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WO2018107341A1 - Module de reconnaissance d'empreintes digitales pour la mise en œuvre d'un rétroéclairage au moyen d'une couche de guidage de lumière - Google Patents

Module de reconnaissance d'empreintes digitales pour la mise en œuvre d'un rétroéclairage au moyen d'une couche de guidage de lumière Download PDF

Info

Publication number
WO2018107341A1
WO2018107341A1 PCT/CN2016/109535 CN2016109535W WO2018107341A1 WO 2018107341 A1 WO2018107341 A1 WO 2018107341A1 CN 2016109535 W CN2016109535 W CN 2016109535W WO 2018107341 A1 WO2018107341 A1 WO 2018107341A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
fingerprint recognition
recognition module
panel
light guiding
Prior art date
Application number
PCT/CN2016/109535
Other languages
English (en)
Chinese (zh)
Inventor
易治明
向鹏
傅强
叶勇
Original Assignee
红蝶科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 红蝶科技(深圳)有限公司 filed Critical 红蝶科技(深圳)有限公司
Priority to PCT/CN2016/109535 priority Critical patent/WO2018107341A1/fr
Publication of WO2018107341A1 publication Critical patent/WO2018107341A1/fr

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/04—Signs, boards or panels, illuminated from behind the insignia
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials

