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WO2018123668A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2018123668A1
WO2018123668A1 PCT/JP2017/045206 JP2017045206W WO2018123668A1 WO 2018123668 A1 WO2018123668 A1 WO 2018123668A1 JP 2017045206 W JP2017045206 W JP 2017045206W WO 2018123668 A1 WO2018123668 A1 WO 2018123668A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electronic device
antenna
resin casing
ground
Prior art date
Application number
PCT/JP2017/045206
Other languages
English (en)
Japanese (ja)
Inventor
信樹 平松
直樹 西坂
光博 西園
ジュニアディ アリフィン サガラ
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2018123668A1 publication Critical patent/WO2018123668A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • This disclosure relates to electronic equipment.
  • miniaturization In recent years, electronic devices such as smartphones and tablet terminals have been made thinner in the thickness direction and smaller in the surface direction different from the thickness direction (hereinafter collectively referred to as miniaturization).
  • miniaturization a technique is known in which the size of the main circuit board in the surface direction is about half that of the casing, and the thickness of the casing in a region where the main circuit board is not disposed is reduced.
  • the main circuit board is the largest circuit board among the circuit boards inside the housing.
  • a portable radio device having a radio communication function among electronic devices may be designed so that the antenna for radio communication is as far as possible from the main circuit board.
  • a coaxial cable is generally used to electrically connect the main circuit board and the antenna.
  • An electronic apparatus includes a first substrate, a second substrate, and a resin casing. Wiring including signal lines for electrically connecting the first substrate and the second substrate is formed in the resin casing.
  • FIG. 1 is a schematic internal structure diagram of an electronic apparatus according to an embodiment.
  • FIG. 2 is a schematic cross-sectional view in the thickness direction of the electronic apparatus according to the embodiment.
  • FIG. 3 is a diagram illustrating the connection between the substrate and the resin casing of the electronic device according to the embodiment.
  • FIG. 4 is a diagram exemplifying signal passing characteristics when there is one ground pin.
  • FIG. 5 is a diagram illustrating signal passing characteristics when there are two ground pins.
  • FIG. 6 is a schematic cross-sectional view in the thickness direction of an electronic apparatus according to another embodiment.
  • FIG. 7 is a schematic cross-sectional view in the thickness direction of the electronic apparatus of the comparative example.
  • the electronic device 1 of one embodiment shown in FIG. 1 is a smartphone.
  • the electronic device 1 may be a portable device (portable wireless device) having a wireless communication function other than a smartphone.
  • the electronic device 1 may be a mobile phone terminal, a Fablet, a tablet PC, a feature phone, a PDA, a remote control terminal, a portable music player, a game machine, an electronic book reader, or the like.
  • FIG. 1 is a schematic internal structure diagram schematically showing components built in the electronic device 1.
  • the electronic device 1 includes a front cover 15, a display 14, a battery 13, a first substrate 12 ⁇ / b> A, a second substrate 12 ⁇ / b> B, a resin housing 11, and a rear cover 10.
  • the resin casing 11 includes three separated parts (a resin casing 11A, a resin casing 11B, and a resin casing 11C).
  • the front cover 15, the first substrate 12A, and the second substrate 12B are drawn to be transparent so as to allow the components on the back surface to pass therethrough.
  • a part of the front cover 15, the first substrate 12A, and the second substrate 12B are opaque.
  • the depth direction for the user is the z-axis direction.
  • the thickness direction of the electronic device 1 is the z-axis direction.
  • the direction from the front cover 15 to the rear cover 10 of the electronic device 1 is the z-axis positive direction.
  • the longitudinal direction and the lateral direction of the main surface of the electronic device 1 are the y-axis direction and the x-axis direction, respectively.
  • the direction toward the end provided with a speaker that emits sound during a call is the positive y-axis direction.
  • the direction shown in FIG. 1 is the x-axis positive direction so as to constitute a right-handed coordinate system.
  • the y-axis direction is particularly referred to as a main surface direction.
  • the front cover 15 constitutes the outer peripheral portion of the front surface of the electronic device 1.
  • the front cover 15 is made of resin, for example.
