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WO2018186030A1 - Composition de résine, préimprégné, stratifié plaqué de métal, carte de circuit imprimé, et carte de circuit imprimé flexorigide - Google Patents

Composition de résine, préimprégné, stratifié plaqué de métal, carte de circuit imprimé, et carte de circuit imprimé flexorigide Download PDF

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Publication number
WO2018186030A1
WO2018186030A1 PCT/JP2018/005422 JP2018005422W WO2018186030A1 WO 2018186030 A1 WO2018186030 A1 WO 2018186030A1 JP 2018005422 W JP2018005422 W JP 2018005422W WO 2018186030 A1 WO2018186030 A1 WO 2018186030A1
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WIPO (PCT)
Prior art keywords
printed wiring
wiring board
resin
composition
flex
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PCT/JP2018/005422
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English (en)
Japanese (ja)
Inventor
章裕 山内
中村　善彦
洋之 藤澤
孝 新保
Original Assignee
パナソニックＩｐマネジメント株式会社
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to KR1020197021161A priority Critical patent/KR102480537B1/ko
Priority to CN201880005369.8A priority patent/CN110121532A/zh
Publication of WO2018186030A1 publication Critical patent/WO2018186030A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present disclosure relates to a resin composition, a prepreg, a metal-clad laminate, a printed wiring board, and a flex-rigid printed wiring board.
  • a prepreg used for manufacturing a printed wiring board or the like is conventionally formed by impregnating a fiber base material with a resin composition containing a thermosetting resin and heating and drying it until it is in a semi-cured state. And after cutting this prepreg to a predetermined dimension, the required number of sheets are stacked, and metal foil is stacked on one or both sides, and this is heated and pressed to form a metal-clad laminate used for manufacturing printed wiring boards Has been made.
  • the prepreg since the prepreg is in a semi-cured state, it is fragile, and powder is likely to fall off when the prepreg is cut or laminated. Due to the powder falling that occurs during the handling of the prepreg, the produced laminate may be dented like a dent and a dent defect may occur.
  • Patent Document 1 discloses a resin composition containing an epoxy resin, a curing agent such as dicyandiamide, and a crosslinked rubber having a particle size of 1 ⁇ m or less.
  • Patent Document 2 discloses an epoxy resin composition containing an epoxy resin and a phenoxy resin modified with an acid anhydride.
  • An object of the present disclosure is to provide a resin composition capable of forming a prepreg having good moldability and high adhesion to a base material, and having less powder falling off, and a cured product having a low coefficient of thermal expansion, and this resin composition And a metal-clad laminate, a printed wiring board, and a flex-rigid printed wiring board containing a cured product of the resin composition.
  • the resin composition according to the present disclosure contains (A) an epoxy resin, (B) dicyandiamide, (C) a phenoxy resin, (D) a core-shell rubber, and (E) an inorganic filler.
  • C) The weight average molecular weight of the phenoxy resin is 30000 or more.
  • C) The tensile elongation of the phenoxy resin is 20% or more.
  • C) Content of a phenoxy resin is 5 mass parts or more and 30 mass parts or less with respect to 100 mass parts of (A) epoxy resins.
  • (D) Content of core shell rubber is 3 to 20 mass parts with respect to 100 mass parts of (A) epoxy resin.
  • the prepreg according to the present disclosure has a fiber base material and a semi-cured product of the resin composition impregnated by the fiber base material.
  • the metal-clad laminate according to the present disclosure has an insulating layer containing a cured product of the resin composition and a metal layer provided on the insulating layer.
  • the printed wiring board according to the present disclosure has an insulating layer containing a cured product of the resin composition and a conductor wiring provided on the insulating layer.
  • a flex rigid printed wiring board includes a plurality of rigid portions, a flex portion connecting the plurality of rigid portions, and a conductor wiring provided in at least one of the plurality of rigid portions and the flex portion. And at least one of the plurality of rigid portions includes a cured product of the resin composition.
  • a resin composition capable of forming a prepreg having good moldability and high adhesion to a base material, and having less powder falling off, and a cured product having a low coefficient of thermal expansion, and this resin composition
  • a metal-clad laminate, a printed wiring board, and a flex-rigid printed wiring board containing a prepreg produced from the product and a cured product of this resin composition can be obtained.
  • FIG. 1 is a cross-sectional view of a prepreg according to an embodiment of the present disclosure.
  • FIG. 2 is a cross-sectional view of a metal-clad laminate according to an embodiment of the present disclosure.
  • FIG. 3A is a cross-sectional view of a printed wiring board having a single-layer structure according to an embodiment of the present disclosure.
  • FIG. 3B is a cross-sectional view of a printed wiring board having a multilayer structure according to an embodiment of the present disclosure.
  • FIG. 4 is a cross-sectional view of the flex-rigid printed wiring board according to the first embodiment of the present disclosure.
  • FIG. 5 is a cross-sectional view of a flex-rigid printed wiring board according to the second embodiment of the present disclosure.
  • FIG. 6 is a cross-sectional view of a flex-rigid printed wiring board according to the third embodiment of the present disclosure.
