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WO2018149963A1 - Filament émettant un rayonnement, muni d'un élément thermoconducteur - Google Patents

Filament émettant un rayonnement, muni d'un élément thermoconducteur Download PDF

Info

Publication number
WO2018149963A1
WO2018149963A1 PCT/EP2018/053878 EP2018053878W WO2018149963A1 WO 2018149963 A1 WO2018149963 A1 WO 2018149963A1 EP 2018053878 W EP2018053878 W EP 2018053878W WO 2018149963 A1 WO2018149963 A1 WO 2018149963A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
hole
filament
chips
heat conduction
Prior art date
Application number
PCT/EP2018/053878
Other languages
German (de)
English (en)
Inventor
Kok Eng Ng
Anuarul Ikhwan Mat Nazri
Tilman Eckert
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2018149963A1 publication Critical patent/WO2018149963A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a radiation-emitting filament, a method for producing a radiation-emitting filament and a luminous means with a radiation-emitting filament.
  • the carrier is arranged with the light-emitting chips in a thermal conducting ⁇ element.
  • the heat conduction element a through hole on.
  • the electrical contacts of the carrier are accessible from both sides for an electrical connection.
  • the arrangement of the carrier with the luminescent chips in the heat conduction element the heat is transferred with a short bridging path to the heat conduction element.
  • the heat conduction element is formed from a material which has ei ⁇ ne higher thermal conductivity than helium.
  • the radiation-emitting filament has a carrier with at least two light-emitting chips.
  • the carrier has at each ⁇ opposite ends to a respective electrical contact.
  • the light chips are with the electrical contacts
  • the heat conduction element is formed from a material which is transparent to the electromagnetic radiation of the luminescent ⁇ chips. Due to this arrangement, an improved heat dissipation from the filament, that is achieved by the light-emitting chips.
  • the heat conducting element is formed of glass.
  • Glass has a thermal conductivity that is, for example, in the range of 0.5 watts per millikelvin. Thereby, a sufficient heat dissipation and kuh ⁇ development of the light-emitting chips is achieved on the support.
  • the luminescent chips and / or the carrier have a luminescent layer.
  • the luminescent layer is designed to shift a wavelength of the electromagnetic radiation of the luminescent chips. In this way, regardless of the wavelength of the radiation of the luminescent chips, a desired color, in particular white light, can be generated .
  • the luminescent layer has, for example, red phosphor as luminescent material. Depending on the selected embodiment, green phosphor, or other materials can be used as luminescent material for the luminescent layer ⁇ to.
  • a simple embodiment of the filament is achieved when the carrier is strip-shaped and the réellelei ⁇ tion element is cylindrical.
  • the mold By Zylin ⁇ the mold an approximately constant layer thickness of heat ⁇ pipe element over the length of the carrier is provided. This allows a uniform heat dissipation over the length of the carrier.
  • the through-hole is formed in the shape of a cylinder and has approximately a circular cross-section.
  • the through hole can be easily manufactured.
  • the strip-shaped carrier can thereby be arranged at approximately equal distances in the middle in the heat conduction element
  • the contacts of the carrier are located in end portions of the through hole or project laterally from the heat conduction member or are arranged at least partially or completely outside the through-hole ⁇ . In this way, a simple contacting of the electrical contacts of the carrier can be realized.
  • Use of the proposed support may be provided with a transparent housing, a lighting means, wherein the filament with the heat-conducting member in the housing is arranged at ⁇ , and both electrical contacts of the carrier with the contact terminals of the transparent housing are electrically connected.
  • the housing is hermetically sealed and is in particular filled with a gas, in particular He ⁇ lium.
  • a gas in particular He ⁇ lium.
  • Using the gas can be achieved by filament improved Were ⁇ meabbow.
  • Luminescent chips provided.
  • the carrier has an electrical contact at governmentlie ⁇ constricting ends.
  • the light chips are electrically connected to the electrical contacts.
  • a heat conduction member having a through hole is provided.
  • the carrier with the light chips is inserted into the through hole of the cherries effetsele ⁇ mentes and connected to the heat conduction element.
  • the heat conduction element is formed of a material which is transparent to the electromagnetic radiation of the light-emitting chips.
  • the heat-conducting member of a mate rial ⁇ is formed, which has a higher thermal conductivity than helium.
  • FIG. 2 is a plan view of the filament of FIG. 1.
  • FIG 3 shows a cross section through the filament of FIGS. 1 and 2,
  • Fig. 5 shows a further cross section through the filament of
  • Fig. 6 shows a further cross section through the filament of
  • Fig. 7 perspective view of a filament a heat conduction element
  • Fig. 8 is a schematic representation of a lighting means
  • FIG. 1 shows, in a schematic cross-sectional illustration, a filament 100 which has a carrier 120.
  • Luminescent chips 110 are arranged on the carrier 120.
  • electrical conductor tracks 130 are provided on the carrier 120.
