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WO2018155639A1 - Composition de résine, produit durci, produit durci à motif, procédé de production de produit durci, film isolant intercouche, film de protection de surface et composant électronique - Google Patents

Composition de résine, produit durci, produit durci à motif, procédé de production de produit durci, film isolant intercouche, film de protection de surface et composant électronique Download PDF

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Publication number
WO2018155639A1
WO2018155639A1 PCT/JP2018/006741 JP2018006741W WO2018155639A1 WO 2018155639 A1 WO2018155639 A1 WO 2018155639A1 JP 2018006741 W JP2018006741 W JP 2018006741W WO 2018155639 A1 WO2018155639 A1 WO 2018155639A1
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group
carbon atoms
integer
independently
resin composition
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PCT/JP2018/006741
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English (en)
Japanese (ja)
Inventor
伸行 斉藤
由香里 鯉渕
生田目　豊
Original Assignee
日立化成デュポンマイクロシステムズ株式会社
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Priority to CN201880011925.2A priority Critical patent/CN110300767B/zh
Priority to KR1020197022434A priority patent/KR102511567B1/ko
Priority to JP2019501840A priority patent/JP7180588B2/ja
Publication of WO2018155639A1 publication Critical patent/WO2018155639A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C08F283/045—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides on to unsaturated polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Definitions

  • the present invention relates to a resin composition, a cured product, a pattern cured product, a method for producing a cured product, an interlayer insulating film, a surface protective film, and an electronic component.
  • a protective film (cured product) using such a polyimide is obtained by heating and curing a resin film formed by applying and drying a polyimide precursor or a resin composition containing a polyimide precursor on a substrate. can get.
  • this heat-curing temperature there is an increasing demand for low-temperature curing.
  • the polyimide precursor is heat-cured at a high temperature of about 370 ° C.
  • heat curing at 300 ° C. or lower is required. ing.
  • An object of the present invention is to provide a resin composition, a cured product, a pattern cured product, a method for producing a cured product, an interlayer insulating film, a surface protective film, and an electronic component that can form a cured product having excellent adhesion and chemical resistance. It is.
  • the present inventors have found that in low-temperature curing, the components remaining in the cured product lower the adhesiveness and chemical resistance. Furthermore, as a result of intensive studies, the present inventors have found that, when tetraethylene glycol dimethacrylate is used, a crosslinked structure that exhibits good adhesiveness is formed, but adversely affects chemical resistance. Further studies were made from the viewpoint of the number of cross-linking points and the molecular length of the cross-linking agent, and the present invention was achieved.
  • the following resin composition and the like are provided.
  • the plurality of R 101 and R 102 may be the same or different.
  • R 111 and R 113 to R 115 are each independently a hydrogen atom, acryloyl group or methacryloyl group, and L 1 is each independently a single bond, an alkylene group having 1 to 10 carbon atoms, or —R 116 - (oR 117) n1 - a group
  • R 112 is .A an alkyl group having 1 to 10 carbon atoms, a heterocyclic ring substituted or unsubstituted ring atoms 3 ⁇ 20 .m is R is an integer of 2 to 6.
  • R 116 is a single bond or an alkylene group having 1 to 10 carbon atoms
  • R 117 is an alkylene group having 1 to 10 carbon atoms
  • n1 is an integer of 1 to 15 .
  • at least two by R 111 is an acryloyl group or a methacryloyl group
  • at least two R 113 is an acryloyl group or a methacryloyl group
  • at least two R 114 is acryloyl A group or a methacryloyl group
  • at least two R 115 is an acryloyl group or a methacryloyl group.
  • the plurality of R 111 , R 113 to R 115 and L 1 may be the same or different.
  • R 116 and R 117 have multiple plurality of R 116 and R 117 may be the same or different.
  • 2. The resin composition according to 1, wherein the (a) polyimide or polyimide precursor is a polyimide precursor.
  • R 1 is a tetravalent organic group
  • R 2 is a divalent organic group
  • R 3 and R 4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, 3 to 20 cycloalkyl groups or monovalent organic groups having a carbon-carbon unsaturated double bond.
  • X 1 and X 2 are each independently a divalent group that is not conjugated to the benzene ring to which they are bonded.
  • R 3 and R 4 are each independently a hydrogen atom or an alkyl having 1 to 20 carbon atoms. Group, a cycloalkyl group having 3 to 20 carbon atoms, or a monovalent organic group having a carbon-carbon unsaturated double bond, wherein each R is independently an alkyl group having 1 to 10 carbon atoms, or 1 carbon atom.
  • the component (b) is (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22), and (b2) the following formula (
  • R 11 is an alkyl group having 1 to 12 carbon atoms
  • a1 is an integer of 0 to 5.
  • R 12 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms.
  • R 13 and R 14 Each independently represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a phenyl group or a tolyl group, and when a1 is an integer of 2 or more, R 11 may be the same or different.
  • R 15 is —OH, —COOH, —O (CH 2 ) OH, —O (CH 2 ) 2 OH, —COO (CH 2 ) OH or —COO (CH 2 ) 2 OH
  • R 16 and R 17 are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, a phenyl group, or a tolyl group
  • b1 is an integer of 0 to 5.
  • R 15 may be the same or different.
  • R 21 is an alkyl group having 1 to 12 carbon atoms
  • R 22 and R 23 are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, carbon A cycloalkyl group, a phenyl group or a tolyl group of 4 to 10, and c1 is an integer of 0 to 5.
  • c1 is an integer of 2 or more, R 21 s may be the same or different.
