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WO2018181690A1 - Alliage de soudage sans plomb et joint à brasure tendre - Google Patents

Alliage de soudage sans plomb et joint à brasure tendre Download PDF

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Publication number
WO2018181690A1
WO2018181690A1 PCT/JP2018/013188 JP2018013188W WO2018181690A1 WO 2018181690 A1 WO2018181690 A1 WO 2018181690A1 JP 2018013188 W JP2018013188 W JP 2018013188W WO 2018181690 A1 WO2018181690 A1 WO 2018181690A1
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WO
WIPO (PCT)
Prior art keywords
solder alloy
lead
joint
auxiliary agent
solder
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Application number
PCT/JP2018/013188
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English (en)
Japanese (ja)
Inventor
西村　哲郎
貴利 西村
徹哉 赤岩
将一 末永
Original Assignee
株式会社日本スペリア社
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Application filed by 株式会社日本スペリア社 filed Critical 株式会社日本スペリア社
Priority to JP2019510113A priority Critical patent/JP7216419B2/ja
Publication of WO2018181690A1 publication Critical patent/WO2018181690A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Definitions

  • the present invention relates to a Sn-Ag-Cu-based lead-free solder alloy used for soldering with a substrate containing at least a surface layer of Al.
  • Al has a high thermal conductivity compared to other metals and generates less thermal stress. Therefore, Al is often used for heat dissipation members such as electronic devices. In recent years, attention has been paid to the small specific gravity or strength, which is a characteristic of Al, and it has been studied as a material contributing to weight reduction of motors and the like.
  • Patent Document 1 discloses a Sn- (3-40%) Zn- (1-10%) Ag- (0.5-4%) Cu composition solder alloy
  • Patent Document 2 discloses Sn- (3-40%).
  • Solder alloys having a composition of (0.5-7%) Mg- (1.5-20%) Zn- (0.5-15%) Ag are disclosed.
  • Patent Document 3 discloses Sn- (10-15%) Zn- (0.1-1.5%) Cu- (0.0001-0.1%) Al- (0.0001-0.03%). ) Si- (0.0001-0.02%) Ti- (0.0001-0.01%) B solder alloy is disclosed in Patent Document 4 as Sn- (10% or less) Ag- (15% or less). ) Solder alloys for direct joining of Al members having an Al composition are disclosed.
  • Patent Document 5 as a joining method for joining Al materials or between Al materials and different materials, Sn composed of a metal element selected from the group of Cu, Ag, In, Bi, Co, and Ti and the remaining Sn is used. Bonding using a system solder is disclosed.
  • Sn—Ag—Cu-based solder alloys widely used as lead-free solder alloys are not suitable for joining Al members. Specifically, when joining Al members using an Sn—Ag—Cu based solder alloy, or when joining an Al member and a dissimilar metal member, an oxide film formed on the surface of the Al member, It is known that sufficient bonding strength cannot be obtained due to problems such as electrolytic corrosion (galvanic corrosion).
  • Patent Documents 1 to 5 do not disclose Sn—Ag—Cu based solder alloys. Further, no improvement has been devised for improving the corrosion resistance and joining reliability in a salt water environment with respect to a solder joint in which an Al member is joined using a Sn—Ag—Cu based solder alloy.
  • the present invention has been made in view of such circumstances, and an object thereof is Sn-Ag-Cu which can maintain excellent corrosion resistance and high bonding reliability with respect to bonding with an Al member even in a salt water environment. It is to provide a lead-free solder alloy and solder joint of the system.
  • the lead-free solder alloy according to the present invention is a Sn-Ag-Cu-based lead-free solder alloy used for soldering with a member to be joined containing at least a surface layer, and is a standard electrode potential with Ni and Al.
  • assistant whose difference of 0.7V or less is included is characterized by the above-mentioned.
  • the lead-free solder alloy according to the present invention is characterized in that the auxiliary agent is at least one of Mn, Ti, Mg, and Zr.
  • the lead-free solder alloy according to the present invention is characterized in that the amount of Mn added is more than 0 and 0.01% by weight.
  • the lead-free solder alloy according to the present invention is characterized by containing 3.00% by weight of Ag, 5.00% by weight of Cu, and 0.05% by weight of Ni.
  • the solder joint according to the present invention is a solder joint of a Sn-Ag-Cu-based lead-free solder alloy to which Ni is added and a member to be joined containing at least Al in the surface layer.
  • the auxiliary electrode has a difference in standard electrode potential of 0.7 V or less, and the auxiliary agent is distributed in the joint.