  • composition (X) includes (A) an epoxy resin, (B) dicyandiamide, (C) a phenoxy resin, (D) a core shell rubber, and (E) And an inorganic filler.
  • C The weight average molecular weight of the phenoxy resin is 30000 or more.
  • C The tensile elongation of the phenoxy resin is 20% or more.
  • C Content of a phenoxy resin is 5 mass parts or more and 30 mass parts or less with respect to 100 mass parts of (A) epoxy resins.
  • (D) Content of core shell rubber is 3 to 20 mass parts with respect to 100 mass parts of (A) epoxy resin.
  • the prepreg produced from the composition (X) has good moldability and high adhesion to the base material, and is free from powder falling off. There is little outbreak. Furthermore, the cured product of the composition (X) has a low coefficient of thermal expansion.
  • composition (X) The components contained in the composition (X) will be described in more detail.
  • composition (X) An epoxy resin (hereinafter referred to as “component (A)”) can impart thermosetting properties to the composition (X). Moreover, the cured
  • component (A) examples include bisphenol type epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, and bisphenol S type epoxy resins; novolak type epoxy resins such as phenol novolac type epoxy resins and cresol novolak type epoxy resins.
  • Biphenyl type epoxy resin xylylene type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl type epoxy resin, biphenyl novolac type epoxy resin, biphenyl dimethylene type epoxy resin, trisphenol methane novolak type epoxy resin, tetramethylbiphenyl type epoxy resin
  • Arylalkylene type epoxy resins such as naphthalene type epoxy resins such as tetrafunctional naphthalene type epoxy resins; naphthalene skeleton modified cresolno Rack-type epoxy resin, naphthalene all-aralkyl epoxy resin, naphthol aralkyl-type epoxy resin, methoxynaphthalene-modified cresol novolac-type epoxy resin, methoxynaphthalenedi-methylene-type epoxy resin, etc.
  • a component may be used individually by 1 type in these, and may use 2 or more types together.
  • the composition (X) contains a bisphenol A type epoxy resin having a weight average molecular weight of 30000 or more and a tensile elongation of 20% or more
  • this bisphenol A type epoxy resin is a phenoxy resin of component (C) As contained in the composition (X). Therefore, the bisphenol A type epoxy resin contained as component (A) is a bisphenol A type epoxy resin having a weight average molecular weight of less than 30000, a bisphenol A type epoxy resin having a tensile elongation of less than 20%, or a weight average molecular weight. Is a bisphenol A type epoxy resin having a tensile elongation of less than 20%.
  • the component (A) preferably contains a phosphorus-modified epoxy resin.
  • the phosphorus-modified epoxy resin means an epoxy resin containing a phosphorus atom.
  • it is environmentally friendly because it can impart flame retardancy to the cured product of the composition (X) without adding a halogen-based flame retardant.
  • the phosphorus-modified epoxy resin is not particularly limited.
  • a phosphorus-modified epoxy resin obtained by reacting an organic phosphorus compound and a quinone compound and reacting the reaction product generated by this reaction with the epoxy resin is used. be able to.
  • the phosphorus-modified epoxy resin preferably has a structure represented by the following formula (1).
  • the cured product of the composition (X) can have excellent flame retardancy.
  • content of (A) component exists in the range of 40 to 80 mass parts with respect to 100 mass parts of compositions (X).
  • the composition (X) can have sufficient thermosetting properties.
  • content of a component exists in the range of 50 to 70 mass parts with respect to 100 mass parts of composition (X).
  • the phosphorus-modified epoxy resin is preferably contained so that the phosphorus concentration in 100 parts by mass of the component (A) is 1% or more.
  • the cured product of the composition (X) can have higher flame retardancy.
  • the phosphorus-modified epoxy resin is contained so that the phosphorus concentration in 100 parts by mass of the component (A) is 1.5% or more.
  • composition (X) contains (B) component as a hardening
  • the composition (X) contains the component (B) as a curing agent
  • the semi-cured product and the cured product of the composition (X) are particularly polyimide base materials as compared with the case of containing a phenolic curing agent. Has higher adhesion to. Since the polyimide base material is suitably used as a cover lay or the like of a printed wiring board, the prepreg produced from the composition (X) can be effectively used as a substrate material for producing the printed wiring board.
  • the component (B) is such that the active hydrogen equivalent of the component (B) is within the range of 0.3 to 0.8 with respect to the epoxy equivalent 1 of the component (A). It is preferable to contain, and it is more preferable to contain so that it may become in the range of 0.4 or more and 0.7 or less.
  • an epoxy equivalent is ratio of the molecular weight of an epoxy resin with respect to the number of the epoxy groups contained in the molecule
  • the active hydrogen equivalent is the ratio of the molecular weight of the compound used as the curing agent to the number of active hydrogens directly bonded to the nitrogen atom of the amino group in the compound used as the curing agent.
  • a phenoxy resin (hereinafter referred to as “component (C)”) is a resin that has been polymerized in a straight chain by a condensation reaction of bisphenols and epichlorohydrin.
