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WO2018145678A1 - Carte de circuit imprimé pour moteur electrique, procédé de fabrication d'une carte de circuit imprimé pour moteur électrique et moteur électrique - Google Patents

Carte de circuit imprimé pour moteur electrique, procédé de fabrication d'une carte de circuit imprimé pour moteur électrique et moteur électrique Download PDF

Info

Publication number
WO2018145678A1
WO2018145678A1 PCT/DE2017/101074 DE2017101074W WO2018145678A1 WO 2018145678 A1 WO2018145678 A1 WO 2018145678A1 DE 2017101074 W DE2017101074 W DE 2017101074W WO 2018145678 A1 WO2018145678 A1 WO 2018145678A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
coil
layer
dielectric layer
Prior art date
Application number
PCT/DE2017/101074
Other languages
German (de)
English (en)
Inventor
Jörg KEGELER
Original Assignee
Schaeffler Technologies AG & Co. KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schaeffler Technologies AG & Co. KG filed Critical Schaeffler Technologies AG & Co. KG
Priority to EP17829593.7A priority Critical patent/EP3581003A1/fr
Publication of WO2018145678A1 publication Critical patent/WO2018145678A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K15/00—Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/04—Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of windings prior to their mounting into the machines
    • H02K15/0407—Manufacturing of windings by etching, printing or stamping the complete coils
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
    • H02K3/26—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Definitions

