WO2018149719A1 - Matière autoadhésive à base de silicone amortissant les vibrations - Google Patents
Matière autoadhésive à base de silicone amortissant les vibrations Download PDFInfo
- Publication number
- WO2018149719A1 WO2018149719A1 PCT/EP2018/053144 EP2018053144W WO2018149719A1 WO 2018149719 A1 WO2018149719 A1 WO 2018149719A1 EP 2018053144 W EP2018053144 W EP 2018053144W WO 2018149719 A1 WO2018149719 A1 WO 2018149719A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition according
- pressure
- composition
- sensitive adhesive
- organopolysiloxane
- Prior art date
Links
- 238000013016 damping Methods 0.000 title abstract description 30
- 150000001875 compounds Chemical class 0.000 title abstract description 6
- 239000013464 silicone adhesive Substances 0.000 title description 5
- 239000000203 mixture Substances 0.000 claims abstract description 94
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 72
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 18
- 238000004132 cross linking Methods 0.000 claims abstract description 16
- 125000003118 aryl group Chemical group 0.000 claims abstract description 10
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 9
- 125000001424 substituent group Chemical group 0.000 claims abstract description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 39
- 229920002050 silicone resin Polymers 0.000 claims description 35
- -1 polydimethylsiloxane Polymers 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920000491 Polyphenylsulfone Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920006260 polyaryletherketone Polymers 0.000 claims description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000004695 Polyether sulfone Substances 0.000 claims 1
- 125000002081 peroxide group Chemical group 0.000 claims 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 14
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 150000003254 radicals Chemical class 0.000 description 28
- 239000012528 membrane Substances 0.000 description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 5
- 235000019400 benzoyl peroxide Nutrition 0.000 description 5
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 125000005375 organosiloxane group Chemical group 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- 238000009472 formulation Methods 0.000 description 3
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical class C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003502 gasoline Substances 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical group C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- CCNDOQHYOIISTA-UHFFFAOYSA-N 1,2-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1C(C)(C)OOC(C)(C)C CCNDOQHYOIISTA-UHFFFAOYSA-N 0.000 description 1
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- KRDXTHSSNCTAGY-UHFFFAOYSA-N 2-cyclohexylpyrrolidine Chemical compound C1CCNC1C1CCCCC1 KRDXTHSSNCTAGY-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- DALNRYLBTOJSOH-UHFFFAOYSA-N 3,3,5,7,7-pentamethyl-1,2,4-trioxepane Chemical compound CC1CC(C)(C)OOC(C)(C)O1 DALNRYLBTOJSOH-UHFFFAOYSA-N 0.000 description 1
- CEOICFCCDFFPBF-UHFFFAOYSA-N C(C1=CC=CC=C1)(=O)OOC(C1=CC=CC=C1)=O.C(C=1C(C(=O)OC2CCCCC2)=CC=CC1)(=O)OC1CCCCC1 Chemical compound C(C1=CC=CC=C1)(=O)OOC(C1=CC=CC=C1)=O.C(C=1C(C(=O)OC2CCCCC2)=CC=CC1)(=O)OC1CCCCC1 CEOICFCCDFFPBF-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 150000005840 aryl radicals Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 125000003493 decenyl group Chemical group [H]C([*])=C([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229940057404 di-(4-tert-butylcyclohexyl)peroxydicarbonate Drugs 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- QWVBGCWRHHXMRM-UHFFFAOYSA-N hexadecoxycarbonyloxy hexadecyl carbonate Chemical compound CCCCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCCCC QWVBGCWRHHXMRM-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 125000005187 nonenyl group Chemical group C(=CCCCCCCC)* 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 150000002978 peroxides Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
Definitions
- the present invention relates to the technical field of pressure-sensitive adhesives, as they are widely used in the art for temporary or permanent bonding of materials and parts to be joined.
- the invention relates to silicone-based PSAs, which are characterized by good vibration damping properties.
- Damping is generally understood to mean the transfer of mechanical energy into so-called lost heat.
- the acoustic damping is about the irreversible conversion of sound energy into heat.
- Acoustic damping - or synonymously sound damping or sound absorption - can occur in gaseous, liquid and solid bodies.
- micro-speakers The generation of sound in mobile phones and smartphones for the reproduction of speech, ringtones, music, etc. is done by small electro-acoustic transducers, so-called micro-speakers.
