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WO2018181273A1 - Sonde, unité de sonde et dispositif d'inspection à semi-conducteurs comportant une unité de sonde - Google Patents

Sonde, unité de sonde et dispositif d'inspection à semi-conducteurs comportant une unité de sonde Download PDF

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Publication number
WO2018181273A1
WO2018181273A1 PCT/JP2018/012350 JP2018012350W WO2018181273A1 WO 2018181273 A1 WO2018181273 A1 WO 2018181273A1 JP 2018012350 W JP2018012350 W JP 2018012350W WO 2018181273 A1 WO2018181273 A1 WO 2018181273A1
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WO
WIPO (PCT)
Prior art keywords
pipe
probe
plunger
notch
spiral groove
Prior art date
Application number
PCT/JP2018/012350
Other languages
English (en)
Japanese (ja)
Inventor
一也 相馬
雅宏 高橋
Original Assignee
日本発條株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本発條株式会社 filed Critical 日本発條株式会社
Priority to JP2019509866A priority Critical patent/JP7023276B2/ja
Publication of WO2018181273A1 publication Critical patent/WO2018181273A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Definitions

  • the present invention relates to a probe.
  • the present invention relates to a probe for inspecting an inspection object such as an electronic component having a circuit using a semiconductor such as a semiconductor integrated circuit, or an electronic device including the electronic component, a probe unit, and a semiconductor inspection apparatus including the probe unit.
  • An electronic component having a semiconductor integrated circuit is also used for an electronic device such as a display device represented by a liquid crystal display device, an EL (Electroluminescence) display device, and the like.
  • a display device represented by a liquid crystal display device, an EL (Electroluminescence) display device, and the like.
  • EL Electrode-emitting diode
  • the electronic component includes, for example, elements such as a semiconductor element, a resistor element, and a capacitor element, or a circuit including a plurality of these elements. These elements are produced, for example, by forming a pattern such as an electrode, a wiring, and a hole for electrically connecting the wiring on a substrate such as a silicon wafer or a glass substrate.
  • Electronic components are manufactured through several hundred or more manufacturing steps for manufacturing a plurality of elements as described above.
  • Manufacture of an electronic component includes a plurality of manufacturing steps for manufacturing a plurality of elements as described above. For this reason, although it is performed in an environment where the contamination of foreign matters is highly regulated, it is difficult to completely suppress the damage to the substrate and circuit, the occurrence of patterning defects, and the like. Therefore, it is necessary to inspect various characteristics of the electronic component in order to investigate damage to the substrate and circuit, occurrence of patterning defects, and prevent the introduction of defective products.
  • the inspection of the characteristics of electronic parts is generally performed using an inspection device called a semiconductor inspection device.
  • a semiconductor inspection device for example, the tip of a thin needle electrode called a probe (also referred to as a conductive contact) is electrically connected to each of a plurality of electrodes and a plurality of wirings formed on a semiconductor integrated circuit, Acquire various electrical information.
  • One of the objects of the present invention is to provide a probe that can reliably achieve electrical connection with a semiconductor integrated circuit to be inspected or an electrode or wiring of an electronic component including the semiconductor integrated circuit.
  • One of the objects of the present invention is to provide a probe having excellent durability, for example, durability of an end portion in contact with an electrode or wiring.
  • One of the objects of the present invention is to provide a probe unit including one or two or more probes, or a semiconductor inspection apparatus including the probe unit.
  • a probe according to an embodiment of the present invention includes a first plunger, a first end having a first notch for fitting the first plunger, and a first spiral having a first spiral groove. And a first pipe having a first cylindrical portion.
  • the probe which concerns on one Embodiment of this invention is equipped with the 2nd plunger
  • the 1st pipe may be provided with the 2nd end part which has a 2nd notch which fits a 2nd plunger. .
  • the first plunger of the probe according to the embodiment of the present invention may further include a first sliding portion, and the first sliding portion may be in contact with the first cylindrical portion.
  • the first pipe of the probe according to the embodiment of the present invention may include a second spiral portion having a second spiral groove.
  • the second plunger of the probe according to the embodiment of the present invention may further include a second sliding portion, and the second sliding portion may be in contact with the first cylindrical portion.
  • the probe according to one embodiment of the present invention may further include a second pipe disposed inside the first pipe and in contact with the first cylindrical portion.
