WO2017010293A1

WO2017010293A1 - Backing plate, sputtering target, and method for manufacturing same

Info

Publication number: WO2017010293A1
Application number: PCT/JP2016/069346
Authority: WO
Inventors: 宏司西岡; 尚也佐藤
Original assignee: 住友化学株式会社
Priority date: 2015-07-10
Filing date: 2016-06-29
Publication date: 2017-01-19
Also published as: TWI669405B; JPWO2017010293A1; JP2017193779A; JP6286088B2; JP6151870B2; CN107849688B; JP2018095971A; KR20180042214A; CN107849688A; KR102116923B1; TW201708582A

Abstract

The purpose of the present invention is to provide a method for manufacturing a backing plate whereby the thickness of a cover member can be made uniform, a backing plate in which the thickness of a cover member is uniform after manufacturing, and a sputtering target including such a backing plate. The present invention makes it possible to provide: a method for manufacturing a backing plate including joining a plate-shaped body having a groove on one side through which a fluid passes and a plate-shaped cover member disposed on the body so as to cover the groove of the body, wherein the method for manufacturing a backing plate includes fixing the body so that after the body and the cover member are joined and integrated, the difference between the maximum value and the minimum value of the height measured on a surface of the cover member is less than 0.5 mm, an interface between the body and the cover member being an upper surface, and the method for manufacturing a backing plate includes processing at least a portion of the interface by cutting; a backing plate in which the difference between the maximum value and the minimum value of the thickness of the cover member is 0.4 mm or less; and a sputtering target including such a backing plate.

Description

Backing plate, sputtering target, and manufacturing method thereof

The present invention relates to a backing plate, a sputtering target, and manufacturing methods thereof.

The backing plate is a member used for supporting the target material of the sputtering target used for sputtering and fixing the sputtering target to the sputtering apparatus. The backing plate also plays a role of radiating heat generated during sputtering.

A backing plate for a sputtering apparatus used for forming an integrated circuit (IC) has, for example, a disk shape with a maximum diameter of about 500 to 600 mm, and is made from a plate material such as a copper alloy or an aluminum alloy. It is common to be done.

In addition, a backing plate for a sputtering apparatus used for manufacturing a liquid crystal display (LCD) has, for example, a plate-like (or panel-like) shape, and is made from a plate material such as copper or a copper alloy. It is common.

Also, the target material used in the sputtering apparatus for LCD production is usually larger than that for ICs, and the amount of heat generated during sputtering is very large. Since the generated heat affects the properties of the thin film formed by sputtering, a large backing plate that can efficiently cool the target material is used. When it has a plate-like shape, the dimension in the longitudinal direction may exceed 3 m.

For example, as described in Patent Documents 1 to 3, a backing plate used for LCD production or the like is generally a flow path through which a refrigerant fluid passes for the purpose of improving heat dissipation performance and cooling performance. Is often formed. Such a channel is formed, for example, by previously forming a channel groove in the main body constituting the backing plate, and the lid member manufactured to cover the groove is engaged with the groove portion of the main body, for example. In a state, it can form by joining by methods, such as welding.

Japanese Patent No. 4852897 Japanese Patent No. 3818084 JP 2012-126965 A

As a backing plate used for LCD manufacture, a large and long plate is generally used, and since relatively hard metals such as copper and copper alloys are used, warpage and distortion are required for the manufacture. There is a problem.

Further, when forming the coolant flow path in the backing plate, if the main body and the lid member are joined by welding, there is a problem that the heat and the entire body including the lid member are distorted and bent. . In particular, when electron beam welding is used, when the electron beam is applied to the joint, a large amount of heat is added to the joint, which may cause distortion and deflection. Get higher.

In addition, in the case of electron beam welding, a ridge part generally called a bead can be formed at the joint part, but by performing the cutting and removal, a flat surface with less unevenness is formed, and a desired backing plate shape is formed. If it is going to process to, due to the above-mentioned distortion and bending, the thickness of a lid member may become uneven.

Also, recently, there is a case where friction stir welding using friction heat is used for joining the main body constituting the backing plate and the lid member. In such a case, protrusions called burrs may be formed at the joint, but if a flat surface is formed by cutting and removing it and processing is made into a desired backing plate shape, the lid member is similar to the above. The thickness may be non-uniform.

Conventionally, after joining the main body and the lid member, in order to correct the distortion generated in the joined body, correction work by a press machine and work for removing distortion by machining have been performed. However, in the past, attention has been focused on being able to be processed into a desired final shape or correcting so that no distortion remains in the finished backing plate, and maintaining the uniformity of the thickness of each member constituting the backing plate The conventional backing plate has a problem in the uniformity of the thickness of the lid member.

In the case of forming a joined body such as a backing plate, when the joining is performed by electron beam welding or friction stir welding, the joined body may be gently warped on the joining surface side. Therefore, when the main body and the lid member are joined and then processed into a backing plate of a desired size by cutting, the portion where the lid member becomes thinner or thicker than the target thickness in the range of several tens to several hundred mm Is likely to occur.

Thus, when the thickness of the lid member becomes non-uniform, the pressure of the fluid (for example, 0.2 to 0.7 MPa) injected into the flow path is applied to the non-uniform lid member during sputtering. Then, it has been found that there is a high possibility that the lid member is deformed in a thin portion of the lid member, and problems such as the lid member being bent or broken occur. In particular, a backing plate designed to have a thin component member has a high risk of deformation due to non-uniform lid thickness. For example, in a copper backing plate, the lid member thickness is designed to be 5 mm or less. When doing so, it is necessary to pay attention to the uniformity of the lid member.

In addition, such non-uniformity of the thickness of the lid member not only reduces the strength of the backing plate itself used by repeatedly bonding the target material, but also the thickness of the side on which the target material on the opposite side is pasted. It also causes non-uniformity. Usually, since the opposite surface is processed so as to be parallel to the bonding surface of the lid member, if there is a non-uniformity in the thickness of the lid member due to distortion of the main body or bending, This is because non-uniformity of thickness occurs even when the surface is processed. Since the cooling efficiency is locally different due to such thickness non-uniformity, the target material may be locally peeled in the sputtering target in which the target material is bonded by solder.