  • R 24 and R 25 are each independently an alkyl group having 1 to 12 carbon atoms
  • d and e are each independently an integer of 0 to 5
  • s and t are each independently 0
  • the sum of s and t is 3.
  • R 24 When d is an integer of 2 or more, R 24 may be the same or different, and when e is an integer of 2 or more, R 24 25 may be the same or different, and when s is an integer of 2 or more, the groups in parentheses may be the same or different, and when t is an integer of 2 or more, Each group may be the same or different.) 10.
  • cured material of 12 whose temperature of the said heat processing is 250 degrees C or less.
  • An electronic component comprising the interlayer insulating film or surface protective film according to 16.15.
  • a resin composition a cured product, a patterned cured product, a method for producing a cured product, an interlayer insulating film, a surface protective film, and an electronic component that can form a cured product having excellent adhesion and chemical resistance.
  • FIG. 1 is a schematic cross-sectional view of a semiconductor device having an interlayer insulating film and a surface protective film according to an embodiment of the present invention.
  • a or B may include either one of A and B, or may include both.
  • the term “process” is not limited to an independent process, and even if it cannot be clearly distinguished from other processes, the term “process” is used as long as the intended action of the process is achieved. included.
  • the numerical range indicated by using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the content of each component in the composition is the sum of the plurality of substances present in the composition unless there is a specific indication when there are a plurality of substances corresponding to each component in the composition. Means quantity.
  • the exemplary materials may be used singly or in combination of two or more unless otherwise specified.
  • (meth) acrylate means “acrylate” and “methacrylate” corresponding thereto.
  • (meth) acryloyl group means “acryloyl group” and “methacryloyl group”.
  • the resin composition of the present invention comprises (a) a polyimide or a polyimide precursor (hereinafter also referred to as “component (a)”, preferably a polyimide precursor), and (d1) the following formula (11) or (12 ) (Hereinafter also referred to as “component (d1)”), (d2) a compound represented by the following formula (13), a compound represented by the following formula (14), and the following formula (15) ) And one or more compounds selected from the group consisting of compounds represented by the following formula (16) (hereinafter also referred to as “component (d2)”).
  • R 101 is independently a hydrogen atom or a methyl group
  • R 102 is an alkylene group having 1 to 4 carbon atoms
  • R 104 is an alkylene group having 3 to 8 carbon atoms
  • n is 2 (It is an integer of ⁇ 5.
  • the plurality of R 101 and R 102 may be the same or different.
  • R 111 and R 113 to R 115 are each independently a hydrogen atom, acryloyl group or methacryloyl group, and L 1 is each independently a single bond, an alkylene group having 1 to 10 carbon atoms, or —R 116 - (oR 117) n1 - a group, R 112 is .A an alkyl group having 1 to 10 carbon atoms, a heterocyclic ring substituted or unsubstituted ring atoms 3 ⁇ 20 .m is R is an integer of 2 to 6.
  • R 116 is a single bond or an alkylene group having 1 to 10 carbon atoms
  • R 117 is an alkylene group having 1 to 10 carbon atoms
  • n1 is an integer of 1 to 15 .
  • at least two by R 111 is an acryloyl group or a methacryloyl group
  • at least two R 113 is an acryloyl group or a methacryloyl group
  • at least two R 114 is acryloyl A group or a methacryloyl group
  • at least two R 115 is an acryloyl group or a methacryloyl group.
  • the plurality of R 111 , R 113 to R 115 and L 1 may be the same or different. If R 116 and R 117 have multiple plurality of R 116 and R 117 may be the same or different. )
  • the polyimide precursor preferably has a structural unit represented by the following formula (1).
  • R 1 is a tetravalent organic group
  • R 2 is a divalent organic group.
  • R 3 and R 4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, 3 to 20 cycloalkyl groups or monovalent organic groups having a carbon-carbon unsaturated double bond.
  • the polyimide precursor can be synthesized using a tetracarboxylic acid or a dianhydride thereof and a diamine compound.
  • R 1 is preferably a residue of tetracarboxylic acid or a dianhydride thereof.
  • R 2 is preferably a residue of a diamine compound.
  • the tetravalent organic group of R 1 in the formula (1) is preferably a tetravalent organic group represented by the following formulas (2a) to (2e).
  • X and Y each independently represent a divalent group or a single bond that is not conjugated to the benzene ring to which each is bonded.
  • Z represents an ether bond (—O—) or (It is a sulfide bond (-S-).)
  • tetracarboxylic acid or dianhydride thereof examples include pyromellitic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, or 3,3 ′, 4,4′-biphenyltetracarboxylic acid dianhydride. Anhydrides are mentioned.
  • 6-Naphthalenetetracarboxylic dianhydride is 2,3,5,6-pyridinetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 3,4,9, 10-perylenetetracarboxylic dianhydride, m-terphenyl-3,3 ′, 4,4′-tetracarboxylic dianhydride, p-terphenyl-3,3 ′, 4,4′-tetracarboxylic acid Dianhydride, 1,1,1,3,3,3-hexafluoro-2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 1,1,1,3,3,3- Hexafluoro-2,2-bis (3,4-dica Boxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis ⁇ 4-
  • Tetracarboxylic acid or its dianhydride may be used alone or in combination of two or more.
  • the “divalent group that is not conjugated with the benzene ring to be bonded” of X and Y in the formula (2d) is, for example, —O—, —S—, or a divalent group represented by the following formula.
  • R 5 represents a carbon atom or a silicon atom.
  • R 6 each independently represents a hydrogen atom or a halogen atom (for example, a fluorine atom).