  • Printed circuit board for an electric motor method for producing a printed circuit board for an electric motor and electric motor
  • the invention relates to a printed circuit board for an electric motor, with a coil which is formed from at least one spirally extending within a layer of the printed circuit board conductor track. Furthermore, the invention relates to an electric motor with such a printed circuit board and a method for producing such a printed circuit board.
  • Such printed circuit boards can be used in electric motors which have one or more coils integrated in a printed circuit board.
  • electric motors are also referred to as printed circuit board motors or printed circuit board (PCB) motors and can be designed as a rotary motor or as a linear motor.
  • PCB printed circuit board
  • a printed circuit board for an electric motor of the aforementioned type is known for example from DE 10 2008 062 575 A1.
  • This circuit board has a spirally extending conductor track, which is provided within a layer of the printed circuit board and thus forms an ironless, compact and weight-saving coil.
  • a cooling surface is arranged within the spiral-shaped conductor track, which is electrically isolated from the spirally extending conductor track.
  • Electric motors with such printed circuit boards have proven themselves in practice. However, it has turned out to be disadvantageous that the force which can be provided by such electric motors is limited. Based on such a prior art, it is an object of the invention to provide a printed circuit board for an electric motor, which is suitable for applications with high power requirements.
  • a printed circuit board for an electric motor comprising a coil which is formed from at least one spiral path running inside a layer of the printed circuit board, and a coil core made from a ferromagnetic or ferrimagnetic material which extends in one direction which is arranged perpendicular to the layer, wherein the coil core is arranged completely inside the printed circuit board and is electrically insulated from the surroundings of the printed circuit board.
  • the coil core of a ferromagnetic or ferrimagnetic material of the magnetic flux generated by the coil can be bundled and thereby the magnetic flux density can be increased.
  • increasing the magnetic flux density causes the magnetic force to increase.
  • the electric motor can provide a higher force or torque.
  • the arrangement of the bobbin completely within the circuit board allows a compact design of the electric motor. Since the coil core, whose material can be electrically conductive, is electrically insulated from the environment, the electrical insulation of the coil core relative to the coil can be smaller than would be the case with a coil core which is not electrically insulated from the environment. The conductor track of the coil can thereby be arranged close to the coil core, whereby the efficiency of the coil and thus also of the electric motor increases.
  • the bobbin may be formed of a ferromagnetic material having iron, cobalt or nickel.
  • the material of the spool core may be a ferromagnetic alloy or a ferrite.
  • the bobbin may have sheets and / or pressed powder material.
  • the coil core preferably has a soft magnetic compound (SMC) material.
  • the circuit board has a plurality of coils, which are formed from at least one spirally extending within a layer of the circuit board trace, and a plurality of cores of a ferromagnetic or ferrimagnetic material extending in a direction perpendicular to the position is arranged, wherein the coil cores are arranged completely within the circuit board and electrically insulated from the environment of the circuit board.
  • the coils formed in the printed circuit board can be excited independently of each other during operation of the electric motor.
  • the coil cores are arranged separately from each other within the circuit board, whereby magnetically separated teeth of an electric motor can be formed.
  • a structurally advantageous embodiment provides that the coil is designed such that in the interior of the coil, a magnetic field can be generated, which is aligned perpendicular to a plane of the circuit board.
  • the printed circuit board has a first dielectric layer, in particular a first dielectric cover layer, and / or a second dielectric layer dielectric layer, in particular a second dielectric cover layer, over which the coil core is insulated from the surroundings of the printed circuit board.
  • the first and / or the second dielectric layer can prevent unwanted touching of the coil core in the sense of basic insulation and offer protection against electric shock.
  • the coil core preferably extends in a direction that is perpendicular to the first dielectric layer and / or the second dielectric layer.
  • the first and / or second dielectric layer are thus preferably arranged parallel to the at least one layer in which the coil is formed.
  • the circuit board has an insulating region for insulating the coil core relative to the coil of a dielectric material which is arranged between the coil core and the conductor track of the coil, wherein the first dielectric layer and / or the second dielectric layer has a larger breakdown voltage and / or a greater insulation resistance than the insulating region.
  • the first dielectric layer and / or the second dielectric layer has a larger breakdown voltage and / or a greater insulation resistance than the insulating region.
  • the insulating region and the first dielectric layer and the second dielectric layer are formed of the same dielectric material and a first thickness of the insulating region is less than a second thickness of the first dielectric layer and less than a third Thickness of the second dielectric layer.
  • the insulating region may be formed of a different dielectric material than the first dielectric layer and the second dielectric layer, wherein the first thickness of the insulating region is greater than the second thickness of the first dielectric layer and greater than the third thickness of the second dielectric Layer.
  • the first dielectric layer and / or the second dielectric layer is formed from an FR4 material, preferably from a FR4 material with a thermal conductivity of at least 0.5 W / (mK), particularly preferably from an FR4 material with a thermal conductivity of at least 1 W / (mK).
  • FR4 material preferably from a FR4 material with a thermal conductivity of at least 0.5 W / (mK), particularly preferably from an FR4 material with a thermal conductivity of at least 1 W / (mK).
  • FR4 material with a thermal conductivity of at least 0.5 W / (mK), in particular of at least 1 W / (mK), has proven to be particularly suitable for assisting the dissipation of the heat and preventing undesired temperature-induced failure of the coil ,
  • the printed circuit board comprises a recess which penetrates the first dielectric layer and / or the second dielectric layer.
  • the conductor track of the coil can be electrically contacted without affecting the electrical insulation of the coil core relative to the environment.
  • an electrically conductive material can be introduced into the recess.
  • a connector in the recess.
  • the recess can be formed as a deep groove or a deep hole.
  • the printed circuit board preferably has at least one thermo-via of electrically conductive material which extends in a direction which is perpendicular to the electrically conductive layers and which is electrically insulated from the coil and / or the coil core.