Therefore, in the present invention, a method for manufacturing a backing plate capable of making the thickness of the lid member uniform, a provision of a backing plate having a uniform thickness of the lid member after manufacture, and sputtering including such a backing plate are provided. The target is to provide a target.

In view of these problems, the present inventor, as a result of earnest research, in the manufacturing method of a backing plate using a main body having a channel groove and its lid member, the joint surface between the main body and the lid member is the upper surface. In the state where the main body is fixed so that the difference between the maximum value and the minimum value measured on the surface of the lid member is less than 0.5 mm, the joint surface is processed by cutting, so that the lid member The present inventors have found that the thickness can be made uniform and have completed the present invention.

The present invention provides the following backing plate manufacturing method and backing plate, and a sputtering target manufacturing method and sputtering target including the following backing plate, but the present invention is not limited to the following.

[1]
A method of manufacturing a backing plate comprising joining a plate-like main body having a groove through which a fluid passes on one side and a plate-like lid member disposed on the main body so as to cover the groove of the main body, After joining and integrating the main body and the lid member, the difference between the maximum value and the minimum value of the height measured on the surface of the lid member with the joint surface between the main body and the lid member as the upper surface A method of manufacturing a backing plate, comprising fixing the main body so that the thickness is less than 0.5 mm, and processing at least a part of the joint surface by cutting.
[2]
The manufacturing method according to [1], wherein the main body is mechanically fixed.
[3]
The manufacturing method according to [1] or [2], wherein the main body is fixed by a vise, a clamp, or a vacuum chuck.
[4]
The manufacturing method according to any one of [1] to [3], wherein the processing is milling.
[5]
The manufacturing method according to any one of [1] to [4], wherein the main body and the lid member are joined by electron beam welding or friction stir welding.
[6]
A backing plate comprising a plate-like main body having a groove through which a fluid passes on one side, and a plate-like lid member disposed on the main body so as to cover the groove of the main body, the main body and the lid member Is a backing plate in which the difference between the maximum value and the minimum value of the thickness of the lid member is 0.4 mm or less.
[7]
The backing plate obtained by the manufacturing method as described in said [1].
[8]
The backing plate according to [7] above, wherein a difference between the maximum value and the minimum value of the thickness of the lid member is 0.4 mm or less.
[9]
A sputtering target, wherein a target material is bonded onto the backing plate according to the above [6].
[10]
A sputtering target manufacturing method including bonding a target material to a backing plate, wherein the backing plate is manufactured by the manufacturing method according to any one of [1] to [5] above. A method for producing a sputtering target.

According to the present invention, a manufacturing method of a backing plate capable of making the thickness of the lid member uniform, and a backing plate having a uniform thickness of the lid member after manufacture, in particular, a maximum value and a minimum value of the thickness of the lid member, A backing plate having a difference of 0.4 mm or less and a sputtering target including such a backing plate can be provided.

It is a perspective view which shows typically one Embodiment of a main body (before joining). It is a perspective view showing typically one embodiment of a lid member (before joining). FIG. 2 is a cross-sectional view schematically showing a cross section at XX of the main body shown in FIG. It is the schematic which shows the manufacturing method of a backing plate typically. It is a top view from the base surface side which shows typically one Embodiment of a backing plate. It is a top view from the base surface side which shows typically one Embodiment (with a base part) of a backing plate. It is a side view which shows typically one Embodiment of a backing plate. It is a side view which shows typically one Embodiment (with a base part) of a backing plate. It is a top view from the joined surface side which shows one embodiment of a joined object typically. It is a top view from the base surface side which shows typically one Embodiment of a joined body. It is a side view showing typically one embodiment of a joined object. FIG. 9 is a cross-sectional view (a) schematically showing a cross section at AA of the joined body shown in FIG. 8 and a cross-sectional view (b) schematically showing a cross section at BB of the joined body shown in FIG. FIG. 9 is a cross-sectional view taken along the line CC of the joined body illustrated in FIG. It is a graph which shows the result (thickness of a lid member) of Example 1. It is a graph which shows the result (thickness of a lid member) of Example 2. It is a graph which shows the result (thickness of a lid member) of the comparative example 1. It is a graph which shows the result (thickness of a lid member) of comparative example 2. It is a graph which shows the result (thickness of a lid member) of Example 3.

The present invention mainly includes a main body and a lid member, and a method of manufacturing a backing plate capable of uniformly forming the thickness of the lid member, and a backing having a uniform thickness of the lid member after production. Regarding plates.

In the present invention, “the thickness of the lid member is uniform” of the backing plate means that the maximum value and the minimum value of the thickness of the lid member measured in the backing plate after manufacture, as described in detail below. Difference of 0.4 mm or less, preferably 0.35 mm to 0 mm, more preferably 0.2 mm to 0 mm. When the difference in thickness exceeds 0.4 mm, the lid member locally yields during pressurization, and deformation may remain in the lid member. Further, if the strength of the material is reduced by repeatedly using the backing plate, the amount of deformation may increase, and the lid member may be damaged. In addition, since the variation in the thickness of the main body may increase, the heat transfer efficiency changes locally, and there is a possibility that local delamination of the target material may occur in the soldered sputtering target. When the target material is peeled off, the distance between the target material and the substrate is changed at that location, which may cause a problem such as adversely affecting the properties of the thin film formed by sputtering.

The manufacturing method of the backing plate of the present invention includes, for example, a plate-like main body 1 having a groove 2 on one side thereof through which a fluid can pass, as schematically shown in FIGS. This includes joining a plate-like lid member 3 disposed on the main body 1 so as to cover (or close) the groove 2 of the main body 1 (hereinafter referred to as “step (a)”. For example, FIG. (See the step (a) shown), after the body 1 and the lid member 3 are joined and integrated (for example, see the joined body 4 of the body 1 and the lid member 3 shown in FIG. 4). The main body 1 (and as required) so that the difference between the maximum and minimum heights measured on the surface of the lid member 3 is less than 0.5 mm with the joint surface of the main body 1 and the lid member 3 as the upper surface. And fixing the lid member 3) and processing at least a part of the joint surface by cutting (hereinafter, Referred to as step (b). "For example, see step (b) shown in FIG. 4).

