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WO2018147305A1 - Dispositif d'étanchéité à la résine et procédé de création d'étanchéité à la résine - Google Patents

Dispositif d'étanchéité à la résine et procédé de création d'étanchéité à la résine Download PDF

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Publication number
WO2018147305A1
WO2018147305A1 PCT/JP2018/004121 JP2018004121W WO2018147305A1 WO 2018147305 A1 WO2018147305 A1 WO 2018147305A1 JP 2018004121 W JP2018004121 W JP 2018004121W WO 2018147305 A1 WO2018147305 A1 WO 2018147305A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
workpiece
resin
mounting surface
smooth surface
Prior art date
Application number
PCT/JP2018/004121
Other languages
English (en)
Japanese (ja)
Inventor
義和 大谷
寛治 森
光 高橋
Original Assignee
信越エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越エンジニアリング株式会社 filed Critical 信越エンジニアリング株式会社
Priority to JP2018567453A priority Critical patent/JP6557428B2/ja
Publication of WO2018147305A1 publication Critical patent/WO2018147305A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present invention relates to a resin sealing apparatus used for manufacturing a molded product in which a workpiece on which a semiconductor element is mounted is manufactured in order to create a package such as a semiconductor package, and a resin sealing for manufacturing the package. It relates to the stopping method.
  • an adsorption fixing portion (a gas permeable member, a suction / discharge hole) that adsorbs a substrate before sealing to an upper mold and a substrate outer peripheral portion of the substrate before sealing between the upper mold surface
  • a holding and fixing portion (chuck member) is provided to hold the substrate in place, and the molten resin is supplied to the cavity space where the substrate before sealing is attached and fixed to the upper die and the film is attached and fixed to the cavity surface of the lower die.
  • the intermediate mold and the lower mold are moved upward with respect to the upper mold, so that the chip portion of the substrate before sealing to the through-hole portion of the substrate is immersed in the molten resin, and the resin sealing of the semiconductor chip for resin sealing molding is performed.
  • the suction fixing operation of the suction fixing portion is switched from the pumping operation to the pumping operation through the second film.
  • the adhesion strength between the non-mounting surface of the substrate before sealing and the second film is further increased so that the molten resin does not enter the non-mounting surface side.
  • a resin material such as an epoxy-based thermosetting resin
  • a resin material generally used for resin sealing molding
  • a phenomenon occurs in which the pressure is partially increased by the gas pressure generated by the foaming.
  • the suction fixing portion breathable member, suction / discharge hole
  • the molten resin is If the material is foamed with reduced pressure to generate gas and fine resin component, the fine resin component mixed in the foam gas will be in the gap between the adsorption fixing part (breathable member) on the upper mold surface and the second film.
  • the resin sealing device includes a first mold having a work holding portion on which a semiconductor element is mounted, and the first mold held by the holding portion of the first mold. Formed between the first mold and the second mold, the second mold having a cavity that is provided opposite to the mounting surface on which the semiconductor element of the work is mounted and that is supplied with uncured resin
  • a movable chamber that is openable and closable, and one or both of the first mold and the second mold that are relatively moved in the opposing direction of the first mold and the second mold
  • a pressure adjusting unit that adjusts the internal pressure from an atmospheric atmosphere to a reduced pressure atmosphere of a predetermined vacuum degree by exhausting or supplying air over the sealed chamber and the external space, and a controller that controls the operation of the driving unit and the pressure adjusting unit.
  • the holding portion of the first mold is The smooth surface has a smooth surface facing a non-mounting surface opposite to the mounting surface of the workpiece, and the smooth surface is made of an elastically deformable material, and the non-mounting surface of the workpiece is the smooth surface.
  • the control unit is configured so that the sealed chamber is decompressed by the pressure adjusting unit, and the driving unit
  • the placement surface of the workpiece and the semiconductor element are immersed in the uncured resin in the cavity, and control is performed so that a molded product is formed by curing the uncured resin.
  • the semiconductor element is mounted on the holding portion of the first mold that is relatively moved in the facing direction of the first mold and the second mold in the air atmosphere.
  • a detachable holding of the workpiece and a feeding step of supplying uncured resin into the cavity of the second mold, and either one or both of the first mold and the second mold are driven.
  • the holding part of the first mold has a smooth surface made of an elastically deformable material facing the non-mounting surface of the workpiece, and in the carrying-in
  • the resin sealing device A includes a plurality of or a single semiconductor element C mounted on the workpiece W in the semiconductor assembly process, and the substrate terminal and the semiconductor of the workpiece W
  • the molded product M can protect the semiconductor element C and the connection member C1 of the product from factors such as impact, temperature, and humidity.
