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WO2018133070A1 - Substrat de circuit et son procédé de fabrication, et carte de circuit imprimé et son procédé de fabrication - Google Patents

Substrat de circuit et son procédé de fabrication, et carte de circuit imprimé et son procédé de fabrication Download PDF

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Publication number
WO2018133070A1
WO2018133070A1 PCT/CN2017/072076 CN2017072076W WO2018133070A1 WO 2018133070 A1 WO2018133070 A1 WO 2018133070A1 CN 2017072076 W CN2017072076 W CN 2017072076W WO 2018133070 A1 WO2018133070 A1 WO 2018133070A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
core
circuit
plate
heat sink
Prior art date
Application number
PCT/CN2017/072076
Other languages
English (en)
Chinese (zh)
Inventor
高卫东
钟山
Original Assignee
乐健科技（珠海）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 乐健科技（珠海）有限公司 filed Critical 乐健科技（珠海）有限公司
Priority to CN201780000030.4A priority Critical patent/CN107079582A/zh
Priority to PCT/CN2017/072076 priority patent/WO2018133070A1/fr
Publication of WO2018133070A1 publication Critical patent/WO2018133070A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate

Definitions

  • the present invention relates to the field of circuit boards, and in particular to a circuit board that can integrate a high power device and a low power device, a circuit board made of such a circuit board, and a circuit board and a method of manufacturing the circuit board.
  • the operation of high-power devices usually generates a large amount of heat, and therefore, the circuit substrate also needs to solve the heat dissipation problem of high-power devices.
  • the existing circuit substrate usually only has a thick circuit layer or a thin circuit layer, the requirement of setting both a high power device and a low power device on the same circuit board cannot be satisfied.
  • a first object of the present invention is to provide a circuit substrate which has good heat dissipation performance and is capable of providing a high power device and a low power device.
  • a second object of the present invention is to provide a circuit board which has good heat dissipation performance and is capable of providing a high power device and a low power device.
  • a third object of the present invention is to provide a method of manufacturing the above circuit board.
  • a fourth object of the present invention is to provide a method of manufacturing the above circuit board.
  • the circuit substrate provided by the present invention includes a first core layer and a second core layer, and a bonding layer is connected between the first core layer and the second core layer; wherein at least one ceramic heat sink is worn
  • the first core layer, the bonding layer and the second core layer are passed through, and the first core layer comprises a thick copper line region and a thin copper line region, and the ceramic heat sink passes through the thick copper line region.
  • a preferred solution is that a first circuit layer is disposed on a side of the first core layer adjacent to the bonding layer, a second circuit layer is disposed on a side of the second core layer adjacent to the bonding layer, and a first circuit layer is disposed on the circuit substrate.
  • the core layer, the bonding layer and the via hole of the second core layer are formed with a conductive metal layer on the inner wall of the via hole, and the conductive metal layer is connected to the first circuit layer and the second circuit layer.
  • a further solution is to provide a thick copper layer on the outside of the first core layer and/or on the outside of the second core layer.
  • the first core layer and/or the thin copper line region comprises a fiberglass board, and the first metal layer is provided on both sides of the fiberglass board.
  • the thick copper line region includes a second metal layer having a thickness greater than a thickness of the first metal layer of the thin copper line region.
  • the ceramic heat sink comprises a ceramic body, and the ceramic body is provided with a second metal layer on both sides.
  • the circuit board provided by the present invention includes a first core layer and a second core layer, and a bonding layer is connected between the first core layer and the second core layer; and the ceramic heat sink passes through the a core layer, a bonding layer and a second core layer, and the first core layer comprises a thick copper line region and a thin copper line region, the ceramic heat sink passes through the thick copper line region, and the heat generating device is disposed above the ceramic heat sink.