  • the front cover 15 may include a hole (space) in a portion that transmits sound from a speaker and a portion corresponding to a physical button used by the user.
  • the front cover 15 may be transparent at a portion corresponding to the display 14 or may be provided with a hole (space).
  • the front cover 15 may have a metal part.
  • the front cover 15 may be formed by insert molding metal into resin.
  • the Display 14 displays a screen.
  • the display 14 may be a liquid crystal display (Liquid Crystal Display), for example.
  • the display 14 may be an organic EL panel (Organic Electro-Luminescence Panel) or an inorganic EL panel (Inorganic Electro-Luminescence Panel).
  • the display 14 is a touch screen display.
  • the touch screen display detects a contact of a finger or a stylus pen and specifies the contact position.
  • the battery 13 supplies power to the electronic device 1.
  • the battery 13 is a lithium ion battery, for example.
  • the battery 13 may be a nickel cadmium battery or a nickel metal hydride battery.
  • the first substrate 12A and the second substrate 12B fix (mount) electronic components used in an electronic circuit in order to realize various functions of the electronic device 1.
  • the first substrate 12A is a main circuit substrate that is larger than the second substrate 12B.
  • the electronic device 1 according to the present embodiment includes the two substrates, the first substrate 12A and the second substrate 12B, it may include three or more substrates.
  • the resin casing 11 (resin casing 11A, resin casing 11B, and resin casing 11C) is a resin casing.
  • the resin casing 11 is formed with wiring including a signal line and a ground for electrically connecting the first substrate 12A and the second substrate 12B.
  • the signal line transmits a high frequency signal (hereinafter also referred to as an RF signal).
  • the wiring is formed by, for example, LDS (Laser Direct Structuring).
  • FIG. 1 illustrates a signal line (RF signal line 23) for transmitting an RF signal formed in the resin casing 11C.
  • the RF signal line of the first substrate 12A is electrically connected to the RF signal line 23 via the pin 16C.
  • the RF signal line of the second substrate 12B is electrically connected to the RF signal line 23 via the pin 16D. That is, the first substrate 12A is electrically connected to the second substrate 12B by the RF signal line 23 formed in the resin casing 11C.
  • the wiring is formed not only in the resin casing 11C but also in the resin casing 11A and the resin casing 11B.
  • a first antenna 21A (see FIG. 2) is formed on the surface in the z-axis positive direction in the resin casing 11A located at the end in the y-axis negative direction of the electronic device 1.
  • a second antenna 21B (see FIG. 2) is formed on the surface in the z-axis positive direction in the resin casing 11B located at the end in the y-axis positive direction of the electronic apparatus 1.
  • the rear cover 10 constitutes the outer peripheral portion of the back surface of the electronic device 1.
  • the rear cover 10 is made of resin, for example.
  • the rear cover 10 may be subjected to surface processing so that the user can easily grip it.
  • the rear cover 10 may have a metal part.
  • the rear cover 10 may be formed by insert molding metal into resin.
  • the pins 16A, 16B, 16C, 16D, 17C, 17D, 18C and 18D in FIG. 1 have conductivity.
  • the pin 16A is a conductive pin for transmitting an RF signal between the first substrate 12A and the resin casing 11A.
  • the pin 16B is a conductive pin for transmitting an RF signal between the second substrate 12B and the resin casing 11B.
  • the pin 16C is a conductive pin for transmitting an RF signal between the first substrate 12A and the resin casing 11C.
  • the pin 16D is a conductive pin for transmitting an RF signal between the second substrate 12B and the resin casing 11C.
  • the pins 17C and 18C are used to connect the ground of the first substrate 12A and the ground of the resin housing 11C.
  • the pins 17D and 18D are used to connect the ground of the second substrate 12B and the ground of the resin casing 11C.
  • FIG. 1 schematically shows components incorporated in the electronic device 1.
  • the electronic device 1 may not include all of the components shown in FIG. Further, the electronic apparatus 1 may include components not shown in FIG.
  • FIG. 2 is a schematic cross-sectional view of the electronic device 1 in the thickness direction (z-axis direction).
  • FIG. 2 shows a cross section of the electronic device 1 cut to include the pins 16A, 16B, 16C, and 16D.