  • Examples of the workpiece W include a substrate made of silicon wafer, glass, metal sheet, glass cloth, BT resin, or the like, or a similar one.
  • Examples of the semiconductor element C include chip-shaped electronic components such as semiconductor chips.
  • the connection member C1 include bumps and wires.
  • the uncured resin R a sheet, powder, granule, gel or the like is used.
  • Examples of the material of the uncured resin R include thermosetting resins such as epoxy resins.
  • the molded product M manufactured by the resin sealing device A is generally subjected to a dividing process such as dicing to complete a package such as a semiconductor package as a final product.
  • the resin sealing device A includes a first mold 1 having a work W holding portion 11 and a work W held by the holding portion 11 of the first mold 1.
  • a second molding die 2 having a cavity 21 provided opposite to the mounting surface W1, an openable / closable sealed chamber 31 formed between the first molding die 1 and the second molding die 2, and a first molding die
  • a drive unit 4 for raising and lowering, in which one or both of the first mold 2 and the second mold 2 are moved relatively close to each other in the opposing direction of the first mold 1 and the second mold 2, and the sealed chamber
  • a pressure adjusting unit 5 that adjusts the internal pressure of 31 as a main component.
  • the release sheet S is a film made of a heat-resistant material having excellent elasticity such as a fluororesin such as Aflex (registered trademark) or ETFE or silicone, and the size thereof is larger than that of the workpiece W or the cavity 21. Yes. Further, by pressurizing and compressing the uncured resin R in the cavity 21, it is possible to produce a mold that does not generate bubbles (voids) inside the resin-sealed molded product M.
  • the resin sealing device A includes the positioning portion 6 of the release sheet S with respect to the cavity 21 and the pressing portion 7 that compresses the uncured resin R.
  • the positioning unit 6, the pressurizing unit 7, and the like are electrically communicated with the control unit 8, and their operations are controlled by the control unit 8.
  • the first mold 1 and the second mold 2 are usually arranged so as to face each other in the vertical direction as shown in FIGS. 1 to 8, and the upper first mold 1 and the lower second mold 2 are arranged.
  • the direction in which the mold 2 approaches or isolates is hereinafter referred to as “Z direction”.
  • a direction along the workpiece W that intersects the Z direction is hereinafter referred to as an “XY direction”.
  • the first mold 1 is formed in a flat plate shape having a thickness that does not deform (bend) with a rigid body such as metal, and on the surface thereof, the non-mounting surface W2 and Z opposite to the mounting surface W1 of the workpiece W are formed. It has the holding
  • the holding part 11 of the first mold 1 comes into contact with the non-mounting surface W2 of the workpiece W at a predetermined timing to hold the workpiece W so that it can be detached and cannot be detached.
  • the mounting surface W1 of the workpiece W and the semiconductor element C is pressed toward the cavity 21 of the second mold 2 described later.
  • the holding part 11 of the first mold 1 has a smooth surface 11a facing the non-mounting surface W2 of the workpiece W.
  • the smooth surface 11a is made of an elastically deformable material, and the smooth surface 11a is elastically deformed into a concave shape along the non-mounting surface W2 in a state where the non-mounting surface W2 of the workpiece W is pressed by the smooth surface 11a. It is configured as follows. In the case of the example shown in FIGS.
  • the first mold 1 is an upper mold arranged on the substrate side of the molding.
  • a holding portion 11 for the workpiece W is provided on the lower surface of the upper mold.
  • the smooth surface 11a of the holding part 11 is formed so that the portion of the workpiece W that is in pressure contact with the non-mounting surface W2 of the workpiece W is pressed (pressed) against the first mold 1 and is partially compressed to elastically deform into a concave shape.
  • work W are surface-contacted, and it will be in a substantially perfect contact state.
  • a molding plate 11p that becomes the holding portion 11 is detachably attached to the base surface 11o of the first molding die 1, and a plate-like member that becomes the smooth surface 11a on the surface side of the molding plate 11p.
  • the plate-like member that becomes the smooth surface 11a is preferably made of a material having high releasability with the uncured resin R. Examples of a material having a high releasability from the uncured resin R include a fluororesin having a low hardness.
  • a coating process including a lining, an adhesive sheet (tape ) Is also possible.
  • the holding part 11 (smooth surface 11a) of the first mold 1 is provided with a holding chuck 12 for detachably holding the workpiece W.
  • the holding chuck 12 has a holding surface 12a facing the non-mounting surface W2 of the workpiece W in the Z direction.
  • an adhesive chuck 12b described later is preferably used as the holding chuck 12.
  • the holding chuck 12 is an adhesive chuck 12b described later, the workpiece W is directly adhered by the adhesive chuck 12b without sandwiching the release sheet S between the holding portion 11 and the non-mounting surface W2 of the workpiece W. Retained.
