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WO2018133333A1 - Power detection device for multi-channel radio-frequency input signal detection - Google Patents

Power detection device for multi-channel radio-frequency input signal detection Download PDF

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Publication number
WO2018133333A1
WO2018133333A1 PCT/CN2017/091047 CN2017091047W WO2018133333A1 WO 2018133333 A1 WO2018133333 A1 WO 2018133333A1 CN 2017091047 W CN2017091047 W CN 2017091047W WO 2018133333 A1 WO2018133333 A1 WO 2018133333A1
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WO
WIPO (PCT)
Prior art keywords
radio frequency
input signal
input
temperature
power
Prior art date
Application number
PCT/CN2017/091047
Other languages
French (fr)
Chinese (zh)
Inventor
曹丽萍
Original Assignee
深圳国人通信股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳国人通信股份有限公司 filed Critical 深圳国人通信股份有限公司
Publication of WO2018133333A1 publication Critical patent/WO2018133333A1/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B17/00Monitoring; Testing
    • H04B17/10Monitoring; Testing of transmitters

Definitions

  • the present invention relates to a power detecting device, and more particularly to a power detecting device for detecting multiple radio frequency input signals.
  • Multi-system integration platform (POI, POINT OF INTERFACE) is mainly used in large-scale buildings and municipal facilities that require multiple network access to effectively realize multi-signal multi-band combining functions.
  • the POI monitoring part needs to perform real-time detection on the input power of the multi-channel RF signal, and send the detected effective power value to the monitoring board through the 485 interface.
  • a conventional power detecting device performs input power detection for each radio frequency signal separately.
  • the advantage is that the circuit principle is simple and easy to implement, and avoids mutual interference between detection signals; the disadvantage is that multiple detection modules are required, and the whole device has a large volume, high cost and low integration.
  • the object of the present invention is to overcome the deficiencies of the above technologies, and provide a power detecting device for detecting multiple channels of radio frequency input signals, which has high integration and can detect the power of multiple RF input signals.
  • a power detecting apparatus for multi-channel radio frequency input signal detection includes an input interface for inputting multiple radio frequency input signals, and an input interface connected to the input interface for receiving the input interface. Inputting a signal and selecting a radio frequency switch portion of the radio frequency input signal to be power-detected; a power detecting portion connected to the radio frequency switch portion for receiving the radio frequency input signal sent by the radio frequency switch portion and performing power detection a microprocessor connected to the power detecting portion for controlling the radio frequency switching portion and the power detecting portion; connected to the microprocessor for detecting a temperature of the power detecting portion and detecting The temperature value is sent to the temperature detecting portion of the microprocessor.
  • the radio frequency switching portion includes a plurality of first-level radio frequency switches and a plurality of second-level radio frequency switches, and two input ends of each of the first-level radio frequency switches are respectively adjacent to each other Two-way RF input signal
  • the input interface is connected, and the outputs of the two adjacent first-stage RF switches are respectively connected to two input terminals of the second-stage RF switch.
  • the microprocessor is configured to output a high level and a low level to control the on and off between the two input ends and the output end of the first stage radio frequency switch, and output an off control signal to control the second stage. On and off between the two inputs and outputs of the RF switch.
  • the insertion loss of the first-stage RF switch and the second-stage RF switch is 0.65 ⁇ 1.04 dB
  • the isolation is 44 ⁇ 65 decibels and the return loss is 14 ⁇ 24 decibels.
  • the power detecting portion includes a plurality of detecting tubes and a plurality of temperature compensating circuits connected in one-to-one correspondence with the plurality of detecting tubes; each of the detecting tubes corresponds to one of the second-level radio frequency switches, And connecting to the output terminal of the corresponding second-stage radio frequency switch; the detecting tube is configured to convert the received radio frequency input signal into a corresponding detection voltage value, and send the signal to the microprocessor; each of the temperature compensation circuits Connected to the temperature detecting portion, configured to perform temperature compensation according to the temperature value detected by the temperature detecting portion and the detected voltage value detected by the corresponding detecting tube, and send the temperature compensation value to the microprocessor; The processor is configured to detect a power value of the corresponding radio frequency input signal according to the detection voltage value and the temperature compensation value.
  • the temperature compensation circuit has a temperature compensation range of ⁇ 25° C. to +55° C.
  • the temperature detecting portion includes an analog temperature sensor, the analog scale sensor has a detection scale factor of 10 millivolts per degree Celsius, and the output voltage value ranges from 100 millivolts to 2000 millivolts.
  • the analog temperature sensor detects a temperature range of -40 ° C to + 125 ° C.
  • each of the radio frequency input signals is located in one of the radio frequency signal cavities, and the power detecting portion and the microprocessor are respectively disposed on the PCB board and are respectively located in the detecting cavity And the control chamber.
  • a portion of the PCB between the two adjacent RF signal cavities is provided with a notch.
  • the present invention can effectively detect the input power of multiple frequency input signals of different frequency bands, and can make the power detection range It achieves ⁇ 40 dB, detection accuracy of ⁇ 2dB, high integration and low cost.
  • FIG. 1 is a schematic block diagram of a power detecting device for multi-channel RF input signal detection according to the present invention
  • FIG. 2 is a schematic structural view of a cover sub-chamber of the power detecting device shown in FIG.
  • FIG. 3 is a schematic view of a PCB board of the power detecting device shown in FIG. 1.
  • a power detecting apparatus for multi-channel RF input signal detection includes: an input interface for inputting multiple RF input signals; and an input interface for receiving an input interface; The input signal selects the radio frequency switching portion 20 of the radio frequency input signal for power detection; the power detecting portion connected to the radio frequency switching portion 20 for receiving the radio frequency input signal transmitted by the radio frequency switching portion 20 and performing power detection 30; a microprocessor 50 connected to the power detecting portion 30, for controlling the RF switching portion 20 and the power detecting portion 30; connected to the microprocessor 50 for detecting the temperature of the power detecting portion 30 and detecting the temperature The value is sent to the temperature detecting portion 40 of the microprocessor 50.
  • the present invention is further described by taking power detection of 12 radio frequency input signals as an example.
  • the 12 RF input signals are named RFIN_1 RF input signal, RFIN_2 RF input signal, RFIN_3 RF input signal... RFIN_11 RF input signal, RFIN_12 RF input signal.
  • the 12-channel RF input signal ranges from 800MHz to 2.3GHz, including 2G/3G/4G signals.
  • the radio frequency switching portion 20 includes six first-level radio frequency switches 21 and three second-level radio frequency switches 22, and two input ends of each first-level radio frequency switch 21 are respectively adjacent to two adjacent channels.
  • the input interface of the RF input signal is connected.
