclined surface IS of the multilayer body 1, a connection terminal electrode 5 (an exposed end surface of the via conductor 2) is formed.
  • the plating layer 4a is formed on the surface of the circuit board terminal electrode 4 and the plating layer 5a is formed on the surface of the connection terminal electrode 5, for example, by electrolytic plating, thereby completing the interposer 100.
  • Manufacturing method 2 of interposer 100 In the manufacturing method 2 of the interposer 100, a part of the manufacturing method 1 is changed.
  • the unsintered laminated body after being divided individually was irradiated with laser light to form the inclined surface IS.
  • manufacturing method 2 instead of this, when the unfired mother laminated body is divided into individual unfired laminated bodies, the dicer is replaced several times along the way, if necessary, Is gradually increased to form the inclined surface IS in each of the divided unfired laminated bodies.
  • the inclined surface IS can be flattened.
  • the unsintered laminated body after being divided individually was irradiated with laser light to form the inclined surface IS.
  • a mother green sheet for producing the insulator layers 1b and 1c instead of this, a mother green sheet for producing the insulator layers 1b and 1c, and a width for forming the inclined surface IS along the dividing line in each dividing line portion.
  • Different line windows openings
  • a line-shaped window having a small width is provided on the mother green sheet for producing the insulator layer 1b
  • a line-shaped window having a large width is provided on the mother green sheet for producing the insulator layer 1c.
  • No window was provided in the mother green sheet for producing the insulator layer 1a.
  • a mother green sheet for producing the insulator layer 1a, a mother green sheet for producing the insulator layer 1b, and a mother green sheet for producing the insulator layer 1c are sequentially laminated.
  • an unfired mother laminated body is produced by pressurizing and integrating, an inclined surface is formed in the dividing line portion.
  • the inclined surface IS is formed in each unfired laminated body by the inclined surfaces of the dividing line portions.
  • the unfired laminated body is barrel-polished to flatten the inclined surface IS.
  • the multilayer body 1 is configured by the three insulator layers 1a to 1c.
  • the multilayer body 1 is configured by an insulator layer having a larger number of layers. This is an effective manufacturing method.
  • the electronic device 200 is, for example, a portable electronic device such as a smartphone. Note that in FIG. 3, provision of reference numerals to fine components may be omitted.
  • the electronic device 200 includes a housing 21.
  • the casing 21 is made of, for example, resin.
  • a first circuit board 22, a second circuit board 23, a third circuit board 24, and a battery pack 25 are accommodated in the housing 21.
  • the battery pack 25 is fixed to the inner wall of the casing 21.
  • the first circuit board 22 is fixed on the battery pack 25.
  • the second circuit board 23 and the third circuit board 24 are each fixed to the inner wall of the housing 21.
  • Electronic components 26 such as semiconductor devices, capacitors, resistors, and inductors are mounted on the first circuit board 22, the second circuit board 23, and the third circuit board 24, respectively.
  • the mounting electrode 27 formed on the main surfaces of the circuit boards 22 to 24 and the terminal electrode of the electronic component 26 are connected to a conductive bonding material 28 such as solder or a conductive adhesive. It is done by joining by.
  • first interposer 100A is mounted on the first circuit board 22, and the second interposer 100B is mounted on the second circuit board 23.
  • Each of the interposers 100A and 100B is the interposer 100 according to the first embodiment described above.
  • the interposers 100A and 100B are mounted by connecting the mounting electrodes 27 formed on the main surfaces of the circuit boards 22 and 23 and the circuit board terminal electrodes 4 of the interposers 100A and 100B with a conductive material such as solder or a conductive adhesive. This is performed by bonding with the adhesive bonding material 28. That is, the interposers 100A and 100B are simultaneously mounted on the circuit boards 22 and 23 by the same method as the other electronic components 26.
  • connection terminals 30 are formed at both ends of the flat cable 29, and the connection terminal electrodes 5 of the interposers 100A and 100B and the connection terminal 30 of the flat cable 29 are connected by solder or conductive. Bonded by a conductive bonding material 28 such as a conductive adhesive.
  • the interposer 100 ⁇ / b> A and the interposer 100 ⁇ / b> B are arranged at different height positions inside the housing 21.
  • the flat cable 29 that connects the interposer 100A and the interposer 100B is not bent, the flat cable 29 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 29 is shifted to increase insertion loss. There is nothing.
  • FIG. 5 shows an interposer 300 according to the second embodiment. However, FIG. 5 is a cross-sectional view of the interposer 300.