  • a disk-shaped silicon wafer is used as the workpiece W, and the silicon wafer is held to the holding portion 11 (smooth surface 11a) of the first mold 1 by the holding chuck 12 (adhesive chuck 12b). ).
  • the release sheet S is placed directly on the inner bottom surface of the cavity 21.
  • a substrate made of glass, a metal sheet, a glass cloth, a BT resin, or the like or a similar one is held (suspended), It is possible to change the outer shape to a rectangular shape (a quadrilateral having a right angle including a rectangle and a square).
  • the entire or part of the adhesive chuck 12b to be the holding chuck 12 is made of an adhesive material such as fluorine rubber, elastomer, butyl rubber, photosensitive resin, acrylic or silicon, and has an adhesive surface to be the holding surface 12a. ing.
  • the holding chuck 12 adheresive chuck 12b
  • at least the holding surface (adhesive surface) 12a is preferably made of an elastically deformable material and slightly protrudes from the holding portion 11 (smooth surface 11a) of the first mold 1.
  • the holding portion 11 smooth surface 11a
  • a plurality of concave grooves 11b are formed on the holding portion 11 (smooth surface 11a) of the first mold 1 in a dispersed manner.
  • the diameter of the groove 11b is set to about 10 mm or less.
  • An adhesive sheet is fitted inside each concave groove 11b, and its holding surface (adhesive surface) 12a protrudes slightly (about 50 um or less) from the holding portion 11 (smooth surface 11a) of the first mold 1. Yes. Thereby, even if the sealed chamber 31 is in a reduced pressure atmosphere DP having a predetermined degree of vacuum, the workpiece W cannot be dropped.
  • the pressure adjusting unit 5 can efficiently exhaust the gas to the outside of the sealed chamber 31, and at the same time, the mounting surface W ⁇ b> 1 of the workpiece W and Exhaust can be reliably performed from the gap C2 of the semiconductor element C. For this reason, bubbles do not remain inside the resin seal, voids can be prevented, and a resin-sealed package can be realized with high accuracy, thereby improving quality. Further, since the non-mounting surface W2 of the workpiece W is held (suspended) by the holding portion 11 (smooth surface 11a) of the first mold 1, the mounting surface W1 of the workpiece W and the semiconductor in the decompression step described later.
  • the gas in the sealed chamber 31 is discharged to the external space O (vacuum exhaust, vacuum Pulling).
  • the surface of the uncured resin R is sufficiently exposed to the vacuum in the sealed chamber 31, and the defoaming of the uncured resin R is promoted.
  • it is excellent in the invasion property of the uncured resin R with respect to the entire gap C2 excluding the mounting surface W1 of the workpiece W and the connection member C1 of the semiconductor element C, and stable molding without generating bubbles (voids) inside is stable. Can be produced.
  • the holding part 11 (smooth surface 11a) of the first mold 1 is forced to move the non-mounting surface W2 of the workpiece W toward the holding surface (adhesive surface) 12a of the holding chuck 12 (adhesive chuck 12b). It is preferable to have a pressing portion 13 that presses against the surface and a peeling portion 14 that peels the non-mounting surface W2 of the workpiece W from the holding surface (adhesive surface) 12a of the holding chuck 12 (adhesive chuck 12b).
  • the pressing force of the workpiece W by the pressing portion 13 is such that the holding portion 11 (smooth surface 11a) of the first mold 1 and the holding surface of the holding chuck 12 (adhesive chuck 12b) slightly protruding from the holding portion 11 (smooth surface 11a).
  • (Adhesive surface) 12a is set to be pressed (pressed) on the non-mounting surface W2 of the workpiece W.
  • the pressing portion 13 partially compresses and deforms a portion of the holding portion 11 (smooth surface 11a) of the first mold 1 that is in pressure contact with the non-mounting surface W2 of the workpiece W, and the holding chuck 12 (adhesive chuck 12b).
  • the holding surface (adhesive surface) 12a is crushed, the holding part 11 (smooth surface 11a) of the first mold 1 and the non-mounting surface W2 of the work W are in close contact, and a gap through which the uncured resin R enters between the two. It is comprised so that it may not produce.
  • a suction hole 13a for vacuum suction is formed in the holding portion 11 (smooth surface 11a) of the first mold 1, and the suction hole 13a. Is set to be approximately the same as the size of the groove 11b, and a plurality of them are dispersedly arranged.
  • Each suction hole 13a communicates with an actuator (not shown) such as a decompression pump or a vacuum suction or gas jet through a pipe line 13b.
  • an actuator such as a decompression pump or a vacuum suction or gas jet through a pipe line 13b.
