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WO2018133059A1 - 一种指纹模组 - Google Patents

一种指纹模组 Download PDF

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Publication number
WO2018133059A1
WO2018133059A1 PCT/CN2017/072042 CN2017072042W WO2018133059A1 WO 2018133059 A1 WO2018133059 A1 WO 2018133059A1 CN 2017072042 W CN2017072042 W CN 2017072042W WO 2018133059 A1 WO2018133059 A1 WO 2018133059A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint module
sensor package
circuit board
ink layer
cover plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/072042
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English (en)
French (fr)
Inventor
许炜添
郭益平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Goodix Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Goodix Technology Co Ltd filed Critical Shenzhen Goodix Technology Co Ltd
Priority to EP17892750.5A priority Critical patent/EP3422248A1/en
Priority to PCT/CN2017/072042 priority patent/WO2018133059A1/zh
Priority to CN201780005326.5A priority patent/CN108475332A/zh
Publication of WO2018133059A1 publication Critical patent/WO2018133059A1/zh
Priority to US16/133,657 priority patent/US20190019006A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Definitions

  • the present invention relates to the field of biometrics, and in particular to a fingerprint module.
  • the present invention provides a fingerprint module, which solves the disadvantage that the existing fingerprint module package is too thick and bulky, which causes space in the application process.
  • the invention provides a fingerprint module, comprising: a cover plate, a sensor package, a circuit board, a support frame and an adhesive; the lower surface of the cover plate is provided with an ink layer, and the sensor package is located below the ink layer Adhesive is covered under the ink layer, and the cover plate is fixedly connected to the sensor package through an adhesive under the ink layer; the sensor package is fixed above the circuit board; the circuit A support frame is disposed on both sides of the plate; the adhesive fills a gap between the respective components.
  • the sensor package is a wafer level package.
  • the fingerprint module further includes a reinforcing plate, the support frame and the support The circuit boards are respectively fixed above the reinforcing plates.
  • the cover is located inside the support frame.
  • the lower end of the support frame connected to the reinforcing plate has an inwardly protruding protrusion adjacent to both sides of the circuit board and the sensor package.
  • the sensor package is fixed above the circuit board by a solder ball and electrically connected to the circuit board.
  • the cover plate is an organic or inorganic material having a light transmissive material and having a thickness of between several tens of millimeters and several hundreds of millimeters.
  • the cover plate has a dielectric constant of 3 or more.
  • the binder is a binder of a silica gel system or a binder of silica.
  • the present invention provides a touch terminal comprising the fingerprint module of any of the above.
  • the present invention has the following advantages:
  • the fingerprint module has better structural stability and a thin overall thickness, and can save more occupied space in the whole machine application, and has better application effects.
  • FIG. 1 is a schematic structural view of a conventional fingerprint module
  • FIG. 2 is a schematic structural view of a biometric sensor package sheet of a conventional fingerprint module
  • FIG. 3 is a schematic structural diagram of an embodiment of a fingerprint module according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of another embodiment of a fingerprint module according to an embodiment of the present invention.
  • the existing fingerprint module is composed of a cover plate, a biometric sensor package sheet, a circuit board and a support frame, and the current fingerprint module is assembled by using a package sheet, and the biometric sensor package sheet is assembled.
  • the biometric sensor package sheet is assembled.
  • it is mainly composed of a sensor wafer, a substrate and a plastic package, so that the thickness is generally thick, and the overall module is relatively thick due to the thick thickness of the package, so that the whole machine takes up space during the application process.
  • FIG. 3 is a schematic structural diagram of an embodiment of a fingerprint module according to the present invention.
  • the fingerprint module includes a cover plate 1, a sensor package 2, a support frame 3, a circuit board 4, an adhesive 5, and a reinforcement. Board 6.
  • the sensor package 2 is fixed on the circuit board 4 by a solder ball, and is electrically connected to the circuit board 4, the sensor package 2 is a wafer level package, and the wafer level sensor package 2 is In
  • the sensor chip directly obtained in the fabrication of the wafer is used for collecting fingerprint information; compared with the conventional sensor package shown in FIG. 1, the thickness of the substrate of the conventional sensor package sheet is generally about 0.2 mm (mm).
  • the thickness of the adhesive film is about 0.05 mm.