In the present invention, the thickness of the lid member 3 after processing by cutting can be made uniform by the above-described steps (a) and (b), specifically, the maximum value of the thickness of the lid member and The difference from the minimum value can be 0.4 mm or less.

Furthermore, in the present invention, if necessary, as a post-processing step, for example, a surface opposite to the joint surface between the main body 1 and the lid member 3 (hereinafter referred to as “pedestal on which a target material for a sputtering target can be disposed. The pedestal 5 may be formed on the “surface” in some cases. The pedestal portion 5 is a portion where a target material can be placed, and there is no particular limitation on the formation method thereof. For example, the pedestal portion 5 excludes the pedestal portion 5 on the pedestal surface by cutting, preferably milling. It can be formed by cutting a part. Moreover, there is no restriction | limiting in particular in the shape of the base part 5, a dimension, height, etc. For example, the surface of the base part 5 should just be substantially parallel with the joint surface after a process, Preferably it is parallel.

For example, FIGS. 5 and 6 schematically show an embodiment of the backing plate of the present invention, but the backing plate of the present invention is not limited to such an embodiment. 5A (plan view) and FIG. 6A (side view) schematically show an embodiment of the backing plate that does not have the pedestal portion 5, and FIG. 5B (plan view) and FIG. 6B (side view). FIG. 4 schematically shows an embodiment of the backing plate on which the pedestal portion 5 is formed.

5 (plan view from the pedestal surface side) and FIG. 6 (side view), the

backing plates

10 and 20 basically have a plate-like main body 1 (for example, FIG. 1) and a plate-like lid member 3 (see, for example, FIG. 2) disposed on the main body 1 so as to cover the groove 2 of the main body 1, and the main body 1 and the lid member 3 are It has a structure integrated by bonding.
Further, as shown in FIG. 5B (top view) and FIG. 6B (side view), a pedestal portion 5 on which a target material can be disposed may be formed on the pedestal surface of the backing plate 20.
The lid member 3 on the joint surface may be formed with a hole 6 having an arbitrary size at an arbitrary location, and enables fluid connection with the groove (or channel) 2 formed in the main body 1. . The number of holes 6 is not particularly limited.

Furthermore, a plurality of holes, preferably through holes (not shown), for enabling attachment to the sputtering apparatus may be formed in the main body of the

backing plates

10 and 20.

In the present invention, the shape of the backing plate is not particularly limited, and for example, a plate-like (or panel-like) shape as described in the plan view of FIG. 5 is preferable.

In the present invention, the size of the backing plate is not particularly limited. For example, when the backing plate has a plate-like (or panel-like) shape, the length in the longitudinal direction is, for example, 400 mm to 4000 mm, preferably 500 mm to 3500 mm, more preferably 700 mm to 3200 mm. The length in the width direction perpendicularly crossing the length in the longitudinal direction is, for example, 100 mm to 2000 mm, preferably 150 mm to 1500 mm, more preferably 200 mm to 1500 mm. The length in the longitudinal direction and the length in the width direction may be the same or different.

In the present invention, the thickness of the backing plate (that is, the maximum distance between the pedestal surface (or the pedestal surface of the pedestal part if it has a pedestal portion) and the joining surface) is, for example, 5 mm to 30 mm, preferably 7 mm. It is ˜25 mm, more preferably 10 mm to 20 mm. However, the thickness of the backing plate is not particularly limited as long as a flow path can be formed in the interior.

In the present invention, the shape of the flow path formed inside the backing plate is not particularly limited, and is not particularly limited as long as the target material arranged on the pedestal surface of the backing plate can be cooled. For example, when the flow path has a rectangular cross section as in the illustrated embodiment, the dimension in the width direction is, for example, 10 mm to 100 mm. The height dimension is, for example, 1 mm to 20 mm, preferably 3 mm to 15 mm, and more preferably 4 mm to 10 mm. In the present invention, a space formed by the groove 2 of the main body 1 and the lid member 3 in a state where the lid member 3 is disposed and joined to the upper side of the groove 2 of the main body 1 is called a flow path. The bottom surface of the groove 2 and the back surface of the lid member 3 (that is, the surface on the opposite side of the joint surface) are preferably substantially parallel, and more preferably parallel. A plurality of flow paths may be formed depending on the size of the backing plate.

Hereinafter, the manufacturing method of the present invention will be illustrated with reference to FIG. 4, and the terms and components used in the present invention will be described in detail.

As shown in FIG. 4, in the “step (a)”, the manufacturing method of the present invention includes a main body 1 made from a main body material 1 ′, and a lid member 3 made from a lid member material 3 ′. Are joined together to form a joined body 4 having a flow path therein. Thereafter, in the “step (b)”, the maximum value and the minimum value of the height measured on the surface of the lid member 3 with the joint surface of the main body 1 and the lid member 3 of the joined body 4 as the upper surface (or the upper side) The main body 1 is fixed together with the lid member 3 as necessary so that the difference is less than 0.5 mm, and at least a part, preferably the entire surface, of the joined body 4 is processed by cutting. Since the joined body 4 after processing thus obtained has a flow path through which a fluid such as cooling water can pass by joining the main body 1 and the lid member 3. Since the surface opposite to the surface has a cooling function and can function as a pedestal surface on which a target material can be arranged, it can be used as a backing plate for a sputtering target (for example, in FIG. 4). (See zygote 4 and backing plate 10 surrounded by dotted line). Furthermore, if necessary, the manufacturing method of the present invention may include a “post-processing step”, for example, to manufacture a backing plate having the base portion 5 on the base surface for placing the target material (for example, (See the backing plate 20 shown in FIGS. 4, 5B and 6B). In addition, in FIG. 4, in order to demonstrate the manufacturing method of this invention more simply, each member is shown with the perspective view which shows the shape of the cross section.

