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WO2018166737A1 - Socle d'essai et dispositif de mise en contact électrique destiné à la mise en contact électrique d'un signal de haute fréquence - Google Patents

Socle d'essai et dispositif de mise en contact électrique destiné à la mise en contact électrique d'un signal de haute fréquence Download PDF

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Publication number
WO2018166737A1
WO2018166737A1 PCT/EP2018/053753 EP2018053753W WO2018166737A1 WO 2018166737 A1 WO2018166737 A1 WO 2018166737A1 EP 2018053753 W EP2018053753 W EP 2018053753W WO 2018166737 A1 WO2018166737 A1 WO 2018166737A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
frequency cable
sleeve
conductor
contacting
Prior art date
Application number
PCT/EP2018/053753
Other languages
German (de)
English (en)
Inventor
Ludwig Huber
Stefan REISCHL
Frank Tatzel
Adalbert SCHADHAUSER
Steffen Thies
Original Assignee
Rosenberger Hochfrequenztechnik Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik Gmbh & Co. Kg filed Critical Rosenberger Hochfrequenztechnik Gmbh & Co. Kg
Publication of WO2018166737A1 publication Critical patent/WO2018166737A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors

Definitions

  • the present invention relates to a test socket with a plurality of contact elements for contacting each of an electrical signal or each one
  • a test socket having a plurality of arranged in the same grid contact elements is required.
  • the contact elements han ⁇ delt it is through-contact, ie Kontak- sliding elements, of the contact plane with the Kunststoffflä ⁇ surfaces of the test integrated circuit over the adjacent to the contact plane surface of the test socket to the ge ⁇ genüberode surface of the test socket and is extend over the opposite face against ⁇ addition of the test socket.
  • the contact elements are in particular pin-shaped Maisele ⁇ elements, ie contact pins.
  • Circuit is also a circuit board with electronics or je ⁇ de other expression of an electronic module with electronic contact surfaces covered.
  • the integrated circuit is typically inserted into the test socket so that a contacting end of one contact element reliably electrically contacts an associated contact surface of the integrated circuit.
  • the other end of each con ⁇ tact element is in each case connected via a so-called loadboard (German: charging plate) with a measuring device.
  • loadboard German: charging plate
  • Respectively to measure the individual contact surfaces of the test inte ⁇ grated circuit only a DC stabilized or low-frequency signal, then for the contacting of only usually a pin sufficient.
  • a contact is required, which is adapted to the radio frequency physics of the measured high-frequency signal.
  • US Pat. No. 7,173,442 B2 discloses a test device for testing integrated circuits with which DC voltage and / or low-frequency signals and high-frequency signals can be contacted in parallel at individual contact surfaces of the integrated circuit. For contacting the
  • High frequency signals are each a coplanar Staccolei ⁇ tion used.
  • the coplanar strip line extends in egg ⁇ ner plane parallel to the contact plane of the test inte grated circuit ⁇ . Since a coplanar strip line has a certain extent in the plane, which is typically greater than the pitch of the individual contact surfaces, such a coplanar strip line can be disadvantageously contacted only high-frequency signals at the edges of the grid.
  • the object of the present invention is to provide a test socket with which not only DC voltage signals but also high-frequency signals can be contacted at any contact surface of the integrated circuit to be tested.
  • this object is tismesvortechnisch by a test socket having the features of patent claim 1, by a Kontak- with the features of claim 18 and by a method for fabricating a contact-making device having the features of claim ge solves ⁇ 29th
  • a test socket having a plurality of contact elements for contacting a respective electrical signal or by a respective electric potential and Minim ⁇ least one contacting device for contacting a respective high-frequency signal, wherein the plurality of contact elements angeord respectively in a first grid ⁇ are net and within the first grid through each contacting at least a Benach ⁇ bartes contact element in each of the two to one another or ⁇ thogonalen arrangement directions of the first raster re- placed, wherein each contacting device along the axial extent of the contact elements extends parallel to the contact elements, wherein the at least one contacting device is in each case different from each ⁇ the contact element ,
  • a contacting device for contacting each ⁇ wells a high frequency signal having an outer sleeve, guided in the outer sleeve in the axial direction of the inner sleeve, a spring that is positioned between the inner sleeve and a radially directed on the outer sleeve to the inside web, one with the
  • a process for preparing a Kunststoffleitersvor- direction for contacting a respective Hochfre ⁇ -frequency signal comprising the steps of: inserting a spring and an inner sleeve of the contact-making device which is connected to an outer conductor of a Hochfre ⁇ frequency cable, in an outer sleeve of Kon - timing device; Connecting an inner conductor contact side arranged contact element with an inner ⁇ conductor of the high-frequency cable; Connecting at least one outer conductor contact side arranged Maisele ⁇ ment with an inner sleeve of justify istsvorrich- device and shaping a directed to the contact plane axial boundary of the outer sleeve of the contacting ⁇ device.
  • the of the present invention is based insights nis / idea is to provide a contacting device for contacting a Hochfre ⁇ quenzsignals, which is arranged parallel to the axial extension of the individual arranged in a Ras ⁇ ter contact elements, each of which is preferably a DC or Low frequency signal is contacted.
