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WO2017199035A1 - Pince électro-adhésive - Google Patents

Pince électro-adhésive Download PDF

Info

Publication number
WO2017199035A1
WO2017199035A1 PCT/GB2017/051387 GB2017051387W WO2017199035A1 WO 2017199035 A1 WO2017199035 A1 WO 2017199035A1 GB 2017051387 W GB2017051387 W GB 2017051387W WO 2017199035 A1 WO2017199035 A1 WO 2017199035A1
Authority
WO
WIPO (PCT)
Prior art keywords
gripper
electrodes
substrate
dielectric layer
barium titanate
Prior art date
Application number
PCT/GB2017/051387
Other languages
English (en)
Inventor
David MANBY
Original Assignee
Aylesbury Automation Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aylesbury Automation Limited filed Critical Aylesbury Automation Limited
Publication of WO2017199035A1 publication Critical patent/WO2017199035A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0085—Gripping heads and other end effectors with means for applying an electrostatic force on the object to be gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Definitions

  • This invention relates to an electroadhesive gripper, and a method of manufacture thereof.
  • Electroadhesive grippers are known in the art. They comprise a pair of electrodes across which is applied either an alternating current (AC) or direct current (DC) drive signal. They generate an electric field. This generates an electrostatic charge in any material that may be nearby, especially where that material is non-conducting. The electrostatic charge generated is then attracted to the electrodes. Thus, the electroadhesive effect can be used to provide an astrictive, non-permeating gripper.
  • AC alternating current
  • DC direct current
  • the gripper avoids the problems of various other gripping techniques, such as impactive grippers (such as jaws or clamps) which may interfere with the structure of a delicate product, ingressive grippers which can puncture the structure of a product and contiguitive grippers which make use of chemical or thermal bonds and so may damage the product or leave residues thereon.
  • impactive grippers such as jaws or clamps
  • ingressive grippers which can puncture the structure of a product
  • contiguitive grippers which make use of chemical or thermal bonds and so may damage the product or leave residues thereon.
  • the electromagnet unlike another common astrictive gripper, it does not require that the material gripped to be magnetic.
  • Electroadhesive grippers have been used in wall-climbing robots such as shown in US Patent no 8 125 758. Sheet and hand-shaped electroadhesive grippers have been disclosed in the International (PCT) patent application published as WO201 1/100028.
  • an electroadhesive gripper comprising:
  • the dielectric layer comprises barium titanate .
  • barium titanate BaTi0 3
  • the use of barium titanate (BaTi0 3 ) as a dielectric has been found to surprisingly improve the performance of the gripper; it has been found that the adhesive force generated by the gripper increases by 10- 15% by using this dielectric. It can also reduce the residual charge held in the gripper after an applied voltage has been removed (thus improving the speed with which the gripper releases) .
  • the dielectric layer will comprise a carrier for the barium titanate .
  • the carrier may comprise a resin, such as a cyanoresin or another form of support material.
  • the dielectric layer may contain barium titanate and the carrier in a volume ratio of between 3 : 5 and 10: 5, preferably between 4: 5 and 9: 5, particularly between 7.5 : 5 to 8.5 : 5.
  • the ratio of barium titanate to carrier may be between 4: 1 and 12: 1 , or between 5 : 1 and 1 1 : 1 , or between 9: 1 and 1 1 : 1.
  • the dielectric layer may consist of the barium titanate and the carrier.
  • an electroadhesive gripper comprising:
  • a capacitive proximity sensor on the substrate • a capacitive proximity sensor on the substrate.
  • the capacitive proximity sensor will comprise at least two sensor electrodes on the substrate.
  • the capacitive proximity sensor may also comprise a detection circuit arranged to determine changes in capacitance across the sensor electrodes.
  • the detection circuit may be arranged to apply an electrical signal across the sensor electrodes, such as a periodic signal, and to determine a resonant frequency of a circuit comprising the sensor electrodes.
  • the gripper electrodes and the sensing electrodes will have been deposited upon the substrate using the same technique, for example printing using a metal- containing ink.
  • the gripper may be in accordance with the first aspect of the invention. The following features can relate to either of the preceding aspects of the invention.
  • the dielectric layer will be on the substrate, and each gripper electrode will be on the dielectric layer.
  • the gripper electrodes may be on the substrate, and the dielectric layer may be on the gripper electrodes.
  • At least one (if not all) of the gripper electrodes and/or the sensor electrodes may comprise metallic silver. At least one (if not all) of the gripper electrodes and/or the sensor electrodes may have been printed using a silver bearing material.
  • the gripper may comprise a drive circuit, which is electrically coupled to the gripper electrodes and is arranged to drive the gripper electrodes with a drive signal having a voltage, frequency and duration.
