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WO2018188155A1 - 量子点显示器件及其制造方法 - Google Patents

量子点显示器件及其制造方法 Download PDF

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Publication number
WO2018188155A1
WO2018188155A1 PCT/CN2017/084851 CN2017084851W WO2018188155A1 WO 2018188155 A1 WO2018188155 A1 WO 2018188155A1 CN 2017084851 W CN2017084851 W CN 2017084851W WO 2018188155 A1 WO2018188155 A1 WO 2018188155A1
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layer
graphene
electrode layer
quantum dot
fullerene
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PCT/CN2017/084851
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English (en)
French (fr)
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谢华飞
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深圳市华星光电半导体显示技术有限公司
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Priority to US15/571,368 priority Critical patent/US10600979B2/en
Publication of WO2018188155A1 publication Critical patent/WO2018188155A1/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/115OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/15Hole transporting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/16Electron transporting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17Carrier injection layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • H10K50/816Multilayers, e.g. transparent multilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8051Anodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8051Anodes
    • H10K59/80517Multilayers, e.g. transparent multilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/828Transparent cathodes, e.g. comprising thin metal layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80523Multilayers, e.g. opaque multilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80524Transparent cathodes, e.g. comprising thin metal layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a quantum dot display device and a method of fabricating the same.
  • TFT-LCD Thin Film Transistor Liquid
  • OLED Organic Light Emitting Diode
  • the above conventional display panels generally include a large variety of metals, for example, indium used as a transparent electrode.
  • a quantum dot display device comprising: a flexible substrate; a first electrode layer, the first electrode layer is disposed on the flexible substrate; a device combination layer, the device combination layer is disposed on the a second electrode layer, the second electrode layer is disposed on the device combination layer; wherein the first electrode layer serves as one of an anode and a cathode of the quantum dot display device, The second electrode layer serves as the other of the anode and the cathode; the device combination layer includes an electron transport layer, a carbon quantum dot light emitting layer, a hole transport layer, and a hole injection layer; The material corresponding to the electrode layer is one of fullerene-graphene and carbon nanotube-graphene, and the material corresponding to the second electrode layer is fullerene-graphene, carbon nanotube-graphene; The other material of the first electrode layer and the material corresponding to the second electrode layer are non-metal doped graphene; the hole injection layer, the hole transport layer, The carbon quantum dot
  • a quantum dot display device comprising: a flexible substrate; a first electrode layer, the first electrode layer is disposed on the flexible substrate; a device combination layer, the device combination layer is disposed on the a second electrode layer, the second electrode layer is disposed on the device combination layer; wherein the first electrode layer serves as one of an anode and a cathode of the quantum dot display device, The second electrode layer serves as the other of the anode and the cathode; the device combination layer includes an electron transport layer, a carbon quantum dot light emitting layer, a hole transport layer, and a hole injection layer;
  • the material corresponding to the electrode layer is one of fullerene-graphene and carbon nanotube-graphene, and the material corresponding to the second electrode layer is fullerene-graphene, carbon nanotube-graphene
  • the other material; or the material corresponding to the first electrode layer and the material corresponding to the second electrode layer are non-metal doped graphene.
  • the hole injection layer, the hole transport layer, the carbon quantum dot light-emitting layer, and the electron transport layer are disposed on the first electrode layer in a predetermined order
  • a predetermined order is a sequence of the hole injection layer, the hole transport layer, the carbon quantum dot light-emitting layer, and the electron transport layer, or the electron transport layer, the carbon quantum dot light-emitting layer, and the The order of the hole transport layer and the hole injection layer.
  • the thickness of the first electrode layer or the second electrode layer made of fullerene-graphene is in the range of 40 nm to 120 nm, and carbon nanotube-graphene
  • the thickness of the second electrode layer or the first electrode layer of the material is in the range of 20 nm to 100 nm
  • the thickness of the hole transport layer is in the range of 20 nm to 60 nm
  • the hole The thickness of the injection layer is in the range of 20 nm to 60 nm
  • the thickness of the carbon quantum dot light-emitting layer is in the range of 10 nm to 30 nm
  • the thickness of the electron transport layer is in the range of 10 nm to 30 nm.
  • the first electrode layer or the second electrode layer made of fullerene-graphene has a thickness of 80 nm, and the carbon nanotube-graphene is used as the material.
  • the thickness of the two electrode layer or the first electrode layer is 60 nm
  • the thickness of the hole transport layer is 40 nm
  • the thickness of the hole injection layer is 40 nm
  • the thickness of the carbon quantum dot light emitting layer is At 20 nm
  • the electron transport layer has a thickness of 20 nm.
  • the first electrode layer made of fullerene-graphene includes a first graphene material layer and a first fullerene material layer
  • the carbon nanotube-graphene is The second electrode layer of material comprises a second graphene material layer and a first carbon nanotube material layer, the first graphene material layer and the first fullerene material layer being combined into one body, The second graphene material layer and the first carbon nanotube material layer are combined into one body; or the first electrode layer made of carbon nanotube-graphene comprises a third graphene material layer and a second carbon a nanotube material layer, the second electrode layer comprising fullerene-graphene comprising a fourth graphene material layer and a second fullerene material layer, the third graphene material layer and the The second carbon nanotube material layer is combined into one body, and the fourth graphene material layer and the second fullerene material layer are combined into one body.
  • the first electrode layer made of fullerene-graphene includes at least two first graphene material layers and at least two first fullerene material layers, and carbon nanotube-graphite
  • the second electrode layer of the olefin material comprises at least two second graphene material layers and at least two first carbon nanotube material layers, at least two of the first graphene material layers and at least two of the first fullerene
  • the material layers are alternately combined into one body, at least two of the second graphene material layers and at least two of the first carbon nanotube material layers are alternately combined into one body; or the first electrode is made of carbon nanotube-graphene
  • the layer includes at least two third graphene material layers and at least two second carbon nanotube material layers, and the second electrode layer comprising fullerene-graphene comprises at least two fourth graphene material layers and at least two a second fullerene material layer, at least two of the third graphene material layers and at least two of the second carbon nanotube material layers are interlaced and integrated
  • the non-metal doped graphene is one of nitrogen-doped graphene, phosphorus-doped graphene, silicon-doped graphene, and boron-doped graphene.
  • the material corresponding to the carbon quantum dot light-emitting layer is a carbon quantum dot or a graphene quantum dot.
  • the first electrode layer has an electron energy level of 4.8 eV
  • the hole injection layer has an electron energy level of 5.0 eV
  • the hole transport layer has an electron energy level of 2.3.
  • the electron energy level of the carbon quantum dot light-emitting layer is in the range of 3.9 eV to 5.5 eV
  • the electron energy level of the electron transport layer is between 2.8 eV and 6.3 eV.
  • the electron energy level is 4.5 electron volts.
  • a method of manufacturing the above quantum dot display device comprising the steps of: forming the flexible substrate on the glass substrate; B, forming the first electrode layer on the flexible substrate, a first electrode layer as one of the anode and the cathode; C, forming the device combination layer on the first electrode layer, the device combination layer including the electron transport layer, the carbon quantum a light-emitting layer, the hole transport layer, and the hole injection layer; D, the second electrode layer is disposed on the device combination layer, and the second electrode layer serves as the anode and the cathode The other one; E, separating the glass substrate from the flexible substrate.
  • the step A includes: a1, dissolving polyimide or polyethylene terephthalate in a first organic solvent to form a first weight percentage a solution, the first organic solvent may be, for example, dimethylacetamide; a2, uniformly coating the first solution on the glass substrate; a3, the first solution on the glass substrate Baking is performed to remove the solvent and moisture in the first solution to form the flexible substrate attached to the glass substrate.
  • the step a3 includes: a31, baking the glass substrate coated with the solution at a temperature of 80 degrees Celsius for 120 minutes to remove the first solution. a solvent; a32, baking the solution in which the solvent is removed at 100 degrees Celsius, 150 degrees Celsius, and 200 degrees Celsius for 60 minutes to remove moisture to form the flexible substrate attached to the glass substrate, thereby obtaining The flexible substrate and the first component of the glass substrate.
  • the step C is: disposing the hole injection layer, the hole transport layer, and the carbon quantum dot light-emitting layer on the first electrode layer in a predetermined order.
  • the electron transport layer, the predetermined order is a sequence of the hole injection layer, the hole transport layer, the carbon quantum dot light-emitting layer, and the electron transport layer, or the electron transport layer, The order of the carbon quantum dot light-emitting layer, the hole transport layer, and the hole injection layer is described.
  • the step C includes: c1, sequentially disposing the hole injection layer, the hole transport layer, and the carbon quantum dot light-emitting layer on the first electrode layer. And the electron transport layer; or c2, the electron transport layer, the carbon quantum dot light-emitting layer, the hole transport layer, and the hole injection layer are sequentially disposed on the first electrode layer.
  • the step B includes: forming a first graphene material layer on the flexible substrate; b2, forming a first fullerene material layer on the first graphene material layer; and the step D includes: D1, a second graphene material layer is disposed on the device combination layer; d2, a first carbon nanotube material layer is formed on the second graphene material layer; and a material corresponding to the first electrode layer is
  • the step B includes: b3, forming a third graphene material layer on the flexible substrate; B4, forming a second carbon nanotube material layer on the third graphene material layer;
  • the step D includes: d3, providing a fourth graphene material layer on the device combination
  • the step B in the case where the material corresponding to the first electrode layer is fullerene-graphene and the material corresponding to the second electrode layer is carbon nanotube-graphene
  • the step b1 and the step b2 are repeatedly performed such that the first electrode layer includes at least two layers of the first graphene material and at least two of the first fullerene materials.