  • a Hochfre ⁇ frequency signal can be contacted not only at the edges of the grid, but also in the interior of the grid. Clocking of the con- of the RF signal is thus dependent to replace only a certain number of adjacent Kontak ⁇ tele elements from realized miniaturization of Kunststoffmaschinetechniksvor- direction.
  • Additional contact members are located between the actual contact area of the high-frequency signal within the grid and the next ge ⁇ superior edge of the grid, thus wetting must in delimi- to a plane parallel to the plane of contact arrange-
  • the contacting device is not replaced and thus sacrificed.
  • the number of adjacent contact elements is formed by a contacting device within the grid, which is hereinafter referred to as the first grid, he ⁇ sets, obtained as a function of the realized miniaturization and the type of contact, such as coaxial contacting or differentiel- le or Twinax contacting.
  • Sleeve and a radially inwardly directed web of äuße ⁇ ren sleeve is a spring positioned elastically supports the inner sleeve in the outer sleeve in the axial direction.
  • the contacting device according to the invention is thus embodied such that it is exchangeable from the test socket according to the invention.
  • the inner sleeve is axially movable over the outer sleeve out through a first implementation, given in a ⁇ to test the integrated circuit end surface of the äuße ⁇ ren sleeve is arranged.
  • the movement of the inner sleeve is limited in the direction of the test integrated circuit by the interaction of a radially outwardly directed web of the inner sleeve and a radially inward boundary of the outer sleeve, the first limited by ⁇ management.
  • An outer conductor of a contacting device with the ver ⁇ -bound high frequency cable is electrically and mechanically connected to the inner sleeve.
  • at least one inner conductor of the high-frequency cable is connected to an associated inner conductor contact side arranged contact element of the inventive contacting device.
  • Minim ⁇ least an outer conductor contact side arranged Maisele ⁇ ment is verbun with the electrically conductive inner sleeve ⁇ .
  • a contacting reali ⁇ Siert contacting at a under test integrated circuit belonging to a high-frequency signal to be measured ⁇ inner conductor and outer conductor contact surfaces and the associated inner conductor and outer conductor is a potential off supplying high-frequency cables.
  • the elastic guide the inner sleeve in the outer sleeve of the contacting device allows a variable distance between the inner conductor and outer conductor contact surfaces of on the integrated circuit to be measured high-frequency signal and the associated contacting the test socket from ⁇ tincten.
  • the high ⁇ frequency cable in accordance with the respective spacing of the Kon ⁇ clock-plane is mounted to the outer sleeve of the contacting device within the outer sleeve movable and follows so ⁇ with the movement of contact level.
  • the term "contact plane" refers to the plane in which the contact between the inner conductor and outer conductor contact side contact elements of the contacting device and the inner conductor or outer conductor contact surfaces of the high-frequency signal to be measured on the integrated circuit takes place.
  • a plurality of outer conductor contact side Mullele ⁇ elements are provided, which are designed to be elastic. In this way, distance differences between individual surface areas of the associated outer conductor contact surface can occur the integrated circuit and the individual outer conductor contact side contact elements are compensated.
  • the elastic contact elements are realized in particular as contact elements with spring arms.
  • read ⁇ is resilient contact members sen with a very low expansion and thus a contacting the con- clocking of a high frequency signal in a miniaturized ⁇ th execution realized.
  • LIGA lithographic electroplating
  • outer conductor contact-side contact elements are seen upstream, these are, in a preferred execution ⁇ form in the same grid as the contact elements, that is, arranged in ers ⁇ th raster in the inventive test socket.
  • the individual contact elements for contacting each egg ⁇ nem electrical signal or each of an electrical potential are preferably also realized as elastic Federkon ⁇ contact pins.
  • the inner conductor contact-side contact element is executed in a first embodiment of the contacting device according to the invention as an elastic contact element, in particular as a contact element with spring arm.
  • an elastic contact element in particular as a contact element with spring arm.
  • Kunststoffschrich ⁇ tung the inner-conductor-contact-side contact member is implemented as a rigid contact element. Differences in distance be- seen, the inner conductor contact surface and the adoptedleiterkon- clock-face of the measured high-frequency signal on the tegrated in ⁇ circuit and the inner conductor or outer conductor ⁇ contact-side contact elements are of reasonable by the cooperation ⁇ play of elasticity within the outer sleeve arranged spring and the elasticity of the outer conductor contact side elastic spring elements balanced.
  • a third embodiment of a Kontak- invention is realized by a single-sided contact element salvageleiterkon- clock t istsvorraum, the approach direction in Griffinie- has a cylindrical inner bore and a Elas ⁇ ticity.
  • the single contact-side contact element on the contact side is preferably annular in shape.
  • the contacting device according to the invention has two inner-conductor-contact side Contacts- ELEMENTS on for detecting a differential Hochfrequenzsig ⁇ nal on the under test integrated circuit. These two inner conductor contact-side contact elements are each connected to an associated inner conductor of the high-frequency cable (so-called Twinax high-frequency cable or differential high-frequency cable).
  • the high frequency cable as a so-called ⁇ micro-coaxial cables, that is realized as a coaxial cable with egg nem compared to conventional coaxial cables clearly ge ⁇ ringeren outer diameter.
  • the diameter of the inner and outer sleeve blank Kunststoffie- reasoning apparatus and thus minimize the radial extent of Kon ⁇ takt istsvorraum significantly.