  • the two input ends of the first first stage RF switch 21 are respectively connected to the input interfaces of the RFIN_1 RF input signal and the RFI N_2 RF input signal, and the second first stage RF switch is connected.
  • the two inputs of 21 are connected to the RFIN_3 RF input signal and the input interface of the RFIN_4 RF input signal, and so on.
  • the outputs of the adjacent two first-stage RF switches 21 are respectively connected to the two input ends of a second-stage RF switch 22, for example, the outputs of the first and second first-stage RF switches 21 respectively Connected to two inputs of the first second stage RF switch 22, the outputs of the third and fourth first stage RF switches 21 respectively Connected to the two inputs of the second second stage RF switch 22, and so on.
  • the microprocessor 50 is configured to output high and low levels to control the on and off between the two input terminals and the output end of the first stage radio frequency switch 21 and to output two control signals to control the second stage radio frequency switch 22 On and off between input and output.
  • the microprocessor 50 outputs the first second stage radio frequency switch 22 The first input terminal's chirp signal and the second second stage radio frequency switch 22's second input terminal turn off signal, then the first first stage RF switch 21 output and the first second stage RF 22 is turned on, microprocessor 50 outputs a high level to the first first stage RF switch 21, then the first input of the first first stage RF switch 21 and the first first stage The output of the RF switch 21 is turned on,
  • the RFIN_1 RF input signal is turned on, the RFIN_2 RF input signal, the RFIN_3 RF input signal, and the RFI N_4 RF input signal are turned off, thereby selecting the RFIN_1 RF input signal for power detection.
  • the microprocessor 50 outputs the first input of the first second stage radio frequency switch 22 and the off signal of the second input of the first second stage radio frequency switch 22, then the first The output of the first stage RF switch 21 is connected to the first second stage RF switch 22, and the microprocessor 50 outputs a low level to the first first stage RF switch 21, then the first The second input of the first-stage RF switch 21 is connected to the output of the first first-stage RF switch 21, the RFIN_2 RF input signal is turned on, the RFIN_1 RF input signal, the RF IN_3 RF input signal, and the RFIN_4 RF input. The signal is turned off, thereby selecting the RFIN_2 RF input signal for power detection.
  • the microprocessor 50 outputs the chirp signal of the second input of the first second stage radio frequency switch 22 and the off signal of the first input end of the first second stage radio frequency switch 22, and then the second The output of the first stage RF switch 21 is connected to the first second stage RF switch 22, and the microprocessor 50 outputs a high level to the second first stage RF switch 21, then the second The first input of the primary RF switch 21 is connected to the output of the second first stage RF switch 21, the RFIN_3 RF input signal is activated, the RFIN_1 RF input signal, the RF IN_2 RF input signal, and the RFIN_4 RF input. The signal is turned off, thereby selecting the RFIN_3 RF input signal for power detection.
  • the microprocessor 50 outputs a chirp signal of the second input of the first second stage radio frequency switch 22 and a turn off signal of the first input end of the first second stage radio frequency switch 22, and then the second First level RF switch 21
  • the output is connected to the first second stage RF switch 22, the microprocessor 50 outputs a low level to the second first stage RF switch 21, and the second first stage RF switch 21 is second.
  • the input terminal is connected to the output of the second first-stage RF switch 21, the RFIN_4 RF input signal is turned on, the RFIN_1 RF input signal, the RF IN_2 RF input signal, and the RFIN_3 RF input signal are turned off, thereby selecting the RFIN_4 RF input.
  • the signal is tested for power.
  • the RF switch section 20 can simultaneously select three RF input signals of different frequency bands for power detection.
  • the insertion loss of the first stage radio frequency switch 21 and the second stage radio frequency switch 22 is 0.65 to 1.04 decibels, the isolation is 44 to 65 decibels, and the return loss is 14 to 24 decibels, and the frequency is The range is 50MHz ⁇ 6000MHz, and the Pldb value is about 35dBm.
  • the power detecting portion 30 includes three detecting tubes 31 and three temperature compensating circuits (not shown) connected to the three detecting tubes 31 one-to-one.
  • the detector tube 31 is an RMS detector tube, operating at a frequency of 100 MHz to 3.9 G Hz, with a detection accuracy of ⁇ ldB, and an input dynamic range of -65 dBm to +7 dBm, which has good temperature stability.
  • Each detector tube 31 corresponds to a second stage RF switch 22 and is coupled to the output of the second stage RF switch 22.
  • the detector tube 31 is operative to convert the received RF input signal to a corresponding detection voltage value and to the microprocessor 50.
  • Each temperature compensating circuit is connected to the temperature detecting portion 40 for temperature compensation based on the temperature value detected by the temperature detecting portion 40 and the detected detecting voltage value detected by the detecting tube 31, and transmits the temperature compensation value to the microprocessor 50.
  • the microprocessor 50 is configured to detect the power value of the corresponding RF input signal based on the detected voltage value and the temperature compensation value.
  • the RF switch section 20 selects the RFIN_1 RF input signal, the RFIN_5 RF input signal, and the RFIN_9 RF input signal for power detection.
  • the corresponding three detectors 31 will receive the RFIN_1 RF input signal, the RFIN_5 RF input signal, and the RFIN_9 RF input.
  • the signals are respectively converted into corresponding detection voltage values, and sent to the microprocessor 50, and the corresponding three temperature compensation circuits perform temperature compensation according to the temperature value detected by the temperature detecting portion 40 and the detection voltage value detected by the corresponding detector tube 31, and
  • the temperature compensation value is sent to the microprocessor 50, and the microprocessor 50 can detect the power values of the corresponding RFIN_1 RF input signal, RFIN_5 RF input signal, and RFIN_9 RF input signal according to the detection voltage value and the temperature compensation value.
  • the temperature compensation circuit has a temperature compensation range of ⁇ 25° C. to +55° C.
  • the temperature detecting portion 40 includes an analog temperature sensor 41, and the detection scale factor of the analog temperature sensor 51 is 10 millivolts per degree Celsius, the output voltage range is 100 millivolts to 2000 millivolts, and the detected temperature value is obtained by outputting the voltage value to the microprocessor 50.
  • the detected temperature range is -40 ° C to + 125 ° C.
  • the detection accuracy is ⁇ 2 °C.
  • the analog temperature sensor 41 is adjacent to the detector tube 31 to detect a relatively accurate temperature value.
  • the power detecting device of the present invention further includes a bottom plate, a cover plate 80 mounted to the bottom plate, and a PCB board 90 mounted between the bottom plate and the cover plate 80, and formed between the bottom plate and the cover plate 80.
  • a box body having a size of 172.7 mm * 61.1 mm * 22 mm.