  • the second pipe of the probe according to the embodiment of the present invention may have a third spiral groove.
  • At least one end has a notch, and the notch of the second pipe is the first plunger or A second plunger may be fitted.
  • the probe according to one embodiment of the present invention is fitted to the first pipe in either the first plunger or the second plunger fitted to both the first pipe and the second pipe of the probe.
  • the second boss portion may protrude from the first boss portion.
  • the probe includes a second pipe disposed inside the first pipe, in contact with the first cylindrical portion, and having a third spiral groove.
  • the second pipe has a notch in at least one of the two ends, and the first spiral portion is the first sliding portion in the first pipe and the second pipe.
  • the second spiral portion extends over the entire length, overlaps with the second cylindrical portion of the second pipe, or the notch of the second pipe, and the third spiral groove extends over the entire length, You may overlap with the notch which a 1st cylindrical part or a 2nd pipe has.
  • One embodiment of the present invention is a probe unit having a probe.
  • One embodiment of the present invention is a semiconductor inspection apparatus having a probe unit.
  • FIG. 1 is a schematic view showing a configuration of a semiconductor inspection apparatus according to the first embodiment of the present invention.
  • the semiconductor inspection apparatus 100 includes a probe unit 120 and a probe 110 provided therein.
  • the number of the probes 110 may be one or more, and usually a plurality of (for example, several tens to several thousand) probes 110 are installed.
  • the probe 110 exchanges electric signals with the circuit board 140.
  • the circuit board 140 is connected to the tester 150.
  • the tester 150 includes units such as a measurement power supply 152, an LCR measurement device 154, and a pulse generator 156.
  • FIG. 2A is a schematic cross-sectional view of the probe 110 and the probe unit 120 shown in FIG. A specific example of the first pipe 10 will be described later with reference to FIG. 3A.
  • the probe 110 is housed in the probe unit 120, and a part of the first plunger 14 is exposed.
  • the first tip 12 comes into contact with the electrode or wiring of the inspection object 170, and the electrical characteristics are measured.
  • Examples of the inspection object 170 include an IC package formed on a silicon wafer.
  • the portions facing the first tip portion 12 and the first plunger 14 are the second tip portion 22 and the second plunger 24.
  • the probe unit 120 may be composed of a probe holder 70 having a first probe holder member 72 and a second probe holder member 74, for example.
  • the first probe holder member 72 and the second probe holder member 74 may be formed using an insulator such as resin or ceramic.
  • the plurality of probes 110 are arranged so as to have the same height. Further, the arrangement may be determined according to the electrode to be inspected and the wiring pattern.
  • the probe 110 includes a conductive material, and may include, for example, a metal such as gold, copper, nickel, palladium, tungsten, or an alloy of the above metals. Alternatively, the probe 110 may include a conductive material, and the surface may be plated using gold or the like.
  • the probe 110 has a first plunger 14, a second plunger 24, and a first pipe.
  • the first plunger 14 has a first tip portion 12, a first plunger boss portion 16, and a first sliding portion 18.
  • the second plunger 24 has a second tip portion 22, a second plunger boss portion 26, and a second sliding portion 28.
  • the first pipe 10 has a first end portion 30 having a first notch 20, a first spiral portion 40 having a first spiral groove 41, and a second end portion having a second notch 21.
  • a second spiral portion 60 having two end portions 31, a second spiral groove 61, and a first cylindrical portion 50.
  • the first notch 20 is continuous with the first spiral groove 41.
  • the second notch 21 is continuous with the second spiral groove 61.
  • a first plunger boss 16 is fitted in the first notch 20.
  • a second plunger boss portion 26 is fitted in the second notch 21.
  • the first plunger 14 is electrically connected to the electrode and wiring of the inspection object 170 at the first tip portion 12.
  • the 1st plunger 14 and the 2nd plunger 24 have a cylindrical shape, and it demonstrates as a cylindrical shape also in this embodiment.
  • channel contained in the 1st spiral part 40 and the 2nd spiral part 60 is not limited to the case shown in drawing.
  • the number of grooves can be changed without departing from the spirit of the present invention.
  • the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
  • the first plunger 14 is press-fitted into the first pipe 10, and the first notch 20 is fitted with the first plunger boss portion 16.
  • the second plunger 24 is also press-fitted into the first pipe 10, and the second plunger boss portion 26 is fitted into the second notch 21. Since there is a notch, the diameter of the first pipe 10 is likely to be widened, so that the load for press-fitting the plunger into the pipe can be reduced. Further, even if the plunger and the pipe diameter are somewhat varied, it can be tolerated.