  • the space required in the inventive test socket for such of miniaturization ⁇ catalyzed contacting device, ie the number of be ⁇ neighboring contact pins that are to be replaced by the miniaturized he ⁇ -making proper contact device is therefore advantageously minimized.
  • the high frequency cable is guided via a second passage in the outer sleeve from the contacting too- and directly or indirectly connected to a high-frequency measuring ⁇ device.
  • This second implementation is preferably provided on the contact plane opposite end face of the Kon ⁇ takt istsvortechnisch, ie on the side facing away from the test ⁇ integrated circuit th, and limited by the provided on the outer sleeve and radially inwardly court ⁇ teten web.
  • the contacting device according to the invention is formed at its opposite end of the contact plane as a coupling unit for receiving a connector.
  • This plug ⁇ connector can be connected to an end of another Hochfrequenzka ⁇ bels, it is advised directly or indirectly connected with a Hochfrequenzmessge- be secured.
  • this connector can also be attached to an assembly, preferably on a printed circuit board, which contacts the individual Maisele ⁇ elements and the individual Kunststoff istsvor- invention of the test socket according to the invention.
  • a radially inwardly directed web of the outer sleeve which is a second one
  • the Hochfre ⁇ quenztiv extends within the coupling unit through a fraction of the longitudinal extent of the Kopplungsein ⁇ unit.
  • SEN test socket is a board, preferably a printed circuit board, inte grated ⁇ for contacting the individual contact elements and a ⁇ individual contact devices according to the invention.
  • the inner conductor of the Hochfrequenzka ⁇ bels over the front end of the high-frequency cable projects out towards ⁇ and is positively or non-positively to the resilient or rigid inner-conductor-contact-side contact member ver ⁇ prevented.
  • the inner conductor contact side contact element has at least one radially inwardly directed groove, preferably a plurality of radially inwardly directed grooves on. These grooves form together ⁇ men with the thermally foamed in the manufacture of insulator material that enter the grooves, an axial connection.
  • the spring and the inner sleeve are inserted into the outer sleeve.
  • a high frequency cable is inserted into the inner sleeve via a passage in the outer sleeve and the outer conductor of the high frequency cable is connected to the inner sleeve.
  • the contact plane ⁇ axial boundary of the outer sleeve is formed ⁇ .
  • a module is integrated, which is connected to those contact ends of the contact elements which are located on the integrated circuit to be tested to ⁇ facing side.
  • this assembly has associated first contact points, which are arranged in the same grid spacing as the first grid of the individual contact elements.
  • this first contact points are arranged in the same grid spacing as the first grid of the individual contact elements.
  • this first contact points are angeord ⁇ net in a second grid with a grid spacing which is greater than the grid spacing of the first Ras-ester is effected.
  • the second contact point against the first contact points are arranged offset so that the ist ⁇ rising high-frequency cable and the outgoing of radiofrequency can be dissipated with the use of a very space ⁇ filling the bend parallel to the test socket.
  • Figure 1A is a three dimensional representation of an OF INVENTION ⁇ to the invention the test socket having a first exporting ⁇ approximate shape of a contact-making device of the invention for one high-frequency signal
  • Figure 1B is a three dimensional representation of an OF INVENTION ⁇ to the invention the test receptacle with a second exporting ⁇ approximate shape of a present invention.. contact-making device for each of a high frequency signal
  • IC is a three dimensional representation of an oF iNVENTION ⁇ to the invention the test receptacle with a third exporting ⁇ approximate shape of a contact-making device according to the invention for one high-frequency signal
  • Fig. 1D is a three dimensional representation of an OF INVENTION ⁇ to the invention the test receptacle with a fourth exporting ⁇ approximate shape of a contact-making device according to the invention for one high-frequency signal
  • Fig. 2A is a cross-sectional view of a first exporting ⁇ approximate shape of a contact-making device according to the invention for one high-frequency signal in an inventive test socket,
  • 2B is a cross-sectional view of a first Unterva ⁇ variant of a second embodiment of a Kontak- t istsvortechnisch for a differential high-frequency ⁇ signal in a test ood according to the invention
  • 2C is a cross-sectional view of a second sub ⁇ variant of a second embodiment of a Kon ⁇ takttechniksvortechnisch for a high-frequency signal in a test socket according to the invention
  • FIG. 2D is a cross-sectional view of a third exporting ⁇ approximate shape of an inventive Kunststofftechniks ⁇ apparatus for a high frequency signal in an inventive test socket,
  • FIG. 2E is a cross-sectional view of a fourth exporting ⁇ approximate shape of an inventive Kunststofftechniks ⁇ apparatus for a high frequency signal in an inventive test socket,
  • FIG. 3 is a cross sectional view of a test socket according to the invention ⁇ SEN with a first variant of the ex ternal ⁇ high frequency connection to the inventiveness proper contacting device
  • FIG. 4A is a cross sectional view of an inventive ⁇ SEN test socket with a second variant of the ex ⁇ ternal high-frequency terminal in the non-plugged state of the inventive contact-making device
  • FIG. 5B is a cross sectional view of an inventive ⁇ SEN test socket with a third variant of the ex ⁇ ternary high-frequency connection in the plugged Zu ⁇ stand on the contacting device according to the invention and
  • Fig. 6 is a flowchart of an inventive procedural ⁇ proceedings for the preparation of an inventive con ⁇ takt istsVorraum.
