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WO2018199172A1 - Film protecteur - Google Patents

Film protecteur Download PDF

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Publication number
WO2018199172A1
WO2018199172A1 PCT/JP2018/016834 JP2018016834W WO2018199172A1 WO 2018199172 A1 WO2018199172 A1 WO 2018199172A1 JP 2018016834 W JP2018016834 W JP 2018016834W WO 2018199172 A1 WO2018199172 A1 WO 2018199172A1
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WO
WIPO (PCT)
Prior art keywords
protective film
layer
resin substrate
styrene
polyolefin
Prior art date
Application number
PCT/JP2018/016834
Other languages
English (en)
Japanese (ja)
Inventor
和房 小野寺
Original Assignee
住友ベークライト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友ベークライト株式会社 filed Critical 住友ベークライト株式会社
Priority to JP2018535189A priority Critical patent/JPWO2018199172A1/ja
Publication of WO2018199172A1 publication Critical patent/WO2018199172A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/02—Bending or folding
    • B29C53/04—Bending or folding of plates or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

Definitions

  • the present invention relates to a protective film that is used by being attached to a resin substrate when the resin substrate is subjected to hot bending under heating.
  • a lens for sunglasses provided with a resin substrate having a structure in which both sides of a polarizer are covered with a coating layer made of polycarbonate resin, polyamide resin or cellulose resin.
  • a lens for sunglasses is manufactured as follows, for example. First, a protective film is affixed on both surfaces of the said resin substrate which makes flat form by planar view. In this state, the resin substrate is punched into a predetermined shape such as a circular shape in plan view. Thereafter, the resin substrate is subjected to heat bending under heating. Then, the protective film is peeled off from the resin substrate subjected to the thermal bending. Thereafter, a polycarbonate layer is injection molded on the concave surface of the resin substrate. Thereby, the lens for sunglasses is manufactured.
  • This protective film includes, for example, a base material and an adhesive layer. Specifically, a protective film having a structure in which a base material mainly composed of a polyolefin-based resin is attached to the resin substrate via an adhesive layer mainly composed of polyethylene, ethylene-propylene copolymer, or the like. It has been proposed (see, for example, Patent Document 1).
  • the protective film having such a structure can be attached to the resin substrate without being peeled off at the time of punching the resin substrate and at the time of thermal bending (particularly at the time of thermal bending), but has the following problems. there were. That is, the protective film having the above-described configuration tends to increase the adhesion strength to the resin substrate after the thermal bending process. As a result, when the protective film is peeled off from the resin substrate, adhesive residue derived from the adhesive layer is generated on the resin substrate, which causes a problem of reducing the yield of the manufactured lens for sunglasses.
  • Such a problem occurs not only in the above-mentioned sunglasses lens but also in a resin substrate such as a lens provided in goggles and a visor provided in a helmet.
  • An object of the present invention is to be able to be stuck to a resin substrate without being peeled off during the heat bending process of the resin substrate, and when the protective film is peeled off from the resin substrate after the heat bending process, the adhesive residue derived from the adhesive layer
  • An object of the present invention is to provide a protective film capable of accurately suppressing or preventing the occurrence of selenium on a resin substrate.
  • the protective film is used by being attached to the resin substrate, A base material layer, and an adhesive layer that is located between the base material layer and the resin substrate and adheres to the resin substrate;
  • the said adhesion layer contains polyolefin and the styrene block elastomer whose content of styrene is 25 wt% or less,
  • the protective film characterized by the above-mentioned.
  • the polyolefin has a melt flow rate of 0.5 g / 10 min or more and 10.0 g / 10 min or less measured under the conditions of a heating temperature of 230 ° C. and a load of 2.16 kgf in accordance with JIS K7210.
  • the protective film according to any one of 1) to (3).
  • a coating layer composed of a single layer or a laminate having at least one of a polycarbonate resin layer, a polyamide resin layer, and a cellulose resin layer on both surfaces, one surface, or the other surface of the resin substrate.
  • the protective film according to any one of the above (1) to (6).
