WO2018161688A1 - Boîtier et son procédé de fabrication - Google Patents
Boîtier et son procédé de fabrication Download PDFInfo
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- WO2018161688A1 WO2018161688A1 PCT/CN2017/118390 CN2017118390W WO2018161688A1 WO 2018161688 A1 WO2018161688 A1 WO 2018161688A1 CN 2017118390 W CN2017118390 W CN 2017118390W WO 2018161688 A1 WO2018161688 A1 WO 2018161688A1
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- layer
- hardness
- plastic
- deposited
- shell body
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000004033 plastic Substances 0.000 claims abstract description 123
- 229920003023 plastic Polymers 0.000 claims abstract description 123
- 229910052751 metal Inorganic materials 0.000 claims abstract description 102
- 239000002184 metal Substances 0.000 claims abstract description 102
- 230000004888 barrier function Effects 0.000 claims abstract description 23
- 239000011148 porous material Substances 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 51
- 239000003973 paint Substances 0.000 claims description 16
- 238000001746 injection moulding Methods 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000004043 dyeing Methods 0.000 claims description 10
- 238000002048 anodisation reaction Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 8
- 238000001556 precipitation Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012153 distilled water Substances 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 279
- 230000008569 process Effects 0.000 description 26
- 239000000975 dye Substances 0.000 description 23
- 230000008021 deposition Effects 0.000 description 12
- 238000007740 vapor deposition Methods 0.000 description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000007743 anodising Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 5
- 150000004682 monohydrates Chemical class 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000010407 anodic oxide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/022—Anodisation on selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
Definitions
- the present disclosure relates to terminal technology, for example, to a housing and a method of fabricating the same.
- Metal casings are generally manufactured through a variety of processes such as computer numerical control (CNC) processes and surface treatment processes.
- CNC computer numerical control
- the complexity of the manufacturing process makes the product yield lower, so the metal is affected by the manufacturing process.
- the production cost of the casing is very high, so that consumers also need to pay a higher purchase cost.
- the embodiment provides a housing and a manufacturing method thereof, which solves the problem of high cost of the metal casing.
- This embodiment provides a housing, including:
- the anodized layer comprises a barrier layer and a porous layer having a porosity; the barrier layer is disposed between the metal layer and the porous layer.
- the plastic shell body includes a first surface and a second surface
- the first surface of the plastic shell body is formed with an accommodating space of the housing, the second surface is a surface opposite to the first surface, and the metal layer and the anodized layer are sequentially Deposited on the second surface.
- the method further includes:
- a hardness layer disposed between the plastic shell body and the metal layer; the hardness layer bringing the hardness of the shell to a set value.
- the method further includes: a base layer disposed between the plastic shell body and the hardness layer, the base layer being an insulating layer.
- the material of the base layer is a transparent ultraviolet light-curing paint.
- the hardness layer is made of chromium or nickel.
- a cover layer disposed on the porous layer is further included; the cover layer is configured to block precipitation of the dye.
- the metal layer is an aluminum layer; and the anodized layer is an aluminum oxide layer.
- the embodiment further provides a manufacturing method of the housing, comprising:
- the anodized layer comprises a barrier layer and a porous layer having a porosity; the barrier layer is disposed between the metal layer and the porous layer.
- the forming the plastic shell body by plastic injection molding further includes:
- a plastic case body by plastic injection molding, and embedding a conductive member in the plastic case body, wherein a part of a surface of the conductive member is exposed on a first surface and a second surface of the plastic case body; the first surface An accommodating space is formed; the second surface is a surface opposite to the first surface.
- the depositing a metal layer on the plastic shell body comprises: depositing a metal layer on the second surface; the deposited metal layer covering the second surface and the second surface is exposed Conductive component
- Forming an anodized layer on the deposited metal layer comprising:
- the conductive member exposed on the first surface is connected as an electrode to the positive electrode of the anodization circuit to anodize the plastic case body on which the metal layer is deposited, and an anodized layer is formed on the metal layer.
- the depositing a metal layer on the second surface comprises:
- the metal layer is deposited on the hardness layer.
- the depositing the hardness layer on the second surface comprises:
- a hardness layer is deposited on the base layer; a deposited hardness layer covers the base layer and the conductive member.
- the depositing the substrate layer on the second surface comprises:
- the ultraviolet light-curing paint sprayed on the surface of the conductive member is removed by a laser.