  • diamine compound containing R 2 examples include 2,2′-bis (trifluoromethyl) -4,4′-diaminobiphenyl, 2,2′-bis (fluoro) -4,4′-diaminobiphenyl, 2,2 '-Bis (trifluoromethyl) benzidine, 2,2'-dimethylbenzidine, p-phenylenediamine, m-phenylenediamine, p-xylylenediamine, m-xylylenediamine, 1,5-diaminonaphthalene, benzidine, 4 , 4'- (or 3, 4'-, 3, 3'-, 2, 4'-, 2, 2'-) diaminodiphenyl ether, 4, 4'- (or 3, 4'-, 3, 3 ' -, 2,4'-, 2,2 '-) diaminodiphenyl sulfone, 4,4'- (or 3,4'-, 3,3'-, 2,4'-, 2,2'-
  • R 3 and R 4 in the formula (1) are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms (preferably 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms), A cycloalkyl group having 20 (preferably 5 to 15 carbon atoms, more preferably 6 to 12 carbon atoms), or a monovalent organic group having a carbon-carbon unsaturated double bond.
  • Examples of the alkyl group having 1 to 20 carbon atoms include a methyl group, an ethyl group, an n-propyl group, a 2-propyl group, and an n-butyl group.
  • Examples of the cycloalkyl group having 3 to 20 carbon atoms include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and an adamantyl group.
  • Examples of the monovalent organic group having a carbon-carbon unsaturated double bond include an organic group having a (meth) acryloyl group. Specific examples include (meth) acryloxyalkyl groups having 1 to 10 carbon atoms in the alkyl group.
  • Examples of the (meth) acryloxyalkyl group having 1 to 10 carbon atoms in the alkyl group include (meth) acryloxyethyl group, (meth) acryloxypropyl group, (meth) acryloxybutyl group and the like.
  • R 3 and R 4 are monovalent organic groups having a carbon-carbon unsaturated double bond, it is combined with a compound that generates radicals upon irradiation with actinic rays, so This is preferable because crosslinking is possible.
  • the polyimide precursor may be a polyimide precursor containing structural units represented by the following formulas (1A) to (1C).
  • the structural unit represented by Formula (1A) is combined with the structural unit represented by Formula (1B) or the structural unit represented by Formula (1C).
  • X 1 and X 2 are each independently a divalent group that is not conjugated to the benzene ring to which they are bonded.
  • R 3 and R 4 are each independently a hydrogen atom or an alkyl having 1 to 20 carbon atoms. Group, a cycloalkyl group having 3 to 20 carbon atoms, or a monovalent organic group having a carbon-carbon unsaturated double bond, wherein each R independently has 1 to 10 carbon atoms (preferably 1 to 3 carbon atoms).
  • An alkyl group for example, a methyl group, an ethyl group, a propyl group, etc.
  • a halogenated alkyl group for example, a trifluoromethyl group having 1 to 10 carbon atoms (preferably 1 to 3).
  • Each is an integer of 0 to 3 (preferably 0 or 1), and each b is independently an integer of 0 to 4 (preferably 0 or 1)
  • R is plural, the plural Rs may be the same , May be different.
  • the divalent group that is not conjugated to the benzene ring to which each of X 1 and X 2 is bonded is the same as the “divalent group that is not conjugated to the bonded benzene ring” of X and Y in formula (2d). -O- is preferred.
  • R 3 and R 4 in the formula (1A) is the same as R 3 and R 4 in the formula (1).
  • the tetracarboxylic acid corresponding to the structural unit represented by the formula (1A) or the dianhydride thereof corresponds to the structural unit represented by the formula (1A) among the tetracarboxylic acids or the dianhydrides described above. Examples thereof include tetracarboxylic acid or a dianhydride thereof.
  • Examples of the diamine compound corresponding to the structural unit represented by Formula (1B) include the diamine compound corresponding to the structural unit represented by Formula (1B) among the diamine compounds described above.
  • the diamine compound etc. corresponding to the structural unit represented by Formula (1C) are mentioned among the diamine compounds mentioned above. These may be used alone or in combination of two or more.
  • the molecular weight of the polyimide precursor is preferably 10,000 to 100,000, more preferably 15,000 to 100,000, and more preferably 20,000 to 85,000 in terms of polystyrene. More preferably it is.
  • the weight average molecular weight is 10,000 or more, the stress after curing tends to be sufficiently reduced.
  • the weight average molecular weight can be measured by a gel permeation chromatography method and can be determined by conversion using a standard polystyrene calibration curve.
  • polyimide examples include a resin in which the above polyimide precursor is closed.
  • a polyimide precursor and polyimide may be used in combination.
  • the component (d1) is a compound represented by the following formula (11) or (12) (preferably a compound represented by formula (11)).
  • R 101 is independently a hydrogen atom or a methyl group
  • R 102 is an alkylene group having 1 to 4 carbon atoms (preferably an ethylene group)
  • R 104 is an alkylene group having 3 to 8 carbon atoms.
  • group preferably, n- butylene, cyclohexylene group n-
  • n represents an integer of 2 to 9 (preferably an integer of 2 to 5, more preferably 3 or 4).
  • multiple R 101 and R 102 may be the same or different.
  • component (d1) specifically, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, 1,4-butanediol di Examples include acrylate, 1,6-hexanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, and the like.
  • a component may be used individually by 1 type and may combine 2 or more types.
  • Component (d1) is preferably blended in an amount of 5 to 50 parts by weight, more preferably 10 to 35 parts by weight per 100 parts by weight of component (a). Good adhesiveness can be expressed by being in the said range.
  • the component (d2) is a compound represented by the following formula (13), a compound represented by the following formula (14), a compound represented by the following formula (15), and a compound represented by the following formula (16).