  • the interposer 300 has changed a part of the configuration of the interposer 100 according to the first embodiment.
  • the via conductor 2 exposed on the inclined surface IS of the multilayer body 1 is used as it is as the connection terminal electrode 5.
  • the interposer 300 has the connection terminal electrode 15 separately formed on the inclined surface IS.
  • a plating layer 15 a was formed on the surface of the connection terminal electrode 15.
  • the connection terminal electrode 15 is connected to the via conductor 2.
  • connection terminal electrode 15 is formed by printing a conductive paste on the inclined surface IS of the unfired laminated body to form a pattern, and then firing the unfired laminated body to produce the laminated body 1. Can be formed.
  • the other configuration of the interposer 300 is the same as that of the interposer 100.
  • FIG. 6 shows an interposer 400 according to the third embodiment. However, FIG. 6 is a cross-sectional view of the interposer 400.
  • the interposer 400 has changed a part of the configuration of the interposer 100 according to the first embodiment.
  • the multilayer body 1 was provided with a top surface TS, a bottom surface BS, four side surfaces SS, and an inclined surface IS.
  • the interposer 400 eliminates the top surface TS
  • the laminated body 41 has a shape including a bottom surface BS, four side surfaces SS, and an inclined surface IS.
  • the multilayer body 41 does not include the top surface TS arranged in parallel with the bottom surface BS, and instead, the area of the inclined surface IS is larger than the inclined surface IS of the multilayer body 1.
  • the multilayer body 41 has a structure in which three insulator layers 41a to 41c are laminated.
  • the interposer 400 has changed the structure of the wiring electrode formed using the via conductor 2 and the line conductor 3 inside the multilayer body 41 from the interposer 100 in accordance with the above change.
  • the other configuration of the interposer 400 is the same as that of the interposer 100.
  • FIG. 7 shows an interposer 500 according to the fourth embodiment. 7 is a cross-sectional view of the interposer 500.
  • the interposer 500 further changes the configuration of the interposer 400 according to the third embodiment.
  • the interposer 400 was provided with a laminated body 41 having a structure in which three insulating layers 41a to 41c were laminated.
  • the interposer 500 includes a single block-shaped element body 51 instead of the laminated element body 41.
  • the element body 51 is also made of an insulator such as ceramic.
  • the interposer 500 includes the wiring electrode inside the element body 51 only by the via conductor 2 and omits the line conductor 3.
  • the other configuration of the interposer 500 is the same as that of the interposer 100.
  • FIG. 8 shows an electronic apparatus 600 according to the fifth embodiment. However, FIG. 8 is a cross-sectional view of the electronic apparatus 600.
  • the electronic device 600 includes a housing 61.
  • a first circuit board 62, a second circuit board 63, and a battery pack 65 are accommodated in the housing 61.
  • the first circuit board 62, the second circuit board 63, and the battery pack 65 are fixed to the inner wall of the casing 61, respectively.
  • Electronic components 26 are mounted on the first circuit board 62 and the second circuit board 63, respectively.
  • first interposer 100A is mounted on the first circuit board 62
  • second interposer 100B is mounted on the second circuit board 63.
  • Interposer 100A and interposer 100B are connected by a flat cable 69.
  • the flat cable 69 connects the interposer 100A and the interposer 100B via the top surface of the battery pack 65.
  • the interposer 100 ⁇ / b> A and the interposer 100 ⁇ / b> B are arranged at the same height in the housing 61.
  • the flat cable 69 is pulled out from the interposer 100A and the interposer 100B without being bent. That is, because the flat cable 69 that connects the interposer 100A and the interposer 100B has a small bending amount (bending amount), the flat cable 39 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 39 is shifted. Insertion loss does not increase.
  • FIG. 9 shows an electronic apparatus 700 according to the sixth embodiment. Note that FIG. 9 is a cross-sectional view of the electronic device 700.
  • the electronic device 700 includes a housing 71.
  • a first circuit board 72, a second circuit board 73, and a battery pack 75 are accommodated in the housing 71.
  • the electronic component 26 is mounted on the upper main surface of the first circuit board 72. In addition, electronic components 26 are mounted on the upper and lower main surfaces of the second circuit board 73, respectively.
  • the battery pack 75 is fixed to the inner wall of the casing 71.
  • the first circuit board 72 is fixed on the battery pack 75.
  • the second circuit board 73 is fixed inside the casing 71 in a suspended state.
  • the first interposer 100A is mounted on the upper main surface of the first circuit board 72.
  • the second interposer 100B is mounted on the lower main surface of the second circuit board 73.
  • Interposer 100A and interposer 100B are connected by a flat cable 79.
  • the interposer 100A and the interposer 100B are arranged at different height positions inside the casing 71.