- the depositing a hardness layer comprises:
- the hardness layer is deposited by evaporation.
- the plastic shell body is formed by plastic injection molding, and the conductive member is embedded in the plastic shell body, including:
- the deposited metal layer comprises:
- the metal layer is deposited by evaporation.
- the method further includes:
- the plastic shell body after the anodized layer is formed is placed in a dyeing bath for dyeing, and after the dye is adsorbed through the porous layer, it is filled in the pores of the porous layer.
- the method further includes:
- the forming the cover layer comprises:
- the dyed plastic shell body is placed in distilled water to form the cover layer;
- the cover layer is deposited on the dyed plastic shell body by spraying.
- the casing and the manufacturing method thereof provided by the embodiment have the advantages of simple process, high process efficiency and low cost, and the formed casing has the texture of the metal casing, and the whole surface of the casing is uniform, which can meet the user's use requirements and is improved. user experience.
- FIG. 2 is a schematic flow chart of a method for manufacturing a second embodiment of the present embodiment
- Figure 5 is a schematic structural view of the housing after the completion of step 203 in the second embodiment
- Figure 6 is a schematic structural view of the housing after the completion of step 204 in the second embodiment
- FIG. 7 is a schematic structural view of an anodizing device in step 205 of the second embodiment
- step 205 is completed in the second embodiment
- Figure 9 is a schematic view showing the microstructure of the aluminum oxide film of the second embodiment.
- FIG. 10 is a schematic view showing the process of the action of the dye molecules and the porous layer in the step 206 of the second embodiment
- Figure 11 is a schematic view showing the microstructure of the housing portion after the completion of step 207 in the second embodiment
- FIG. 12 is a schematic structural view of the housing after the completion of step 207 in the second embodiment.
- the metal casing of the related art generally needs to be manufactured through various processes such as a CNC process and a surface treatment process, and is very complicated to manufacture, so even with the most strict control method, the process yield is still low, resulting in The price of metal casings remains high, and consumers pay extra for this.
- the material of the metal casing is mainly an aluminum alloy material, and after a complicated CNC machining process, the surface of the metal casing of the aluminum alloy material is anodized, and the final metal casing is obtained.
- the processing is complicated, the yield is low, the cost is high, and the antenna performance often fails to meet the design specifications.
- the plastic injection molded housing is the most economical housing, but the plastic housing has a very low profile and is difficult to attract consumers.
- the plastic shell body is formed by plastic injection molding, and the conductive shell is embedded with the conductive member, and the conductive member is exposed on the first surface and the second surface of the plastic shell body. a portion of the surface; the first surface is formed with an accommodating space; the second surface is a surface exposed by the accommodating space for accommodating the electronic device; a metal layer is deposited on the second surface; and the deposited metal layer Covering the second surface and the metal member; connecting the conductive member exposed on the first surface as an electrode to the anode of the anodizing circuit to anodize the plastic shell body on which the metal layer is deposited, on the metal layer Forming an anodized layer; wherein the anodized layer comprises a barrier layer and a porous layer having a porosity; the barrier layer is disposed between the metal layer and the porous layer.
- This embodiment provides a manufacturing method of a housing. As shown in FIG. 1 , the method includes: Step 110 to Step 130.
- a plastic shell body is formed by plastic injection molding.
- a conductive member is embedded in the plastic shell body, and a portion of the surface of the conductive member is exposed on the first surface and the second surface of the plastic shell body.
- the first surface is formed with an accommodating space; the second surface is a surface exposed by the accommodating space accommodating device (such as an electronic device), that is, a surface opposite to the first surface.
- the accommodating space accommodating device such as an electronic device
- the conductive member is placed in a mold
- the mold infused with the flowing plastic is plasticized.
- the conductive member functions to form an electrical path together with the cathode electrode and the power source to deposit an anodized layer when the anode layer is subsequently deposited as an anode electrode.
- the shape of the conductive member may be a column shape and the number of the conductive members may be at least one for convenience of application, such as convenience and electrical conductivity for connection with the positive electrode of the power source.
- the conductive member may be a metal material having good conductivity, such as copper or the like.
- the material of the plastic forming the plastic shell body may be an acrylonitrile-butadiene-styrene copolymer (ABS), polycarbonate (PC) or the like which does not have a self-lubricating plastic.