  • test socket 1 is typically designed as a block-shaped body 2 made of plastic, which meh ⁇ rere arranged in a certain grid fürgangsboh ⁇ ments has.
  • contact elements 3 preferably contact pins 3, arranged mechanically fi xed, each preferably as a spring contact pins ⁇ executed as indicated in the following FIG. 2.
  • the individual contact pins 3 are beyond a surface of the cuboid body 2 of the test socket 1 according to the invention.
  • the individual contact pins 3 are up to the opposite surface of the parallelepiped body 2 GE. leads or stand over this opposite surface ⁇ out.
  • These contact pins 3 each detect a DC-recorders and low-frequency signal to the associated to kon ⁇ lactating electrical contact surface of the integrated circuit.
  • two or more contact devices 4 may be adjacent to each other directly without the interposition of contact pins 3 to ⁇ .
  • contact-making devices 4 may be positioned at an edge or at a corner of the grid of contact pins 3 and thus be adjacent to only three edges or on two edges each of the contact pins 3 ⁇ or enclosed.
  • High-frequency signal has in each case a contact element 5 for contacting the inner conductor of the high-frequency signal and min ⁇ least one contact element for contacting the outer conductor harnessfre ⁇ -frequency signal.
  • a contact element 5 for contacting the inner conductor of the high-frequency signal
  • min ⁇ least one contact element for contacting the outer conductor harnessfre ⁇ -frequency signal.
  • eight contact elements 61, 62, 63, 64, 65, 6 ⁇ , 67 and 6s are provided for contacting the high-frequency outer-conductor signal.
  • These individual contact elements 5, 6 1 , 6 2 , 63, 64, 65, 6 6 , 67 and 63 in the first embodiment of the contact techniks- device 4 and 4 are each designed as a resilient contact elements to compensate for contact in each direction of the present tolerances that can occur between the associated outer conductor contact points on the electrical contact surface to be contacted of the integrated circuit. Due to the small dimensions of the contact elements 61, 62, 63, 64, 65, 6 6 , 67 and 6 8 , these are each manufactured as micromechanical components with spring arms in, for example, LIGA technology.
  • a test socket according to the invention 1 '' with a third embodiment of a contact according to the invention techniksvorcardi 4 '' to the contacting of a high frequency signal shown in Fig. IC is the sum of all the individual resilient contact members 61, 6 2, 63, 64, 65 , 6 ⁇ , 67 and 63 for external conductor contact réelle by a single in the direction of contact réellesutter resilient annular contact element 6 replaced.
  • This contactor device is elastic. see annular contact element 6 may be, for example, a corrugated ring or an annular member made of an elastomer, are contained in the conductive particles in a certain Konzent ⁇ ration.
  • a test socket 1 'of the invention with a fourth embodiment of he ⁇ inventive contact techniksvorraum 4' for the contacting of a differential high-frequency signal of FIG. 1D are two resilient contact elements 5i and 5 2 to the inner conductor contact ation of the differential high-frequency signal and 1D, for example, ten fe ⁇ - reducing contact elements 6i, 62, 63, 64, 65, 6e, 67, 6s, 69 and 6 10 réelle provided forêtleitertern.
  • the first embodiment of a present invention approximately Kunststoffie- device 4 for contact ation of a Hochfrequenzsig ⁇ Nals and its electrical and mechanical connection to a high-frequency cable 7 will be explained below with reference to FIG. 2:
  • the contact element 5 for mecanicleiterness tion is directly and directly connected by means of, for example, a press fit with the inner conductor 8 of the high-frequency cable 7.
  • the inner conductor 8 is led out for this purpose from the high-frequency cable 7 and arranged opposite the st irnseit igen end of the high frequency ⁇ cable 7.
  • a press fit and a solder joint between the inner ⁇ conductor 8 of the high-frequency cable 7 and the contact element 5 for mecanicleiter candy is possible.
  • All contact elements 6 lr 6 2 , 6 3 , 6 4 , 6 5 , 6 6 , 6 7 and 6 8 for outer conductor contact technik are directly and directly with ei ⁇ ner electrically conductive inner sleeve 9, in which the high-frequency cable 7 is guided , each with a frontal Contact electrically and mechanically connected.
  • this connection between the individual Maisele ⁇ elements 6 1 , 6 2 , 6 3 , 6 4 , 6 5 , 6 e, 6 7 and 6s and the inner sleeve 9 by means of a solder joint.
  • a screw or a connector by means of
  • the outer diameter of the outer conductor 10 of the Hochfrequenzka ⁇ lever 7 is smaller than the inner diameter of the inner sleeve 9, so that the high-frequency cable 7 and the inner sleeve 9 can be easily joined.
  • a connection technique Zvi ⁇ rule the high-frequency cable 7 and the inner sleeve 9 coming cohesive compounds, for example soldering, or positive or non-positive connections, such as crimping, in question.
  • the solder joint between the outer conductor 10 of the high-frequency cable 7 and the inner sleeve 9 is indicated by a thick line.
  • the inner sleeve 9 electrically and mechanically connected to the individual contact elements 6i, 62, 63, 64, 65, 6, 6, 6 and 6 s for external conductor contact.