  • the flat cable 79 that connects the interposer 100A and the interposer 100B is not bent, the flat cable 79 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 79 is shifted to increase insertion loss. There is nothing.
  • FIGS. 10A and 10B show an interposer 800 according to the seventh embodiment.
  • FIG. 10A is a perspective view of the interposer 800.
  • FIG. 10B is a plan view of the interposer 800.
  • the interposer 800 has a new configuration added to the interposer 100 according to the first embodiment. Specifically, the metal shield 36 was formed on the four side surfaces SS of the multilayer body 1 of the interposer 100.
  • the metal shield 36 is formed on each of the four side surfaces SS of the multilayer body 1 with a certain width along the side in contact with the bottom surface BS. As a result, in the present embodiment, the metal shield 36 is formed on the entire surface of the one side surface SS, and is partially formed on each of the three side surfaces SS.
  • the material and configuration of the metal shield 51 are arbitrary, but can be formed of, for example, Ti, Ni, Cr, SUS, Cu, Al, Ag, or an alloy thereof. Further, an adhesion layer made of Ti, Ni, Cr, SUS, or an alloy thereof, a conductive layer made of Cu, Al, Ag, or an alloy thereof, and a corrosion-resistant layer made of Ti, Ni, Cr, SUS, or an alloy thereof
  • the three-layer structure can be formed.
  • the adhesion layer is preferably made of a material having high affinity with the element body 1 and hardly peeled off
  • the conductive layer is preferably made of a material having high conductivity
  • the corrosion-resistant layer is preferably made of a material resistant to oxidation and corrosion.
  • the metal shield 36 is connected to the circuit board terminal electrode 4 via wiring electrodes (via conductor 2 and line conductor 3). Therefore, the metal shield 36 can be connected to the ground potential by connecting the circuit board terminal electrode 4 to the ground potential.
  • the metal shield 36 can be formed, for example, by sputtering after masking the outer surface of the multilayer body 1 where the metal shield 36 is not formed.
  • the interposer 800 can suppress the noise radiated from the interposer to the outside and the noise entering the interposer from the outside by the metal shield 36. That is, since the interposer 800 is shielded by the metal shield 36, the transmission of the side surface SS of the laminated body 1 of the magnetic field component and electric field component constituting the noise is suppressed, and noise radiated to the outside from the interposer , Noise entering the interposer from the outside is suppressed.
  • the metal shield 36 is formed so as to go around the outer periphery of the four side surfaces SS of the multilayer body 1 and has a high noise shielding effect.
  • FIG. 11A and 11B show an interposer 900 according to the eighth embodiment.
  • FIG. 11A is a perspective view of the interposer 900.
  • FIG. 11B is a plan view of the interposer 900.
  • the interposer 900 has changed a part of the configuration of the interposer 800 according to the seventh embodiment described above. Specifically, in the interposer 800, the metal shields 36 are formed on the four side surfaces SS of the multilayer body 1 with a certain width along the sides in contact with the bottom surface BS. The interposer 900 is modified to form a metal shield 46 on the entire surface of the four side surfaces SS of the multilayer body 1 and the entire surface of the top surface TS.
  • the interposer 900 has a better noise shielding effect than the interposer 800.
  • FIG. 12 shows an interposer 1000 according to the ninth embodiment. However, FIG. 12 is a perspective view of the interposer 1000.
  • the interposer 1000 has changed a part of the configuration of the interposer 900 according to the above-described eighth embodiment. Specifically, in the interposer 1000, in addition to the metal shield 46, the metal shield 56 is also formed around the connection terminal electrode 5 on the inclined surface IS of the multilayer body 1.
  • the interposer 1000 has a better noise shielding effect than the interposer 900.
  • the interposers 800, 900, and 100 according to the seventh to ninth embodiments, examples of forming the metal shields 36, 46, and 56 have been described.
  • the present invention is not limited to the above example. While confirming the noise shielding effect, the formation position can be appropriately set as necessary.
  • FIG. 13 shows an electronic apparatus 1100 according to the tenth embodiment. However, FIG. 13 is a front view of the electronic device 1100.
  • the interposer 800 according to the seventh embodiment described above is mounted on the circuit board 64.
  • an electronic component 67 is mounted on the circuit board 64 adjacent to the interposer 800.
  • the height H S of the metal shield 36 formed on the side surface SS which faces the electronic component 67 of the laminated body 1 is higher than the height H D of the electronic component 67.
