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WO2018000767A1 - Procédé et système pour commander la température d'un moteur - Google Patents

Procédé et système pour commander la température d'un moteur Download PDF

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Publication number
WO2018000767A1
WO2018000767A1 PCT/CN2016/111019 CN2016111019W WO2018000767A1 WO 2018000767 A1 WO2018000767 A1 WO 2018000767A1 CN 2016111019 W CN2016111019 W CN 2016111019W WO 2018000767 A1 WO2018000767 A1 WO 2018000767A1
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WO
WIPO (PCT)
Prior art keywords
temperature
engine
semiconductor refrigeration
heat dissipation
preset
Prior art date
Application number
PCT/CN2016/111019
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English (en)
Chinese (zh)
Inventor
刘均
刘新
宋朝忠
欧阳张鹏
Original Assignee
深圳市元征科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 深圳市元征科技股份有限公司 filed Critical 深圳市元征科技股份有限公司
Publication of WO2018000767A1 publication Critical patent/WO2018000767A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P9/00—Cooling having pertinent characteristics not provided for in, or of interest apart from, groups F01P1/00 - F01P7/00
    • F01P9/06—Cooling having pertinent characteristics not provided for in, or of interest apart from, groups F01P1/00 - F01P7/00 by use of refrigerating apparatus, e.g. of compressor or absorber type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P2037/00—Controlling

Definitions

  • the invention relates to the technical field of new energy application, in particular to a method and a system for controlling engine temperature.
  • An engine is a machine that converts a certain type of energy into mechanical energy. Its function is to convert the chemical energy of liquid or gas combustion into heat by combustion, and then convert the heat energy into mechanical energy through expansion and externally output power, so that the automobile and the aircraft And the ship can operate normally.
  • a large amount of heat is generated in the engine work, which not only affects the working efficiency of the engine, but also, if the engine is operated in a high temperature environment for a long time, it is easy to age, thereby reducing the service life of the engine.
  • a motor vehicle generally uses a water-cooled type to dissipate heat from the engine.
  • the water-cooled heat-dissipating system is composed of a water pump, a radiator, a fan, a thermostat, and a water jacket, and uses the circulation of the cooling water to heat the high-temperature parts. Dissipating to the atmosphere through the radiator to maintain the normal operating temperature of the engine not only increases the heat dissipation cost of the engine, but also causes a large amount of waste of resources.
  • the main object of the present invention is to provide a method and system for controlling engine temperature, which aims to solve the problem that a complex heat dissipation system is formed by a plurality of heat dissipating devices to dissipate heat from the engine and dissipate excess heat to the atmosphere.
  • the present invention provides a method of controlling an engine temperature, wherein an outer surface of the engine is provided with a semiconductor refrigeration assembly, and the method for controlling the temperature of the engine includes the following steps:
  • the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.
  • the temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation duration and/or a preset number of semiconductor refrigeration and cooling fins, and the temperature control mode pair of the semiconductor refrigeration component corresponding to the matched preset temperature interval is used.
  • the steps of the engine performing a heat dissipation operation include:
  • the heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
  • the step of performing the heat dissipation operation by using the matching heat dissipation duration corresponding to the preset temperature interval and/or the number of the cooling fins in the semiconductor refrigeration component includes:
  • the present invention also provides a method for controlling engine temperature, wherein an outer surface of the engine is provided with a semiconductor refrigeration assembly, and the method for controlling the temperature of the engine includes:
  • the engine is subjected to a heat dissipation operation using a temperature control mode of the semiconductor refrigeration unit corresponding to the matched preset temperature interval.
  • the step of performing the heat dissipation operation of the engine by using the temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval is performed:
  • the step of performing the heat dissipation operation on the engine by using the temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval further includes:
  • the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.
  • the temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation duration and/or a preset number of semiconductor refrigeration and cooling fins, and the temperature control mode pair of the semiconductor refrigeration component corresponding to the matched preset temperature interval is used.
  • the steps of the engine performing a heat dissipation operation include:
  • the heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
  • the step of performing the heat dissipation operation by using the matching heat dissipation duration corresponding to the preset temperature interval and/or the number of the cooling fins in the semiconductor refrigeration component includes:
  • the present invention also provides a control system for an engine temperature
  • the outer surface of the engine is provided with a semiconductor refrigeration assembly
  • the control system for the engine temperature includes:
  • a first determining module configured to acquire a current temperature of the engine, and determine whether the current temperature is greater than a preset temperature threshold
  • a second determining module configured to determine a preset temperature interval that matches a current temperature of the engine when the current temperature is greater than a preset temperature threshold
  • the first heat dissipation module is configured to perform a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.