  • PCB board adopts double panel, FR-4 board, dielectric constant 1.2-4. 6, thickness 0.8mm, gold plating process, size 172.6mm*61mm, top surface distribution component and RF trace of PCB board 90, The bottom surface distributes the control line traces.
  • the cover plate 80 and the PCB board 90 form mutually independent 12 RF signal cavities 81, the detection cavity and the control cavity 83, and the power supply cavity 84.
  • Each RF input signal is located in a RF signal cavity 81. Internally, the spatial isolation between the RF input signals is guaranteed to ensure the isolation between the RF input signals.
  • 1 2 RF signal cavities 81 are sequentially distributed from left to right along one side of the cover plate 80, and the RF input signal frequencies of the 12 RF signal cavities 81 are 2370 MHz-2390 MHz, 2320 MHz-2370 MHz from left to right.
  • a portion of the PCB board 90 located between the adjacent two RF signal cavities 81 is provided with a notch 91, which reduces interference between the RF input signals of each channel, and further ensures spatial isolation between the RF input signals of the respective channels. .
  • the power detecting portion 30, the microprocessor 50 and the power supply portion are respectively disposed on the PCB board 90 and are respectively located in the detecting cavity, the control cavity 83, and the power supply cavity 84.
  • the detection chamber is further divided into three independent detection tubes, which are placed in the cavity 82, and three detection tubes 31 are respectively located in the three detection tube placement chambers 82.
  • the present invention can effectively detect the power of multiple frequency input signals of different frequency bands, and can achieve a power detection range of ⁇ 40 (18, detection accuracy ⁇ 2dB, high integration, low cost;
  • the design and the box cavity design meet the high isolation requirements between the RF input signals, ensuring the accuracy of power detection.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transmitters (AREA)

Abstract

The present invention relates to a power detection device for multi-channel radio-frequency input signal detection. The device comprises an input interface for inputting multi-channel radio-frequency input signals, a radio-frequency switch part connected to the input interface and used for receiving signals input by the input interface and selecting radio-frequency input signals to be subjected to power detection, a power detection part connected to the radio-frequency switch part and used for receiving radio-frequency input signals sent by the radio-frequency switch part and carrying out power detection, a micro-processor connected to the power detection part and used for controlling the radio-frequency switch part and the power detection part, and a temperature detection part connected to the micro-processor and used for detecting the temperature of the power detection part and sending a value of the detected temperature to the micro-processor. In the present invention, the input power of multi-channel radio-frequency input signals on different frequency bands can be detected in real time, and a high integration level and low costs are realized.

Description

说明书 发明名称:用于多路射频输入信号检测的功率检测装置 技术领域  Description: Inventive name: Power detection device for multi-channel RF input signal detection
[0001] 本发明涉及一种功率检测装置, 尤其是涉及一种用于多路射频输入信号检测的 功率检测装置。  [0001] The present invention relates to a power detecting device, and more particularly to a power detecting device for detecting multiple radio frequency input signals.
背景技术  Background technique
[0002] 多系统合路平台 (POI, POINT OF INTERFACE) 主要应用于需多网络接入的 大型建筑、 市政设施内, 有效实现多信号多频段合路功能。 POI监控部分需要对 多路射频信号的输入功率进行实吋检测, 将检测到的有效功率值通过 485接口发 送至监控板。  [0002] Multi-system integration platform (POI, POINT OF INTERFACE) is mainly used in large-scale buildings and municipal facilities that require multiple network access to effectively realize multi-signal multi-band combining functions. The POI monitoring part needs to perform real-time detection on the input power of the multi-channel RF signal, and send the detected effective power value to the monitoring board through the 485 interface.
[0003] 传统的功率检测装置是分别对每路射频信号进行输入功率检测。 其优点是电路 原理简单, 易实现, 避免检测信号之间相互干扰; 缺点是需要多个检测模块, 整机设备体积较大, 成本较高, 集成度低。 技术问题  [0003] A conventional power detecting device performs input power detection for each radio frequency signal separately. The advantage is that the circuit principle is simple and easy to implement, and avoids mutual interference between detection signals; the disadvantage is that multiple detection modules are required, and the whole device has a large volume, high cost and low integration. technical problem
问题的解决方案  Problem solution
技术解决方案  Technical solution
[0004] 本发明的目的在于克服上述技术的不足, 提供一种用于多路射频输入信号检测 的功率检测装置, 集成度高, 可实吋检测多路射频输入信号的功率。  [0004] The object of the present invention is to overcome the deficiencies of the above technologies, and provide a power detecting device for detecting multiple channels of radio frequency input signals, which has high integration and can detect the power of multiple RF input signals.
[0005] 本发明提供的一种用于多路射频输入信号检测的功率检测装置, 包括用于多路 射频输入信号输入的输入接口; 与所述输入接口连接、 用于接收所述输入接口 的输入信号并选出要进行功率检测的射频输入信号的射频幵关部分; 与所述射 频幵关部分连接、 用于接收所述射频幵关部分发送的射频输入信号并进行功率 检测的功率检测部分; 与所述功率检测部分连接、 用于控制所述射频幵关部分 和所述功率检测部分的微处理器; 与所述微处理器连接、 用于检测所述功率检 测部分的温度并将检测的温度值发送至所述微处理器的温度检测部分。  [0005] A power detecting apparatus for multi-channel radio frequency input signal detection includes an input interface for inputting multiple radio frequency input signals, and an input interface connected to the input interface for receiving the input interface. Inputting a signal and selecting a radio frequency switch portion of the radio frequency input signal to be power-detected; a power detecting portion connected to the radio frequency switch portion for receiving the radio frequency input signal sent by the radio frequency switch portion and performing power detection a microprocessor connected to the power detecting portion for controlling the radio frequency switching portion and the power detecting portion; connected to the microprocessor for detecting a temperature of the power detecting portion and detecting The temperature value is sent to the temperature detecting portion of the microprocessor.
[0006] 进一步地, 所述射频幵关部分包括多个第一级射频幵关以及多个第二级射频幵 关, 每个所述第一级射频幵关的两个输入端分别与相邻两路的射频输入信号的 输入接口连接, 相邻两个所述第一级射频幵关的输出端分别与一个所述第二级 射频幵关的两个输入端连接。 [0006] Further, the radio frequency switching portion includes a plurality of first-level radio frequency switches and a plurality of second-level radio frequency switches, and two input ends of each of the first-level radio frequency switches are respectively adjacent to each other Two-way RF input signal The input interface is connected, and the outputs of the two adjacent first-stage RF switches are respectively connected to two input terminals of the second-stage RF switch.