  • a method of manufacturing a circuit substrate includes providing a first core board having a first wiring layer, providing a second core board having a second wiring layer, and the first core board is provided a first through hole, a second through hole is disposed on the second core plate, and a bonding sheet having a third through hole is disposed between the first core plate and the second core plate; and the ceramic heat sink is placed at the first In the core board, the second core board and the bonding sheet, the ceramic heat dissipating body passes through the first through hole, the second through hole and the third through hole; and the thick copper plate with the fourth through hole is placed in the first through hole, ceramic The heat dissipating body is located in the fourth through hole, and the first core plate, the second core plate, the bonding sheet and the ceramic heat sink are pressed together, and the surface of the first core plate and the thick copper plate is plated with copper and etched to form a third Line layer.
  • a preferred solution is to drill a through hole on the pressed plate before copper plating on the surface of the first core plate and the thick copper plate, and when copper is plated on the surface of the first core plate and the thick copper plate, A conductive metal layer is formed in the via hole, and the conductive metal layer communicates with the first circuit layer and the second circuit layer.
  • a further solution is to form a thick copper layer on the outer surface of the second core layer when copper is plated on the surface of the first core board and the thick copper board.
  • providing the first core board having the first circuit layer includes: providing a fiberglass board having a first metal layer on both sides, and attaching a dry film on the first metal layer on one side of the fiberglass board, and After exposing the dry film, etching is performed to form a first wiring layer, and a first via hole is drilled in the first core plate on which the first wiring layer is formed.
  • a further solution is to provide a ceramic heat sink, wherein the ceramic heat sink comprises a ceramic body and a second metal disposed on both sides of the ceramic body, before the ceramic heat sink is placed in the first core board, the second core board and the bonding sheet.
  • Providing a ceramic heat sink comprises: providing a ceramic heat sink, and cutting the ceramic heat sink to obtain a plurality of ceramic heat sinks.
  • a further solution is: cutting the ceramic heat sink comprises: etching the second metal layer to form a cut mark, cutting the ceramic heat sink along the cut mark, and etching the second metal layer, and further on the ceramic heat sink Perform titanium removal treatment.
  • a further solution is to perform titanium removal treatment on the circuit substrate after copper plating on the surface of the first core plate and the thick copper plate and etching to form the third circuit layer.
  • a further solution is to fill the line gap of the third circuit layer with ink after copper plating on the surface of the first core plate and the thick copper plate and etching to form the third circuit layer.
  • a method of manufacturing a circuit board includes providing a first core board having a first wiring layer, providing a second core board having a second wiring layer, and the first core board is provided a first through hole, a second through hole is disposed on the second core plate, and a bonding sheet having a third through hole is disposed between the first core plate and the second core plate; and the ceramic heat sink is placed at the first In the core board, the second core board and the bonding sheet, the ceramic heat dissipating body passes through the first through hole, the second through hole and the third through hole; and the thick copper plate with the fourth through hole is placed in the first through hole, ceramic The heat dissipating body is located in the fourth through hole, and the first core plate, the second core plate, the bonding sheet and the ceramic heat sink are pressed together, and the surface of the first core plate and the thick copper plate is plated with copper and etched to form a third The wiring layer and the soldering device are soldered over the ceramic
  • the circuit board provided by the present invention is provided with a thick copper line region and a thin copper line region, a high-power device can be disposed on a thick copper line region, and a low-power device can be disposed in a thin copper line region. on.
  • a ceramic heat sink is disposed on the thick copper line region, thereby solving the heat dissipation problem of the high-power device, and the different copper-thick substrates are pressed together with the ceramic heat sink during the pressing, thereby achieving a large
  • the heat dissipation of the power device is designed on the circuit board of the same layer, and the lines on the surface of the circuit board can be disposed on the same plane, which provides the mounting of the grinding board and the device on the circuit board.
  • first circuit layer and the second circuit layer are respectively disposed on the first core layer and the second core layer, and the plurality of circuit layers can be disposed on the circuit substrate, thereby integrating more devices on the electrode plate.
  • the heat can be conducted in time when the circuit board is mounted on the heat sink, which is beneficial to heat dissipation of the high power device.