<Main body>
As shown in FIG. 4, the main body 1 can be formed by processing the material 1 ′ for the main body by a method such as cutting or grinding.

As the main body material 1 ′, it is sufficient that it is made of a conductive material, and it is preferable to use a plate-like (or panel-like) material made of a metal or an alloy thereof.

Examples of the metal include copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, tantalum, tantalum alloy, niobium, niobium alloy, and stainless steel. From the viewpoints of mechanical strength, durability, heat dissipation, etc., it is preferable to use copper. Among them, oxygen-free copper (purity of 99.96% or more, particularly from the viewpoint of high thermal conductivity and high electrical conductivity) It is preferable to use an oxygen concentration of 10 ppm or less.

For example, as shown in the perspective view of FIG. 1, the main body 1 is liquid refrigerant (for example, water, ethanol, ethylene glycol) after joining with a lid member (for example, the lid member 3 shown in FIG. 2) described in detail below. Or, a fluid 2 such as a mixture of two or more of them) has a groove 2 that can form a flow path on one side thereof.

For example, as shown in the cross-sectional view of FIG. 3, the groove 2 has a shape capable of supporting (or placing) the lid member 3 described in detail below, for example,

step portions

2 a and 2 b. Also good.
In addition, there is no restriction | limiting in particular in the shape and dimension of the groove | channel 2, and the ratio and position which occupy for the main body 1. It is preferable that the groove | channel 2 has a shape and a dimension so that the surface of the cover member 3 used as a joint surface after joining and the surface of the main body 1 used as a joint surface after joining may become flush.

Here, as shown in FIG. 4, the main body 1 having the groove 2 is made of, for example, a plate-shaped (or panel-shaped) material 1 ′ having an appropriate size, with the surface on the side serving as a pedestal surface as an upper surface, It is fixed mechanically using a vice, vacuum chuck, etc., and is chamfered by milling using, for example, a rotary tool such as a face mill or a cutter. The main body having the groove 2 by, for example, chamfering by milling using a rotary tool such as a face mill or cutter, and then by cutting using, for example, a face mill or cutter, if necessary. 1 can be produced. The formed main body 1 has a substantially constant thickness, and the pedestal surface, the surface to be the bonding surface, and the bottom surface of the groove 2 may be substantially parallel, preferably parallel. Moreover, you may process the outer peripheral surface of the main body 1 by cutting or grinding | polishing at arbitrary steps as needed.

In addition, when the material 1 ′ has no warp, distortion, twist, etc., and a horizontal surface is secured, the surface can be used as it is as a pedestal surface, and the groove 2 is formed on the opposite surface as described above. May be.

<Cover member>
The lid member 3 has a thickness of usually 2 to 6 mm, which can be disposed in the main body 1 so as to cover (or close) the groove 2 of the main body 1, for example, as shown in the perspective view of FIG. 2 and the schematic diagram of FIG. 4. It is a plate-shaped (or panel-shaped) member. For ease of installation of the lid member on the main body, the width of the lid member is larger than the width of the groove so that the lid member is placed on the stepped

portions

2a and 2b of the main body shown in the cross-sectional view of FIG. It is better, but when the thickness of the lid member is designed to be 5 mm or less, particularly 3.5 mm or less, deformation is likely to occur due to pressurization to the flow path, so the width of the lid member is the groove width + 30 mm or less, The size is preferably +20 mm or less, more preferably +15 mm or less. The thickness of the lid member may be determined as appropriate, but the effect of the present invention can be easily achieved when the thickness of the lid member is 5 mm or less, preferably 3.5 mm or less, more preferably 3 mm or less.

As the lid member material 3 ′ capable of forming the lid member 3, it is sufficient that the lid member 3 is made of a conductive material, and a plate-like (or panel-like) material made of a metal or an alloy thereof is used. It is preferable to use it.

Examples of the metal include copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, tantalum, tantalum alloy, niobium, niobium alloy, and stainless steel. From the viewpoints of mechanical strength, durability, heat dissipation, etc., it is preferable to use copper. Among them, oxygen-free copper (purity of 99.96% or more, particularly from the viewpoint of high thermal conductivity and high electrical conductivity) It is preferable to use an oxygen concentration of 10 ppm or less. Among oxygen-free coppers, it is more preferable to use oxygen-free copper having a high strength of 1 / 4H to H.

The material 3 ′ may be the same as or different from the material 1 ′, but in the present invention, the lid member 3 and the main body 1 are integrated by bonding, and the strength of the bonded portion is kept high. It is preferable that they are the same material or a material having the same composition and purity.

The lid member 3 is a mechanically fixed material 3 ′ having an appropriate size using a restraint such as a vise, for example, a band saw, a wire saw, a circular saw, a lathe, a milling machine, a band saw, a grinder, a water jet, etc. It can be formed by cutting or cutting. The formed lid member has a substantially constant thickness, and the front and back surfaces may be substantially parallel, preferably parallel. Moreover, you may process the outer peripheral surface of the cover member 3 by cutting or grinding | polishing at arbitrary steps as needed.

Furthermore, at any stage, if necessary, a hole through which fluid can pass may be formed at any location of the lid member 3 (see, for example, the hole 6 shown in FIGS. 5 and 6). . The number of holes 6 is not particularly limited. In particular, if the hole 6 is formed in the lid member 3 before joining to the main body 1, the air surrounded by the main body 1 and the lid member 3 at the time of fitting the lid member 3 into the main body 1 or at the time of joining them. It is preferable because it can be removed through the hole 6 and the occurrence of displacement at the joint can be suppressed.

<Process (a)>
Step (a) includes integrating the main body 1 and the lid member 3 by bonding.
For example, as shown in FIG. 4, the lid member 3 is disposed on the main body 1 so that the lid member 3 covers the groove 2 of the main body 1, and preferably the surface of the main body 1 and the surface of the lid member 3 are flush with each other. These members are arranged.