  • the second electrode layer includes at least two of the second graphene material layer and at least two of the first carbon nanotube material layers, at least two of the second graphene material layers and at least two of the first carbon nanotubes
  • the material layers are interlaced and integrated; wherein the material corresponding to the first electrode layer is carbon nanotube-graphene, and the material corresponding to the second electrode layer is fullerene-graphene,
  • the step b3 and the step b4 are repeatedly performed to
  • the first electrode layer includes at least two third graphene material layers and at least two second carbon nanotube material layers, at least two of the third graphene material layers and at least two of the second carbon nanotube material layers are interlaced
  • the step d3 and the step d4 are repeatedly performed such that the second electrode
  • the flexible substrate, the first electrode layer, the device combination layer, and the second electrode layer in the quantum dot display device of the present invention are all made of an organic material and do not contain a metal material, the metal material can be reduced. Use to reduce the adverse effects on the environment.
  • FIG. 1 is a schematic view of a quantum dot display device of the present invention
  • FIG. 2 is a schematic view of a device combination layer in the quantum dot display device shown in FIG. 1;
  • FIG. 3 is a flow chart showing a method of fabricating a quantum dot display device of the present invention.
  • FIG. 4 is a flow chart showing the steps of forming the flexible substrate on the glass substrate in FIG. 3;
  • FIG. 5 is a flow chart showing a step of forming the first electrode layer on the flexible substrate shown in FIG. 3 in a case where the material corresponding to the first electrode layer is fullerene-graphene;
  • FIG. 6 is a flow chart showing a step of disposing the second electrode layer on the device combination layer shown in FIG. 3 in a case where the material corresponding to the second electrode layer is carbon nanotube-graphene;
  • FIG. 7 is a flow chart showing a step of forming the first electrode layer on the flexible substrate shown in FIG. 3 in a case where the material corresponding to the first electrode layer is carbon nanotube-graphene;
  • FIG. 8 is a flow chart showing the step of disposing the second electrode layer on the device combination layer shown in FIG. 3 in the case where the material corresponding to the second electrode layer is fullerene-graphene.
  • FIG. 1 is a schematic diagram of a quantum dot display device of the present invention
  • FIG. 2 is a schematic diagram of a device combination layer 103 in the quantum dot display device shown in FIG. 1.
  • the quantum dot display device of the present invention includes a flexible substrate 101, a first electrode layer 102, a device combination layer 103, and a second electrode layer 104.
  • the first electrode layer 102 is disposed on the flexible substrate 101
  • the device combination layer 103 is disposed on the first electrode layer 102
  • the second electrode layer 104 is disposed on the device combination layer 103.
  • first electrode layer 102 is one of an anode and a cathode of the quantum dot display device, and the second electrode layer 104 serves as the other of the anode and the cathode;
  • the device combination layer 103 includes an electron transport layer 1034, a carbon quantum dot light emitting layer 1033, a hole transport layer 1032, and a hole injection layer 1031;
  • the material corresponding to the first electrode layer 102 is one of fullerene-graphene, carbon nanotube-graphene, and the material corresponding to the second electrode layer 104 is Fuller.
  • the other one of the ene-graphene and the carbon nanotube-graphene; or the material corresponding to the first electrode layer 102 and the material corresponding to the second electrode layer 104 are all non-metal doped graphene.
  • the materials corresponding to the electron transport layer 1034, the carbon quantum dot light-emitting layer 1033, the hole transport layer 1032, and the hole injection layer 1031 are all organic materials.
  • the hole injection layer 1031, the hole transport layer 1032, the carbon quantum dot light-emitting layer 1033, and the electron transport layer 1034 are disposed in the first order in the first order.
  • the predetermined order is the order of the hole injection layer 1031, the hole transport layer 1032, the carbon quantum dot light-emitting layer 1033, and the electron transport layer 1034 or the electron transport layer. 1034.
  • the hole injection layer 1031 is located on the first electrode layer 102
  • the hole transport layer 1032 is located on the hole injection layer 1031
  • the carbon quantum dot light-emitting layer 1033 is located in the hole.
  • the electron transport layer 1034 is located on the carbon quantum dot light-emitting layer 1033
  • the second electrode layer 104 is located on the electron transport layer 1034.
  • the electron transport layer 1034 is located on the first electrode layer 102
  • the carbon quantum dot light emitting layer 1033 is located on the electron transport layer 1034
  • the hole transport layer 1032 is located at the carbon quantum dot light emitting layer.
  • the hole injection layer 1031 is located on the hole transport layer 1032
  • the second electrode layer 104 is located on the hole injection layer 1031.
  • the thickness of the first electrode layer 102 or the second electrode layer 104 made of fullerene-graphene is in the range of 40 nm to 120 nm, with carbon nano
  • the thickness of the second electrode layer 104 or the first electrode layer 102 of the tube-graphene material is in the range of 20 nm to 100 nm, and the hole transport layer 1032 has a thickness of 20 nm to 60 nm.
  • the thickness of the hole injection layer 1031 is in the range of 20 nm to 60 nm
  • the thickness of the carbon quantum dot light-emitting layer 1033 is in the range of 10 nm to 30 nm
  • the thickness of the electron transport layer 1034 It is in the range of 10 nm to 30 nm.
  • the first electrode layer 102 or the second electrode layer 104 made of fullerene-graphene has a thickness of 80 nm
  • the second electrode layer is made of carbon nanotube-graphene.
  • 104 or the first electrode layer 102 has a thickness of 60 nm
  • the hole transport layer 1032 has a thickness of 40 nm
  • the hole injection layer 1031 has a thickness of 40 nm
  • the carbon quantum dot light-emitting layer 1033 The thickness is 20 nm
  • the thickness of the electron transport layer 1034 is 20 nm.
  • the material corresponding to the flexible substrate 101 is one or a combination of one or more of polyethylene terephthalate, polycarbonate, and polyimide;
  • the non-metal doped graphene is one of nitrogen-doped graphene, phosphorus-doped graphene, silicon-doped graphene, and boron-doped graphene;
  • the material corresponding to the hole injection layer 1031 is PEDOT, PSS, a mixture of PEDOT and PSS, one of 2T-NATA and m-MTDATA;
  • the material corresponding to the hole transport layer 1032 is one of TFB, PVK, CBP, NPB, Poly-TPD, TCTA, ⁇ -NPD, MEH-PPV;
  • the material corresponding to the carbon quantum dot light-emitting layer 1033 is a carbon quantum dot or a graphene quantum dot
  • the material corresponding to the electron transport layer 1034 is one of TPBi, BBOT, BCP, Alq3, and BND.
  • the first electrode layer 102 made of fullerene-graphene includes a first graphene material layer and a first fullerene material layer, and the carbon nanotube-
  • the second electrode layer 104 of graphene material comprises a second graphene material layer and a first carbon nanotube material layer, and the first graphene material layer and the first fullerene material layer are combined into In one piece, the second graphene material layer and the first carbon nanotube material layer are combined into one body.
  • the first electrode layer 102 made of carbon nanotube-graphene includes a third graphene material layer and a second carbon nanotube material layer, and the second electrode is made of fullerene-graphene.
  • the layer 104 includes a fourth graphene material layer and a second fullerene material layer, the third graphene material layer and the second carbon nanotube material layer are combined, the fourth graphene material layer And the second fullerene material layer is combined into one.
  • the first electrode layer comprising fullerene-graphene comprises at least two first graphene material layers and at least two first fullerene material layers, and carbon nanotube-graphene is used as material.
  • the second electrode layer includes at least two second graphene material layers and at least two first carbon nanotube material layers, at least two of the first graphene material layers and at least two of the first fullerene material layers are interlaced Combining, at least two of the second graphene material layers and at least two of the first carbon nanotube material layers are interlaced together; or
  • the first electrode layer using carbon nanotube-graphene as a material includes at least two third graphene material layers and at least two second carbon nanotube material layers, and the second material is made of fullerene-graphene
  • the electrode layer includes at least two fourth graphene material layers and at least two second fullerene material layers, at least two of the third graphene material layers and at least two of the second carbon nanotube material layers are alternately combined, at least Two of the fourth graphene material layers and at least two of the second fullerene material layers are alternately combined.
  • the term "combination” includes lamination and mixing.
  • the electron energy level of the first electrode layer 102 is 4.8 eV
  • the electron energy level of the hole injection layer 1031 is 5.0 eV
  • the hole transport layer 1032 The electron energy level is in the range of 2.3 electron volts 5.2 eV
  • the electron energy level of the carbon quantum dot light-emitting layer 1033 is in the range of 3.9 eV to 5.5 eV
  • the electron energy level of the electron transport layer 1034 is
  • the electronic energy level of the second electrode layer 104 is 4.5 electron volts in the range of 2.8 electron volts to 6.3 electron volts.
  • FIG. 3 is a flow chart of a method of fabricating a quantum dot display device of the present invention.
  • the manufacturing method of the quantum dot display device of the present invention comprises the following steps:
  • step 301 forming a flexible substrate 101 on a glass substrate
  • step 302 forming a first electrode layer 102 on the flexible substrate 101, the first electrode layer 102 serving as one of an anode and a cathode of the quantum dot display device;
  • step 303 forming a device combination layer 103 on the first electrode layer 102, the device combination layer 103 including an electron transport layer 1034, a carbon quantum dot light-emitting layer 1033, a hole transport layer 1032, and a hole injection layer 1031;
  • step 304 providing a second electrode layer 104 on the device combination layer 103, the second electrode layer 104 serving as the other of the anode and the cathode;
  • step 305 separating the glass substrate from the flexible substrate 101;
  • the material corresponding to the first electrode layer 102 is one of fullerene-graphene and carbon nanotube-graphene, and the material corresponding to the second electrode layer 104 is fullerene-graphene.
  • the material corresponding to the first electrode layer 102 and the material corresponding to the second electrode layer 104 are all non-metal doped graphene.
  • FIG. 4 is a flow chart showing the steps of forming the flexible substrate 101 on the glass substrate in FIG.
  • the step A includes:
  • A1 (step 3011), dissolving polyimide or polyethylene terephthalate in a first organic solvent to form a first solution having a predetermined weight percentage, wherein the first organic solvent may be, for example Is dimethylacetamide;
  • step 3012 uniformly coating the first solution on the glass substrate
  • step 3013 baking the first solution on the glass substrate to remove solvent and moisture in the first solution to form the flexible substrate 101 attached to the glass substrate .
  • the step a3 is also used to cure the polyimide in the first solution.