  • component (C) can give flexibility to the prepreg produced from composition (X), and can reduce generation
  • the composition (X) contains the component (C)
  • the semi-cured product and the cured product of the composition (X) can have particularly good adhesion to the polyimide substrate.
  • the weight average molecular weight of a component is 30000 or more.
  • the upper limit of the weight average molecular weight of (C) component is not specifically limited, For example, it is preferable that it is 100,000 or less.
  • the tensile elongation of the component is 20% or more.
  • component (C) for example, product numbers “YP-50” and “YP50S” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. can be used.
  • the content of the component (C) is 5 to 30 parts by mass with respect to 100 parts by mass of the component (A).
  • (C) When content of a component exists in this range, generation
  • component (D)) is a prepreg produced from composition (X) without significantly affecting the glass transition temperature of the cured product when composition (X) is cured. In addition, flexibility can be imparted to the cured product. For this reason, the powder fall of the prepreg produced from composition (X) is reduced. Furthermore, since the composition (X) contains the component (D), the composition (X) has a good substrate impregnation property, and the prepreg produced from the composition (X) is good. Can have moldability.
  • Component is an aggregate of rubber particles.
  • the rubber particles have a core part and a shell part surrounding the core part. That is, the rubber particle is a composite material containing different materials in the core part and the shell part.
  • the core portion is not particularly limited, but may include, for example, silicone / acrylic rubber, acrylic rubber, silicone rubber, nitrile rubber, butadiene rubber, and the like.
  • the core part preferably contains silicone / acrylic rubber or acrylic rubber. In this case, high flexibility can be imparted to the prepreg and cured product produced from the composition (X).
  • the shell part is not particularly limited, and may be composed of, for example, a plurality of graft chains bonded to the core part.
  • the graft chain may have a functional group.
  • the functional group include a methacryl group, an acryl group, a vinyl group, an epoxy group, an amino group, a ureido group, a mercapto group, and an isocyanate group.
  • the shell part may be comprised from polymers, such as polymethyl methacrylate and a polystyrene, for example.
  • the shape and particle size of the rubber particles are not particularly limited.
  • the average particle size of the rubber particles is preferably 0.1 to 2.0 ⁇ m, for example.
  • the average particle diameter of the rubber particles is a volume-based median diameter calculated from the measured value of the particle size distribution by the laser diffraction / scattering method, and is obtained using a commercially available laser analysis / scattering particle size distribution measuring apparatus.
  • Examples of the component (D) include product numbers “SRK200A”, “S2100”, “SX-005”, “S-2001”, “S-2006”, “S-2030”, “S” manufactured by Mitsubishi Rayon Co., Ltd. -2200 ",” SX-006 “,” W-450A “,” E-901 “,” C-223A “; product numbers” AC3816 “,” AC3816N “,” AC3832 “,” AC4030 “manufactured by Aika Industry Co., Ltd. , “AC3364”, “IM101”; “MX-217”, “MX-153”, “MX-960” manufactured by Kaneka Corporation, etc. can be used.
  • the content of the component (D) is 3 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the component (A).
  • content of (D) component exists in this range, the prepreg produced from composition (X) can have favorable base-material adhesiveness. Furthermore, in this case, it can be suppressed that the coefficient of thermal expansion of the cured product of the composition (X) becomes too high.
  • composition (X) contains the (E) inorganic filler (hereinafter referred to as the (E) component)
  • the cured product of the composition (X) can have a low coefficient of thermal expansion.
  • composition (X) contains (D) component
  • cured material of composition (X) tends to become high.
  • the cured product of the composition (X) can have a low coefficient of thermal expansion because the composition (X) contains the component (E)
  • the cured product of the composition (X) Even when subjected to stress, deformation such as warpage and generation of cracks are small.
  • the component (E) is not particularly limited.
  • these inorganic fillers may be used alone or in combination of two or more.
  • the component (E) preferably contains at least one of aluminum hydroxide and silica.
  • the shape and particle size of the component are not particularly limited.
  • the average particle diameter of the component (E) is preferably 0.1 to 5.0 ⁇ m, for example.
  • the average particle diameter of the component (E) is a volume-based median diameter calculated from the measured value of the particle size distribution by the laser diffraction / scattering method, and is obtained using a commercially available laser analysis / scattering particle size distribution measuring apparatus.
  • the component may be surface-treated with a coupling agent or the like. Thereby, the adhesiveness to the base material of the hardened
  • a coupling agent for example, a silane coupling agent such as an epoxy silane coupling agent or a mercaptosilane coupling agent can be used.
  • content of (E) component is 5 to 100 mass parts with respect to 100 mass parts of (A) component.
  • content of the component (E) is within this range, the coefficient of thermal expansion of the cured product of the composition (X) is lowered without adversely affecting the powderability of the prepreg produced from the composition (X). can do.
  • the content of component (E) is more preferably 10 parts by weight and 70 parts by weight with respect to 100 parts by weight of component (A).
  • the composition (X) contains components other than the components (A), (B), (C), (D), and (E). Also good.
  • the composition (X) may contain, for example, a dispersant, a colorant, an adhesion promoter, a curing accelerator, an organic solvent, other resins, and additives.