  • the sensor package 2 according to the embodiment of the present invention is a wafer-level package, which is at least 0.25 mm thinner than the conventional sensor package sheet in the overall thickness of the fingerprint module.
  • the overall thickness of the fingerprint module of the embodiment of the present invention is less than 0.4 mm; on the other hand, the process of fixing the sensor package 2 to the circuit board 4 by solder balls Because the solder ball is self-contained in the wafer-level package molding process, and because of the conductive properties of the solder ball itself, it is not necessary to brush the solder through the pad again during the SMT (Surface Mount Technology) process. To achieve welding, improve installation efficiency.
  • SMT Surface Mount Technology
  • the cover plate 1 is an organic or inorganic material having a light transmissive material and a thickness of between several tens of millimeters and several hundreds of millimeters.
  • the cover plate 1 has a certain light transmittance, and can transmit light of a certain wavelength, and the dielectric constant of the cover plate 1 is greater than or equal to 3, in other embodiments of the present invention.
  • the relevant characteristic parameters of the cover plate 1 can be adjusted accordingly according to actual needs; the sensor package 2 is located below the ink layer 11, and the adhesive layer 5 is covered under the ink layer 11
  • the cover plate 1 is fixedly connected to the sensor package 2 by an adhesive 5 under the ink layer 11.
  • a support frame 3 is disposed on both sides of the circuit board 4, and a reinforcing plate 6 is fixedly disposed on a lower surface of the circuit board 4, and the bottom end of the support frame 3 is fixed by a structural adhesive, a conductive silver glue or a soldering method. Above the reinforcing plate 6, the reinforcing plate 6 is used to support the upper circuit board 4 and the support frame 3 and to enhance the toughness of the circuit board 4.
  • the cover plate 1 is located inside the support frame 3. .
  • the internal components of the fingerprint module may have a gap between each other during the installation process; for example, between the support frame 3 and the sensor package 2, between the support frame 3 and the circuit board 4 In the embodiment of the invention, the gap between the internal components of the fingerprint module
  • the binder 5 is filled with the binder 5, which is a binder of a silica gel system or a binder of silica. It has a low coefficient of thermal expansion and high impact strength to support
  • the spatial structure of each component in the fingerprint module can effectively protect the stability of the structure and performance of the sensor package 2 due to its characteristics, and also avoid the internal components of the fingerprint module caused by external causes such as collisions. Partial offset or damage, etc.
  • the fingerprint module has better structural stability and thinner overall thickness than the prior art, and can save more space in the whole machine application, and is better. Application effect.
  • FIG. 4 it is a schematic structural diagram of another embodiment of a fingerprint module according to an embodiment of the present invention.
  • the lower end of the supporting frame 3 and the reinforcing plate 6 has an inwardly protruding protrusion adjacent to the two sides of the circuit board 4 and the sensor package 2, respectively, because the protrusion fills the fingerprint module
  • the internal voids are reduced by the amount of adhesive 5 used to fill the gap between the various components of the interior of the fingerprint module.
  • the thermal expansion coefficient of the adhesive 5 selected by the fingerprint module is high, the volume of the adhesive 5 expands after the external temperature rises, and the amount of the adhesive 5 used is larger, the binder 5, the larger the volume change of the whole body, in order to reduce the influence of the volume change of the adhesive 5, the use amount of the adhesive 5 can be reduced by the structure according to the embodiment of the invention, and the fingerprint mode can be effectively improved.
  • the structural stability of the group on the other hand, when the coefficient of thermal expansion of the adhesive 5 is low, the structure of the fingerprint module described in the above embodiment can also be selected, and is selected according to actual needs.
  • the embodiment of the present invention further provides a touch terminal, where the touch terminal includes the fingerprint module described in the foregoing embodiment, and the touch terminal has the corresponding function of the fingerprint module.
  • the touch terminal includes the fingerprint module described in the foregoing embodiment, and the touch terminal has the corresponding function of the fingerprint module.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

一种指纹模组，涉及生物识别领域，该指纹模组包括：盖板（1），传感器封装（2），电路板（4），支撑架（3）以及粘结剂（5）；所述盖板（1）下表面设置有油墨层（11），所述传感器封装（2）位于所述油墨层（11）的下方，在所述油墨层（11）的下方覆盖有粘结剂（5），所述盖板（1）通过所述油墨层（11）下方的粘结剂（5）与所述传感器封装（2）固定连接；所述传感器封装（2）固定在电路板（4）的上方；所述电路板（4）的两侧均设置有支撑架（3）；所述粘结剂（5）填充在上述各个组成部分之间的间隙。所述的指纹模组相比于现有技术具备更好的结构稳定性以及更薄的整体厚度，在整机应用中可以节省更多的占有空间，具有较佳的应用效果。