  • the adhesive residue can be adhered to the resin substrate without being peeled off during the heat bending process of the resin substrate, and when the protective film is peeled off from the resin substrate after the heat bending process, Can be accurately suppressed or prevented from occurring in the resin substrate. Therefore, when the resin substrate is applied to, for example, a resin substrate included in a sunglasses lens, the sunglasses lens can be manufactured with a high yield.
  • FIG. 1 is a schematic diagram for explaining a method of manufacturing a lens for sunglasses using a protective film.
  • FIG. 2 is a longitudinal sectional view showing a preferred embodiment of the protective film of the present invention.
  • the protective film of the present invention is a protective film that is used by being attached to the resin substrate when the resin substrate is subjected to a heat bending process under heating.
  • the protective film has a base material layer, and an adhesive layer that is located between the base material layer and the resin substrate and adheres to the resin substrate, and the adhesive layer contains a polyolefin and a content of styrene. Containing 25 wt% or less of a styrene block elastomer.
  • the adhesive layer included in the protective film By making the adhesive layer included in the protective film into such a configuration, it can be attached to the resin substrate without being peeled off during the heat bending process of the resin substrate, and the protective film is peeled off from the resin substrate after the heat bending process. It is possible to accurately suppress or prevent the adhesive residue derived from the adhesive layer from being generated on the resin substrate. Therefore, when the resin substrate is applied to, for example, a resin substrate included in a sunglasses lens, the sunglasses lens can be manufactured with a high yield.
  • FIG. 1 is a schematic diagram for explaining a method of manufacturing a lens for sunglasses using a protective film.
  • the upper side of FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.
  • a flat resin substrate 21 is prepared, and a protective film 10 (masking tape) is applied to both surfaces of the resin substrate 21, so that the protective film 10 is applied to both surfaces of the resin substrate 21.
  • a laminated body 100 is obtained (see FIG. 1A).
  • a resin substrate 21 including a polarizer 23 and a coating layer 24 is prepared.
  • the polarizer 23 functions as an optical element that extracts linearly polarized light having a polarization plane in a predetermined direction from unpolarized natural light.
  • the covering layer 24 covers both surfaces of the polarizer 23.
  • the coating layer 24 is constituted by a single layer or a laminate having at least one of a polycarbonate resin layer, a polyamide resin layer, and a cellulose resin layer such as triacetyl cellulose. .
  • the coating layer 24 is formed on both surfaces (both surfaces) of the polarizer 23, as well as the upper surface (one surface) and the lower surface (the other surface). It may be formed either.
  • the prepared laminate 100 that is, the resin substrate 21 is punched in the thickness direction with the protective film 10 applied to both surfaces of the resin substrate 21. .
  • the laminated body 100 is made into circular shape by planar view.
  • the laminated body 100 having a circular shape is subjected to hot bending under heating.
  • This hot bending process is usually performed by press forming or vacuum forming.
  • the resin substrate 21 includes the coating layer 24, and the coating layer 24 includes at least one of a polycarbonate resin layer, a polyamide resin layer, and a cellulose resin layer. Consists of the body.
  • the heating temperature (molding temperature) of the laminated body 100 (resin substrate 21) during the hot bending process is preferably about 110 ° C. or higher and 150 ° C. or lower in consideration of the melting or softening temperature of the coating layer 24.
  • it is set to about 140 ° C. or higher and 150 ° C. or lower.
  • the protective film 10 is peeled off from the heat-bent resin substrate 21, that is, the laminate 100, and the concave surface of the resin substrate 21 is made of polycarbonate resin.
  • the polycarbonate layer 30 is injection molded.
  • a polyamide layer made of a polyamide resin may be formed on the concave surface of the resin substrate 21 instead of the polycarbonate layer 30.
  • the lens 200 for sunglasses including the resin substrate 21 subjected to the thermal bending is manufactured.
  • the protective film of the present invention By applying the protective film of the present invention to the method for manufacturing a lens for sunglasses as described above, the resin substrate 21 in the step [2] and the step [3] without peeling off the protective film 10 from the resin substrate 21. Punching and thermal bending can be carried out, and the peeling of the protective film 10 from the resin substrate 21 in the step [4] can be accurately suppressed or the occurrence of adhesive residue derived from the adhesive layer 11 on the resin substrate 21 can be accurately suppressed or It can be implemented with prevention.