  • One or more compounds selected from the group consisting of preferably a compound represented by the formula (13)).
  • R 111 and R 113 ⁇ R 115 are each independently a hydrogen atom, an acryloyl group or a methacryloyl group
  • L 1 are each independently a single bond, an alkylene group (preferably having 1 to 10 carbon atoms, A methylene group, an ethylene group), or a —R 116 — (OR 117 ) n1 — group
  • R 112 is an alkyl group having 1 to 10 carbon atoms (preferably a methyl group or an ethyl group).
  • R 114 is an acryloyl group or a methacryloyl group
  • R 115 is an acryloyl group or a methacryloyl group.
  • the plurality of R 111 , R 113 to R 115 and L 1 may be the same or different. If R 116 and R 117 have multiple plurality of R 116 and R 117 may be the same or different. )
  • R 111 is preferably an acryloyl group.
  • R 113 is preferably an acryloyl group.
  • R 114 is preferably an acryloyl group.
  • R 115 is preferably a hydrogen atom or an acryloyl group.
  • heterocyclic ring having 3 to 20 ring atoms of A examples include an isocyanuric acid ring and a triazine ring. An isocyanuric acid ring and a triazine ring are preferable.
  • substituent for the heterocyclic ring having 3 to 20 ring atoms include the same substituents as described below.
  • the total of the plurality of n1 is preferably 25 to 40, and more preferably 30 to 40.
  • component (d2) specifically, trimethylolpropane diacrylate, trimethylolpropane triacrylate, trimethylolpropane dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, Pentaerythritol tetramethacrylate, Tetramethylolmethane tetraacrylate, tetramethylolmethane tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated isocyanuric acid triacrylate, ethoxylated isocyanuric acid trimethacrylate, acryloyloxyethyl isocyanuri
  • a component may be used individually by 1 type and may combine 2 or more types.
  • the amount of component (d2) is preferably 5 to 25 parts by mass, more preferably 10 to 20 parts by mass, relative to 100 parts by mass of component (a). By being in the said range, the chemical
  • the resin composition of the present invention preferably further contains (b) a photosensitizer. Thereby, it can be set as the photosensitive resin composition.
  • the component (b) is not particularly limited as long as it is a compound that can generate radicals upon irradiation with actinic rays. Examples of actinic rays include ultraviolet rays such as i-rays, visible rays, and radiation.
  • component (b) examples include oxime compounds, acylphosphine oxide compounds, acyl dialkoxymethane compounds, and the like.
  • the component (b) is (b1) one or more compounds selected from the group consisting of the compound represented by the following formula (21) and the compound represented by the following formula (22) (hereinafter referred to as “component (b1)”. It is also preferable to contain.
  • component (b1) preferably has higher sensitivity to actinic rays than the component (b2) described later, and is preferably a highly sensitive photosensitizer.
  • R 11 is an alkyl group having 1 to 12 carbon atoms, and a1 is an integer of 0 to 5.
  • R 12 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms.
  • R 13 and R 14 each independently represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms (preferably 1 to 4 carbon atoms), a phenyl group or a tolyl group.
  • R 11 may be the same or different.
  • R 11 is preferably an alkyl group having 1 to 4 carbon atoms, and more preferably a methyl group. a1 is preferably 1.
  • R 12 is preferably an alkyl group having 1 to 4 carbon atoms, and more preferably an ethyl group.
  • R 13 and R 14 are preferably each independently an alkyl group having 1 to 4 carbon atoms, and more preferably a methyl group.
  • Examples of the compound represented by the formula (21) include a compound represented by the following formula (21-1), and are available as “IRGACURE OXE 02” manufactured by BASF Japan Ltd.
  • R 15 is —OH, —COOH, —O (CH 2 ) OH, —O (CH 2 ) 2 OH, —COO (CH 2 ) OH or —COO (CH 2 ) 2 OH.
  • R 16 and R 17 are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms (preferably 1 to 6 carbon atoms), a cycloalkyl group having 4 to 10 carbon atoms, a phenyl group, or a tolyl group.
  • b1 is an integer of 0 to 5. When b1 is an integer of 2 or more, R 15 may be the same or different.
  • R 15 is preferably —O (CH 2 ) 2 OH.
  • R 16 is preferably an alkyl group having 1 to 6 carbon atoms, more preferably a methyl group or a hexyl group.
  • R 17 is preferably an alkyl group having 1 to 6 carbon atoms or a phenyl group, and more preferably a methyl group or a phenyl group.
  • Examples of the compound represented by the formula (22) include a compound represented by the following formula (22-1), and are available as “IRGACURE OXE 01” manufactured by BASF Japan Ltd. Moreover, the compound represented by the following formula (22-2) is mentioned, and is available as “NCI-930” manufactured by ADEKA Corporation.
  • the component (b) is composed of (b2) one or more compounds selected from the group consisting of the compound represented by the following formula (31) and the compound represented by the following formula (32) (hereinafter referred to as “(b2) It is also preferable to contain a component ".
  • the component (b2) preferably has a lower sensitivity to actinic rays than the component (b1), and is preferably a standard photosensitizer.
  • R 21 is an alkyl group having 1 to 12 carbon atoms
  • R 22 and R 23 are each independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms (preferably having 1 to 4 carbon atoms).
  • c1 is an integer of 0 to 5.
  • R 21 may be the same or different.
  • R 22 is preferably an alkyl group having 1 to 4 carbon atoms, and more preferably a methyl group.
  • R 23 is preferably an alkoxy group having 1 to 12 carbon atoms, more preferably an alkoxy group having 1 to 4 carbon atoms, and further preferably a methoxy group or an ethoxy group.