  • the thermal via extends from the first dielectric layer through the interior of the printed circuit board to the second dielectric layer, so that the dissipation of heat from the interior of the printed circuit board is improved. The transfer of heat from the thermal via to the environment may then be through the first and / or second dielectric layers.
  • the circuit board on a first part of the circuit board and a second part of printed circuit board, which are interconnected, in particular glued, are.
  • an outer layer of the first partial printed circuit board can be connected to an outer layer of the second partial printed circuit board.
  • the first partial printed circuit board preferably has the first dielectric cover layer on an opposite side of the second partial printed circuit board, and the second partial printed circuit board has the second dielectric cover layer on an opposite side from the first partial printed circuit board.
  • an electric motor in particular a rotary motor or a linear motor, which has a printed circuit board as described above.
  • a method for producing a printed circuit board for an electric motor is further proposed, which comprises the following method steps:
  • the production of the printed circuit board preferably takes place in such a way that first of all a total printed circuit board, which is also referred to as a utility, is produced, which comprises a plurality of printed circuit boards.
  • the production of this total printed circuit board preferably comprises the abovementioned process steps for producing a printed circuit board.
  • the overall printed circuit board can then be singulated into individual printed circuit boards, for example by a separating device, in particular a milling device, a cutting device or a punching device.
  • the electrical insulation of the coil core relative to the environment of the circuit board comprises a cover layer which completely covers a surface of the circuit board, wherein a recess, in particular a deep milling or deep hole, is produced by the cover layer.
  • a contacting of the conductor track of the coil can then take place through the recess, for example, by introducing into the recess an electrically conductive material or a plug connector.
  • the electrical insulation of the coil core relative to the surroundings of the circuit board comprises a cover layer which completely covers a surface of the overall circuit board, wherein a recess, in particular a deep milling or deep hole, is produced by the cover layer.
  • the separation of the total printed circuit board to individual printed circuit boards can take place.
  • 1 shows a printed circuit board according to a first embodiment of the invention in a horizontal sectional view along a plane parallel to the plate plane of the circuit board cutting plane.
  • 2 shows a circuit board according to a second exemplary embodiment of the invention in a schematic, vertical sectional view along a cutting plane oriented perpendicular to the plane of the printed circuit board;
  • FIG. 3 shows a printed circuit board according to a third exemplary embodiment of the invention in a vertical sectional view along a cutting plane oriented perpendicular to the plate plane of the printed circuit board;
  • FIG. 4 shows a printed circuit board according to a fourth exemplary embodiment of the invention in a vertical sectional illustration along a sectional plane oriented perpendicular to the plate plane of the printed circuit board.
  • the cutting plane runs parallel to the plane of the board 1 through an inner layer of the printed circuit board 1.
  • the inner layer of the printed circuit board 1 has a plurality of interconnects 3, which are spirally formed, so that a plurality of coils 2 are formed within this layer.
  • a magnetic field can be generated, which is perpendicular to the plane of the board 1 - here the cutting plane - aligned.
  • the magnetic field has its maximum in the middle of the respective spiral formed by the conductor 3.
  • the conductor track 3 is formed from a metallic material, preferably from a copper-containing material, particularly preferably from copper.
  • the conductor 3 is surrounded by a dielectric material 5, which electrically isolates the individual sections of the spiral conductor 3 against each other.
  • the dielectric material 5 is preferably an FR4 material.
  • the printed circuit board 1 has further layers.
  • the printed circuit board 1 is a multi-layer printed circuit board, which is also referred to as a multi-layer board.
  • the circuit board 1 may have four, eight, ten, twelve, fourteen or more layers, wherein in each layer tracks are arranged.
  • the interconnects of the other layers preferably also have a spiral-shaped structure, so that coils are also formed in these layers.
  • the tracks of each adjacent layers are connected to each other via so-called vias, electrically conductive connections perpendicular to the plane of the plate.
  • vias 6 are provided, which connect the strip conductors 3 to the strip conductors of the adjacent layers, so that coils 2 are formed which extend in a direction perpendicular to the plate plane.
  • the printed circuit board 1 also has a plurality of thermal vias 7, which improve the dissipation of heat from the interior of the printed circuit board 1 and are described in more detail below in connection with FIG.
  • recesses 8 are provided in the form of through holes.
  • each spool core 4 extends in a direction which is perpendicular to the layers of the printed circuit board 1.
  • the spool core 4 is formed from sheets and / or layers of pressed powder material.
  • the material of the spool core 4 is iron, a ferromagnetic alloy or a ferrite.
  • the coil core 4 is provided in each case within the spiral-shaped conductor 3, which forms a coil 2. The coil core 4 bundles the magnetic flux generated by the coil 2 and strengthens the magnetic flux density.
  • the coil cores 4 are completely provided within the printed circuit board 1 and electrically insulated from the environment of the printed circuit board 1.
  • the insulation of the coil cores 4 takes place via a first dielectric layer, which is arranged parallel to the layers of the printed circuit board 1 is, for example, a dielectric cover layer, the circuit board 1.
  • the respective coil core 4 may be isolated on a first surface of the circuit board 1 from the environment.
  • the printed circuit board 1 has a second dielectric layer, which is likewise arranged parallel to the layers of the printed circuit board 1.
  • the coil cores 4 are arranged inside the printed circuit board 1 between the first and the second dielectric layer. As such, each spool core 4 is isolated from the environment by the first dielectric layer on a first surface of the circuit board 1 and by the second dielectric layer on a second surface opposite to the first surface.
  • the first and second dielectric layers are formed of FR4 material.
  • the thermal conductivity of the FR4 material is preferably at least 0.5 W / (mK), particularly preferably at least 1 W / (mK), so that the ohmic heat loss arising during operation of the coil is improved by the first and second dielectric layer. leads derived.
  • the first and second dielectric layers provide base isolation of the spool core 4 from the environment of the circuit board.
  • the arrangement of the coil cores 4 completely within the printed circuit board 1 not only allows a compact configuration of the electric motor, but also makes it possible to design the insulation provided in the interior of the printed circuit board between the respective coil core 4 and the associated coil 2 to be weaker and thus to improve the performance of the Spool 2 and the electric motor in which the circuit board 1 is used to increase.