  • the manufacturing method of the circuit board provided by the present invention two core plates are first manufactured, and after the two core plates and the bonding plates are laminated, the heat dissipation ceramic body is placed in the laminated core plate, and then the thick copper plate is placed. After the core plate is subjected to high temperature pressing treatment, finally drilling, copper plating to form a circuit substrate, and a high power device is disposed above the ceramic heat sink. Since the manufacturing process of the circuit board provided by the present invention is simple, the manufacturing cost of the circuit substrate can be reduced.
  • a single ceramic heat sink is cut to obtain a plurality of small ceramic heat sinks, and the metal layer on both surfaces of the ceramic body is etched away before cutting the ceramic heat sink, thereby avoiding Directly cutting the metal layer causes the burr to be formed at the cutting of the metal layer and requires subsequent processing, which can improve the production efficiency of the circuit substrate.
  • the ceramic heat sink is subjected to titanium removal treatment, thereby improving the adhesion of the metal layer of the ceramic heat sink to the subsequent metal layer, thereby enabling subsequent processing of the metal layer, such as The copper layer is more firmly bonded to the metal layer of the ceramic heat sink to improve the quality of the circuit board.
  • Figure 1 is a cross-sectional view showing a first embodiment of a circuit board of the present invention.
  • Fig. 2 is a cross-sectional view showing a first state in the first core board manufacturing process of the first embodiment of the circuit board manufacturing method of the present invention.
  • Figure 3 is a cross-sectional view showing a second state in the first core board manufacturing process of the first embodiment of the circuit board manufacturing method of the present invention.
  • Fig. 4 is a cross-sectional view showing a third state in the first core board manufacturing process of the first embodiment of the circuit board manufacturing method of the present invention.
  • Fig. 5 is a cross-sectional view showing a fourth state in the manufacturing process of the first core board of the first embodiment of the circuit board manufacturing method of the present invention.
  • Fig. 6 is a structural view showing a first core plate of the first embodiment of the circuit board manufacturing method of the present invention.
  • Fig. 7 is a structural view showing a bonding sheet of a first embodiment of the method of manufacturing a circuit board of the present invention.
  • Figure 8 is a cross-sectional view showing a first state in the manufacturing process of the ceramic heat sink in the first embodiment of the method of manufacturing a circuit board of the present invention.
  • Figure 9 is a cross-sectional view showing a second state in the manufacturing process of the ceramic heat sink in the first embodiment of the method of manufacturing a circuit board of the present invention.
  • Fig. 10 is a view showing a third state in the manufacturing process of the ceramic heat sink in the first embodiment of the method of manufacturing a circuit board of the present invention.
  • Figure 11 is a cross-sectional view showing a first state of the first embodiment of the circuit board manufacturing method of the present invention.
  • Figure 12 is a cross-sectional view showing a second state of the first embodiment of the method of manufacturing a circuit board of the present invention.
  • Figure 13 is a cross-sectional view showing a third embodiment of the first embodiment of the method of manufacturing a circuit board of the present invention.
  • Figure 14 is a cross-sectional view showing a fourth state of the first embodiment of the circuit board manufacturing method of the present invention.
  • Figure 15 is a cross-sectional view showing a fifth state of the first embodiment of the method of manufacturing a circuit board of the present invention.
  • Figure 16 is a cross-sectional view showing a sixth embodiment of the first embodiment of the circuit board manufacturing method of the present invention.
  • Figure 17 is a cross-sectional view showing a seventh embodiment of the first embodiment of the circuit board manufacturing method of the present invention.
  • Figure 18 is a cross-sectional view showing a second embodiment of the circuit board of the present invention.
  • the circuit board of the present invention has a circuit substrate on which a plurality of devices are soldered, including a high-power device and a low-power device. Therefore, the circuit board of the present invention is a circuit substrate capable of integrating a high-power device and a low-power device. .
  • a ceramic heat sink is embedded in the circuit substrate, and a high-power device with a large amount of heat is disposed on the ceramic heat sink, so that the heat generated by the high-power device is quickly guided away through the ceramic heat sink, thereby improving the circuit board. Thermal performance.