The joining method of the main body 1 and the lid member 3 is not particularly limited. For example, electron beam welding (EBW), friction stir welding (FSW), TIG welding, laser beam welding. , MIG welding, MAG welding and the like. Of these, electron beam welding and friction stir welding are preferred from the viewpoints of a small weld bead and small welding distortion.

In the present invention, the joined body 4 obtained by integrating the main body 1 and the lid member 3 has excellent airtightness at the joined portion. For example, even when air pressurized to 0.1 MPa to 0.8 MPa is injected into the flow path, the air does not leak and the airtightness can be maintained.

Here, as schematically shown in FIGS. 7 to 9, one embodiment of the joined body 4 is shown more specifically. FIG. 7 shows a joining surface of the joined body 4, FIG. 8 shows a pedestal surface of the joined body 4, and FIG. 9 shows a side surface of the joined body 4. 10 to 11 show a cross section of the joined body 4. FIG. More specifically, FIGS. 10A and 10B show cross sections taken along lines AA and BB in FIG. 8, respectively, and FIG. 11 shows a cross section taken along line CC in FIG. In the present invention, the joined body 4 is not limited to the illustrated embodiment.

Further, there is a case where warpage may occur in the bonded body 4 obtained by the above-described bonding. In that case (especially when the length in the longitudinal direction exceeds 2000 mm), for example, a corrector or the like is used. It is preferable to correct the bonded body 4 until the level of the warp is fixed to be grounded on a horizontal plane, preferably less than 5 mm, taking care not to deform the lid member 3. . In the present invention, the “warping” of the joined body 4 refers to the longitudinal direction or width of the joined body 4 when the joined body 4 is allowed to stand on an arbitrary horizontal plane with the pedestal surface down. If the lower edge of at least one end in the direction (width direction perpendicular to the longitudinal direction) is located away from this horizontal plane, or the lower edge of all ends is horizontal Means that only the lower central part of the joined body 4 is separated from the horizontal plane, and the maximum between the spaced edge and the lower central part and the horizontal plane. In the present invention, the distance is expressed as the magnitude of “warp”. In addition, the lower edge portion of the end portion may be wavyly separated from the horizontal plane, and even in this case, the maximum distance between the horizontal plane and the edge portion is expressed as “ Expressed as the magnitude of “warp”. In addition, since the “warp” generated in the lower central portion of the joined body 4 cannot be directly measured, the thickness of the joined body 4 is subtracted from the height of the joined body 4 measured on the surface of the lid member 3. The maximum value of the difference is expressed as the magnitude of “warp”.

For example, the warp of at least one end in the longitudinal direction (hereinafter sometimes referred to as “longitudinal warp”) is preferably less than 5 mm, more preferably less than 1 mm.

Also, the warp of at least one end in the width direction (hereinafter sometimes referred to as “the warp in the width direction”) is preferably less than 5 mm, more preferably less than 1 mm.

<Step (b)>
In the step (b), for example, the joining surface of the main body 1 and the lid member 3 of the joined body 4 is fixed as an upper surface (or upper side) on a horizontal plane (for example, see the joined body 4 shown in FIG. 4). ). When the joined body 4 is fixed on the horizontal plane, the surface on which the joined body 4 is installed (the surface that becomes the pedestal surface) is preferably arranged as close to the horizontal plane as possible. Fix later. The difference between the maximum value and the minimum value of the height measured on the surface of the lid member 3 (that is, the distance from this horizontal plane to the measurement point on the surface of the lid member 3) is less than 0.5 mm, preferably Is fixed to 0.4 mm to 0 mm, more preferably 0.3 mm to 0 mm, and if necessary, at least a part of the joint surface, preferably the entire joint surface, is processed horizontally by cutting together with the lid member 3. .

Further, when the parallelism between the joint surface and the pedestal surface can be guaranteed, the following method may be used as a method of fixing the joint body 4 in the step (b). On the above-described horizontal plane, the bonding surface between the main body 1 and the lid member 3 of the bonded body 4 is fixed as an upper surface (or upper side) so that the pedestal surface is in contact with the horizontal plane as much as possible. When the joined body 4 is fixed on the horizontal plane, the maximum value of the distance between the horizontal plane and the bottom surface of the joined body 4 (the surface on the side that becomes the base surface) is less than 0.5 mm, preferably Is preferably fixed to 0.4 mm to 0 mm, more preferably 0.3 mm to 0 mm, and then at least a part of the joining surface, preferably the entire surface, is processed horizontally by cutting as described above. .

There is no particular limitation on the method of fixing the bonded body 4, particularly the main body 1, and it is preferable to fix the bonded body dynamically using, for example, a restraint such as a vise, a clamp, or a vacuum chuck. In the case of fixing using a restraint such as a vise or a clamp, for example, a plurality of restraints are arranged in the length direction of the joined body 4 and the joined body 4 is held in a horizontal direction by pressing the side parts of the joined body. It can be fixed on a plane. The restraint tool is evenly distributed at least at three locations, ie, at both ends and the center in the length direction of the joined body 4, preferably at least 5 locations including 1/4 and 3/4 positions in the length direction. Deploy. If the difference between the maximum value and the minimum value measured on the surface of the lid member 3 is not less than 0.5 mm, after temporarily fixing with a vice so that the joined body 4 does not move, a mallet or plastic hammer The surface of the lid member 3 can be fixed in a horizontal state by hitting with, for example, a ground surface on a horizontal plane. In addition, when fixing with a vacuum chuck, for example, before joining the main body and the lid member, the pedestal surface side of the main body is cut to produce a flat surface so that the adsorption area is increased. An O-ring is arranged around the joined body so that the center is located within 30 mm from the edge, preferably 5 mm to 20 mm, and the vacuum level (gauge pressure) is -0.1 MPa with the pedestal surface side as the adsorption surface. By fixing by vacuum suction, the surface of the lid member 3 can be fixed in a horizontal state.

Further, there is no particular limitation on the position at which the height is measured on the surface of the lid member 3. For example, the measurement is preferably performed above the groove 2, and more preferably measured above the central portion of the groove 2. For example, as shown in FIG. 7, it is preferable to measure the height of the lid member 3 along the straight lines L1 and / or L2.