  • FIG. 2 shows a second embodiment of a printed circuit board 1 according to the invention for an electric motor.
  • a plurality of separate coil cores 4 have a ferromagnetic or ferrimagnetic material.
  • a first dielectric On a first surface of the printed circuit board 1, which is referred to below as the top, is a first dielectric
  • a second dielectric layer 10 is arranged on a second surface of the printed circuit board 1 opposite the first surface, referred to below as the underside.
  • the coil core 4 is thus arranged inside the printed circuit board 1 between the first dielectric layer 9 and the second dielectric layer 10.
  • the first te dielectric layer 9 forms a cover layer on the upper side of the printed circuit board 1 and the second dielectric layer 10 forms a cover layer on the underside of the printed circuit board first
  • the illustration in FIG. 2 also shows a layer of the printed circuit board 1, which has a spiral-shaped conductor track 3.
  • a layer of the printed circuit board 1 which has a spiral-shaped conductor track 3.
  • further layers with spiral-shaped conductor track 3 can be present, which are electrically connected to the conductor track 3 of the illustrated position.
  • an insulating region 11 of the layer is provided for electrical insulation of the conductor 3 with respect to the spool core 4.
  • the insulating region 11 is formed of a dielectric material, for example of an FR4 material.
  • the material of the insulating region 1 1 and / or the dimensioning of the insulating region 1 1 is selected such that the first dielectric layer 9 and the second dielectric layer 10 have a greater breakdown voltage and / or a greater insulation resistance than the insulating region.
  • the base insulation of coil and coil core can be made possible with respect to the environment.
  • the insulation between the conductor 3 of the coil 2 and the coil core must only meet the lower requirements of a functional insulation.
  • the insulating region 11 and the first dielectric layer 9 and the second dielectric layer 10 are formed from the same dielectric material and a first thickness D1 of the insulating region 11 is less than a second thickness D2 of the first dielectric layer 9 and less than a third thickness D3 of the second dielectric layer 10.
  • the insulating region 11 is formed of a different dielectric material than the first dielectric layer 9 and the second dielectric layer 10, the first thickness D1 of the insulating region 1 1 is greater than the second thickness D2 of the first dielectric layer 9 and greater than the third thickness D3 of the second dielectric layer 10.
  • the first thickness D1 of the insulating region in the range of 200 ⁇ to 300 ⁇ lie and the second thickness D2 of the first dielectric layer 9 and the third thickness D3 of the second dielectric layer 10 may be in the range of 110 ⁇ to 190 ⁇ , preferably in the range of 140 ⁇ to 160 ⁇ , particularly preferably at 150 ⁇ lie.
  • FIG. 3 shows a detail of a printed circuit board 1 according to a third exemplary embodiment of the invention in a sectional view along a cutting plane oriented perpendicular to the plane of the printed circuit board 1.
  • the printed circuit board 1 has a plurality of layers, wherein in the layers a plurality of coils, not shown, are provided, which are formed from at least one spirally extending within a layer of the printed circuit board trace.
  • the circuit board has a plurality of coil cores made of a ferromagnetic or ferrimagnetic material, which extend in a direction which is perpendicular to the electrically conductive layers, wherein the coil cores arranged completely within the circuit board 1 and electrically insulated from the environment of the circuit board 1 are.
  • a first dielectric layer 9 and a second dielectric layer 10 are provided in the printed circuit board 1.
  • thermal vias 7 are also provided, one of which can be seen in FIG.
  • the thermal via 7 is made of electrically conductive material that extends in a direction that is perpendicular to the electrically conductive layers and that is electrically insulated from the coil and / or the coil core.
  • the production of the printed circuit board 1 shown in FIGS. 1, 2 and 3 can take place by a method in which initially a coil 2 is produced, which is formed from at least one conductor 3 extending spirally within a layer of the printed circuit board 1.
  • the coil 2 may extend over a plurality of layers of the printed circuit board 1, wherein the interconnects of adjacent layers are connected to each other via vias.
  • a receptacle for the spool core 4 is introduced into the printed circuit board.
  • the introduction of the recording can be done for example by milling.
  • the receptacle extends perpendicular to the position with the coil 2 and is arranged within the spiral course of the conductor 3 of the respective coil.
  • a spool core 4 is produced, which is dimensioned such that it can be fully absorbed in the receptacle.
  • This may for example be formed as a package of a plurality of sheets or as a molded body of a pressed powder material, in particular as a shaped body, which is formed of a plurality of layers of pressed powder material.
  • the bobbin 4 is finally introduced into the receptacle in the circuit board. Finally, an electrical insulation of the coil core relative to the environment of the circuit board is generated. When the insulation is produced, for example in the form of the first dielectric layer 9 and / or the second dielectric layer 10, the receptacle is preferably sealed from the environment. 4, a fourth embodiment of a guide plate 1 according to the invention is shown.
  • This printed circuit board 1 has a first partial printed circuit board 12 and a second partial printed circuit board 13 which are connected to one another, in particular adhesively bonded.
  • an outer layer 14 of the first partial printed circuit board 12 is connected to an outer layer 15 of the second partial printed circuit board 13, for example glued.
  • the first partial printed circuit board 12 On the side of the first partial printed circuit board 12, which faces the interconnected outer layers 14, 15 of the partial printed circuit boards 12, 13, the first partial printed circuit board 12 has a first dielectric covering layer 9.
  • the second partial printed circuit board 13 On the side of the second partial printed circuit board 13, which faces the interconnected outer layers 14, 15 of the partial printed circuit boards 12, 13, the second partial printed circuit board 13 has a second dielectric covering layer 10.
  • the circuit board 1 has spirally running within a layer of the circuit board 1 running tracks 3, which form a coil.
  • a coil core 4 made of a ferromagnetic or ferrimagnetic material is provided, which is arranged perpendicular to the layers or to the dielectric cover layers 9, 10.
  • the coil core 4 lies within the printed circuit board 1 formed by the first partial printed circuit board 12 and the second partial printed circuit board 13 and is insulated from the environment by the first and second dielectric covering layers 9, 10.
  • the above-described printed circuit boards 1 for an electric motor each have a coil 2 formed of at least one conductor 3 extending spirally within a layer of the circuit board 1, and a coil core 4 made of a ferromagnetic or ferrimagnetic material extending in a direction is arranged perpendicular to the layer, wherein the coil core 4 is disposed completely within the circuit board 1 and electrically insulated from the environment of the circuit board 1.
  • the printed circuit boards 1 described can be used in an electric motor, in particular a rotary motor or a linear motor. LIST OF REFERENCE NUMBERS