  • the carrier 120 has a first electrical contact 150 and a second electrical contact 155 at opposite ends of the carrier 120.
  • a first and a last conductor track 130 are each electrically conductively connected to the first and the second electrical contact 150, 155, respectively.
  • the electrical conductor tracks 130 connect the light-emitting chips 110 in the form of a series connection.
  • each light chip 110 has on a lower side a first and a second electrical connection 111, 112.
  • the light-emitting chips 110 are designed to generate electromagnetic radiation, in particular visible light.
  • the light-emitting chips 110 can produce blue, red or green light.
  • the light-emitting chips can, for example as radiation-emitting diode chips (LED) or may be formed as the laser diode chip from ⁇ .
  • the light-emitting chips may be 110 ⁇ covered with a luminescent layer 140th
  • the luminescent layer 140 represents a conversion Layer is, and has an optically excitable lamps which emits the electromagnetic radiation of the light-emitting chips from ⁇ sorbed and with a changed wavelength.
  • the luminescent layer 140 may comprise a matrix material and a light source in the form of red or green phosphor.
  • the illuminant may include an MDF phosphor or a KSF phosphor.
  • the luminescent layer 140 covers both the light-emitting chips 110 and a Oberflä ⁇ surface of the substrate 120.
  • the luminescent layer 140 may be also arranged only on the light-emitting chips 110th
  • a protective layer may cover the light-emitting chips 110 and the carrier 120th
  • the luminescent layer 140 is disposed only on the top 160 of the carrier 120 and the light-emitting chips 110th
  • the entire carrier 120, ie also side surfaces and a lower side of the carrier can be covered with the luminescent layer 140.
  • Be the light-emitting chips 110 represent radiation-emitting semiconductor chip ⁇ .
  • the carrier 120 may be made of a rigid or a flexible substrate, in particular a carrier plate ⁇ formed.
  • the carrier 120 may also consist of silicon carbide or sapphire.
  • the carrier 120 has the shape of a strip. In this case, a height of the strip in ei ⁇ Z direction is significantly smaller than a length of the strip in an X direction.
  • the light-emitting chips 110 may be formed beispielswei ⁇ se as LEDs or laser diodes. In the illustrated embodiment, the light-emitting chips 110 have electrical connections 111, 112 on the underside.
  • the look electrical connections may be provided at the top of the light-emitting chips 110 also laterally and / or.
  • the carrier 120 extends in the longitudinal direction along an x-axis. A height or thickness of the carrier 120 is arranged along a z-axis.
  • FIG. 2 shows a top view of the arrangement of FIG. 1, wherein a width of the carrier 120 is arranged in a y-axis.
  • the width of the carrier is greater than the height of Trä ⁇ gers.
  • the luminescent layer 140 is shown transparent. As already stated, the luminescent layer 140 can also be dispensed with.
  • ⁇ pending chosen by the embodiment may have only two light-emitting chips 110, a carrier 120, which are in series or parallel to ⁇ sorted.
  • a carrier 120 have more than two light-emitting chips 110 ⁇ serially and / or in parallel electrically conductively connected to the electrical contacts 150, 155th
  • the arrangement of the light-emitting chips 110 can be correspondingly designed differently.
  • the conductor tracks 130 can also have correspondingly required shapes for the electrical connection of the light-emitting chips 110.
  • the electrical contacts 150, 155 are formed, for example, of metal.
  • the x-axis, the z-axis and the y-axis form an orthogonal coordinate system.
  • Fig. 3 shows a schematic cross-section through the filament 100 of FIGS. 1 and 2, in the z-y plane through a
  • Luminescent chip 110 It can be clearly seen that the light chip 110 and a top 160 of the carrier 120 with the
  • Luminescent layer 140 are covered.
  • FIG. 4 shows a cross-section in a zx-plane through a further embodiment of a radiation-emitting filament 100, which is designed essentially in accordance with the embodiment of FIGS. 1 and 2.
  • the luminescent layer 140 is formed in such a manner that the upper side, side surfaces and also an underside of the carrier 120 are embedded in the luminescent layer 140.
  • 5 shows a cross section in the zx plane through the filament 100 of FIG. 4.
  • FIG. 6 shows a cross section through a luminous chip 110 of the filament 100 of FIG. 5 in the zy plane perpendicular to FIG
  • the carrier 120 and the light-emitting chip 110 are embedded in the luminescent layer 140.
  • FIG. 7 shows a perspective illustration of a radiation-emitting filament 100 which is arranged in a through-hole 170 of a heat-conducting element 180.
  • the filament 100 may be formed as shown in FIGS.
  • the through hole 170 is cylindrical in the illustrated embodiment and has a circular shape in cross section perpendicular to the longitudinal axis of the filament 100. Depending on the chosen embodiment, other cross sections and / or other shapes of the through hole 170 may be used.
  • the through hole 170 is opened at ge ⁇ opposite side surfaces 190, 195 of the heat conduction element 180th From the opposite openings of the through hole 170, the electrical contacts 150, 155 protrude.
  • the end pieces of the carrier 120 from the opposite Soflä ⁇ surfaces 190, 195 of the heat conduction member 190 may protrude from the through-hole ⁇ 170th