  • the protective film of the present invention will be described in detail.
  • the adhesion layer 11 should just contain polyolefin and the styrene block elastomer whose content of styrene is 25 wt% or less, and the structure of the base material layer 15 is not specifically limited.
  • the base material layer 15 is comprised with the laminated body of the 1st layer 16 and the 2nd layer 17 is demonstrated to an example.
  • FIG. 2 is a longitudinal sectional view showing a preferred embodiment of the protective film of the present invention.
  • the upper side of FIG. 2 is referred to as “upper” and the lower side is referred to as “lower”.
  • the protective film 10 includes a base material layer 15 and an adhesive layer 11 that is located between the base material layer 15 and the resin substrate 21 and adheres (bonds) to the resin substrate 21.
  • the base material layer 15 includes a first layer 16 located on the opposite side of the adhesive layer 11, that is, the mold side, and the adhesive layer 11 side, that is, the resin substrate 21. And a second layer 17 located on the side.
  • Adhesion layer 11 The adhesive layer 11 is positioned (intervened) between the base material layer 15 and the resin substrate 21 and adheres to the resin substrate 21.
  • the adhesive layer 11 has a function of bonding the base material layer 15 to the resin substrate 21.
  • the adhesive layer 11 contains polyolefin and a styrene block elastomer having a styrene content of 25 wt% or less.
  • the resin substrate 21 is peeled off when the protective film 10 is peeled from the resin substrate 21 in the step [4]. It is possible to accurately suppress or prevent the adhesive layer 11 from remaining on the surface. That is, it is possible to accurately suppress or prevent the occurrence of adhesive residue derived from the adhesive layer 11 in the resin substrate 21.
  • the styrene block elastomer (styrene elastomer having a styrene block) is not particularly limited, but is preferably a styrene-olefin-styrene block copolymer elastomer.
  • a styrene-olefin-styrene block copolymer is used as the styrene block elastomer containing styrene as a monomer component, and the styrene content is 25 wt% or less.
  • the resin in the step [4] is used. Generation of adhesive residue on the substrate 21 can be more accurately suppressed or prevented.
  • styrene-olefin-styrene block copolymer examples include styrene-isobutylene-styrene block copolymer (SIBS), styrene-ethylene-butylene-styrene block copolymer (SEBS), and styrene-butadiene-styrene block.
  • SIBS styrene-isobutylene-styrene block copolymer
  • SEBS styrene-ethylene-butylene-styrene block copolymer
  • SEBS styrene-ethylene-butylene-styrene block copolymer
  • the styrene content in the elastomer can be set to 25 wt% or less relatively easily, and the above-described effects can be obtained more reliably. it can.
  • the styrene content in the elastomer may be 25 wt% or less, but is preferably 10 wt% or more and 18 wt% or less.
  • the content of the elastomer in the adhesive layer 11 is not particularly limited, but is preferably set to 20 wt% or more and 80 wt% or less, more preferably 30 wt% or more and 60 wt% or less. Thereby, the effect acquired by making the adhesion layer 11 contain the styrene block elastomer whose content of styrene is 25 wt% or less can be exhibited more notably.
  • the adhesive layer 11 contains a polyolefin in addition to the styrene block elastomer having a styrene content of 25 wt% or less as described above.
  • the adhesive layer 11 contains polyolefin
  • the resin substrate 21 is punched and thermally bent in the step [2] and the step [3] without peeling off the protective film 10 from the resin substrate 21. While being able to do, peeling of the protective film 10 from the resin substrate 21 in the said process [4] can be implemented comparatively easily.
  • the melting point of the polyolefin is preferably 150 ° C. or higher, more preferably 155 ° C. or higher and 160 ° C. or lower.
  • the easy peelability of the protective film 10 from the resin substrate 21 can be expressed using peel strength.