The height measurement method is not particularly limited, but can be measured using, for example, a height gauge, a dial gauge, or the like.

Thus, the joining is performed so that the difference between the maximum value and the minimum value measured on the surface of the lid member 3 is less than 0.5 mm, preferably 0.4 mm to 0 mm, more preferably 0.3 mm to 0 mm. After fixing the body 4, at least a part of the joining surface, preferably the entire surface, is processed horizontally by cutting, preferably horizontally processed by chamfering, so that the thickness of the lid member after processing is uniform. Can be. Preferably, the difference between the maximum value and the minimum value of the thickness of the lid member after processing can be 0.4 mm or less, preferably 0.35 mm to 0 mm, more preferably 0.3 mm to 0 mm.

In addition, the process of a joint surface will not be restrict | limited especially if a joint surface can be processed by cutting, For example, it can process by a milling process, a surface grinding process, an end mill process, a lathe process etc.

Further, in the step (b), the side surface of the joined body 4 may be processed by cutting or grinding at an arbitrary stage, for example, finishing may be applied to a mirror surface.

In the present invention, the joined body 4 obtained after the step (b) (for example, the joined body 4 surrounded by a dotted line in FIG. 4 or the joined body 4 shown in FIGS. 7 to 11) can be used as it is as a backing plate. (For example, the backing plate 10 shown in FIGS. 4, 5A, and 6A).

Furthermore, in the manufacturing method of the present invention, the bonded body 4 may be subjected to the following post-processing steps as necessary.

<Post-processing process>
Examples of the post-processing step include the following steps.
(1) Processing by cutting the pedestal surface (2) Finishing processing of the joint surface (3) Finishing processing of the pedestal surface (4) Drilling processing (5) Warping correction

The post-treatment step is preferably performed in the order of the above steps (1) to (5), but is not limited to the above order. Further, the above steps (1) to (5) are all optional steps and can be performed in an arbitrary order. Hereinafter, each process will be briefly described.

(1) Processing by cutting of pedestal surface The bonded body 4 is arranged with the pedestal surface on the upper side and fixed by, for example, a vacuum chuck, and the pedestal surface of the bonded body 4 is, for example, milled, ground, end milled, Further processing may be performed using lathe processing or the like.

The machining by this cutting is for shaping the pedestal surface to be substantially parallel to the bonding surface of the bonded body 4, preferably parallel.

(2) Finishing processing of the joint surface The joint body 4 is arranged with the joint surface on the upper side and fixed with, for example, a vacuum chuck, and the joint surface of the joint body 4 is milled, ground, end milled, and turned, for example. You may finish using etc.

This finishing process is for finishing the bonded surface of the bonded body 4 by cutting or polishing it to a mirror surface as required according to its use.

(3) Finishing process of pedestal surface The bonded body 4 is arranged with the pedestal surface on the upper side and fixed by, for example, a vacuum chuck, and the pedestal surface of the bonded body 4 is milled, ground, end milled, etc. You may finish using.

Further, in any stage before finishing the pedestal surface, the pedestal portion 5 may be formed on the pedestal surface as needed (for example, the backing plate 20 shown in FIGS. 5B and 6B). There is no restriction | limiting in particular in the formation method of the base part 5, For example, a milling process, a grinding process, an end mill process, a lathe process etc. can be used.

The finishing process of the pedestal surface may be performed separately for the above-described pedestal part 5 and other peripheral parts.

In this finishing process, the pedestal surface of the joined body 4 (in some cases, both the above-described pedestal portion 5 and other peripheral portions) may be processed to a mirror surface.

(4) Drilling If necessary, a through hole may be formed in a portion of the backing plate where the groove 2 or the pedestal 5 is not formed. By passing a bolt or the like through such a through hole, the main body 1 can be fixed to the sputtering apparatus. There is no restriction | limiting in particular in the formation method of a through-hole, For example, it can form using a drill etc. Moreover, there is no restriction | limiting in particular in the dimension of a through-hole, a position, a number.

(5) Warpage correction During the post-processing step of the above backing plate, warpage may occur in the joined body 4. In that case, for example, using a corrector, the warpage may be corrected. It is preferable to correct the bonded body 4 until the size is less than 2 mm, preferably 1 mm to 0 mm, more preferably 0.5 mm to 0 mm.

Further, such correction of warpage may be performed at any stage of manufacturing the backing plate.

A sputtering target can be produced by bonding (or joining or bonding) a target material to the pedestal surface of the backing plate using a solder material to the backing plate thus obtained.

The target material is not particularly limited as long as it is a material composed of ceramics or sintered bodies such as metals, alloys, oxides, nitrides and the like that can be normally used for film formation by sputtering. A target material may be selected as appropriate. As such a target material, for example, aluminum, copper, titanium, molybdenum, silver, tungsten or an alloy containing them as a main component, tin-doped indium oxide (ITO), aluminum-doped zinc oxide (AZO), gallium-doped zinc oxide ( GZO), In—Ga—Zn-based composite oxide (IGZO), and the like.

In the manufacturing method of the present invention, the target material can be processed into a substantially plate shape, but the method of processing into a plate shape is not particularly limited. In the case of a metal target material, for example, a rectangular parallelepiped or cylindrical target material obtained by melting or casting is subjected to plastic processing such as rolling, extrusion, forging, and then cutting, milling, or end milling. By performing machining such as processing, it can be manufactured by finishing to a desired size and surface state. On the other hand, in the case of a target material of a refractory metal or oxide sintered system, the target material is filled into a plate-shaped mold and sintered by a hot press or a hot isostatic press. After obtaining a green compact by pressure sintering, cold isostatic pressing, injection molding, etc., a plate-like sintered body was obtained by atmospheric pressure sintering that sinters at atmospheric pressure. Then, it can be manufactured by finishing it to a desired size and surface state by performing machining such as cutting, milling, and end milling, and grinding.