  • Examples of the compound represented by the formula (31) include a compound represented by the following formula (31-1), which is available as “G-1820 (PDO)” manufactured by Lambson.
  • R 24 and R 25 are each independently an alkyl group having 1 to 12 carbon atoms (preferably 1 to 4 carbon atoms), and d and e are each independently an integer of 0 to 5 And s and t are each independently an integer of 0 to 3, and the sum of s and t is 3.
  • R 24 may be the same or different.
  • e is an integer of 2 or more
  • R 25 may be the same or different.
  • s is an integer of 2 or more
  • the groups in parentheses may be the same or different.
  • t is an integer of 2 or more, the groups in parentheses may be the same or different.
  • R 25 is preferably each independently an alkyl group having 1 to 4 carbon atoms, preferably a methyl group.
  • e is preferably an integer of 2 to 4, more preferably 3.
  • the combination (s, t) of s and t is preferably (1, 2) or (2, 1).
  • Examples of the compound represented by the formula (32) include a compound represented by the following formula (32-1), which is available as “IRGACURE TPO” manufactured by BASF Japan Ltd. Moreover, the compound represented by the following formula (32-2) is mentioned, and is available as “IRGACURE 819” manufactured by BASF Japan Ltd.
  • a component may be used individually by 1 type and may combine 2 or more types.
  • the component (b) preferably contains one or more selected from the group consisting of the component (b1) and the component (b2). Moreover, it is preferable that (b) component contains (b1) component and (b2) component. It is more preferable to use the compound represented by the above formula (21) as the component (b1) and the compound represented by the above formula (32) as the component (b2).
  • the amount of the component (b) is preferably 0.1 to 15 parts by mass, more preferably 0.2 to 10 parts by mass with respect to 100 parts by mass of the component (a). By being within the above range, it is possible to maintain both the remaining film ratio and good resolution in a wide range of exposure.
  • the content of the component (b1) is usually 0.05 to 5.0 parts by mass with respect to 100 parts by mass of the component (a), preferably 0. 0.05 to 1.0 part by mass, and more preferably 0.15 to 0.6 part by mass.
  • the content of the component (b2) is usually 0.5 to 10.0 parts by mass, preferably 0 with respect to 100 parts by mass of the component (a). .5 to 5.0 parts by mass.
  • the content of the component (b1) is 0.05 to 5.00 parts by mass with respect to 100 parts by mass of the component (a), and the component (b2)
  • the content of is preferably 0.5 to 10.0 parts by mass with respect to 100 parts by mass of component (a).
  • the mass ratio of the content of the component (b1) and the component (b2) is preferably 1: 3 to 1:30, more preferably 1: 5 to 1:20.
  • the total amount of the component (b1) and the component (b2) is preferably 0.6 to 11.0 parts by mass with respect to 100 parts by mass of the component (a). More preferably, it is 1.0 to 6.0 parts by mass, and still more preferably 1.15 to 5.6 parts by mass.
  • the resin composition of the present invention may further contain (c) a solvent (hereinafter also referred to as “component (c)”).
  • an organic solvent is preferred.
  • preferable examples include gamma butyrolactone, N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylsulfoxide, hexamethylphosphoryl
  • polar solvents such as amide, dimethylimidazolidinone, tetraethylurea, tetramethylurea, ethyl lactate, 3-methoxy-N, N-dimethylpropanamide and N-acetyl- ⁇ -caprolactam.
  • ketones, esters, lactones, ethers, halogenated hydrocarbons, hydrocarbons and the like may be used.
  • a component may be used individually by 1 type, or may use 2 or more types together.
  • the amount of the component (c) is preferably 50 to 1000 parts by mass, more preferably 100 to 500 parts by mass with respect to 100 parts by mass of the component (a).
  • the resin composition of the present invention may further contain (e) a sensitizer (hereinafter also referred to as “(e) component”). This makes it possible to maintain both the remaining film ratio and good resolution in a wide range of exposure amounts.
  • a sensitizer hereinafter also referred to as “(e) component.
  • (E) Sensitizers include Michler's ketone, benzoin, 2-methylbenzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin butyl ether, 2-t-butylanthraquinone, 1,2-benzo-9,10- Anthraquinone, anthraquinone, methylanthraquinone, 4,4'-bis- (diethylamino) benzophenone, acetophenone, benzophenone, thioxanthone, 1,5-acenaphthene, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2 -Methyl- [4- (methylthio) phenyl] -2-morpholino-1-propanone, diacetylbenzyl, benzyldimethyl ketal, benzyl diethyl
  • a component may be used individually by 1 type, or may use 2 or more types together.
  • the amount of the component (e) is preferably 0.1 to 1.0 part by weight, and 0.2 to 0.8 part by weight with respect to 100 parts by weight of the component (a). Is more preferable.
  • the resin composition of the present invention may further contain (f) a stabilizer (hereinafter also referred to as “component (f)”). Thereby, leaving stability can be made favorable.
  • component (f) a stabilizer
  • component (f) examples include p-methoxyphenol, diphenyl-p-benzoquinone, benzoquinone, hydroquinone, pyrogallol, phenothiazine, resorcinol, orthodinitrobenzene, paradinitrobenzene, metadinitrobenzene, phenanthraquinone, N-phenyl-2 -Naphtylamine, cuperone, 2,5-toluquinone, tannic acid, parabenzylaminophenol, nitrosamines, and compounds represented by the following formula F1.
  • the component may be used alone or in combination of two or more.
  • the amount of the component (f) is preferably 0.05 to 1.0 part by weight, and 0.1 to 0.8 part by weight with respect to 100 parts by weight of the component (a). Is more preferable.