  • the protective film 10 is attached to the coating layer 24 to obtain a laminate. Thereafter, the peel strength T 1 between the coating layer 24 and the protective film 10 measured in accordance with JIS C-6481: 1996 after storing the laminate at a temperature of 50 ° C. for 12 hours, and The peel strength T 2 between the coating layer 24 and the protective film 10 measured in accordance with JIS C-6481: 1996 after storing the laminate at a temperature of 150 ° C.
  • the step [2 ] And punching and thermal bending of the resin substrate 21 in the step [3] can be performed without peeling off the protective film 10 from the resin substrate 21, and the thermal history due to the thermal bending in the step [3] can be obtained. Even if the protective film 10 has passed, the protective film 10 can be reliably peeled from the resin substrate 21 in the step [4].
  • the polyolefin is not particularly limited, and for example, a polypropylene homopolymer (homopolymer), a polyethylene homopolymer, a propylene-ethylene block copolymer having an EPR phase (rubber phase), an ethylene-vinyl acetate block Examples thereof include a copolymer, an ethylene-ethyl acrylate block copolymer, an ethylene-methyl methacrylate block copolymer, and the like, and one or more of them can be used in combination. Among these, a polypropylene homopolymer (homopolymer) is preferable.
  • a polypropylene homopolymer can be obtained at a relatively low cost, and a polypropylene homopolymer having a melting point of 150 ° C. or higher can also be easily obtained. Moreover, if it is a homopolymer of a polypropylene, transparency can be provided to the adhesion layer 11. Therefore, when the base material layer 15 has transparency similarly, the protective film 10 can be provided with transparency. Therefore, when the protective film 10 is stuck on the resin substrate 21 in the step [1], it can be visually confirmed whether dust such as dust is interposed between the protective film 10 and the resin substrate 21. Therefore, it can prevent reliably that the laminated body 100 in which refuse exists after the said process [2] transfers. As a result, the yield of the obtained sunglasses lens 200 is improved.
  • the polyolefin has a melt flow rate (MFR) of 0.5 g / 10 min or more and 10.0 g / 10 min or less measured under the conditions of a heating temperature of 230 ° C. and a load of 2.16 kgf in accordance with JIS K7210. It is preferably 1.0 g / 10 min or more and 5.0 g / 10 min or less, more preferably 2.0 g / 10 min or more and 3.5 g / 10 min or less.
  • the melting point of each layer constituting the protective film 10 including the adhesive layer 11 is the melting point of each constituent material included in each layer (peak temperature by DSC measurement). The value determined by the sum of the ratios contained is taken as the melting point.
  • the average thickness of the adhesive layer 11 is preferably 5 ⁇ m or more and 40 ⁇ m or less, and more preferably 10 ⁇ m or more and 20 ⁇ m or less. Thereby, the function as the adhesion layer 11 mentioned above can be exhibited reliably.
  • Base material layer 15 is bonded to the resin substrate 21 (covering layer 24) through the adhesive layer 11.
  • the base material layer 15 functions as a functional layer (protective layer) that protects (masks) the resin substrate 21 during the punching and thermal bending of the resin substrate 21 in the step [2] and the step [3]. is there.
  • the base material layer 15 may have any configuration as long as it exhibits such a function, and may be a single layer or a laminate.
  • the base material layer 15 includes a first layer 16 located on the opposite side of the adhesive layer 11, that is, the mold side, and the adhesive layer 11 side, that is, the resin substrate 21. The case where it comprises with the laminated body which has the 2nd layer 17 located in the side is demonstrated.
  • first layer 16 is located on the opposite side of the adhesive layer 11, that is, on the mold side during the thermal bending in the step [3], and functions as the outermost layer for protecting the resin substrate 21.
  • the first layer 16 maintains excellent detachability from the mold after the thermal bending in the step [3], that is, the first layer 16 does not adhere to the mold (mold).
  • the melting point of the first layer 16 is preferably 150 ° C. or higher, more preferably about 155 ° C. or higher and 165 ° C. or lower.
  • the heating temperature of the coating layer 24 (resin substrate 21) during the thermal bending in the step [3] is preferably set to about 110 ° C. or more and 150 ° C. or less. Therefore, by setting the melting point of the first layer 16 as described above, it is possible to reliably prevent the first layer 16 from being melted or softened during the thermal bending in the step [3]. Therefore, the laminate 100 can be reliably detached from the mold after the thermal bending in the step [3].