The solder material used for joining the target and the backing plate is not particularly limited, and a material containing a metal or alloy having a low melting point (for example, 723 K or less) is preferable. For example, indium (In), tin (Sn), zinc ( A material containing a metal selected from the group consisting of Zn), lead (Pb), silver (Ag), copper (Cu), bismuth (Bi), cadmium (Cd) and antimony (Sb) or an alloy thereof. . More specifically, In, In—Sn, Sn—Zn, Sn—Zn—In, In—Ag, Sn—Pb, Sn—Pb—Ag, Sn—Bi, Sn—Ag—Cu, Pb—Sn, Examples thereof include Pb—Ag, Zn—Cd, Pb—Sn—Sb, Pb—Sn—Cd, Pb—Sn—In, and Bi—Sn—Sb. In general, In, In alloys, and Sn alloys having a low melting point can be widely used as solder materials for sputtering targets.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples.

[Example 1]
The backing plate 10 shown in FIGS. 5A and 6A was produced using the main body and the lid member having the shapes shown in FIGS. In the joining in the step (a), the main body and the lid member were joined by electron beam welding using an electron beam welding machine manufactured by Steigerwald.

The materials and target design target values of each member were as follows.

Body: Oxygen-free copper plate (Mitsubishi Shindoh Co., Ltd. rolled plate C1020-1 / 2H)
Vickers hardness> 80
Tensile strength> 265 MPa
Conductivity> 101% IACS (20 ° C)

Lid member: Oxygen-free copper plate (Mitsubishi Shindoh Co., Ltd. rolled plate C1020-1 / 2H)
Vickers hardness> 80
Tensile strength> 265 MPa
Conductivity> 101% IACS (20 ° C)

Design target value of the backing plate Dimensions in the longitudinal direction of the backing plate: 2500 mm
Width dimension of backing plate: 270mm
Backing plate thickness: 16mm
Body thickness (groove): 8mm
Lid member thickness: 3mm
Longitudinal dimension of the lid member: 2350 mm
Dimension in the width direction of the lid member: 175 mm (full length) (= 70 mm (dimension in the width direction of the long straight portion) +35 mm (dimension in the width direction of the intermediate portion) +70 mm (dimension in the width direction of the long straight portion))
Dimensions in the width direction of the flow path: 165 mm (full length) (= 60 mm (dimension in the width direction of the long straight portion) +45 mm (dimension in the width direction of the intermediate portion) +60 mm (dimension in the width direction of the long straight portion))
Channel thickness (or height): 5 mm

Since the joined body after joining warped toward the joining surface in both the length direction and the width direction, correction was performed by press molding so that the warpage was less than 1 mm.

At the joint surface, the dial gauge is fixed to the portal machining center, and the dial gauge is moved along the straight lines L1 and L2 located at the center of the long straight portion of the lid member shown in FIG. The height was measured.
The joined body was fixed with a vice so that the difference between the maximum value and the minimum value measured on the joint surface was 0.4 mm, and then milled using a portal machining center (step (b) )).

Next, the joined body after milling was fixed with a vacuum chuck so that the pedestal surface was on the upper side, and the pedestal surface was milled using a portal machining center.

The backing plate thus manufactured was cut along L1 and L2 shown in FIG. 7, and the “thickness of the lid member” was measured using a caliper. The results are shown in the graph of FIG.

As shown in FIG. 12 and Table 1, the difference between the maximum value and the minimum value of the “lid member thickness” is 0.31 mm (= 3.13−2.82) at L1, and 0.26 mm at L2. (= 3.14 mm-2.88 mm).

From these results, it was found that in the backing plate manufactured in Example 1, the thickness of the lid member was uniform.

In the embodiment of the present invention, the uniform thickness of the lid member means that the difference between the maximum value and the minimum value of the thickness of the lid member is “0.4 mm or less”.

[Example 2]
A backing plate was produced in the same manner as in Example 1 except that the joined body was fixed with a vice so that the difference between the maximum value and the minimum value measured on the joint surface was 0.3 mm.

The backing plate produced in this way was cut along L1 and L2 shown in FIG. 7, and the “thickness of the lid member” was measured. The results are shown in the graph of FIG. 13 and Table 1 below.

As shown in FIG. 13 and Table 1, the difference between the maximum value and the minimum value of the “lid member thickness” is 0.17 mm (= 3.04-2.87) at L1, and 0.13 mm at L2. (= 3.04 mm-2.91 mm).

From these results, it was found that in the backing plate manufactured in Example 2, the thickness of the lid member was uniform.

[Example 3]
The main body and the lid member were joined by friction stir welding, and a backing plate was produced with the following design target values. The material of each member was the same as that in Example 1.

Design target value of the backing plate Dimensions in the longitudinal direction of the backing plate: 2100 mm
Width dimension of backing plate: 270mm
Backing plate thickness: 16mm
Body thickness (groove): 7.7 mm
Lid member thickness: 3.3 mm
Longitudinal dimension of the lid member: 2000 mm
Dimension in the width direction of the lid member: 175 mm (full length) (= 70 mm (dimension in the width direction of the long straight portion) +35 mm (dimension in the width direction of the intermediate portion) +70 mm (dimension in the width direction of the long straight portion))
Dimensions in the width direction of the flow path: 165 mm (full length) (= 60 mm (dimension in the width direction of the long straight portion) +45 mm (dimension in the width direction of the intermediate portion) +60 mm (dimension in the width direction of the long straight portion))
Channel thickness (or height): 5 mm

A backing plate was produced in the same manner as in Example 1 except that the joined body was fixed with a vice so that the difference between the maximum value and the minimum value measured on the joining surface was 0.3 mm.

The backing plate produced in this way was cut along L1 and L2 shown in FIG. 7, and the “thickness of the lid member” was measured. The results are shown in the graph of FIG. 16 and Table 1 below.

As shown in FIG. 16 and Table 1, the difference between the maximum value and the minimum value of the “lid member thickness” is 0.13 mm (= 3.34−3.21) at L1 and 0.10 mm at L2. (= 3.31 mm−3.21 mm).

From these results, it was found that in the backing plate manufactured in Example 3, the thickness of the lid member was uniform.