  • Composition (X) may contain, for example, a resin other than the components (A) and (C) when the effects of the present invention are not inhibited.
  • the composition (X) may contain, for example, a phenol resin, a bismaleimide resin, a cyanate resin, and the like.
  • composition (X) may contain a curing agent other than the component (B), for example, when the effects of the present invention are not inhibited.
  • a curing agent other than the component (B) include amine curing agents other than dicyandiamide, urea curing agents, and acid anhydride curing agents.
  • the prepreg 1 includes a fiber base 12 and a semi-cured product 11 of the composition (X) impregnated by the fiber base 12.
  • the fiber base material 12 is not particularly limited, and for example, a woven fabric base material such as a plain woven base material woven so that warp and weft yarns are substantially orthogonal can be used.
  • a woven fabric base material such as a plain woven base material woven so that warp and weft yarns are substantially orthogonal
  • the fiber base 12 for example, a woven base made of inorganic fibers, a woven base made of organic fibers, or the like can be used.
  • Examples of the woven fabric substrate made of inorganic fibers include glass cloth.
  • Examples of the woven fabric substrate made of organic fibers include aramid cloth and polyester cloth.
  • the prepreg 1 can be formed, for example, by impregnating the composition (X) into the fiber base material 12 and heating and drying it until it is in a semi-cured state.
  • the temperature conditions and time for making the semi-cured state may be, for example, 170 to 200 ° C. and 30 to 90 minutes.
  • the semi-cured state is a B-stage state with a so-called prepreg or the like. That is, it is a resin composition in an intermediate stage in which the resin composition in the A stage state (varnish state) is cured to the C stage state (cured state) by heating.
  • the prepreg 1 thus formed is formed using the composition (X), as described above, not only has good moldability and high adhesion to the substrate, but also powder. There are few drops. For this reason, it is possible to prevent the produced laminated board from being dented like a dent due to dust falling that occurs when handling the prepreg 1 or when producing a laminated board from the prepreg 1. it can.
  • the prepreg 1 may be used by providing an opening in the prepreg 1 by punching the mold.
  • the prepreg 1 provided with the opening is laminated on the core material used for manufacturing the flex-rigid printed wiring board, the prepreg 1 is struck onto the core material due to powder falling off from the end surface of the prepreg 1 or the inner peripheral surface of the opening. It is possible to prevent the generation of a mark or a defect due to powder that has fallen off. Therefore, the prepreg 1 formed using the composition (X) can be effectively used as a material for producing a high-performance printed wiring board.
  • Metal-clad laminate 2 With reference to FIG. 2, the metal-clad laminated board 2 which concerns on this embodiment is demonstrated.
  • the metal-clad laminate 2 includes an insulating layer 10 containing a cured product of the composition (X) and a metal layer 20 provided on the insulating layer 10.
  • the metal layer 20 is provided on at least one of the insulating layers 10. That is, the configuration of the metal-clad laminate 2 may be a two-layer configuration including the insulating layer 10 and the metal layer 20 disposed on one surface of the insulating layer 10. A three-layer configuration having two metal layers 20 arranged on both sides may be used.
  • FIG. 2 is a cross-sectional view of the metal-clad laminate 2 having a three-layer structure.
  • the metal-clad laminate 2 is formed by stacking metal foils on one or both sides of one or a plurality of prepregs 1 having a semi-cured product of the composition (X), and heating and press-molding to laminate them integrally. It is possible to make it. Lamination molding can be performed by heating and pressurizing using, for example, a multistage vacuum press, a hot press, a double belt, or the like. In this case, the insulating layer 10 is produced by the prepreg 1 being cured.
  • the metal-clad laminate 2 may be manufactured without using the prepreg 1.
  • the varnish-like composition (X) is directly applied to the surface of the metal layer 20 made of a metal foil, and the metal layer 20 and the composition (X) are heated and pressurized to form a varnish-like composition (X ) Can be cured to produce the insulating layer 10.
  • the insulating layer 10 of the metal-clad laminate 2 formed as described above contains a cured product of the composition (X), the coefficient of thermal expansion is low. For this reason, the metal-clad laminate 2 is less likely to be warped or cracked even when subjected to thermal stress. Therefore, the metal-clad laminate 2 having the insulating layer 10 containing the cured product of the composition (X) can be effectively used as a substrate material for producing a high-performance printed wiring board.
  • the printed wiring boards 3 and 4 include an insulating layer 10 containing a cured product of the composition (X) and a conductor wiring 30 provided on the insulating layer 10.
  • the printed wiring board 3 (hereinafter sometimes referred to as a core material) includes one insulating layer 10 containing a cured product of the composition (X), and conductor wiring 30 provided on one or both surfaces of the insulating layer 10. This is a printed wiring board having a single layer structure.
  • FIG. 3A is a cross-sectional view of a printed wiring board 3 having a single layer structure including one insulating layer 10 and two conductor wirings 30 provided on both surfaces of one insulating layer 10. A through-hole, a via hole, or the like may be formed in the printed wiring board 3 having a single layer structure as necessary.