- ABS acrylonitrile-butadiene-styrene copolymer
- PC polycarbonate
- the self-lubricating effect means that the solid plastic itself has a lubricating effect.
- a plastic that does not have a self-lubricating function refers to a plastic that does not have a lubricating effect by itself.
- step 120 a metal layer is deposited on the second surface.
- a deposited metal layer covers the second surface and the metal features.
- the hardness of the plastic is inferior to the hardness of the metal, so in order to make the manufactured casing have some texture of the metal casing, it is necessary to modify the plastic casing body so that the plastic casing body has a certain hardness.
- the method before the depositing the metal layer on the second surface, the method may further include:
- the hardness layer causes the hardness of the casing to reach a set value.
- the metal layer is deposited on the hardness layer.
- the hardness value of the casing can be determined as needed, and then the hardness layer of the corresponding thickness is deposited according to the set hardness value.
- the surface of the plastic shell body formed by plastic injection molding is not flat under the microscopic (cannot be seen by the naked eye).
- the method may further include:
- a hardness layer is deposited on the base layer; a deposited hardness layer covers the base layer and the conductive member.
- the deposited substrate layer is in complete contact with the second surface and the hardness layer, and the hardness layer is planarized.
- depositing the base layer on the second surface comprises:
- the substrate layer is deposited on the second surface by spraying.
- the base layer is an insulating layer.
- Depositing the substrate layer on the second surface by spraying comprising:
- the ultraviolet light-curable paint sprayed on the surface of the conductive member is removed by a laser.
- the deposited base layer provides sufficient adhesion for subsequent deposition of the hardness layer, providing a good basis for the flatness of the hardness layer, so that the manufactured shell has better flatness.
- the purpose of removing the ultraviolet light-curing paint sprayed on the surface of the conductive member by means of a laser is to bring the conductive member into contact with the hardness layer in preparation for depositing the anodized layer.
- the hardness layer is formed by depositing a metal, so the hardness layer can be deposited by evaporation.
- a target material for depositing a hardness layer is placed in the vapor deposition machine, and the plastic shell body on which the pre-deposition is completed is placed at a set position of the vapor deposition machine, and then the deposition speed and deposition time are set, and the current is set. Thereafter, the vapor deposition machine heats the target under vacuum to cause the target to evaporate or sublime under vacuum conditions, and the evaporated or sublimated metal precipitates on the second surface or the substrate layer to form a hardness layer.
- the material used to deposit the hardness layer may be chromium or nickel. Accordingly, the target is chromium or nickel.
- the metal layer can also be deposited by evaporation.
- the process of depositing the metal layer by vapor deposition is similar. First, the deposition thickness of the metal layer is set, then the target (aluminum) is placed in the vapor deposition machine, and the plastic shell body on which the pre-deposition is completed is placed on the vapor deposition machine. The set position is set according to the deposition thickness and the deposition time. After the power is applied, the vapor deposition machine will deposit a metal layer on the hardness layer.
- the deposition principle is similar to the process and principle of depositing the hardness layer, and will not be described here.
- step 130 an anodized layer is deposited on the metal layer.
- the anodized layer comprises a barrier layer and a porous layer having a porosity; the barrier layer is disposed between the metal layer and the porous layer.
- the metal layer is an aluminum layer.
- An anodized layer is deposited on the metal layer by anodization.
- the conductive member exposed on the first surface is connected as an electrode to the anode of the anodization circuit to anodize the plastic shell body on which the metal layer is deposited, and an anodized layer is formed on the metal layer.
- the conductive member exposed on the first surface is connected to the positive electrode of the circuit (which is a power source after being turned on), and a metal electrode (such as a lead plate) is connected to the negative electrode of the circuit, and then Then put it into the oxidation tank and turn on the circuit to perform the anodization process.
- the positive electrode of the circuit which is a power source after being turned on
- a metal electrode such as a lead plate
- the oxidation pool generally contains a preset mass percentage concentration, for example, about 20% sulfuric acid solution.
- the basic principle of the anodizing method is: in the anodizing process, under the action of current, the O 2 ions generated by the electrolysis will move to the positive electrode of the power source, and at the same time, the aluminum on the surface of the aluminum layer will chemically react with the sulfuric acid, thereby Al 3+ ions are generated on the surface of the aluminum layer, and O 2 ions are combined with Al 3+ ions to form aluminum oxide, and the generated alumina is dissolved by sulfuric acid to regain Al 3+ ions, which progresses with time. The dissolution and formation of alumina reaches a dynamic equilibrium, which ultimately forms an aluminum oxide layer.