  • the heat dissipation substrate includes a first core layer 20 at an upper end, a second core layer 10 under the first core layer, and a bonding between the first core layer 20 and the second core layer 10.
  • the layer 18, and the first core layer 20, the second core layer 10, and the bonding layer 18 are each provided with a through hole, and the ceramic heat sink 30 passes through the through holes of the above three layers. It is to be noted that the directions “upper” and “lower” in the present invention are described in the directions shown in Figs. 1 to 18, but are not to be construed as limiting the invention.
  • the second core layer 10 includes a fiberglass board 11 and a metal layer on the upper and lower surfaces of the fiberglass board 11.
  • the metal layer is a copper clad layer 12, and at least one copper clad layer 12 is etched to form a wiring layer, preferably The copper clad layer 12 adjacent to the bonding layer 18 is etched to form a wiring layer.
  • the fabrication process of the second core layer 10 will be described below with reference to FIGS. 2 through 6.
  • a core board 16 is obtained.
  • the core board 16 is cut into a sheet material having a size similar to that of the finally obtained circuit board.
  • the core board 16 has a fiberglass board 11 and a copper clad layer 12 on both sides of the fiberglass board 11. .
  • a dry film 13 is attached to the copper clad layer 12.
  • the dry film 13 is flatly attached to the copper clad layer 12.
  • the core sheet 16 to which the dry film 13 is attached is subjected to exposure and development processing, and the dry film 13 in the region where the wiring pattern is not required to be formed is removed.
  • the core sheet 16 is etched due to the dry film.
  • the copper clad layer 13 has a protective effect on the copper clad layer 12, and the copper clad layer 13 where the dry film 13 is attached will not be etched, and the copper clad layer 12 without the dry film 13 will be etched, and the etched copper layer 12 A line pattern is formed on the line.
  • a wiring pattern is formed on one surface of the core board 16, the upper surface is formed with a wiring pattern, and the lower surface retains the complete copper-clad layer 12 since it has not undergone exposure and development operations.
  • the core plate 16 is drilled to form a plurality of through holes 15, and the shape of each of the through holes 15 is identical to the shape of the ceramic heat sink 30, and the outer contour of the through hole 15 is slightly larger than the ceramic heat sink.
  • the outer contour of 30 is such that the ceramic heat sink 30 can pass through the through hole 15 in the core plate 16.
  • first several positioning holes are formed in the core plate 16 to facilitate positioning of the core plate 16 during drilling.
  • the adhesive layer 18 is formed of a bonding material layer for bonding the first core layer 20 and the second core layer 10 after the high temperature pressing of the bonding plate, and the bonding layer 18 is provided with a plurality of through holes 19, as shown in the figure.
  • the bonding plate is made of a polypropylene material.
  • the bonding plate may also be made of a material such as epoxy resin, silane, etc., as long as the bonding layer 18 has the first core layer 20 and the second core.
  • the layer 10 is bonded and has insulating properties.
  • the ceramic heat sink 30 includes a ceramic body 31 and a metal layer 32 on the upper and lower sides of the ceramic body 31.
  • the ceramic body 31 is an aluminum oxide or aluminum nitride ceramic body, and is formed on the ceramic body 31.
  • the metal layer 32 on both sides is a copper clad layer.
  • a ceramic heat sink having a larger area is provided.
  • the middle portion of the ceramic heat sink 30 is a ceramic body 31, and a metal layer 32 is disposed on the upper and lower surfaces of the ceramic body 31. If the ceramic heat sink is directly cut, the burr is often formed at the edge of the cut metal layer 32 when the metal layer 32 is cut, which affects the subsequent processing. Therefore, in this embodiment, before cutting the ceramic heat sink, first The metal layer 32 of the ceramic heat sink is etched.
  • a dry film 33 is attached to the surface of the metal layer 32, and then the dry film is exposed and developed to form a cut mark 34 on the dry film 33 as shown in Fig. 10.
  • the metal layer 32 is then etched to etch away the metal layer 32 where the dicing marks 34 are located, thereby removing the metal at the dicing.