  • the resin composition of the present invention may further contain (g) an adhesive (hereinafter also referred to as “(g) component”).
  • an adhesive hereinafter also referred to as “(g) component”.
  • a component may be used individually by 1 type, or may use 2 or more types together.
  • the blending amount of the component (g) is preferably 0.5 to 10 parts by mass and more preferably 1 to 8 parts by mass with respect to 100 parts by mass of the component (a).
  • the resin composition of the present invention may further contain (h) a rust inhibitor (hereinafter also referred to as “(h) component”).
  • a rust inhibitor hereinafter also referred to as “(h) component.
  • the component (h) is preferably a compound having a triazole skeleton or a tetrazole skeleton.
  • 5-aminotetrazole benzotriazole, 1-hydroxybenzotriazole, 1H-benzotriazole-1-acetonitrile, benzotriazole-5-carboxylic acid, 1H-benzotriazole-1-methanol, carboxybenzotriazole And mercaptobenzoxazole.
  • 5-aminotetrazole benzotriazole or 1-hydroxybenzotriazole is preferable.
  • a component may be used individually by 1 type, or may use 2 or more types together.
  • the amount of the component (h) is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 5 parts by mass with respect to 100 parts by mass of the component (a).
  • the resin composition of the present invention may further contain a dissolution accelerator, a surfactant, a leveling agent and the like.
  • the resin composition of the present invention essentially comprises the components (a), (d1) and (d2), and optionally the components (b), except for the solvent (component (c)), (e) to (h). ) Component, a dissolution accelerator, a surfactant, and a leveling agent, and may contain other inevitable impurities as long as the effects of the present invention are not impaired.
  • the resin composition of the present invention for example, 80% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, or 100% by mass, excluding the solvent (component (c)), (A), (d1) and (d2) components, (A), (b), (d1) and (d2) components or (a), (b), (d1) and (d2) components, and optionally (e) to (h) components, dissolution promoters, You may consist of surfactant and a leveling agent.
  • the cured product of the present invention can be obtained by curing the above-described resin composition.
  • the cured product of the present invention may be used as a cured product having a pattern (hereinafter referred to as a pattern cured product) or may be used as a cured product having no pattern.
  • the film thickness of the cured product of the present invention is preferably 1 to 20 ⁇ m.
  • the method for producing a cured product of the present invention includes a step of applying the resin composition described above on a support substrate and drying to form a resin film, and a step of heat-treating the resin film. Furthermore, you may provide the process of exposing.
  • the above-mentioned photosensitive resin composition is apply
  • the resin film is developed using an organic solvent to obtain a pattern resin film, and the pattern resin film is heated.
  • the support substrate examples include a metal substrate such as Cu, a glass substrate, a semiconductor, a metal oxide insulator (for example, TiO 2 , SiO 2, etc.), silicon nitride, and the like.
  • the coating method include dipping, spraying, screen printing, and spin coating.
  • drying for example, drying is performed by heating using a hot plate, an oven, or the like (for example, 90 to 150 ° C., 1 to 5 minutes).
  • the thickness of the resulting photosensitive resin film is preferably 1 to 20 ⁇ m.
  • post-exposure heating may be performed as necessary.
  • the post-exposure heating temperature is preferably 70 ° C. to 140 ° C., and the post-exposure heating time is preferably 1 minute to 5 minutes.
  • the temperature of the heat treatment is preferably 250 ° C. or lower, and more preferably 230 ° C. or lower. Thereby, a cyclization reaction and a crosslinking reaction proceed and a film can be formed.
  • the heat treatment time is preferably 20 minutes to 6 hours, more preferably 30 minutes to 3 hours. Multi-stage heating may be performed.
  • the heat treatment can be performed using, for example, an oven such as an inert gas oven, a quartz tube furnace, a hot plate, rapid thermal annealing, a vertical diffusion furnace, an infrared curing furnace, an electron beam curing furnace, and a microwave curing furnace.
  • an oven such as an inert gas oven, a quartz tube furnace, a hot plate, rapid thermal annealing, a vertical diffusion furnace, an infrared curing furnace, an electron beam curing furnace, and a microwave curing furnace.
  • air or an inert atmosphere such as nitrogen can be selected.
  • the cured product of the present invention can be used as an interlayer insulating film or a surface protective film.
  • the interlayer insulating film and the surface protective film of the present invention can be used for electronic parts and the like. Thereby, an electronic component with high reliability can be obtained.
  • the electronic component of the present invention can be used for semiconductor devices, multilayer wiring boards, and the like.
  • the semiconductor device and the multilayer wiring board can be used for various electronic devices.
  • the electronic component of the present invention is not particularly limited except that it has the above-described surface protective film, interlayer insulating film, and the like, and can have various structures.
  • FIG. 1 shows a schematic cross-sectional view of a semiconductor device having an interlayer insulating film and a surface protective film of the present invention.
  • An Al wiring layer 2 is formed on the interlayer insulating layer (interlayer insulating film) 1, an insulating layer (insulating film) 3 (for example, a P-SiN layer) is further formed on the Al wiring layer 2, and a surface protective layer of the device A (surface protective film) 4 is formed.
  • a rewiring layer 6 is formed from the pad portion 5 of the wiring layer 2 and extends to an upper portion of the core 8 which is a connection portion with a conductive ball 7 formed of solder, gold or the like as an external connection terminal. Further, a cover coat layer 9 is formed on the surface protective layer 4.
  • the rewiring layer 6 is connected to the conductive ball 7 through the barrier metal 10, and a collar 11 is provided to hold the conductive ball 7.