  • the predetermined weight percentage is in the range of 1 wt% to 40 wt%, and preferably, the predetermined weight percentage is 10 wt%.
  • the step C is:
  • the hole injection layer 1031, the hole transport layer 1032, the carbon quantum dot light-emitting layer 1033, and the electron transport layer 1034 are disposed on the first electrode layer 102 in a predetermined order, the predetermined order being a sequence of the hole injection layer 1031, the hole transport layer 1032, the carbon quantum dot light-emitting layer 1033, and the electron transport layer 1034 or the electron transport layer 1034, the carbon quantum dot light-emitting layer 1033 The order of the hole transport layer 1032 and the hole injection layer 1031.
  • the step C includes:
  • the hole injection layer 1031, the hole transport layer 1032, the carbon quantum dot light-emitting layer 1033, and the electron transport layer 1034 are sequentially disposed on the first electrode layer 102; or
  • the electron transport layer 1034, the carbon quantum dot light-emitting layer 1033, the hole transport layer 1032 and the hole injection layer 1031 are sequentially disposed on the first electrode layer 102;
  • FIG. 5 is that, when the material corresponding to the first electrode layer 102 is fullerene-graphene, the first one is formed on the flexible substrate 101 shown in FIG.
  • FIG. 6 is a flow chart of the step of the electrode layer 102.
  • FIG. 6 shows a case where the material corresponding to the second electrode layer 104 is carbon nanotube-graphene.
  • the material corresponding to the first electrode layer 102 is fullerene-graphene
  • the material corresponding to the second electrode layer 104 is carbon nanotube-graphite.
  • the step B includes:
  • step 3021 forming a first graphene material layer on the flexible substrate 101;
  • step 3021 forming a first fullerene material layer on the first graphene material layer
  • the step D includes:
  • step 3041 providing a second graphene material layer on the device combination layer 103;
  • step 3042 forming a first carbon nanotube material layer on the second graphene material layer.
  • step B The step b1 and the step b2 are repeatedly performed such that the first electrode layer includes at least two layers of the first graphene material and at least two layers of the first fullerene material, at least two of The first graphene material layer and at least two of the first fullerene material layers are interlaced and integrated, and in the step D, the step d1 and the step d2 are repeatedly performed to make the second electrode layer Including at least two of the second graphene material layer and at least two of the first carbon nanotube material layers, at least two of the second graphene material layers and at least two of the first carbon nanotube material layers are alternately combined into one .
  • FIG. 7 is that, in the case where the material corresponding to the first electrode layer 102 is carbon nanotube-graphene, the first layer is formed on the flexible substrate 101 illustrated in FIG. 3 .
  • FIG. 8 is a view showing the device layer 103 disposed on the device assembly layer 103 in the case where the material corresponding to the second electrode layer 104 is fullerene-graphene.
  • the material corresponding to the first electrode layer 102 is carbon nanotube-graphene
  • the material corresponding to the second electrode layer 104 is fullerene-graphite.
  • the step B includes:
  • step 3023 forming a third graphene material layer on the flexible substrate 101;
  • step 3024 forming a second carbon nanotube material layer on the third graphene material layer
  • the step D is:
  • step 3043 providing a fourth graphene material layer on the device combination layer 103;
  • step 3044 forming a second fullerene material layer on the second graphene material layer.
  • the step B In the case where the material corresponding to the first electrode layer is carbon nanotube-graphene and the material corresponding to the second electrode layer is fullerene-graphene, in the step B The step b3 and the step b4 are repeatedly performed such that the first electrode layer includes at least two third graphene material layers and at least two second carbon nanotube material layers, at least two of the third graphene The material layer and at least two of the second carbon nanotube material layers are alternately combined into one body.
  • the step D the step d3 and the step d4 are repeatedly performed, so that the second electrode layer includes at least two The fourth graphene material layer and the at least two second fullerene material layers, at least two of the fourth graphene material layers and at least two of the second fullerene material layers are alternately combined.
  • the step a3 includes:
  • the solution from which the solvent is removed is baked at 100 degrees Celsius, 150 degrees Celsius, and 200 degrees Celsius for 60 minutes to remove moisture to form the flexible substrate 101 attached to the glass substrate, thereby obtaining a The flexible substrate 101 and the first component of the glass substrate.
  • the step b1 includes:
  • the first copper foil provided with the first graphene is pressed between the first glass plate and the second glass plate, wherein the first graphene is disposed on a surface of the first copper foil.
  • the first glass sheet is in contact with the first graphene, and the second glass sheet is in contact with the first copper foil.
  • the glass substrate (the first component) to which the flexible substrate 101 is attached is pressed against the first copper foil provided with the first graphene material layer, wherein the flexible substrate 101 Contacting the first graphene;
  • the step b2 includes:
  • B21 Dissolving the first fullerene in a second organic solvent to form a second solution, wherein the second organic solvent may be, for example, a toluene solution, and the second solution is 5 millimoles per liter.
  • the second organic solvent may be, for example, a toluene solution, and the second solution is 5 millimoles per liter.
  • the second assembly is held for at least 30 seconds of rotation.
  • the second solution disposed on the second component is baked at 200 degrees Celsius for 120 minutes to form the first Three components.
  • the step b22 and the step b23 are repeatedly performed, so that the first electrode layer 102 has a structure of a multilayer fullerene and a multilayer graphene.
  • multilayer means at least two layers. At least two layers of fullerene and fullerene graphene are interlaced together.
  • the first electrode layer 102 is a multilayer structure of the first graphene-first fullerene-second graphene-second fullerene-...-Nth graphene-Nth fullerene.
  • the step d1 includes:
  • the second copper foil provided with the second graphene is pressed between the third glass plate and the fourth glass plate, wherein the second graphene is disposed on a surface of the second copper foil.
  • the third glass plate is in contact with the second graphene, and the fourth glass plate is in contact with the second copper foil.
  • the combination of the device combination layer 103 and the third component is clamped on the second copper foil provided with the second graphene material layer, wherein the device combination layer 103 and the first Two graphene contacts;
  • the step d2 includes:
  • the fourth assembly is rotated at a speed of 1000 revolutions per minute, the third solution is dropped into the fourth assembly in a rotating state, and the fourth assembly is kept rotated for at least 30 seconds.
  • the step b3 includes:
  • a third copper foil provided with a third graphene is pressed between the fifth glass plate and the sixth glass plate, wherein the third graphene is disposed on a surface of the third copper foil.
  • the fifth glass plate is in contact with the third graphene
  • the sixth glass plate is in contact with the third copper foil.
  • the glass substrate (the first component) to which the flexible substrate 101 is attached is pressed against the third copper foil provided with the third graphene material layer, wherein the flexible substrate 101 Contacting the third graphene;
  • the step b4 includes:
  • the step d3 includes:
  • the fourth copper foil provided with the fourth graphene is pressed between the seventh glass plate and the eighth glass plate, wherein the fourth graphene is disposed on a surface of the fourth copper foil.
  • the seventh glass plate is in contact with the fourth graphene
  • the eighth glass plate is in contact with the fourth copper foil.
  • the step d4 includes:
  • the eighth assembly is held rotated for at least 30 seconds.
  • the ninth component specifically, the fifth solution disposed on the eighth component is baked at 200 degrees Celsius for 120 minutes to form the ninth component.
  • the step d42 and the step d43 are repeatedly performed, so that the first electrode layer 102 has a structure of a multilayer fullerene and a multilayer graphene.
  • multilayer means at least two layers. At least two layers of fullerene and fullerene graphene are interlaced together.
  • a single layer of graphene can be obtained by peeling the flexible substrate 101 and/or the glass substrate.
  • the step c1 includes:
  • the sixth solution is a mixed solution of the PEDOT and the PSS.
  • the seventh solution is coated on the hole injection layer 1031, wherein the seventh solution is a solution containing the Poly-TPD;
  • the carbon quantum dot light-emitting layer 1033 is formed by baking at 80 degrees Celsius for 60 minutes to obtain a twelfth component including the carbon quantum dot light-emitting layer 1033 and the eleventh component.
  • the step c2 includes:
  • an eighth solution containing carbon quantum dots dissolved in a sixth organic solvent on the electron transport layer 1034, specifically, rotating the fourteenth component at a speed of 2000 rpm
  • the eighth solution is dropped onto the electron transport layer 1034, and the fourteenth component is rotated for 20 seconds
  • the sixth organic solvent may be, for example, n-hexane
  • the seventh solution is coated on the carbon quantum dot light-emitting layer 1033, wherein the seventh solution is a solution containing the Poly-TPD;
  • the hole transport layer 1032 coated a sixth solution of 10 mg/mL on the hole transport layer 1032, specifically, rotating the sixteenth component at a speed of 3000 rpm, and dropping the sixth solution into the On the hole transport layer 1032, the sixteenth component is rotated for 60 seconds, wherein the sixth solution is a mixed solution of the PEDOT and the PSS.
  • the flexible substrate, the first electrode layer, the device combination layer, and the second electrode layer in the quantum dot display device of the present invention are all made of an organic material and do not contain a metal material, the metal material can be reduced. Use to reduce the adverse effects on the environment.