  • FIG. 2 shows a cross section of a portion excluding the front cover 15 and the rear cover 10. 2 is the back side of the electronic device 1, and the lower side of the paper is the front side of the electronic device 1.
  • the first antenna 21A formed on the resin casing 11A and the second antenna 21B formed on the resin casing 11B are used to realize the wireless communication function of the electronic device 1 that is a smartphone.
  • the first antenna 21A and the second antenna 21B may be different from each other in at least one of a frequency band of a radio signal to be handled and a radio communication standard.
  • the first antenna 21A and the second antenna 21B may constitute a diversity antenna.
  • the processor 22 is an IC for wireless communication.
  • the processor 22 performs various types of signal processing on signals transmitted and received via the first antenna 21A and the second antenna 21B, and realizes a function (for example, a call function, a data transmission / reception function, etc.) as a smartphone of the electronic device 1.
  • the processor 22 is electrically connected to the pins 16A and 16C via an RF signal line formed on the first substrate 12A. Further, the pin 16D and the pin 16B are electrically connected by an RF signal line formed on the second substrate 12B.
  • the processor 22 is electrically connected to the pins 17C and 18C through the ground formed on the first substrate 12A.
  • the pins 17D and 18D are electrically connected via a ground formed on the second substrate 12B.
  • the pin 16A is electrically connected to the first antenna 21A through a through hole formed in the resin casing 11A.
  • the pin 16B is electrically connected to the second antenna 21B through a through hole formed in the resin casing 11B.
  • Other elements shown in FIG. 2 are the same as those in FIG.
  • the same elements as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.
  • antennas first antenna 21A and second antenna 21B
  • substrates first substrate 12A and second substrate 12B
  • the antenna overlaps at least one of the first substrate 12A and the second substrate 12B in the thickness direction of the electronic device 1. More specifically, the second antenna 21B and the second substrate 12B overlap in the z-axis direction.
  • the second substrate 12B needs to be spaced apart from the second antenna 21B in the z-axis direction in order to avoid interference with the electronic component to be mounted.
  • the pin 16B has the length of the z-axis direction corresponding to a fixed space
  • the first antenna 21A and the first substrate 12A have almost no overlap in the thickness direction of the electronic device 1. Therefore, the first substrate 12A can be brought closer to the first antenna 21A than the second substrate 12B.
  • the length of the pin 16A in the z-axis direction is shorter than that of the pin 16B.
  • the distance between the first substrate 12 ⁇ / b> A and the display 14 in the z-axis direction is wider than the distance between the second substrate 12 ⁇ / b> B and the display 14 in the z-axis direction.
  • the electronic apparatus of the comparative example includes one substrate 12C.
  • the substrate 12C corresponds to a combination of the first substrate 12A and the second substrate 12B of the electronic device 1 according to this embodiment. Since the substrate 12C overlaps with the second antenna 21B in the z-axis direction, the substrate 12C needs to be spaced apart from the second antenna 21B in the z-axis direction. And since the board
  • the substrate 12 ⁇ / b> C is connected not only to the second antenna 21 ⁇ / b> B but also to the first antenna 21 ⁇ / b> A with pins 16.
  • the length of the pin 16 in the z-axis direction is equal to the length of the pin 16B of the electronic device 1 according to the present embodiment in the z-axis direction.
  • the battery 13 is disposed between the substrate 12C and the display 14.
  • the thickness from the display 14 of the electronic device of the comparative example to the antenna (the first antenna 21A and the second antenna 21B) is t0.
  • the thickness t0 corresponds to the thickness when the battery 13 is disposed between the second substrate 12B and the display 14 in the electronic apparatus 1 according to the present embodiment. Therefore, the thickness t1 of the electronic device 1 according to the present embodiment is smaller than the thickness t0 of the electronic device of the comparative example.
  • the electronic apparatus 1 includes a plurality of substrates (first substrate 12A and second substrate 12B), and at least one substrate (first substrate 12A) is an antenna in the thickness direction of the electronic device 1. Does not overlap. And the battery 13 is arrange
  • the electronic device 1 since the electronic device 1 includes a plurality of substrates (the first substrate 12A and the second substrate 12B), wiring for electrically connecting the substrates is necessary.