- the temperature load on the microspeaker, and in particular its diaphragm increases more and more.
- the membrane must therefore be made of a material that has a long life and does not crack even at high temperatures and high mechanical loads. At the same time, the membrane material should also have good acoustic properties to give the speaker a good sound quality.
- the general requirements for the material of a loudspeaker diaphragm are on the one hand high rigidity and low density for generating a high sound pressure and the coverage of a wide frequency range.
- the material should at the same time have a high internal damping in order to achieve a smooth frequency response worry and minimize distortion. Since the stiffness, light and well-damped properties give a constructive contradiction and can not all be fulfilled simultaneously (the stiffer, the lower the damping and vice versa), compromises in terms of rigidity and damping of the membrane material must generally be made or more rigid for each membrane Materials combined with good damping materials.
- US Pat. No. 7,726,441 B2 describes a membrane composed of a multilayer composite of two rigid polymer films and a damping adhesive layer lying between these films.
- US 2014/0017491 A1 describes a silicone adhesive composition which, before curing, comprises a silicone elastomer, a silicone resin, a reaction product of a silicone elastomer and a silicone resin, a silicone hydride crosslinker and a platinum catalyst.
- a resulting adhesive is used in a transfer tape for connecting brake components, for example for connecting the brake disc and brake pad.
- EP 1 018 725 A2 describes a method for deadening a sheet metal part, for example a vehicle body part, by producing a screwed, riveted or welded connection of a metal sheet with the sheet metal part to be deconvolved with the interposition of an adhesive layer.
- a crosslinked silicone adhesive is used as adhesive layer for use in sheet metal parts in the temperature range between -20 ° C and +50 ° C while a polyacrylic acid ester copolymer and for use at higher temperatures in the range of 0 ° C to 100 ° C.
- a crosslinked silicone adhesive is used.
- the energy of the oscillating sheet metal part is conducted to a high degree in the sandwich of at least one adhesive layer and at least one metal sheet, so that the sandwich is able to convert a high vibrational energy fraction into heat.
- EP 1 035 345 A2 describes a damping plate for attachment to a carrier plate of a brake shoe of a disc brake which has a self-adhesive damping layer on the inner side facing the brake shoe.
- the object of the present invention is to provide an easily applicable pressure-sensitive adhesive with good vibration-damping properties which are available over a wide temperature range.
- a first, general subject of the invention is a composition for producing a pressure-sensitive adhesive which a) at least one organopolysiloxane containing several Si-bonded alkyl groups, containing at least two Si-bonded alkenyl groups;
- c) contains at least one radical generator.
- a pressure sensitive adhesive Under a PSA or synonymous a pressure sensitive adhesive according to the invention, as common in common usage, a substance understood that - especially at room temperature - permanently sticky and sticky.
- a characteristic of a pressure-sensitive adhesive is that it can be applied by pressure to a substrate and adhere there, whereby the pressure to be applied and the duration of this pressure are generally not specified. In some cases, depending on the precise nature of the pressure-sensitive adhesive, the temperature and humidity, as well as the substrate, the action will be a short-term minimum pressure that does not exceed a light touch for a brief moment to achieve the adhesion effect. In other cases, a long-term exposure time of high pressure may be necessary. Pressure-sensitive adhesives have special, characteristic viscoelastic properties which lead to permanent tackiness and adhesiveness.
- Characteristic of them is that when they are mechanically deformed, it comes both to viscous flow processes as well as to build elastic restoring forces. Both processes are in a certain ratio with regard to their respective proportions, depending on the exact composition, the structure and the degree of crosslinking of the pressure-sensitive adhesive as well as on the speed and duration of the deformation and on the temperature.
- the proportional viscous flow is necessary to achieve adhesion.
- the viscous components caused by macromolecules with relatively high mobility, allow good wetting and a good flow onto the substrate to be bonded.
- a high proportion of viscous flow leads to a high pressure tack (also referred to as tack or surface tackiness) and thus often also to a high bond strength.
- Strongly crosslinked systems, crystalline or glassy solidified polymers are usually not or at least only slightly tacky due to the lack of flowable components.
- the proportional elastic restoring forces are necessary to achieve cohesion. They are caused for example by very long-chained and strongly entangled as well as by physically or chemically crosslinked macromolecules and allow the transmission of forces acting on an adhesive bond forces. They result in an adhesive bond being able to withstand a sustained load acting on it, for example in the form of a permanent shearing load, to a sufficient extent over a relatively long period of time.