  • the non-mounting surface W2 of the workpiece W is drawn toward the adhesive chuck 12b and presses the non-mounting surface W2 against the holding surface (adhesive surface) 12a.
  • a push pin 14 a provided so as to be reciprocable in the Z direction with respect to the first mold 1 is used, and the non-mounting surface W 2 of the workpiece W is held at the tip of the push pin 14 a as a holding surface (adhesive surface). It is preferable to push away from 12a.
  • the peeling part 14 it is also possible to push away the non-mounting surface W2 of the workpiece W from the holding surface (adhesive surface) 12a by injecting compressed gas from the suction holes 13a.
  • a plurality of adhesive chucks 12 are dispersedly arranged around each suction hole 13a.
  • the workpiece W is peeled off only by the push pin 14 a as the peeling portion 14.
  • an electrostatic chuck is used as the pressing portion 13 of the workpiece W instead of the suction hole 13a, and the non-mounting surface W2 of the workpiece W is held by the electromagnetic chuck by the electrostatic chuck.
  • the second molding die 2 is formed as a flat plate having a thickness that does not deform (bend) with a rigid body such as metal, and is opposed to the mounting surface W1 of the workpiece W on which the semiconductor element C is mounted in the Z direction.
  • the surface of 2 has a cavity 21 to which the uncured resin R is supplied.
  • the cavity 21 is formed in a concave shape having a volume that allows at least all of the semiconductor elements C mounted on the mounting surface W1 of the workpiece W to enter and has a depth that allows the mounting to the mounting surface W1 of the workpiece W.
  • At least the second mold 2 is provided with a heater (not shown) for heating the cavity 21 and its periphery. A heater for heating can also be provided in the first mold 1.
  • the second mold 2 is a lower mold disposed on the resin side of the molding.
  • a circular concave cavity 21 into which the uncured resin R, all the semiconductor elements C, and the connection member C1 enter is integrally formed at the center of the upper surface of the lower mold.
  • a circular concave portion into which the entire work W is inserted is formed integrally with the cavity 21.
  • the shape of the cavity 21 is changed to a rectangular concave shape corresponding to the outer shape of the workpiece W, or only the cavity 21 is formed without forming the concave portion into which the entire workpiece W enters. It is possible to change what to do.
  • a sheet-like thermosetting resin R 1 having an outer shape corresponding to the shape and size of the cavity 21 is supplied into the cavity 21. It is melted with a heater for heating.
  • a powdered or granular thermosetting resin R2 is supplied into the cavity 21 and melted with a heater for heating, or FIG.
  • the fiber-containing resin substrate R3 in which the uncured resin layer R31 is impregnated in the resin-impregnated fiber base R32 is supplied into the cavity 21 as shown in FIG.
  • the powdered or granular thermosetting resin R ⁇ b> 2 easily adjusts the capacity of the uncured resin R more easily than the sheet-like thermosetting resin R ⁇ b> 1 or the fiber-containing resin substrate R ⁇ b> 3.
  • the fiber-containing resin substrate R3 shown in FIG. 7 is a resin-impregnated fiber base made of carbon fiber, glass fiber, quartz glass fiber or the like whose linear expansion coefficient in the XY direction is smaller than 3 ppm, as described in Japanese Patent No. 5934078.
  • a material R32 and an uncured resin layer R31 made of an uncured epoxy resin or the like formed on one surface of the resin-impregnated fiber substrate R32 are provided.
  • the shrinkage stress when the uncured resin layer R31 is cured can be suppressed.
  • the workpiece W (wafer or substrate) warps, the workpiece W (wafer)
  • the separation of the semiconductor element C from the substrate and the substrate and the damage of the workpiece W (wafer or substrate) can be suppressed, and the mounting surface W1 of the workpiece W (wafer or substrate) on which the semiconductor element C is mounted or the semiconductor element C is formed.
  • the mounting surface W1 of the workpiece W (wafer or substrate) can be collectively sealed at the level of the workpiece W (wafer or substrate) and the sealing performance such as heat resistance and moisture resistance is excellent after sealing.
  • the second mold 2 is divided into a central portion 22 constituting the bottom surface portion of the cavity 21 and an outer portion 23 serving as a side surface portion of the cavity 21, and a spacer is provided between the central portion 22 and the outer portion 23.
  • the intake port 61 is formed in an annular slit shape along the inner surface of the cavity 21 and communicates with an intake device 62 such as a vacuum pump.
  • the outer portion 23 includes a driven portion 23a that contacts the first mold 1 regardless of the presence of the release sheet S, a stopper 23b that restricts movement of the first mold 1 and the driven portion 23a in the Z direction, and a driven portion. And an elastic member 23c that constantly urges 23a toward the first mold 1.