Description

一种指纹模组 技术领域
本发明涉及生物识别领域，尤其涉及一种指纹模组。
背景技术
目前，伴随着消费者对产品外观的追求越来越高，消费类电子产品的内部元器件及模组也越来越追求极致，不管是性能及工艺都在追求极限。
而现有的指纹模组则无法满足这一需求。
发明内容
为了克服现有技术中相关产品的不足，本发明提出一种指纹模组，解决现有的指纹模组封装偏厚体积过大，造成应用过程中占空间的缺点。
本发明解决其技术问题所采用的技术方案是：
本发明提供了一种指纹模组，包括：盖板，传感器封装，电路板，支撑架以及粘结剂；所述盖板下表面设置有油墨层，所述传感器封装位于所述油墨层的下方，在所述油墨层的下方覆盖有粘结剂，所述盖板通过所述油墨层下方的粘结剂与所述传感器封装固定连接；所述传感器封装固定在电路板的上方；所述电路板的两侧均设置有支撑架；所述粘结剂填充在上述各个组成部分之间的间隙。
作为本发明的进一步改进，所述传感器封装是晶圆级封装。
作为本发明的进一步改进，所述指纹模组还包括补强板，所述支撑架与所 述电路板分别固定在所述补强板的上方。
作为本发明的进一步改进，所述盖板位于所述支撑架的内侧。
作为本发明的进一步改进，所述支撑架与所述补强板连接的下端有向内侧的凸起，分别临近所述电路板和传感器封装的两侧。
作为本发明的进一步改进，所述传感器封装通过锡球固定在电路板的上方，且与所述电路板电性连接。
作为本发明的进一步改进，所述盖板是透光材质且厚度介于几十毫米到几百毫米之间的有机物或无机物。
作为本发明的进一步改进，所述盖板的介电常数大于等于3。
作为本发明的进一步改进，所述的粘结剂是硅胶体系粘接剂或参杂二氧化硅的粘接剂。
本发明提供了一种触控终端，包括上述任一项所述的指纹模组。
与现有技术相比，本发明有以下优点：
所述的指纹模组相比于现有技术具备更好的结构稳定性以及更薄的整体厚度，在整机应用中可以节省更多的占有空间，具有较佳的应用效果。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有指纹模组的结构示意图；
图2为现有指纹模组的生物识别传感器封装片的结构示意图；
图3为本发明实施例所述指纹模组一个实施例的结构示意图；
图4为本发明实施例所述指纹模组另一个实施例的结构示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。
参阅图1所示，现有指纹模组由盖板、生物识别传感器封装片、电路板及支撑架组成，而目前的指纹模组由于采用封装片来组装，而所述的生物识别传感器封装片如图2所示，主要由传感器晶圆、基板及塑封体组成，故总体来说偏厚，由于封装体偏厚造成整体模组相对较厚，从而整机应用过程中较为占用空间。
实施例一
参阅图3所示，为本发明所述指纹模组一个实施例的结构示意图，所述指纹模组包括盖板1、传感器封装2、支撑架3、电路板4、粘结剂5以及补强板6。
所述传感器封装2通过锡球固定在所述电路板4的上方，且与所述电路板4电性连接，所述传感器封装2是晶圆级封装，所述的晶圆级传感器封装2是在 晶圆的制成中直接得到的传感器芯片，用于采集指纹信息；跟图1所示的传统的传感器封装2片相比，传统的传感器封装片的基板厚度一般为0.2mm(毫米)左右，粘接膜的厚度在0.05mm左右，本发明实施例所述的传感器封装2由于是晶圆级封装，比传统的传感器封装片在整体厚度上至少要薄0.25mm，在所述指纹模组的安装的过程中占据较小的空间，使本发明实施例所述的指纹模组的整体厚度小于0.4mm；在另一方面，所述传感器封装2通过锡球与所述电路板4固定的过程中，由于锡球是晶圆级封装成型过程中自带的，且由于锡球本身的导电特性，而不需要再次在SMT(Surface Mount Technology表面贴装技术)过程中通过焊盘刷锡的操作来实现焊接，提高了安装效率。
所述盖板1下表面设置有用于遮光的油墨层11，在本发明的实施例中，所述盖板1是透光材质且厚度介于几十毫米到几百毫米之间的有机物或无机物，例如蓝宝石、陶瓷、玻璃等，所述盖板1具有一定透光率，可透过一定波长的光线，所述盖板1的介电常数大于等于3，在本发明的其他实施例中，所述盖板1的相关特性参数根据实际需求可以进行相应的调整；所述传感器封装2位于所述油墨层11的下方，在所述油墨层11的下方覆盖有粘结剂5，所述盖板1通过所述油墨层11下方的粘结剂5与所述传感器封装2固定连接。
所述电路板4的两侧均设置有支撑架3，所述电路板4的下面固定设置有补强板6，所述支撑架3底端通过结构胶、导电银胶或焊接的方式固定在所述补强板6上方，所述补强板6用以支撑上方的电路板4和支撑架3以及提升所述电路板4的韧性强度，所述盖板1位于所述支撑架3的内侧。
所述指纹模组的内部各个组成部分在安装过程中相互位置间会产生间隙；例如，所述支撑架3与所述传感器封装2之间，所述支撑架3与所述电路板4之间等，在本发明的实施例中，所述指纹模组的内部各个组成部分之间的间隙 均以所述粘结剂5进行填充，所述的粘结剂5是硅胶体系粘接剂或参杂二氧化硅的粘接剂，具有低热膨胀系数及高抗冲击强度的特性，用以支撑所述指纹模组内部各个组成部分的空间结构，同时由于其特性可以有效保护传感器封装2的结构和性能的稳定性，也避免了因外部原因如碰撞等造成所述指纹模组的内部各个组成部分的偏移或损坏等。
在本发明的实施例中，所述的指纹模组相比于现有技术具备更好的结构稳定性以及更薄的整体厚度，在整机应用中可以节省更多的占有空间，具有较佳的应用效果。
实施例二
在上述实施例的基础上，参阅图4所示，为本发明实施例所述指纹模组另一实施例的结构示意图。
所述的支撑架3与所述补强板6连接的下端有向内侧的凸起，分别临近所述电路板4和传感器封装2的两侧，由于所述凸起填补了所述指纹模组内部的部分空隙，填充所述指纹模组的内部各个组成部分之间的间隙所用的粘结剂5减少。
当所述指纹模组所选用的粘结剂5的热膨胀系数较高时，由于所述粘结剂5在外部温度升高后体积会膨胀，使用的粘结剂5数量越多，粘结剂5整体的体积变化越大，为了降低所述粘结剂5的体积变化的影响，通过本发明实施例所述的结构来减少所述粘结剂5的使用量，可以有效提高所述指纹模组的结构稳定性，另一方面，在所述粘结剂5热膨胀系数较低时，也可以选用上述实施例所述的指纹模组的结构，根据实际需求选择。
实施例三
在上述实施例的基础上，本发明实施例还提供了一种触控终端，所述触控终端包括上述实施例所述的指纹模组，所述触控终端具备上述指纹模组相应的功能模块和有益效果，具体请参阅上述指纹模组的实施例，本发明实施例在此不再赘述。
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。