- the deposited aluminum oxide layer comprises a barrier layer and a porous layer; the barrier layer is disposed between the metal layer and the porous layer.
- the plastic shell body after depositing the anodized layer can be placed in the dyeing tank for dyeing, so that the dye molecules are porous. After the layer is adsorbed, it is filled in the pores of the porous layer.
- the dye is generally an aromatic sodium sulfonate, such as a water-soluble azo dye.
- the pores of the porous layer of the anodized layer are filled with a dye for bringing the shell to a set color.
- a cover layer may be formed on the plastic shell body filled with the dye; the cover layer is used to block the dye deposition.
- the cover layer may be formed chemically, or the cover layer may be formed by physical means.
- the process of chemically forming the cap layer comprises:
- the dyed plastic shell body (the plastic shell body filled with the dye) is placed in distilled water, and the alumina of the surface layer of the porous layer is chemically reacted with water molecules to form alumina monohydrate, since the density of alumina monohydrate is less than oxidation.
- the density of aluminum covers the pores of the porous layer to form the cover layer. That is to say, the cover layer is disposed on the porous layer, and the cover layer can block the precipitation of the dye, that is, the cover layer serves to block the precipitation of the dye.
- the process of physically forming the overlay layer includes:
- the cover layer is deposited on the plastic shell body after dyeing by spraying.
- the specific process of depositing the cover layer by spraying is similar to the process of depositing the base layer.
- a transparent ultraviolet light-curing paint may be sprayed on the plastic casing, and the paint is cured after ultraviolet irradiation to form the cover layer.
- the embodiment further provides a housing, the housing comprising:
- the anodized layer includes a barrier layer and a porous layer having a porosity; the barrier layer is disposed between the metal layer and the porous layer.
- a hardness layer is further disposed between the plastic shell body and the metal layer; the hardness layer causes the hardness of the shell to reach a set value, so that the shell has a certain The hardness thus has some texture of the metal casing.
- a base layer may be disposed between the plastic shell body and the hardness layer, the base layer is an insulating layer, and the base layer is in complete contact with the plastic shell body and the hardness layer. And flattening the hardness layer.
- the material of the base layer is a transparent ultraviolet light curing paint.
- the pores of the porous layer of the anodized layer are filled with a dye for rendering the housing present.
- the color is fixed.
- the porous layer is further provided with a cover layer for blocking the precipitation of the dye.
- the second surface of the plastic shell body may be sequentially deposited with the above-mentioned layers; the first surface of the plastic shell body is formed with the housing space; the second surface is The surface that is exposed after the electronic device is accommodated in the space.
- the embodiment provides a method for forming a plastic shell body by plastic injection molding, and a conductive member is embedded in the plastic shell, and a part of the surface of the conductive member is exposed on the first surface and the second surface of the plastic shell body;
- the first surface is formed with an accommodating space;
- the second surface is a surface exposed by the accommodating space for accommodating the electronic device;
- a metal layer is deposited on the second surface; and the deposited metal layer covers the first surface a surface and a metal member;
- the conductive member exposed on the first surface is connected as an electrode to the anode of the anodizing circuit to anodize the plastic shell body on which the metal layer is deposited, and an anodized layer is formed on the metal layer
- the anodized layer includes a barrier layer and a porous layer having a porous layer; the barrier layer is disposed between the metal layer and the porous layer.
- the solution provided by the embodiment is simple in process, high in process efficiency, and low in cost.
- a metal layer and an anodized layer are sequentially deposited on the plastic shell body; the anodized layer includes a barrier layer
- the porous layer has a porous layer; the barrier layer is disposed between the metal layer and the porous layer, and the formed shell has the texture of the metal shell, and the whole surface of the shell is uniform, which can meet the user's use requirements and enhance the user experience. .
- a base layer is deposited on the second surface; the deposited base layer does not cover the surface of the conductive member; accordingly, a hardness layer is deposited on the base layer; a deposited hardness layer covers the base layer and the a conductive member, in the formed casing, a base layer may be further disposed between the plastic shell body and the hardness layer, the base layer is in complete contact with the plastic shell body and the hardness layer, and the The hardness layer is flat, and the base layer can provide sufficient adhesion for the deposition of the subsequent hardness layer, which provides a good foundation for the flatness of the deposited hardness layer, so that the manufactured casing has a flat appearance and improves the user experience.