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Windings For Motors And Generators (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une carte de circuit imprimé pour moteur électrique comprenant une bobine (2) formée d'au moins une piste conductrice (3) s'étendant en spirale à l'intérieur d'une couche de la carte de circuit imprimé (1). L'invention est caractérisée par un noyau de bobine (4) en matériau ferromagnétique ou ferrimagnétique qui s'étend dans une direction perpendiculaire à la couche. Le noyau de bobine (4) est disposé complètement à l'intérieur de la carte de circuit imprimé (1) et est isolé électriquement de l'environnement de la carte de circuit imprimé (1). L'invention concerne en outre un procédé de fabrication d'une carte de circuit imprimé (1) destinée à un moteur électrique. Le procédé comprend les étapes suivantes : - réaliser une bobine (2) formée d'au moins une piste conductrice (3) s'étendant en spirale à l'intérieur d'une couche de la carte de circuit imprimé (1), - réaliser un noyau de bobine (4) en un matériau ferromagnétique qui s'étend dans une direction perpendiculaire à la couche, - disposer le noyau de bobine (4) entièrement à l'intérieur de la carte de circuit imprimé (1), - réaliser une isolation électrique du noyau de bobine (4) par rapport à l'environnement de la carte de circuit imprimé (1).
PCT/DE2017/101074 2017-02-07 2017-12-14 Carte de circuit imprimé pour moteur electrique, procédé de fabrication d'une carte de circuit imprimé pour moteur électrique et moteur électrique WO2018145678A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP17829593.7A EP3581003A1 (fr) 2017-02-07 2017-12-14 Carte de circuit imprimé pour moteur electrique, procédé de fabrication d'une carte de circuit imprimé pour moteur électrique et moteur électrique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017102344.5 2017-02-07
DE102017102344.5A DE102017102344B4 (de) 2017-02-07 2017-02-07 Leiterplatte für einen Elektromotor, Verfahren zur Herstellung einer Leiterplatte für einen Elektromotor und Elektromotor

Publications (1)

Publication Number Publication Date
WO2018145678A1 true WO2018145678A1 (fr) 2018-08-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2017/101074 WO2018145678A1 (fr) 2017-02-07 2017-12-14 Carte de circuit imprimé pour moteur electrique, procédé de fabrication d'une carte de circuit imprimé pour moteur électrique et moteur électrique

Country Status (3)

Country Link
EP (1) EP3581003A1 (fr)
DE (1) DE102017102344B4 (fr)
WO (1) WO2018145678A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111564941A (zh) * 2020-06-15 2020-08-21 中车株洲电机有限公司 一种直线电机长定子电缆绕组端部弯形装置及其方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021114131A1 (de) 2021-06-01 2022-12-01 Schaeffler Technologies AG & Co. KG Stator für eine Axialflussmaschine und Axialflussmaschine
DE102022102652A1 (de) 2022-02-04 2023-08-10 Schaeffler Technologies AG & Co. KG Elektromotor mit Leiterplattenwicklung

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