- G ' storage modulus
- G " loss modulus
- G " is a measure of the viscous portion of a substance. Both quantities depend on the deformation frequency and the temperature.
- the sizes can be determined with the help of a rheometer.
- the material to be examined is exposed to a sinusoidal oscillating shear stress in a plate-and-plate arrangement, for example.
- shear stress controlled devices the deformation as a function of time and the time lag of this deformation are compared with the introduction of the shear stress measured. This time offset is referred to as the phase angle ⁇ .
- a substance is generally considered to be pressure sensitive and is defined as tacky if, at room temperature, here by definition at 23 ° C, in the deformation frequency range of 10 ° to 10 1 rad / sec G 'at least partially in the range of 10 3 to 10 7 Pa and if G "is also at least partially within this range.”
- Partially means that at least a portion of the G 'curve lies within the window defined by the deformation frequency range of 10 ° to 10 inclusive 1 rad / sec (abscissa) and the range of G 'values of from 10 3 to 10 7 Pa inclusive (ordinate) is spanned. For G "this applies accordingly.
- composition according to the invention can be used-essentially by removing the solvent and crosslinking the composition-to prepare pressure-sensitive adhesives which have very good damping properties, in particular acoustic, over a wide temperature range.
- compositions according to the invention or pressure-sensitive adhesives prepared therefrom can advantageously be used wherever damping must be effected even at high and / or varying temperatures. They are particularly well suited for bonding foils for loudspeaker membranes and for gluing components of brake systems.
- composition of the invention contains as component a) at least one organopolysiloxane, as it is generally referred to as silicone.
- An organopolysiloxane according to the invention is preferably a) a polymer having a composition of the organosiloxane units according to the general formula (1)
- the organopolysiloxane is preferably a) a linear polymer of the general formula (2) (2) R'3Si-O- (R'2Si-O) m-SiR'3, in which the radicals R 'are each independently alkyl, phenyl - or alkenyl radicals and to 0 to 1 0%, based on the number of all radicals R ', are OH groups, where at least two radicals R' are alkyl groups and at least two radicals R 'are alkenyl groups; and m stands for a natural number of 2,000 to 6,000.
- the radicals R ' can be distributed over the linear silicone in all conceivable and chemically possible constellations. For example, polydimethylsiloxanes, poly (methylphenyl) siloxanes and
- the radicals R 'in the general formula (2) independently of one another represent methyl, ethyl, phenyl or alkenyl radicals, where at least two radicals R' are alkenyl radicals.
- the silicone is particularly preferably a) a polydimethylsiloxane, a poly (methylphenyl) siloxane or a dimethylsiloxane-diphenylsiloxane copolymer.
- the organopolysiloxane of component a) is a polydimethylsiloxane.
- the formula (2) is a structural formula, so also the linkage of the siloxane units with each other again.
- the at least one organopolysiloxane of component a) contains at least two alkenyl groups.
- Crosslinking is usually enabled via the alkenyl groups in such silicones by adding to the composition another organopolysiloxane containing several Si-H groups. It then comes to an addition of the Si-H functions to the alkenyl groups and in this way to build a crosslinked silicone.
- the alkenyl groups of the silicone a) preferably contain 2-10 C atoms.
- the alkenyl groups of the organopolysiloxane of component a) are particularly preferably selected independently of one another from the group consisting of vinyl, propenyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl and decenyl groups. These groups are particularly reactive and thus enable efficient networking.
- the alkenyl groups of the organopolysiloxane of component a) comprise vinyl groups.
- the alkenyl groups of the organopolysiloxane of component a) are vinyl groups.
- composition of the invention is designed so that the organopolysiloxane of component a) is not crosslinked as usual via a compound containing Si-H groups, but instead untypical of a radical mechanism.
- Component a) is evidently included in the crosslinking of component b) designed from the outset for radical crosslinking.
- the composition according to the invention is therefore preferably free of substances which contain one or more Si-H groups.
- the composition of the invention is free of substances containing one or more Si-H groups.
- the weight-average molar mass Mw of the organopolysiloxane of component a) is preferably 31,000-2,000,000 g / mol, more preferably 45,000-1,000,000 g / mol.