[Comparative Example 1]
A backing plate was produced in the same manner as in Example 1 except that the joined body was fixed with a vice so that the difference between the maximum value and the minimum value measured on the joining surface was 1.0 mm.

The backing plate produced in this way was cut along L1 and L2 shown in FIG. 7, and the “thickness of the lid member” was measured. The results are shown in the graph of FIG. 14 and Table 1 below.

As shown in FIG. 14 and Table 1, the difference between the maximum value and the minimum value of the “lid member thickness” is 0.60 mm (= 3.77-3.17) at L1, and 0.65 mm at L2. (= 3.79-3.14).

From these results, it was found that the thickness of the lid member was not uniform in the backing plate manufactured in Comparative Example 1.

[Comparative Example 2]
A backing plate was produced in the same manner as in Example 1 except that the joined body was fixed with a vice so that the difference between the maximum value and the minimum value measured on the joining surface was 0.5 mm.

The backing plate produced in this way was cut along L1 and L2 shown in FIG. 7, and the “thickness of the lid member” was measured. The results are shown in the graph of FIG. 15 and Table 1 below.

As shown in FIG. 15 and Table 1, the difference between the maximum value and the minimum value of “thickness of the lid member” is 0.41 mm (= 3.17-2.76) at L1, and 0.48 mm at L2. (= 3.16 mm-2.68 mm).

From these results, it was found that the thickness of the lid member was not uniform in the backing plate manufactured in Comparative Example 2.

In Comparative Examples 1 and 2, the difference between the maximum value and the minimum value of the thickness of the lid member exceeded 0.4 mm, and it was found that the thickness of the lid member was not uniform. This is because, in the step (b), the difference between the maximum value and the minimum value measured on the joint surface when fixing the joined body is 0.5 mm or more (particularly the result of Comparative Example 2). checking).

On the other hand, in Examples 1 to 3 of the present invention, the difference between the maximum value and the minimum value of the lid member thickness was 0.4 mm or less, indicating that the lid member thickness was uniform. . This is because, in the step (b), the difference between the maximum value and the minimum value of the height measured on the bonding surface when fixing the bonded body is less than 0.5 mm.

As described above, according to Examples 1 to 3 and Comparative Examples 1 and 2, the maximum value of the height measured on the surface of the lid member in the joint surface of the joined body in the step (b) after the step (a). The minimum and minimum values are less than 0.5 mm, the joined body is fixed, and at least a part of the joining surface is processed by cutting. The difference from the value is 0.4 mm or less, and the thickness of the lid member can be made uniform.

Further, in the step (b), at least a part of the joint surface is processed by cutting in a state where the joined body is fixed. However, the effect on the warping and distortion of the backing plate after the manufacture is hardly caused by such fixing. I can't see it.

[Example 4]
A backing plate was prepared in the same manner as in Example 1, and a pressure test was performed by applying a water pressure of 0.5 MPa to the channel in the backing plate through a hole provided in the lid member connected to the channel. After holding for 30 minutes in the pressurized state, it was confirmed whether or not the lid member was deformed in the unloaded state, and no deformed portion was found. In addition, after the pressure resistance test, the He leak test of the flow path was performed using an UL leak He leak device, but the leak rate was 5.0 × 10 ⁻¹⁰ Pa · m ³ / s or less, and leakage was observed. There wasn't. By making the thickness of the lid member uniform, it is possible to obtain a backing plate that is resistant to deformation that does not cause plastic deformation of the lid member even under pressure.

A sputtering target was prepared by bonding an aluminum target of 2250 mm × 200 mm × t15 mm using indium solder on a backing plate that was confirmed to be free from deformation or leak by the pressure resistance test and the He leak test of the flow path. During the bonding operation, the backing plate was heated to 240 ° C., but no significant warping occurred. When the bonding rate was inspected with an ultrasonic flaw detector, the bonding rate was 99% or more, and the entire target material was bonded uniformly. It was possible to produce a sputtering target.

In addition, this application claims the priority on the basis of Japanese Patent Application No. 2015-138918 for which it applied in Japan on July 10, 2015, and all the content should be referred in this specification. Incorporated by

Backing plate and its manufacturing method of the present invention, the sputtering target can be particularly utilized in the sputtering target that could be used in the manufacture of flat panel displays such as liquid crystal displays (LCD).

1 Body 2 Groove (or flow path)
3 Lid member 4 Assembly 5 Pedestal part 6 Hole 10 Backing plate 20 Backing plate (with pedestal part)

Claims

A method of manufacturing a backing plate comprising joining a plate-like main body having a groove through which a fluid passes on one side and a plate-like lid member disposed on the main body so as to cover the groove of the main body, After joining and integrating the main body and the lid member, the difference between the maximum value and the minimum value of the height measured on the surface of the lid member with the joint surface between the main body and the lid member as the upper surface A method of manufacturing a backing plate, comprising fixing the main body so that the thickness is less than 0.5 mm, and processing at least a part of the joint surface by cutting.
The manufacturing method according to claim 1, wherein the main body is mechanically fixed.
The manufacturing method according to claim 1 or 2, wherein the main body is fixed by a vise, a clamp or a vacuum chuck.
The manufacturing method according to any one of claims 1 to 3, wherein the processing is milling.
The manufacturing method according to any one of claims 1 to 4, wherein the main body and the lid member are joined by electron beam welding or friction stir welding.
A backing plate comprising a plate-like main body having a groove through which a fluid passes on one side, and a plate-like lid member disposed on the main body so as to cover the groove of the main body, the main body and the lid member Is a backing plate in which the difference between the maximum value and the minimum value of the thickness of the lid member is 0.4 mm or less.
A backing plate obtained by the production method according to claim 1.
The backing plate according to claim 7, wherein a difference between a maximum value and a minimum value of the thickness of the lid member is 0.4 mm or less.
A sputtering target, wherein a target material is bonded onto the backing plate according to claim 6.
A sputtering target manufacturing method comprising bonding a target material to a backing plate, wherein the backing plate is manufactured by the manufacturing method according to any one of claims 1 to 5. Production method.