  • the ceramic heat sink is cut along the cut marks. Since the metal layer at the cut has been etched away, the grinder only needs to cut the ceramic body 31 without cutting the metal layer 32, so that After the dicing, the burr-forming metal layer 32 is polished to improve the manufacturing efficiency of the circuit substrate.
  • the ceramic heat sink is also subjected to titanium removal treatment to increase the bonding ability of the metal layer 32 with other metals in the subsequent manufacturing process.
  • the first core layer 20 has a thin copper line region 21 and a thick copper line region 22, wherein the thin copper line region 21 is provided with a larger through hole, and the thick copper line region 22 is A through hole having a small area is provided, and the ceramic heat sink 30 is placed in the through hole in the thick copper line region 22, so that the ceramic heat sink 30 is embedded in the heat dissipation substrate.
  • the thin copper line region 21 is formed by etching a core layer and drilling a hole
  • the thick copper line region 22 is formed by drilling a thick copper plate, and the thick copper plate is placed in the through hole of the core plate.
  • the first core board 25 includes a fiberglass board 26, and the fiberglass board 26 is The upper and lower surfaces are each provided with a copper clad layer 27, and a copper layer 27 close to the adhesive layer 18 is etched to form a wiring layer. Further, it is necessary to drill a through hole 28 having a large area on the first core plate 25, and the ceramic heat sink 30 and the thick copper plate 35 need to be placed in the through hole 28 of the first core plate 25.
  • the second core board 16 is placed on the lowermost layer, and the bonding board is placed on the second core board 16, and The first core plate 25 is placed on the bonding plate, and the through holes 15 in the second core plate 16 are aligned with the through holes 19 on the bonding plates.
  • the cut ceramic heat sink 30 is placed into the through hole 15 of the second core plate 16 and the passage 19 of the bonding plate.
  • the ceramic heat sink 30 is also located at the first core plate 25. Inside the through hole 28.
  • the thick copper plate 35 has a copper layer 36 and a fiberglass plate 37 located under the copper layer 36, and the thick copper plate 35 is bored to form a through hole 29.
  • the thick copper plate 35 is placed into the through hole 28 of the first core plate 25, and the ceramic heat sink 30 is placed in the through hole 29 of the thick copper plate 35.
  • the lower surface should be a flat surface, that is, the lower surface of the first core board 16 and The lower surface of the ceramic heat sink 30 is flush, and the upper surface of the plate on which the first core plate 25, the bonding plate, the second core plate 16, the thick copper plate 35, and the ceramic heat sink 30 are stacked is also a flat surface, that is, the first core The upper surfaces of the plate 25, the ceramic heat sink 30, and the thick copper plate 35 are also flush.
  • the plate material laminated with the first core plate 25, the bonding plate, the second core plate 16, the thick copper plate 35, and the ceramic heat sink 30 is subjected to high temperature pressing, and the bonding plate is melted to form the adhesive layer 18, and will be first
  • the core plate 25, the second core plate 16, the thick copper plate 35, and the ceramic heat sink 30 are bonded.
  • the first core plate 25 forms the first core layer 10
  • the second core plate 25 and the thick copper plate 35 form the second core layer.
  • the area of the second core plate 25 forms a thin copper line region 21, and the region where the thick copper plate 35 is located forms a thick copper line region 22.
  • the thickness of the copper layer 36 of the thick copper plate 35 is greater than the thickness of the copper-clad layer 27 of the first core plate 25, and therefore, after pressing, the thickness of the metal layer of the thick copper line region 22 is larger than that of the thin copper line region.
  • the thickness of the metal layer of 21 is greater than the thickness of the copper-clad layer 27 of the first core plate 25, and therefore, after pressing, the thickness of the metal layer of the thick copper line region 22 is larger than that of the thin copper line region.
  • the plate subjected to high temperature pressing is subjected to a rubbing treatment.
  • the material of the adhesive layer 18 is applied to the outer surface of the plate, so that the bonding material flowing to the outer surface of the plate needs to be ground away. To avoid the impact of the bonding material on subsequent processing.
