WO2018192182A1

WO2018192182A1 - Chip surface temperature measuring system and method, and computer storage medium

Info

Publication number: WO2018192182A1
Application number: PCT/CN2017/103639
Authority: WO
Inventors: 李丛丛
Original assignee: 深圳市中兴微电子技术有限公司
Priority date: 2017-04-19
Filing date: 2017-09-27
Publication date: 2018-10-25
Also published as: CN108731827A

Abstract

A chip surface temperature measuring system and method, and a computer storage medium. The system comprises: a programmable logic array module (01), configured to configure operating states of a chip by means of dynamic simulation, and receive a chip surface temperature numerical value obtained by measuring; a chip socket module (02), configured to accommodate a chip to be tested, the chip socket module (02) being connected to the programmable logic array module (01) by means of a connection module (10) having multiple sockets; a temperature sensing module (03), configured to measure the surface temperatures of the chip to be tested in various operating states, and send the chip surface temperature numerical values, obtained by measuring, to the programmable logic array module (01); and a power supply module (04), connected to both the programmable logic array module (01) and the chip socket module (02), to supply a power source for a circuit. The power supply module (04) supports the pulse width modulation technology, such that when the surface temperature of a chip to be tested is higher than a present value, the system is configured to use the programmable logic array module (01) to control the power supply module (04) to reduce power consumption so as to reduce the temperature of the chip to be tested.

Description

Chip surface temperature measuring system and method, computer storage medium

Cross-reference to related applications

The present application is based on a Chinese patent application filed on Jan. 19, 2017, filed on Apr.

Technical field

The invention relates to the field of chip physical property measurement, in particular to a chip surface temperature measuring system and method, and a computer storage medium.

Background technique

In modern life, electronic equipment has penetrated into civil, industrial, military and other aspects. The reliability of the operation of electronic equipment plays an increasingly important role in people's lives; especially in military equipment, damage to any small component can cause incalculable losses. The main form of failure of electronic equipment is thermal failure. As the temperature increases, its failure rate increases exponentially. In the electronics industry, every 10 degrees increase in device ambient temperature often increases its failure rate by an order of magnitude. This is called the "10 degree rule." According to the related literature, 55% of the failure rate of the electronic device is caused by the temperature exceeding a predetermined value. Therefore, even if the electronic device is lowered by 1 degree, the failure rate of the device is reduced by a considerable amount. This is especially important for electronic systems with high reliability requirements. For example, for every 1 degree reduction in civil aviation electronic equipment, its failure rate will drop by 4% at a certain temperature. Therefore, it is very important to obtain the surface temperature of the chip in various working states. A reliable chip surface temperature measuring system is very important for chip development, verification, manufacturing, and inspection.

Modern large-scale integrated circuit chips, whether digital or analog, RF, are modular The direction of integration is developing, and the working mode of the chip is very much. If each working mode is to be a printed circuit board, the program is burned, and then the surface temperature of the chip is measured, which is time-consuming and labor-intensive, and is not in the R&D design stage of the chip. realistic. Therefore, how to measure the surface temperature of the chip, improve the measurement efficiency, and ensure the smooth progress of the measurement work has become a problem that the technician needs to consider.

Summary of the invention

The following is an overview of the topics detailed in this document. This Summary is not intended to limit the scope of the claims.

The embodiment of the invention provides a chip surface temperature measuring system and method, and a computer storage medium, which can measure the surface temperature of the chip and improve the measuring efficiency.

In order to achieve the above object, an embodiment of the present invention provides a chip surface temperature measuring system, including:

The programmable logic array module is configured to configure the working state of the chip through dynamic simulation, and receive the measured surface temperature value of the chip;

a chip socket module configured to place a chip to be tested, wherein the chip socket module and the programmable logic array module are connected by a connection module having a plurality of sockets;

a temperature sensing module configured to measure a surface temperature of the chip to be tested in each working state, and send the measured chip surface temperature value to the programmable logic array module;

The power supply module is respectively connected to the programmable logic array module and the chip socket module to provide power for the circuit, and the power supply module supports a pulse width modulation technology, and is configured to pass when the surface temperature of the chip to be tested is higher than a preset value. The programming logic array module controls the power supply module to reduce power consumption to lower the temperature of the chip to be tested.