  • Such a constituent material of the first layer 16 is preferably a thermoplastic resin having a melting point of 150 ° C. or higher, and more preferably a polyolefin having a melting point of 150 ° C. or higher.
  • fusing point of the 1st layer 16 can be easily set to 150 degreeC or more.
  • the 2nd layer 17 mentioned later is also set as the structure containing polyolefin, the adhesiveness of the base material layer 15 (1st layer 16 and 2nd layer 17) and the adhesion layer 11 can be improved. Since it can do, it can suppress or prevent exactly that peeling arises in each layer with which the protective film 10 is provided.
  • fusing point of 150 degreeC or more is mentioned among the polyolefin contained in the adhesion layer 11 mentioned above, for example.
  • the average thickness of the first layer 16 is preferably 10 ⁇ m or more and 50 ⁇ m or less, and more preferably 15 ⁇ m or more and 35 ⁇ m or less. Thereby, the function as the 1st layer 16 mentioned above can be exhibited reliably.
  • the second layer 17 is located on the adhesive layer 11 side, that is, on the resin substrate 21 side, and functions as an intermediate layer located between the adhesive layer 11 and the first layer 16.
  • the second layer 17 is in a melted / softened state during the thermal bending in the step [3], and the first layer 16 protrudes at the edge of the curved surface of the laminated body 100 by the thermal bending of the laminated body 100.
  • the base layer 15 is provided for the purpose of functioning as an intermediate layer for forming the gripping white. For this reason, it is preferable that melting
  • the heating temperature of the coating layer 24 (resin substrate 21) during the thermal bending in the step [3] is preferably set to about 110 ° C. or more and 150 ° C. or less.
  • the second layer 17 can be surely brought into a molten or softened state during the thermal bending in the step [3]. Accordingly, in the step [3], the second layer 17 functions as an intermediate layer in a molten or softened state, and the first layer 16 is displaced with respect to the surface direction of the resin substrate 21. Can be. As a result, grabbing scissors by the first layer 16 are formed at the edge of the stacked body 100. Therefore, since peeling of the protective film 10 in the said process [4] can be implemented by grasping and holding this white, this peeling can be performed easily.
  • the length of the gripping white and L 1, a diameter in plan view after it has been bent heat and L 2 laminate 100 forms a circular shape in plan view by the step [3], the step [3] (L 1 / L 2 ) ⁇ 100 is preferably 0.1% or more and 1% or less, and preferably 0.2% or more, when the curvature radius R of the laminated body 100 heat-bent by is set to 8.5 cm. More preferably, it is 0.5% or less.
  • the protective film 10 in the step [4] can be reliably peeled off using the gripping white formed in the step [3].
  • Such a constituent material of the second layer 17 is preferably a thermoplastic resin having a melting point of less than 120 ° C, and more preferably a polyolefin having a melting point of less than 120 ° C.
  • fusing point of the 2nd layer 17 can be easily set to less than 120 degreeC.
  • the first layer 16 described above also includes a polyolefin, the adhesion between the base material layer 15 (the first layer 16 and the second layer 17) and the adhesive layer 11 can be improved. Since it can do, it can suppress or prevent exactly that peeling arises in each layer with which the protective film 10 is provided.
  • the polyolefin having a melting point of less than 120 ° C. includes a polyolefin having a melting point of less than 120 ° C. among the polyolefins contained in the adhesive layer 11 described above. Examples thereof include a polyethylene homopolymer having a melting point of less than 120 ° C., an ⁇ -olefin / polyethylene copolymer, an ⁇ -olefin / polypropylene copolymer, and the like.
  • the average thickness of the second layer 17 is preferably 10 ⁇ m or more and 60 ⁇ m or less, and more preferably 15 ⁇ m or more and 30 ⁇ m or less. Thereby, the function as the 2nd layer 17 mentioned above can be exhibited reliably.
  • each of the adhesive layer 11 and the base material layer 15 (the first layer 16 and the second layer 17) included in the protective film 10 described above includes an antioxidant, a light Various additives such as a stabilizer and an antistatic agent may be contained. Further, an intermediate layer containing the above-described additives and the like may be formed between these layers.