- the present embodiment details the manufacturing process of the housing and the structure of the housing.
- the manufacturing process of the housing includes: Step 201 to Step 207.
- the plastic shell body is formed by plastic injection molding
- the plastic shell body 11 is injection molded from plastic.
- two conductive members 12 are placed in the mold. After the injection molding, the two conductive members 12 are embedded in the plastic shell body 11, as shown in FIG. 3, and are exposed on the upper and lower surfaces of the plastic shell body 11. Come out to provide electrodes for subsequent anodization.
- step 202 a base layer is deposited on the plastic shell body
- a transparent and insulating ultraviolet light-curing paint is sprayed on the surface of the plastic case body 11 (the surface of the housing in which the housing space is exposed), and the base layer 21 is formed.
- the formation provides sufficient adhesion and a good appearance for the subsequent vapor deposited metal film layer (or hardness layer).
- the paint deposited on the two conductive members 12 is laser-destroyed (i.e., removed by laser) to expose the conductive member 12, as shown in Fig. 4, so that subsequent anodization can proceed smoothly.
- step 203 a hardness layer is deposited on the base layer
- the plastic shell body 11 after the completion of the step 2 is placed in a vapor deposition machine, and a target (such as nickel or chromium) for depositing a hardness layer is attached to the vapor deposition machine, and the corresponding parameters are set, and then steamed. After the plating machine is energized, a layer of nickel or chromium is automatically deposited on the base layer 21 to form a hardness layer 31, as shown in FIG.
- a target such as nickel or chromium
- step 204 depositing a metal layer on the hardness layer
- the plastic shell body 11 after the completion of step 203 is placed in a vapor deposition machine, and a target (aluminum) for depositing a metal layer is attached to the vapor deposition machine. After the corresponding parameters are set, the vapor deposition machine is energized. Thereafter, a layer of aluminum is automatically deposited on the base layer 21 to form the metal layer 41 as shown in FIG.
- the metal layer 41 lays a material foundation for the subsequent anodization, which lays a material foundation for forming an anodized layer.
- step 205 an anodized layer is deposited on the metal layer
- the plastic case body 11 (referred to as part 51) after the completion of step 204 is connected to the positive electrode of the circuit 55 (the conductive member 12 is connected to the positive electrode of the circuit 55), at the circuit 55.
- the negative electrode is connected to the lead plate 52, and then placed in the oxidation tank 54.
- the oxidation tank contains a sulfuric acid solution 53 having a mass percentage concentration of a predetermined value, for example, about 20%. At normal temperature, the anodic oxidation reaction process is performed after the direct current is passed.
- the conductive member 12 is electrically connected to the metal layer 41 through the hardness layer 31.
- a porous alumina film having a thickness of about 20 ⁇ m is formed on the surface of the metal layer 41, thereby forming an anodized layer 61.
- the microstructure of the aluminum oxide film includes a barrier layer 62 and a porous layer 63.
- step 206 filling the dye
- the plastic shell body 11 after the completion of step 205 is placed in a dyeing tank for dyeing, and the dye molecules 71 are adsorbed by the porous layer 63 and filled in the pores of the porous layer 63, as shown in FIG.
- the dye can make the surface of the shell appear in a variety of colors.
- step 207 a cover layer is formed.
- the plastic shell body 11 after the completion of step 206 is placed in distilled water, and the temperature of the distilled water may be 80 ° C or higher, and the surface layer alumina and water are combined to form alumina monohydrate (Al 2 O 3 ). H 2 O), thereby forming a cover layer 81, as shown in FIG. 11, the cover layer 81 functions as a sealing hole.
- the temperature of the distilled water may be 80 ° C or higher, and the surface layer alumina and water are combined to form alumina monohydrate (Al 2 O 3 ). H 2 O), thereby forming a cover layer 81, as shown in FIG. 11, the cover layer 81 functions as a sealing hole.
- the density of the alumina monohydrate is smaller than the density of the alumina, the volume of the alumina monohydrate is large, thereby blocking the pores of the porous layer 63, so that the dye in the pores does not precipitate discoloration, and the porous layer 63 is allowed. Loss of the ability to adsorb other substances.