In order to achieve the above object, an embodiment of the present invention further provides a method for measuring a surface temperature of a chip, including:

Obtain the type of chip to be tested;

Obtaining pre-stored simulated working mode parameters according to the type of the chip to be tested;

Sending the simulated working mode parameter to the chip to be tested;

Obtain temperature data of the chip to be tested in various working modes.

Embodiments of the present invention also provide a computer storage medium storing computer executable instructions that are implemented when the computer executable instructions are executed.

The chip surface temperature measuring system and method and the computer storage medium provided by the embodiments of the present invention realize automatic measurement of the surface temperature of the chip to be tested in the chip design or screening stage, and obtain physical characteristics of the chip to be tested, thereby providing powerful design for the chip design. reference. The chip socket module provided by the embodiment of the invention can be used to place a plurality of chips to be tested. The programmable logic array module provided by the embodiment of the invention can dynamically simulate the working state of various chips, and is implemented with a bus connection module having multiple interfaces. Various working state parameters are sent to the chip to be tested, thereby obtaining temperature data of the chip to be tested under various working states. Therefore, compared with the prior art, the embodiment of the present invention can realize measurement of a plurality of chips to be tested, improve work efficiency, and facilitate chip designers to evaluate chip temperature characteristics. In order to protect the test chip, the embodiment of the present invention also provides three kinds of feedback (down voltage, frequency reduction, fan speed) to adjust the working temperature of the chip, thereby ensuring smooth and reliable test work without causing excessive temperature of the chip. And the consequences of the damage.

Other aspects will be apparent upon reading and understanding the drawings and detailed description.

DRAWINGS

The drawings are used to provide a further understanding of the technical solutions of the present application, and constitute a part of the specification, which is used together with the embodiments of the present application to explain the technical solutions of the present application, and does not constitute a limitation of the technical solutions of the present application. In the drawing:

FIG. 1 is a schematic structural diagram of a chip surface temperature measuring system according to an embodiment of the present invention.

2 is a schematic diagram of an application scenario of an audio-video SOC (system on a chip) in which a chip to be tested is a first application example of the present invention.

FIG. 3 is a schematic diagram of an application scenario in which a chip to be tested is a digital analog hybrid circuit according to a second application example of the present invention.

4 is a schematic diagram of an application scenario in which a chip to be tested is a protocol interface circuit according to a third application example of the present invention.

FIG. 5 is a schematic diagram of a table in which the programmable logic array module measures the surface temperature of the chip after the completion of the programmable logic array module in the embodiment of the present invention.

The implementation, functional features and advantages of the present application will be further described with reference to the accompanying drawings.

detailed description

It is understood that the specific embodiments described herein are merely illustrative of the application and are not intended to be limiting.

It should be noted that, in the case of no conflict, the features in the embodiments and the embodiments in the present application may be arbitrarily combined with each other.

Referring to FIG. 1 , it is a schematic structural diagram of a chip surface temperature measuring system according to an embodiment of the present invention. The chip surface temperature measuring system of this embodiment includes:

The programmable logic array module 01 is configured to configure the working state of the chip through dynamic simulation, and receive the measured surface temperature value of the chip;

The chip socket module 02 is configured to place a chip to be tested, and is connected to the programmable logic array module 01 through a connection module 10 having a plurality of sockets;

The temperature sensing module 03 is configured to measure the surface temperature of the chip to be tested in each working state, and send the measured temperature value to the programmable logic array module 01;

The power supply module 04 is respectively connected to the programmable logic array module 01 and the chip socket module 02 to provide power for the circuit, and the power supply module 04 supports a pulse width modulation technology, and the surface temperature of the chip to be tested is higher than a preset value. Reduce the temperature of the chip to be tested by reducing power consumption;

Considering that the model of the chip under test is as rich as possible, the basic indicators for selecting a programmable logic chip include the number of logic cells (equivalent number of logic gates), the number of available I/O pins, and the on-chip memory resources (embedded hard) Core block RAM and distributed RAM), clock management unit (PLL and DCM), High-speed I/O interface module (MGT), embedded hard core multiplier (DSP segment element), embedded hard CPU.