  • the driven portion 23a is supported so as to be reciprocally movable in the Z direction, and the holding portion 11 (smooth surface 11a) of the first mold 1 in a state where the first mold 1 is in contact with the stopper 23b via the driven portion 23a. Is set to be equal to or longer than the thickness of the molded product M including the workpiece W.
  • the second mold 2 is integrally formed without being divided into the central portion 22 and the outer portion 23, and the shape and structure of the outer portion 23 are changed to shapes and structures other than those shown in the drawing. It is also possible to change it.
  • the uncured resin R pressurizing unit 7 includes an overflow channel 71 formed continuously outside the cavity 21, a plunger 72 provided so as to be able to protrude toward the overflow channel 71, and an unfilled portion in the overflow channel 71. And a deformable separation portion 73 provided between the cured resin R and the plunger 72.
  • the overflow channel 71 is preferably formed with a plurality of overflow channels 71 around the cavity 21 at predetermined intervals.
  • a plurality of plungers 72 are respectively provided in the plurality of overflow channels 71, and the plurality of overflow channels 71 and the plurality of plungers 72 are preferably arranged symmetrically with respect to the shape of the cavity 21.
  • the plunger 72 is supported so as to reciprocate in the Z direction with respect to the driven portion 23 a of the outer portion 23 and the like in order to vary the volume of the overflow channel 71.
  • the separation portion 73 is preferably formed integrally with the outer peripheral portion of the release sheet S supplied along the cavity 21. In the case of the example shown in FIGS.
  • a plurality of overflow channels 71 are respectively provided on the outer periphery of the circular concave cavity 21 in the circumferential direction at predetermined intervals and in the XY direction. It arranges radially and the plunger 72 is arrange
  • a plurality of overflow channels 71 are arranged at predetermined intervals on each side or each corner. It is also possible to change the arrangement number and shape of 71 or the arrangement location of the plunger 72 other than the illustrated example.
  • the sealed chamber 31 is preferably formed inside the vacuum device 3 including a vacuum chamber and the like, and it is preferable that gas is exhausted (evacuated and evacuated) from the sealed chamber 31 by the operation of the pressure adjusting unit 5 such as a vacuum pump.
  • the sealed chamber 31 is configured to be capable of adjusting the transformation from the atmospheric atmosphere AP to the reduced-pressure atmosphere DP having a predetermined degree of vacuum.
  • the vacuum device 3 is configured to be openable and closable in whole or in part so that the workpiece W, the uncured resin R, the release sheet S, the molded product M, and the like can be taken in and out of the sealed chamber 31.
  • Automation can be achieved by providing a transfer mechanism (not shown) such as a transfer robot across the sealed chamber 31 in the vacuum apparatus 3 and the external space O of the vacuum apparatus 3. More specifically, when the sealed chamber 31 is the atmospheric atmosphere AP, the workpiece W, the uncured resin R, and the release sheet S are carried into the sealed chamber 31 by the transport mechanism. Molding is performed after the sealed chamber 31 is in a reduced pressure atmosphere DP having a predetermined degree of vacuum. After the molding is completed, the molded product M is returned from the sealed chamber 31 to the external space O by returning to the atmospheric atmosphere AP.
  • a transfer mechanism such as a transfer robot across the sealed chamber 31 in the vacuum apparatus 3 and the external space O of the vacuum apparatus 3. More specifically, when the sealed chamber 31 is the atmospheric atmosphere AP, the workpiece W, the uncured resin R, and the release sheet S are carried into the sealed chamber 31 by the transport mechanism. Molding is performed after the sealed chamber 31 is in a reduced pressure atmosphere DP having a predetermined degree of vacuum. After the molding is completed, the molded product
  • the peripheral wall portion 32 forms the lower side of the vacuum device 3 on the outer periphery of the first mold 1 constituting the upper side of the vacuum device 3. It is provided so as to be detachable and intimately attached to the outer periphery of the second mold 2.
  • the peripheral wall portion 32 has a seal portion 32a that is in close contact with the outer peripheral portion of the second mold 2 in the Z direction, and a stretchable portion 32b that is elastically deformable in the Z direction.
  • a peripheral wall portion may be provided on the outer periphery of the second mold 2, or the first mold 1 and the second mold 2. A change such as providing a peripheral wall portion separable in the Z direction on the outer periphery is possible.
  • the drive unit 4 for raising and lowering is configured by an actuator or the like that reciprocates either the first mold 1 or the second mold 2 or both the first mold 1 and the second mold 2 in the Z direction.
  • the operation is controlled by the control unit 8 described later.
  • control of the drive unit 4 for raising and lowering by the control unit 8 at the time of carrying in the workpiece W and the uncured resin R shown by the solid line in FIG. 1 and at least carrying out the molded product M shown in FIG. Sometimes, the first mold 1 and the second mold 2 are relatively moved apart in the Z direction.