  • the first sliding portion 18 is relatively thinner than the diameter of the first plunger boss portion 16.
  • the thin part of the 1st sliding part 18 may contain two different diameters.
  • the second sliding portion 28 is relatively thinner than the diameter of the second plunger boss portion 26.
  • the thin part of the 2nd sliding part 28 may contain two different diameters.
  • the tip portion slightly narrower than the first plunger boss portion 16 has a first cylindrical portion due to the bending of the first pipe 10 that occurs when receiving a load from the electrode or wiring to be inspected. 50.
  • the tip part slightly thinner than the second plunger boss part 26 is in contact with the first cylindrical part 50.
  • the first plunger 14, the first cylindrical portion 50, and the second plunger 24 may be used as a conduction path when electrically connected to the electrode and wiring of the inspection target 170. it can. Therefore, since the electrode or wiring and the probe can be conducted without using the spiral portion, the resistance value and inductance of the probe can be reduced. It should be noted that the conduction path not passing through the spiral portion only needs to be secured when electrically connected to the electrode or wiring of the inspection object 170, and this conduction path may not be secured before the connection.
  • the probe 110 having such a configuration allows the first pipe 10 to expand and contract in the axial direction when the first tip portion 12 of the probe 110 comes into contact with the electrode and the wiring of the inspection target 170, so Can reduce the impact.
  • each end of the first pipe 10 has one notch (also referred to as one place) has been described as an example, but there are two or more notches (also referred to as two or more places). There may be. Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more cutouts, the diameter of the first pipe 10 is more easily expanded, and therefore the load for press-fitting the plunger into the pipe can be further reduced.
  • the notch and the spiral groove may not be continuous. Since the notch and the spiral groove are not continuous, the strength of the pipe can be increased. Further, the length of the notch and the spiral groove is not limited to the length shown in FIG. 2A.
  • FIG. 2B is different from the configuration of FIG. 2A in that it has a second pipe 32 and the structure of the second plunger 24 is different.
  • the second pipe 32 is in contact with the first pipe 10. Note that one end of the second pipe 32 has a notch. A specific example of the second pipe 32 will be described later with reference to FIG. 3F.
  • the third plunger boss portion 29 of the second plunger 24 has a relatively smaller diameter and protrudes from the second plunger boss portion 26.
  • the second plunger boss portion 26 is fitted in the second cutout 21, and the third plunger boss portion 29 is fitted in the third cutout 23.
  • the first plunger 14 has the same configuration as the second plunger 24, and a pipe without a spiral groove similar to the second pipe may be fitted therein.
  • the manufacturing can be simplified.
  • the first sliding portion 18 and the second pipe 32 do not go through the first spiral portion 40 and the second spiral portion 60, Since it is electrically connected via the first cylindrical portion 50, the resistance value of the probe can be lowered.
  • FIG. 2C shows an example in which the second pipe 32 has a spiral groove with respect to the configuration of FIG. 2B.
  • a portion without a spiral groove and notch is defined as a second cylindrical portion.
  • the load resistance of the probe 110 can be increased.
  • a movable range can be expanded.
  • channel which the 2nd pipe 32 has, the 1st spiral part 40, and the 2nd spiral part 60 have shown the example which has not overlapped. That is, the first pipe 10 and the second pipe 32 can overlap at least one of the portions without the spiral groove, and the spiral groove does not have to be a conduction path. The value can be further reduced.
  • the spiral groove of the second pipe 32, the first spiral groove 41, and the second spiral groove 61 may overlap each other. In that case, the movable range of the probe 110 can be further expanded.
  • the 1st sliding part 18 has shown the example which is in contact with the 2nd pipe 32, it is not limited to this example. It is only necessary that the first sliding portion 18 is in contact with the second pipe 32 when the electric signal is transmitted and received. In the state of FIG. 2C, the first sliding portion 18 is not in contact with the second pipe 32. Also good.
  • FIG. 2D shows an example in which the first plunger 14 is inserted into the second pipe with respect to the configuration of FIG. 2C.
  • the first plunger 14 may also be press-fitted into the second pipe.
  • the first plunger boss portion 16 of the first plunger 14 is fitted into the first notch 20, and the fourth plunger boss portion 19 is fitted into the other end of the second pipe 32. Is done.
  • the second pipe 32 is in contact with the first plunger 14 and the second plunger 24 even when the probe 110 is not receiving a load from the electrode or wiring to be inspected. Therefore, a conduction path is always secured, and the resistance value of the probe can be kept low.
