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WO2018168504A1 - Corps de montage de composant et dispositif électronique - Google Patents

Corps de montage de composant et dispositif électronique Download PDF

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Publication number
WO2018168504A1
WO2018168504A1 PCT/JP2018/007847 JP2018007847W WO2018168504A1 WO 2018168504 A1 WO2018168504 A1 WO 2018168504A1 JP 2018007847 W JP2018007847 W JP 2018007847W WO 2018168504 A1 WO2018168504 A1 WO 2018168504A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal
electronic component
conductor
wiring board
heat
Prior art date
Application number
PCT/JP2018/007847
Other languages
English (en)
Japanese (ja)
Inventor
悠 江口
陽紀 富田
Original Assignee
Ｋｙｂ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｋｙｂ株式会社 filed Critical Ｋｙｂ株式会社
Publication of WO2018168504A1 publication Critical patent/WO2018168504A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a component mounting body having an exothermic electronic component and an electronic apparatus including the component mounting body.
  • an electronic control unit including a power system board on which a power circuit is mounted and a control system board that generates a control signal
  • the ECU generates a control signal for driving a motor for assisting the driver's steering force based on outputs from a steering torque sensor, a vehicle speed sensor, and the like of the steering wheel.
  • a heat-generating switching element such as a power MOSFET is used.
  • the ECU is provided with a heat sink for efficiently radiating heat generated by the heat-generating electronic components.
  • Patent Document 1 includes a printed circuit board on which a plurality of heating elements are mounted, and a metal case fixed to the printed circuit board through a plurality of screws, and the case is formed of silicon on the plurality of heating elements.
  • An electronic control device is described which abuts via a heat conducting member of the system.
  • Patent Document 2 describes a semiconductor device having a semiconductor layer, a connection electrode provided on one surface of the semiconductor layer, and a heat dissipation portion provided on the other surface of the semiconductor layer.
  • the clearance between the electronic component and the heat sink will be widened, so the heat dissipation efficiency of the electronic component will be reduced, resulting in malfunction of the electronic device. May be incurred.
  • Such a problem may occur due to the structure of the land portion on the substrate surface, the terminal layout of the electronic component, or both of them. Therefore, the structure of the land portion that can increase the parallelism of the electronic component to the substrate surface. Optimization is required.
  • an object of the present invention is to provide a component mounting body and an electronic apparatus that can increase the parallelism of an electronic component with respect to a substrate surface.
  • a component mounting body includes an electronic component and a wiring board.
  • the electronic component has a first surface having a heat radiating portion, and a second surface having an electrode terminal and opposite to the first surface.
  • the wiring board has a conductor pattern and an insulator pattern.
  • the conductor pattern includes a first conductor portion extending across the mounting region of the electronic component in a uniaxial direction, and is electrically connected to the electrode terminal.
  • the insulator pattern includes an opening provided on the first conductor portion and facing the electrode terminal, and supports both end sides in the uniaxial direction of the second surface.
  • the first conductor portion that is electrically connected to the terminal electrode of the electronic component is formed so as to extend across the component mounting region on the wiring board in the uniaxial direction, and Since the insulator pattern for supporting the electronic component is provided on the first conductor portion, the parallelism of the electronic component with respect to the substrate surface is increased. Thereby, the heat dissipation efficiency from the said electronic component to a heat sink improves, and it becomes possible to obtain the desired heat dissipation characteristic stably.
  • the electrode terminal is composed of a plurality of terminal parts including a first terminal part electrically connected to the first conductor part and a second terminal part parallel to the first terminal part,
  • the conductor pattern may further include a second conductor portion that is electrically connected to the second terminal portion.
  • the second terminal portion may be composed of a single electrode or a plurality of electrodes.
  • the first terminal portion may have the largest area. Thereby, since the area
  • An electronic device includes the component mounting body, and a heat sink that is disposed to face the wiring board and is connected to the heat dissipation portion via a heat conductive member. Has a heat radiating terminal as the heat radiating portion.
  • FIG. 5 is a schematic cross-sectional view in the YY line direction in FIG. 4. It is a principal part schematic plan view which shows the modification of a structure of the wiring board in the said component mounting body. It is a principal part schematic plan view which shows the other modification of the structure of the wiring board in the said component mounting body.
  • FIG. 1 is a schematic cross-sectional view of a main part showing a configuration of a component mounting body 100 according to an embodiment of the present invention.
  • the X axis, the Y axis, and the Z axis indicate three axial directions orthogonal to each other, and the Z axis corresponds to the thickness direction (height direction) of the component mounting body 100.
  • the component mounting body 100 of this embodiment includes an electronic component 10 and a wiring board 20 that supports the electronic component 10.
  • the component mounting body 100 is configured as, for example, a power circuit board or a control circuit board of various electronic devices, and a plurality of circuit components are mounted on the wiring board 20 in addition to the electronic components 10, not shown.
  • the electronic component 10 is composed of a heat generating electronic component.
  • a switching element such as a power MOSFET (Metal Oxide Semiconductor Semiconductor Field Field Effect Transistor).
  • MOSFET Metal Oxide Semiconductor Semiconductor Field Field Effect Transistor
  • various electronic components such as an insulated gate bipolar transistor (IGBT: Insulated Gate Bipolar Transistor) and a thyristor can be used.
  • IGBT Insulated Gate Bipolar Transistor