In this embodiment, the chip socket module 02 can be docked with a plurality of chips, so that various systems can be temperature tested using the system of the present invention. Considering the rapid development of the modern chip industry, all kinds of packages have been widely applied and developed. A single chip socket cannot be used to unify various chips. Therefore, it is necessary to customize the chips according to the characteristics of various chips, such as application manuals of various chips. socket.

The temperature sensor can use a PT100-based Huygens bridge circuit to sense temperature changes, and then transmit the temperature data to the programmable logic array module 01 through an analog-to-digital converter for processing. Of course, the temperature sensor can also adopt other The type of the embodiment of the present invention is not limited thereto.

The power supply module 04, in addition to providing a power supply function, also adjusts the voltage of the power supply by PWM (Pulse Width Modulation) technology. When the temperature of the chip to be tested is higher than the maximum value of the chip manufacturing trademark, the programmable logic array module lowers the PWM. The frequency to achieve the purpose of cooling, thus protecting the chip from damage.

In this embodiment, the chip surface temperature measurement system further includes:

The clock module 05 is respectively connected to the programmable logic array module 01 and the chip socket module 02, and configured to provide a clock reference for the digital circuit when the chip to be tested is a digital circuit, and the surface temperature of the chip to be tested is higher than the pre-measurement When the value is set, the temperature of the chip to be tested is lowered by lowering the clock frequency. Among them, especially the frequency reduction effect of the main clock is very obvious; the clock module 05 can be an integrated clock chip or a discrete phase-locked loop circuit.

The variable speed fan module 06 is respectively connected to the programmable logic array module 01 and the chip socket module 02, and configured to pass the negative feedback by the programmable logic array module 01 when the surface temperature of the chip to be tested is higher than a preset value. The temperature adjustment controls the speed of the speed control fan to reduce the temperature.

If the chip to be tested is used with a fan, the fan speed data can be used to give suggestions for future use.

a storage module 07 and/or a display module 08, the storage module 07 is connected to the programmable logic array module 01, configured to store measured chip temperature data to be tested; the display module 08, and the programmable logic The array module 01 is connected and configured to output and display the chip temperature data to be tested.

The storage module 07 and the storage module may include at least one type of storage medium including a flash memory, a hard disk, a card type memory (eg, SD, TF memory, etc.), a multimedia card, a random access memory (RAM), and the like. Programmable Read Only Memory (PROM), Static Random Access Memory (SRAM), Electrically Erasable Programmable Read Only Memory (EEPROM), Read Only Memory (ROM), and the like.

The display module 08 may include at least one of a liquid crystal display (LCD), a thin film transistor LCD (TFT-LCD), an organic light emitting diode (OLED) display, a flexible display, and the like. According to a particular embodiment, display module 08 may include two or more display units, and display module 08 may include a touch screen configured to detect touch operations.

The alarm device 09 is connected to the programmable logic array module 01 and configured to send an alarm message when the temperature of the chip to be tested is higher than a preset value. It can be a speaker, a buzzer or an LED flashing light.

In this embodiment, the connection module 10 is a bus structure including a plurality of interfaces configured to implement physical connection between the programmable logic array and the chip to be tested.

Embodiments of the invention are digital systems based on programmable logic arrays. Modern large-scale integrated circuit chips, whether digital or analog, or RF, are moving in the direction of modular integration. There are many working modes of the chip. If each working mode is to be a printed circuit board, the programming program, Re-measuring the temperature, time and labor, is unrealistic in the R&D design phase of the chip. this invention The programmable logic array module 01 provided by the embodiment is rich in logic, peripherals and IO resources, and can solve this problem well.