  • the engine temperature control system further comprises:
  • connection module configured to conduct a direct connection between the semiconductor refrigeration component and the battery, to transfer power generated by the semiconductor refrigeration component to a battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component will absorb heat Convert to power.
  • the engine temperature control system further comprises:
  • the second heat dissipation module is configured to perform heat dissipation operation on the engine according to a temperature control mode corresponding to a preset temperature range with the highest temperature when the current temperature is greater than a temperature of all the preset temperature intervals, and perform an alarm operation.
  • the temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation time and/or a preset number of semiconductor refrigeration and cooling fins, and the first heat dissipation module is further configured to:
  • the heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
  • the first heat dissipation module is further configured to:
  • the invention determines whether the current temperature is greater than a preset temperature threshold by acquiring a current temperature of the engine, and determines a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than a preset temperature threshold, and adopts a matching preset temperature interval corresponding to
  • the temperature control mode of the semiconductor refrigeration unit performs heat dissipation operation on the engine. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation.
  • FIG. 1 is a schematic flow chart of a first embodiment of a method for controlling engine temperature according to the present invention
  • FIG. 2 is a schematic flow chart of a second embodiment of a method for controlling engine temperature according to the present invention.
  • FIG. 3 is a schematic flow chart of a third embodiment of a method for controlling engine temperature according to the present invention.
  • FIG. 4 is a schematic flow chart of a fourth embodiment of a method for controlling engine temperature according to the present invention.
  • FIG. 5 is a schematic flowchart of a refinement step of step S13 in the fourth embodiment shown in FIG. 4 according to the present invention.
  • Figure 6 is a schematic diagram of the functional modules of the first embodiment of the engine temperature control system of the present invention.
  • Figure 7 is a schematic diagram of functional modules of a second embodiment of the engine temperature control system of the present invention.
  • Figure 8 is a schematic diagram of functional modules of a third embodiment of the engine temperature control system of the present invention.
  • the present invention provides a method of controlling engine temperature.
  • FIG. 1 there is shown a flow chart of a first embodiment of a method for controlling engine temperature according to the present invention.
  • the method for controlling the engine temperature includes:
  • Step S10 obtaining a current temperature of the engine, and determining whether the current temperature is greater than a preset temperature threshold
  • the preset temperature threshold may be a normal temperature of 25 ° C, or may be a temperature that ensures the normal operation of the engine.
  • Step S20 determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than the preset temperature threshold
  • a plurality of preset temperature intervals are preset in the device, for example, 25 ° C ⁇ T1 ⁇ 50 ° C, 50 ° C ⁇ T1 ⁇ 80 ° C and 80 ° C ⁇ T1 ⁇ 100 ° C.
  • the current temperature value of the engine is compared with each temperature in the preset temperature interval to determine a preset temperature interval that the current temperature of the engine matches.
  • Step S30 performing heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.
  • a temperature control mode corresponding to one semiconductor refrigeration component is set in the device in advance, and after determining a preset temperature interval matched by the current temperature of the engine, and further preset from the device
  • the preset temperature range matched with the current temperature is selected to correspond to the temperature control mode of the semiconductor refrigeration component
  • the engine is subjected to a heat dissipation operation according to the temperature control mode of the semiconductor refrigeration component.
  • the outer surface of the engine is bonded with a plurality of semiconductor refrigerating sheets.
  • the cooling principle of the semiconductor refrigerating sheet is to attach the cold end of the semiconductor refrigerating sheet to the outside of the engine, and the hot end and the temperature difference semiconductor sheet power generating sheet in the semiconductor refrigerating unit are performed.
  • the cold end of the semiconductor refrigerating sheet absorbs excess heat generated by the engine, and the hot end of the semiconductor refrigerating sheet exotherms to perform a heat dissipating operation on the engine.
  • the number of the semiconductor refrigerating sheets depends on the actual conditions of the engine, and the number of the semiconductor refrigerating sheets is not limited in this embodiment.
  • the different temperature control modes of the semiconductor refrigeration components correspond to different preset temperature intervals to achieve heat dissipation operation for different current temperatures of the engine.