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Abstract

一种量子点显示器件及其制造方法。量子点显示器件包括柔性基板(101),第一、第二电极层(102,104),器件组合层(103)。第一电极层(102)的材料为富勒烯-石墨烯、碳纳米管-石墨烯,第二电极层(104)的材料为碳纳米管-石墨烯或富勒烯-石墨烯;或者第一、第二电极层(102,104)的材料均为非金属掺杂石墨烯。该方案能减少对金属材料的使用,避免破坏环境。

Description

量子点显示器件及其制造方法 技术领域
本发明涉及显示技术领域,特别涉及一种量子点显示器件及其制造方法。
背景技术
传统的显示面板一般包括TFT-LCD(Thin Film Transistor Liquid Crystal Display,薄膜晶体管液晶显示面板)和OLED(Organic Light Emitting Diode,有机发光二极管显示面板)。
上述传统的显示面板一般都包括大量的各种各样的金属,例如,用作透明电极的铟。
由于铟这种金属材料日益短缺,成本越来越高,并且这种金属材料对环境造成的污染较大,因此,有必要开发出一种新的显示器件,以替代需要使用大量金属材料的传统的显示面板。
技术问题
本发明的目的在于提供一种量子点显示器件及其制造方法,其能减少对金属材料的使用,降低对环境的不良影响。
技术解决方案
为解决上述问题,本发明的技术方案如下:
一种量子点显示器件,所述量子点显示器件包括:柔性基板;第一电极层,所述第一电极层设置在所述柔性基板上;器件组合层,所述器件组合层设置在所述第一电极层上;第二电极层,所述第二电极层设置在所述器件组合层上;其中,所述第一电极层作为所述量子点显示器件的阳极、阴极中的一者,所述第二电极层作为所述阳极、所述阴极中的另一者;所述器件组合层包括电子传输层、碳量子点发光层、空穴传输层和空穴注入层;所述第一电极层所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的一者,所述第二电极层所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的另一者;或者所述第一电极层所对应的材料和所述第二电极层所对应的材料均为非金属掺杂石墨烯;所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层按预定顺序设置在所述第一电极层上,所述预定顺序为所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层的先后顺序或所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层的先后顺序;所述非金属掺杂石墨烯为氮掺杂石墨烯、磷掺杂石墨烯、硅掺杂石墨烯、硼掺杂石墨烯中的一者;所述碳量子点发光层所对应的材料为碳量子点或石墨烯量子点。
一种量子点显示器件,所述量子点显示器件包括:柔性基板;第一电极层,所述第一电极层设置在所述柔性基板上;器件组合层,所述器件组合层设置在所述第一电极层上;第二电极层,所述第二电极层设置在所述器件组合层上;其中,所述第一电极层作为所述量子点显示器件的阳极、阴极中的一者,所述第二电极层作为所述阳极、所述阴极中的另一者;所述器件组合层包括电子传输层、碳量子点发光层、空穴传输层和空穴注入层;所述第一电极层所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的一者,所述第二电极层所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的另一者;或者所述第一电极层所对应的材料和所述第二电极层所对应的材料均为非金属掺杂石墨烯。
在上述量子点显示器件中,所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层按预定顺序设置在所述第一电极层上,所述预定顺序为所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层的先后顺序或所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层的先后顺序。
在上述量子点显示器件中,以富勒烯-石墨烯为材料的所述第一电极层或所述第二电极层的厚度处于40纳米至120纳米的范围内,以碳纳米管-石墨烯为材料的所述第二电极层或所述第一电极层的厚度处于20纳米至100纳米的范围内,所述空穴传输层的厚度处于20纳米至60纳米的范围内,所述空穴注入层的厚度处于20纳米至60纳米的范围内,所述碳量子点发光层的厚度处于10纳米至30纳米的范围内,所述电子传输层的厚度处于10纳米至30纳米的范围内。
在上述量子点显示器件中,以富勒烯-石墨烯为材料的所述第一电极层或所述第二电极层的厚度为80纳米,以碳纳米管-石墨烯为材料的所述第二电极层或所述第一电极层的厚度为60纳米,所述空穴传输层的厚度为40纳米,所述空穴注入层的厚度为40纳米,所述碳量子点发光层的厚度为20纳米,所述电子传输层的厚度为20纳米。
在上述量子点显示器件中,以富勒烯-石墨烯为材料的所述第一电极层包括一第一石墨烯材料层和一第一富勒烯材料层,以碳纳米管-石墨烯为材料的所述第二电极层包括一第二石墨烯材料层和一第一碳纳米管材料层,所述第一石墨烯材料层和所述第一富勒烯材料层组合为一体,所述第二石墨烯材料层和所述第一碳纳米管材料层组合为一体;或者以碳纳米管-石墨烯为材料的所述第一电极层包括一第三石墨烯材料层和一第二碳纳米管材料层,以富勒烯-石墨烯为材料的所述第二电极层包括一第四石墨烯材料层和一第二富勒烯材料层,所述第三石墨烯材料层和所述第二碳纳米管材料层组合为一体,所述第四石墨烯材料层和所述第二富勒烯材料层组合为一体。
在上述量子点显示器件中,以富勒烯-石墨烯为材料的所述第一电极层包括至少两第一石墨烯材料层和至少两第一富勒烯材料层,以碳纳米管-石墨烯为材料的所述第二电极层包括至少两第二石墨烯材料层和至少两第一碳纳米管材料层,至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层交错组合为一体,至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层交错组合为一体;或者以碳纳米管-石墨烯为材料的所述第一电极层包括至少两第三石墨烯材料层和至少两第二碳纳米管材料层,以富勒烯-石墨烯为材料的所述第二电极层包括至少两第四石墨烯材料层和至少两第二富勒烯材料层,至少两所述第三石墨烯材料层和至少两所述第二碳纳米管材料层交错组合为一体,至少两所述第四石墨烯材料层和至少两所述第二富勒烯材料层交错组合为一体。
在上述量子点显示器件中,所述非金属掺杂石墨烯为氮掺杂石墨烯、磷掺杂石墨烯、硅掺杂石墨烯、硼掺杂石墨烯中的一者。
在上述量子点显示器件中,所述碳量子点发光层所对应的材料为碳量子点或石墨烯量子点。
在上述量子点显示器件中,所述第一电极层的电子能级为4.8电子伏特,所述空穴注入层的电子能级为5.0电子伏特,所述空穴传输层的电子能级处于2.3电子伏特值5.2电子伏特的范围内,所述碳量子点发光层的电子能级处于3.9电子伏特至5.5电子伏特的范围内,所述电子传输层的电子能级处于2.8电子伏特至6.3电子伏特的范围内,所述第二电极层的电子能级为4.5电子伏特。
一种上述量子点显示器件的制造方法,所述方法包括以下步骤:A、在所述玻璃基板上形成所述柔性基板;B、在所述柔性基板上形成所述第一电极层,所述第一电极层作为所述阳极、所述阴极中的一者;C、在所述第一电极层上形成所述器件组合层,所述器件组合层包括所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层;D、在所述器件组合层上设置所述第二电极层,所述第二电极层作为所述阳极、所述阴极中的另一者;E、将所述玻璃基板与所述柔性基板相分离。
在上述量子点显示器件的制造方法中,所述步骤A包括:a1、将聚酰亚胺或聚对苯二甲酸乙二醇酯溶解于第一有机溶剂中,以形成具有预定重量百分比的第一溶液,所述第一有机溶剂可例如为二甲基乙酰胺;a2、将所述第一溶液均匀涂布于所述玻璃基板上;a3、对所述玻璃基板上的所述第一溶液进行烘烤,以去除所述第一溶液中的溶剂和水分,以形成附着于所述玻璃基板上的所述柔性基板。
在上述量子点显示器件的制造方法中,所述步骤a3包括:a31、对涂布有所述溶液的所述玻璃基板以80摄氏度的温度烘烤120分钟,以去除所述第一溶液中的溶剂;a32、对去除了所述溶剂的所述溶液以100摄氏度、150摄氏度、200摄氏度各烘烤60分钟,以去除水分,以形成附着于所述玻璃基板上的所述柔性基板,得到包括所述柔性基板和所述玻璃基板的第一组件。
在上述量子点显示器件的制造方法中,所述步骤C为:在所述第一电极层上按预定顺序设置所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层,所述预定顺序为所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层的先后顺序或所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层的先后顺序。
在上述量子点显示器件的制造方法中,所述步骤C包括:c1、在所述第一电极层上依次设置所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层;或者c2、在所述第一电极层上依次设置所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层。
在上述量子点显示器件的制造方法中,在所述第一电极层所对应的材料为富勒烯-石墨烯,所述第二电极层所对应的材料为碳纳米管-石墨烯的情况下,所述步骤B包括:b1、在所述柔性基板上形成第一石墨烯材料层;b2、在所述第一石墨烯材料层上形成第一富勒烯材料层;所述步骤D包括:d1、在所述器件组合层上设置第二石墨烯材料层;d2、在所述第二石墨烯材料层上形成第一碳纳米管材料层;在所述第一电极层所对应的材料为碳纳米管-石墨烯,所述第二电极层所对应的材料为富勒烯-石墨烯的情况下,所述步骤B包括:b3、在所述柔性基板上形成第三石墨烯材料层;b4、在所述第三石墨烯材料层上形成第二碳纳米管材料层;所述步骤D包括:d3、在所述器件组合层上设置第四石墨烯材料层;d4、在所述第二石墨烯材料层上形成第二富勒烯材料层。