  • the protective film 10 described above may be manufactured by any method, for example, it can be manufactured by using a coextrusion method.
  • the protective film 10 is manufactured by supplying the obtained laminated body to the sheet
  • each layer which comprises a protective film can be substituted with the layer of the arbitrary structures which can exhibit the same function.
  • the protective film of the present invention is used by being attached to a resin substrate when the resin substrate included in the lens for sunglasses is hot-bent has been described.
  • the protective film of the present invention can be applied to thermal bending of a resin substrate included in such a lens for sunglasses, and is also used when, for example, a resin substrate such as a lens provided in goggles or a visor provided in a helmet is thermally bent. be able to.
  • an adhesive layer forming material is prepared by kneading SEBS having a styrene content of 12 wt% and random polypropylene having a melting point of 145 ° C. so that the SEBS content is 50 wt%. (Resin composition) was prepared.
  • Example 2A to Example 7A Comparative Example 1A to Comparative Example 3A
  • Example 2A to Example 7A and Comparative Example 1A to Comparative Example 3A were the same as Example 1A, except that the average thickness of the adhesive layer in each laminate was changed as shown in Table 1. A protective film was obtained.
  • A The peel strength is 0.10 N / 25 mm or more and 1.5 N / 25 mm or less.
  • B The peel strength is 0.05 N / 25 mm or more and less than 0.10 N / mm, or 1.5 N / 25 mm or more and 3.0 N / 25 mm or less.
  • C The peel strength is less than 0.05 N / 25 mm or more than 3.0 N / 25 mm.
  • the laminate was thermally bent by vacuum forming.
  • the protective film was peeled from the polycarbonate substrate, and the presence or absence of the adhesive residue in a polycarbonate substrate was observed after that. And the observation result of the presence or absence of adhesive residue was evaluated based on the following evaluation criteria.
  • a styrene-olefin-styrene block copolymer having a styrene content of 25 wt% or less was used as the elastomer in the adhesive layer of the protective film.
  • the protective film in each Example in the laminate of the polycarbonate substrate and the protective film after heat bending, the protective film can be easily peeled from the polycarbonate substrate without any adhesive residue remaining on the polycarbonate substrate. Became clear.
  • the protective film in each comparative example an elastomer not containing styrene or a styrene-olefin-styrene block copolymer having a styrene content exceeding 25 wt% was used as the elastomer contained in the adhesive layer. For this reason, in the protective film in each comparative example, when the protective film was peeled off from the polycarbonate substrate, a clear adhesive residue was observed on the polycarbonate substrate.
  • Example 2B to Example 13B In the step [1B], the type of polyolefin used in place of the 158 ° C. homopolypropylene (Nobrene FS2011DG2), the content of the elastomer contained in the adhesive layer forming material prepared in the step [1B], in the step [3B] Protective films of Examples 2B to 13B were obtained in the same manner as in Example 1B except that the average thickness of the adhesive layer in the laminate to be formed was changed as shown in Table 2.
  • the obtained laminate was stored under the conditions of a temperature of 50 ° C. and a time of 12 hours, and then the peel strength T 1 between the polycarbonate substrate and the protective film was measured according to JIS C-6481: 1996.
  • a resin substrate (Sumitomo Bakelite, manufactured by Sumitomo Bakelite Co., Ltd.) having a polarizer held between two polycarbonate substrates (polycarbonate layer), respectively. “P1352”) was prepared.
  • Each protective film was bonded to both surfaces of each resin substrate using a roll under the condition of a load of 0.5 kg / cm 2 , and a laminate was obtained by attaching the protective film.
  • the obtained laminate was stored under the conditions of a temperature of 150 ° C. and a time of 5 minutes, and then the peel strength T 2 between the polycarbonate substrate and the protective film was measured according to JIS C-6481: 1996.