  • FIG. 7 is a graph in which the difference between the maximum stress of Comparative Example 1 and the maximum stress of the test samples of Examples 2 to 5 and Comparative Examples 2 to 5 is plotted against the difference (V) from the standard electrode potential of Al.
  • the Sn-Ag-Cu-based lead-free solder alloy according to the present embodiment is used for soldering with a member to be joined containing Al.
  • the to-be-joined member containing Al includes, for example, a pure aluminum member, a member having an Al-coated surface, or a member containing Al at least in the surface layer.
  • Sn—Ag—Cu based lead-free solder alloy is soldered to at least one pure aluminum (Al) plate
  • the Sn—Ag—Cu-based lead-free solder alloy according to the present embodiment further includes Ni and an auxiliary agent in addition to Sn, Ag, and Cu.
  • Mn is added as an auxiliary agent
  • Table 1 is a table showing the composition of the Sn—Ag—Cu solder alloy (Example 1) according to the present embodiment. Table 1 also shows Comparative Example 1 and Comparative Example 2.
  • the Sn—Ag—Cu-based solder alloy according to the present embodiment (hereinafter referred to as Example 1) includes Cu, Ag, and Ni, 5 wt%, 3 wt%, It contains 0.05% by weight, further contains 0.003% by weight of Mn, and the balance is Sn.
  • the soldering temperature in Example 1 is 320 ° C.
  • Comparative Example 1 contains 5% by weight, 3% by weight, and 0.05% by weight of Cu, Ag, and Ni, respectively, with the balance being Sn.
  • Comparative Example 2 contains 0.5% by weight and 3% by weight of Cu and Ag, respectively, with the balance being Sn.
  • the soldering temperatures in Comparative Examples 1 and 2 are 320 ° C. and 245 ° C., respectively.
  • Test samples for solder joints were prepared using Example 1, Comparative Example 1 and Comparative Example 2 described above.
  • the test sample was prepared by joining Al test pieces using Example 1, Comparative Example 1, and Comparative Example 2. This will be described in detail below.
  • FIG. 1 is a perspective view showing a test piece used for a test sample of a solder joint
  • FIG. 2 is a schematic diagram schematically showing an example of the test sample of the solder joint.
  • the test piece 1 has a strip shape of 25 ⁇ 5 ⁇ 1 mm.
  • Example 1 As shown in FIG. 1, about 0.01 g of flux is applied to the end of the test piece 1.
  • the flux is No. 1 manufactured by Nippon Superior Co., Ltd. 1261.
  • the soldering of Example 1, Comparative Example 1 or Comparative Example 2 was performed in the soldering range of about 6 mm in width (indicated by hatching in FIG. 1) at the end of the test piece 1, and these alloys The plating layer was formed. A pair of such test pieces is prepared.
  • the solder joint 100 of the test sample is prepared by soldering the Al test pieces prepared as described above. That is, in both Example 1 and Comparative Examples 1 and 2, the solder joint 100 of the test sample was manufactured from an Al test piece for both the one test piece 1a and the other test piece 1b.
  • soldering ranges of the Al test pieces 1a and 1b are faced to each other, and a 6 ⁇ 5 ⁇ 0.4 mm solder alloy foil 2 is sandwiched therebetween.
  • the test pieces 1a and 1b were joined by heating the solder alloy foil 2 and the periphery thereof. At this time, the soldering temperature is as shown in Table 1, and the test pieces 1a and 1b are parallel to each other. Then, the created solder joint 100 was cooled to room temperature, and the solder joint 100 of the test sample shown in FIG. 2 was obtained.
  • test pieces 1a and 1b are joined by Example 1, and in the test sample of Comparative Example 1, the test pieces 1a and 1b are joined by Comparative Example 1, and the test sample of Comparative Example 2 is used. , The test pieces 1a and 1b are joined by the comparative example 2.
  • Such a corrosion test was performed using the solder joint 100 of the test sample of Example 1 and Comparative Examples 1 and 2.
  • each test sample was completely immersed in a 3% NaCl aqueous solution and left at room temperature. At this time, the test samples were allowed to stand so as not to contact each other. A test sample was taken out every 24 hours from the start of immersion, and it was confirmed whether it was normally joined.
  • Such confirmation is made by pressing and fixing a position P1 of approximately 5 mm from one end of the solder joint 100 of the test sample with the tip of the resin tweezers and pressing a position P2 of approximately 5 mm from the other end with the tip of the resin tweezers three times.