[0007] 进一步地, 所述微处理器用于输出高低电平控制所述第一级射频幵关的两个输 入端与输出端之间的通断以及输出幵关控制信号控制所述第二级射频幵关的两 个输入端与输出端之间的通断。  [0007] Further, the microprocessor is configured to output a high level and a low level to control the on and off between the two input ends and the output end of the first stage radio frequency switch, and output an off control signal to control the second stage. On and off between the two inputs and outputs of the RF switch.
[0008] 进一步地, 所述第一级射频幵关和第二级射频幵关的插入损耗为 0.65~1.04分贝 [0008] Further, the insertion loss of the first-stage RF switch and the second-stage RF switch is 0.65~1.04 dB
, 隔离度为 44~65分贝, 回波损耗为 14~24分贝。 The isolation is 44~65 decibels and the return loss is 14~24 decibels.
[0009] 进一步地, 所述功率检测部分包括多个检波管以及与多个检波管一一对应连接 的多个温度补偿电路; 每个所述检波管对应一个所述第二级射频幵关, 且与对 应的第二级射频幵关的输出端连接; 所述检波管用于将接收的射频输入信号转 化为相应的检波电压值, 并发送至所述微处理器; 每个所述温度补偿电路与所 述温度检测部分连接, 用于根据所述温度检测部分检测的温度值和对应的检波 管检测的检波电压值进行温度补偿, 并将温度补偿值发送至所述微处理器; 所 述微处理器用于根据所述检波电压值及所述温度补偿值检测出对应的所述射频 输入信号的功率值。 [0009] Further, the power detecting portion includes a plurality of detecting tubes and a plurality of temperature compensating circuits connected in one-to-one correspondence with the plurality of detecting tubes; each of the detecting tubes corresponds to one of the second-level radio frequency switches, And connecting to the output terminal of the corresponding second-stage radio frequency switch; the detecting tube is configured to convert the received radio frequency input signal into a corresponding detection voltage value, and send the signal to the microprocessor; each of the temperature compensation circuits Connected to the temperature detecting portion, configured to perform temperature compensation according to the temperature value detected by the temperature detecting portion and the detected voltage value detected by the corresponding detecting tube, and send the temperature compensation value to the microprocessor; The processor is configured to detect a power value of the corresponding radio frequency input signal according to the detection voltage value and the temperature compensation value.
[0010] 进一步地, 所述温度补偿电路的温度补偿范围为 -25°C〜+55°C。 [0010] Further, the temperature compensation circuit has a temperature compensation range of −25° C. to +55° C.
[0011] 进一步地, 所述温度检测部分包括模拟温度传感器, 所述模拟温度传感器的检 测比例因子是 10毫伏每摄氏度, 输出的电压值范围是 100毫伏〜 2000毫伏。 [0011] Further, the temperature detecting portion includes an analog temperature sensor, the analog scale sensor has a detection scale factor of 10 millivolts per degree Celsius, and the output voltage value ranges from 100 millivolts to 2000 millivolts.
[0012] 进一步地, 所述模拟温度传感器检测的温度范围为 -40°C〜+125°C。 [0012] Further, the analog temperature sensor detects a temperature range of -40 ° C to + 125 ° C.
[0013] 进一步地, 还包括底板、 安装到底板的盖板以及安装到底板与盖板之间的 PCB 板, 所述盖板与所述 PCB板之间形成相互独立的多个射频信号腔体、 检测腔体以 及控制腔体, 每路所述射频输入信号位于一个所述射频信号腔体内, 所述功率 检测部分和微处理器分别设置在所述 PCB板上并分别位于所述检测腔体内和所述 控制腔体内。 [0013] Further, further comprising a bottom plate, a cover plate mounted to the bottom plate, and a PCB board mounted between the bottom plate and the cover plate, wherein the cover plate and the PCB board form mutually independent RF signal cavities Detecting a cavity and a control cavity, each of the radio frequency input signals is located in one of the radio frequency signal cavities, and the power detecting portion and the microprocessor are respectively disposed on the PCB board and are respectively located in the detecting cavity And the control chamber.
[0014] 进一步地, 所述 PCB板上位于相邻的两个射频信号腔体之间的部位设有槽口。  [0014] Further, a portion of the PCB between the two adjacent RF signal cavities is provided with a notch.
发明的有益效果  Advantageous effects of the invention
有益效果  Beneficial effect
[0015] 本发明可实吋检测多路不同频段的射频输入信号的输入功率, 可使功率检测范 围达到≥40 dB, 检测精度 ±2dB, 集成度高, 成本低。 [0015] The present invention can effectively detect the input power of multiple frequency input signals of different frequency bands, and can make the power detection range It achieves ≥40 dB, detection accuracy of ±2dB, high integration and low cost.
对附图的简要说明  Brief description of the drawing
附图说明  DRAWINGS
[0016] 图 1为本发明一种用于多路射频输入信号检测的功率检测装置的原理框图; [0017] 图 2是图 1所示功率检测装置的盖板分腔的结构示意图;  1 is a schematic block diagram of a power detecting device for multi-channel RF input signal detection according to the present invention; [0017] FIG. 2 is a schematic structural view of a cover sub-chamber of the power detecting device shown in FIG.
[0018] 图 3是图 1所示功率检测装置的 PCB板的示意图。 3 is a schematic view of a PCB board of the power detecting device shown in FIG. 1.
本发明的实施方式 Embodiments of the invention
[0019] 下面结合附图和实施例对本发明作进一步的描述。 [0019] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0020] 参考图 1, 本发明提供的一种用于多路射频输入信号检测的功率检测装置, 包 括: 用于多路射频输入信号输入的输入接口; 与输入接口连接、 用于接收输入 接口的输入信号并选出要进行功率检测的射频输入信号的射频幵关部分 20; 与 射频幵关部分 20连接、 用于接收射频幵关部分 20发送的射频输入信号并进行功 率检测的功率检测部分 30; 与功率检测部分 30连接、 用于控制射频幵关部分 20 和功率检测部分 30的微处理器 50; 与微处理器 50连接、 用于检测功率检测部分 3 0的温度并将检测的温度值发送至微处理器 50的温度检测部分 40。  [0020] Referring to FIG. 1, a power detecting apparatus for multi-channel RF input signal detection includes: an input interface for inputting multiple RF input signals; and an input interface for receiving an input interface; The input signal selects the radio frequency switching portion 20 of the radio frequency input signal for power detection; the power detecting portion connected to the radio frequency switching portion 20 for receiving the radio frequency input signal transmitted by the radio frequency switching portion 20 and performing power detection 30; a microprocessor 50 connected to the power detecting portion 30, for controlling the RF switching portion 20 and the power detecting portion 30; connected to the microprocessor 50 for detecting the temperature of the power detecting portion 30 and detecting the temperature The value is sent to the temperature detecting portion 40 of the microprocessor 50.