- One or more organopolysiloxanes of component a) are preferably contained in the composition according to the invention to a total of 10 to 90 wt .-%, based on the solids content of the composition. It is thus possible for an organopolysiloxane of component a) or a mixture of different organopolysiloxanes of component a) to be present. Organopolysiloxanes of component a) are more preferably contained in the composition according to the invention to a total of 20 to 80 wt .-%, in particular to a total of 30 to 60 wt .-%, each based on the solids content of the composition.
- composition according to the invention contains as component b) at least one organopolysiloxane having several Si-bonded aryl groups and containing at least two free-radically crosslinkable substituents. Preference is given to an organopolysiloxane according to the invention b) a polymer having a composition of the organosiloxane units of the general formula (3)
- the organopolysiloxane b) is preferably a linear polymer of the general formula (4)
- polydiphenylsiloxanes, poly (methylphenyl) siloxanes and poly (dimethylsiloxane / diphenylsiloxane) copolymers are known.
- the radicals R '' in the general formula (4) are preferably, independently of one another, methyl, ethyl or phenyl radicals or OH groups, where at least two radicals R '' 'represent phenyl groups and at least two radicals R' '' represent methyl groups
- the Si-bonded aryl groups of the organopolysiloxane of component b) are particularly preferably phenyl groups, silicone b) being most preferably a polydiphenylsiloxane, a poly (methylphenyl) siloxane or a dimethylsiloxane-diphenylsiloxane copolymer, in particular the organopolysiloxane is Component b) a poly (methylphenyl) siloxane or a dimethylsiloxane-diphenylsiloxane copolymer
- the formula (4) is a structural formula, ie it also represents the linkage of the siloxane units
- the at least one organopolysiloxane of component b) contains at least two free-radically crosslinkable substituents.
- Such groups usually allow cross-linking via these groups by adding a free-radical generator to the composition. It then comes to the formation of radicals that cause the construction of a crosslinked silicone by recombination.
- Preferred are the Radically crosslinkable substituents of the organopolysiloxane of component b) methyl groups.
- the organopolysiloxane of component b) is preferably free of Si-bonded alkenyl groups, more preferably free of any alkenyl groups.
- the weight-average molar mass Mw of the organopolysiloxane of component b) is preferably 31,000-1,500,000 g / mol, more preferably 45,000-1,200,000 g / mol, in particular 50,000-1,000,000 g / mol.
- One or more organopolysiloxanes of component b) are preferably present in the composition according to the invention to a total of 10 to 90 wt .-%, based on the solids content of the composition. It is therefore possible for an organopolysiloxane of component b) or a mixture of different organopolysiloxanes of component b) to be present. Organopolysiloxanes of component b) are more preferably contained in the composition according to the invention to a total of 20 to 80 wt .-%, in particular to a total of 40 to 70 wt .-%, each based on the solids content of the composition.
- the weight ratio of the organopolysiloxanes of component a) to the organopolysiloxanes of component b) of the composition according to the invention is preferably from 1: 4 to 3: 1, more preferably from 1: 3 to 7: 3, in particular from 3: 7 to 3: 2.
- silicones of components a) and b) may be present in the composition according to the invention which contain neither alkenyl nor aryl groups nor OH groups. These may be, for example, pure polydimethylsiloxanes.
- the composition according to the invention contains at least one radical generator.
- the radical generator is preferably a peroxide.
- the radical generator is selected from the group consisting of di (4-methylbenzoyl) peroxide, dibenzoyl peroxide, di (2,4-dichlorobenzoyl) peroxide, dicumyl peroxide, di- (4-tert-butylcyclohexyl) peroxydicarbonate, dilauroyl peroxide, Dicetyl peroxydicarbonate, tert-butyl peroxybenzoate, tert-butyl cumyl peroxide, di-tert-butyl peroxide, di- (tert-butylperoxyisopropyl) benzene, 2,5-dimethyl-2,5-di (tert-butylperoxy) hexyn-3 and 3,3,
- Radical formers are in the composition according to the invention preferably to a total of 0.3 to 6 wt .-%, more preferably to a total of 0.5 to 4 wt .-%, in particular to a total of 1 to 3 wt .-%, each based on the solids content of Composition, included.
- the composition of the invention preferably contains at least one silicone resin.