  • a drilling process is performed on the plate after the high temperature pressing, such as drilling a plurality of through holes 40 in the plate, each through hole 40 penetrating the upper and lower surfaces of the pressed plate.
  • the copper plate after the drilling is processed, as shown in Fig. 15, a thick copper layer 41 is formed on the upper surface of the pressed plate, and a layer is formed on the lower surface of the pressed plate.
  • the copper layer 42 is thickened, and a conductive metal layer 43 is formed on the inner wall of the through hole 40.
  • the conductive metal layer 15 communicates with the thick copper layer 41, the circuit layer of the first core layer 20, and the second layer.
  • the wiring layer of the core layer 10 is thickened with a copper layer 42, that is, to achieve an electrical connection between the plurality of cable layers on the circuit substrate.
  • a circuit pattern is formed on the plate material forming the thick copper layer 41 and the thick copper layer 42.
  • a dry film 45 is attached on both surfaces of the plate material, such as a thick copper layer. 42 does not need to form a line pattern, then a dry film 45 is attached to the entire thick copper layer 42.
  • a portion of the thick copper layer 41 is pasted with a dry film 45, that is, the area where the line pattern needs to be formed is dry.
  • the film without the need to form a line pattern, is not attached to the dry film.
  • the plate to which the dry film 45 is attached is etched, and etching is performed by exposure and development to obtain a circuit board with a line pattern as shown in FIG.
  • a plurality of gaps 48 formed by etching the copper layer are formed on the upper surface of the circuit substrate, and the depths of the plurality of gaps 48 are different, that is, formed in the thin copper line region.
  • the depth of the gap is shallow, and the depth of the gap formed in the thick copper line region is thick, so the copper layer of the line pattern formed on the circuit substrate is different in depth.
  • the circuit substrate is subjected to titanium removal treatment.
  • the ink is filled in the gap 48 of the line pattern, that is, the circuit substrate as shown in FIG. 1 is obtained, and when the circuit board is manufactured, the manufactured circuit substrate is used, and devices are disposed on the circuit substrate, such as setting a high-power device.
  • a low power device is placed over the thin copper line region 21 such that heat generated by the high power device is quickly conducted through the ceramic heat sink 30 to the thickened copper layer 42. Since the thick copper layer 42 of the circuit board is usually integrated on the heat sink, the heat of the high power device will be quickly conducted to the heat sink through the thick copper layer, which is advantageous for heat dissipation of the high power device.
  • circuit layer of the circuit board of the present invention is provided with circuit regions of different thicknesses, and the high-power device and the low-power device can be integrated on one circuit board, and the ceramic heat sink is embedded in the circuit substrate, and high power can be realized.
  • the rapid dissipation of the device provides conditions for integrating high-power devices with low-power devices on the same board.
  • the circuit board of this embodiment has a circuit substrate, and a wiring pattern is formed on the circuit substrate, and the electronic device is disposed on the wiring pattern.
  • the circuit substrate of the embodiment has a copper layer 60 located at the bottom, and no wiring pattern is disposed on the copper layer 60. Therefore, the copper layer 60 can be closely attached to the heat dissipation plate for timely dissipating heat of the high-power device.
  • a second core layer 62 is disposed on the copper layer 60.
  • the second core layer 62 includes a fiberglass board 63 and a metal layer on the upper and lower surfaces of the fiberglass board 63, that is, a copper clad layer 68, and a through hole is formed in the second core layer 62.
  • the ceramic heat sink 66 is disposed in the through hole.
  • a first core layer is disposed on the second core layer 62.
  • the first core layer includes a thick copper line region 64 and a thin copper line region 65. As can be seen from FIG. 18, the thickness of the copper layer of the thick copper line region 64 is greater than that of the thin layer.
  • the thickness of the copper layer of the copper line region 65 is such that the ceramic heat sink 66 is embedded in the thick copper line region 64.
  • the high-power device can be disposed in the thick copper line region above the ceramic heat sink 66, so that the heat generated by the high-power device can be quickly guided away through the ceramic heat sink, such as transferring heat to the heat sink, improving the circuit board. Thermal performance.