  • the electronic device 1 forms wiring on the resin casing 11C in order to electrically connect the first substrate 12A and the second substrate 12B.
  • the electronic device 1 does not require a space for passing the coaxial cable and an additional member.
  • the electronic apparatus 1 according to the present embodiment contributes to downsizing.
  • FIG. 3 is an enlarged perspective view showing the connection between the first substrate 12A and the resin casing 11C of the electronic apparatus 1 according to the present embodiment.
  • the electronic device 1 uses pins 16A to 16D, 17C to 17D, and 18C to 18D for connection between the first substrate 12A or the second substrate 12B and the resin casing 11 (see FIG. 1). These pins are arranged as a set of three pins as in the example of pins 16C, 17C and 18C in FIG.
  • the electronic device 1 includes connection members (pins 16A to 16D) that connect at least one RF signal line of the first substrate 12A and the second substrate 12B and the RF signal line of the resin casing 11.
  • the electronic device 1 connects at least one ground of the first substrate 12A and the second substrate 12B and the ground of the resin housing 11 and has two grounds arranged with the connection members (pins 16C to 16D) interposed therebetween. Members (pins 17C to 17D and 18C to 18D).
  • the configurations of the connecting member and the ground member will be described below.
  • the width of the substrate is WS.
  • a ground member (ground pin) having a ground potential may be disposed near the RF signal connection member. This is because the impedance change in the RF signal line is reduced to reduce the reflection loss, and the power leaked into the air by the ground member is suppressed. That is, by arranging the grounding member near the RF signal connecting member, it is possible to expect a reduction in the RF signal passing loss. Here, it is preferable that the grounding member is disposed closer to the connection member.
  • FIG. 4 is a diagram illustrating RF signal pass characteristics when one ground member having a ground potential is arranged in the vicinity of the RF signal connection member.
  • the RF signal connection member and the ground member are arranged side by side in the width direction of the substrate (in the example of FIG. 3, the direction of WS).
  • the vertical axis in FIG. 4 represents the transmission coefficient.
  • the horizontal axis indicates the frequency of the high frequency signal.
  • a passage loss depending on WS which is the width of the substrate, is seen at a frequency of 1500 MHz or higher that can be used in a smartphone.
  • FIG. 5 is a diagram illustrating RF signal pass characteristics when two ground members having a ground potential are arranged in the vicinity of the RF signal connection member.
  • the RF signal connection member and the ground member are arranged side by side in the width direction of the substrate (in the example of FIG. 3, the direction of WS).
  • the two ground members are arranged with an RF signal connection member interposed therebetween.
  • the vertical axis represents the transmission coefficient.
  • the horizontal axis represents the frequency of the RF signal.
  • singular points corresponding to WS do not occur at all frequencies. This is presumably because resonance does not occur by arranging grounding members at both ends of the RF signal connecting member.
  • the electronic apparatus 1 is configured to include two ground members (pins 17C to 17D and 18C to 18D) arranged with a connection member (pins 16C to 16D) interposed therebetween. Therefore, regardless of the width of the substrate (the first substrate 12A or the second substrate 12B) to which the connecting member and the ground member are connected, there is no abrupt transmission loss (singular point) of the RF signal depending on the frequency. That is, the electronic device 1 according to the present embodiment can ensure a stable pass characteristic of a high-frequency signal.
  • FIG. 6 is a schematic cross-sectional view in the thickness direction (z-axis direction) of the electronic apparatus 1 according to the present embodiment.
  • FIG. 6 shows a cross section of the electronic device 1 cut so as to include the pins 16A and 16B.
  • the electronic device 1 according to the present embodiment has a cross-sectional structure in which the battery 13 and the first substrate 12A do not overlap in the thickness direction (z-axis direction) of the electronic device 1.
  • the processor 22 is mounted on the second substrate 12B, and is electrically connected to the pins 16B and 16D by the RF signal lines provided on the second substrate 12B.
  • the first board 12 ⁇ / b> A, the second board 12 ⁇ / b> B, and the battery 13 are arranged in parallel in the main surface direction (y-axis direction) of the electronic device 1.