在上述量子点显示器件的制造方法中,在所述第一电极层所对应的材料为富勒烯-石墨烯,所述第二电极层所对应的材料为碳纳米管-石墨烯的情况下,在所述步骤B中,重复执行所述步骤b1和所述步骤b2,以使所述第一电极层包括至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层,至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层交错组合为一体,在所述步骤D中,重复执行所述步骤d1和所述步骤d2,以使所述第二电极层包括至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层,至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层交错组合为一体;在所述第一电极层所对应的材料为碳纳米管-石墨烯,所述第二电极层所对应的材料为富勒烯-石墨烯的情况下,在所述步骤B中,重复执行所述步骤b3和所述步骤b4,以使所述第一电极层包括至少两第三石墨烯材料层和至少两第二碳纳米管材料层,至少两所述第三石墨烯材料层和至少两所述第二碳纳米管材料层交错组合为一体,在所述步骤D中,重复执行所述步骤d3和所述步骤d4,以使所述第二电极层包括至少两第四石墨烯材料层和至少两第二富勒烯材料层,至少两所述第四石墨烯材料层和至少两所述第二富勒烯材料层交错组合为一体。
有益效果
相对现有技术,由于本发明的量子点显示器件中的柔性基板、第一电极层、器件组合层、第二电极层均由有机材料制成,而不含有金属材料,因此能减少对金属材料的使用,降低对环境的不良影响。
附图说明
为让本发明的上述内容能更明显易懂,下文特举优选实施例,并配合所附图式,作详细说明如下。
图1为本发明的量子点显示器件的示意图;
图2为图1所示的量子点显示器件中的器件组合层的示意图;
图3为本发明的量子点显示器件的制造方法的流程图;
图4为图3中在所述玻璃基板上形成所述柔性基板的步骤的流程图;
图5为在所述第一电极层所对应的材料为富勒烯-石墨烯的情况下,图3所示的在所述柔性基板上形成所述第一电极层的步骤的流程图;
图6为在所述第二电极层所对应的材料为碳纳米管-石墨烯的情况下,图3所示的在所述器件组合层上设置所述第二电极层的步骤的流程图;
图7为在所述第一电极层所对应的材料为碳纳米管-石墨烯的情况下,图3所示的在所述柔性基板上形成所述第一电极层的步骤的流程图;
图8为在所述第二电极层所对应的材料为富勒烯-石墨烯的情况下,图3所示的在所述器件组合层上设置所述第二电极层的步骤的流程图。
本发明的最佳实施方式
本说明书所使用的词语“实施例”意指实例、示例或例证。此外,本说明书和所附权利要求中所使用的冠词“一”一般地可以被解释为“一个或多个”,除非另外指定或从上下文可以清楚确定单数形式。
参考图1和图2,图1为本发明的量子点显示器件的示意图,图2为图1所示的量子点显示器件中的器件组合层103的示意图。
本发明的量子点显示器件包括柔性基板101、第一电极层102、器件组合层103、第二电极层104。
所述第一电极层102设置在所述柔性基板101上,所述器件组合层103设置在所述第一电极层102上,所述第二电极层104设置在所述器件组合层103上。
其中,所述第一电极层102作为所述量子点显示器件的阳极、阴极中的一者,所述第二电极层104作为所述阳极、所述阴极中的另一者;
所述器件组合层103包括电子传输层1034、碳量子点发光层1033、空穴传输层1032和空穴注入层1031;
所述第一电极层102所对应的材料为富勒烯(Fullerene)-石墨烯(Graphene)、碳纳米管-石墨烯中的一者,所述第二电极层104所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的另一者;或者所述第一电极层102所对应的材料和所述第二电极层104所对应的材料均为非金属掺杂石墨烯。
其中,电子传输层1034、碳量子点发光层1033、空穴传输层1032和空穴注入层1031所对应的材料均为有机材料。
在本发明的量子点显示器件中,所述空穴注入层1031、所述空穴传输层1032、所述碳量子点发光层1033和所述电子传输层1034按预定顺序设置在所述第一电极层102上,所述预定顺序为所述空穴注入层1031、所述空穴传输层1032、所述碳量子点发光层1033和所述电子传输层1034的先后顺序或所述电子传输层1034、所述碳量子点发光层1033、所述空穴传输层1032和所述空穴注入层1031的先后顺序。
具体地,所述空穴注入层1031位于所述第一电极层102上,所述空穴传输层1032位于所述空穴注入层1031上,所述碳量子点发光层1033位于所述空穴传输层1032上,所述电子传输层1034位于所述碳量子点发光层1033上,所述第二电极层104位于所述电子传输层1034上。
或者,所述电子传输层1034位于所述第一电极层102上,所述碳量子点发光层1033位于所述电子传输层1034上,所述空穴传输层1032位于所述碳量子点发光层1033上,所述空穴注入层1031位于所述空穴传输层1032上,所述第二电极层104位于所述空穴注入层1031上。
在本发明的量子点显示器件中,以富勒烯-石墨烯为材料的所述第一电极层102或所述第二电极层104的厚度处于40纳米至120纳米的范围内,以碳纳米管-石墨烯为材料的所述第二电极层104或所述第一电极层102的厚度处于20纳米至100纳米的范围内,所述空穴传输层1032的厚度处于20纳米至60纳米的范围内,所述空穴注入层1031的厚度处于20纳米至60纳米的范围内,所述碳量子点发光层1033的厚度处于10纳米至30纳米的范围内,所述电子传输层1034的厚度处于10纳米至30纳米的范围内。
优选地,以富勒烯-石墨烯为材料的所述第一电极层102或所述第二电极层104的厚度为80纳米,以碳纳米管-石墨烯为材料的所述第二电极层104或所述第一电极层102的厚度为60纳米,所述空穴传输层1032的厚度为40纳米,所述空穴注入层1031的厚度为40纳米,所述碳量子点发光层1033的厚度为20纳米,所述电子传输层1034的厚度为20纳米。
在本发明的量子点显示器件中,所述柔性基板101所对应的材料为聚对苯二甲酸乙二醇酯、聚碳酸酯、聚酰亚胺中的一者或一者以上的组合;
所述非金属掺杂石墨烯为氮掺杂石墨烯、磷掺杂石墨烯、硅掺杂石墨烯、硼掺杂石墨烯中的一者;
所述空穴注入层1031所对应的材料为PEDOT、PSS、PEDOT与PSS的混合物、2T-NATA、m-MTDATA中的一者;
所述空穴传输层1032所对应的材料为TFB、PVK、CBP、NPB、Poly-TPD、TCTA、α-NPD、MEH-PPV中的一者;
所述碳量子点发光层1033所对应的材料为碳量子点或石墨烯量子点;
所述电子传输层1034所对应的材料为TPBi、BBOT、BCP、Alq3、BND中的一者。
其中,PEDOT为聚(3,4-乙烯二氧噻吩);PSS为聚苯乙烯磺酸;2T-NATA为4,4’,4”-三[2-萘基(苯基)氨基]三苯胺;m-MTDATA为4,4’,4”-三[苯基(间甲苯基)氨基]三苯胺;TFB为聚(9,9-二辛基芴-CO-N-(4-丁基苯基)二苯胺);PVK为聚乙烯咔唑;CBP为4,4’-二(9-咔唑)联苯;NPB为N,N’-二苯基-N,N’-(1-萘基)-1,1’-联苯-4,4’-二胺;Poly-TPD为聚(N,N’-双(3-甲基苯基)-N,N’-二苯基-1,1’-联苯-4,4’-二胺)。
在本发明的量子点显示器件中,以富勒烯-石墨烯为材料的所述第一电极层102包括一第一石墨烯材料层和一第一富勒烯材料层,以碳纳米管-石墨烯为材料的所述第二电极层104包括一第二石墨烯材料层和一第一碳纳米管材料层,所述第一石墨烯材料层和所述第一富勒烯材料层组合为一体,所述第二石墨烯材料层和所述第一碳纳米管材料层组合为一体。或者
以碳纳米管-石墨烯为材料的所述第一电极层102包括一第三石墨烯材料层和一第二碳纳米管材料层,以富勒烯-石墨烯为材料的所述第二电极层104包括一第四石墨烯材料层和一第二富勒烯材料层,所述第三石墨烯材料层和所述第二碳纳米管材料层组合为一体,所述第四石墨烯材料层和所述第二富勒烯材料层组合为一体。
作为一种改进,以富勒烯-石墨烯为材料的所述第一电极层包括至少两第一石墨烯材料层和至少两第一富勒烯材料层,以碳纳米管-石墨烯为材料的所述第二电极层包括至少两第二石墨烯材料层和至少两第一碳纳米管材料层,至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层交错组合为一体,至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层交错组合为一体;或者
以碳纳米管-石墨烯为材料的所述第一电极层包括至少两第三石墨烯材料层和至少两第二碳纳米管材料层,以富勒烯-石墨烯为材料的所述第二电极层包括至少两第四石墨烯材料层和至少两第二富勒烯材料层,至少两所述第三石墨烯材料层和至少两所述第二碳纳米管材料层交错组合为一体,至少两所述第四石墨烯材料层和至少两所述第二富勒烯材料层交错组合为一体。
在本发明中,术语“组合”包括层叠、混合。
在本发明的量子点显示器件中,所述第一电极层102的电子能级为4.8电子伏特,所述空穴注入层1031的电子能级为5.0电子伏特,所述空穴传输层1032的电子能级处于2.3电子伏特值5.2电子伏特的范围内,所述碳量子点发光层1033的电子能级处于3.9电子伏特至5.5电子伏特的范围内,所述电子传输层1034的电子能级处于2.8电子伏特至6.3电子伏特的范围内,所述第二电极层104的电子能级为4.5电子伏特。
参考图3,图3为本发明的量子点显示器件的制造方法的流程图。
本发明的量子点显示器件的制造方法包括以下步骤:
A(步骤301)、在玻璃基板上形成柔性基板101;
B(步骤302)、在所述柔性基板101上形成第一电极层102,所述第一电极层102作为量子点显示器件的阳极、阴极中的一者;
C(步骤303)、在所述第一电极层102上形成器件组合层103,所述器件组合层103包括电子传输层1034、碳量子点发光层1033、空穴传输层1032和空穴注入层1031;
D(步骤304)、在所述器件组合层103上设置第二电极层104,所述第二电极层104作为所述阳极、所述阴极中的另一者;