  • the electronic component 10 is surface-mounted on the wiring board 20 by a reflow soldering method.
  • the component mounting body 100 further includes a heat sink 30 facing the wiring board 20 with the electronic component 10 interposed therebetween, as shown in FIG.
  • the heat sink 30 is typically configured by a structure such as a metal plate or case, and radiates heat from the electronic component 10 by being thermally connected to the electronic component 10.
  • the heat sink 30 may be fixed to the wiring board 20 or may be fixed to a casing (not shown) of an electronic device that supports the wiring board 20.
  • FIGS. 2A and 2B are a top perspective view and a bottom perspective view schematically showing the overall configuration of the electronic component 10.
  • the electronic component 10 is composed of a rectangular parallelepiped semiconductor package component.
  • the size of the electronic component 10 is not particularly limited.
  • the electronic component 10 has a rectangular planar shape with a side length of 5 mm to 10 mm.
  • the electronic component 10 has a front surface portion 11 (first surface) facing the heat sink 30 and a back surface portion 12 (second surface) on the opposite side (facing the wiring board 20).
  • the front surface portion 11 and the back surface portion 12 are configured by a plane parallel to the XY plane.
  • the front surface portion 11 is provided with a heat dissipation terminal 110 as a heat dissipation portion, and the back surface portion 12 is provided with an electrode terminal 120. Yes.
  • the heat radiating terminal 110 is thermally connected to the heat sink 30 via a heat conducting member 42 attached to the surface portion 11.
  • the heat conductive member 42 has insulating properties, and a resin material such as a heat conductive adhesive or a heat conductive adhesive sheet is employed.
  • the heat radiating terminal 110 is constituted by a single terminal having a rectangular planar shape, and is disposed at a substantially central portion of the surface portion 11.
  • the heat radiating terminal 110 is not limited to this example, and may be composed of a plurality of terminals arranged in a predetermined pattern on the surface portion 11.
  • the heat dissipation of the electronic component 10 can be further improved by configuring the heat dissipation terminal 110 with a metal material having high heat dissipation.
  • the electrode terminal 120 corresponds to an external terminal of the electronic component 10 and is electrically connected to a land portion on the wiring board 20.
  • the electrode terminal 120 includes a plurality of terminal portions including a first terminal portion 121 and a second terminal portion 122.
  • the first terminal portion 121 is composed of a single terminal having a rectangular planar shape, and is disposed at a substantially central portion of the back surface portion 12.
  • the second terminal portion 122 is composed of a plurality of (four in this example) terminals having a rectangular planar shape, and is arranged along one side portion of the back surface portion 12 with an interval.
  • the first terminal portion 121 has the largest area, and extends from the substantially central portion of the back surface portion 12 to the peripheral portion on one side in the Y-axis direction. Occupies an area.
  • the first terminal portion 121 and the second terminal portion 122 are arranged so as to face each other in the Y-axis direction on the back surface portion 12, and one end of each protrudes outward (side) from the back surface portion 12. Configured to do.
  • terminal portions 121 and 122 are examples, and it is needless to say that the terminal portions 121 and 122 can be appropriately changed according to the type and size of the parts.
  • the wiring board 20 is typically composed of a multilayer wiring board in which insulating bases made of synthetic resin or the like and conductor layers made of copper foil or the like are alternately laminated.
  • One surface of the wiring board 20 is configured as a mounting surface 21 on which the electronic component 10 is mounted.
  • the mounting surface 21 of the wiring board 20 has a conductor pattern 22 and an insulator pattern 23.
  • the conductor pattern 22 is typically composed of a copper foil having a predetermined pattern shape formed on the surface of the insulating substrate 24.
  • the insulator pattern 23 is typically composed of a solder resist having a predetermined thickness that covers the surfaces of the conductor pattern 22 and the insulating base 24.
  • FIG. 3 is a schematic plan view of a main part for explaining the configuration of the mounting surface 21.
  • the conductor pattern 22 has a first conductor portion 221 and a second conductor portion 222.
  • the first conductor portion 221 is electrically connected to the first terminal portion 121 (see FIGS. 1 and 2B) of the electronic component 10, and the second conductor portion 222 is the second terminal portion of the electronic component 10. 122 (see FIG. 2B) are electrically connected to each other.
  • the first conductor portion 221 is formed in a strip shape extending across the mounting area 20A of the electronic component 10 on the mounting surface 21 in the uniaxial direction (X-axis direction).
  • the first conductor portion 221 has a width dimension that is equal to or greater than the length along the Y-axis direction of the first terminal portion 121, and a length dimension that crosses the first terminal portion 121 in the X-axis direction.
  • the tip 221a is configured to be located outside the component mounting area 20A.
  • the second conductor portions 222 are arranged in the X-axis direction at a predetermined interval so as to correspond to the respective second terminal portions 122.
  • the insulator pattern 23 covers the conductor pattern 22 and the insulating base 24 on the mounting surface 21 as described above, and is connected to the electrode terminal 120 (first and second terminal portions 121 and 122). Openings 23a and 23b for forming 51 and 52 are provided.
  • the openings 23a and 23b are typically formed at predetermined positions on the mounting surface 21 by using a photolithography technique.
  • the opening 23 a is provided on the first conductor portion 221 facing the first terminal portion 121.
  • the opening 23a has a substantially rectangular planar shape, and is formed with an area that is the same as or slightly larger than the land 51 (first terminal 121).
  • the length of the side along the Y-axis direction of the opening 23a is formed to be slightly larger than the width dimension along the Y-axis direction of the land portion 51 (first conductor portion 221). .