  • an underfill 12 may be interposed in order to further relieve stress.
  • Synthesis Example 1 (Synthesis of Polymer I) In a 1.0 liter flask equipped with a stirrer and a thermometer, 62.0 g (199.9 mmol) of 4,4′-oxydiphthalic dianhydride, 5.2 g (40.0 mmol) of 2-hydroxyethyl methacrylate and catalyst Amount of 1,4-diazabicyclo [2.2.2. Octanetriethylenediamine was dissolved in 250.0 g of N-methyl-2-pyrrolidone, stirred at 45 ° C.
  • the reaction solution was dropped into distilled water, and the precipitate was collected by filtration and dried under reduced pressure to obtain a polyamic acid ester.
  • the weight average molecular weight was calculated
  • the weight average molecular weight of the polymer I was 35,000.
  • Synthesis Example 2 (Synthesis of Polymer II) In a 1.0 liter flask equipped with a stirrer and a thermometer, 62.0 g (199.9 mmol) of 4,4′-oxydiphthalic dianhydride, 5.2 g (40.0 mmol) of 2-hydroxyethyl methacrylate and catalyst Amount of 1,4-diazabicyclo [2.2.2. Octanetriethylenediamine was dissolved in 250.0 g of N-methyl-2-pyrrolidone, stirred at 45 ° C. for 1 hour, cooled to 25 ° C., and 35.95 g (169.8 mmol) of 2,2′-dimethylbenzidine.
  • Examples 1 to 7 and Comparative Example 1 (Preparation of resin composition) A resin composition was prepared with the components and blending amounts shown in Table 1. The blending amounts in Table 1 are the parts by mass of the components (b) to (h) with respect to 100 parts by mass of the component (a).
  • each component used is as follows.
  • the component (a) the polymer I obtained in Synthesis Example 1 and the polymer II obtained in Synthesis Example 2 were used.
  • Component B1 G-1820 (PDO) (Lambson, 1-phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime)
  • D2 Component D2-1 A-TMMT (manufactured by Shin-Nakamura Chemical Co., Ltd., tetramethylolmethane tetraacrylate, compound represented by the following formula D2-1)
  • D2-2 A-9300 (manufactured by Shin-Nakamura Chemical Co., Ltd., ethoxylated isocyanuric acid triacrylate, compound represented by the following formula D2-2)
  • D2-3 M-215 (manufactured by Shin-Nakamura Chemical Co., Ltd., acryloyloxyethyl isocyanurate, compound represented by the following formula D2-3)
  • D2-4 A-TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd., trimethylolpropane triacrylate, compound represented by the following formula D2-4)
  • D2-5 DPE-6A (manufactured by Shin-Nakamura Chemical Co., Ltd., dipentaerythritol hexaacrylate,
  • the obtained resin composition was applied onto a 6-inch silicon wafer by spin coating, heated on a hot plate at 110 ° C. for 4 minutes, and the solvent was evaporated to obtain a coating film having a film thickness of 13 ⁇ m after curing. .
  • This was heat-cured at 225 ° C. for 1 hour in a nitrogen atmosphere using a vertical diffusion furnace (manufactured by Koyo Thermo System Co., Ltd.) to obtain a cured product.
  • GTN-68P (manufactured by Senju Metal Industry Co., Ltd.) was applied to the cured product with a pipette.
  • the cured product after application was placed on a hot plate at 245 ° C. and held for 1 minute. Thereafter, the cured product was moved from the hot plate and cooled to room temperature.
  • the cured product after cooling was washed with isopropyl alcohol and dried, and then the film thickness was measured.
  • the film thickness change rate (%) was calculated from the film thickness change before and after the application of GTN-68P.
  • a positive value means membrane swelling
  • a negative value means membrane dissolution. The results are shown in Table 1.
  • GTN-68P was measured in the same manner as the chemical resistance, except that WS-600 (manufactured by Alpha Advanced Materials) was used instead of GTN-68P. The results are shown in Table 1.
  • Adhesive evaluation Using a cross-cut guide (manufactured by Kortec Co., Ltd.), with a razor, cut 10 ⁇ 10 grids into the cured product obtained by manufacturing the cured product on the above-described Cu substrate. Divided into 100 pieces. Adhesive tape (manufactured by 3M Japan Co., Ltd.) was applied thereto, and the adhesive tape was peeled off. When peeling the adhesive tape, the adhesiveness was evaluated as follows according to the number of small pieces of the cured product peeled from the substrate. The results are shown in Table 1. A: The remaining mass was 100-80. B: The remaining mass was less than 80
  • Examples 8 to 9 and Comparative Examples 2 to 3 (Preparation of resin composition) A resin composition was prepared with the components and blending amounts shown in Table 2. The compounding quantity of Table 2 is a mass part of each component with respect to 100 mass parts of (a) component.
  • Component B2 IRGACURE OXE-02 (manufactured by BASF Japan Ltd., Etanone-1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -1- (o-acetyl) Oxime)
  • B3 IRGACURE 819 (manufactured by BASF Japan Ltd., bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide)
  • the resin composition of the present invention can be used for electronic parts such as semiconductor devices, multilayer wiring boards, and various electronic devices.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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  • Organic Chemistry (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Cette composition de résine contient : (a) un polyimide ou précurseur de polyimide ; (d1) un composé représenté par la formule (11) ou (12) ; et (d2) un ou plusieurs composés choisis dans le groupe constitué par un composé représenté par la formule (13), un composé représenté par la formule (14), un composé représenté par la formule (15), et un composé représenté par la formule (16).