  • FIGS. 3A to 3E are schematic plan views of the first pipe 10 included in the probe 110.
  • FIG. 3F shows a schematic plan view of the second pipe 32.
  • FIG. 3A has the same configuration as the first pipe 10 shown in FIG. 2A, and the description thereof is omitted here.
  • FIG. 3B is different from FIG. 3A in that the first notch 20 has an angle with respect to the end surface of the first end portion 30, and the second notch 21 has an angle with respect to the end surface of the second end portion 31.
  • An example having an angle is shown. Even if the second notch 21 has an angle with respect to the end surface of the second end portion 31, the end surface of the second end portion 31 is approximately horizontal. Therefore, when the second plunger 24 is press-fitted into the first pipe 10, the diameter of the second end portion 31 is widened so that the second plunger 24 is expanded and contracted with respect to the first pipe 10. It is possible to press-fit without difficulty. Therefore, it is possible to provide a highly reliable probe with little damage and the like.
  • FIG. 3C is different from FIG. 3B in that the first notch 20 is not continuous with the first spiral groove 41, and the second notch 21 is also continuous with the second spiral groove 61.
  • the boss portion 16 is press-fitted approximately straight with respect to the expansion and contraction direction of the first pipe 10. Therefore, the first pipe 10 and the first plunger 14 are connected approximately horizontally, and electrical connection can be ensured.
  • the second plunger 24 the surface area of the pipe is increased due to the fewer grooves as compared with FIGS. 3A and 3B, so that a probe with higher durability can be realized. Therefore, it is possible to provide a highly reliable probe with little damage and the like.
  • FIGS. 3D and 3E show the first notch 20, one spiral groove 42, one second notch 21, and a spiral shape with respect to FIGS. 3A and 3C, respectively.
  • the spring constant of the first pipe is reduced, and the first pipe is more easily expanded and contracted in the axial direction. The impact at the time of contact with can be further reduced.
  • FIG. 3F shows a schematic plan view of the second pipe 32 included in the probe 110.
  • FIG. 3F is a plan view of the second pipe 32 shown in FIG. 2B.
  • One end of the second pipe 32 has a third notch 23. Since the pipe has the notch, the plunger can be press-fitted substantially straight with respect to the expansion and contraction direction of the pipe. Therefore, the electrical connection between the pipe and the plunger can be ensured.
  • the probe 110 having such a configuration can mitigate the impact on the inspection target by the first pipe 10 extending and contracting in the axial direction.
  • the second pipe 32 may also have a spiral groove as shown in FIGS. 2C and 2D.
  • the 3rd notch 23 may have an angle with respect to the end surface of the 2nd pipe 32, as shown to FIG. 3B. Further, the spiral groove and the third notch 23 may be continuous as shown in FIG. 3A or may not be continuous as shown in FIG. 3C. Further, the spiral groove may be two as shown in FIGS. 3D and 3E.
  • the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle.
  • the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the shape of each edge part may differ.
  • channel has shown the example which is 2 strip
  • the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the number of notches may be at least one.
  • the notch may be continuous with the spiral groove.
  • the notches and the spiral groove may not be continuous or may be continuous. However, one side may be continuous and the other may not be continuous.
  • the probe 110 has the first notch 20 when the first plunger 14 is press-fitted into the first pipe 10, so that the first notch 20 Compared with the case where there is no notch 20, the diameter of the first pipe 10 is increased, and the load for press-fitting the plunger into the pipe can be reduced. Further, in the probe 110, the first end 30 is kept approximately horizontal. Therefore, the first plunger 14 is press-fitted approximately straight with respect to the expansion / contraction direction of the first pipe 10. The same applies to the press-fitting of the second plunger boss portion 26 and the second end portion 31 of the second plunger 24.
  • the electrical connection can be ensured.
  • the pressure can be applied almost straight to the tip of the probe, even if contact with the electrodes and wiring of the semiconductor integrated circuit is repeated, the tip of the probe is prevented from being bent or quickly worn out, making it durable.
  • a probe with high performance can be realized.
  • the positional accuracy of the tip of the probe can be increased.
  • the probe unit provided with these probes, or a semiconductor inspection apparatus provided with the same can be provided.
  • Second Embodiment In this embodiment, another configuration of the probe according to one embodiment of the present invention will be described. In addition, description may be abbreviate
  • FIG. 4 shows a schematic cross-sectional view of the probe 112 and a schematic plan view of the first pipe 80 included in the probe 112.
  • the probe 112 is housed and used in the probe unit 120 shown in FIG. 2A. 4A to 4C show an example in which the second spiral groove 61 is not provided for the probe 110 of FIGS. 2B to 2D. 4, the description of the same configuration as that of FIG. 2 may be omitted.