  • the temperature control mode of the specific semiconductor refrigeration component of the device is matched as shown in Table 1.
  • Preset temperature interval Temperature control mode of semiconductor refrigeration components 25°C ⁇ T1 ⁇ 50°C First temperature control mode 50 ° C ⁇ T1 ⁇ 80 ° C Second temperature control mode 80°C ⁇ T1 ⁇ 100°C Third temperature control mode
  • the first temperature control mode can be understood as a semiconductor refrigeration chip that is turned on by 1/3, the voltage applied to the semiconductor refrigeration chip is 3V, and the heat dissipation time of the engine is 2 minutes;
  • the second temperature control mode can be understood.
  • the voltage applied to the semiconductor refrigerating sheet is 6V and the heat dissipation time of the engine is 5 minutes;
  • the third temperature control mode can be understood as turning on all the semiconductor refrigerating sheets, plus The voltage on the semiconductor cooling sheet was 12 V and the heat dissipation time for the engine was 10 minutes.
  • the detection is performed.
  • obtaining the current temperature of the engine is 80 ° C
  • determining that the current temperature of the engine matches the preset temperature interval is 50 ° C ⁇ T1 ⁇ 80 ° C
  • the heat dissipation time set in the control mode is 5 minutes
  • the current temperature of the engine is detected to be 45 ° C, and the engine is subjected to heat dissipation operation according to the first temperature control mode in which the current temperature of the engine is 45 ° C, and so on. I will not repeat them here.
  • the current temperature of the engine is obtained to determine whether the current temperature is greater than a preset temperature threshold.
  • the preset temperature interval matched by the current temperature of the engine is determined, and the matched preset temperature interval is adopted.
  • the temperature control mode of the corresponding semiconductor refrigeration component performs a heat dissipation operation on the engine. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation.
  • FIG. 2 a schematic flowchart of a second embodiment of a method for controlling engine temperature according to the present invention is proposed.
  • the engine temperature is simultaneously performed while the S30 is being executed.
  • the control methods include:
  • step S40 the semiconductor refrigeration component is directly connected to the battery to transfer the power generated by the semiconductor refrigeration component to the battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component converts the absorbed heat into a quantity of electricity.
  • each of the temperature difference semiconductor wafers in the conductor refrigeration assembly is associated with each of the semiconductor refrigeration sheets in the conductor refrigeration assembly, wherein the end of the temperature difference semiconductor wafer associated with the hot end of the semiconductor refrigeration sheet absorbs the semiconductor refrigeration sheet.
  • the heat released from the hot end forms a temperature difference from the cold end of the temperature difference semiconductor piece, and the temperature difference semiconductor piece converts the absorbed heat into a quantity according to the Seebeck effect, and turns on the temperature difference semiconductor piece in the semiconductor refrigeration component and the device
  • the battery is connected to transfer the amount of electricity generated by the temperature difference semiconductor chip to the battery connected to the semiconductor refrigeration unit.
  • the present invention does not limit the low temperature holding mode of the cold end of the temperature difference semiconductor.
  • the first temperature control mode of the semiconductor refrigeration component when the first temperature control mode of the semiconductor refrigeration component is activated, 1/3 of the semiconductor refrigeration chip is turned on in the first temperature control mode, and the heat absorbed when the temperature difference semiconductor chip is energized
  • the temperature difference semiconductor piece that is consistent with the number and position of the semiconductor cooling fins of the first temperature control mode may be turned on; when the second temperature control mode or the third temperature control mode of the semiconductor refrigeration component is activated.
  • the manner in which the number and position of the temperature difference semiconductor chips are turned on the manner in which the number and position of the temperature difference semiconductor chips are turned on in the first temperature control mode can be referred to, and details are not described herein again.
  • the present embodiment directly connects the semiconductor refrigeration unit to the battery to transfer the amount of electricity generated by the semiconductor refrigeration unit to the battery to which the semiconductor refrigeration unit is connected, wherein the semiconductor refrigeration unit converts the absorbed heat into a quantity of electricity. Due to the association between the hot end of the temperature difference semiconductor wafer in the semiconductor refrigeration module and the hot end of the semiconductor refrigeration chip, the temperature difference semiconductor wafer recovers the waste heat of the engine absorbed, and converts the absorbed heat into a current according to the Seebeck effect. Thereby realizing resource reuse and avoiding waste of resources.