  • the thickness t2 of the electronic device 1 according to the present embodiment is smaller than the thickness t1 of the electronic device 1 according to the first embodiment because there is no overlap in the z-axis direction between the battery 13 and the first substrate 12A.
  • the wiring to the resin casing 11 is integrally formed by, for example, LDS. Therefore, the electronic device 1 according to the present embodiment does not require a space for passing the coaxial cable and an additional member, and contributes to downsizing similarly to the first embodiment.
  • the electronic apparatus 1 according to the present embodiment can be configured to include two ground members (pins 17C to 17D and 18C to 18D) arranged with a connection member (pins 16C to 16D) interposed therebetween. At this time, the electronic apparatus 1 according to the present embodiment can ensure a stable pass characteristic of the RF signal, similar to the first embodiment.
  • the electronic device 1 includes two ground members (pins 17C to 17D and 18C to 18D) arranged with a connection member (pins 16C to 16D) interposed therebetween.
  • two grounding members are not necessarily provided for one connection member.
  • FIG. 4 it is possible to provide one grounding member for one connecting member by limiting the frequency band to a range where passage loss does not occur much.
  • the first substrate 12A, the second substrate 12B, and the battery 13 are one of these surfaces (the surface on the lower side in FIG. 6 and facing the display 14). Are arranged in parallel in the main surface direction so that the surfaces to be aligned are aligned.
  • the first substrate 12A that does not substantially overlap in the thickness direction (z-axis direction) of the first antenna 21A and the electronic device 1 can be closer to the first antenna 21A than the position shown in FIG. . That is, the electronic device 1 can take a configuration in which at least one of the first substrate 12A and the second substrate 12B is arranged in parallel with the battery 13 in the main surface direction.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Telephone Set Structure (AREA)
  • Support Of Aerials (AREA)
  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un dispositif électronique ayant une nouvelle structure contribuant à une réduction de taille. La présente invention comprend un premier substrat 12A, un second substrat 12B et un boîtier en résine 11. Un câblage, comprenant une ligne de signal pour connecter électriquement le premier substrat 12A et le second substrat 12B, est formé sur le boîtier en résine 11. Le câblage formé sur le boîtier en résine peut comprendre une masse. L'invention peut en outre comprendre un élément de connexion pour connecter le premier substrat 12A et/ou le second substrat 12B avec la ligne de signal, et un élément de mise à la terre pour connecter le premier substrat 12A et/ou le second substrat 12B à la masse.
PCT/JP2017/045206 2016-12-26 2017-12-15 Dispositif électronique WO2018123668A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016252026A JP6665081B2 (ja) 2016-12-26 2016-12-26 電子機器
JP2016-252026 2016-12-26

Publications (1)

Publication Number Publication Date
WO2018123668A1 true WO2018123668A1 (fr) 2018-07-05

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PCT/JP2017/045206 WO2018123668A1 (fr) 2016-12-26 2017-12-15 Dispositif électronique

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JP (1) JP6665081B2 (fr)
WO (1) WO2018123668A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008005037A (ja) * 2006-06-20 2008-01-10 Hitachi Metals Ltd アンテナ装置及びそれを用いた無線通信機器
JP2012044640A (ja) * 2010-08-13 2012-03-01 Samsung Electro-Mechanics Co Ltd 伝送線路パターンがケースに埋め込まれる電子装置及びその製造方法
WO2012074100A1 (fr) * 2010-12-03 2012-06-07 株式会社村田製作所 Circuit d'acheminement des signaux haute fréquence

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008005037A (ja) * 2006-06-20 2008-01-10 Hitachi Metals Ltd アンテナ装置及びそれを用いた無線通信機器
JP2012044640A (ja) * 2010-08-13 2012-03-01 Samsung Electro-Mechanics Co Ltd 伝送線路パターンがケースに埋め込まれる電子装置及びその製造方法
WO2012074100A1 (fr) * 2010-12-03 2012-06-07 株式会社村田製作所 Circuit d'acheminement des signaux haute fréquence

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JP2018107630A (ja) 2018-07-05

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