  • the adhesive residue can be adhered to the resin substrate without being peeled off during the heat bending process of the resin substrate, and when the protective film is peeled off from the resin substrate after the heat bending process, It is possible to provide a protective film capable of accurately suppressing or preventing the occurrence of selenium on the resin substrate. Therefore, the present invention has industrial applicability.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

L'invention concerne un film protecteur (10) qui est utilisé collé sur un substrat en résine (21), lors du cintrage thermique du substrat en résine (21) sous de la chaleur. Le film protecteur (10) comprend une couche de matériau de base et une couche adhésive disposée entre cette couche de matériau de base et le substrat en résine (21) et adhérant au substrat en résine (21). La couche adhésive contient une polyoléfine et un élastomère séquencé de styrène ayant une teneur en styrène inférieure ou égale à 25 % en poids.
PCT/JP2018/016834 2017-04-25 2018-04-25 Film protecteur WO2018199172A1 (fr)

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JP2017086683 2017-04-25
JP2017-086683 2017-04-25

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WO2018199172A1 true WO2018199172A1 (fr) 2018-11-01

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018183922A (ja) * 2017-04-25 2018-11-22 住友ベークライト株式会社 保護フィルム
JPWO2018199173A1 (ja) * 2017-04-25 2019-06-27 住友ベークライト株式会社 保護フィルム
WO2020040189A1 (fr) * 2018-08-21 2020-02-27 住友ベークライト株式会社 Film protecteur
WO2020203214A1 (fr) * 2019-03-29 2020-10-08 東レフィルム加工株式会社 Film stratifié

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003145616A (ja) * 2001-11-12 2003-05-20 Mitsubishi Gas Chem Co Inc ポリカーボネート板の保護フィルム
JP2010275340A (ja) * 2009-05-26 2010-12-09 Tohcello Co Ltd 表面保護フィルム
WO2011122288A1 (fr) * 2010-03-31 2011-10-06 東レフィルム加工株式会社 Film de protection de surface
WO2014054700A1 (fr) * 2012-10-05 2014-04-10 東洋紡株式会社 Film de protection de surface auto-adhésif
WO2014189078A1 (fr) * 2013-05-24 2014-11-27 三菱瓦斯化学株式会社 Feuille fonctionnelle dotée d'un film protecteur
WO2015129426A1 (fr) * 2014-02-28 2015-09-03 東レフィルム加工株式会社 Film de protection de surface pour procédé de chauffage

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003145616A (ja) * 2001-11-12 2003-05-20 Mitsubishi Gas Chem Co Inc ポリカーボネート板の保護フィルム
JP2010275340A (ja) * 2009-05-26 2010-12-09 Tohcello Co Ltd 表面保護フィルム
WO2011122288A1 (fr) * 2010-03-31 2011-10-06 東レフィルム加工株式会社 Film de protection de surface
WO2014054700A1 (fr) * 2012-10-05 2014-04-10 東洋紡株式会社 Film de protection de surface auto-adhésif
WO2014189078A1 (fr) * 2013-05-24 2014-11-27 三菱瓦斯化学株式会社 Feuille fonctionnelle dotée d'un film protecteur
WO2015129426A1 (fr) * 2014-02-28 2015-09-03 東レフィルム加工株式会社 Film de protection de surface pour procédé de chauffage

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018183922A (ja) * 2017-04-25 2018-11-22 住友ベークライト株式会社 保護フィルム
JPWO2018199173A1 (ja) * 2017-04-25 2019-06-27 住友ベークライト株式会社 保護フィルム
US11396615B2 (en) 2017-04-25 2022-07-26 Sumitomo Bakelite Co., Ltd. Protective film
WO2020040189A1 (fr) * 2018-08-21 2020-02-27 住友ベークライト株式会社 Film protecteur
JP2020037184A (ja) * 2018-08-21 2020-03-12 住友ベークライト株式会社 保護フィルム
US11584870B2 (en) 2018-08-21 2023-02-21 Sumitomo Bakelite Co., Ltd. Protective film
WO2020203214A1 (fr) * 2019-03-29 2020-10-08 東レフィルム加工株式会社 Film stratifié
JPWO2020203214A1 (fr) * 2019-03-29 2020-10-08
JP7496309B2 (ja) 2019-03-29 2024-06-06 東レフィルム加工株式会社 積層フィルム

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