  • the electrical contacts 150, 155 may also terminate within the through-hole 170 in the end regions of the through-hole 170.
  • the through-hole 170 may also have a larger cross-section in the end region in order to allow a simpler electrical contacting of the electrical contacts 150, 155.
  • the heat conduction element 180 has the shape of a cylinder with the central through-hole. on the way up.
  • the heat conduction element 180 may also have other shapes and / or cross sections.
  • the heat conduction member is formed of egg ⁇ nem material which is transparent to the electromagnetic radiation of the light-emitting chips.
  • ⁇ as glass can be example as material for the thermal conduction member 180 ver ⁇ spent.
  • the heat conduction element can be designed as a glass ⁇ tube.
  • the heat conduction ⁇ element is formed of a material having a higher thermal conductivity than helium having see. This is given for glass with a thermal conductivity of 0.8 watts per millikelvin.
  • the thermal conductivity of helium is ei ⁇ nem range of 0.14 watts per milli-Kelvin.
  • the cross section of the through hole is compared to
  • Cross-section of the carrier 120 with the light-emitting chips 110 and possibly ⁇ the luminescent layer 140 performed in such a way that is formed depending on the ⁇ selected embodiment, a gap or a cavity between the carrier 120 and the heat conduction element 180 over the entire through hole 170 , By this is meant that the gap or cavity extends over the entire length of the through hole.
  • the carrier 120 can also be connected to the heat conduction element 180 at least locally or continuously over the entire length. In this way, a thermal balance within the through-hole 170 can be achieved by means of an air or gas circulation.
  • the gap between the carrier 120 with the light-emitting chips 110 and the possibly before ⁇ seen luminescent layer 140 may be provided air or gas.
  • the carrier 120 may be connected using an adhesive ⁇ layer, in particular made of a transparent adhesive having the heat-conducting member 180 with the light-emitting chips 110 and possibly with the light-emitting layer 140th
  • an adhesive for example, a low-viscosity silicone adhesive can be used.
  • the filament 100 is fixed in the through hole 170.
  • heat conductive adhesive used ⁇ to the entire surface or pointwise between the carrier 120 and the inside of the heat conduction member 180 are formed.
  • the width of the support may be selected so that we ⁇ antes 70% of the width of the through hole to be filled by the carrier 170th
  • the luminescent layer or a protective layer can also rest directly on an inner wall of the through-hole 170.
  • the heat conduction element 180 may also have a rough, roughened or structured outer wall 200. Co- help the roughened and / or structured outer wall 200, the surface of the heat conduction element 180 magnification ⁇ is ßert. This improves heat transfer to the environment.
  • an inner wall 260 of the through-hole 170 can also be roughened in order to have an enlarged surface.
  • FIG. 8 shows a schematic illustration of a luminous means 210 which has a transparent housing 220.
  • the lighting means 210 is in the form of a light bulb.
  • the housing 220 is formed of glass.
  • the housing 220 is sealed gas ⁇ tight and has a first and a second contact terminal 230, 240.
  • two filaments 100 with heat conducting elements 180 are arranged in the housing 220.
  • the filaments 100 with heat conducting elements 180 are formed as shown in FIG.
  • the electrical contacts 150, 155 of the filaments 100 are electrically conductively connected to the first and the second contact connection 230, 240 of the luminous means 210 via wires 250.
  • the two filaments are electrically connected in series.
  • only one filament with a heat conduction element 180 can be arranged in the housing 220.
  • more than two filaments 100 may be arranged with heat conducting elements 180 in the housing 220.
  • the filaments can be connected electrically in series and / or in parallel.
  • the housing 220 can be filled with air or with a gas such as helium. be filling.
  • the arrangement of the heat conduction element 180 around the radiation-emitting filament 100 around ei ne improved heat dissipation from the filament 100 to the environment, that is, the interior of the housing 220 allows.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un filament (100) émettant un rayonnement, comportant un support (120) et au moins deux puces électroluminescentes (110) agencées sur le support (120). Le support (120) présente un contact électrique (150, 155) à chacune de ses extrémités opposées, les puces électroluminescentes (110) sont connectées aux contacts (150, 155) de manière électroconductrice, le support (120) portant les puces électroluminescentes (110) est agencé dans un trou traversant (170) d'un élément thermoconducteur (180), l'élément thermoconducteur (180) est constitué d'un matériau transparent au rayonnement électromagnétique des puces électroluminescentes (110), le support (120) est fixé à l'élément thermoconducteur (180), et l'élément thermoconducteur (180) est constitué d'un matériau présentant une conductivité thermique supérieure à celle de l'hélium.
PCT/EP2018/053878 2017-02-20 2018-02-16 Filament émettant un rayonnement, muni d'un élément thermoconducteur WO2018149963A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017103431.5 2017-02-20
DE102017103431.5A DE102017103431A1 (de) 2017-02-20 2017-02-20 Strahlungsemittierendes Filament mit Wärmeleitungselement