  • the strength of pressing the solder joint 100 of the test sample is such a strength that the test sample is not deformed and forced peeling does not occur.
  • the test sample that was normally bonded was immersed again in the NaCl aqueous solution, and the sample that was not normally bonded, that is, the sample where peeling occurred was taken out from the container.
  • the corrosion test results are shown in Table 2.
  • the corrosion test results in Table 2 show the occurrence of peeling at the joint of the test piece 1b.
  • FIG. 3 is a graph showing the corrosion test results in Table 2. That is, Table 2 and FIG. 3 show the corrosion test results on the test piece 1b when both the test pieces 1a and 1b are Al test pieces.
  • Example 1 Such a corrosion test was performed three times each in Example 1 and Comparative Examples 1 and 2.
  • Table 2 the number of days from the start of immersion to the confirmation of occurrence of peeling (hereinafter referred to as “joining days”) is shown.
  • the corrosion test results are shown in ascending order.
  • the average joining days of Comparative Example 2 is 12 days
  • the average joining days of Comparative Example 1 is 36 days
  • the average joining days of Example 1 is 108 days. That is, when comparing the number of days of joining, the length becomes longer in the order of Comparative Example 2, Comparative Example 1, and Example 1.
  • the joining days of Comparative Example 1 are three times longer than the joining days of Comparative Example 2, and the joining days of Example 1 are three times longer than the joining days of Comparative Example 1.
  • Example 1 when the test piece 1b is Al, that is, in the case of a member to be bonded containing Al, the corrosion resistance and bonding reliability are superior to those of Comparative Examples 1 and 2. .
  • Example 1 can maintain excellent corrosion resistance and high bonding reliability even when placed in an environment where salt water is used. Such a result is considered to be influenced by Mn added as an auxiliary agent. This will be described in detail below.
  • Electrolytic corrosion proceeds as the difference in standard electrode potential increases. That is, in the case of a member to be joined containing Al, the electrolytic alloy at the joint becomes more severe as the solder alloy having a larger difference in standard electrode potential from Al, and the rate of electrolytic corrosion is further increased in salt water.
  • the standard electrode potential of Mn added to Example 1 is -1.18 V
  • the standard electrode potential of Al is -1.68.
  • the difference in standard electrode potential between Mn and Al (hereinafter referred to as the Mn potential difference) is 0.5 V, which is relatively small.
  • Mn potential difference is distributed in the vicinity of the joint interface (joint portion) of the solder joint 100.
  • Mn is contained in a Cu—Al-based or Cu—Ag-based intermetallic compound formed in the joint. Therefore, in Example 1, the difference in the standard electrode potential between the member to be joined containing Al and the solder alloy is reduced at the joint. This is considered to suppress the corrosion at the joint.
  • Mn is added as an auxiliary agent for suppressing electrolytic corrosion
  • Any auxiliary may be used as long as the difference in standard electrode potential from Al is not more than the potential difference (0.5 V) of Mn.
  • the standard electrode potential of Ti and Zr is ⁇ 1.63 V and ⁇ 1.55, respectively, and the difference in standard electrode potential from Al is 0.05 V and 0.13 V, respectively. small. Therefore, Ti or Zr may be used as an auxiliary agent.
  • auxiliary agent other than Mn a material having a difference in standard electrode potential from Al that is similar to the potential difference (0.5 V) of Mn may be used.
  • the standard electrode potential is ⁇ 2.36, the standard electrode potential difference from Al is 0.68 V, which is about the same as the Mn potential difference of 0.5 V. Therefore, Mg may be used as an auxiliary agent.
  • auxiliary for suppressing electrolytic corrosion a material having a standard electrode potential difference from Al of 0.7 V or less may be used. That is, such an auxiliary agent may be any one of Mn, Mg, Ti, and Zr. Moreover, it is not restricted to this, You may use two or more among Mn, Mg, Ti, and Zr.
  • the Sn—Ag—Cu solder alloy according to the present embodiment contains 0.003% by weight of Mn has been described as an example, but the present invention is not limited thereto.
  • Mn is in the range of 0 to 0.01% by weight
  • the Sn—Ag—Cu based solder alloy according to the present embodiment has the above-described effects.