- the silicone resin is preferably selected from MQ, MTQ, TQ, MT and MDT resins. According to the invention, it is also possible for mixtures of different silicone resins to be present in the composition, in particular mixtures of the abovementioned silicone resins. Most preferably, the silicone resin is an MQ resin. MQ silicone resins are readily available and are characterized by very good stability. If a plurality of silicone resins are present in the composition according to the invention, all silicone resins of the composition according to the invention are very particularly preferably MQ resins.
- the weight-average molar mass Mw of the at least one silicone resin is preferably 500 - ⁇ 30,000 g / mol.
- the resin may contain alkenyl groups.
- Suitable silicone resins are, for example, DC 2-7066 from Dow Corning; MQ Resin VSR6201 from Chenguang Fluoro & Silicone Elastomers Co., Ltd .; MQ-RESIN POWDER 803 TF from Wacker Silicones; SR 545 from Momentive Performance Materials or SilmerVQ9XYL and Silmer Q9XYL from Siltech.
- the proportion of the totality of all silicone resins in the totality of all silicones a) and b) and of all silicone resins is at most 90% by weight.
- the proportion of the totality of all silicone resins in the totality of all silicones a) and b) and of all silicone resins is at least 30% by weight. In a further embodiment of the invention, the proportion of the totality of all silicone resins in the entirety of all silicones a) and b) and of all silicone resins is at least 45% by weight. In particular, silicone resins are included in total 30 to 80 wt .-%, based on the total weight of all organopolysiloxanes and all silicone resins of the composition in the composition of the invention.
- the composition according to the invention preferably contains at least one solvent.
- the solvent is preferably selected from aromatic and aliphatic hydrocarbons, in particular from toluene, xylene and gasoline, from aprotic carbonyl compounds, in particular from ketones, esters and ethers and from inert protic solvents, in particular isopropanol.
- the composition according to the invention may contain further constituents in the sense of auxiliaries and adjuvants, e.g. Anchorage aids; organic and / or inorganic pigments; Fillers such as carbon black, graphite or carbon nanotubes and organic and / or inorganic particles (e.g., polymethyl methacrylate (PMMA), barium sulfate or titanium oxide (.02)) may be included.
- auxiliaries and adjuvants e.g. Anchorage aids
- organic and / or inorganic pigments e.g., Fillers such as carbon black, graphite or carbon nanotubes and organic and / or inorganic particles (e.g., polymethyl methacrylate (PMMA), barium sulfate or titanium oxide (.02)
- PMMA polymethyl methacrylate
- barium sulfate titanium oxide
- the composition of the invention independently contains 0.1 to 5 parts by weight of one or more anchoring aids and / or one or more pigments and / or 0.1 to 50 parts by weight of one or more fillers, each based on 100 parts by weight of the total on base polymer (s) and silicone resin (s).
- the composition according to the invention is free of any constituents which go beyond the previously mentioned components.
- Another object of the invention is a process for the preparation of a pressure-sensitive adhesive composition comprising the thermal crosslinking of a composition according to the invention.
- Another object of the invention is a pressure-sensitive adhesive which is obtainable by thermal crosslinking of a composition according to the invention.
- thermal crosslinking is meant here the crosslinking under the influence of heat that is obtainable under the respective present, in particular from the composition of the composition and the resulting theoretically available attachment sites, otherwise corresponding to the conditions usual for the crosslinking of silicone adhesive compositions .
- the temperature at which the quotient of loss modulus (G ") and storage modulus (G ') (tan ⁇ ) of the pressure-sensitive adhesive of the invention reaches its maximum value can be adjusted by varying the resin content
- Temperature at which the quotient of loss modulus (G ") and storage modulus (G ') (tan ⁇ ) of a pressure-sensitive adhesive obtainable by thermal crosslinking of a composition containing at least one silicone resin according to the invention reaches its maximum value ( Ta n 5 max), where T ta n 5 max is set by changing the silicone resin concentration with otherwise constant proportions.
- silicone resin concentration is understood to mean, of course, the total concentration of silicone resins 80 wt .-%, more preferably from 20 to 50 wt .-%, each based on the total amount of silicones and silicone resins of the composition.
- the latter method according to the invention makes it possible to adjust the silicone PSA obtainable from the composition to the temperature range expected for the intended use.