  • the noise cannot be sufficiently shielded by the metal shield 36, and the noise radiated from the electronic component 67 becomes an interposer. effect or apply, interposer there is a possibility that noise radiation or affect the electronic component 67, but in the electronic device 11000, the height H S of the metal shield 36 is greater than the height H D of the electronic component 67 Therefore, the influence of noise between the two is effectively suppressed.
  • FIG. 14 shows an interposer 1200 according to the eleventh embodiment. However, FIG. 14 is a cross-sectional view of the interposer 1200.
  • the interposer 1200 has changed a part of the configuration of the interposer 100 according to the first embodiment. Specifically, in the interposer 100, the three insulator layers 1a to 1c constituting the multilayer body 1 are made of a non-magnetic material, but in the interposer 1200, the three insulator layers 1a to 1d are formed. Among them, the insulator layer 1a laminated on the lowermost layer was made of the magnetic body Z. More specifically, the insulator layer 1a was made of a magnetic material Z made of ferrite.
  • the interposer 1200 also has a function of a so-called magnetic bead inductor (ferrite bead inductor), and can suppress passage of noise included in a signal passing through the interposer.
  • magnetic bead inductor ferrite bead inductor
  • FIG. 15 shows an interposer 1300 according to the twelfth embodiment. 15 is a perspective view of the interposer 1300.
  • the interposer 1300 has changed a part of the configuration of the interposer 1200 according to the eleventh embodiment. Specifically, in the interposer 1200, the insulator layer 1a laminated on the lowermost layer of the multilayer body 1 is made of the magnetic body Z. In the interposer 1300, all of the three insulator layers 1a to 1c are made magnetic. Made with body Z.
  • the laminated element body 1 may be partially made of a magnetic substance like the interposer 1200, or the laminated element body 1 like the interposer 1300. The whole may be made of a magnetic material.
  • Interposer 1300 also has the function of a magnetic bead inductor (ferrite bead inductor).
  • FIGS. 16A and 16B show an interposer 1400 according to the thirteenth embodiment.
  • 16A is a perspective view of the interposer 1400.
  • FIG. 16B is an exploded perspective view of the interposer 1400 and shows a state where the metal shield 36 is removed.
  • the interposer 1400 combines the features of the interposer 800 according to the seventh embodiment and the features of the interposer 1200 according to the eleventh embodiment.
  • the interposer 1400 is formed by using the magnetic body Z, the insulator layer 1a laminated at the lowest layer among the three insulator layers 1a to 1c constituting the multilayer body 1. did.
  • the metal shield 36 is formed on the four side surfaces SS of the multilayer body 1 in the same manner as the interposer 800.
  • the interposer 1400 Since the interposer 1400 is formed with the metal shield 36, noise radiated from the interposer to the outside and noise entering the interposer from the outside are suppressed. Further, the interposer 1400 has the function of a so-called magnetic bead inductor (ferrite bead inductor) because the insulator layer 1a constituting the element body 1 is made of the magnetic body Z.
  • magnetic bead inductor ferrite bead inductor
  • interposers 100, 300, 500, 800, 900, 1000, 1200, 1300, 1400 and the electronic devices 200, 600, 700, 1100 according to the embodiments have been described.
  • the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.
  • interposers 100, 300, 400, 500, 800, 900, 1000, 1200, 1300, and 1400 are made of the laminated element bodies 1 and 41 and the element body 51 using ceramics, these materials are arbitrary. You may produce with other materials, such as resin.
  • the inclination angle of the inclined surface IS of the laminated element bodies 1 and 41 and the element body 51 of the interposers 100, 300, 400, 500, 800, 900, 1000, 1200, 1300, and 1400 is arbitrary. Can be changed.
  • the electronic devices 200, 600, 700, and 1100 are portable electronic devices such as smartphones, the type of the electronic device is arbitrary and may be other types of electronic devices.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un interposeur permettant à un câble plat, ou similaire, d'être connecté de manière oblique par rapport à la surface inférieure d'un corps d'élément. L'invention comprend un corps d'élément (1) servant d'isolant, des électrodes de borne de carte de base de circuit (4) disposées au niveau de la surface inférieure du corps d'élément (1), des électrodes de borne de connexion (5) disposées sur le côté de surface supérieure du corps d'élément (1), et des électrodes de câblage (par l'intermédiaire de conducteurs (2), des conducteurs de trajet de ligne (3)) disposés à l'intérieur du corps d'élément (1) pour connecter les électrodes de borne de carte de base de circuit (4) aux électrodes de borne de connexion (5). Sur la surface supérieure du corps d'élément (1) est disposée une surface inclinée (IS), qui est une surface plate disposée obliquement par rapport à la surface inférieure (BS), sur laquelle est disposée les électrodes de borne de connexion (5).
PCT/JP2017/043085 2017-01-27 2017-11-30 Interposeur et machine électronique WO2018139048A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-013483 2017-01-27
JP2017013483 2017-01-27