  • the frequency will typically be greater than zero.
  • the gripper electrodes will typically be coplanar on the substrate, and may be interdigitated, for increased performance .
  • the drive circuit may be arranged so that the drive signal is applied across the gripper electrodes, so that a potential difference is set up between the gripper electrodes, generating an electric field that acts to attract items to be gripped.
  • the substrate (and/or the further substrate) may comprise polyurethane (PU), polyethylene terephthalate (PET), polyimide (PI) or other suitable materials.
  • the substrate (and/or the further substrate) may be flexible.
  • the substrate and the further substrate may be formed of different materials, for example the substrate may comprise PU and the further substrate may comprise PET.
  • the gripper may be arranged so as to grip items on the PET surface .
  • the printing step will comprise screen printing, typically through a calendered stainless steel mesh.
  • the step of applying the dielectric layer may comprise a draw down coating.
  • each gripper electrode is printed on the substrate and then the dielectric layer is applied on top of each gripper electrode, although in an alternative, the dielectric layer is applied on the substrate before each gripper electrode is printed on top of the dielectric layer.
  • the dielectric layer may be applied using an amalgamate of a cyanoresin and barium titanate, typically dissolved in a solvent.
  • the method may comprise distributing the barium titanate through the cyanoresin using sonication.
  • the solvent may be a polar solvent, such as a ketone .
  • Figure 1 shows a schematic view of an electroadhesive gripper in accordance with a first embodiment of the invention
  • Figure 2 shows a cross section through the gripper of Figure 1 ;
  • FIG 3 shows the sensing electrodes of the capacitive proximity sensors of the gripper of Figure 1 in more detail
  • Figure 4 shows the gripper electrodes of the gripper of Figure 1 in more detail
  • Figure 5 shows an alternative set of gripper electrodes in accordance with another embodiment of the invention.
  • the electroadhesive gripper 1 has a pair of electrodes 10a, 10b, which are mutually interdigitated, in that each electrode 10a, 10b is formed as a number of parallel fingers
  • Electrodes 10a, 10b are shown schematically in Figure 1 of the accompanying drawings, the electrodes are shown in more detail in Figure 4 of the accompanying drawings. Such electrodes have been found to provide an electroadhesive gripper with a good performance .
  • the gripper is finished with a further substrate 16, this time formed of polyurethane, which seals the gripper together so as to sandwich the electrodes 10a, 10b and dielectric layer.
  • Electrical connections 1 1 are provided to each electrode . These are coupled to a control module 6, which houses a drive circuit 8 and a control circuit 7 (which may be implemented as a microprocessor running computer program instructions).
  • the drive circuit 8 is coupled to the electrical connections 1 1 , so as to provide a current signal across the electrodes 10. Typically but not exclusively voltages are in the region of 1 - 100 kilovolts ( 1 - l OOkV), alternating current.
  • the control circuit 7 controls the drive circuit and the other functions of the apparatus, so that a variable voltage within the range - l OkV to + 10kV (resolution 5V) can be applied across the electrodes.
  • the drive circuit 8 drives the electrodes 10a, 10b with the drive signal, so that an electric field is created. This attracts items that may be nearby.
  • the barium titanate in the dielectric layer we have found that the attractive force generated by the gripper increases by 10- 15% compared to if it were not used.
  • each sensor comprises a pair of electrodes 21 a, 21b, comprising each comprising a plurality of concentric part-circular circumferentially- extending interdigitated fingers, connected to a sensing circuit 22.
  • the electrodes 21a, 21b are provided on the substrate 9 (or alternatively the further substrate 16) .
  • the sensing circuit is arranged to determine the capacitance of each pair of electrodes.
  • the comb shape design is better than the circular shape for achieving the maximum electroadhesive force (maximum about 43% relative increase, tests 14 vs 10).
  • the circular shape is better than the comb shape design when the dielectric layer is not present (maximum about 36% relative increase, tests 3 vs 7).
  • Thinner pads (PI, 75 ⁇ ) are better than thicker pads (PI, 125 ⁇ ) at achieving the electroadhesive force (maximum about 30% relative increase, tests 16 vs 24) when the force was measured on the substrate PI side of the gripper.
  • a further set of electrodes were the subject of testing. In these cases, rather than being printed, the barium titanate was applied to the electrode using a painting method. In this method, a mixture of water, barium titanate granules and a domestic emulsion paint (Dulux (RTM) Primer and Undercoat) were mixed in the quantities given below:
  • samples 1 , 2 and 3 have 1 , 2 and 3 parts of BaTi03 by weight respectively, with the remainder of the samples being the same.
  • the mixture was then applied to the electrodes using a paint brush.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