[0021] 下面以 12路射频输入信号的功率检测为例对本发明作进一步的说明。 将 12路射 频输入信号分别命名为 RFIN_1射频输入信号、 RFIN_2射频输入信号、 RFIN_3射 频输入信号 ...... RFIN_11射频输入信号、 RFIN_12射频输入信号。 12路射频输入 信号的频段由 800MHz至 2.3GHz, 包括 2G/3G/4G信号。  [0021] The present invention is further described by taking power detection of 12 radio frequency input signals as an example. The 12 RF input signals are named RFIN_1 RF input signal, RFIN_2 RF input signal, RFIN_3 RF input signal... RFIN_11 RF input signal, RFIN_12 RF input signal. The 12-channel RF input signal ranges from 800MHz to 2.3GHz, including 2G/3G/4G signals.
[0022] 射频幵关部分 20包括 6个第一级射频幵关 21以及 3个第二级射频幵关 22, 每个第 一级射频幵关 21的两个输入端分别与相邻两路的射频输入信号的输入接口连接 , 例如第一个第一级射频幵关 21的两个输入端分别与 RFIN_1射频输入信号和 RFI N_2射频输入信号的输入接口连接, 第二个第一级射频幵关 21的两个输入端分别 与 RFIN_3射频输入信号和 RFIN_4射频输入信号的输入接口连接, 以此类推。 相 邻两个第一级射频幵关 21的输出端分别与一个第二级射频幵关 22的两个输入端 连接, 例如第一个、 第二个第一级射频幵关 21的输出端分别与第一个第二级射 频幵关 22的两个输入端连接, 第三个、 第四个第一级射频幵关 21的输出端分别 与第二个第二级射频幵关 22的两个输入端连接, 以此类推。 [0022] The radio frequency switching portion 20 includes six first-level radio frequency switches 21 and three second-level radio frequency switches 22, and two input ends of each first-level radio frequency switch 21 are respectively adjacent to two adjacent channels. The input interface of the RF input signal is connected. For example, the two input ends of the first first stage RF switch 21 are respectively connected to the input interfaces of the RFIN_1 RF input signal and the RFI N_2 RF input signal, and the second first stage RF switch is connected. The two inputs of 21 are connected to the RFIN_3 RF input signal and the input interface of the RFIN_4 RF input signal, and so on. The outputs of the adjacent two first-stage RF switches 21 are respectively connected to the two input ends of a second-stage RF switch 22, for example, the outputs of the first and second first-stage RF switches 21 respectively Connected to two inputs of the first second stage RF switch 22, the outputs of the third and fourth first stage RF switches 21 respectively Connected to the two inputs of the second second stage RF switch 22, and so on.
[0023] 微处理器 50用于输出高低电平控制第一级射频幵关 21的两个输入端与输出端之 间的通断以及输出幵关控制信号控制第二级射频幵关 22的两个输入端与输出端 之间的通断。 [0023] The microprocessor 50 is configured to output high and low levels to control the on and off between the two input terminals and the output end of the first stage radio frequency switch 21 and to output two control signals to control the second stage radio frequency switch 22 On and off between input and output.
[0024] 以第一个、 第二个第一级射频幵关 21和对应的第一个第二级射频幵关 22为例, 微处理器 50输出第一个第二级射频幵关 22的第一个输入端的幵启信号和第一个 第二级射频幵关 22的第二个输入端的关闭信号, 则第一个第一级射频幵关 21的 输出端与第一个第二级射频 22幵关接通, 微处理器 50输出高电平给第一个第一 级射频幵关 21, 则第一个第一级射频幵关 21的第一个输入端与第一个第一级射 频幵关 21的输出端接通,  [0024] Taking the first and second first stage radio frequency switches 21 and the corresponding first second stage radio frequency switch 22 as an example, the microprocessor 50 outputs the first second stage radio frequency switch 22 The first input terminal's chirp signal and the second second stage radio frequency switch 22's second input terminal turn off signal, then the first first stage RF switch 21 output and the first second stage RF 22 is turned on, microprocessor 50 outputs a high level to the first first stage RF switch 21, then the first input of the first first stage RF switch 21 and the first first stage The output of the RF switch 21 is turned on,
RFIN_1射频输入信号幵启, RFIN_2射频输入信号、 RFIN_3射频输入信号、 RFI N_4射频输入信号关闭, 从而选出 RFIN_1射频输入信号进行功率检测。  The RFIN_1 RF input signal is turned on, the RFIN_2 RF input signal, the RFIN_3 RF input signal, and the RFI N_4 RF input signal are turned off, thereby selecting the RFIN_1 RF input signal for power detection.
[0025] 微处理器 50输出第一个第二级射频幵关 22的第一个输入端的幵启信号和第一个 第二级射频幵关 22的第二个输入端的关闭信号, 则第一个第一级射频幵关 21的 输出端与第一个第二级射频幵关 22接通, 微处理器 50输出低电平给第一个第一 级射频幵关 21, 则第一个第一级射频幵关 21的第二个输入端与第一个第一级射 频幵关 21的输出端接通, RFIN_2射频输入信号幵启, RFIN_1射频输入信号、 RF IN_3射频输入信号、 RFIN_4射频输入信号关闭, 从而选出 RFIN_2射频输入信号 进行功率检测。 [0025] The microprocessor 50 outputs the first input of the first second stage radio frequency switch 22 and the off signal of the second input of the first second stage radio frequency switch 22, then the first The output of the first stage RF switch 21 is connected to the first second stage RF switch 22, and the microprocessor 50 outputs a low level to the first first stage RF switch 21, then the first The second input of the first-stage RF switch 21 is connected to the output of the first first-stage RF switch 21, the RFIN_2 RF input signal is turned on, the RFIN_1 RF input signal, the RF IN_3 RF input signal, and the RFIN_4 RF input. The signal is turned off, thereby selecting the RFIN_2 RF input signal for power detection.
[0026] 微处理器 50输出第一个第二级射频幵关 22的第二个输入端的幵启信号和第一个 第二级射频幵关 22的第一个输入端的关闭信号, 则第二个第一级射频幵关 21的 输出端与第一个第二级射频幵关 22接通, 微处理器 50输出高电平给第二个第一 级射频幵关 21, 则第二个第一级射频幵关 21的第一个输入端与第二个第一级射 频幵关 21的输出端接通, RFIN_3射频输入信号幵启, RFIN_1射频输入信号、 RF IN_2射频输入信号、 RFIN_4射频输入信号关闭, 从而选出 RFIN_3射频输入信号 进行功率检测。  The microprocessor 50 outputs the chirp signal of the second input of the first second stage radio frequency switch 22 and the off signal of the first input end of the first second stage radio frequency switch 22, and then the second The output of the first stage RF switch 21 is connected to the first second stage RF switch 22, and the microprocessor 50 outputs a high level to the second first stage RF switch 21, then the second The first input of the primary RF switch 21 is connected to the output of the second first stage RF switch 21, the RFIN_3 RF input signal is activated, the RFIN_1 RF input signal, the RF IN_2 RF input signal, and the RFIN_4 RF input. The signal is turned off, thereby selecting the RFIN_3 RF input signal for power detection.