In the embodiment of the present invention, the programmable logic array module 01 can update the digital logic circuit in real time by updating the code. The tester prepares a series of automated test cases for pre-existing by consulting the function manual of the chip to be tested. During the test, the high-speed chip socket 02 is connected to the chip to be tested, and the digital logic code is updated. The working mode of the chip to be tested is configured by connecting the bus of the module 10, including the normal design working state and the stress test before the chip leaves the factory, and then passed. The temperature sensor 03 installed in the chip socket 02 converts the measured analog signal into a digital signal, and the obtained temperature of the chip to be tested is transmitted back to the programmable logic array module 01.

In the temperature measurement process, the programmable logic array module 01 is rich in logic resources and is used to implement negative feedback control of the chip surface temperature. The measurement system of the invention can realize the negative feedback adjustment of the chip temperature through three kinds of modules, so as to ensure that the chip is not damaged during the measurement process. First, the programmable logic array module 01 controls the power supply module 04 of the circuit to be tested, and adjusts the voltage of the power supply by PWM (Pulse Width Modulation) technology. When the temperature is higher than the maximum value of the chip manufacturing trademark, the programmable logic array module 01 The frequency of the PWM is lowered. Second, the programmable logic array module 01 controls the clock module 05 of the circuit to be tested, and the frequency of the clock is configured by the control word. When the temperature is higher than the preset maximum value, the programmable logic array module 01 is lowered. The frequency of the clock, especially the frequency of the main clock, is very obvious. Third, the programmable logic array module 01 controls the speed of the speed regulating fan 06 mounted on the chip socket 02. When the temperature is higher than the preset maximum value, The programmed logic array module 01 increases the speed of the fan. If all three methods have been tried, the temperature is still higher than the maximum value of the chip manufacturing trademark, and the programmable logic array module 01 disconnects the power supply module 04 of the chip to be tested, and issues an alarm through the alarm device 09 to achieve the purpose of protecting the test chip.

After the programmable logic array module 01 measures the surface temperature of the chip, the data is intelligently organized into a format as shown in FIG. 5, displayed by the liquid crystal display of the display module 08 of the system, and stored in the storage module 07, such as erasable. In addition to the memory, it is convenient for the chip designer to view the summary. Evaluate the temperature physics of the chip.

The technical solutions of the present invention are exemplarily described below through examples in specific applications.

It should be noted that, in the following three application examples, only the programmable logic array module and different types of chips to be tested are shown in the drawings, and the programmable logic array and the chip to be tested are illustrated in various application examples. The connection module performs the working process after the connection, and other modules relating to the embodiment of the present invention are consistent with the description of the above embodiment. After the programmable logic array module is connected to the chip socket to be tested through the connection module, the programmable logic array module configures the working mode, measures by the temperature sensor, and records the surface temperature of the chip by the programmable logic array module.

Example 1:

Referring to FIG. 2, FIG. 2 is a schematic diagram of an application scenario in which a chip to be tested is an audio-video SOC (system on a chip) according to a first application example of the present invention.

In this application example, the chip to be tested is an audio and video on-chip system chip, and the peripheral resources are relatively abundant. The application scenarios of the audio and video on-chip system commonly used in the market are very diverse, and the number of chip pins is very large. Since the programmable logic array provided by the embodiment of the present invention has many types of peripherals, and the number of pins is a limit state supported by the package, it can be fully connected to the chip to be tested.

The audio and video file 01 is a file that can be read by the system of audio and video on-chip stored by the programmable logic array. The configuration interface 02 is the UART, JTAG, I2C, SPI, etc. of the audio and video on-chip system. In this application example, the logic code is written in the programmable logic array module according to the chip manual to be tested, and the control audio and video file 01 is downloaded through the configuration interface 02. The audio and video on-chip system operates. And the peripheral interface can be realized as a DDR (Double Rate Synchronous Dynamic Random Access Memory) controller, a memory controller, an Ethernet network transceiver, and the like. Therefore, the programmable logic array can be used to simulate various application scenarios so that all modules of the audio and video on-chip system can be fully operated, and then the chip surface temperature data is obtained according to all application scenarios of the chip design.