- a housing as shown in FIG. 12 is formed.
- the plastic shell body 11 is embedded with the conductive member 12, and the base layer 21 and the hardness layer are sequentially disposed on the surface of the plastic shell body 11. 31.
- the present embodiment performs a series of treatments on the surface of the plastic shell body, and the obtained surface treatment structure includes: a base layer, a hardness layer, a metal layer, and an anodized layer which are sequentially disposed on the surface of the plastic shell body. .
- the surface treatment method has the advantages of simple process, high process efficiency and low cost. Moreover, the obtained plastic casing surface treatment structure has an overall uniform appearance effect, and the color is bright and the texture is strong (after the completion of steps 205 to 206, the texture of the metal casing is obtained).
- the casing and the manufacturing method thereof provided by the embodiment have the advantages of simple process, high process efficiency and low cost, and the formed casing has the texture of the metal casing, and the surface of the casing is uniform overall, which can meet the user's use requirements and is improved. The user experience.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
L'invention concerne un boîtier, comprenant : un corps principal de boîtier en plastique, et une couche métallique et une couche d'oxydation d'anode déposées de manière séquentielle sur le corps principal de boîtier en plastique. La couche d'oxydation d'anode comprend une couche barrière et une couche poreuse ayant de multiples pores. La couche barrière est disposée entre la couche métallique et la couche poreuse.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201710129433.0A CN108541152A (zh) | 2017-03-06 | 2017-03-06 | 一种壳体及其制造方法 |
CN201710129433.0 | 2017-03-06 |
Publications (1)
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WO2018161688A1 true WO2018161688A1 (fr) | 2018-09-13 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/CN2017/118390 WO2018161688A1 (fr) | 2017-03-06 | 2017-12-25 | Boîtier et son procédé de fabrication |
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CN (1) | CN108541152A (fr) |
WO (1) | WO2018161688A1 (fr) |
Families Citing this family (2)
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CN113423213B (zh) * | 2021-06-08 | 2022-11-29 | Oppo广东移动通信有限公司 | 壳体组件、其制备方法及电子设备 |
CN113602035B (zh) * | 2021-07-29 | 2022-08-09 | Oppo广东移动通信有限公司 | 陶瓷装饰膜及其制备方法、壳体组件和电子设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1419404A (zh) * | 2001-11-13 | 2003-05-21 | 鸿富锦精密工业(深圳)有限公司 | 电子装置外壳 |
US6623614B2 (en) * | 2001-11-07 | 2003-09-23 | Hon Hai Precision Ind. Co., Ltd. | Cover structure for electronic device and method of manufacturing same |
CN105101688A (zh) * | 2015-07-08 | 2015-11-25 | 广东欧珀移动通信有限公司 | 一种壳体的制作方法及利用该方法制作的壳体、移动终端 |
CN205829765U (zh) * | 2016-07-11 | 2016-12-21 | 石狮市星火铝制品有限公司 | 一种抗菌手机壳 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6768654B2 (en) * | 2000-09-18 | 2004-07-27 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
CN102111969A (zh) * | 2009-12-25 | 2011-06-29 | 深圳富泰宏精密工业有限公司 | 电子装置壳体 |
CN102950838A (zh) * | 2011-08-19 | 2013-03-06 | 深圳富泰宏精密工业有限公司 | 壳体及其制备方法 |
-
2017
- 2017-03-06 CN CN201710129433.0A patent/CN108541152A/zh not_active Withdrawn
- 2017-12-25 WO PCT/CN2017/118390 patent/WO2018161688A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6623614B2 (en) * | 2001-11-07 | 2003-09-23 | Hon Hai Precision Ind. Co., Ltd. | Cover structure for electronic device and method of manufacturing same |
CN1419404A (zh) * | 2001-11-13 | 2003-05-21 | 鸿富锦精密工业(深圳)有限公司 | 电子装置外壳 |
CN105101688A (zh) * | 2015-07-08 | 2015-11-25 | 广东欧珀移动通信有限公司 | 一种壳体的制作方法及利用该方法制作的壳体、移动终端 |
CN205829765U (zh) * | 2016-07-11 | 2016-12-21 | 石狮市星火铝制品有限公司 | 一种抗菌手机壳 |
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