Definitions

  • Fingerprint recognition module for backlight through light guiding layer
  • the present invention relates to a fingerprint identification module, in particular to a capacitive sensor type fingerprint recognition module or a radio frequency sensor type fingerprint recognition module in a product such as a smart phone, and more particularly, to a light guide layer Backlit fingerprint identification module.
  • the human fingerprint repetition rate is extremely small, about one-fifth of a billion, with the characteristics of "human identity card”; because of its lifetime immutability, uniqueness and convenience, it has almost become synonymous with biometric identification.
  • the application of fingerprint recognition technology is very extensive, especially the number of fingerprint recognition modules on smartphones, which is already very large. According to statistics, the monthly shipment volume of China's smart phone market is about 80 million, and the monthly shipment of mobile phone with fingerprint identification module is about 35 to 40 million.
  • a fingerprint sensor or a radio frequency sensor is generally used in the fingerprint recognition module 901 on the smart phone.
  • the panel of the fingerprint recognition module cannot be illuminated and cannot be illuminated to be presented.
  • Specific light transmission patterns such as corporate trademarks; if a specific light transmission pattern can be presented, the aesthetic effect and brand recognition of the fingerprint recognition module will be greatly improved.
  • FIG. 1 A typical structure of the fingerprint recognition module is shown in FIG. 1.
  • the fingerprint identification module 100 can be electrically connected to a motherboard inside the smart phone through the circuit board 104.
  • the upper portion of Fig. 1 is a panel 102 for a user to place a finger for fingerprint recognition.
  • Around the panel 102 is a ring of metal rings 103.
  • the length L and the width W of the panel 102 are approximately 10 mm.
  • the 2 is a side cross-sectional view of the fingerprint recognition module, wherein the fingerprint identification chip 203 is electrically connected to the circuit board 104.
  • the fingerprint recognition chip 203 is bonded to the panel 102 whose ink 201 is coated on the bottom surface by the adhesive layer 202.
  • the panel 102 (or cover plate) may be made of glass, sapphire, ceramic, resin, or the like.
  • the panel of the existing fingerprint recognition module cannot emit light due to its structural limitation.
  • the actual thickness dimension of each part is very small, wherein the thickness HI of the entire fingerprint recognition module is strictly controlled by the function of the implementation itself, and the limitation of the thinning of the mobile phone is generally only about 1 mm;
  • the thickness H5 of the layer 202 is between 0.01 and 0.02 mm;
  • the thickness H3 of the panel 102 is about 0.2 mm;
  • the thickness H4 is about 0.1 mm;
  • the identification thickness that the fingerprint recognition chip can support that is, the maximum vertical distance H2 from the upper surface of the die to the finger contact point, must be controlled within 0.35 mm. Therefore, adding any complicated micro optical structure will bring great troubles and cost increase to the mass production of the fingerprint identification module, and cannot meet the mass production needs.
  • the existing fingerprint recognition module technology mainly uses a capacitive sensor and a radio frequency sensor.
  • the material of the manufacturing module has strict dielectric or other performance requirements, and thus the illumination source cannot be placed at the center of the fingerprint recognition chip or Top, only on the side.
  • the only place that can be used for light transmission is to use a transparent adhesive layer 202, but its thickness is too thin, and there is a serious lack of effective path for light conduction, and the light of the light source cannot be transmitted to the panel to exhibit light transmission. pattern.
  • the present invention solves the problem that the panel of the existing fingerprint recognition module cannot emit light and cannot be illuminated to present a specific light-transmitting pattern.
  • the technical solution adopted by the present invention to solve the technical problem is: providing a fingerprint recognition module for implementing a backlight through a light guiding layer, comprising a circuit board, a fingerprint identification chip disposed on the circuit board, and
  • the fingerprint recognition chip includes a package material and a bare core, and further includes at least one light source connected to the circuit board; the panel is provided with at least one light transmissive area; a light guiding layer is disposed on the upper surface of the encapsulating material; the light emitted by the illuminating source is the light guiding layer with the light guiding layer as the main light guiding medium, and the light transmitting area from the panel after passing through the light guiding layer
  • the light guiding layer is at least one of: a diffusing surface provided on an upper surface of the encapsulating material and having a micro-optical structure; a guide plated on an upper surface of the encapsulating material and having a diffusing function or a fluorescent function a light film or a light guiding film; a
  • the encapsulating material may be made of a light transmissive material or a non-transparent material, and the light emitting source may be disposed outside the packaging material.
  • the encapsulating material is made of a light transmissive material
  • the light emitting source may also be packaged inside the encapsulating material together with the bare core.
  • the panel is attached to the upper surface of the fingerprint identification chip through a light-transmissive adhesive layer, and the light emitted by the illumination source passes through the light guiding layer and then through the bonding. Light transmission from the panel after the layer The area is shot.
  • a dimming material for adjusting a light-emitting effect may be provided in at least one of the following: in the encapsulating material, in the adhesive layer, on the top of the bare core, in the The bottom of the light transmissive area of the panel.
  • the dimming agent is a phosphor; or a microparticle and/or microporous that changes the direction and/or composition of light propagation.
  • the non-conductive reflective material may also be disposed in at least one of the following: a top of the bare core, and a non-transparent area at the bottom of the panel.
  • a high-reflection film and a reflective portion partially surrounding the light-emitting source to concentrate the light mainly toward the light-transmitting region may be further disposed. Any of a cover, or a mirror.
  • the light source may be any one of the following: a light emitting diode, a light emitting diode die, a laser, a laser die, a laser array die, an organic light emitting device, and an organic light emitting array device.
  • the light transmissive area may form a corporate trademark, a universal logo, or a specific light transmissive pattern.
  • the present invention can realize the backlight function of the fingerprint recognition module by using at least one illumination source as a backlight source in a limited space while satisfying the fingerprint recognition requirement, and can make the panel transparent.
  • the light-transmitting pattern formed by the light area emits light, thereby greatly improving the aesthetic degree and brand recognition of the fingerprint recognition module.
  • FIG. 1 is a schematic structural diagram of a conventional fingerprint recognition module
  • FIG. 2 is a side elevational cross-sectional view of the fingerprint recognition module of FIG. 1;
  • FIG. 3 is an exploded perspective view of a fingerprint identification module in a preferred embodiment of the present invention.
  • FIG. 4 is a schematic top plan view of a light source in the fingerprint recognition module of FIG. 3;