  • the opening 23b is provided on the end portion of the second conductor portion 222 facing each of the second terminal portions 122.
  • the opening 23b has a substantially rectangular planar shape, and is formed with an area that is the same as or slightly larger than the land 52 (second terminal 122).
  • the length of the side along the X-axis direction of the opening 23b is slightly larger than the width dimension along the X-axis direction of the land portion 52 (second conductor portion 222).
  • the length of the side of the opening 23b along the Y-axis direction is slightly larger than the length of the land 52 along the Y-axis direction.
  • the conductor pattern 22 (first and second conductor portions 221 and 222) is connected to the electrode terminals 120 (first and second electrodes) of the electronic component 10 via the conductive bonding material 41 filled in the land portions 51 and 52. Terminal portions 121 and 122) (see FIG. 1).
  • the bonding material 41 is typically a brazing material such as lead-free solder.
  • the bonding material 41 is applied and filled in advance on the land portions 51 and 52 by a screen printing method or the like, and then the electronic component 10 is mounted on a mounting surface 20A (see FIG. 2) on the mounting surface 21 through a mounting process, a reflow process, and the like. To be implemented). Thereby, the component mounting body 100 is produced.
  • the bonding material 41 is not limited to a solder material, and may be a conductive paste containing metal particles or an anisotropic conductive paste.
  • the openings 23a and 23b of the insulator pattern 23 have a function of preventing the bonding material 41 from flowing out to regions other than the land portions 51 and 52. That is, since the opening areas of the openings 23a and 23b are limited, a sufficient amount of the bonding material 41 for bonding onto the land portions 51 and 52 is secured. Moreover, since each opening part 23a, 23b is individually formed corresponding to each land part 51, 52, the short circuit between land parts is prevented.
  • the insulator pattern 23 is formed on the insulating substrate 24 and the conductor pattern 22 with a predetermined thickness by a printing method, a spin coating method, or the like, and the conductor pattern 22 is formed on the insulating substrate 24 with a predetermined thickness. Formed with. And the insulator pattern 23 is provided on each surface so that the level
  • the first terminal portion 121 occupies the main area of the back surface portion 12 of the electronic component 10, and the mounting surface 21 of the wiring board 20 Of the provided conductor pattern 22, the first conductor portion 221 connected to the first terminal portion 121 is formed so as to straddle (or cross) the component mounting region 20A in one axis direction (X-axis direction in FIG. 3). ing. For this reason, as shown in FIG. 1 (corresponding to a cross-sectional view in the XX line direction in FIG. 3), the back surface portion 12 of the electronic component 10 extends in the uniaxial direction across the land portion 51 (opening portion 23a).
  • the electronic component 10 can be mounted with high parallelism to the surface (mounting surface 21) of the wiring board 20.
  • the first conductor portion 221 does not straddle the component mounting region 20A in the X-axis direction (does not cross), for example, the tip portion 221a is positioned within the region of the opening 23a.
  • the first region 231 of the insulator pattern 23 covering the first conductor portion 221 is unevenly distributed on one side (right side in FIG. 4) of the component mounting region 20A. become.
  • the electronic components 10 mounted in the component mounting area 20A have different heights across the land portion 51 (opening 23a) as shown in FIG. 5 corresponding to the YY line direction cross section in FIG. Since it is supported by the first region 231 and the second region 232 of the insulator pattern 23, the posture is inclined obliquely with respect to the surface of the wiring substrate 200.
  • the surface portion 11 of the electronic component 10 is also inclined, so that the thickness of the heat conducting member 42 is made uniform by the inclination of the electronic component 10.
  • the clearance between the heat sink 30 and the surface portion 11 cannot be reduced. For this reason, a uniform heat dissipation effect cannot be obtained in the plane of the surface portion 11, and there is a possibility of causing an operation failure of the electronic device. Such a problem becomes more prominent as the size of the electronic component 10 increases.
  • the electronic component 10 is mounted with a high degree of parallelism with respect to the surface (mounting surface 21) of the wiring board 20, and therefore the surface portion 11 of the electronic component 10 and the heat sink 30 The clearance between them can be narrowed, and a uniform heat radiation effect can be stably obtained in the surface portion 11 without causing variations in heat transfer characteristics. Thereby, a high heat dissipation effect can be obtained for the electronic component 10 having a large amount of heat generation, and stable operation characteristics of the electronic device can be ensured.
  • each electronic component is desired for the wiring board 20 by configuring the component mounting area of each electronic component in the same manner as described above. Parallelism can be ensured. As a result, it is possible to achieve appropriate thermal connection with each electronic component with a single heat sink 30, and to obtain the desired heat dissipation characteristics of each electronic component.
  • the first terminal portion 121 of the electronic component 10 is configured as a part of the electrode terminal 120, but the first terminal portion 121 is similar to the heat dissipation terminal 110. It may have the function as.
  • the second terminal portion 122 that constitutes the electrode terminal 120 of the electronic component 10 is constituted by a plurality of terminal portions.
  • the present invention is not limited thereto, and the second terminal portion 122 may be constituted by a single terminal portion. Good.
  • a single land portion 53 is formed through the opening 23c in the second conductor portion 223 connected to the terminal portion as in the wiring board 210 shown in FIG.
  • the first terminal portion 121 constituting the electrode terminal 120 of the electronic component 10 may be composed of a plurality of terminal portions.
  • a plurality of conductor portions 224 connected to the terminal portion are also configured, and each conductor portion 224 has a plurality of land portions 54 via openings 23d. Is formed.
  • each conductor part 224 is formed so that component mounting area