  • the peculiarity of this design is the shortest possible axial extent of the ⁇ lectric insulator element 12, whereby the high-frequency cable 7 as close as possible to the contact plane 22 leads ⁇ leads and thus electrical impurities are considerably mini ⁇ mized.
  • the contact plane 22 is the transition between the individual contact elements 5, 6 1, 62, 63, 64, 65, 6 e, 6 7 and 6 3 of the contact-making device 4 and the associated electrical contact areas of the integrated circuit to be tested Understood.
  • the entire contact istsvortechnisch 4 for a Hochfre ⁇ -frequency signal comprises in analogy to the contact st iften 3 likewise apply an elasticity, on the one hand, a spring force of the contact is to electrical contact pads of the integrated circuit and on the other hand, Zvi ⁇ rule the individual electrical contact surfaces of the inte ⁇ grated circuit in the direction of contact réellesutter compensate tolerances.
  • the inner sleeve 7 is resiliently mounted in egg ⁇ ner outer sleeve 13.
  • the resilient mounting of the inner sleeve 7 is effected by a spring element 14, which is within the outer sleeve 13 between a radially outwardly directed web 15 on st irnseit igen end of the inner sleeve 9 and a radially inwardly directed web 16 on st irnseit igen end of outer sleeve 13 is arranged.
  • the contact is istsvoriques 4 for a high frequency signal in analogy to a spring contact st ift realized as an elastic contact component.
  • the contact force of the spring element 14 is adapted to the contact ⁇ forces of the individual elastic contact elements 5, 6i, 6 2 , 6 3 , 6 4 , 6 5 , 6 6 , 6 7 and 6 8 ideally along the entire spring contact path.
  • a pre ⁇ voltage generating technical mechanism such as pneumatic, hydraulic or elastomer can be used and is covered by the invention.
  • the inner sleeve 9 has an upper stop in the direction of the integrated circuit, which is provided by a Mittelbe ⁇ rich inner sleeve 9 radially outwardly directed web 18 and at the other st irnseit igen end of the outer sleeve 13 and bent radially inwardly Wall 19 of the outer sleeve 13 is realized.
  • the inwardly curved inner wall 19 of the outer sleeve 13 has an end-side passage 32, which is referred to below as the first passage 32, and allows axial movement of the inner sleeve 9 from the outer sleeve 13 out.
  • the inner conductor 8 of the high-frequency cable 7 is to Kon ⁇ clock element 5' led to the inner conductor contact ation.
  • Themped- from the st irnseit strength end of the high frequency cable 7 guided inner conductor 8 is connected via a suitable stoffschlüs ⁇ fitting connection, for example by soldering, or egg ⁇ ne appropriate positive and / or non-positive connection, at ⁇ play, by means of press fit, directly and directly connected to the rigid contact element 5 ' .
  • a suitable stoffschlüs ⁇ fitting connection for example by soldering, or egg ⁇ ne appropriate positive and / or non-positive connection, at ⁇ play, by means of press fit, directly and directly connected to the rigid contact element 5 ' .
  • the additional insulator element 12 may be provided in the bore of the rigid contact element 5 ' is anchored for réelleleiter toast technik. Alternatively, however, it is also possible to dispense with the additional insulator element 12.
  • the inner conductor 8 of the high-frequency cable 7 is guided to the contact plane 22 without the use of a contact element 5. This is at Ver ⁇ strengthening of the inner conductor 8 of the high-frequency cable 7 in Kon ⁇ clock domain tet suitable coating in the contact region.
  • the outer conductor 10 of the high ⁇ frequency cable 7 can be led to the individual contact elements 6i, 62, 63, 6 4 , 65, 6e, 67 and 6s.
  • the contact element 5 '' for mecanicleiter toastkom at least one groove 23, preferably a plurality of grooves 23, into which or in which is foamed material of the dielectric Isola ⁇ sector 10 of the high-frequency cable 7.
  • the depth of each groove 23 within the contact element 5 '' for mecanicleitermas ist thereby enlarged to the outer diameter of the substantially cylindrical contact element 5 '' for mecanicleiteravaie ⁇ tion outside each of the slots 23 is larger than the outer ⁇ diameter of the High-frequency cable 7 belonging mecaniclei ⁇ ters 8 and within the individual grooves 23 is smaller than the outer diameter of the high-frequency cable 7 associated In ⁇ nenleiters 8 dimensioned.
  • the fixation of the contact element 5 '' for mecanicleiterkontak- tion at the front end of the high-frequency cable 7 is realized that the inner conductor 8 of Hochfre ⁇ quenztiv 7 pushed out of the high-frequency cable 7 at the front end of the high-frequency cable 7 and with the Kon ⁇ tact element 5 '' Suitably - for example by means of soldering - is connected. Subsequently, the inner conductor 8 of the high-frequency cable 8 with the connected Kunststoffele ⁇ ment 5 '' while heating the front end of the high ⁇ frequency cable 8 hineinein pushed ⁇ back into the high-frequency cable until only a tip of the contact element 5 ' from the front end of the High-frequency cable 8 stands out.
  • the contact element 5 '' is located in a that forms the recess 22 of the high-frequency cable 7. Due to the heating of the front end of the high-frequency cable 8, the pushing in of the contacts ⁇ lement 5 simplifies 'connected' inner conductor, the insulating 7. In addition, foamed by heating Material of the dielectric see insulator 10 in the vicinity of the individual grooves 23, enters the individual grooves 23 and fills these ⁇ individual grooves 23 completely.