Publications (1)

Publication Number Publication Date
WO2018149963A1 true WO2018149963A1 (fr) 2018-08-23

Family

ID=61256943

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/053878 WO2018149963A1 (fr) 2017-02-20 2018-02-16 Filament émettant un rayonnement, muni d'un élément thermoconducteur

Country Status (2)

Country Link
DE (1) DE102017103431A1 (fr)
WO (1) WO2018149963A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113366255B (zh) 2019-01-24 2024-06-28 昕诺飞控股有限公司 Led灯丝装置
WO2021018813A1 (fr) * 2019-08-01 2021-02-04 Signify Holding B.V. Structure optique de production d'effets décoratifs d'éclairage
EP4038310A1 (fr) * 2019-10-03 2022-08-10 Signify Holding B.V. Dispositif d'éclairage à filament à del

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140268779A1 (en) * 2013-03-15 2014-09-18 Litetronics International, Inc. Led light emitting device
CN104377194A (zh) * 2014-11-17 2015-02-25 深圳市裕富照明有限公司 Led灯丝、led球泡灯及灯具
US20150070871A1 (en) * 2013-09-11 2015-03-12 Huga Optotech Inc. Led assembly
WO2015135817A1 (fr) * 2014-03-13 2015-09-17 Koninklijke Philips N.V. Filament pour dispositif d'éclairage
US20170012177A1 (en) * 2015-07-09 2017-01-12 Cree, Inc. Led based lighting system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140268779A1 (en) * 2013-03-15 2014-09-18 Litetronics International, Inc. Led light emitting device
US20150070871A1 (en) * 2013-09-11 2015-03-12 Huga Optotech Inc. Led assembly
WO2015135817A1 (fr) * 2014-03-13 2015-09-17 Koninklijke Philips N.V. Filament pour dispositif d'éclairage
CN104377194A (zh) * 2014-11-17 2015-02-25 深圳市裕富照明有限公司 Led灯丝、led球泡灯及灯具
US20170012177A1 (en) * 2015-07-09 2017-01-12 Cree, Inc. Led based lighting system

Also Published As

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