  • FIG. 5 is a side elevational cross-sectional view of the fingerprint recognition module of FIG. 3;
  • FIG. 6 is an exploded perspective view of a fingerprint identification module in another preferred embodiment of the present invention
  • 7 is a top plan view of a light source in the fingerprint recognition module shown in FIG. 6;
  • FIG. 8 is an enlarged side elevational cross-sectional view of the fingerprint recognition module of FIG. 6; [0025] FIG.
  • FIG. 9 is a schematic diagram of a fingerprint recognition module in a conventional smart phone.
  • FIG. 3 shows a preferred embodiment of the fingerprint identification module of the present invention.
  • a light transmissive area is formed on the panel 102, and the light transmissive area can form a light transmissive pattern 101.
  • the conventional fingerprint recognition module shown in Fig. 1 generally does not have this light transmission pattern 101 because it does not have a light transmitting function.
  • the light transmissive pattern 101 may be of a different shape, specifically a corporate logo, a universal logo, or other light transmissive pattern.
  • illumination sources 301, 302, 303, and 304 are disposed around the outside of the fingerprint recognition chip 203.
  • These light sources are physically connected to the circuit board 104 by soldering together with the fingerprint identification chip, and the top view effect is as shown in FIG. For specific implementation, the number and position of the light source can be adjusted accordingly.
  • the panel 102 is attached to the fingerprint recognition chip 203 through an adhesive layer.
  • the metal ring 103 surrounds the panel 102 and the fingerprint identification chip 203, and is also physically connected and electrically connected to the circuit board 104.
  • a light guiding film 305 having a diffusing function is provided, which is disposed on the upper surface of the encapsulating material of the fingerprint identifying chip, between the panel 102 and the fingerprint identifying chip 203.
  • the light guiding film is only one of the implementation manners.
  • a diffusing surface having a micro-optical structure may be disposed on the surface of the packaging material, or a light guiding film having a diffusing function or a fluorescent function may be disposed on the surface of the packaging material.
  • the bottom of the panel 102 is coated with black ink regions 501 and 502 by printing. A gap is left between the black ink areas, or a clear ink is used to form a light transmissive area, typically a specific light transmissive pattern 101.
  • the panel 102 with the ink areas 501, 502 and the light transmissive pattern 101 is attached to the fingerprint recognition chip by an adhesive layer 202.
  • the fingerprint identification chip is composed of a bare core 507 and an encapsulating material 508.
  • a light guiding film 305 having a diffusing function is added; and the encapsulating material 508 and the adhesive layer 202 are both light transmissive materials, specifically It is a colorless transparent material or a colored transparent material.
  • the light emitted by the light source is guided by the light guiding film 305 as a main light guiding medium, and can be emitted from the light transmitting pattern 101 on the panel 102 after the sealing material 508, the light guiding film 305, and the adhesive layer 202.
  • the encapsulating material therein may be made of a light transmissive material or a non-transparent material. In this embodiment, colorless is used. A transparent encapsulating material and mixing the dimming material into the encapsulating material. In other embodiments, the dimming material may also be disposed at the top 504 of the encapsulation material, or at the top 505 of the die 507, or at the bottom of the light transmissive region of the panel 202; when disposed at the bottom of the panel 202 ⁇ , mainly to cover the area where the light-transmitting pattern 101 is located.
  • the illumination sources 301, 303 are shown in FIG.
  • the light sources 301, 303 and other illumination sources not shown are physically and electrically connected to the circuit board 104.
  • the top of the light source 301, 303 is its illuminating center. From the viewpoint of light efficiency, the height of the illuminating center must be higher than the bare core 507 and lower than the bottom 503 of the panel.
  • the main direction of its illumination should be substantially toward the light transmissive pattern 101.
  • the light source may be a blue light emitting diode, such as a Group III nitride light emitting diode.
  • the phosphor can be selected from suitable phosphors. For example, there are two main types of red nitride phosphors, which are all miscellaneous nitrides.
  • the structure can be written as M 2 xSi 5 N 8 : xEu 2+
  • the light source and the light control may have various combinations, and those skilled in the art may change the type of the light source, the color and wavelength of the light, or change the type and ratio of the light control, as needed. Thereby changing the illuminating effect of the light transmitting pattern.
  • the dimming agent may be a phosphor or a microparticle and/or microporous which changes the direction and/or composition of light propagation.
  • micro-optical structures such as microparticles and micropores
  • there are many optical phenomena such as reflection, refraction, diffraction, scattering, and polarization of light; the weight of these phenomena varies with the size of the micropore; But in the final analysis, it changes the direction and composition of light.
  • Changing the direction of propagation means that the object is illuminated without directly seeing the light source.
  • Changing the composition means changing the wavelength and polarization of the constituent light. For example, you can see the blue and red sky, relying on the particles in the air. Scattering of sunlight.
  • a non-conductive reflective material may be disposed by coating, printing, plating, or the like to improve the light efficiency.
  • a non-conductive reflective material can be placed at the top 505 of the bare core.
  • reflective masks 50 6 and 509 are further provided to further improve the light effect.
  • FIG. 6 shows another preferred embodiment of the fingerprint recognition module of the present invention.
  • the light source 601 is integrated into the inside of the fingerprint recognition chip 203.
  • the fingerprint identification chip 203 is physically connected and electrically connected to the circuit board 104 by soldering.
  • the relative position of the top ⁇ is shown in Fig. 7.
  • the metal ring 103 surrounds the panel 102 and the fingerprint identification chip 203, and is also physically connected and electrically connected to the circuit board 104.
  • a light transmissive pattern 101 is provided on the panel 102.
  • the fingerprint identification chip 203 is packaged with a bare core 507 and a light source 601. As long as the normal operation of the bare core 507 is not affected, the number and position of the light source can be adjusted according to the needs, and is not limited to the number and position shown in Fig. 6 and Fig. 7.
  • the bottom of the panel 102 is coated with black ink regions 501 and 502 by printing. A gap is left between the black ink areas, or a clear ink is used to form the light transmitting pattern 101.
  • the panel 102 with the ink regions 501, 502 and the light transmissive pattern 101 is attached to the fingerprint recognition chip by an adhesive layer 202.
  • the fingerprint identification chip is composed of a bare core 507 and a packaging material 508, and a light guiding film 305 having a diffusing function is added; the light source 601 and other possible sources not shown are also packaged inside the packaging material 508.
  • the encapsulating material 508 is a light transmissive material, and specifically may be a colorless transparent material or a colored transparent material.
  • a reflector 901 is further provided to further improve the light effect.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)