  • Contact istsvortechnisch 4 '' of FIG. 2D is the outer conductor contact tion a single contact element 6 is used.
  • this contact element 6 has a cylindrical inner bore in the direction of contact with respect to the outer conductor contact.
  • the single contact element 6 for the outer conductor contact has an elasticity in the contact direction.
  • the contact element 6 to the outer conductor ⁇ contact tion is connected to the st irnseit igen end of the inner sleeve 9 with a suitable connection technology, for example ⁇ by means of soldering, screwing or interference fit, connected.
  • a contact device istsvor ⁇ 4 '''according to Fig. 2E are two resilient Contacts- to the contact ation of a differential high-frequency signal ELEMENTS ation provided 5i and 5 2 to the inner conductor contact.
  • These resilient contact elements 5i and 5 2 for the inner conductor contact are each connected to an inner conductor 8i and 8 2 of the differential high-frequency cable 7 ' .
  • the two inner conductors 8 1 and 8 2 are surrounded within the outer conductor 10 of the differential high-frequency cable 7 ' by a respective belonging to ⁇ dielectric insulator Iii and II 2 .
  • the two inner conductors 8 1 and 8 2 of the differential Hochfre ⁇ quenztiv 7 ' are each led beyond the associated dielectric ⁇ 's insulator Iii and II 2 and by an associated bore within the insulator element 12 with the associated resilient contact element 5i and 5 2 to the inner conductor contact tion electrically connected.
  • the resilient Kon ⁇ clock elements 5i and 5 2 are ation to the inner conductor contact connected in play ⁇ by press fitting or screwing opinion within the associated bore with the insulator element 12th
  • resilient contact elements 5i and 5 2 for mecanicleiterness tion rigid contact elements can be used.
  • the high-frequency cable 7 through a bore, which is hereinafter referred to as a second passage 17 and which is formed by the web 16 at st irnseit igen end of the outer Hül ⁇ se 13, in the outer space of the Needlesvorrich ⁇ device 4, 4 ⁇ ' , 4 2 ' , 4 '' and 4 ''' out.
  • the high-frequency cable 7 can be routed directly to a high-frequency measuring device or indirectly via an interconnected printed circuit board, for example a sample card (German: measuring adapter module), or an adapter or an adapter module interposed therebetween to a high-frequency measuring device. From Fig.
  • This group 20 implements an electrical and mechanical Bond between the contact pins 3, which are arranged in a ver ⁇ like small grid spacing from each other, in associated further contact pins 21, which are arranged at a greater distance to each other.
  • the DC and Niederfre acid sequence signals at the ends of the individual further contact pins ⁇ blank 21 by a simple to realize probe card, tap.
  • the contacting device 4, 4 '' , 4 2 ' , 4 '' and 4 ''' according to the invention for contacting a high-frequency signal with respect to the longitudinal extension of the contact pins 3 is extended and passed through a bore 26 in the assembly 20 is.
  • the assembly 20 imple- mented a spatial separation between the individual Kon ⁇ clock pins 21 and the depending ⁇ wells also guided from the individual bores 26 contact devices 4, 4i ', 4 2', 4 '' and 4 '''for contacting a Hochfrequenzsig ⁇ nals.
  • a deflection, ie a bend, the individual high-frequency cable 7 by a certain angle, preferably an angle of 90 °, which requires a certain space can be realized in this way.
  • the individual contacting devices 4, 4 ⁇ ' , 4 2 ' , 4 '' and 4 ' for contacting each of a high-frequency ⁇ signal and the electrically and mechanically connected thereto High-frequency cable 7 parallel to the individual pins 3, ie in contacting direction, out.
  • Contact terminals 4 and the associated high-frequency cable 7 are oriented in particular along the entire axial extent of the contact pins 3 parallel to the individual contact pins 3.
  • ⁇ guides without the assembly 20 are possible.
  • dispense with the additional contact pins 21 ⁇ to are conceivable.
  • the respective high-frequency cables 7 are adapted accordingly in their cross-sectional extent. Be used as a high-frequency cable 7 coaxial cable, so come Because of the low pitch intervals so-called micro ⁇ coaxial cable, that is coaxial with a small cable cross-section ⁇ used.
  • 4 ⁇ ' , 4 2 ' , 4 '' and 4 ''' guided high-frequency cable 7 is also by a second passage 17, which by a web 16 at the front end of the outer sleeve 13th is formed ⁇ out in the outer space of the contacting device 4, 4 ⁇ ' , 4 2 ' , 4 '' and 4 ''' out.
  • the assembly 20 preferably a circuit board 20, which realizes an increase of the grid spacing of the individual Kon ⁇ clock pins.
  • a through bore is aligned with the longitudinal extent of the contacting device 4 according to the invention, 4 ⁇ ', 4 2', 4 '' and 4 '''provided 26th
  • this through-hole 26 which is from the inventive Kon ⁇ takt istsvorraum 4, 4 ⁇ ', 4 2', 4 '' and 4 '''hinausge- led high-frequency cable 7 through a fraction of the L Lucasser ⁇ stretching of the through hole extended 26th
  • the mecaniclei ⁇ ter 8 of the high-frequency cable 7 is in this case additionally slightly extended relative to the dielectric insulator 11 and the outer conductor 10 of the high ⁇ frequency cable 7.