  • the printed wiring board 4 is formed by alternately forming the insulating layers 10 and the conductor wirings 30 on the surface of the core material 3 on which the conductor wirings 30 are formed, and a multilayer in which the conductor wirings 31 are formed in the outermost layer.
  • a printed wiring board having a structure In the printed wiring board 4 having a multilayer structure, at least one of the plurality of insulating layers 10 includes a cured product of the composition (X). In the printed wiring board 4 having a multilayer structure, it is preferable that all of the plurality of insulating layers 10 include a cured product of the composition (X).
  • 3B is a cross-sectional view of a printed wiring board 4 having a multilayer structure including three insulating layers 10 and four conductor wirings 30.
  • a through-hole, a via hole, or the like may be formed in the multilayer printed wiring board 4 as necessary.
  • a method for manufacturing the printed wiring board 3 having a single layer structure is not particularly limited.
  • a thin electroless plating layer is formed by electroless plating on one or both sides of the unclad plate made of the insulating layer 10 containing the cured product of the composition (X), and the non-circuit forming portion is protected with a plating resist, and then electrolysis is performed.
  • Examples include a semi-additive method in which the electroplating layer is thickened on the circuit forming portion by plating, the plating resist is removed, and the electroless plating layer other than the circuit forming portion is removed by etching to form the conductor wiring 30.
  • the method for producing the multilayer printed wiring board 4 is not particularly limited, and examples thereof include a build-up process.
  • the flex-rigid printed wiring board 5 according to the first embodiment includes a plurality of rigid portions 51, a flex portion 52 that connects the plurality of rigid portions 51, and at least one of the plurality of rigid portions 51 and the flex portion 52. And at least one of the plurality of rigid portions 51 includes a cured product of the composition (X).
  • the flex-rigid printed wiring board 5 according to the first embodiment includes two rigid portions 51, one flex portion 52, and conductor wiring 30 (32), and is provided in the rigid portion 51.
  • At least one of the plurality of insulating layers 10 includes a cured product of the composition (X).
  • the rigid portion 51 is a rigid portion having a hardness and strength that can withstand the weight of the mounted component and can be fixed to the housing.
  • the flex portion 52 is a flexible portion that can be bent.
  • the flex-rigid printed wiring board 5 is used in a small and lightweight device such as a portable electronic device by being bent at the flex portion 52 and housed in a housing or the like.
  • the thickness of the flex portion 52 is preferably in the range of 5 to 300 ⁇ m, for example. In this case, the flex part 52 has good flexibility.
  • the flex-rigid printed wiring board 5 can be manufactured by using, for example, a flexible printed wiring board 200 having a single layer structure having one insulating layer 50 and two conductor wirings 30 as a core material.
  • the rigid part 51 is formed by multilayering the core material 200 except for the part that becomes the flex part 52. That is, a part of the core material 200 becomes the flex part 52 and the other part of the core material 200 becomes the rigid part 51.
  • the material of the insulating layer 50 in the core material 200 is not particularly limited as long as it is a flexible material, and may include, for example, a flexible resin such as polyimide.
  • the method for multilayering is not particularly limited, and a known method is used.
  • the resin sheet with metal foil has a metal foil and a resin layer containing the composition (X).
  • the resin sheet with metal foil is produced, for example, by applying composition (X) to metal foil and drying by heating until the composition (X) is in a semi-cured state (B stage state).
  • the resin sheet with metal foil is stacked on each of both surfaces of the core material 200, and in this state, the composition of the resin sheet with metal foil is formed by heating and pressing.
  • the resin layer containing the product (X) adheres to the core material 200 and the resin layer containing the composition (X) is cured to form the insulating layer 10 of the rigid portion 51.
  • the conductor wiring 32 is formed in the rigid part 51 by performing an etching process etc. to the metal foil originating in the resin sheet with a metal foil. As a result, a rigid portion 51 is formed, and a flex portion 52 that connects the rigid portion 51 is formed.
  • the rigid portion 51 includes a part of the core material 200, the insulating layer 10 provided on the core material 200, and the conductor wiring 32 provided on the insulating layer 10.
  • the rigid part 51 may be provided with the soldering resist layer provided in outermost layer, for example.
  • the rigid portion 51 may have a structure in which two or more insulating layers 10 and two or more conductor wirings 32 are alternately provided on both sides of the core material 200. That is, the rigid portion 51 may be further multilayered by a build-up method or the like. A through hole, a via hole, or the like may be formed in the rigid portion 51 as necessary.
  • the flex portion 52 includes an insulating layer 50 that is a part of the core material 200. That is, the flex part 52 is a part of the insulating layer 50.
  • the configuration of the flex portion 52 is not limited to this, and the flex portion 52 may include the conductor wiring 30, for example. That is, the conductor wiring 30 may be formed on the insulating layer 50 of the flex part 52.
  • a coverlay that covers the conductor wiring 30 of the core material 200 may be provided.
  • the flex portion 52 includes the insulating layer 50, the conductor wiring 30, and the coverlay.
  • the insulating layer 50 may have a single-layer structure including a single insulating layer, or may have a multilayer structure in which a plurality of insulating layers are stacked.
  • the flex part 52 may have a multilayer structure.