  • the second plunger 24 included in the probe 112 has a second tip portion 22 and a second plunger boss portion 26.
  • the first pipe 80 includes a first end portion 30 having a first notch 20, a first spiral portion 40 having a first spiral groove 41, and It has the 1st cylindrical part 50 and the 2nd edge part 31 which has the 2nd notch 21.
  • a second plunger boss portion 26 is fitted in the second notch 21.
  • channel contained in the 1st spiral part 40 is not limited to the case shown in drawing.
  • the number of grooves can be changed without departing from the spirit of the present invention.
  • the length and thickness of each portion are not limited to those shown in the drawings, and can be changed without departing from the spirit of the present invention.
  • the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
  • FIG. 4B shows an example in which the second pipe 32 has a spiral groove and the structure of the second plunger 24 is different from the configuration of FIG. 4A.
  • the description of the same configuration as in FIG. 4A is omitted here.
  • the second pipe 32 is in contact with the first pipe 80.
  • the load resistance of the probe 112 can be increased.
  • the movable range of the probe 112 can be expanded.
  • an example in which the spiral groove of the second pipe 32 and the first spiral groove 41 do not overlap is shown. That is, since it is not necessary to use a spiral groove as a conduction path, the resistance value of the probe can be further reduced.
  • 4B has one spiral groove on one side of the first pipe and one contact point on the sliding portion.
  • the second pipe has one spiral groove. Therefore, the movable range of the probe can be widened.
  • hub part 29 has shown the example which is a column shape, it is not limited to this example.
  • the third plunger boss portion 29 is press-fitted into the second pipe 32 by forming a pointed shape like a conical shape, it is possible to facilitate press-fitting.
  • FIG. 4C shows an example in which the first plunger 14 is also inserted into the second pipe with respect to the configuration of FIG. 4B.
  • the description of the same configuration as in FIG. 4B is omitted here.
  • the second pipe 32 is in contact with the first plunger 14 and the second plunger 24 even when the probe 112 is not receiving a load from the electrode or wiring to be inspected. Therefore, a conduction path is always secured, and the resistance value of the probe can be kept low.
  • the spiral groove may be two as shown in FIGS. 3D and 3E. Further, the spiral groove may be three or more (not shown).
  • the case where the first end portion 30 has one notch (also referred to as one location) has been described as an example, but the number of notches may be two or more (also referred to as two locations or more). .
  • the first cylindrical portion 50 has one notch (also referred to as one place) has been described as an example, the number of notches may be two or more (also referred to as two or more places).
  • the length of the notch may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more cutouts, the diameter of the first pipe 80 is more easily expanded, and therefore the load for press-fitting the plunger into the pipe can be further reduced. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle.
  • the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the shape of each edge part may differ.
  • the both ends of the 1st edge part 30 and the 2nd edge part 31 have a notch, the number of the notches which each edge part has may differ.
  • the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the number of notches may be at least one.
  • the notch may be continuous with the spiral groove.
  • the notches and the spiral groove may not be continuous or may be continuous. However, one side may be continuous and the other may not be continuous.
  • a conductive path having a small resistance value can be secured when electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit.
  • a probe that can reliably achieve electrical connection.
  • a probe that is excellent in durability at an end portion in contact with an electrode or wiring.
  • a probe unit including these probes or a semiconductor inspection apparatus including the probe unit can be provided.
  • FIG. 5 shows a schematic cross-sectional view of the probe 113 and the probe unit 120 and a schematic plan view of the first pipe 90 included in the probe 112.
  • the probe 113 shown in FIG. 5A shows an example in which the second plunger 24 is not provided and the first pipe 90 does not have the second notch 21 with respect to the configuration of the probe 112 shown in FIG. 4A. Yes.
  • the other configuration is the same as that in FIG. 4A, and a description thereof is omitted here.
  • the first pipe 90 includes a first end 30 having a first notch 20, a first spiral 40 having a first spiral groove 41, and a first And a second end portion 31 having no notch.
  • the first end portion 30 into which the first plunger 14 that comes into contact with the electrode or wiring of the semiconductor integrated circuit is press-fitted has a first notch 20, so that the first plunger 14 can expand and contract the first pipe 90.