  • the through hole 26 is dimensioned to be as
  • Coupling element for receiving a at a front end of another high-frequency cable 7 ' attached plug- connector 27 can serve. In the inserted state of the connector 27 in the as
  • Coupling element serving through hole 26 of the Baugrup ⁇ pe 20 of FIG. 4B abuts the connector 27 preferably with its front end at the front end of he ⁇ inventive contacting device 4, 4 ⁇ ' , 4 2 ' , 4 '' and 4 ''' to.
  • the completed with the connector 27 high frequency ⁇ cable 7 ' is directly to a high-frequency meter or to an interconnected circuit board, example ⁇ a sample card (German: measuring adapter assembly), or to an interposed adapter or Adapterbaugrup ⁇ pe passed.
  • the diameter of the through hole 26 is enlarged on the output side over a certain length.
  • the connector 27, the end of a further high-frequency cable 7 'is attached may also be a with an assembly 20', preferably with a circuit board 20 ', verbun ⁇ Dener connector 29 (so-called Porterplattensteckver ⁇ binder) as further undern reference to the Figures 5A and 5B is presented, serving as the coupling element
  • Through hole 26 of the assembly 20 may be plugged.
  • each contact pin 3 and each contacting device 4, 4i ' , 4 2 ' , 4 '' and 4 '''of the test socket 1, 1 ' , 1 '' and 1 ' according to the invention is not analogous to the second variant of an external high-frequency connection contacted state ⁇ identical.
  • the web 16 is the outer one Sleeve 13 is not attached to the front end of the Kunststoffssensvor- direction 4, 4 ⁇ ' , 4 2 ' , 4 '' and 4 ''' , but is by a certain distance in the direction of the contact elements 5, 5i, 5 2 , 5 ' , 5 '' , 6, 6i, 6 2 , 6 3 , 6 4 , 6 5 , 6 6 , 6 7 , 6 8 , 6 9 and 6 i0 staggered.
  • the area between the web 16 and the front end of the outer sleeve 13 is provided as a Kopp ⁇ development element for receiving a plug connector 29 being shaped and dimensioned ⁇ .
  • the coupling element formed at the front end of the outer sleeve 13 is dimensioned such that a plug connector 29, which is fastened on an opposite surface 30 of an assembly 20 ' , preferably a printed circuit board 20 ' , in the inserted state according to FIG from the contacting device according to the invention 4, 4i ' , 4 2 ' , 4 '' and 4 ''' out high-frequency cable 7 inside and outside conductor safely mechanically and electrically connected is connected.
  • the connector 29 pushes in the plugged ⁇ th state preferably on the web 16 of the outer sleeve of he ⁇ inventive contacting device 4, 4 ⁇ ' , 4 2 ' , 4 '' and 4 ' .
  • the connector 29 is electrically and mechanically connected on the inside and outside conductors with corresponding contact surfaces of a high-frequency connection, which are applied to the surface 30 of the assembly 20 ' .
  • connector 29 can also at a further high-frequency cable 7' mounted Termina ⁇ 27, as is above-illustrated in the figures 4A and 4B, in the formed as a coupling element front end of the invention Contacting device 4, 4i ' , 4 2 ' , 4 '' and 4 '''are plugged.
  • a first method step S10 the spring element 14, the inner sleeve 9 in the outer sleeve 13 of the contacting tion device 4, 4 ⁇ ' , 4 2 ' , 4 '' and 4 ''' inserted.
  • the high-frequency cable 7 is inserted through the second passage 17 in the web 16 of the contacting device 4, 4 ⁇ ' , 4 2 ' , 4 '' and 4 ''' associated outer sleeve 13 in the inner region of the inner sleeve 9.
  • the outer conductor 10 of the high-frequency cable 7 is connected to the inner sleeve 9 either with a cohesive connection method, for example by means of soldering, or with a positive and / or non-positive connection method, for example with ⁇ means crimping.
  • the inner conductor contact side contact element 5 is connected to the inner conductor 8 of the high ⁇ frequency cable 7 or the two inner conductor contact side contact elements 5i and 5 2 with the associated inner conductors 8i and 8 2 of the high-frequency cable 7 with a suitable conne ⁇ tion method.
  • the inner conductor 8 of the high-frequency cable 7 is used for this purpose led out stirnseiti ⁇ towards the end of the high-frequency cable 7 and with egg ⁇ nem cohesive connection methods, for example by soldering, or with a positive and / or frictional connection method, for example by interference fit, with the inner-conductor-contact-side contact member 5 and 5i and 5 2 for the realization of a safe connected electrical contact.
  • the inner conductor 8 of the high-frequency cable 7 is for this purpose the inner conductor 8 of the high-frequency cable 7 also opposite the st irnseit igen end of the high-frequency cable 7
  • Lockge ⁇ leads and with a material connection method, for example by means of soldering, or with a positive and / or non-positive connection method, for example by means of interference fit, with the inner conductor contact since iges Maisele ⁇ ment 5 or 5i and 5 2 connected to the realization of a secure electrical contact.
  • the front end of the Hochfrequenzka ⁇ lever 7 is heated over a certain period of time.