  • FIG. 3 a schematic flowchart of a third embodiment of a method for controlling engine temperature according to the present invention is proposed.
  • the method for controlling the engine temperature includes :
  • step S50 when the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.
  • the engine is dissipated according to the temperature control mode corresponding to the highest temperature preset temperature interval, for example, according to the pre-position of 100 ° C
  • the third temperature control mode corresponding to the temperature interval is used to perform heat dissipation operation on the engine, and at the same time, an alarm command is sent to the alarm system in the device to perform an alarm until the current temperature of the acquired engine matches the corresponding preset temperature interval.
  • the semiconductor refrigeration component is stopped to perform a heat dissipation operation on the engine, thereby The engine can work at room temperature.
  • the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed, by lowering the temperature of the transmitter.
  • FIG. 4 is a schematic flowchart of a fourth embodiment of a method for controlling engine temperature according to the present invention.
  • a method for controlling engine temperature includes:
  • Step S11 obtaining a current temperature of the engine, and determining whether the current temperature is greater than a preset temperature threshold
  • Step S12 determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than the preset temperature threshold
  • Step S11 and step S12 in the third embodiment of the present invention are similar to those described in step S10 and step S20 in the first embodiment shown in FIG. 1, and details are not described herein again.
  • step S13 the heat dissipation operation is performed by using the heat dissipation duration corresponding to the matched preset temperature interval and/or the number of the cooling sheets in the semiconductor refrigeration unit.
  • the temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval matched with the temperature is adopted, and the temperature control mode of the semiconductor refrigeration component is corresponding to The heat dissipation time and/or the number of cooling fins in the semiconductor refrigeration unit heats the engine.
  • the current temperature of the engine is detected to be 75 ° C, and the second temperature control corresponding to the preset temperature interval of 50 ° C ⁇ T1 ⁇ 80 ° C matched with the 75 ° C is adopted.
  • the mode performs a heat dissipation operation on the engine, and the number of the cooling sheets in the semiconductor refrigeration unit corresponding to the second temperature control mode and the heat dissipation time corresponding to the second temperature control mode are used to dissipate the engine during the heat dissipation process;
  • the current temperature of the engine is detected to be 75 ° C, and the second temperature control mode corresponding to the predetermined temperature interval of 50 ° C ⁇ T1 ⁇ 80 ° C matched with the 75 ° C is used.
  • the engine performs a heat dissipation operation, and the heat dissipation operation is performed on the engine by using the number of the cooling fins in the semiconductor refrigeration unit corresponding to the second temperature control mode during the heat dissipation process, but the heat dissipation duration corresponding to the second temperature control mode is not limited.
  • the current temperature of the engine is obtained to determine whether the current temperature is greater than a preset temperature threshold.
  • the preset temperature interval matched by the current temperature of the engine is determined, and the matched preset temperature interval is adopted.
  • the corresponding heat dissipation time and/or the number of the cooling fins in the semiconductor refrigeration unit perform heat dissipation operation to avoid excessive absorption of heat of the engine or insufficient heat dissipation, thereby causing an operational burden on the engine.
  • FIG. 5 is a schematic flowchart of the refinement step of step S13 in the fourth embodiment of the present invention.
  • the refinement step of step S13 includes:
  • Step S131 obtaining a number of cooling pieces corresponding to the matched preset temperature interval
  • the number of semiconductor cooling fins corresponding to each temperature control mode of the semiconductor refrigeration component is different, and the positions of the semiconductor cooling fins corresponding to the respective temperature control modes are also different.
  • the design of the position of the semiconductor refrigerating sheet is related to the structure of the engine, and the position of the semiconductor refrigerating sheet of the present invention is not limited.
  • Step S132 powering on the cooling sheet corresponding to the number of cooling pieces obtained in the semiconductor refrigeration unit, and controlling the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece, and then powering down to perform heat dissipation operation on the engine.
  • the semiconductor refrigerating sheet When the number of semiconductor refrigerating sheets corresponding to the temperature control mode of the semiconductor refrigeration unit matched with the preset temperature interval is obtained, the semiconductor refrigerating sheet is powered on, the heat dissipation operation is performed on the engine, and the heat dissipation operation is performed to the temperature of the semiconductor refrigeration unit.
  • the semiconductor cooling chip When the preset heat dissipation duration corresponding to the control mode is controlled, the semiconductor cooling chip is controlled to be powered down.