  • the first pipe 90 and the first plunger 14 are connected approximately horizontally, and electrical connection can be ensured.
  • the tip of the probe is not inclined with respect to the electrode or wiring surface of the semiconductor integrated circuit but can be contacted approximately vertically, the probe tip can be prevented from being bent or quickly worn out, and has high durability. Can be realized.
  • the first pipe 90 does not have the second notch 21, the manufacture of the probe can be simplified.
  • channel contained in the 1st spiral part 40 is not limited to the case shown in drawing. The number of grooves can be changed without departing from the spirit of the present invention.
  • each portion is not limited to those shown in the drawings, and can be changed without departing from the spirit of the present invention.
  • the length and thickness of each part are not limited to those shown in the drawings, and can be changed without departing from the gist of the present invention.
  • the probe holder 70 can be formed by only the first probe holder member 72. Therefore, the manufacturing cost can be reduced as compared with FIG. 2A.
  • FIG. 5C shows an example of the first pipe 90.
  • FIG. 5C shows an example in which a plurality of tapered claws are provided at the second end portion 31 in the configuration of FIG. 5B to form a crown-shaped tip portion 180 (also referred to as a crown shape).
  • the probe 113 can perform more reliable electrical connection with the electrode or wiring on the circuit board 140.
  • the spiral groove may be two as shown in FIGS. 3D and 3E. Further, the spiral groove may be three or more.
  • FIG. 5 illustrates an example in which the first pipe has one notch (also referred to as one place), but the number of notches may be two or more (also referred to as two or more places). Further, the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention. Since there are two or more notches, the diameter of the first pipe 90 becomes easier to expand, so that the load for press-fitting the plunger into the pipe can be further reduced. Further, the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • FIG. 5 shows examples of probes according to an embodiment of the present invention, but the present invention is not limited to these examples.
  • the notch may be parallel to the direction in which the pipe expands or contracts, or may have an angle.
  • the length of the cutout may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • each notch may be parallel with respect to the direction where a pipe expands / contracts, may have an angle, and is parallel.
  • a notch and a notch having an angle may be mixed.
  • the length of the spiral groove may be longer or shorter than the illustrated length without departing from the spirit described in the present invention.
  • the number of notches may be at least one.
  • the notch may be continuous with the spiral groove or may not be continuous. When there are two notches, one may be continuous and the other may not be continuous.
  • a conductive path having a small resistance value can be secured when electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit.
  • a probe that can reliably achieve electrical connection.
  • a probe that is excellent in durability at an end portion in contact with an electrode or wiring.
  • a probe unit including these probes or a semiconductor inspection apparatus including the probe unit can be provided.
  • FIG. 6 is a schematic plan view of the first tip portion 12 or the second tip portion 22 included in the probe according to the embodiment of the present invention.
  • FIG. 6A shows a tip shaped like a crown. Such a shape is also called a crown type, for example.
  • the shape shown in FIG. 6A is used for the first tip 12, for example.
  • By making the first tip portion 12 into a crown shape it is possible to make contact with the electrodes or wirings of a semiconductor integrated circuit to be inspected or an electronic component including the same at a plurality of vertices of the crown. Therefore, more reliable electrical connection with the electrode or wiring to be inspected is possible.
  • FIG. 6B shows a conical tip.
  • the shape shown in FIG. 6B is used for the first tip portion 12, for example.
  • the contact with the electrode or wiring of the semiconductor integrated circuit to be inspected or the electronic component including the semiconductor integrated circuit can be performed with a point, so that local contact is possible.
  • the contact with the electrode or wiring of the semiconductor integrated circuit to be inspected or the electronic component including the semiconductor integrated circuit can be performed with a point, so that local contact is possible.
  • mold it can contact with a bigger load.
  • reliable electrical connection with the electrodes and wirings to be inspected becomes possible.
  • FIG. 6C shows a tip having a rounded tip with respect to FIG. 6B.
  • the shape shown in FIG. 6C is used for the first tip portion 12 or the second tip portion 22, for example. With such a shape, it is possible to increase an area electrically connected to an electrode or wiring of a semiconductor integrated circuit to be inspected or an electronic component including the semiconductor integrated circuit. Therefore, the surface pressure between the electrode or wiring to be inspected and the probe can be lowered.