  • the inner conductor 8 of the Hochfrequenzka ⁇ lever 8 with the attached inner conductor contact since igen contact element 5 '' pushed back into the high-frequency cable 7 ⁇ until only a certain portion of the inner ⁇ conductor contact shall igen contact element 5 '' from the stirnsei ⁇ end of the high-frequency cable 7 protrudes.
  • the heating simplifies the shifting and foams the insulating material of the dielectric insulator 11 and penetrates into the originally empty intermediate space within the grooves 23 of the inner conductor contact since contact element 5 ' . Are the spaces filled with insulation material completeness, ⁇ dig within the grooves 23, the heating process can be adjusted.
  • the inner conductor contact is permanently fixed in the high-frequency cable 7 since contact element 5 " .
  • step S30 the individual outer conductor contact side contact elements 6, 6i, 6 2 , 6 3 , 6 4 , 6 5 , 6 e, 6 7 , 6s, 6 9 and 6 10 with the inner sleeve 9 of he ⁇ inventive Contact techniksvorraum 4, 4 ⁇ ' , 4 '' and 4 ' either cohesively, for example by means of soldering, or positive or non-positive, for example by means
  • An inventivemaschine istsvor ⁇ direction 4, 4i ' , 4 '' and 4 ''' is made in a suitable dimensioned ⁇ bore within the associated test socket according to the invention 1, 1 ' , 1 '' and] _ ''', for example by means

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne un socle d'essai comprenant plusieurs éléments de contact destinés à la mise en contact électrique respectivement d'un signal électrique ou d'un potentiel électrique, et au moins d'un dispositif de mise en contact électrique destiné à la mise en contact électrique respectivement d'un signal de haute fréquence. Les différents éléments de contact sont respectivement disposés dans une première matrice. Dans la première matrice, respectivement au moins un élément de contact adjacent est remplacé par chaque dispositif de mise en contact électrique dans chacune des deux directions de disposition mutuellement perpendiculaires de la première matrice. Chaque dispositif de mise en contact électrique s'étend le long de la dimension axiale des éléments de contact et ce, parallèlement aux éléments de contact. L'au moins un dispositif de mise en contact électrique (4; 41'; 42'; 4' '; 4' ' ') est respectivement différent de chaque élément de contact (3).
PCT/EP2018/053753 2017-03-14 2018-02-15 Socle d'essai et dispositif de mise en contact électrique destiné à la mise en contact électrique d'un signal de haute fréquence WO2018166737A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DEDE102017002479.0 2017-03-14
DE102017002479 2017-03-14
DE102017004517.8 2017-05-11
DE102017004517.8A DE102017004517A1 (de) 2017-03-14 2017-05-11 Testsockel und Kontaktierungsvorrichtung zur Kontaktierung eines Hochfrequenzsignals

Publications (1)

Publication Number Publication Date
WO2018166737A1 true WO2018166737A1 (fr) 2018-09-20

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PCT/EP2018/053753 WO2018166737A1 (fr) 2017-03-14 2018-02-15 Socle d'essai et dispositif de mise en contact électrique destiné à la mise en contact électrique d'un signal de haute fréquence

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Country Link
DE (1) DE102017004517A1 (fr)
TW (1) TW201837488A (fr)
WO (1) WO2018166737A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111786159A (zh) * 2019-04-03 2020-10-16 高天星 传导装置

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KR102626152B1 (ko) * 2021-07-01 2024-01-17 주식회사 아이에스시 전기접속용 커넥터

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WO2008120856A1 (fr) * 2007-03-29 2008-10-09 Gigalane Co.Ltd Dispositif de connexion coaxiale
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US6270357B1 (en) * 1999-05-06 2001-08-07 Wayne K. Pfaff Mounting for high frequency device packages
US20040137767A1 (en) * 2002-10-28 2004-07-15 Yamaichi Electronics Co., Ltd. IC socket for a fine pitch IC package
EP1471357A2 (fr) * 2003-04-25 2004-10-27 YOKOWO Co., Ltd Socle de circuit intégré
EP1471358A2 (fr) * 2003-04-25 2004-10-27 YOKOWO Co., Ltd Interface à sondes coaxiales
US6932618B1 (en) * 2003-05-14 2005-08-23 Xilinx, Inc. Mezzanine integrated circuit interconnect
US7173442B2 (en) 2003-08-25 2007-02-06 Delaware Capital Formation, Inc. Integrated printed circuit board and test contactor for high speed semiconductor testing
US20070269999A1 (en) * 2006-05-18 2007-11-22 Centipede Systems, Inc. Socket for an electronic device
US20080088331A1 (en) * 2006-09-12 2008-04-17 Yokowo Co., Ltd. Socket for test
WO2008120856A1 (fr) * 2007-03-29 2008-10-09 Gigalane Co.Ltd Dispositif de connexion coaxiale
DE112008003702T5 (de) * 2008-02-07 2010-11-25 Advantest Corporation Geräteabhängige Austauscheinheit und Herstellungsverfahren
US20100188112A1 (en) * 2009-01-29 2010-07-29 Yokowo Co., Ltd. Inspection socket
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Publication number Priority date Publication date Assignee Title
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DE102017004517A1 (de) 2018-09-20
TW201837488A (zh) 2018-10-16

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