  • the first molding die 1 and the second molding die 2 move further closer to pressurize the workpiece W and the uncured resin R.
  • either the first molding die 1 or the second molding die 2 is relatively moved away from the other in the Z direction by the elevating drive unit 4 at the time of carry-in or carry-out, or the first Both the mold 1 and the second mold 2 are moved relatively apart from each other in the Z direction.
  • either the first mold 1 or the second mold 2 is moved relatively close to the Z direction toward the other, or both the first mold 1 and the second mold 2 are moved to each other. Move relatively close to the Z direction. In the case of the example shown in FIG.
  • the lifting drive unit 4 only the first mold 1 is linked to the lifting drive unit 4, and the first mold 1 side is second molded. It is moved close to the mold 2 side in the Z direction.
  • the second mold 2 is linked to the drive unit 4 for raising and lowering, and the second mold 2 side is relatively close to the first mold 1 side in the Z direction.
  • the first molding die 1 and the second molding die 2 are respectively linked to the raising / lowering drive unit 4 to move the first molding die 1 side and the second molding die 2 side simultaneously in the Z direction. It is possible to change things.
  • the control unit 8 includes not only the actuator of the pressing unit 13 and the driving unit 4 and the pressure adjusting unit 5 for lifting and lowering, but also the pressure adjusting unit 5, the intake device 62 of the positioning unit 6, and the drive source of the plunger 72 of the pressurizing unit 7, It is a controller that is electrically connected to the transport mechanism of the workpiece W, the uncured resin R, and the release sheet S.
  • the controller serving as the controller 8 sequentially controls the operation at a preset timing in accordance with a preset program in its control circuit (not shown).
  • the resin sealing method according to the embodiment of the present invention includes a loading step of loading the workpiece W, the uncured resin R, and the release sheet S into the opened sealed chamber 31, and the sealed chamber 31 with a predetermined degree of vacuum from the atmospheric atmosphere AP.
  • the main process includes a curing process in which the resin is sealed by curing the uncured resin R, and a carry-out process in which the sealed chamber 31 is opened to take out the molded product M.
  • an air release step for returning the sealed chamber 31 from the reduced pressure atmosphere DP to the air atmosphere AP between the curing step and the carry-out step.
  • the first mold 1 and the second mold 2 are relatively moved apart in the Z direction, and the holding portion 11 ( The workpiece W is carried into the smooth surface 11a) by the transport mechanism and is adhesively held by the adhesive chuck 12.
  • the smooth surface 11a of the holding part 11 is elastically (compressed) deformed into a concave shape along the non-mounting surface W2 of the workpiece W, and the smooth surface 11a and the non-mounting surface W2 are brought into close contact with each other to hold the workpiece W. It is set at a predetermined position on the part 11 (smooth surface 11a).
  • the release sheet S and the uncured resin R are supplied toward the cavity 21 of the second mold 2 by the transport mechanism. Thereby, the uncured resin R is set to the predetermined position of the cavity 21 via the release sheet S.
  • the decompression step as shown in FIG. 3A, either one or both of the first mold 1 and the second mold 2 are moved relatively close to each other in the Z direction by the drive unit 4 for raising and lowering.
  • a sealed chamber 31 is formed between the first mold 1 and the second mold 2.
  • the pressure adjusting unit 5 discharges the gas in the sealed chamber 31 to the external space O (evacuation and evacuation) to reduce the pressure from the atmospheric atmosphere AP.
  • the uncured resin R in the cavity 21 is melted by a heater for heating. After that, as shown in FIG.
  • Resin R is pressurized.
  • the uncured resin R flows into the overflow channel 71 and overflows as much as the volume in which the mounting surface W1 of the workpiece W and the semiconductor element C are immersed in the melted uncured resin R.
  • the plunger 72 projects and moves toward the overflow channel 71 via the separation portion 73.
  • the uncured resin R of a volume that protrudes the separating portion 73 into the overflow channel 71 is pushed back to the overflow channel 71 without flowing into the plunger 72, and the uncured resin in the cavity 21.
  • R is pressurized and the uncured resin R is further compressed.
  • the uncured resin R in the cavity 21 and the overflow channel 71 is cured together by heating with a heater or the passage of time, and the work surface W1 and the semiconductor element C are placed between the two.
  • the gap C2 excluding the connection member C1 is integrally resin-sealed.
  • the pressure adjusting unit 5 supplies air from the external space O to the sealed chamber 31 and returns it to the air atmosphere AP.
  • the plunger 72 moves backward to return to the initial state.
  • the first mold 1 and the second mold 2 are moved away from each other by the drive unit 4 for raising and lowering, and the non-mounting surface W2 of the workpiece W from the holding unit 11 (smooth surface 11a) of the first mold 1 is moved. Is peeling off.