- Simple test series can be used to produce a mass with optimal damping properties, which are most pronounced in the tan ⁇ maximum.
- the maximum value of the quotient of loss modulus (G ") and storage modulus (G ') (tan ⁇ max, measured at 10 rad / s) of the pressure-sensitive adhesive of the invention in the temperature range between -60 ° C. and 170 ° C. is preferably from 0.5 to 2 In particular, it is equal to or greater than 0.8, most preferably equal to or greater than 1. In this range, excellent - in particular acoustic - damping properties are obtained. Also preferably, the temperature range within the range of - 60 ° C to 170 ° C, in which tan ⁇ of the pressure-sensitive adhesive of the invention is at least 0.5, at least 80 K, more preferably at least 150 K.
- the temperature range within the range of - 60 ° C to 170 ° C, in the tan ⁇ of the pressure-sensitive adhesive of the invention at least 1, 0, at least 40 K, more preferably at least 50 K.
- Compositions according to the invention or obtainable from pressure-sensitive adhesives can advantageously for bonding of acoustic membranes, such as speaker membranes in mobile phones, laptops, televisions and others with Equipped with loudspeakers and for gluing brake system components in Vehicles are used.
- the PSA is preferably coated in a layer thickness of 5 to 30 ⁇ on a film, for example by means of direct coating or lamination, and then the other film is applied to the free adhesive mass side.
- Another object of the invention is a multi-layer composite
- polypropylene PP
- PET polyethylene terephthalate
- PBT polybutylene terephthalate
- PC polycarbonate
- PU polyurethane
- TPU thermoplastic polyurethane
- PEN polyethylene naphthalate
- PPS Polyphenylene sulfide
- PI polyimide
- PES polyethersulfone
- PSU polyetherimide
- PEI polyarylate
- PAR polyetheretherketone
- PAEK polyaryletherketone
- PAEK polyaryletherketone
- Such a multilayer composite can be used particularly advantageously as an acoustic membrane in the above sense.
- the main component of the two films is particularly preferably a polyetheretherketone.
- compositions according to the invention or the pressure-sensitive adhesives obtainable therefrom are adhesions to ceilings and floors of house and façade elements (eg doors, windows); further bonding (beyond loudspeaker membranes) in electronic devices such as mobile phones, laptops, televisions; Bonding to movable furniture elements such as drawers; Bonding of the interior lining of vehicles and aircraft; Bonding in kitchen appliances (eg mixers); Bonding of moving parts in printers; Adhesions in mass memories or drives of computers; further bonding in vehicles such as from and in oil pans, dashboards, body panels, door panels, vehicle floors, vehicle roofs, trunk lids and tailgates and vehicle windows; in particular, the noise reduction in bonnet hinges in vehicles; the noise reduction in washing machines and dryer drums; the squeal protection between window clamping rings and body of vehicles; Bonding of thick metal substrates in shipbuilding, for example, bonding of ship walls and decks; also bonding of metal plates in locomotives, train trailers and trucks; Bonding of
- the determination of the bond strength steel was carried out at a test climate of 23 ° C +/- 1 ° C temperature and 50% +/- 5% rel. Humidity.
- the tape samples were cut to 20 mm width and adhered to a steel plate.
- the steel plate was cleaned and conditioned before measurement. For this purpose, the plate was first wiped with acetone and then left in the air for 5 minutes to allow the solvent to evaporate.
- the side of the adhesive tape pattern facing away from the test substrate was then covered with a 50 ⁇ m aluminum foil, which prevented the pattern from stretching during the measurement.
- the test pattern was rolled up on the steel substrate.
- the adhesive tape was rolled over with a 2 kg roller 5 times back and forth at a winding speed of 10 m / min.
- the steel plate was slid into a special fixture which allowed the pattern to be withdrawn vertically at an angle of 90 °.
- the bond strength was measured with a Zwick tensile testing machine.
- the measurement results are given in N / cm and are averaged out of three measurements.
- BPO dicyclohexyl phthalate - benzoyl peroxide
- DC 7956 was admixed with the respectively indicated amounts of DC 7657 and optionally DC 7066. The mixture was homogenized for 2 h with a magnetic stirrer. Subsequently, the indicated amount of BPO in 5 ml of toluene was added and mixed by stirring for an additional 1 hour.