  • the cooling piece corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration component is powered on, and the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece is controlled. Power down to dissipate heat from the engine, allowing the engine to operate stably at normal operating temperatures.
  • the invention further provides a control system for engine temperature.
  • Figure 6 is a schematic diagram of the functional modules of the first embodiment of the engine temperature control system of the present invention.
  • the engine temperature control system includes: a first determining module 10, a second determining module 20, and a first heat dissipation module 30.
  • the first determining module 10 is configured to acquire a current temperature of the engine, and determine whether the current temperature is greater than a preset temperature threshold;
  • the first determining module 10 acquires the current temperature of the engine every preset time interval, and determines whether the current temperature of the engine is greater than the pre-predetermined time.
  • the preset temperature threshold may be a normal temperature of 25 ° C, or may be a temperature that ensures the normal operation of the engine.
  • the second determining module 20 is configured to determine a preset temperature interval that matches a current temperature of the engine when the current temperature is greater than the preset temperature threshold;
  • a plurality of preset temperature intervals are preset in the device, for example, 25 ° C ⁇ T1 ⁇ 50 ° C, 50 ° C ⁇ T1 ⁇ 80 ° C and 80 ° C ⁇ T1 ⁇ 100 ° C.
  • the second determining module 20 compares the current temperature value of the engine with each temperature in the preset temperature interval to determine the current temperature of the engine.
  • the preset temperature range that is matched.
  • the first heat dissipation module 30 is configured to perform heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.
  • the temperature control mode corresponding to one semiconductor refrigeration component is set in the device in advance, and after the second determining module 20 determines the preset temperature interval that the current temperature of the engine matches, the first heat dissipation module 30. From a temperature control mode of the semiconductor refrigeration component preset in the device, selecting a preset temperature interval matched to the current temperature corresponds to a temperature control mode of the semiconductor refrigeration component, and the engine is controlled according to a temperature control mode of the semiconductor refrigeration component Perform heat dissipation operations.
  • the outer surface of the engine is bonded with a plurality of semiconductor refrigerating sheets.
  • the cooling principle of the semiconductor refrigerating sheet is to attach the cold end of the semiconductor refrigerating sheet to the outside of the engine, and the hot end and the temperature difference semiconductor sheet power generating sheet in the semiconductor refrigerating unit are performed.
  • the cold end of the semiconductor refrigerating sheet absorbs excess heat generated by the engine, and the hot end of the semiconductor refrigerating sheet exotherms to perform a heat dissipating operation on the engine.
  • the number of the semiconductor refrigerating sheets depends on the actual conditions of the engine, and the number of the semiconductor refrigerating sheets is not limited in this embodiment.
  • the different temperature control modes of the semiconductor refrigeration components correspond to different preset temperature intervals to achieve heat dissipation operation for different current temperatures of the engine.
  • the temperature control mode of the specific semiconductor refrigeration component of the device is matched as shown in Table 1.
  • Preset temperature interval Temperature control mode of semiconductor refrigeration components 25°C ⁇ T1 ⁇ 50°C First temperature control mode 50 ° C ⁇ T1 ⁇ 80 ° C Second temperature control mode 80°C ⁇ T1 ⁇ 100°C Third temperature control mode
  • the first temperature control mode can be understood as a semiconductor refrigeration chip that is turned on by 1/3, the voltage applied to the semiconductor refrigeration chip is 3V, and the heat dissipation time of the engine is 2 minutes;
  • the second temperature control mode can be understood.
  • the voltage applied to the semiconductor refrigerating sheet is 6V and the heat dissipation time of the engine is 5 minutes;
  • the third temperature control mode can be understood as turning on all the semiconductor refrigerating sheets, plus The voltage on the semiconductor cooling sheet was 12 V and the heat dissipation time for the engine was 10 minutes.
  • the detection is performed.
  • obtaining the current temperature of the engine is 80 ° C
  • determining that the current temperature of the engine matches the preset temperature interval is 50 ° C ⁇ T1 ⁇ 80 ° C
  • the heat dissipation time set in the control mode is 5 minutes
  • the current temperature of the engine is detected to be 45 ° C, and the engine is subjected to heat dissipation operation according to the first temperature control mode in which the current temperature of the engine is 45 ° C, and so on. I will not repeat them here.