  • a rigid flex printed wiring board is used. Can be produced.
  • At least one of the plurality of insulating layers 10 contains a cured product of the composition (X). That is, at least one of the plurality of rigid portions 51 includes a cured product of the composition (X).
  • the flex-rigid printed wiring board 6 according to the second embodiment includes a plurality of rigid portions 51, a flex portion 52 connecting the plurality of rigid portions 51, and at least one of the plurality of rigid portions 51 and the flex portion 52. And at least one of the plurality of rigid portions 51 includes a cured product of the composition (X).
  • the flex-rigid printed wiring board 6 according to the second embodiment includes two rigid portions 51, one flex portion 52, and conductor wiring 30 (32), and is provided in the rigid portion 51.
  • At least one of the plurality of insulating layers 10 includes a cured product of the composition (X).
  • the solder resist layer 60 is provided on the outermost layer of the rigid portion 51. Further, a cover lay 40 that covers the conductor wiring 30 of the core material 200 is provided. Further, a through hole 101 and a buried via hole 102 are formed in the rigid portion 51.
  • the configuration of the flex-rigid printed wiring board 6 is not limited to this, and the flex-rigid printed wiring board 6 may not have the solder resist layer 60. Further, the flex-rigid printed wiring board 6 may not have the coverlay 40. Blind via holes may be further formed in the rigid portion 51 as necessary.
  • the flex-rigid printed wiring board 6 can be manufactured by using, for example, a flexible printed wiring board 200 having a single layer structure having one insulating layer 50 and two conductor wirings 30 as a core material.
  • the material of the insulating layer 50 in the core material 200 is not particularly limited as long as it is a flexible material, and may include, for example, a flexible resin such as polyimide.
  • the coverlay 40 which covers the conductor wiring 30 is formed by laminating coverlay films on both surfaces of the core material 200. Thereby, the flexible printed wiring board 300 which has the core material 200 and the coverlay 40 is produced.
  • the flexible printed wiring board 300 is multilayered except for the portion that becomes the flex portion 52, thereby forming the rigid portion 51.
  • the technique for multilayering is not particularly limited, and a known technique is used.
  • multilayering can be performed by the same method as the flex-rigid printed wiring board 5 of the first embodiment described above. Specifically, it can be multilayered by a build-up method using a resin sheet with a metal foil having a metal foil and a resin layer containing the composition (X). The resin sheet with a metal foil is produced by applying the composition (X) to the metal foil and drying by heating until the composition (X) is in a semi-cured state (B stage state).
  • a resin sheet with a metal foil is stacked on each of both surfaces of the flexible printed wiring board 300, and in this state, the metal foil is attached by heating and pressing.
  • the resin layer containing the composition (X) of the resin sheet adheres to the flexible printed wiring board 300 and the resin layer containing the composition (X) is cured, so that the insulating layer 10 containing the cured product of the composition (X) is formed. It is formed in the rigid part 51.
  • the conductor wiring 32 is formed in the rigid part 51 by performing an etching process etc. to the metal foil originating in the resin sheet with a metal foil.
  • the formation of the insulating layer 10 and the formation of the conductor wiring 32 are alternately repeated to form the solder resist layer 60 as the outermost layer. As a result, a rigid portion 51 is formed, and a flex portion 52 that connects the rigid portion 51 is formed.
  • the through hole 101 and the buried via hole 102 can be formed by a known method.
  • the prepreg 1 having the fiber base 12 and the semi-cured product 11 of the composition (X) impregnated in the fiber base 12 shown in FIG. A method is mentioned. An opening is made in the prepreg 1 by punching the prepreg 1 by die processing or the like. This opening corresponds to the flex portion 52 of the flex-rigid printed wiring board 6.
  • the prepreg 1 having an opening is overlaid on the flexible printed wiring board 300 and heated and pressed in this state, whereby the prepreg 1 is cured and the insulating layer 10 containing a cured product of the composition (X) is rigid. Formed.
  • the insulating layer 10 is not formed in the flex part 52.
  • the conductor wiring 32 is formed on the insulating layer 10 by a known method. The formation of the insulating layer 10 using the prepreg 1 having the opening and the formation of the conductor wiring 32 are alternately repeated to form the solder resist layer 60 as the outermost layer. As a result, a rigid portion 51 is formed, and a flex portion 52 that connects the rigid portion 51 is formed.
  • the flex-rigid printed wiring board 7 according to the third embodiment includes a plurality of rigid portions 51, a flex portion 52 connecting the plurality of rigid portions 51, and at least one of the plurality of rigid portions 51 and the flex portion 52. And at least one of the plurality of rigid portions 51 includes a cured product of the composition (X).
  • the flex-rigid printed wiring board 7 according to the third embodiment includes two rigid portions 51, one flex portion 52, and conductor wiring 30 (32), and is provided in the rigid portion 51.
  • At least one of the plurality of bonding sheets 70 includes a cured product of the composition (X).
  • a cover lay 40 that covers the conductor wiring 30 of the core material 200 is provided.
  • a through hole 101 and a blind via hole 103 are formed.