  • the portion of the smooth surface 11a of the holding portion 11 that faces the non-mounting surface W2 of the workpiece W is elastically (expanded) and deformed from the concave shape because the pushing (pressing) of the workpiece W is released. 11a is restored to the smooth state before holding the workpiece W.
  • the subsequent unloading process as shown in FIG.
  • the resin sealing is completed.
  • the molded product M and the release sheet S are carried out from the sealed chamber 31 to the external space O by the transport mechanism.
  • the molded product M and the release sheet S are separated in the sealed chamber 31 or in the external space O.
  • the resin sealing apparatus A which concerns on 2nd embodiment of this invention is demonstrated based on FIG.
  • the uncured resin R is supplied inside the cavity 21 with the plate-like spacer P interposed therebetween, and is clamped in the same manner as in the first embodiment described above.
  • the configuration for manufacturing the molded product M that is molded is different from that of the first embodiment described above, and other configurations are the same as those of the first embodiment.
  • a plurality of types of spacers P having different thicknesses are prepared, and a spacer P having a thickness suitable for the thickness of the molded product M is used. Therefore, in the second embodiment, in the initial state shown in FIG.
  • the spacer P and the release sheet S are set so as to overlap with the inner bottom surface of the cavity 21, and the uncured resin is placed on the release sheet S. R is supplied. Thereafter, the operation of the second embodiment is controlled in the same manner as in FIGS. 3A, 3B, 5A, and 5B of the first embodiment described above.
  • FIG. 8 as a specific example of the spacer P, one spacer P is set inside the cavity 21 in the initial state. In place of this, although not shown, it is also possible to set a plurality of spacers P in combination.
  • the sheet-like thermosetting resin R1 as the uncured resin R can be replaced with the powdery or granular thermosetting resin R2 shown in FIG.
  • the work W is held by the holding portion 11 of the first mold 1. Accordingly, the smooth surface 11a of the holding portion 11 is elastically deformed into a concave shape along the non-mounting surface W2 of the workpiece W, and the smooth surface 11a and the non-mounting surface W2 are in close contact with each other.
  • the pressure inside the sealed chamber 31 is reduced to a reduced pressure atmosphere DP having a predetermined degree of vacuum by the pressure adjusting unit 5, the uncured resin R in the cavity 21 is foamed to generate gas and fine resin components.
  • the mounting surface W1 of the workpiece W and the semiconductor element C are immersed in the uncured resin R by the driving unit 4.
  • the foaming gas and the fine resin component do not enter between the smooth surface 11a of the holding unit 11 and the non-mounting surface W2 of the work W.
  • the uncured resin R smoothly enters the entire gap C2 excluding the mounting surface W1 of the workpiece W and the connection member C1 of the semiconductor element C, and even a narrow gap C2 of about several tens of um is sufficient.
  • the uncured resin R spreads over.
  • the molded product M is formed by curing the uncured resin R.
  • the foaming gas and the fine resin component (the fine resin component mixed in the foaming gas) from entering between the two while holding the workpiece W by the holding portion 11 of the first mold 1.
  • the resin foaming gas and fine resin components that are generated by the decompression are not accompanied by the decompression compared to the conventional one in which the adsorption fixing part (breathable member) on the upper mold surface and the second film easily enter.
  • the non-mounting surface W2 of the workpiece W is stuck to the smooth surface 11a of the holding portion 11 and is not solidified.
  • the molded product M in which the resin component does not adhere to the non-mounting surface W2 of the workpiece W can be manufactured stably and smoothly. For this reason, it is possible to realize a package sealed with a resin with high accuracy and to improve the quality. Further, since it is not necessary to frequently remove and clean the resin that has entered and solidified into the gaps, continuous operation is possible and the operating rate can be improved.
  • the holding part 11 of the first mold 1 includes a holding chuck 12 that detachably holds the work W, and a pressing part 13 that moves and presses the non-mounting surface W2 of the work W toward the holding chuck 12. It is preferable to set the pressing force of the workpiece W by the pressing portion 13 so that a portion of the smooth surface 11a of the holding portion 11 that is in pressure contact with the non-mounting surface W2 of the workpiece W is partially compressed and deformed. In this case, the portion of the holding portion 11 (smooth surface 11a) of the first mold 1 that is in pressure contact with the non-mounting surface W2 is partially compressed and deformed by the pressing portion 13 of the holding portion 11 and held.