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  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention concerne, selon un mode de réalisation, une sonde comprenant : un premier piston ; une première section d'extrémité ayant une première découpe destinée à s'ajuster dans le premier piston ; une première section en spirale ayant une première rainure en spirale ; et un premier tuyau ayant une première section cylindrique.
PCT/JP2018/012350 2017-03-29 2018-03-27 Sonde, unité de sonde et dispositif d'inspection à semi-conducteurs comportant une unité de sonde WO2018181273A1 (fr)

Priority Applications (1)

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JP2019509866A JP7023276B2 (ja) 2017-03-29 2018-03-27 プローブ、プローブユニット、およびプローブユニットを備える半導体検査装置

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JP2017064993 2017-03-29
JP2017-064993 2017-03-29

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WO2018181273A1 true WO2018181273A1 (fr) 2018-10-04

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JP (1) JP7023276B2 (fr)
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WO2020039969A1 (fr) * 2018-08-23 2020-02-27 日本電産リード株式会社 Gabarit d'inspection, dispositif d'inspection et terminal de contact
JP2021165638A (ja) * 2020-04-06 2021-10-14 株式会社日本マイクロニクス プローブおよび電気的接続装置

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JP2016142644A (ja) * 2015-02-03 2016-08-08 株式会社日本マイクロニクス 電気的接続装置およびポゴピン

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US20060001437A1 (en) * 2004-06-30 2006-01-05 January Kister Double acting spring probe
JP2007024664A (ja) * 2005-07-15 2007-02-01 Japan Electronic Materials Corp 垂直コイルスプリングプローブ及びこれを用いたプローブユニット
US7491069B1 (en) * 2008-01-07 2009-02-17 Centipede Systems, Inc. Self-cleaning socket for microelectronic devices
JP2010281601A (ja) * 2009-06-02 2010-12-16 Nidec-Read Corp 検査用治具及び検査用接触子
JP2010281583A (ja) * 2009-06-02 2010-12-16 Nidec-Read Corp 検査用治具
WO2011132613A1 (fr) * 2010-04-19 2011-10-27 日本電産リード株式会社 Contact et gabarit pour inspection
JP2013053931A (ja) * 2011-09-05 2013-03-21 Nidec-Read Corp 接続端子及び接続治具
JP2015141199A (ja) * 2014-01-28 2015-08-03 旺▲夕▼科技股▲分▼有限公司 スプリングプローブ
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JP2016109664A (ja) * 2014-11-26 2016-06-20 株式会社日本マイクロニクス プローブ及び接触検査装置
JP2016142644A (ja) * 2015-02-03 2016-08-08 株式会社日本マイクロニクス 電気的接続装置およびポゴピン

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020039969A1 (fr) * 2018-08-23 2020-02-27 日本電産リード株式会社 Gabarit d'inspection, dispositif d'inspection et terminal de contact
JPWO2020039969A1 (ja) * 2018-08-23 2021-08-12 日本電産リード株式会社 検査治具、検査装置、及び接触端子
US11467186B2 (en) 2018-08-23 2022-10-11 Nidec-Read Corporation Inspection jig, inspection device, and contact terminal
JP7409310B2 (ja) 2018-08-23 2024-01-09 ニデックアドバンステクノロジー株式会社 検査治具、検査装置、及び接触端子
JP2021165638A (ja) * 2020-04-06 2021-10-14 株式会社日本マイクロニクス プローブおよび電気的接続装置
JP7372194B2 (ja) 2020-04-06 2023-10-31 株式会社日本マイクロニクス プローブおよび電気的接続装置

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TW201837476A (zh) 2018-10-16
JPWO2018181273A1 (ja) 2019-11-07

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