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un corps 100 de montage de composant selon un mode de réalisation de la présente invention comporte un composant électronique 10 et une carte 20 de câblage. Le composant électronique 10 présente une partie 11 de surface d'avers (première surface) dotée d'une borne 110 de dissipation de chaleur (unité de dissipation de chaleur), et une partie 12 de surface de revers (seconde surface) dotée d'une borne 120 d'électrode. La carte 20 de câblage est dotée d'un motif 22 de conducteur et d'un motif 23 d'isolant. Le motif 22 de conducteur comprend une première partie 221 de conducteur s'étendant dans une direction axiale à travers une zone de montage du composant électronique 10, et est reliée électriquement à la borne 120 d'électrode. Le motif 23 d'isolant comprend une ouverture 23a qui est orientée à l'opposé de la borne 120 d'électrode et est pratiquée sur la première partie 221 de conducteur, le motif 23 d'isolant soutenant les deux côtés d'extrémités dans une direction axiale de la partie 12 de surface de revers du composant électronique 10.
PCT/JP2018/007847 2017-03-15 2018-03-01 Corps de montage de composant et dispositif électronique WO2018168504A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017049426A JP6961902B2 (ja) 2017-03-15 2017-03-15 部品実装体及び電子機器
JP2017-049426 2017-03-15