E(步骤305)、将所述玻璃基板与所述柔性基板101相分离;
其中,所述第一电极层102所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的一者,所述第二电极层104所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的另一者;或者
所述第一电极层102所对应的材料和所述第二电极层104所对应的材料均为非金属掺杂石墨烯。
参考图4,图4为图3中在所述玻璃基板上形成所述柔性基板101的步骤的流程图。
在本发明的量子点显示器件的制造方法中,所述步骤A包括:
a1(步骤3011)、将聚酰亚胺或聚对苯二甲酸乙二醇酯溶解于第一有机溶剂中,以形成具有预定重量百分比的第一溶液,其中,所述第一有机溶剂可例如为二甲基乙酰胺;
a2(步骤3012)、将所述第一溶液均匀涂布于所述玻璃基板上;
a3(步骤3013)、对所述玻璃基板上的所述第一溶液进行烘烤,以去除所述第一溶液中的溶剂和水分,以形成附着于所述玻璃基板上的所述柔性基板101。
在所述第一有机溶剂溶解有所述聚酰亚胺的情况下,所述步骤a3还用于使得所述第一溶液中的聚酰亚胺固化。
所述预定重量百分比处于1wt%至40wt%的范围内,优选地,所述预定重量百分比为10wt%。
在本发明的量子点显示器件的制造方法中,所述步骤C为:
在所述第一电极层102上按预定顺序设置所述空穴注入层1031、所述空穴传输层1032、所述碳量子点发光层1033和所述电子传输层1034,所述预定顺序为所述空穴注入层1031、所述空穴传输层1032、所述碳量子点发光层1033和所述电子传输层1034的先后顺序或所述电子传输层1034、所述碳量子点发光层1033、所述空穴传输层1032和所述空穴注入层1031的先后顺序。
具体地,所述步骤C包括:
c1、在所述第一电极层102上依次设置所述空穴注入层1031、所述空穴传输层1032、所述碳量子点发光层1033和所述电子传输层1034;或者
c2、在所述第一电极层102上依次设置所述电子传输层1034、所述碳量子点发光层1033、所述空穴传输层1032和所述空穴注入层1031;
参考图5和图6,图5为在所述第一电极层102所对应的材料为富勒烯-石墨烯的情况下,图3所示的在所述柔性基板101上形成所述第一电极层102的步骤的流程图,图6为在所述第二电极层104所对应的材料为碳纳米管-石墨烯的情况下,图3所示的在所述器件组合层103上设置所述第二电极层104的步骤的流程图。
在本发明的量子点显示器件的制造方法中,在所述第一电极层102所对应的材料为富勒烯-石墨烯,所述第二电极层104所对应的材料为碳纳米管-石墨烯的情况下,所述步骤B包括:
b1(步骤3021)、在所述柔性基板101上形成第一石墨烯材料层;
b2(步骤3021)、在所述第一石墨烯材料层上形成第一富勒烯材料层;
所述步骤D包括:
d1(步骤3041)、在所述器件组合层103上设置第二石墨烯材料层;
d2(步骤3042)、在所述第二石墨烯材料层上形成第一碳纳米管材料层。
作为一种改进,在所述第一电极层所对应的材料为富勒烯-石墨烯,所述第二电极层所对应的材料为碳纳米管-石墨烯的情况下,在所述步骤B中,重复执行所述步骤b1和所述步骤b2,以使所述第一电极层包括至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层,至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层交错组合为一体,在所述步骤D中,重复执行所述步骤d1和所述步骤d2,以使所述第二电极层包括至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层,至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层交错组合为一体。
参考图7和图8,图7为在所述第一电极层102所对应的材料为碳纳米管-石墨烯的情况下,图3所示的在所述柔性基板101上形成所述第一电极层102的步骤的流程图,图8为在所述第二电极层104所对应的材料为富勒烯-石墨烯的情况下,图3所示的在所述器件组合层103上设置所述第二电极层104的步骤的流程图。
在本发明的量子点显示器件的制造方法中,在所述第一电极层102所对应的材料为碳纳米管-石墨烯,所述第二电极层104所对应的材料为富勒烯-石墨烯的情况下,所述步骤B包括:
b3(步骤3023)、在所述柔性基板101上形成第三石墨烯材料层;
b4(步骤3024)、在所述第三石墨烯材料层上形成第二碳纳米管材料层;
所述步骤D为:
d3(步骤3043)、在所述器件组合层103上设置第四石墨烯材料层;
d4(步骤3044)、在所述第二石墨烯材料层上形成第二富勒烯材料层。
作为一种改进,在所述第一电极层所对应的材料为碳纳米管-石墨烯,所述第二电极层所对应的材料为富勒烯-石墨烯的情况下,在所述步骤B中,重复执行所述步骤b3和所述步骤b4,以使所述第一电极层包括至少两第三石墨烯材料层和至少两第二碳纳米管材料层,至少两所述第三石墨烯材料层和至少两所述第二碳纳米管材料层交错组合为一体,在所述步骤D中,重复执行所述步骤d3和所述步骤d4,以使所述第二电极层包括至少两第四石墨烯材料层和至少两第二富勒烯材料层,至少两所述第四石墨烯材料层和至少两所述第二富勒烯材料层交错组合为一体。
所述步骤a3包括:
a31、对涂布有所述溶液的所述玻璃基板以80摄氏度的温度烘烤120分钟,以去除所述第一溶液中的溶剂;
a32、对去除了所述溶剂的所述溶液以100摄氏度、150摄氏度、200摄氏度各烘烤60分钟,以去除水分,以形成附着于所述玻璃基板上的所述柔性基板101,得到包括所述柔性基板101和所述玻璃基板的第一组件。
所述步骤b1包括:
b11、将设置有第一石墨烯的第一铜箔压在第一玻璃板和第二玻璃板之间,其中,所述第一石墨烯设置于所述第一铜箔的一表面上,所述第一玻璃板与所述第一石墨烯相接触,所述第二玻璃板与所述第一铜箔相接触。
b12、利用所述第一玻璃板和所述第二玻璃板将所述第一石墨烯展平,具体地,滑动所述第一玻璃板和所述第二玻璃板的组合或所述第一铜箔,以使所述第一石墨烯展平,以形成第一石墨烯材料层。
b13、将所述第一玻璃板移除;
b14、将附着有所述柔性基板101的所述玻璃基板(所述第一组件)扣压于设置有所述第一石墨烯材料层的所述第一铜箔上,其中,所述柔性基板101与所述第一石墨烯相接触;
b15、将所述第二玻璃板移除;
b16、往所述第一铜箔上滴加铜蚀刻液,以利用所述铜蚀刻液对所述第一铜箔进行蚀刻;
b17、使用去离子水清洗包括所述第一石墨烯材料层、所述柔性基板101和所述玻璃基板的第二组件,以去除所述第二组件中残留的蚀刻液;
b18、烘干所述第二组件,具体地,以100摄氏度对所述第二组件烘烤120分钟。
所述步骤b2包括:
b21、将第一富勒烯溶解于第二有机溶剂中,以形成第二溶液,其中,所述第二有机溶剂可例如为甲苯溶液,所述第二溶液为5毫摩尔每升。
b22、在所述第二组件上涂布所述第二溶液,具体地,将所述第二组件以每分钟1000转的速度旋转,将所述第二溶液滴入到处于旋转状态的所述第二组件中,保持所述第二组件旋转至少30秒。
b23、烘干设置于所述第二组件上的所述第二溶液的溶剂,以形成所述第一富勒烯材料层,得到包括所述第一富勒烯材料层、所述第一石墨烯材料层、所述柔性基板101和所述玻璃基板的第三组件,具体地,对设置于所述第二组件上的所述第二溶液以200摄氏度烘烤120分钟,以形成所述第三组件。
重复执行所述步骤b22和所述步骤b23,即可使得所述第一电极层102具有多层富勒烯和多层石墨烯的结构。其中,术语“多层”是指至少两层。至少两层富勒烯和富勒烯石墨烯交错组合为一体。
即,所述第一电极层102为第一石墨烯-第一富勒烯-第二石墨烯-第二富勒烯-……-第N石墨烯-第N富勒烯的多层结构。
所述步骤d1包括:
d11、将设置有第二石墨烯的第二铜箔压在第三玻璃板和第四玻璃板之间,其中,所述第二石墨烯设置于所述第二铜箔的一表面上,所述第三玻璃板与所述第二石墨烯相接触,所述第四玻璃板与所述第二铜箔相接触。
d12、利用所述第三玻璃板和所述第四玻璃板将所述第二石墨烯展平,具体地,滑动所述第三玻璃板和所述第四玻璃板的组合或所述第二铜箔,以使所述第二石墨烯展平,以形成第二石墨烯材料层。
d13、将所述第三玻璃板移除;
d14、将所述器件组合层103与所述第三组件的组合扣压于设置有所述第二石墨烯材料层的所述第二铜箔上,其中,所述器件组合层103与所述第二石墨烯相接触;
d15、将所述第四玻璃板移除;
d16、往所述第二铜箔上滴加铜蚀刻液,以利用所述铜蚀刻液对所述第二铜箔进行蚀刻;
d17、使用去离子水清洗包括所述第二石墨烯材料层、所述器件组合层103、所述第一电极层102、所述柔性基板101和所述玻璃基板的第四组件,以去除所述第四组件中残留的蚀刻液;
d18、烘干所述第四组件,具体地,以100摄氏度对所述第四组件烘烤120分钟。
所述步骤d2包括:
d21、将含有分散于第三有机溶剂中的第一碳纳米管的第三溶液涂布在所述第四组件上,其中,所述第三有机溶剂可例如为二甲基甲酰胺。具体地,将所述第四组件以每分钟1000转的速度旋转,将所述第三溶液滴入到处于旋转状态的所述第四组件中,保持所述第四组件旋转至少30秒。
d22、烘干设置于所述第四组件上的所述第三溶液的溶剂,以形成所述第一碳纳米管材料层,得到包括所述第一碳纳米管材料层、所述第二石墨烯材料层、所述器件组合层103、所述第一电极层102、所述柔性基板101和所述玻璃基板的第五组件,具体地,对设置于所述第二石墨烯材料层上的所述第三溶液以200摄氏度烘烤120分钟,以形成所述第五组件。
所述步骤b3包括:
b31、将设置有第三石墨烯的第三铜箔压在第五玻璃板和第六玻璃板之间,其中,所述第三石墨烯设置于所述第三铜箔的一表面上,所述第五玻璃板与所述第三石墨烯相接触,所述第六玻璃板与所述第三铜箔相接触。
b32、利用所述第五玻璃板和所述第六玻璃板将所述第三石墨烯展平,具体地,滑动所述第五玻璃板和所述第六玻璃板的组合或所述第三铜箔,以使所述第三石墨烯展平,以形成所述第三石墨烯材料层。
b33、将所述第五玻璃板移除;
b34、将附着有所述柔性基板101的所述玻璃基板(所述第一组件)扣压于设置有所述第三石墨烯材料层的所述第三铜箔上,其中,所述柔性基板101与所述第三石墨烯相接触;