Abstract

L'invention concerne un module de reconnaissance d'empreintes digitales permettant de mettre en œuvre un rétroéclairage au moyen d'une couche de guidage de lumière. Au moins une source d'émission de lumière (301, 302, 303, 304, 601) reliée à une carte de circuit imprimé (104) du module est en outre agencée. Une région de transmission de lumière est en outre agencée sur un panneau (102) du module ; en même temps, une couche de guidage de lumière ayant une fonction de diffusion ou de fluorescence est en outre agencée sur la surface supérieure d'un matériau d'emballage (508) d'une puce de reconnaissance d'empreintes digitales. La couche de guidage de lumière est un milieu de guidage de lumière principal pour la lumière émise par les sources d'émission de lumière (301, 302, 303, 304, 601), et la lumière est émise à partir de la région de transmission de lumière du panneau après avoir traversé la couche de guidage de lumière. Les sources électroluminescentes (301, 302, 303, 304, 601) peuvent être disposées à l'extérieur du matériau d'emballage (508) ou emballées à l'intérieur du matériau d'emballage (508) conjointement avec un noyau nu (507). Une fonction de rétroéclairage du module de reconnaissance d'empreintes digitales est mise en oeuvre dans un espace limité, et un motif de transmission de lumière (101) formé dans la région de transmission de lumière du panneau (102) peut émettre de la lumière.
PCT/CN2016/109535 2016-12-12 2016-12-12 Module de reconnaissance d'empreintes digitales pour la mise en œuvre d'un rétroéclairage au moyen d'une couche de guidage de lumière WO2018107341A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/109535 WO2018107341A1 (fr) 2016-12-12 2016-12-12 Module de reconnaissance d'empreintes digitales pour la mise en œuvre d'un rétroéclairage au moyen d'une couche de guidage de lumière

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/109535 WO2018107341A1 (fr) 2016-12-12 2016-12-12 Module de reconnaissance d'empreintes digitales pour la mise en œuvre d'un rétroéclairage au moyen d'une couche de guidage de lumière

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WO2018107341A1 true WO2018107341A1 (fr) 2018-06-21

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PCT/CN2016/109535 WO2018107341A1 (fr) 2016-12-12 2016-12-12 Module de reconnaissance d'empreintes digitales pour la mise en œuvre d'un rétroéclairage au moyen d'une couche de guidage de lumière

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109409346A (zh) * 2018-12-20 2019-03-01 苏州多感科技有限公司 一种指纹识别模组及其制备方法、电子设备
CN110598518A (zh) * 2019-06-25 2019-12-20 深圳市兆驰数码科技股份有限公司 一种指纹模组周圈导光圈

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090039241A1 (en) * 2007-08-07 2009-02-12 Hironori Ueki Biometric device and information terminal
CN104156711A (zh) * 2014-08-26 2014-11-19 南昌欧菲生物识别技术有限公司 指纹识别装置及终端设备
CN105184230A (zh) * 2015-08-14 2015-12-23 上海箩箕技术有限公司 光学指纹传感器和电子产品
CN105868710A (zh) * 2016-03-28 2016-08-17 南昌欧菲生物识别技术有限公司 指纹模组及设有该指纹模组的终端设备
CN106778598A (zh) * 2016-12-12 2017-05-31 红蝶科技(深圳)有限公司 具有背光的指纹识别模组
CN206270986U (zh) * 2016-12-12 2017-06-20 红蝶科技(深圳)有限公司 具有背光的指纹识别模组

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090039241A1 (en) * 2007-08-07 2009-02-12 Hironori Ueki Biometric device and information terminal
CN104156711A (zh) * 2014-08-26 2014-11-19 南昌欧菲生物识别技术有限公司 指纹识别装置及终端设备
CN105184230A (zh) * 2015-08-14 2015-12-23 上海箩箕技术有限公司 光学指纹传感器和电子产品
CN105868710A (zh) * 2016-03-28 2016-08-17 南昌欧菲生物识别技术有限公司 指纹模组及设有该指纹模组的终端设备
CN106778598A (zh) * 2016-12-12 2017-05-31 红蝶科技(深圳)有限公司 具有背光的指纹识别模组
CN206270986U (zh) * 2016-12-12 2017-06-20 红蝶科技(深圳)有限公司 具有背光的指纹识别模组

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109409346A (zh) * 2018-12-20 2019-03-01 苏州多感科技有限公司 一种指纹识别模组及其制备方法、电子设备
CN110598518A (zh) * 2019-06-25 2019-12-20 深圳市兆驰数码科技股份有限公司 一种指纹模组周圈导光圈

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