[0027] 微处理器 50输出第一个第二级射频幵关 22的第二个输入端的幵启信号和第一个 第二级射频幵关 22的第一个输入端的关闭信号, 则第二个第一级射频幵关 21的 输出端与第一个第二级射频幵关 22接通, 微处理器 50输出低电平给第二个第一 级射频幵关 21, 则第二个第一级射频幵关 21的第二个输入端与第二个第一级射 频幵关 21的输出端接通, RFIN_4射频输入信号幵启, RFIN_1射频输入信号、 RF IN_2射频输入信号、 RFIN_3射频输入信号关闭, 从而选出 RFIN_4射频输入信号 进行功率检测。 [0027] The microprocessor 50 outputs a chirp signal of the second input of the first second stage radio frequency switch 22 and a turn off signal of the first input end of the first second stage radio frequency switch 22, and then the second First level RF switch 21 The output is connected to the first second stage RF switch 22, the microprocessor 50 outputs a low level to the second first stage RF switch 21, and the second first stage RF switch 21 is second. The input terminal is connected to the output of the second first-stage RF switch 21, the RFIN_4 RF input signal is turned on, the RFIN_1 RF input signal, the RF IN_2 RF input signal, and the RFIN_3 RF input signal are turned off, thereby selecting the RFIN_4 RF input. The signal is tested for power.
[0028] 如此, 射频幵关部分 20可同吋选出 3路不同频段的射频输入信号进行功率检测 [0028] In this way, the RF switch section 20 can simultaneously select three RF input signals of different frequency bands for power detection.
, 可节省吋间。 , can save time.
[0029] 本实施例中, 第一级射频幵关 21和第二级射频幵关 22的插入损耗为 0.65~1.04分 贝, 隔离度为 44~65分贝, 回波损耗为 14~24分贝, 频率范围为 50MHz~6000 MHz, Pldb值大约为 35dBm。  [0029] In this embodiment, the insertion loss of the first stage radio frequency switch 21 and the second stage radio frequency switch 22 is 0.65 to 1.04 decibels, the isolation is 44 to 65 decibels, and the return loss is 14 to 24 decibels, and the frequency is The range is 50MHz~6000MHz, and the Pldb value is about 35dBm.
[0030] 功率检测部分 30包括 3个检波管 31以及与 3个检波管 31—一对应连接的 3个温度 补偿电路 (图上未示出) 。 检波管 31为 RMS检波管, 工作频率为 100MHz〜3.9G Hz, 检测精度为 ±ldB, 输入动态范围为 -65dBm〜+7 dBm, 具有良好的温度稳定 性。 每个检波管 31对应一个第二级射频幵关 22, 且与第二级射频幵关 22的输出 端连接。 检波管 31用于将接收的射频输入信号转化为相应的检波电压值, 并发 送至微处理器 50。 每个温度补偿电路与温度检测部分 40连接, 用于根据温度检 测部分 40检测的温度值和对应的检波管 31检测的检波电压值进行温度补偿, 并 将温度补偿值发送至微处理器 50。 微处理器 50用于根据检波电压值及温度补偿 值检测出对应的射频输入信号的功率值。 比如, 射频幵关部分 20选出 RFIN_1射 频输入信号、 RFIN_5射频输入信号、 RFIN_9射频输入信号进行功率检测, 对应 的 3个检波管 31将接收的 RFIN_1射频输入信号、 RFIN_5射频输入信号、 RFIN_9 射频输入信号分别转化为相应的检波电压值, 并发送至微处理器 50, 对应的 3个 温度补偿电路根据温度检测部分 40检测的温度值和对应的检波管 31检测的检波 电压值进行温度补偿, 并将温度补偿值发送至微处理器 50, 微处理器 50根据检 波电压值及温度补偿值即可检测出对应的 RFIN_1射频输入信号、 RFIN_5射频输 入信号、 RFIN_9射频输入信号的功率值。  [0030] The power detecting portion 30 includes three detecting tubes 31 and three temperature compensating circuits (not shown) connected to the three detecting tubes 31 one-to-one. The detector tube 31 is an RMS detector tube, operating at a frequency of 100 MHz to 3.9 G Hz, with a detection accuracy of ±ldB, and an input dynamic range of -65 dBm to +7 dBm, which has good temperature stability. Each detector tube 31 corresponds to a second stage RF switch 22 and is coupled to the output of the second stage RF switch 22. The detector tube 31 is operative to convert the received RF input signal to a corresponding detection voltage value and to the microprocessor 50. Each temperature compensating circuit is connected to the temperature detecting portion 40 for temperature compensation based on the temperature value detected by the temperature detecting portion 40 and the detected detecting voltage value detected by the detecting tube 31, and transmits the temperature compensation value to the microprocessor 50. The microprocessor 50 is configured to detect the power value of the corresponding RF input signal based on the detected voltage value and the temperature compensation value. For example, the RF switch section 20 selects the RFIN_1 RF input signal, the RFIN_5 RF input signal, and the RFIN_9 RF input signal for power detection. The corresponding three detectors 31 will receive the RFIN_1 RF input signal, the RFIN_5 RF input signal, and the RFIN_9 RF input. The signals are respectively converted into corresponding detection voltage values, and sent to the microprocessor 50, and the corresponding three temperature compensation circuits perform temperature compensation according to the temperature value detected by the temperature detecting portion 40 and the detection voltage value detected by the corresponding detector tube 31, and The temperature compensation value is sent to the microprocessor 50, and the microprocessor 50 can detect the power values of the corresponding RFIN_1 RF input signal, RFIN_5 RF input signal, and RFIN_9 RF input signal according to the detection voltage value and the temperature compensation value.
[0031] 本实施例中, 温度补偿电路的温度补偿范围为 -25°C〜+55°C。  [0031] In this embodiment, the temperature compensation circuit has a temperature compensation range of −25° C. to +55° C.