b35、将所述第六玻璃板移除;
b36、往所述第三铜箔上滴加铜蚀刻液,以利用所述铜蚀刻液对所述第三铜箔进行蚀刻;
b37、使用去离子水清洗包括所述第三石墨烯、所述柔性基板101和所述玻璃基板的第六组件,以去除所述第六组件中残留的蚀刻液;
b38、烘干所述第六组件,具体地,以100摄氏度对所述第二组件烘烤120分钟。
所述步骤b4包括:
b41、将含有分散于第四有机溶剂中的第二碳纳米管的第四溶液涂布在所述第六组件上,其中,所述第四有机溶剂可例如为二甲基甲酰胺。具体地,将所述第六组件以每分钟1000转的速度旋转,将所述第四溶液滴入到处于旋转状态的所述第六组件中,保持所述第六组件旋转至少30秒。
b42、烘干设置于所述第六组件上的所述第四溶液的溶剂,以形成所述第二碳纳米管材料层,得到包括所述第二碳纳米管材料层、所述第三石墨烯、所述柔性基板101和所述玻璃基板的第七组件,具体地,对设置于所述第三石墨烯材料层上的所述第四溶液以200摄氏度烘烤120分钟,以形成所述第七组件。
所述步骤d3包括:
d31、将设置有第四石墨烯的第四铜箔压在第七玻璃板和第八玻璃板之间,其中,所述第四石墨烯设置于所述第四铜箔的一表面上,所述第七玻璃板与所述第四石墨烯相接触,所述第八玻璃板与所述第四铜箔相接触。
d32、利用所述第七玻璃板和所述第八玻璃板将所述第四石墨烯展平,具体地,滑动所述第七玻璃板和所述第八玻璃板的组合或所述第四铜箔,以使所述第四石墨烯展平,以形成第四石墨烯材料层。
d33、将所述第七玻璃板移除;
d34、将所述器件组合层103与所述第七组件的组合扣压于设置有所述第四石墨烯材料层的所述第四铜箔上,其中,所述器件组合层103与所述第四石墨烯相接触;
d35、将所述第八玻璃板移除;
d36、往所述第四铜箔上滴加铜蚀刻液,以利用所述铜蚀刻液对所述第四铜箔进行蚀刻;
d37、使用去离子水清洗包括所述第四石墨烯材料层、所述器件组合层103和所述第七组件的第八组件,以去除所述第八组件中残留的蚀刻液;
d38、烘干所述第八组件,具体地,以100摄氏度对所述第八组件烘烤120分钟。
所述步骤d4包括:
d41、将第二富勒烯溶解于第五有机溶剂中,以形成第五溶液,其中,所述第五有机溶剂可例如为甲苯溶液,所述第五溶液为5毫摩尔每升。
d42、在所述第八组件上涂布所述第五溶液,具体地,将所述第八组件以每分钟1000转的速度旋转,将所述第五溶液滴入到处于旋转状态的所述第八组件中,保持所述第八组件旋转至少30秒。
d43、烘干设置于所述第八组件上的所述第五溶液的溶剂,以形成所述第二富勒烯材料层,得到包括所述第二富勒烯材料层和所述第八组件的第九组件,具体地,对设置于所述第八组件上的所述第五溶液以200摄氏度烘烤120分钟,以形成所述第九组件。
重复执行所述步骤d42和所述步骤d43,即可使得所述第一电极层102具有多层富勒烯和多层石墨烯的结构。其中,术语“多层”是指至少两层。至少两层富勒烯和富勒烯石墨烯交错组合为一体。
其中,单层的石墨烯可通过对所述柔性基板101和/或所述玻璃基板进行剥离得到。
所述步骤c1包括:
c11、将10mg/mL的第六溶液涂布在所述第一电极层102上,具体地,将所述第一电极层102、所述柔性基板101和所述玻璃基板的组合以每分钟3000转的速度旋转,将所述第六溶液滴入到所述第一电极层102上,保持所述第一电极层102、所述柔性基板101和所述玻璃基板的组合旋转60秒,其中,所述第六溶液为所述PEDOT与所述PSS的混合溶液。
c12、对设置在所述第一电极层102上的所述第六溶液进行烘烤,以形成所述空穴注入层1031,得到包括所述空穴注入层1031、所述第一电极层102、所述柔性基板101和所述玻璃基板的第十组件;
c13、将10mg/mL的第七溶液涂布在所述空穴注入层1031上,其中,所述第七溶液为含有所述Poly-TPD的溶液;
c14、对设置在所述空穴注入层1031上的所述第七溶液进行烘烤,以形成所述空穴传输层1032,得到包括所述空穴传输层1032、所述空穴注入层1031、所述第一电极层102、所述柔性基板101和所述玻璃基板的第十一组件;
c15、将10mg/mL包含溶解于第六有机溶剂的碳量子点的第八溶液涂布在所述空穴传输层1032上,具体地,将所述第十一组件以每分钟2000转的速度旋转,将所述第八溶液滴入到所述空穴传输层1032上,保持所述第十一组件旋转20秒,所述第六有机溶剂可例如为正己烷;
c16、对设置在所述空穴传输层1032上的所述第八溶液进行烘烤,具体地,对设置在所述空穴传输层1032上的所述第八溶液放在真空干燥箱中以80摄氏度烘烤60分钟,以形成所述碳量子点发光层1033,得到包括所述碳量子点发光层1033和所述十一组件的第十二组件。
c17、利用蒸镀机将1,3,5-三(1-苯基-1H-苯并咪唑-2-基)苯蒸镀在所述碳量子点发光层1033上,以形成所述电子传输层1034,得到包括所述电子传输层1034和所述第十二组件的第十三组件。
所述步骤c2包括:
c21、利用蒸镀机将1,3,5-三(1-苯基-1H-苯并咪唑-2-基)苯蒸镀在所述第一电极层102上,以形成所述电子传输层1034,得到包括所述电子传输层1034、所述第一电极层102、所述柔性基板101和所述玻璃基板的第十四组件;
c22、将10mg/mL包含溶解于第六有机溶剂的碳量子点的第八溶液涂布在所述电子传输层1034上,具体地,将所述第十四组件以每分钟2000转的速度旋转,将所述第八溶液滴入到所述电子传输层1034上,保持所述第十四组件旋转20秒,所述第六有机溶剂可例如为正己烷;
c23、对设置在所述电子传输层1034上的所述第八溶液进行烘烤,具体地,对设置在所述电子传输层1034上的所述第八溶液放在真空干燥箱中以80摄氏度烘烤60分钟,以形成所述碳量子点发光层1033,得到包括所述碳量子点发光层1033和所述十四组件的第十五组件。
c24、将10mg/mL的第七溶液涂布在所述碳量子点发光层1033上,其中,所述第七溶液为含有所述Poly-TPD的溶液;
c25、对设置在所述碳量子点发光层1033上的所述第七溶液进行烘烤,以形成所述空穴传输层1032,得到包括所述空穴传输层1032和所述第十五组件的第十六组件;
c26、将10mg/mL的第六溶液涂布在所述空穴传输层1032,具体地,将所述第十六组件以每分钟3000转的速度旋转,将所述第六溶液滴入到所述空穴传输层1032上,保持所述第十六组件旋转60秒,其中,所述第六溶液为所述PEDOT与所述PSS的混合溶液。
c27、对设置在所述空穴传输层1032上的所述第六溶液进行烘烤,以形成所述空穴注入层1031,得到包括所述空穴注入层1031、所述第十六组件的第十七组件。
通过上述技术方案,由于本发明的量子点显示器件中的柔性基板、第一电极层、器件组合层、第二电极层均由有机材料制成,而不含有金属材料,因此能减少对金属材料的使用,降低对环境的不良影响。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本发明,本领域的普通技术人员,在不脱离本发明的精神和范围内,均可作各种更动与润饰,因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种量子点显示器件,其中,所述量子点显示器件包括:
    柔性基板;
    第一电极层,所述第一电极层设置在所述柔性基板上;
    器件组合层,所述器件组合层设置在所述第一电极层上;
    第二电极层,所述第二电极层设置在所述器件组合层上;
    其中,所述第一电极层作为所述量子点显示器件的阳极、阴极中的一者,所述第二电极层作为所述阳极、所述阴极中的另一者;
    所述器件组合层包括电子传输层、碳量子点发光层、空穴传输层和空穴注入层;
    所述第一电极层所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的一者,所述第二电极层所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的另一者;或者
    所述第一电极层所对应的材料和所述第二电极层所对应的材料均为非金属掺杂石墨烯;
    所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层按预定顺序设置在所述第一电极层上,所述预定顺序为所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层的先后顺序或所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层的先后顺序;
    所述非金属掺杂石墨烯为氮掺杂石墨烯、磷掺杂石墨烯、硅掺杂石墨烯、硼掺杂石墨烯中的一者;
    所述碳量子点发光层所对应的材料为碳量子点或石墨烯量子点。
  2. 根据权利要求1所述的量子点显示器件,其中,以富勒烯-石墨烯为材料的所述第一电极层或所述第二电极层的厚度处于40纳米至120纳米的范围内,以碳纳米管-石墨烯为材料的所述第二电极层或所述第一电极层的厚度处于20纳米至100纳米的范围内,所述空穴传输层的厚度处于20纳米至60纳米的范围内,所述空穴注入层的厚度处于20纳米至60纳米的范围内,所述碳量子点发光层的厚度处于10纳米至30纳米的范围内,所述电子传输层的厚度处于10纳米至30纳米的范围内。
  3. 根据权利要求1所述的量子点显示器件,其中,以富勒烯-石墨烯为材料的所述第一电极层包括一第一石墨烯材料层和一第一富勒烯材料层,以碳纳米管-石墨烯为材料的所述第二电极层包括一第二石墨烯材料层和一第一碳纳米管材料层,所述第一石墨烯材料层和所述第一富勒烯材料层组合为一体,所述第二石墨烯材料层和所述第一碳纳米管材料层组合为一体;或者
    以碳纳米管-石墨烯为材料的所述第一电极层包括一第三石墨烯材料层和一第二碳纳米管材料层,以富勒烯-石墨烯为材料的所述第二电极层包括一第四石墨烯材料层和一第二富勒烯材料层,所述第三石墨烯材料层和所述第二碳纳米管材料层组合为一体,所述第四石墨烯材料层和所述第二富勒烯材料层组合为一体。
  4. 根据权利要求3所述的量子点显示器件,其中,以富勒烯-石墨烯为材料的所述第一电极层包括至少两第一石墨烯材料层和至少两第一富勒烯材料层,以碳纳米管-石墨烯为材料的所述第二电极层包括至少两第二石墨烯材料层和至少两第一碳纳米管材料层,至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层交错组合为一体,至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层交错组合为一体;或者