  • the configuration of the flex-rigid printed wiring board 7 is not limited to this, and the flex-rigid printed wiring board 7 may not have the cover lay 40.
  • a buried via hole may be further formed in the rigid portion 51 as necessary.
  • the rigid part 51 may be provided with the soldering resist layer provided in the outermost layer.
  • the flex-rigid printed wiring board 7 includes, for example, a flexible printed wiring board 300 similar to that used to manufacture the flex-rigid printed wiring board 6 of the second embodiment, a rigid printed wiring board 400, and FIG. It can be manufactured using the prepreg 1.
  • the flexible printed wiring board 300 includes a core material 200 including one insulating layer 50 and two conductor wirings 30, and two coverlays 40.
  • the rigid printed wiring board 400 is a multilayer printed wiring board having two insulating layers 10 and three conductor wirings 32, and a blind via hole 103 is formed using a known method. First, an opening is formed in the prepreg 1 by punching the prepreg 1 by die processing or the like. This opening corresponds to the flex portion 52 of the flex-rigid printed wiring board 7.
  • the prepreg 1 having an opening is stacked on the flexible printed wiring board 300, and the rigid printed wiring board 400 is stacked on each of the prepregs 1.
  • the prepreg 1 is cured to form the bonding sheet 70 containing the composition (X), and the flexible printed wiring board 300 and the rigid printed wiring board 400 form the bonding sheet 70.
  • the through hole 101 can be formed by a known method. Since the opening of the prepreg 1 corresponds to the flex part 52, the bonding sheet 70 is not formed on the flex part 52.
  • the configuration of the rigid printed wiring board 400 is not limited to the configuration shown in FIG.
  • the rigid printed wiring board 400 may have the same configuration as the single-layer printed wiring board 3 shown in FIG. 3A having one insulating layer 10 and two conductor wirings 30, for example.
  • the rigid printed wiring board 400 may have a configuration similar to that of the multilayer printed wiring board 4 shown in FIG. 3B having three insulating layers 10 and four conductor wirings 30, and the four insulating layers 10. And five conductor wirings 30 may be used.
  • the insulating layer 10 of the rigid printed wiring board 400 may or may not contain a cured product of the composition (X).
  • prepreg The resin varnishes of the examples and comparative examples were impregnated into glass cloth (manufactured by Nitto Boseki Co., Ltd., # 1078 type, WEA1078) so that the thickness after curing was 80 ⁇ m, and the melt viscosity at 170 ° C.
  • a prepreg containing a semi-cured resin composition was obtained by drying by heating to 60000 to 150,000 poise.
  • the melt viscosity was measured using a Koka flow tester (manufactured by Shimadzu Corporation, CFT-100) under the conditions of a flow tester temperature of 130 ° C. and a pressure of 1.96 MPa (20 kgf / cm 2 ).
  • a nozzle having a diameter of 1 mm and a thickness of 1 mm was used.
  • a copper foil (Mitsui Metal Mining Co., Ltd., 3EC-III) having a thickness of 18 ⁇ m is arranged on both sides of one prepreg of each example and comparative example to form a pressure-receiving body.
  • a copper-clad laminate having a thickness of 80 ⁇ m with a copper foil bonded to both surfaces was obtained.
  • a copper foil (Mitsui Metal Mining Co., Ltd., 3EC-III) having a thickness of 18 ⁇ m is arranged on both sides of a laminate obtained by laminating 10 prepregs of each Example and Comparative Example, and this pressure body was heated and pressed under the same conditions as above to obtain a copper-clad laminate having a thickness of 800 ⁇ m with copper foil bonded to both sides.
  • a hot press was used, and the heated body was put in a state where the temperature of the hot platen of the molding machine was heated to 100 ° C.
  • Evaluation test 4-1 Powder fall-off property
  • the prepregs of Examples and Comparative Examples prepared in 2 above were cut into a size of 11 ⁇ 10 cm (length ⁇ width) and tested as test pieces. First, deposits such as powder and dust were removed from 10 test pieces using a handy mop. Next, the weight of 10 test pieces was measured. Subsequently, 10 test pieces with a length of 10 cm were cut at equal intervals using a cutter knife (manufactured by NTT Co., Ltd., A-type cutter replacement blade) in each of the 10 test pieces, and 10 test pieces with cuts made. Deposits such as powder and dust were removed from the piece. Then, the weights of 10 test pieces with cuts were measured. A value obtained by subtracting the weight of 10 test pieces after making a cut from the weight of 10 test pieces before making the cut was defined as the amount of powder falling. The percentage of the amount of powder falling with respect to the weight of 10 test pieces before cutting was defined as powder falling.
  • Copper foil adhesion The 18- ⁇ m thick copper-clad laminate of each Example and Comparative Example prepared in 3 above was used as a test piece. The peel strength of the copper foil of this test piece was measured according to IPC-TM-650-2.4.8. A copper foil pattern having a width of 10 mm and a length of 100 mm was formed on the test piece, the copper foil pattern was peeled off at a rate of 50 mm / min by a tensile tester, and the peel strength at that time was measured. This peel strength was defined as copper foil adhesion.