Publications (1)

Publication Number Publication Date
WO2018168504A1 true WO2018168504A1 (fr) 2018-09-20

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PCT/JP2018/007847 WO2018168504A1 (fr) 2017-03-15 2018-03-01 Corps de montage de composant et dispositif électronique

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WO (1) WO2018168504A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112786547A (zh) * 2019-11-01 2021-05-11 神讯电脑(昆山)有限公司 散热架构

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240088759A1 (en) * 2021-04-28 2024-03-14 Mitsubishi Electric Corporation Multilayer circuit board, drive control device, and motor unit for electric power steering

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010006923A (ja) * 2008-06-26 2010-01-14 Momentive Performance Materials Inc 熱伝導性シリコーン組成物
JP2015156463A (ja) * 2014-01-14 2015-08-27 新光電気工業株式会社 配線基板及び半導体パッケージ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010006923A (ja) * 2008-06-26 2010-01-14 Momentive Performance Materials Inc 熱伝導性シリコーン組成物
JP2015156463A (ja) * 2014-01-14 2015-08-27 新光電気工業株式会社 配線基板及び半導体パッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112786547A (zh) * 2019-11-01 2021-05-11 神讯电脑(昆山)有限公司 散热架构
CN112786547B (zh) * 2019-11-01 2023-10-13 神讯电脑(昆山)有限公司 散热架构

Also Published As

Publication number Publication date
JP2018152525A (ja) 2018-09-27
JP6961902B2 (ja) 2021-11-05

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