  • a test was conducted using a solder joint 100 as a test sample to which Mg, Ti, Zr, or 0 to 0.01 wt% of Mn was added as an auxiliary agent. Specifically, after the solder joint 100 of the test sample was immersed in salt water for a predetermined time, the tensile strength of the solder joint 100 was measured, and the change in bonding strength with the immersion time in salt water was observed.
  • Table 3 is a table showing the composition of the solder joint 100 (Sn—Ag—Cu solder alloy) of the test sample used for the measurement of the tensile strength. Moreover, Comparative Example 1 and Comparative Example 2 described in Table 3 are the same as those described above. In Table 3, Comparative Examples 3 to 5 were added for comparison.
  • the solder joint 100 according to the present embodiment includes Mn, Mg, Ti, and Zr as auxiliary agents.
  • new Comparative Examples 3 to 5 each contain Zn, Na, and Fe as auxiliaries.
  • Example 2 contains 3% by weight, 5% by weight, and 0.05% by weight of Ag, Cu, and Ni, respectively, and 0.009% by weight. Ti is further contained and the balance is Sn.
  • Example 3 Ag, Cu, and Ni are the same amount as in Example 2, and further contain 0.008% by weight of Zr, with the balance being Sn.
  • Example 4 Ag, Cu, and Ni are the same amount as in Example 2, and further contain 0.010% by weight of Mn, with the balance being Sn.
  • Example 5 Ag, Cu, and Ni are the same amount as in Example 2, and further contain 0.004% by weight of Mg, with the balance being Sn.
  • the soldering temperatures in Examples 2 to 5 are all 320 ° C.
  • Comparative Example 3 Ag, Cu, and Ni are the same amount as in Example 2, and further contain 0.012% by weight of Zn, with the balance being Sn.
  • Comparative Example 4 Ag, Cu, and Ni are the same amount as in Example 2, 0.008 wt% Na is further included, and the balance is Sn.
  • Comparative Example 5 Ag, Cu, and Ni are the same amount as in Example 2, further containing 0.010 wt% Fe, and the balance being Sn.
  • the soldering temperatures in Comparative Examples 3 to 5 are all 320 ° C. Note that Comparative Examples 1 and 2 have already been described, and a description thereof will be omitted.
  • Table 4 shows the standard electrode potential (V) of the auxiliary agent added to Examples 2 to 5 and Comparative Examples 2 to 5, and the difference between the standard electrode potential (V) of the auxiliary agent and the standard electrode potential of Al ( V). That is, the difference (V) from the standard electrode potential of Al is a value obtained by subtracting the standard electrode potential of the auxiliary agent from the standard electrode potential of Al. In Table 4, the difference (V) from the standard electrode potential of Al is shown as an absolute value. In Comparative Example 2, it was considered that Sn was added as an auxiliary agent, and the difference (V) between the standard electrode potential (V) of the auxiliary agent and the standard electrode potential of Al was described.
  • the amount of each of these components (elements) added is the amount of each element.
  • the amount of each element was determined to have the same amount of electrons. This is a reaction phenomenon that occurs due to the exchange of electrons between dissimilar metal elements (auxiliaries). Therefore, in order to compare and evaluate the effect of adding each element on the corrosion inhibition effect, the electrons involved in the exchange of reactions. It was because it was judged that it was necessary to match the amount.
  • Test samples for solder joints were prepared using the solder alloys of Examples 2 to 5 and Comparative Examples 1 to 5 shown in Table 3.
  • the test sample has the same shape as that shown in FIG.
  • the production of the test sample shown in FIG. 2 has already been described, and detailed description thereof will be omitted.
  • test samples were immersed in salt water for a predetermined time. Specifically, the test samples according to Examples 2 to 5 and Comparative Examples 1 to 5 were completely immersed in brine (3% NaCl aqueous solution) and left at room temperature. At this time, the test samples were allowed to stand so as not to contact each other. When the elapsed time from the start of immersion was 72 hours, 168 hours, and 336 hours, the test sample was taken out and the tensile strength was measured. The salt water was changed every week.
  • Tensile strength was measured using a Shimadzu tester AG-IS 10 kN. Specifically, the test samples of Examples 2 to 5 and Comparative Examples 1 to 5 after being immersed in salt water were cut at room temperature (20 ° C. to 25 ° C.) and 10 mm / min until each test sample was cut. Pull and measure the tensile strength of the test sample. Tensile strength was measured five times for each test sample.