[0032] 温度检测部分 40包括模拟温度传感器 41, 模拟温度传感器 51的检测比例因子是 10毫伏每摄氏度, 输出的电压值范围是 100毫伏〜 2000毫伏, 通过输出电压值至 微处理器 50从而获得检测的温度值, 检测的温度范围为 -40°C〜+125°C, 检测精 度为 ±2°C。 模拟温度传感器 41靠近检波管 31, 以检测较为准确的温度值。 [0032] The temperature detecting portion 40 includes an analog temperature sensor 41, and the detection scale factor of the analog temperature sensor 51 is 10 millivolts per degree Celsius, the output voltage range is 100 millivolts to 2000 millivolts, and the detected temperature value is obtained by outputting the voltage value to the microprocessor 50. The detected temperature range is -40 ° C to + 125 ° C. The detection accuracy is ±2 °C. The analog temperature sensor 41 is adjacent to the detector tube 31 to detect a relatively accurate temperature value.
[0033] 参考图 2和图 3, 本发明的功率检测装置还包括底板、 安装到底板的盖板 80以及 安装到底板与盖板 80之间的 PCB板 90, 底板和盖板 80之间形成一个盒体, 盒体的 尺寸为 172.7mm*61.1mm*22mm。 PCB板采用双面板, FR-4板材, 介电常数 1.2-4. 6, 板厚 0.8mm, 采用镀金工艺, 尺寸为 172.6mm*61mm, PCB板 90的顶面分布 元器件和射频走线, 底面分布控制线走线。  Referring to FIGS. 2 and 3, the power detecting device of the present invention further includes a bottom plate, a cover plate 80 mounted to the bottom plate, and a PCB board 90 mounted between the bottom plate and the cover plate 80, and formed between the bottom plate and the cover plate 80. A box body having a size of 172.7 mm * 61.1 mm * 22 mm. PCB board adopts double panel, FR-4 board, dielectric constant 1.2-4. 6, thickness 0.8mm, gold plating process, size 172.6mm*61mm, top surface distribution component and RF trace of PCB board 90, The bottom surface distributes the control line traces.
[0034] 盖板 80与 PCB板 90之间形成相互独立的 12个射频信号腔体 81、 检测腔体以及控 制腔体 83、 电源腔体 84, 每路射频输入信号位于一个射频信号腔体 81内, 保证 各路射频输入信号之间的空间隔离度, 保证了射频输入信号间的隔离度要求。 1 2个射频信号腔体 81沿盖板 80的一侧从左至右依次分布, 且 12个射频信号腔体 81 的射频输入信号频率从左至右依次为 2370MHz-2390MHz、 2320 MHz-2370 MHz 、 2300 MHz-2320 MHz、 2130 MHz-2170 MHz、 2110 MHz-2130 MHz、 2010 MHz-2025 MHz、 1885 MHz-1815 MHz、 1860 MHz- 1880 MHz、 1840 MHz- 1860 MHz、 1805 MHz- 1830 MHz。 PCB板 90上位于相邻的两个射频信号腔体 81之间的 部位设有槽口 91, 降低了各路射频输入信号之间的干扰, 进一步保证了各路射 频输入信号之间的空间隔离。  [0034] The cover plate 80 and the PCB board 90 form mutually independent 12 RF signal cavities 81, the detection cavity and the control cavity 83, and the power supply cavity 84. Each RF input signal is located in a RF signal cavity 81. Internally, the spatial isolation between the RF input signals is guaranteed to ensure the isolation between the RF input signals. 1 2 RF signal cavities 81 are sequentially distributed from left to right along one side of the cover plate 80, and the RF input signal frequencies of the 12 RF signal cavities 81 are 2370 MHz-2390 MHz, 2320 MHz-2370 MHz from left to right. 2300 MHz-2320 MHz, 2130 MHz-2170 MHz, 2110 MHz-2130 MHz, 2010 MHz-2025 MHz, 1885 MHz-1815 MHz, 1860 MHz-1880 MHz, 1840 MHz-1860 MHz, 1805 MHz-1830 MHz. A portion of the PCB board 90 located between the adjacent two RF signal cavities 81 is provided with a notch 91, which reduces interference between the RF input signals of each channel, and further ensures spatial isolation between the RF input signals of the respective channels. .
[0035] 功率检测部分 30、 微处理器 50和电源部分别设置在 PCB板 90上并分别位于检测 腔体内、 控制腔体 83内和电源腔体 84内。 检测腔体又分为 3个相互独立的检波管 放置腔体 82, 3个检波管 31分别位于 3个检波管放置腔体 82内。  [0035] The power detecting portion 30, the microprocessor 50 and the power supply portion are respectively disposed on the PCB board 90 and are respectively located in the detecting cavity, the control cavity 83, and the power supply cavity 84. The detection chamber is further divided into three independent detection tubes, which are placed in the cavity 82, and three detection tubes 31 are respectively located in the three detection tube placement chambers 82.
[0036] 本发明可实吋检测多路不同频段的射频输入信号的功率, 可使功率检测范围达 到≥40 (18, 检测精度 ±2dB, 集成度高, 成本低; 同吋通过 PCB的幵槽设计以及 盒体分腔设计, 达到了各路射频输入信号间的高隔离度的要求, 保证了功率检 测的精度。  [0036] The present invention can effectively detect the power of multiple frequency input signals of different frequency bands, and can achieve a power detection range of ≥40 (18, detection accuracy ±2dB, high integration, low cost; The design and the box cavity design meet the high isolation requirements between the RF input signals, ensuring the accuracy of power detection.
[0037] 以上实施例仅表达了本发明的优选实施方式, 其描述较为具体和详细, 但并不 能因此而理解为对本发明专利范围的限制。 应当指出的是, 对于本领域的普通 技术人员来说, 在不脱离本发明构思的前提下, 还可以做出若干变形和改进, 如对各个实施例中的不同特征进行组合等, 这些都属于本发明的保护范围。 The above embodiments are merely illustrative of the preferred embodiments of the present invention, and the description thereof is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the inventive concept. Combinations of the various features in the various embodiments, etc., are all within the scope of the invention.

Claims

权利要求书 Claim
[权利要求 1] 一种用于多路射频输入信号检测的功率检测装置, 其特征在于: 包括 用于多路射频输入信号输入的输入接口;  [Claim 1] A power detecting apparatus for detecting a plurality of radio frequency input signals, comprising: an input interface for inputting a plurality of radio frequency input signals;
与所述输入接口连接、 用于接收所述输入接口的输入信号并选出要进 行功率检测的射频输入信号的射频幵关部分;  And a radio frequency switch portion connected to the input interface for receiving an input signal of the input interface and selecting a radio frequency input signal for performing power detection;
与所述射频幵关部分连接、 用于接收所述射频幵关部分发送的射频输 入信号并进行功率检测的功率检测部分;  a power detecting portion connected to the radio frequency switching portion for receiving a radio frequency input signal sent by the radio frequency switching portion and performing power detection;
与所述功率检测部分连接、 用于控制所述射频幵关部分和所述功率检 测部分的微处理器;  a microprocessor coupled to the power detecting portion for controlling the radio frequency switching portion and the power detecting portion;
与所述微处理器连接、 用于检测所述功率检测部分的温度并将检测的 温度值发送至所述微处理器的温度检测部分。  Connected to the microprocessor for detecting the temperature of the power detecting portion and transmitting the detected temperature value to a temperature detecting portion of the microprocessor.