  • the first heat dissipation module 30 is further configured to perform a heat dissipation operation by using a matching heat dissipation time period corresponding to the preset temperature interval and/or the number of the cooling sheets in the semiconductor refrigeration component.
  • the first heat dissipation module 30 when it is detected that the current temperature of the engine is a certain temperature, the first heat dissipation module 30 adopts a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval matched by the temperature, and passes through the semiconductor refrigeration component.
  • the temperature control mode corresponds to the heat dissipation time and/or the number of cooling fins in the semiconductor refrigeration unit to perform heat dissipation operation on the engine. For example, when the engine is running at a lower temperature ambient temperature, the current temperature of the engine is detected to be 75 ° C, and the second temperature control corresponding to the preset temperature interval of 50 ° C ⁇ T1 ⁇ 80 ° C matched with the 75 ° C is adopted.
  • the mode performs a heat dissipation operation on the engine, and the number of the cooling sheets in the semiconductor refrigeration unit corresponding to the second temperature control mode and the heat dissipation time corresponding to the second temperature control mode are used to dissipate the engine during the heat dissipation process;
  • the current temperature of the engine is detected to be 75 ° C, and the second temperature control mode corresponding to the predetermined temperature interval of 50 ° C ⁇ T1 ⁇ 80 ° C matched with the 75 ° C is used.
  • the engine performs a heat dissipation operation, and the heat dissipation operation is performed on the engine by using the number of the cooling fins in the semiconductor refrigeration unit corresponding to the second temperature control mode during the heat dissipation process, but the heat dissipation duration corresponding to the second temperature control mode is not limited.
  • the first heat dissipation module 30 is further configured to obtain a number of cooling pieces corresponding to the matched preset temperature interval;
  • the first heat dissipation module 30 acquires a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval, thereby acquiring the temperature of the semiconductor refrigeration component.
  • the number of semiconductor cooling fins that need to be turned on in the control mode is not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, the first heat dissipation module 30 acquires a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval, thereby acquiring the temperature of the semiconductor refrigeration component. The number of semiconductor cooling fins that need to be turned on in the control mode.
  • the number of semiconductor cooling fins corresponding to each temperature control mode of the semiconductor refrigeration component is different, and the positions of the semiconductor cooling fins corresponding to the respective temperature control modes are also different.
  • the design of the position of the semiconductor refrigerating sheet is related to the structure of the engine, and the position of the semiconductor refrigerating sheet of the present invention is not limited.
  • the first heat dissipation module 30 is further configured to power on the cooling sheet corresponding to the number of cooling pieces obtained in the semiconductor refrigeration component, and control the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece, and then power down to the engine. Perform heat dissipation operations.
  • the first heat dissipation module 30 When acquiring the number of semiconductor refrigeration sheets corresponding to the temperature control mode of the semiconductor refrigeration component that matches the preset temperature interval, the first heat dissipation module 30 powers up the semiconductor refrigeration chip, performs a heat dissipation operation on the engine, and performs the heat dissipation operation to the When the temperature control mode of the semiconductor refrigeration component corresponds to a preset heat dissipation time, the semiconductor cooling chip is controlled to be powered down.
  • the first determining module 10 obtains the current temperature of the engine, and determines whether the current temperature is greater than a preset temperature threshold.
  • the second determining module 20 determines a preset that matches the current temperature of the engine.
  • the first heat dissipation module 30 performs a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation.
  • the engine temperature control system further includes: a connection module 40.
  • the connection module 40 is configured to conduct a direct connection between the semiconductor refrigeration component and the battery to transfer the power generated by the semiconductor refrigeration component to the battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component converts the absorbed heat into a quantity of electricity.
  • each of the temperature difference semiconductor wafers in the conductor refrigeration assembly is associated with each of the semiconductor refrigeration sheets in the conductor refrigeration assembly, wherein the end of the temperature difference semiconductor wafer associated with the hot end of the semiconductor refrigeration sheet absorbs the semiconductor refrigeration sheet.
  • the heat released from the hot end forms a temperature difference from the cold end of the temperature difference semiconductor piece, and the temperature difference semiconductor piece converts the absorbed heat into a quantity according to the Seebeck effect, and the connection module 40 turns on the temperature difference semiconductor piece in the semiconductor refrigeration component and the
  • the connection of the battery in the device is to transfer the amount of electricity generated by the temperature difference semiconductor chip to the battery connected to the semiconductor refrigeration unit.