It can be seen that in this application example, since the logic, IO, and peripheral resources of the programmable logic array are very rich, all modules of the audio and video system on the chip can be fully operated, and the surface of the chip Temperature data can be obtained from all application scenarios of the chip design.

Example 2:

Referring to FIG. 3, it is a schematic diagram of an application scenario in which a chip to be tested is a digital analog hybrid circuit according to a second application example of the present invention.

In this application example, the chip to be tested is a digital analog hybrid circuit chip, and the programmable logic array module sends the analog signal 01 to the hybrid circuit through the peripheral of the analog circuit, and vice versa, the digital signal 02 can be sent to the hybrid circuit. The hybrid circuit works in different working scenarios. The digital signal 02 signal and the analog signal 04 converted by the hybrid circuit can be collected by the programmable logic array module, and the chip is evaluated according to the collected signal, and then the temperature sensor is collected. The surface temperature of the chip, thereby obtaining the temperature of the chip under various operating conditions.

Example three:

Referring to FIG. 4, a third application example of the present invention is a schematic diagram of an application scenario of a protocol interface circuit.

In this application example, the chip to be tested is an interface protocol conversion circuit chip, and the programmable logic array module sends the first protocol data 01 to the protocol interface circuit, and after the chip processing, forwards the second protocol data 02 to the programmable logic array. It is possible to form a data loop to generate circuits for transmission and reception. The temperature sensor collects the temperature, sends it to the programmable logic array circuit for real-time processing, and confirms the correct operation of the protocol interface circuit through the protocol verification code word.

The embodiment of the invention further provides a chip surface temperature measuring method, the method comprising:

Obtain the type of chip to be tested;

Sending the simulated working mode parameter to the chip to be tested;

Obtain temperature data of the chip to be tested in various working modes.

The obtaining the type of the chip to be tested may be obtained by the number of chip pins, or may be identified by receiving a parameter input by the user.

The obtaining temperature data of the chip to be tested in various working modes is obtained by a temperature sensor.

In addition, an embodiment of the present invention further provides a computer storage medium storing computer executable instructions, which are implemented when the computer executable instructions are executed.

The computer readable storage medium described above includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor to perform some of the steps of the methods described in various embodiments of the present disclosure. The computer readable storage medium includes: a USB flash drive, a removable hard disk, a read only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like, which can store program codes. medium.

It is to be understood that the term "comprises", "comprising", or any other variants thereof, is intended to encompass a non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes those elements. It also includes other elements that are not explicitly listed, or elements that are inherent to such a process, method, article, or device. An element that is defined by the phrase "comprising a ..." does not exclude the presence of additional equivalent elements in the process, method, item, or device that comprises the element.

The serial numbers of the embodiments of the present invention are merely for the description, and do not represent the advantages and disadvantages of the embodiments.

Through the description of the above embodiments, those skilled in the art can clearly understand that the foregoing embodiment method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be through hardware, but in many cases, the former is better. Implementation. Based on such understanding, the technical solution of the present invention, which is essential or contributes to the prior art, may be embodied in the form of a software product stored in a storage medium (such as ROM/RAM, disk, The optical disc includes a number of instructions for causing a terminal device (which may be a cell phone, a computer, a server, an air conditioner, or a network device, etc.) to perform the methods described in various embodiments of the present invention.

The above is only a preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. The equivalent structure or equivalent process transformations made by the present specification and the contents of the drawings are directly or indirectly applied to other related technical fields, and are included in the scope of patent protection of the present invention.