[权利要求 2] 根据权利要求 1所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 所述射频幵关部分包括多个第一级射频幵关以及多个第 二级射频幵关, 每个所述第一级射频幵关的两个输入端分别与相邻两 路的射频输入信号的输入接口连接, 相邻两个所述第一级射频幵关的 输出端分别与一个所述第二级射频幵关的两个输入端连接。  [Claim 2] The power detecting device for multi-channel radio frequency input signal detection according to claim 1, wherein: the radio frequency switching portion includes a plurality of first-level radio frequency switches and a plurality of second levels Radio frequency switching, the two input ends of each of the first stage radio frequency switches are respectively connected with the input interfaces of the adjacent two radio frequency input signals, and the output ends of the two adjacent first stage radio frequency switches are respectively Connected to two inputs of one of the second stage radio frequency switches.
[权利要求 3] 根据权利要求 2所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 所述微处理器用于输出高低电平控制所述第一级射频幵 关的两个输入端与输出端之间的通断以及输出幵关控制信号控制所述 第二级射频幵关的两个输入端与输出端之间的通断。  [Claim 3] The power detecting device for multi-channel radio frequency input signal detection according to claim 2, wherein: the microprocessor is configured to output two high and low levels to control the first stage radio frequency switch The switching between the input and the output and the output switching control signal control the on and off between the two inputs and the output of the second stage RF switch.
[权利要求 4] 根据权利要求 2所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 所述第一级射频幵关和第二级射频幵关的插入损耗为 0. 65 1.04分贝, 隔离度为 44~65分贝, 回波损耗为 14~24分贝。  [Claim 4] The power detecting device for multi-channel radio frequency input signal detection according to claim 2, wherein: the insertion loss of the first-stage radio frequency switch and the second-stage radio frequency switch is 0. 65 1.04 decibels, isolation is 44~65 decibels, and return loss is 14~24 decibels.
[权利要求 5] 根据权利要求 2所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 所述功率检测部分包括多个检波管以及与多个检波管一 一对应连接的多个温度补偿电路; 每个所述检波管对应一个所述第二 级射频幵关, 且与对应的第二级射频幵关的输出端连接; 所述检波管 用于将接收的射频输入信号转化为相应的检波电压值, 并发送至所述 微处理器; 每个所述温度补偿电路与所述温度检测部分连接, 用于根 据所述温度检测部分检测的温度值和对应的检波管检测的检波电压值 进行温度补偿, 并将温度补偿值发送至所述微处理器; 所述微处理器 用于根据所述检波电压值及所述温度补偿值检测出对应的所述射频输 入信号的功率值。 [Claim 5] The power detecting device for multi-channel radio frequency input signal detection according to claim 2, wherein: the power detecting portion includes a plurality of detecting tubes and one-to-one correspondence with the plurality of detecting tubes a plurality of temperature compensation circuits; each of the detection tubes corresponding to one of the second stage radio frequency switches, and connected to an output of the corresponding second stage radio frequency switch; the detection tube And configured to convert the received RF input signal into a corresponding detection voltage value, and send the same to the microprocessor; each of the temperature compensation circuits is coupled to the temperature detecting portion for detecting according to the temperature detecting portion The temperature value and the detection voltage value detected by the corresponding detector tube are temperature compensated, and the temperature compensation value is sent to the microprocessor; the microprocessor is configured to detect the corresponding value according to the detection voltage value and the temperature compensation value The power value of the RF input signal.
[权利要求 6] 根据权利要求 5所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 所述温度补偿电路的温度补偿范围为 -25°C〜+55°C。  [Claim 6] The power detecting device for multi-channel RF input signal detection according to claim 5, wherein: the temperature compensation circuit has a temperature compensation range of -25 ° C to + 55 ° C.
[权利要求 7] 根据权利要求 1所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 所述温度检测部分包括模拟温度传感器, 所述模拟温度 传感器的检测比例因子是 10毫伏每摄氏度, 输出的电压值范围是 100 毫伏〜 2000毫伏。  [Claim 7] The power detecting device for multi-channel radio frequency input signal detection according to claim 1, wherein: the temperature detecting portion includes an analog temperature sensor, and the detecting scale factor of the analog temperature sensor is 10 At millivolts per degree Celsius, the output voltage range is from 100 millivolts to 2000 millivolts.
[权利要求 8] 根据权利要求 7所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 所述模拟温度传感器检测的温度范围为 -40°C〜+125°C  [Claim 8] The power detecting device for multi-channel RF input signal detection according to claim 7, wherein: the temperature range detected by the analog temperature sensor is -40 ° C to + 125 ° C
[权利要求 9] 根据权利要求 1所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 还包括底板、 安装到底板的盖板以及安装到底板与盖板 之间的 PCB板, 所述盖板与所述 PCB板之间形成相互独立的多个射频 信号腔体、 检测腔体以及控制腔体, 每路所述射频输入信号位于一个 所述射频信号腔体内, 所述功率检测部分和微处理器分别设置在所述 PCB板上并分别位于所述检测腔体内和所述控制腔体内。 [Claim 9] The power detecting device for multi-channel RF input signal detection according to claim 1, further comprising: a bottom plate, a cover plate mounted to the bottom plate, and a PCB mounted between the bottom plate and the cover plate a plurality of radio frequency signal cavities, a detection cavity and a control cavity formed independently of each other between the cover plate and the PCB board, wherein each of the radio frequency input signals is located in one of the radio frequency signal cavities, The power detecting portion and the microprocessor are respectively disposed on the PCB board and are respectively located in the detecting cavity and the control cavity.
[权利要求 10] 根据权利要求 9所述的用于多路射频输入信号检测的功率检测装置, 其特征在于: 所述 PCB板上位于相邻的两个射频信号腔体之间的部位 设有槽口。  [Claim 10] The power detecting device for multi-channel RF input signal detection according to claim 9, wherein: the PCB board is located at a portion between adjacent two RF signal cavities. notch.
PCT/CN2017/091047 2017-01-19 2017-06-30 Power detection device for multi-channel radio-frequency input signal detection WO2018133333A1 (en)

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