Publications (1)

Publication Number Publication Date
WO2018139048A1 true WO2018139048A1 (fr) 2018-08-02

Family

ID=62979240

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/043085 WO2018139048A1 (fr) 2017-01-27 2017-11-30 Interposeur et machine électronique

Country Status (1)

Country Link
WO (1) WO2018139048A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024257470A1 (fr) * 2023-06-14 2024-12-19 株式会社村田製作所 Module de circuit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251889A (ja) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd 立体的電子回路装置
JP2010087232A (ja) * 2008-09-30 2010-04-15 Murata Mfg Co Ltd 電子部品および電子部品用基板ならびにそれらの製造方法
JP2011200332A (ja) * 2010-03-24 2011-10-13 Toshiba Corp 二次元アレイ超音波プローブ及びプローブ診断装置
JP2014049577A (ja) * 2012-08-30 2014-03-17 Toshiba Corp 半導体装置及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251889A (ja) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd 立体的電子回路装置
JP2010087232A (ja) * 2008-09-30 2010-04-15 Murata Mfg Co Ltd 電子部品および電子部品用基板ならびにそれらの製造方法
JP2011200332A (ja) * 2010-03-24 2011-10-13 Toshiba Corp 二次元アレイ超音波プローブ及びプローブ診断装置
JP2014049577A (ja) * 2012-08-30 2014-03-17 Toshiba Corp 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024257470A1 (fr) * 2023-06-14 2024-12-19 株式会社村田製作所 Module de circuit

Similar Documents

Publication Publication Date Title
KR101670184B1 (ko) 적층 전자부품 및 그 제조방법
CN107452464B (zh) 层叠线圈部件
KR102565701B1 (ko) 코일 부품
JP6458904B2 (ja) 受動素子アレイおよびプリント配線板
US11510315B2 (en) Multilayer substrate, interposer, and electronic device
US10418168B2 (en) Inductor and method for manufacturing the same
JP2008198923A (ja) コイル部品
KR20150089279A (ko) 칩형 코일 부품
CN214754244U (zh) 内插件以及电子设备
JP2017216288A (ja) 積層コイル部品
KR101823189B1 (ko) 인덕터 어셈블리
WO2018139048A1 (fr) Interposeur et machine électronique
JP2017216290A (ja) 積層コイル部品
CN212034479U (zh) 内插器以及电子设备
US10707016B2 (en) Method of manufacturing laminated electronic component
JP2017216289A (ja) 積層コイル部品
WO2018142740A1 (fr) Interposeur et dispositif électronique
WO2018110381A1 (fr) Module électronique
JP6980891B2 (ja) 積層コイル部品
JP6954441B2 (ja) 積層コイル部品
JP6923027B2 (ja) 積層コイル部品
JP2004047817A (ja) 積層フェライト基板，薄型コイル部品及びそれを使用した回路装置
JP2023039711A (ja) インダクタ部品
WO2019240000A1 (fr) Procédé de fabrication d'élément électrique, élément électrique et structure de montage d'élément électrique
JP2005136231A (ja) セラミック電子部品及びセラミックコンデンサ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17893766

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17893766

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载