  • the present invention does not limit the low temperature holding mode of the cold end of the temperature difference semiconductor.
  • the first temperature control mode of the semiconductor refrigeration component when the first temperature control mode of the semiconductor refrigeration component is activated, 1/3 of the semiconductor refrigeration chip is turned on in the first temperature control mode, and the heat absorbed when the temperature difference semiconductor chip is energized
  • the temperature difference semiconductor piece that is consistent with the number and position of the semiconductor cooling fins of the first temperature control mode may be turned on; when the second temperature control mode or the third temperature control mode of the semiconductor refrigeration component is activated.
  • the manner in which the number and position of the temperature difference semiconductor chips are turned on the manner in which the number and position of the temperature difference semiconductor chips are turned on in the first temperature control mode can be referred to, and details are not described herein again.
  • the present embodiment directly connects the semiconductor refrigeration unit to the battery to transfer the amount of electricity generated by the semiconductor refrigeration unit to the battery to which the semiconductor refrigeration unit is connected, wherein the semiconductor refrigeration unit converts the absorbed heat into a quantity of electricity. Due to the association between the hot end of the temperature difference semiconductor wafer in the semiconductor refrigeration module and the hot end of the semiconductor refrigeration chip, the temperature difference semiconductor wafer recovers the waste heat of the engine absorbed, and converts the absorbed heat into a current according to the Seebeck effect. Thereby realizing resource reuse and avoiding waste of resources.
  • the engine temperature control system further includes: a second heat dissipation module 50.
  • the second heat dissipation module 50 is configured to perform a heat dissipation operation on the engine according to a temperature control mode corresponding to a preset temperature range with the highest temperature when the current temperature is greater than the temperature of all the preset temperature intervals, and perform an alarm operation.
  • the second heat dissipation module 50 When the current temperature of the engine is greater than all the preset temperature intervals, such as greater than 100 ° C, the second heat dissipation module 50 performs a heat dissipation operation on the engine according to a temperature control mode corresponding to the highest temperature preset temperature interval, for example, according to The third temperature control mode corresponding to the preset temperature range where 100 °C is located performs heat dissipation operation on the engine, and at the same time, sends an alarm command to the alarm system in the device to perform an alarm until the current temperature of the obtained engine matches the corresponding pre- Set the temperature range.
  • the semiconductor refrigeration component is stopped to perform a heat dissipation operation on the engine, thereby The engine can work at room temperature.
  • the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed, by lowering the temperature of the transmitter.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

Un procédé et un système pour commander la température d'un moteur. Un ensemble de réfrigération à semi-conducteurs est disposé sur une surface externe du moteur. Le procédé consiste à : acquérir une température courante du moteur, et déterminer si la température actuelle est supérieure à une valeur seuil de température prédéterminée (S10); lorsque la température actuelle est supérieure à la valeur seuil de température prédéterminée, à déterminer un intervalle de température prédéterminé correspondant à la température courante du moteur (S20); et à effectuer une opération de dissipation de chaleur sur le moteur dans un mode de commande de température de l'ensemble de réfrigération à semi-conducteurs correspondant à l'intervalle de température prédéterminé correspondant (S30) Le procédé de commande permet non seulement de réduire le coût de la dissipation de la chaleur, mais également d'améliorer la dissipation de chaleur d'un moteur plus affiné, ce qui permet d'assurer le fonctionnement du moteur à une température normale.