Claims (10)

  1. 一种指纹模组，其特征在于，包括：
    盖板，传感器封装，电路板，支撑架以及粘结剂；
    所述盖板下表面设置有油墨层，所述传感器封装位于所述油墨层的下方，在所述油墨层的下方覆盖有粘结剂，所述盖板通过所述油墨层下方的粘结剂与所述传感器封装固定连接；
    所述传感器封装固定在电路板的上方；
    所述电路板的两侧均设置有支撑架；
    所述粘结剂填充在上述各个组成部分之间的间隙。
  2. 根据权利要求1所述的指纹模组，其特征在于：所述传感器封装是晶圆级封装。
  3. 根据权利要求1所述的指纹模组，其特征在于，所述指纹模组还包括补强板，所述支撑架与所述电路板分别固定在所述补强板的上方。
  4. 根据权利要求3所述的指纹模组，其特征在于：所述盖板位于所述支撑架的内侧。
  5. 根据权利要求4所述的指纹模组，其特征在于：所述支撑架与所述补强板连接的下端有向内侧的凸起，分别临近所述电路板和传感器封装的两侧。
  6. 根据权利要求1所述的指纹模组，其特征在于：所述传感器封装通过锡球固定在电路板的上方，且与所述电路板电性连接。
  7. 根据权利要求1所述的指纹模组，其特征在于：所述盖板是透光材质且厚度介于几十毫米到几百毫米之间的有机物或无机物。
  8. 根据权利要求7所述的指纹模组，其特征在于：所述盖板的介电常数大 于等于3。
  9. 根据权利要求1所述的指纹模组，其特征在于：所述的粘结剂是硅胶体系粘接剂或参杂二氧化硅的粘接剂。
  10. 一种触控终端，其特征在于，包括如权利要求1-9任一项所述的指纹模组。
PCT/CN2017/072042 2017-01-22 2017-01-22 一种指纹模组 Ceased WO2018133059A1 (zh)

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