    以碳纳米管-石墨烯为材料的所述第一电极层包括至少两第三石墨烯材料层和至少两第二碳纳米管材料层,以富勒烯-石墨烯为材料的所述第二电极层包括至少两第四石墨烯材料层和至少两第二富勒烯材料层,至少两所述第三石墨烯材料层和至少两所述第二碳纳米管材料层交错组合为一体,至少两所述第四石墨烯材料层和至少两所述第二富勒烯材料层交错组合为一体。
  5. 一种量子点显示器件,其中,所述量子点显示器件包括:
    柔性基板;
    第一电极层,所述第一电极层设置在所述柔性基板上;
    器件组合层,所述器件组合层设置在所述第一电极层上;
    第二电极层,所述第二电极层设置在所述器件组合层上;
    其中,所述第一电极层作为所述量子点显示器件的阳极、阴极中的一者,所述第二电极层作为所述阳极、所述阴极中的另一者;
    所述器件组合层包括电子传输层、碳量子点发光层、空穴传输层和空穴注入层;
    所述第一电极层所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的一者,所述第二电极层所对应的材料为富勒烯-石墨烯、碳纳米管-石墨烯中的另一者;或者
    所述第一电极层所对应的材料和所述第二电极层所对应的材料均为非金属掺杂石墨烯。
  6. 根据权利要求5所述的量子点显示器件,其中,所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层按预定顺序设置在所述第一电极层上,所述预定顺序为所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层的先后顺序或所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层的先后顺序。
  7. 根据权利要求5所述的量子点显示器件,其中,以富勒烯-石墨烯为材料的所述第一电极层或所述第二电极层的厚度处于40纳米至120纳米的范围内,以碳纳米管-石墨烯为材料的所述第二电极层或所述第一电极层的厚度处于20纳米至100纳米的范围内,所述空穴传输层的厚度处于20纳米至60纳米的范围内,所述空穴注入层的厚度处于20纳米至60纳米的范围内,所述碳量子点发光层的厚度处于10纳米至30纳米的范围内,所述电子传输层的厚度处于10纳米至30纳米的范围内。
  8. 根据权利要求7所述的量子点显示器件,其中,以富勒烯-石墨烯为材料的所述第一电极层或所述第二电极层的厚度为80纳米,以碳纳米管-石墨烯为材料的所述第二电极层或所述第一电极层的厚度为60纳米,所述空穴传输层的厚度为40纳米,所述空穴注入层的厚度为40纳米,所述碳量子点发光层的厚度为20纳米,所述电子传输层的厚度为20纳米。
  9. 根据权利要求5所述的量子点显示器件,其中,以富勒烯-石墨烯为材料的所述第一电极层包括一第一石墨烯材料层和一第一富勒烯材料层,以碳纳米管-石墨烯为材料的所述第二电极层包括一第二石墨烯材料层和一第一碳纳米管材料层,所述第一石墨烯材料层和所述第一富勒烯材料层组合为一体,所述第二石墨烯材料层和所述第一碳纳米管材料层组合为一体;或者
    以碳纳米管-石墨烯为材料的所述第一电极层包括一第三石墨烯材料层和一第二碳纳米管材料层,以富勒烯-石墨烯为材料的所述第二电极层包括一第四石墨烯材料层和一第二富勒烯材料层,所述第三石墨烯材料层和所述第二碳纳米管材料层组合为一体,所述第四石墨烯材料层和所述第二富勒烯材料层组合为一体。
  10. 根据权利要求9所述的量子点显示器件,其中,以富勒烯-石墨烯为材料的所述第一电极层包括至少两第一石墨烯材料层和至少两第一富勒烯材料层,以碳纳米管-石墨烯为材料的所述第二电极层包括至少两第二石墨烯材料层和至少两第一碳纳米管材料层,至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层交错组合为一体,至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层交错组合为一体;或者
    以碳纳米管-石墨烯为材料的所述第一电极层包括至少两第三石墨烯材料层和至少两第二碳纳米管材料层,以富勒烯-石墨烯为材料的所述第二电极层包括至少两第四石墨烯材料层和至少两第二富勒烯材料层,至少两所述第三石墨烯材料层和至少两所述第二碳纳米管材料层交错组合为一体,至少两所述第四石墨烯材料层和至少两所述第二富勒烯材料层交错组合为一体。
  11. 根据权利要求5所述的量子点显示器件,其中,所述非金属掺杂石墨烯为氮掺杂石墨烯、磷掺杂石墨烯、硅掺杂石墨烯、硼掺杂石墨烯中的一者。
  12. 根据权利要求5所述的量子点显示器件,其中,所述碳量子点发光层所对应的材料为碳量子点或石墨烯量子点。
  13. 根据权利要求5所述的量子点显示器件,其中,所述第一电极层的电子能级为4.8电子伏特,所述空穴注入层的电子能级为5.0电子伏特,所述空穴传输层的电子能级处于2.3电子伏特值5.2电子伏特的范围内,所述碳量子点发光层的电子能级处于3.9电子伏特至5.5电子伏特的范围内,所述电子传输层的电子能级处于2.8电子伏特至6.3电子伏特的范围内,所述第二电极层的电子能级为4.5电子伏特。
  14. 一种如权利要求5所述的量子点显示器件的制造方法,其中,所述方法包括以下步骤:
    A、在所述玻璃基板上形成所述柔性基板;
    B、在所述柔性基板上形成所述第一电极层,所述第一电极层作为所述阳极、所述阴极中的一者;
    C、在所述第一电极层上形成所述器件组合层,所述器件组合层包括所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层;
    D、在所述器件组合层上设置所述第二电极层,所述第二电极层作为所述阳极、所述阴极中的另一者;
    E、将所述玻璃基板与所述柔性基板相分离。
  15. 根据权利要求14所述的量子点显示器件的制造方法,其中,所述步骤A包括:
    a1、将聚酰亚胺或聚对苯二甲酸乙二醇酯溶解于第一有机溶剂中,以形成具有预定重量百分比的第一溶液,所述第一有机溶剂可例如为二甲基乙酰胺;
    a2、将所述第一溶液均匀涂布于所述玻璃基板上;
    a3、对所述玻璃基板上的所述第一溶液进行烘烤,以去除所述第一溶液中的溶剂和水分,以形成附着于所述玻璃基板上的所述柔性基板。
  16. 根据权利要求15所述的量子点显示器件的制造方法,其中,所述步骤a3包括:
    a31、对涂布有所述溶液的所述玻璃基板以80摄氏度的温度烘烤120分钟,以去除所述第一溶液中的溶剂;
    a32、对去除了所述溶剂的所述溶液以100摄氏度、150摄氏度、200摄氏度各烘烤60分钟,以去除水分,以形成附着于所述玻璃基板上的所述柔性基板,得到包括所述柔性基板和所述玻璃基板的第一组件。
  17. 根据权利要求14所述的量子点显示器件的制造方法,其中,所述步骤C为:
    在所述第一电极层上按预定顺序设置所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层,所述预定顺序为所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层的先后顺序或所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层的先后顺序。
  18. 根据权利要求17所述的量子点显示器件的制造方法,其中,所述步骤C包括:
    c1、在所述第一电极层上依次设置所述空穴注入层、所述空穴传输层、所述碳量子点发光层和所述电子传输层;或者
    c2、在所述第一电极层上依次设置所述电子传输层、所述碳量子点发光层、所述空穴传输层和所述空穴注入层。
  19. 根据权利要求14所述的量子点显示器件的制造方法,其中,在所述第一电极层所对应的材料为富勒烯-石墨烯,所述第二电极层所对应的材料为碳纳米管-石墨烯的情况下,所述步骤B包括:
    b1、在所述柔性基板上形成第一石墨烯材料层;
    b2、在所述第一石墨烯材料层上形成第一富勒烯材料层;
    所述步骤D包括:
    d1、在所述器件组合层上设置第二石墨烯材料层;
    d2、在所述第二石墨烯材料层上形成第一碳纳米管材料层;
    在所述第一电极层所对应的材料为碳纳米管-石墨烯,所述第二电极层所对应的材料为富勒烯-石墨烯的情况下,所述步骤B包括:
    b3、在所述柔性基板上形成第三石墨烯材料层;
    b4、在所述第三石墨烯材料层上形成第二碳纳米管材料层;
    所述步骤D包括:
    d3、在所述器件组合层上设置第四石墨烯材料层;
    d4、在所述第二石墨烯材料层上形成第二富勒烯材料层。
  20. 根据权利要求19所述的量子点显示器件的制造方法,其中,在所述第一电极层所对应的材料为富勒烯-石墨烯,所述第二电极层所对应的材料为碳纳米管-石墨烯的情况下,在所述步骤B中,重复执行所述步骤b1和所述步骤b2,以使所述第一电极层包括至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层,至少两所述第一石墨烯材料层和至少两所述第一富勒烯材料层交错组合为一体,在所述步骤D中,重复执行所述步骤d1和所述步骤d2,以使所述第二电极层包括至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层,至少两所述第二石墨烯材料层和至少两所述第一碳纳米管材料层交错组合为一体;
    在所述第一电极层所对应的材料为碳纳米管-石墨烯,所述第二电极层所对应的材料为富勒烯-石墨烯的情况下,在所述步骤B中,重复执行所述步骤b3和所述步骤b4,以使所述第一电极层包括至少两第三石墨烯材料层和至少两第二碳纳米管材料层,至少两所述第三石墨烯材料层和至少两所述第二碳纳米管材料层交错组合为一体,在所述步骤D中,重复执行所述步骤d3和所述步骤d4,以使所述第二电极层包括至少两第四石墨烯材料层和至少两第二富勒烯材料层,至少两所述第四石墨烯材料层和至少两所述第二富勒烯材料层交错组合为一体。
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