PCT/CN2016/111019 2016-06-30 2016-12-20 Procédé et système pour commander la température d'un moteur WO2018000767A1 (fr)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111928521A (zh) * 2020-08-28 2020-11-13 珠海格力电器股份有限公司 采用半导体制冷的散热装置及其控制方法
CN115050710A (zh) * 2022-08-15 2022-09-13 深圳市威兆半导体股份有限公司 一种变频器mosfet的散热装置及散热方法
CN116447001A (zh) * 2023-06-12 2023-07-18 山东莱柴动力有限公司 一种柴油机的水冷组件

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106150663A (zh) * 2016-06-30 2016-11-23 深圳市元征科技股份有限公司 发动机温度的控制方法及系统
CN107415643B (zh) * 2017-04-24 2018-07-06 朱若东 废热钳制控制方法与自源式废热钳温器、车辆
CN113325892A (zh) * 2021-05-06 2021-08-31 珠海格力电器股份有限公司 发热设备控制方法、控制装置、高温杀菌设备、服务器

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200997575Y (zh) * 2006-12-28 2007-12-26 东风汽车集团股份有限公司 利用汽车水箱的水温实现温差发电装置
CN101554837A (zh) * 2008-12-31 2009-10-14 上海市延安中学 一种循环利用能源的公交车
CN102891635A (zh) * 2012-10-15 2013-01-23 无锡翱天电气科技有限公司 一种车用温差发电装置
CN203626942U (zh) * 2013-12-30 2014-06-04 佳木斯大学 用于发动机的冷却装置
CN104410328A (zh) * 2014-10-28 2015-03-11 上海翌先信息科技有限公司 低温差发电散热新技术
US20150135689A1 (en) * 2012-05-08 2015-05-21 Eberspächer Exhaust Technology GmbH & Co., KG Heat exchanger having a thermoelectric generator
CN104863692A (zh) * 2015-06-01 2015-08-26 中国人民解放军装甲兵技术学院 一种发动机的制冷片传热系统及控制方法
CN204663649U (zh) * 2015-06-01 2015-09-23 中国人民解放军装甲兵技术学院 一种发动机的制冷片传热系统
CN105150964A (zh) * 2015-09-17 2015-12-16 郭若昊 光热互补储能及电子制冷的汽车能源综合利用系统
CN105977574A (zh) * 2016-06-30 2016-09-28 深圳市元征科技股份有限公司 电池温度的控制方法及系统
CN106150663A (zh) * 2016-06-30 2016-11-23 深圳市元征科技股份有限公司 发动机温度的控制方法及系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102820273B (zh) * 2011-06-08 2016-02-24 北京中科美伦科技有限公司 用于ccd探测器的制冷系统
CN102522609B (zh) * 2012-01-11 2015-05-20 东莞市钜大电子有限公司 一种锂电池保温装置及其控制方法
CN203194078U (zh) * 2013-04-03 2013-09-11 联合汽车电子有限公司 散热器
SE539027C2 (sv) * 2013-04-25 2017-03-21 Scania Cv Ab Förfarande och system för styrning av ett kylsystem
KR101550981B1 (ko) * 2013-11-21 2015-09-07 현대자동차주식회사 가변분리냉각시스템 모드별 제어 방법

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200997575Y (zh) * 2006-12-28 2007-12-26 东风汽车集团股份有限公司 利用汽车水箱的水温实现温差发电装置
CN101554837A (zh) * 2008-12-31 2009-10-14 上海市延安中学 一种循环利用能源的公交车
US20150135689A1 (en) * 2012-05-08 2015-05-21 Eberspächer Exhaust Technology GmbH & Co., KG Heat exchanger having a thermoelectric generator
CN102891635A (zh) * 2012-10-15 2013-01-23 无锡翱天电气科技有限公司 一种车用温差发电装置
CN203626942U (zh) * 2013-12-30 2014-06-04 佳木斯大学 用于发动机的冷却装置
CN104410328A (zh) * 2014-10-28 2015-03-11 上海翌先信息科技有限公司 低温差发电散热新技术
CN104863692A (zh) * 2015-06-01 2015-08-26 中国人民解放军装甲兵技术学院 一种发动机的制冷片传热系统及控制方法
CN204663649U (zh) * 2015-06-01 2015-09-23 中国人民解放军装甲兵技术学院 一种发动机的制冷片传热系统
CN105150964A (zh) * 2015-09-17 2015-12-16 郭若昊 光热互补储能及电子制冷的汽车能源综合利用系统
CN105977574A (zh) * 2016-06-30 2016-09-28 深圳市元征科技股份有限公司 电池温度的控制方法及系统
CN106150663A (zh) * 2016-06-30 2016-11-23 深圳市元征科技股份有限公司 发动机温度的控制方法及系统

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111928521A (zh) * 2020-08-28 2020-11-13 珠海格力电器股份有限公司 采用半导体制冷的散热装置及其控制方法
CN115050710A (zh) * 2022-08-15 2022-09-13 深圳市威兆半导体股份有限公司 一种变频器mosfet的散热装置及散热方法
CN116447001A (zh) * 2023-06-12 2023-07-18 山东莱柴动力有限公司 一种柴油机的水冷组件
CN116447001B (zh) * 2023-06-12 2023-08-22 山东莱柴动力有限公司 一种柴油机的水冷组件

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