- the resulting mixture was applied in the form of a layer of 50 g / m 2 (for measurements of bond strength) or 500 g / m 2 (for dynamic mechanical analysis) on a fluorosilicone PET liner and 2 min at 90 ° C and 5 min at 170 ° C crosslinked.
- Table 1 lists the formulations.
- Table 1 Compositions for the production of pressure-sensitive adhesives
- the resulting mixtures were applied in the form of a layer of 50 g / m 2 (for measurements of bond strength) or 500 g / m 2 (for dynamic mechanical analysis) on a fluorosilicone PET liner and 2 min at 90 ° C and below Crosslinked at 170 ° C for 5 min.
- the bond strength to steel and the tan ⁇ values in the temperature range from -60 ° C. to 165 ° C. were determined at 15 K intervals. From the latter, the values contained in Table 4 were obtained by applying appropriate curves against the temperature of the temperature range in which tan ⁇ in each case at least 0.5 or at least 0.7 or 1, 0 was.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
L'invention vise à mettre au point une matière autoadhésive facile à utiliser présentant de bonnes propriétés d'amortissement des vibrations, ces propriétés se manifestant sur un large spectre de températures. Cet objectif est atteint grâce à une composition pour fabriquer une matière autoadhésive qui contient a) au moins un organopolysiloxane présentant plusieurs groupes alkyle liés au Si et contenant au moins deux groupes alcényle liés au Si, b) au moins un organopolysiloxane présentant plusieurs groupes aryle liés au Si et contenant au moins deux substituants pouvant être réticulés par voie radicalaire, et c) au moins un générateur de radicaux. L'invention concerne également une matière autoadhésive pouvant être obtenue par réticulation thermique d'une composition selon l'invention.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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EP18705118.0A EP3583184A1 (fr) | 2017-02-17 | 2018-02-08 | Matière autoadhésive à base de silicone amortissant les vibrations |
CN201880008342.4A CN110249018A (zh) | 2017-02-17 | 2018-02-08 | 振动阻尼硅酮胶粘剂物质 |
KR1020197023212A KR102284815B1 (ko) | 2017-02-17 | 2018-02-08 | 진동-감쇠 실리콘 접착제 화합물 |
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DE102017202623.5A DE102017202623A1 (de) | 2017-02-17 | 2017-02-17 | Vibrationsdämpfende Silikon-Haftklebmasse |
DE102017202623.5 | 2017-02-17 |
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WO2018149719A1 true WO2018149719A1 (fr) | 2018-08-23 |
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PCT/EP2018/053144 WO2018149719A1 (fr) | 2017-02-17 | 2018-02-08 | Matière autoadhésive à base de silicone amortissant les vibrations |
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Country | Link |
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EP (1) | EP3583184A1 (fr) |
KR (1) | KR102284815B1 (fr) |
CN (1) | CN110249018A (fr) |
DE (1) | DE102017202623A1 (fr) |
TW (1) | TWI675897B (fr) |
WO (1) | WO2018149719A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3694943A4 (fr) * | 2017-10-09 | 2021-06-16 | 3M Innovative Properties Company | Couches adhésives d'amortissement pour diaphragmes de micro-haut-parleurs |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN108774488A (zh) * | 2018-06-15 | 2018-11-09 | 歌尔股份有限公司 | 有机硅类压敏胶及其制备方法、复合膜结构、振膜、及发声装置 |
WO2024130669A1 (fr) * | 2022-12-23 | 2024-06-27 | Dow Silicones Corporation | Article électronique ayant une couche adhésive intercouche ayant une fonction d'amortissement/d'absorption des chocs |
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EP3694943A4 (fr) * | 2017-10-09 | 2021-06-16 | 3M Innovative Properties Company | Couches adhésives d'amortissement pour diaphragmes de micro-haut-parleurs |
US20210198543A1 (en) * | 2017-10-09 | 2021-07-01 | 3M Innovative Properties Company | Damping adhesive layers for microspeaker diaphragms |
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Publication number | Publication date |
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KR102284815B1 (ko) | 2021-07-30 |
TWI675897B (zh) | 2019-11-01 |
EP3583184A1 (fr) | 2019-12-25 |
TW201833288A (zh) | 2018-09-16 |
KR20190101462A (ko) | 2019-08-30 |
CN110249018A (zh) | 2019-09-17 |
DE102017202623A1 (de) | 2018-08-23 |
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