PCT/JP2018/006741 2017-02-23 2018-02-23 Composition de résine, produit durci, produit durci à motif, procédé de production de produit durci, film isolant intercouche, film de protection de surface et composant électronique WO2018155639A1 (fr)

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CN201880011925.2A CN110300767B (zh) 2017-02-23 2018-02-23 树脂组合物、固化物及其制造方法、图案固化物、层间绝缘膜、表面保护膜和电子部件
KR1020197022434A KR102511567B1 (ko) 2017-02-23 2018-02-23 수지 조성물, 경화물, 패턴 경화물, 경화물의 제조 방법, 층간절연막, 표면 보호막 및 전자부품
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021120697A (ja) * 2020-01-30 2021-08-19 旭化成株式会社 ネガ型感光性樹脂組成物、並びにこれを用いたポリイミド及び硬化レリーフパターンの製造方法
WO2022065337A1 (fr) * 2020-09-25 2022-03-31 富士フイルム株式会社 Composition de résine, objet durci ainsi que procédé de fabrication de celui-ci, stratifié, et dispositif à semi-conducteurs

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024090567A1 (fr) 2022-10-27 2024-05-02
CN118605083B (zh) * 2024-06-07 2025-03-07 上海镭利电子材料有限公司 一种干膜型感光性树脂组合物及其制备方法和应用

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03220558A (ja) * 1989-09-22 1991-09-27 E I Du Pont De Nemours & Co 半水性溶液で現像可能な光反応性樹脂組成物
JPH05216224A (ja) * 1992-02-04 1993-08-27 Chisso Corp 感光性樹脂組成物
JPH0611830A (ja) * 1992-06-25 1994-01-21 Chisso Corp 感光性樹脂組成物
JP2000098607A (ja) * 1998-09-22 2000-04-07 Mitsui Chemicals Inc 感光性樹脂組成物
JP2000098604A (ja) * 1998-09-17 2000-04-07 Mitsui Chemicals Inc 感光性樹脂組成物
JP2001005180A (ja) * 1999-06-22 2001-01-12 Mitsui Chemicals Inc 感光性樹脂組成物
JP2001005182A (ja) * 1999-06-22 2001-01-12 Mitsui Chemicals Inc 感光性樹脂組成物
JP2004029702A (ja) * 2001-11-22 2004-01-29 Mitsui Chemicals Inc 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工部品
WO2015052885A1 (fr) * 2013-10-09 2015-04-16 日立化成デュポンマイクロシステムズ株式会社 Composition de résine contenant un précurseur de polyimide et procédé de fabrication d'un film durci utilisant cette composition
WO2015116657A1 (fr) * 2014-01-31 2015-08-06 Fujifilm Electronic Materials U.S.A., Inc. Nouvelles compositions de polyimide
US20160313641A1 (en) * 2015-04-21 2016-10-27 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive polyimide compositions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100529577B1 (ko) * 2001-11-22 2005-11-17 미쓰이 가가쿠 가부시키가이샤 감광성 수지조성물, 드라이필름 및 그것을 이용한 가공부품
JP5903164B2 (ja) 2012-08-08 2016-04-13 旭化成イーマテリアルズ株式会社 感光性フィルム積層体、及び、フレキシブルプリント配線の製造方法
JP2016200643A (ja) * 2015-04-07 2016-12-01 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03220558A (ja) * 1989-09-22 1991-09-27 E I Du Pont De Nemours & Co 半水性溶液で現像可能な光反応性樹脂組成物
JPH05216224A (ja) * 1992-02-04 1993-08-27 Chisso Corp 感光性樹脂組成物
JPH0611830A (ja) * 1992-06-25 1994-01-21 Chisso Corp 感光性樹脂組成物
JP2000098604A (ja) * 1998-09-17 2000-04-07 Mitsui Chemicals Inc 感光性樹脂組成物
JP2000098607A (ja) * 1998-09-22 2000-04-07 Mitsui Chemicals Inc 感光性樹脂組成物
JP2001005180A (ja) * 1999-06-22 2001-01-12 Mitsui Chemicals Inc 感光性樹脂組成物
JP2001005182A (ja) * 1999-06-22 2001-01-12 Mitsui Chemicals Inc 感光性樹脂組成物
JP2004029702A (ja) * 2001-11-22 2004-01-29 Mitsui Chemicals Inc 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工部品
WO2015052885A1 (fr) * 2013-10-09 2015-04-16 日立化成デュポンマイクロシステムズ株式会社 Composition de résine contenant un précurseur de polyimide et procédé de fabrication d'un film durci utilisant cette composition
WO2015116657A1 (fr) * 2014-01-31 2015-08-06 Fujifilm Electronic Materials U.S.A., Inc. Nouvelles compositions de polyimide
US20160313641A1 (en) * 2015-04-21 2016-10-27 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive polyimide compositions

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021120697A (ja) * 2020-01-30 2021-08-19 旭化成株式会社 ネガ型感光性樹脂組成物、並びにこれを用いたポリイミド及び硬化レリーフパターンの製造方法
WO2022065337A1 (fr) * 2020-09-25 2022-03-31 富士フイルム株式会社 Composition de résine, objet durci ainsi que procédé de fabrication de celui-ci, stratifié, et dispositif à semi-conducteurs
JPWO2022065337A1 (fr) * 2020-09-25 2022-03-31
JP7605851B2 (ja) 2020-09-25 2024-12-24 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

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TWI762589B (zh) 2022-05-01
WO2018154688A1 (fr) 2018-08-30
CN110300767A (zh) 2019-10-01
JP7180588B2 (ja) 2022-11-30
JPWO2018155639A1 (ja) 2019-12-12

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