  • Table 6 shows the measurement results of tensile strength (maximum stress).
  • “0 hour” indicates before immersion in salt water.
  • a value of “0” indicates that peeling occurred between the solder alloy (solder alloy foil 2) and the test pieces 1a and 1b in the solder joint of the test sample.
  • FIG. 4 is a graph showing the measurement results of the maximum stress in Table 6.
  • the vertical axis represents the maximum stress value
  • the horizontal axis represents Examples 2 to 5 and Comparative Examples 1 to 5.
  • Table 7 shows the measurement results of the maximum stress of the test samples of Examples 2 to 5 and Comparative Examples 1 to 5 on the basis of the immersion treatment (0 hour). That is, in Table 7, the maximum stress after the immersion treatment for a predetermined time in each of Examples 2 to 5 and Comparative Examples 1 to 5 is shown as a ratio (percentage) to the maximum stress at 0 hour.
  • FIG. 5 is a graph showing the ratio of the maximum stress in Table 7. In FIG. 5, the vertical axis represents the ratio to the stress value before the immersion treatment, and the horizontal axis represents Examples 2 to 5 and Comparative Examples 1 to 5.
  • the immersion treatment time was as long as 72 hours, 168 hours, and 336 hours. As it becomes, the maximum stress decreases. That is, it is judged that the corrosion becomes severe and the maximum stress is reduced as the time of the immersion treatment becomes longer.
  • the maximum stress after 72 hours of immersion treatment was all 299 N or more
  • the maximum stress after 168 hours of immersion treatment was 158 N or more
  • the maximum stress after 336 hours of immersion treatment It can be seen that the stress is 54 N or more.
  • the maximum stress of the solder joint 100 of the test samples according to Examples 2 to 5 is higher than the maximum stress of the test sample according to Comparative Examples 1 to 5. It can be seen that the solder joint 100 of the test sample is superior in corrosion resistance as compared with the test samples according to Comparative Examples 1 to 5.
  • FIG. 6 plots the difference between the maximum stress of Comparative Example 1 and the maximum stress of the test samples of Examples 2 to 5 and Comparative Examples 2 to 5 against the difference (V) from the standard electrode potential of Al. It is a graph.
  • the vertical axis indicates the maximum stress difference from Comparative Example 1
  • the horizontal axis indicates the difference (V) from the standard electrode potential of Al.
  • the maximum stress is separated when the difference (V) from the standard electrode potential of Al is 0.70.
  • the difference (V) from the standard electrode potential of Al is lower than 0.70, the maximum stress difference from Comparative Example 1 is larger than 0, and the difference (V) from the standard electrode potential of Al is larger than 0.70.
  • the maximum stress difference from Comparative Example 1 is smaller than zero.
  • the one where the difference (V) from the standard electrode potential of Al is lower than 0.70 corresponds to the solder joint 100 of the test samples according to Examples 2 to 5, and the difference (V) from the standard electrode potential of Al is 0.00.
  • a value larger than 70 corresponds to Comparative Examples 2 to 5.
  • each of the solder joints 100 of the test samples according to Examples 2 to 5 shows a maximum stress (tensile strength) higher than that of Comparative Examples 1 to 5 after the immersion treatment.
  • solder joint 100 solder alloy
  • Mn, Mg, Ti, Zr whose difference in standard electrode potential from Al is 0.7 V or less as an auxiliary agent. did it.
  • the solder joint 100 of this embodiment has an effect of suppressing electrolytic corrosion.
  • Mn is an element that easily oxidizes. When an oxide, so-called dross, is formed on the surface of the solder (alloy), it causes a decrease in solderability and workability. There is also a problem that the melting point of the solder alloy increases when Mn is added to Sn. As described above, the addition of Mn also has a side effect of lowering the performance of the solder alloy itself and the soldering workability, and the addition of Mn exceeding 0.010% by weight is not desirable.
  • the use of the lead-free solder alloy containing 0% over 0.009% by weight of Ti as an auxiliary agent also has the effect of suppressing electrolytic corrosion in the solder joint 100 of the present embodiment.
  • the solder joint 100 of the present embodiment also has an effect of suppressing electrolytic corrosion.
  • the solder joint 100 of this embodiment also has an effect of suppressing electrolytic corrosion.