Une pince électro-adhésive comprend un substrat portant une couche diélectrique et au moins deux électrodes de préhension, la couche diélectrique comprenant du titanate de baryum et/ou un capteur de proximité capacitif étant situé sur le substrat. La couche diélectrique peut comprendre un support pour le titanate de baryum, tel qu'une résine, telle qu'une cyanorésine.
PCT/GB2017/051387 2016-05-18 2017-05-18 Pince électro-adhésive WO2017199035A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1608729.8A GB2552450A (en) 2016-05-18 2016-05-18 Electroadhesive gripper
GB1608729.8 2016-05-18

Publications (1)

Publication Number Publication Date
WO2017199035A1 true WO2017199035A1 (fr) 2017-11-23

Family

ID=56320592

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2017/051387 WO2017199035A1 (fr) 2016-05-18 2017-05-18 Pince électro-adhésive

Country Status (2)

Country Link
GB (1) GB2552450A (fr)
WO (1) WO2017199035A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10852825B2 (en) 2018-09-06 2020-12-01 Microsoft Technology Licensing, Llc Selective restriction of skeletal joint motion
US10860102B2 (en) 2019-05-08 2020-12-08 Microsoft Technology Licensing, Llc Guide for supporting flexible articulating structure
US11023047B2 (en) 2018-05-01 2021-06-01 Microsoft Technology Licensing, Llc Electrostatic slide clutch with bidirectional drive circuit
US11036295B2 (en) 2016-11-23 2021-06-15 Microsoft Technology Licensing, Llc Electrostatic slide clutch
US11054905B2 (en) 2019-05-24 2021-07-06 Microsoft Technology Licensing, Llc Motion-restricting apparatus with common base electrode
US11061476B2 (en) 2019-05-24 2021-07-13 Microsoft Technology Licensing, Llc Haptic feedback apparatus
EP3975426A1 (fr) * 2020-09-28 2022-03-30 NXP USA, Inc. Capteur mutuellement capacitif pour un pavé tactile

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240083043A1 (en) * 2022-09-14 2024-03-14 The Boeing Company Electroadhesive pads, electroadhesive end effectors, and methods of producing the same
EP4530033A1 (fr) * 2023-09-28 2025-04-02 Engimotion - Engenharia Industrial Lda Bloc de préhension électro-adhésif et son procédé de fabrication

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995020838A1 (fr) * 1994-01-31 1995-08-03 Applied Materials, Inc. Mandrin electrostatique a film isolant epousant la base
WO2002011184A1 (fr) * 2000-08-02 2002-02-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Support mobile destine a une plaquette

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2865472B2 (ja) * 1992-02-20 1999-03-08 信越化学工業株式会社 静電チャック
WO1998047176A1 (fr) * 1997-04-11 1998-10-22 The Morgan Crucible Company Plc Dielectriques en ceramique composite
JPH11176920A (ja) * 1997-12-12 1999-07-02 Shin Etsu Chem Co Ltd 静電吸着装置
JP2004349665A (ja) * 2003-05-23 2004-12-09 Creative Technology:Kk 静電チャック
WO2008082978A2 (fr) * 2006-12-26 2008-07-10 Saint-Gobain Ceramics & Plastics, Inc. Mandrin électrostatique et procédé de réalisation
WO2008082977A2 (fr) * 2006-12-26 2008-07-10 Saint-Gobain Ceramics & Plastics, Inc. Mandrin électrostatique et procédé de réalisation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995020838A1 (fr) * 1994-01-31 1995-08-03 Applied Materials, Inc. Mandrin electrostatique a film isolant epousant la base
WO2002011184A1 (fr) * 2000-08-02 2002-02-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Support mobile destine a une plaquette

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11036295B2 (en) 2016-11-23 2021-06-15 Microsoft Technology Licensing, Llc Electrostatic slide clutch
US11023047B2 (en) 2018-05-01 2021-06-01 Microsoft Technology Licensing, Llc Electrostatic slide clutch with bidirectional drive circuit
US10852825B2 (en) 2018-09-06 2020-12-01 Microsoft Technology Licensing, Llc Selective restriction of skeletal joint motion
US10860102B2 (en) 2019-05-08 2020-12-08 Microsoft Technology Licensing, Llc Guide for supporting flexible articulating structure
US11054905B2 (en) 2019-05-24 2021-07-06 Microsoft Technology Licensing, Llc Motion-restricting apparatus with common base electrode
US11061476B2 (en) 2019-05-24 2021-07-13 Microsoft Technology Licensing, Llc Haptic feedback apparatus
EP3975426A1 (fr) * 2020-09-28 2022-03-30 NXP USA, Inc. Capteur mutuellement capacitif pour un pavé tactile
US11460969B2 (en) 2020-09-28 2022-10-04 Nxp Usa, Inc. Mutually capacitive sensor for a touchpad

Also Published As

Publication number Publication date
GB2552450A (en) 2018-01-31
GB201608729D0 (en) 2016-06-29

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