  • Polyimide adhesion Single-sided flexible metal-clad laminate manufactured by SK Innovation Co., Ltd., Enflex®, copper foil thickness 12 ⁇ m, polyimide thickness 20 ⁇ m
  • the laminate was prepared by laminating the polyimide layer of the flexible metal-clad laminate so that the prepreg was in contact, and heating and pressurizing at 190 ° C. and a pressure of 2.94 MPa (30 kgf / cm 2 ) for 60 minutes.
  • This laminate was cut into a size of 10 ⁇ 100 mm to obtain a test piece. From this test piece, the single-sided flexible metal-clad laminate was peeled off at a speed of 50 mm / min with a tensile tester, and the peel strength at that time was measured. This peel strength was defined as polyimide adhesion.
  • Glass transition temperature (Tg) The copper foils on both sides of the 80 ⁇ m thick copper-clad laminate of each of the examples and comparative examples prepared in 3 above were removed to obtain test pieces.
  • the glass transition temperature (Tg) of this test piece was measured by differential scanning calorimetry (DSC) according to IPC-TM-650-2.4.25 at a temperature rising rate of 20 ° C./min.
  • DSC differential scanning calorimetry
  • parenthesis shown in the column of the glass transition temperature of Table 1 and 2 shows the glass transition temperature of the low temperature side at the time of measuring a glass transition temperature in two places of a test piece.
  • CTE Thermal expansion coefficient
  • the test pieces were obtained by removing the copper foils on both sides of the 800- ⁇ m-thick copper-clad laminate of each example and comparative example prepared in 3 above.
  • the coefficient of thermal expansion (CTE) in the surface direction (thickness direction) of the test piece was measured by a thermo-mechanical analysis (TMA) method in accordance with JIS C 6481.
  • TMA thermo-mechanical analysis
  • Example 2 and Comparative Example 13 When Example 2 and Comparative Example 13 are compared, the powderability of Example 2 containing the component (B) as a curing agent is lower than the powderiness of Comparative Example 13 containing a phenol resin as the curing agent, Furthermore, the adhesiveness to copper foil and polyimide is higher than that of Comparative Example 13. Moreover, when Example 1 and Comparative Example 10 are compared, the powder-off property of Example 1 containing the component (C) is less than half of the powder-off property of Comparative Example 10 not containing the component (C). Moreover, when Example 3 and Comparative Example 7 are compared, the powder-off property of Example 3 containing the component (D) is half of the powder-off property of Comparative Example 7 containing no component (D).
  • component (B), the component (C) and the component (D) reduce the occurrence of powder falling of the prepreg produced from the composition (X). Moreover, it was confirmed that (B) component improves the adhesiveness to copper foil and a polyimide.
  • the examples have better levels of powder-off properties, moldability, copper foil and polyimide adhesion, glass transition temperature, and coefficient of thermal expansion than the comparative examples. It was confirmed that a good balance was obtained. On the other hand, in the comparative example, a resin composition in which all of these characteristics were favorable was not obtained.

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  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention concerne une composition de résine capable : de donner un préimprégné présentant une formabilité satisfaisante, une adhérence élevée à son support et une capacité réduite d'empoussiérage ; et de former un objet durci présentant un faible coefficient de dilatation thermique. La composition de résine comprend une résine époxy, un dicyandiamide, une résine phénoxy, un caoutchouc cœur-écorce et une charge inorganique. La résine phénoxy présente un poids moléculaire moyen en poids égal ou supérieur à 30 000. La résine phénoxy présente un allongement à la traction égal ou supérieur à 20 %. La teneur en résine phénoxy varie de 5 à 30 parties en masse pour 100 parties en masse de la résine époxy. La teneur en caoutchouc cœur-écorce varie de 3 à 20 parties en masse pour 100 parties en masse de la résine époxy.
PCT/JP2018/005422 2017-04-07 2018-02-16 Composition de résine, préimprégné, stratifié plaqué de métal, carte de circuit imprimé, et carte de circuit imprimé flexorigide WO2018186030A1 (fr)

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KR1020197021161A KR102480537B1 (ko) 2017-04-07 2018-02-16 수지 조성물, 프리프레그, 금속 클래드 적층판, 프린트 배선판 및 플렉스 리지드 프린트 배선판
CN201880005369.8A CN110121532A (zh) 2017-04-07 2018-02-16 树脂组合物、预浸料、覆金属层叠板、印刷电路板和柔性刚性印刷电路板

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JP2017-077043 2017-04-07
JP2017077043A JP6928908B2 (ja) 2017-04-07 2017-04-07 プリプレグ、金属張積層板、プリント配線板及びフレックスリジッドプリント配線板

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EP4026865B1 (fr) * 2019-09-06 2023-08-09 Panasonic Intellectual Property Management Co., Ltd. Composition de résine, préimprégné, film revêtu de résine, feuille métallique revêtue de résine, feuille stratifiée plaquée de métal, et carte de circuit imprimé
KR102424462B1 (ko) * 2021-03-31 2022-07-25 주식회사 자연바이오 유리섬유 보강재 및 그 제조장치

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