  • the smooth surface 11a of the part 11 and the non-mounting surface W2 of the workpiece W are in close contact with each other, and no gap for the uncured resin R to enter between them is generated. Therefore, it is possible to prevent the foaming gas and the fine resin component (the fine resin component mixed in the foaming gas) from adhering to and permeating the holding chuck 12 of the workpiece W. As a result, the holding chuck 12 does not change with time, can be used stably over a long period of time, and the operating rate does not decrease.
  • the molding plate 11p which becomes the holding part 11 is detachably attached to the base surface 11o of the first molding die 1, and the smooth surface 11a is provided on the surface side of the molding plate 11p.
  • the holding part 11 and the smooth surface 11a can be attached to and detached from the first mold 1.
  • the replacement operation of the smooth surface 11a can be completed in a shorter time than the case where the entire first mold 1 needs to be removed and replaced, and the molding operation by the resin sealing device A can be resumed.
  • the plate-like member that becomes the smooth surface 11a is made of a material having a high releasability with the uncured resin R, there is no damage at the time of taking out the molded product M after molding, and after molding, Since the cured product of the uncured resin R adhering to the plate-like member that becomes the smooth surface 11a can be easily removed, cleaning is also simplified. Furthermore, when the plate-like member that becomes the smooth surface 11a is detachably attached to the base surface 11o of the first mold 1 by sticking with an adhesive sheet, the replacement work of the plate-like member that becomes the smooth surface 11a is performed.
  • the first mold 1 is an upper mold disposed on the mold substrate side
  • the second mold 2 is the resin side of the mold.
  • the present invention is not limited to this, and the first mold 1 is a lower mold disposed on the resin side of molding, and the second mold 2 is disposed on the substrate side of molding. It may be an upper mold.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'objectif de la présente invention est d'empêcher l'entrée d'un gaz moussant et d'un composant résine fine dans un espace entre une pièce à travailler et une partie de maintien d'une première matrice de moulage, tandis que la pièce à travailler est maintenue par la partie de maintien de la première matrice de moulage. La présente invention comprend : une première matrice de moulage pourvue d'une partie de maintien pour une pièce à travailler avec des éléments semi-conducteurs montés sur celle-ci ; une deuxième matrice de moulage qui est disposée face à une surface de positionnement de la pièce à travailler maintenue sur la partie de maintien de la première matrice de moulage, les éléments semi-conducteurs étant montés sur ladite surface de positionnement qui est pourvue d'une cavité par laquelle est fournie une résine non durcie ; une chambre fermée qui peut être ouverte et fermée, et qui est formée entre la première matrice de moulage et la deuxième matrice de moulage ; une unité d'entraînement qui provoque le déplacement de la première matrice de moulage et/ou de la deuxième matrice de moulage relativement l'une vers l'autre dans la direction dans laquelle la première matrice de moulage et la deuxième matrice de moulage se font face ; une unité de réglage de pression qui refoule ou fournit de l'air entre la chambre fermée et un espace extérieur, pour régler la pression interne entre l'atmosphère ambiante et une atmosphère à pression réduite ayant un niveau de vide prédéterminé ; et une unité de commande qui actionne et commande l'unité d'entraînement et l'unité de réglage de pression. La partie de maintien de la première matrice de moulage est pourvue d'une surface lisse qui fait face à une surface de non-positionnement de la pièce à travailler au niveau du côté opposé à la surface de positionnement. La surface lisse comprend un matériau qui peut se déformer élastiquement, et qui se déforme élastiquement en une forme en creux le long de la surface de non-positionnement, tandis que la surface de non-positionnement de la pièce à travailler est dans un état maintenu par la surface lisse. L'unité de commande met en œuvre une commande de sorte que la surface de positionnement de la pièce à travailler et les éléments semi-conducteurs soient immergés dans la résine non durcie dans la cavité par l'unité d'entraînement tandis que la pression de la chambre fermée est dans un état réduit ayant été réduit par l'unité de réglage de pression, et un article moulé est formé en durcissant la résine non durcie.
PCT/JP2018/004121 2017-02-08 2018-02-07 Dispositif d'étanchéité à la résine et procédé de création d'étanchéité à la résine WO2018147305A1 (fr)

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US12044962B2 (en) * 2019-04-19 2024-07-23 Canon Kabushiki Kaisha Forming apparatus, forming method, and article manufacturing method
JP7203715B2 (ja) * 2019-12-06 2023-01-13 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
CN110904737B (zh) * 2019-12-20 2025-03-04 绍兴科恩士纸管有限公司 一种纸管生产设备及其生产方法
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JP2001024014A (ja) * 1999-07-05 2001-01-26 Hitachi Ltd モールド装置およびそれを用いた半導体装置の製造方法
JP2016022672A (ja) * 2014-07-22 2016-02-08 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2016192503A (ja) * 2015-03-31 2016-11-10 株式会社巴川製紙所 半導体装置製造用工程シート

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