Industrial applicability

The technical solution of the embodiment of the invention realizes automatic measurement of the surface temperature of the chip to be tested in the chip design or screening stage, and obtains the physical characteristics of the chip to be tested, thereby providing a powerful reference for the chip design. The chip socket module provided by the embodiment of the invention can be used to place a plurality of chips to be tested. The programmable logic array module provided by the embodiment of the invention can dynamically simulate the working state of various chips, and is implemented with a bus connection module having multiple interfaces. Various working state parameters are sent to the chip to be tested, thereby obtaining temperature data of the chip to be tested under various working states. Therefore, compared with the prior art, the embodiment of the present invention can realize measurement of a plurality of chips to be tested, improve work efficiency, and facilitate chip designers to evaluate chip temperature characteristics. In order to protect the test chip, the embodiment of the present invention also provides three kinds of feedback (down voltage, frequency reduction, fan speed) to adjust the working temperature of the chip, thereby ensuring smooth and reliable test work without causing excessive temperature of the chip. And the consequences of the damage.

Claims

A chip surface temperature measuring system comprising:

The programmable logic array module is configured to configure the working state of the chip through dynamic simulation, and receive the measured surface temperature value of the chip;

a chip socket module configured to place a chip to be tested, wherein the chip socket module and the programmable logic array module are connected by a connection module having a plurality of sockets;

a temperature sensing module configured to measure a surface temperature of the chip to be tested in each working state, and send the measured chip surface temperature value to the programmable logic array module;

The power supply module is respectively connected to the programmable logic array module and the chip socket module to provide power for the circuit, and the power supply module supports a pulse width modulation technology, and is configured to pass when the surface temperature of the chip to be tested is higher than a preset value. The programming logic array module controls the power supply module to reduce power consumption to lower the temperature of the chip to be tested.
The system of claim 1 wherein said chip surface temperature measuring system further comprises:

a clock module, respectively connected to the programmable logic array module and the chip socket module, configured to provide a clock reference for the digital circuit when the chip to be tested is a digital circuit, and when the surface temperature of the chip to be tested is higher than a preset value Reduce the clock frequency by the programmable logic array module to reduce the temperature of the chip to be tested.
The system of claim 1 wherein said chip surface temperature measuring system further comprises:

The speed control fan module is respectively connected to the programmable logic array module and the chip socket module, and configured to be adjusted by the programmable logic array module through a negative feedback temperature adjustment when the surface temperature of the chip to be tested is higher than a preset value The speed of the speed fan reduces the temperature of the chip to be tested.
The system of claim 1 wherein said chip surface temperature measuring system further comprises:

a storage module and/or a display module, the storage module is connected to the programmable logic array module, configured to store the measured chip temperature data obtained by the measurement; and the display module is connected to the programmable logic array module and configured Output display for the temperature data of the chip to be tested.
The system of claim 1 wherein said chip surface temperature measuring system further comprises:

The alarm device is connected to the programmable logic array module and configured to send an alarm message when the temperature of the chip to be tested is higher than a preset value.
The system of claim 1 wherein

When the chip to be tested placed on the chip socket module is an audio and video on-chip system chip, the programmable logic array module controls the audio and video files to be downloaded into the audio and video on-chip system through the configuration interface for operation.
The system of claim 1 wherein

When the chip to be tested placed on the chip socket module is a digital analog hybrid circuit, the programmable logic array module sends an analog signal to the digital analog hybrid circuit through a peripheral of the analog circuit, and/or sends a digital signal to the digital analog The hybrid circuit, the digital signal and the analog signal converted by the digital analog hybrid circuit are collected by the programmable logic array module.
The system of claim 1 wherein

When the chip to be tested placed on the chip socket module is a protocol interface circuit, the programmable logic array module sends the first protocol data to the protocol interface circuit, and the second protocol data is forwarded to the programmable logic array module after being processed by the protocol interface circuit. The data loop generates circuits for transmission and reception.
The system of claim 8 wherein

The programmable logic array module confirms the correctness of the operation of the protocol interface circuit by using the verification codeword of the protocol.
A chip surface temperature measuring method includes:

Obtain the type of chip to be tested;

Obtaining pre-stored simulated working mode parameters according to the type of the chip to be tested;

Sending the simulated working mode parameter to the chip to be tested;

Obtain temperature data of the chip to be tested in various working modes.
A computer storage medium having stored therein computer executable instructions configured to perform the chip surface temperature measurement method of claim 10.