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  • Mechanical Engineering (AREA)
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Abstract

L'invention concerne un alliage de soudage sans plomb à base de Sn-Ag-Cu destiné au soudage d'un élément à assembler qui contient de l'Al au moins dans sa couche superficielle, l'alliage de soudage sans plomb comprenant du Ni et un agent auxiliaire, la différence de potentiel d'électrode standard entre l'agent auxiliaire et l'Al étant inférieure ou égale à 0,7 V. Le joint à brasure tendre de la présente invention est tel que, au moyen dudit alliage de soudage sans plomb, l'agent auxiliaire est distribué dans une partie d'assemblage avec l'élément à assembler qui contient de l'Al au moins dans sa couche superficielle, et la différence de potentiel d'électrode standard entre l'élément à assembler et l'alliage de soudage est réduite.
PCT/JP2018/013188 2017-03-31 2018-03-29 Alliage de soudage sans plomb et joint à brasure tendre WO2018181690A1 (fr)

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JP2022515254A (ja) * 2018-12-27 2022-02-17 アルファ・アセンブリー・ソリューションズ・インコーポレイテッド 鉛フリーはんだ組成物

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CN112513300A (zh) * 2019-04-11 2021-03-16 日本斯倍利亚社股份有限公司 无铅焊料合金和焊料接合部

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JP2005319470A (ja) * 2004-05-06 2005-11-17 Katsuaki Suganuma 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
JP2007299722A (ja) * 2006-04-06 2007-11-15 Hitachi Cable Ltd 配線用導体及びその製造方法並びに端末接続部並びにＰｂフリーはんだ合金
JP2008142729A (ja) * 2006-12-07 2008-06-26 Hitachi Metals Ltd アルミニウム部材直接接続用はんだ
WO2010119836A1 (fr) * 2009-04-14 2010-10-21 新日鉄マテリアルズ株式会社 Alliage de soudure sans plomb, bille de soudure et composant électronique comprenant une perle de soudure
JP2014027122A (ja) * 2012-07-27 2014-02-06 Nippon Steel Sumikin Materials Co Ltd 無鉛はんだバンプ接合構造
JP2014136219A (ja) * 2013-01-15 2014-07-28 Nihon Superior Co Ltd アルミニウム用はんだ及びはんだ継手

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Publication number Priority date Publication date Assignee Title
JP2005319470A (ja) * 2004-05-06 2005-11-17 Katsuaki Suganuma 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
JP2007299722A (ja) * 2006-04-06 2007-11-15 Hitachi Cable Ltd 配線用導体及びその製造方法並びに端末接続部並びにＰｂフリーはんだ合金
JP2008142729A (ja) * 2006-12-07 2008-06-26 Hitachi Metals Ltd アルミニウム部材直接接続用はんだ
WO2010119836A1 (fr) * 2009-04-14 2010-10-21 新日鉄マテリアルズ株式会社 Alliage de soudure sans plomb, bille de soudure et composant électronique comprenant une perle de soudure
JP2014027122A (ja) * 2012-07-27 2014-02-06 Nippon Steel Sumikin Materials Co Ltd 無鉛はんだバンプ接合構造
JP2014136219A (ja) * 2013-01-15 2014-07-28 Nihon Superior Co Ltd アルミニウム用はんだ及びはんだ継手

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022515254A (ja) * 2018-12-27 2022-02-17 アルファ・アセンブリー・ソリューションズ・インコーポレイテッド 鉛フリーはんだ組成物
US12115602B2 (en) 2018-12-27 2024-10-15 Alpha Assembly Solutions Inc. Lead-free solder compositions

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TW201837194A (zh) 2018-10-16
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