  • the high power device and the low power device can be integrated on the circuit board of the embodiment, that is, the high power device is integrated on the thick copper line region 64, and the low power device is integrated on the thin copper line region 65, and the thick copper line is A ceramic heat sink is embedded in the region 64, and the heat generated by the high-power device can be dissipated through the ceramic heat sink in time.
  • the circuit board of the present invention can meet the current requirements for integrating high-power devices and low-power devices on the same circuit board, and the heat dissipation performance of the circuit board is good, the manufacturing process of the circuit board is very simple, the production efficiency is high, and the production cost is high. low.
  • the present invention is not limited to the above embodiments, and variations such as a specific material of the ceramic heat sink, a material change of the adhesive layer, and the like are also included in the scope of protection of the present invention.
  • the circuit substrate of the present invention can be applied to circuit boards for manufacturing various electronic devices, for example, can be applied to LED lamps, and integrated with high-power devices such as LED chips, various light-emitting tubes or power tubes, and integrated with LED lamps.
  • a device having a small power such as a resistor or a control chip, can be used to integrate the high-power device and the low-power device on the same circuit substrate by using the circuit substrate of the present invention, thereby realizing miniaturization and light weight of the electronic product structure.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un substrat de circuit et son procédé de fabrication, ainsi qu'une carte de circuit imprimé et son procédé de fabrication. Le substrat de circuit comprend une première couche de noyau (20) et une seconde couche de noyau (10), une couche adhésive (18) étant connectée entre la première couche de noyau et la seconde couche de noyau, au moins un corps de rayonnement de chaleur en céramique (30) passant à travers la première couche de noyau, la couche adhésive et la seconde couche de noyau ; et la première couche de noyau comprenant une région de circuit de cuivre épaisse (22) et une région de circuit de cuivre mince (21), et le corps de rayonnement de chaleur en céramique passant à travers la région de circuit de cuivre épaisse. Le procédé de fabrication du substrat de circuit consiste à utiliser une première plaque de noyau (25) ayant une première couche de circuit ; à utiliser une seconde plaque de noyau (16) ayant une deuxième couche de circuit, la première plaque de noyau étant pourvue d'un premier trou traversant (28), et la seconde plaque de noyau étant pourvue d'un deuxième trou traversant (15) ; à disposer une feuille adhésive ayant un troisième trou traversant (19) entre la première plaque de noyau et la seconde plaque de noyau ; en outre, à disposer le corps de rayonnement de chaleur en céramique dans la première plaque de noyau, la seconde plaque de noyau et la feuille adhésive, le corps de rayonnement de chaleur en céramique passant par le premier trou traversant, le deuxième trou traversant et le troisième trou traversant ; à disposer une plaque de cuivre épaisse (35) ayant un quatrième trou traversant (29) dans le premier trou traversant, le corps de rayonnement de chaleur en céramique étant situé dans le quatrième trou traversant ; à stratifier la première plaque de noyau, la seconde plaque de noyau, la feuille adhésive et le corps de rayonnement de chaleur en céramique ; puis à cuivrer les surfaces de la première plaque de noyau et de la plaque de cuivre épaisse, puis à graver pour former une troisième couche de circuit.
PCT/CN2017/072076 2017-01-22 2017-01-22 Substrat de circuit et son procédé de fabrication, et carte de circuit imprimé et son procédé de fabrication WO2018133070A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780000030.4A CN107079582A (zh) 2017-01-22 2017-01-22 电路基板及其制造方法、电路板及其制造方法
PCT/CN2017/072076 WO2018133070A1 (fr) 2017-01-22 2017-01-22 Substrat de circuit et son procédé de fabrication, et carte de circuit imprimé et son procédé de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/072076 WO2018133070A1 (fr) 2017-01-22 2017-01-22 Substrat de circuit et son procédé de fabrication, et carte de circuit imprimé et son procédé de fabrication

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WO2018133070A1 true WO2018133070A1 (fr) 2018-07-26

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